ZXMN2A02X8 [ZETEX]

20V N-CHANNEL ENHANCEMENT MODE MOSFET; 20V N沟道增强型MOSFET
ZXMN2A02X8
型号: ZXMN2A02X8
厂家: ZETEX SEMICONDUCTORS    ZETEX SEMICONDUCTORS
描述:

20V N-CHANNEL ENHANCEMENT MODE MOSFET
20V N沟道增强型MOSFET

文件: 总4页 (文件大小:139K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ZXMN2A02X8  
20V N-CHANNEL ENHANCEMENT MODE MOSFET  
SUMMARY  
V(BR)DSS=20V; RDS(ON)=0.02D=7.6A  
DESCRIPTION  
This new generation of TRENCH MOSFETs from Zetex utilizes a unique  
structure that combines the benefits of low on-resistance with fast switching  
speed. This makes them ideal for high efficiency, low voltage, power  
management applications.  
MSOP8  
FEATURES  
Low on-resistance  
Fast switching speed  
Low threshold  
Low gate drive  
Low profile SOIC package  
APPLICATIONS  
DC - DC Converters  
Power Management Functions  
Disconnect switches  
Motor control  
ORDERING INFORMATION  
DEVICE  
REEL SIZE  
TAPE WIDTH  
QUANTITY  
PER REEL  
Top View  
ZXMN2A02X8TA  
ZXMN2A02X8TC  
7”  
12mm  
12mm  
1000 units  
4000 units  
13”  
DEVICE MARKING  
ZXMN  
2A02  
PROVISIONAL ISSUE A - SEPTEMBER 2001  
1
ZXMN2A02X8  
ABSOLUTE MAXIMUM RATINGS.  
PARAMETER  
SYMBOL  
VDSS  
VGS  
LIMIT  
20  
UNIT  
Drain-Source Voltage  
V
V
A
Gate Source Voltage  
12  
Continuous Drain Current VGS=10V; TA=25°C (b)  
ID  
7.6  
6.1  
6
VGS=10V; TA=70°C (b)  
VGS=10V; TA=25°C (a)  
Pulsed Drain Current (c)  
IDM  
IS  
27  
3.1  
27  
A
A
A
Continuous Source Current (Body Diode) (b)  
Pulsed Source Current (Body Diode) (c)  
ISM  
PD  
Power Dissipation at TA=25°C (a)  
Linear Derating Factor  
1.1  
8.8  
W
mW/°C  
Power Dissipation at TA=25°C (b)  
Linear Derating Factor  
PD  
1.8  
14.4  
W
mW/°C  
Operating and Storage Temperature Range  
Tj:Tstg  
-55 to +150  
°C  
THERMAL RESISTANCE  
PARAMETER  
SYMBOL  
RθJA  
VALUE  
113  
UNIT  
°C/W  
°C/W  
Junction to Ambient (a)  
Junction to Ambient (b)  
RθJA  
70  
NOTES  
(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper,  
in still air conditions  
(b) For a device surface mounted on FR4 PCB measured at tр10 secs.  
(c) Repetitive rating 25mm x 25mm FR4 PCB, D = 0.05, pulse width 10s - pulse width limited by maximum  
junction temperature.  
PROVISIONAL ISSUE A - SEPTEMBER 2001  
2
ZXMN2A02X8  
ELECTRICAL CHARACTERISTICS (at T = 25°C unless otherwise stated).  
A
PARAMETER  
SYMBOL MIN.  
TYP.  
MAX.  
UNIT CONDITIONS.  
STATIC  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate-Body Leakage  
V(BR)DSS 20  
IDSS  
V
ID=250µA, VGS=0V  
VDS=20V, VGS=0V  
VGS=Ϯ12V, VDS=0V  
ID=250µA, VDS= VGS  
1
µA  
nA  
V
IGSS  
100  
Gate-Source Threshold Voltage  
VGS(th)  
RDS(on)  
0.7  
Static Drain-Source On-State Resistance  
(1)  
0.02  
0.04  
V
V
GS=4.5V, ID=11A  
GS=2.5V, ID=8.4A  
Forward Transconductance (1)(3)  
DYNAMIC (3)  
gfs  
27  
S
VDS=10V,ID=11A  
Input Capacitance  
Ciss  
Coss  
Crss  
2050  
300  
pF  
pF  
pF  
V
DS=15 V, VGS=0V,  
Output Capacitance  
Reverse Transfer Capacitance  
SWITCHING(2) (3)  
f=1MHz  
183  
Turn-On Delay Time  
Rise Time  
td(on)  
tr  
td(off)  
tf  
6.9  
ns  
ns  
ns  
ns  
nC  
nC  
nC  
12.2  
32.5  
11  
VDD =10V, ID=5.5A  
RG=6.0, VGS=5V  
Turn-Off Delay Time  
Fall Time  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
SOURCE-DRAIN DIODE  
Diode Forward Voltage (1)  
Qg  
18.6  
4.1  
V
DS=10V,VGS=4.5V,  
Qgs  
Qgd  
ID=5.5A  
5.1  
VSD  
0.8  
0.95  
V
TJ=25°C, IS=11A,  
V
GS=0V  
Reverse Recovery Time (3)  
Reverse Recovery Charge (3)  
NOTES  
trr  
19.3  
9.1  
ns  
TJ=25°C, IF=5.5A,  
di/dt= 100A/µs  
Qrr  
nC  
(1) Measured under pulsed conditions. Width=300µs. Duty cycle 2% .  
(2) Switching characteristics are independent of operating junction temperature.  
(3) For design aid only, not subject to production testing.  
PROVISIONAL ISSUE A - SEPTEMBER 2001  
3
ZXMN2A02X8  
PACKAGE DIMENSIONS  
DIM  
Millimetres  
Inches  
MIN  
8
7
2
6
3
5
4
MIN  
MAX  
MAX  
0.043  
0.006  
0.016  
0.009  
0.122  
BSC  
A
A1  
B
C
D
e
1.10  
0.15  
0.40  
0.23  
3.10  
BSC  
3.10  
BSC  
0.70  
6°  
1
0.05  
0.25  
0.13  
2.90  
0.65  
2.90  
4.90  
0.40  
0°  
0.002  
0.010  
0.005  
0.114  
0.0256  
0.114  
0.193  
0.016  
0°  
e X 6  
θ°  
L
B
C
E
0.122  
BSC  
H
L
0.028  
6°  
°
PAD LAYOUT DETAILS  
© Zetex plc 2001  
Zetex plc  
Fields New Road  
Chadderton  
Oldham, OL9 8NP  
United Kingdom  
Telephone (44) 161 622 4422  
Fax: (44) 161 622 4420  
Zetex GmbH  
Streitfeldstraße 19  
D-81673 München  
Zetex Inc  
Suite 315  
700 Veterans Memorial Highway  
Hauppauge NY11788  
USA  
Telephone: (631) 360 2222  
Fax: (631) 360 8222  
Zetex (Asia) Ltd  
3701-04 Metroplaza, Tower 1  
Hing Fong Road  
Kwai Fong, Hong Kong  
China  
Telephone: (852) 26100 611  
Fax: (852) 24250 494  
Germany  
Telefon: (49) 89 45 49 49 0  
Fax: (49) 89 45 49 49 49  
These offices are supported by agents and distributors in major countries world-wide.  
This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or  
reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services  
concerned. The Company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or  
service.  
For the latest product information, log on to www.zetex.com  
PROVISIONAL ISSUE A - SEPTEMBER 2001  
4

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