IP4100CY20-02S [YAGEO]

Terminator, 9-Line, PDSO20, 3.81 MM, PLASTIC, QSOP-20;
IP4100CY20-02S
型号: IP4100CY20-02S
厂家: YAGEO CORPORATION    YAGEO CORPORATION
描述:

Terminator, 9-Line, PDSO20, 3.81 MM, PLASTIC, QSOP-20

光电二极管 接口集成电路
文件: 总12页 (文件大小:275K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ADVANCED CERAMICS AND MODULES  
DATA SHEET  
IP4100 series  
9-channel IEEE 1284  
filter/termination  
with 2 kV ESD protection  
Preliminary specification  
1999 Jul 29  
File under Advanced Ceramics and Modules, ACM4  
Philips Components  
Preliminary specification  
9-channel IEEE 1284 filter/termination  
with 2 kV ESD protection  
IP4100 series  
FEATURES  
QUICK REFERENCE DATA  
9-channel RC filter array with pull-up resistors  
ESD protection: >2 kV  
DESCRIPTION  
Electrical characteristics at 25 °C  
VALUE  
Undershoot protection  
Resistance  
±10%; see Table 1  
High capacitance range  
Capacitance  
±20%; see Table 1  
Available in 20-pin or 24-pin QSOP and 20-pin SOIC  
packages.  
Operating voltage, VCC  
ESD protection  
0 to +5.5 V  
IEC 61000-4-2, level 1  
(2 kV)  
APPLICATIONS  
Power rating per channel 100 mW, package limited  
Package ratings  
IEEE 1284 filter/termination for:  
Workstations  
Maximum dissipation at:  
Desktop and portable computers  
PDAs  
Tamb = 70 °C  
1 W  
Tamb = 85 °C  
0.83 W  
PCMICA cards.  
Operating temperature  
Storage temperature  
25 to +85 °C  
60 to +150 °C  
DESCRIPTION  
The Philips IP4100 series of Application Specific  
Integrated Products (ASIPs) is a 9-channel solution for  
termination and filtering for high speed IEEE 1284 parallel  
interfaces while also providing ESD protection of >2 kV.  
IP4100 devices are fabricated using thin film-on-silicon  
technology and integrates 18 resistors, 9 capacitors and  
18 diodes in various package configurations.  
The IP4100 is configured as low pass filters with high  
impedance pull-ups. As filters, the IP4100 will pass low  
frequency digital data and attenuate undesired high  
frequency signals. As terminations, the IP4100 will reduce  
reflections caused by transmission line effects of long  
cable lines.  
The integral diodes of the IP4100 provide ESD protection  
of <2 kV. Furthermore, the diodes help maintain signal  
integrity on digital transmission lines by reducing logic  
undershoot conditions.  
1999 Jul 29  
2
Philips Components  
Preliminary specification  
9-channel IEEE 1284 filter/termination  
with 2 kV ESD protection  
IP4100 series  
handbook, halfpage  
handbook, halfpage  
20  
1
2
24  
23  
R1  
1
2
3
4
5
6
7
8
19  
18  
17  
16  
15  
14  
13  
12  
11  
R2  
R1  
R2  
3
22  
21  
20  
19  
18  
17  
16  
15  
14  
R1  
R2  
R1  
R2  
4
R1  
R2  
R1  
R2  
5
R1  
R2  
R1  
R2  
6
R1  
R2  
R1  
R2  
7
R1  
R2  
R1  
R2  
8
R1  
R2  
R1  
R2  
9
R1  
R2  
R1  
R2  
10  
R1  
R2  
9
R1  
R2  
11  
12  
10  
CCB972  
13  
CCB973  
Fig.1 Functional diagram for 20-pin packages.  
Fig.2 Functional diagram for 24-pin packages.  
1999 Jul 29  
3
Philips Components  
Preliminary specification  
9-channel IEEE 1284 filter/termination  
with 2 kV ESD protection  
IP4100 series  
ORDERING INFORMATION  
Ordering code  
I P 4 1 0 0 C Y 2 0 0 1 S  
Philips P/N series  
Packaging  
S
T
reel: 330 mm (13")  
tube  
Operating temperature range  
(25 to +85 °C)  
(1)  
Resistance/Capacitance code  
Package type  
Number of pins  
(20 or 24)  
(Y = QSOP; R = SOIC)  
CCB974  
(1) For R/C codes, see Table 1.  
Table 1 Standard R/C values, ordering information and packaging quantities  
RESISTANCE  
CATALOGUE NUMBER  
IP4100CY(R)20(24)-...  
CAPACITANCE  
VALUE  
R/C  
CODES  
VALUE  
(pF)  
R1  
R2  
REEL 330 mm (13")  
TUBE  
55 units(1)  
(k)  
()  
1000 units  
-01  
-02  
-03  
4.7  
2.2  
1.0  
33  
33  
33  
180  
220  
180  
01S  
02S  
03S  
01T  
02T  
03T  
Note  
1. The QSOP package has a tube quantity of 56 units.  
1999 Jul 29  
4
Philips Components  
Preliminary specification  
9-channel IEEE 1284 filter/termination  
with 2 kV ESD protection  
IP4100 series  
PACKAGING  
SOIC20 Package outline  
D
E
detail A  
c
H
E
11  
20  
A
A
1
pin 1 index  
θ
L
detail A  
1
10  
e
b
CCB878  
For dimensions see Table 2.  
Fig.3 SOIC20 plastic shrink small outline package; 20 leads; wide body 7.39 mm.  
Table 2 Package dimensions; see Fig.3  
VALUE  
DIMENSION  
UNIT  
MIN.  
MAX.  
A
A1  
b
2.43  
0.10  
2.64  
0.30  
mm  
mm  
mm  
mm  
mm  
mm  
mm  
mm  
mm  
deg  
0.36  
0.46  
c
0.23  
0.32  
D
E
HE  
e
12.65  
7.39  
12.85  
7.60  
10.06  
10.52  
1.27 NOM.  
L
0.51  
0
1.02  
8
θ
1999 Jul 29  
5
Philips Components  
Preliminary specification  
9-channel IEEE 1284 filter/termination  
with 2 kV ESD protection  
IP4100 series  
QSOP20 Package outline  
D
E
detail A  
c
H
E
11  
20  
A
A
1
pin 1 index  
θ
L
detail A  
1
10  
e
b
CCB878  
For dimensions see Table 3.  
Fig.4 QSOP20 plastic shrink small outline package; 20 leads; narrow body width 3.81 mm.  
Table 3 Package dimensions; see Fig.4  
VALUE  
DIMENSION  
UNIT  
MIN.  
MAX.  
A
A1  
b
1.35  
0.10  
0.20  
0.15  
8.55  
3.81  
5.79  
1.75  
0.30  
0.30  
0.25  
8.74  
3.99  
6.20  
mm  
mm  
mm  
mm  
mm  
mm  
mm  
mm  
mm  
deg  
c
D
E
HE  
e
0.635 NOM.  
L
0.40  
0
1.27  
8
θ
1999 Jul 29  
6
Philips Components  
Preliminary specification  
9-channel IEEE 1284 filter/termination  
with 2 kV ESD protection  
IP4100 series  
QSOP24 Package outline  
D
E
detail A  
c
H
E
24  
13  
A
A
1
pin 1 index  
θ
L
detail A  
1
12  
CCB975  
e
b
For dimensions see Table 4.  
Fig.5 QSOP24 plastic shrink small outline package; 20 leads; narrow body width 3.81 mm.  
Table 4 Package dimensions; see Fig.4  
VALUE  
DIMENSION  
UNIT  
MIN.  
MAX.  
A
A1  
b
1.35  
0.10  
0.20  
0.15  
8.55  
3.81  
5.79  
1.75  
0.30  
0.30  
0.25  
8.74  
3.99  
6.20  
mm  
mm  
mm  
mm  
mm  
mm  
mm  
mm  
mm  
deg  
c
D
E
HE  
e
0.635 NOM.  
L
0.40  
0
1.27  
8
θ
1999 Jul 29  
7
Philips Components  
Preliminary specification  
9-channel IEEE 1284 filter/termination  
with 2 kV ESD protection  
IP4100 series  
Blister tape specifications  
K
K
0
A
pin 1 designator  
0
T
1
G
B
D
1
W
0
1
W
θ
F
E
δ
δ
D
P
2
0
P
CCB884  
T
(1)  
P
0
direction of unreeling  
K0: so chosen that the orientation of the component cannot change.  
For dimensions see Table 5.  
(1) Pocket position relative to sprocket hole measured as true position of pocket, not pocket hole.  
Fig.6 Blister tape.  
1999 Jul 29  
8
Philips Components  
Preliminary specification  
9-channel IEEE 1284 filter/termination  
with 2 kV ESD protection  
IP4100 series  
Table 5 Dimensions of blister tape; see Fig.6  
DIMENSION  
(mm)  
TOLERANCE  
(mm)  
PARAMETER  
QSOP20/24 PACKAGE  
SOIC20 PACKAGE  
A0 nominal clearance; note 1  
6.5  
9.0  
10.9  
13.3  
3.0  
±0.1  
±0.1  
±0.1  
B0 nominal clearance; note 1  
K0 minimum clearance; note 1  
2.3  
K
<2.4  
>0.75  
<15°  
<0.3  
16.0  
1.75  
7.5  
<3.2  
>0.75  
<15°  
<0.3  
24.0  
1.75  
7.5  
G
Θ
δ
W
±0.3  
±0.1  
±0.1  
+0.1/0.0  
E
F
D0  
1.5  
1.5  
D1 min  
1.5  
1.5  
P0; note 2  
4.0  
4.0  
±0.1  
±0.1  
±0.1  
P
8.0  
12.0  
2.0  
P2  
T
2.0  
<0.35  
<0.1  
<0.35  
<0.1  
T1  
Notes  
1. Typical displacement in pocket.  
2. P0 pitch tolerance over any 10 pitches is ±0.2 mm.  
1999 Jul 29  
9
Philips Components  
Preliminary specification  
9-channel IEEE 1284 filter/termination  
with 2 kV ESD protection  
IP4100 series  
Reel specifications  
t
W
O
U
E
C
B
A
trailer  
leader  
MEA942  
fixing  
tape  
For dimensions see Table 6.  
Minimum trailer length: 160 mm.  
Minimum leader length: 390 mm.  
Fig.7 Reel.  
Table 6 Reel dimensions; see Fig.7  
TAPE  
WIDTH  
(mm)  
A NOM.  
(mm)  
t
W
(mm)  
B
(mm)  
C
(mm)  
E MIN.  
(mm)  
U MIN.  
(mm)  
O
(mm)  
16  
24  
330  
330  
3 +0.0/1.5 16.4 +2.0/0.0 101 ±1.5  
3 +0.0/1.5 24.4 +2.0/0.0 101 ±1.5  
13 +0.5/0.2  
13 +0.5/0.2  
1.5  
1.5  
3.6  
3.6  
120°  
120°  
1999 Jul 29  
10  
Philips Components  
Preliminary specification  
9-channel IEEE 1284 filter/termination  
with 2 kV ESD protection  
IP4100 series  
QUALITY AND RELIABILITY  
Wafer fabrication and packaging technology  
Philips ASIPs use well-proven semiconductor industry thin film-on-silicon fabrication and packaging technologies.  
Wafers are processed in a clean room wafer fabrication environment with circuit elements defined using a  
photolithography process. Metal disposition is performed by precision sputter process. Finished wafers are diced,  
assembled and tested in a state-of-the-art assembly and packaging facility fully compliant with ISO 9002.  
Tests and requirements  
The following tests have been conducted on representative samples of Philips ASIPs in QSOP (SSOP), SOIC and similar  
industry standard plastic packages in accordance with the appropriate IEC, EIA and EIAJ requirements.  
Table 7 Test procedures and requirements  
EIA/JESD22  
TEST METHOD  
TEST  
PROCEDURE  
REQUIREMENTS  
B102-A  
solderability  
8 hours steam;  
good tinning (95% covered);  
(after ageing)  
immersed for 5 s in a solder bath at 215 °C  
no visible damage  
A113-A  
SMD sequential  
stress  
preconditioning;  
device functional;  
no visible damage;  
SAT inspection  
5 cycles: 55 to +125 °C; 24 hours bake;  
temperature and humidity soak; 3 cycles of  
IR convection reflow at maximum 220 °C  
A104-A  
A102-B  
A101-B  
A108-A  
A108-A  
temperature  
cycling  
1000 cycles:  
10 minutes minimum at 65 °C  
10 minutes minimum at +150 °C  
no visible damage;  
R/R max.: ±1%;  
C/C max.: ±1%  
autoclave  
(pressure pot)  
336 hours: 121 °C, 100% RH  
no visible damage;  
R/R max.: ±1%;  
C/C max.: ±1%  
temperature;  
humidity; bias  
1000 hours: 85 °C; 85% RH;  
reverse voltage bias  
no visible damage;  
R/R max.: ±1%;  
C/C max.: ±1%  
high temperature  
reverse bias  
1000 hours: 125 °C;  
reverse voltage bias  
no visible damage;  
R/R max.: ±1%;  
C/C max.: ±1%  
high temperature  
operating life  
1000 hours: 125 °C;  
each channel with maximum power per spec. R/R max.: ±1%;  
C/C max.: ±1%  
no visible damage;  
1999 Jul 29  
11  
Philips Components  
Preliminary specification  
9-channel IEEE 1284 filter/termination  
with 2 kV ESD protection  
IP4100 series  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
1999 Jul 29  
12  

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