AF2512DR-071R5 [YAGEO]

ANTI-SULFURATED CHIP RESISTORS;


型号：	AF2512DR-071R5
厂家：	YAGEO CORPORATION
描述：	ANTI-SULFURATED CHIP RESISTORS
文件：	总9页 (文件大小：876K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

DATA SHEET

ANTI-SULFURATED CHIP RESISTORS

AF series

5%, 1%, 0.5%

sizes 0201/0402/0603/0805/1206/1210/1218/2010/2512

RoHS compliant & Halogen free

Product specification

SERIES

0201 to 2512

Chip Resistor Surface Mount

SCOPE

ORDERING INFORMATION - GLOBAL PART NUMBER

This specification describes

AF0201 to AF2512 chip resistors

with anti-sulfuration capabilities.

Part number is identified by the series name, size, tolerance, packaging

type, temperature coefficient, taping reel and resistance value.

GLOBAL PART NUMBER

AF XXXX X X X XX XXXX L

APPLICATIONS

( )

( ) ( ) ( ) ( )

( )

 Industrial Equipment

 Power Application

 Networking Application

( )

1 SIZE

0201/0402/0603/0805/1206/1210/1218/2010/2512

 High-end Computer &

Multimedia Electronics in high

sulfur environment

( )

2 TOLERANCE

D = ±0.5%

F = ±1%

 Automotive electronics

J = ±5% (for jumper ordering, use code of J)

FEATURES

( )

3 PACKAGING TYPE

 AEC-Q200 qualified

 Superior resistance against

sulfur containing atmosphere

R = Paper taping reel

K = Embossed plastic tape reel

 Halogen free product and

production

 RoHS compliant

( )

4 TEMPERATURE COEFFICIENT OF RESISTANCE

– = Base on spec

( )

 Reduces environmentally

5 TAPING REEL

hazardous waste

07 = 7 inch dia. Reel

13 = 13 inch dia. Reel

 High component and

equipment reliability

 Saving of PCB space

 Moisture sensitivity level:

MSL 1

( )

6 RESISTANCE VALUE

There are 2~4 digits indicated the resistance value. Letter R/K/M is decimal point.

Detailed resistance rules are displayed in the table of “Resistance rule of global part

number”.

(7) DEFAULT CODE

Letter L is system default code for ordering only ^(Note)

Resistance rule of global part

number

ORDERING EXAMPLE

The ordering code for an AF0402

chip resistor, value 100 KΩ with

±1% tolerance, supplied in 7-inch

tape reel with 10Kpcs quantity is:

AF0402FR-07100KL.

Resistance coding rule

Example

1R = 1 Ω

1R5 = 1.5 Ω

9R76 = 9.76 Ω

XRXX

(1 to 9.76 Ω)

XXRX

10R = 10 Ω

NOTE

(10 to 97.6 Ω)

97R6 = 97.6 Ω

1. All our R-Chip products are RoHS

compliant and Halogen free. "LFP" of the

internal 2D reel label states "Lead-Free

Process"

XXXR

(100 to 976 Ω)

100R = 100 Ω

XKXX

1K = 1,000 Ω

2. On customized label, "LFP" or specific

symbol can be printed

(1 to 9.76 KΩ)

9K76 = 9760 Ω

XMXX

1M = 1,000,000 Ω

(1 to 9.76 MΩ)

9M76= 9,760,000 Ω

www.yageo.com

Jun. 21, 2016 V.5

Product specification

SERIES

0201 to 2512

Chip Resistor Surface Mount

MARKING

AF0201 / AF0402

No marking

Fig. 1

AF0603 / AF0805 / AF1206 / AF1210 / AF2010 / AF2512

E-24 series: 3 digits, ±5%, ≥10Ω

First two digits for significant figure and 3rd digit for number of zeros

Fig. 2 Value=10 KΩ

AF0603

E-24 series: 3 digits, ±1%

One short bar under marking letter

Fig. 3

Value = 24 Ω

E-96 series: 3 digits, ±1%

First two digits for E-96 marking rule and 3rd letter for number of zeros

Fig. 4

Value = 12.4 KΩ

AF0805 / AF1206 / AF1210 / AF2010 / AF2512

Both E-24 and E-96 series: 4 digits, ±1%

First three digits for significant figure and 4th digit for number of zeros

Fig. 5 Value = 10 KΩ

AF1218

E-24 series: 3 digits, ±5%

First two digits for significant figure and 3rd digit for number of zeros

Fig. 6 Value = 10 KΩ

Both E-24 and E-96 series: 4 digits, ±1%

First three digits for significant figure and 4th digit for number of zeros

Fig. 7 Value = 10 KΩ

NOTE

For further marking information, please see special data sheet “Chip resistors marking”. Marking of AF series is the same as RC series

www.yageo.com

Jun. 21, 2016 V.5

Product specification

SERIES

0201 to 2512

Chip Resistor Surface Mount

CONSTRUCTION

OUTLINES

The resistors are constructed on top of a high grade

ceramic body. Internal metal electrodes are added at

each end and connected by a resistive glaze. The

resistive glaze is covered by a glass.

For dimensions see Table 1

The composition of the glaze is adjusted to give the

approximate required resistance value and laser trimming

of this resistive glaze achieves the value within tolerance.

The whole element is covered by a protective overcoat.

Size 0603 and bigger is marked with the resistance value

on top. Finally, the two external terminations (Ni / matte

tin) are added. See fig.8

DIMENSIONS

Table 1 For outlines see fig. 8

TYPE

L (mm) W (mm) H (mm) I₁(mm) I₂(mm)

AF0201

0.60±0.03 0.30±0.03 0.23±0.03 0.12±0.05 0.15±0.05

AF0402

AF0603

AF0805

AF1206

AF1210

AF1218

AF2010

AF2512

1.00 ±0.05 0.50 ±0.05 0.32 ±0.05 0.20 ±0.10 0.25 ±0.10

1.60 ±0.10 0.80 ±0.10 0.45 ±0.10 0.25 ±0.15 0.25 ±0.15

2.00 ±0.10 1.25 ±0.10 0.50 ±0.10 0.35 ±0.20 0.35 ±0.20

Fig. 8 Chip resistor outlines

3.10 ±0.10 1.60 ±0.10 0.55 ±0.10 0.45 ±0.20 0.40 ±0.20

3.10±0.10 2.60±0.15 0.50±0.10 0.45±0.15 0.50±0.20

3.10±0.10 4.60±0.10 0.55±0.10 0.45±0.20 0.40±0.20

5.00±0.10 2.50±0.15 0.55±0.10 0.55±0.15 0.50±0.20

6.35±0.10 3.10±0.15 0.55±0.10 0.60±0.20 0.50±0.20

www.yageo.com

Jun. 21, 2016 V.5

Product specification

SERIES

0201 to 2512

Chip Resistor Surface Mount

ELECTRICAL CHARACTERISTICS

Table 2

CHARACTERISTICS

Max. Dielectric

Temperature Working Overload Withstanding

Operating

Max.

Temperature Coefficient

of Resistance

Jumper

Criteria

TYPE

RESISTANCE RANGE

Range Voltage

Voltage

Rated Current

0.5A

±5% (E24),

1Ωto 10MΩ

Max. Current

1.0A

1Ω≤ R ≤10Ω, -100/+350 ppm/°C

10Ω＜R ≤ 10MΩ, ±200 ppm/°C

AF0201

±0.5%, ±1% (E24/E96),

1Ω to 10MΩ

25 V

50 V

Zero Ohm Jumper < 0.05Ω

Rated Current

1.0A

AF0402

AF0603

50 V

75 V

100 V

150 V

100 V

150 V

Max. Current

2.0A

±5% (E24),

1 Ω to 22 MΩ

Rated Current

2.0A

1 Ω≤ R ≤ 10 Ω, ±200 ppm/°C

10 Ω< R ≤ 10 MΩ, ±100 ppm/°C

10 MΩ< R ≤ 22 MΩ, ±200 ppm/°C

±0.5%, ±1% (E24/E96),

1 Ω to 10 MΩ

AF0805

AF1206

AF1210

AF1218

150 V

300 V

400 V

500 V

300 V

500 V

Max. Current

5.0A

Zero Ohm Jumper < 0.05 Ω

Rated Current

2.0A

–55 °C to +155 °C

200 V

Max. Current

10.0A

Rated Current

2.0A

±5% (E24),

1Ω to 10MΩ

± 0.5%, ±1% (E24/E96),

1Ω to 10M

Max. Current

10.0A

Zero Ohm Jumper < 0.05Ω

Rated Current

2.0A

±5% (E24),

1Ω to 1MΩ

± 0.5%, ±1% (E24/E96),

1Ω≤ R≤ 10Ω, ±200 ppm/°C

Max. Current

10.0A

1Ω to 1M

Zero Ohm Jumper < 0.05Ω

10Ω＜R ≤ 10MΩ, ±100 ppm/°C

Rated Current

2.0A

±5% (E24),

1Ω to 10MΩ

± 0.5%, ±1% (E24/E96),

1Ω to 10M

AF2010

AF2512

200 V

200V

500 V

500V

500 V

500V

Max. Current

10.0A

Zero Ohm Jumper < 0.05Ω

www.yageo.com

Jun. 21, 2016 V.5

Product specification

SERIES

0201 to 2512

Chip Resistor Surface Mount

FOOTPRINT AND SOLDERING PROFILES

For recommended footprint and soldering profiles of AF-series is the same as RC-series. Please see the special

data sheet “Chip resistors mounting”.

PACKING STYLE AND PACKAGING QUANTITY

Table 3 Packing style and packaging quantity

PACKING STYLE

REEL

DIMENSION

AF0201

AF0402 AF0603/0805/

1206

AF1210 AF1218/2010/

2512

Paper taping reel (R)

7" (178 mm) 10,000/20,000 10,000/20,000

5,000

20,000

5,000

20,000

13" (330 mm)

7" (178 mm)

50,000

Embossed taping reel (K)

4,000

NOTE

1. For paper/embossed tape and reel specification/dimensions, please see the special data sheet “Chip resistors packing”.

FUNCTIONAL DESCRIPTION

OPERATING TEMPERATURE RANGE

AF0201 - AF2512 Range:

-55 °C to + 155 °C (Fig. 7)

POWER RATING

Each type rated power at 70 °C:

AF0201=1/20W (0.05W)

AF0402=1/16 W (0.0625W)

AF0603=1/10 W (0.1W)

AF0805=1/8 W (0.125W)

AF1206=1/4 W (0.25W)

AF1210=1/2W (0.5W)

AF1218=1W

AF2010=3/4W (0.75W)

Fig. 7 Maximum dissipation (P ) in percentage of rated power as

AF2512=1W

max

a function of the operating ambient temperature (T

)

amb

RATED VOLTAGE

The DC or AC (rms) continuous working voltage

corresponding to the rated power is determined by

the following formula:

(

)

V = P X R

Where

(

)

V = Continuous rated DC or AC rms working

( )

voltage V

P = Rated power W

(

)

(

)

R = Resistance value Ω

www.yageo.com

Jun. 21, 2016 V.5

Product specification

SERIES

0201 to 2512

Chip Resistor Surface Mount

TESTS AND REQUIREMENTS

Table 4 Test condition, procedure and requirements

TEST

TEST METHOD

PROCEDURE

REQUIREMENTS

Temperature

Coefficient of

Resistance

(T.C.R.)

IEC 60115-1 4.8

At +25/–55 °C and +25/+125 °C

Refer to table 2

MIL-STD-202 Method 304

Formula:

R₂–R₁

T.C.R= ------------------------- ×10⁶(ppm/°C)

R₁(t₂–t₁)

Where

t₁=+25 °C or specified room temperature

t₂=–55 °C or +125 °C test temperature

R₁=resistance at reference temperature in ohms

R₂=resistance at test temperature in ohms

Life/Endurance

IEC 60115-1 4.25

MIL-STD-202 Method 108

At 70±2 °C for 1,000 hours, RCWV applied for

1.5 hours on, 0.5 hour off, still-air required

±(1.0%+0.05 Ω)

<100 mΩ for Jumper

High

Temperature

Exposure

MIL-STD-202 Method 108

±(1.0%+0.05 Ω)

1,000 hours at 155±3℃

unpowered

<100 mΩ for Jumper

Moisture

Resistance

MIL-STD-202 Method 106

Each temperature / humidity cycle is defined at 8

hours, 3 cycles / 24 hours for 10d. with 25 °C /

65 °C 95% R.H, without steps 7a & 7b,

unpowered

±(0.5%+0.05 Ω) for 0.5%, 1%

tol.

±(1.0%+0.05 Ω) for 5% tol.

<100 mΩ for Jumper

Parts mounted on test-boards, without

condensation on parts

Thermal Shock

MIL-STD-202 Method 107

–55 / +125 °C

±(0.5%+0.05 Ω) for 0.5%, 1%

tol.

Number of cycles required is 300. Devices

mounted

±(1%+0.05 Ω) for 5% tol.

Maximum transfer time is 20 seconds. Dwell time <100 mΩ for Jumper

is 15 minutes

Short Time

Overload

IEC60115-1 4.13

IEC 60115-1 4.33

2.5 times of rated voltage or maximum overload

voltage whichever is less for 5 seconds at room

temperature

±(1.0%+0.05 Ω)

No visible damage

Bending

Chips mounted on a 90 mm glass epoxy resin

PCB (FR4)

±(1.0%+0.05 Ω)

<100 mΩ for Jumper

No visible damage

Bending: 0201/0402: 5 mm

0603/0805: 3 mm

1206 & above: 2 mm

Bending time: 60±5 seconds

www.yageo.com

Jun. 21, 2016 V.5

Product specification

SERIES

0201 to 2512

Chip Resistor Surface Mount

TEST

TEST METHOD

PROCEDURE

REQUIREMENTS

Biased Humidity

MIL-STD-202 method 103

1,000 hours; 85℃/85%R.H., 10% of operating 1Ω≤R≤1MΩ: ±(3%+0.05Ω)

power.

1MΩ<R≤10MΩ: ±(5%+0.05Ω)

Measurement at 24±4 hours after test

conclusion.

Solderability

- Resistance to

Soldering Heat

IEC 60115-1 4.18

MIL-STD-202 Method 215

Condition B, no pre-heat of samples

±(0.5%+0.05Ω) for 0.5%, 1% tol.

±(1.0%+0.05Ω) for 5% tol.

<50 mΩfor Jumper

Lead-free solder, 260±5 °C, 10±1 seconds

immersion time

Procedure 2 for SMD: devices fluxed and

cleaned with isopropanol

No visible damage

- Wetting

J-STD-002

Electrical test not required

Magnification 10X

Well tinned (≥95% covered)

No visible damage

SMD conditions:

(a) Method B, aging 4 hours at 155 °C

dry heat, lead-free solder bath at 245 °C

(b) Method B, dipping at 215 °C for 3 seconds

Sulfur 750 hours, 105 °C. unpowered

FOS

ASTM-B-809-95*

* Modified

±(4.0%+0.05Ω)

www.yageo.com

Jun. 21, 2016 V.5

Product specification

SERIES

0201 to 2512

Chip Resistor Surface Mount

REVISION HISTORY

REVISION DATE

CHANGE NOTIFICATION DESCRIPTION

Version 5

Version 4

Version 3

Version 2

Version 1

Version 0

Jun. 21, 2016

Dec. 24, 2015

Apr. 01, 2015

Nov. 20, 2014

Sep. 27, 2013

Jan 07, 2011

- Update test and requirement

- Update Dielectric Withstanding Voltage& Resistance value

- Modified test and requirements

- Tests and requirement update

- Size 0201/1210/1218/2010/2512 extend

- First issue of this specification

“ Yageo reserves all the rights for revising the content of this datasheet without further notification, as long as the products are unchanged. Any

product change will be announced by PCN.”

www.yageo.com

Jun. 21, 2016 V.5

AF2512DR-071R5 [YAGEO]

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