ZXTD4591AM832TC [ZETEX]
COMPLEMENTARY DUAL 40V HIGH PERFORMANCE TRANSISTOR; 互补双40V高性能晶体管![ZXTD4591AM832TC](http://pdffile.icpdf.com/pdf1/p00029/img/icpdf/ZXTD4591_153753_icpdf.jpg)
型号: | ZXTD4591AM832TC |
厂家: | ![]() |
描述: | COMPLEMENTARY DUAL 40V HIGH PERFORMANCE TRANSISTOR |
文件: | 总8页 (文件大小:351K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
![](http://public.icpdf.com/style/img/ads.jpg)
ZXTD4591AM832
MPPS™ Miniature Package Power Solutions
COMPLEMENTARY DUAL 40V HIGH PERFORMANCE TRANSISTOR
SUMMARY
NPN Transistor
V
= 40V; R
= 195m ;
= 350m ;
= 2.5A
= -2A
C
CEO
SAT
C
PNP Transistor
V
= -40V; R
SAT
CEO
DESCRIPTION
Packaged in the new innovative 3mm x 2mm MLP (Micro Leaded Package),
these high performance NPN / PNP combination dual transistors offer lower on
state losses making them ideal for use in DC-DC circuits and various driving
and power-management functions.
Users will also gain several other key benefits:
Performance capability equivalent to much larger packages
3mm x 2mm Dual Die MLP
Improved circuit efficiency & power levels
PCB area and device placement savings
Lower package height (0.9mm nom)
Reduced component count
C1
C2
FEATURES
B2
B1
•
•
•
Low Saturation Voltage (500mV max @1A)
H
specified up to 2A
FE
I
= 2.5A Continuous Collector Current
E2
C
E1
•
3mm x 2mm MLP
APPLICATIONS
•
•
•
•
DC - DC Converters
Power switches
PINOUT
Motor control
LED Backlighting circuits
ORDERING INFORMATION
DEVICE
REE
L
TAPE
QUANTITY
WIDTH PER REEL
ZXTD4591AM832TA
7
8mm
8mm
3000
3mm x 2mm Dual MLP
underside view
ZXTD4591AM832TC 13
10000
DEVICE MARKING
91A
ISSUE 1 - JUNE 2002
1
ZXTD4591AM832
ABSOLUTE MAXIMUM RATINGS.
PARAMETER
SYMBOL
NPN
40
40
5
PNP
-40
-40
-5
UNIT
V
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Peak Pulse Current
V
V
V
CBO
CEO
EBO
V
V
I
I
I
I
3
-3
A
CM
Continuous Collector Current (a)(f)
Continuous Collector Current (b)(f)
Base Current
2
-1.5
-2.0
A
C
C
B
2.5
A
300
mA
Power Dissipation at TA=25°C (a)(f)
Linear Derating Factor
P
P
P
P
P
P
1.5
12
W
D
D
D
D
D
D
mW/°C
Power Dissipation at TA=25°C (b)(f)
Linear Derating Factor
2.45
19.6
W
mW/°C
Power Dissipation at TA=25°C (c)(f)
Linear Derating Factor
1
8
W
mW/°C
Power Dissipation at TA=25°C (d)(f)
Linear Derating Factor
1.13
9
W
mW/°C
Power Dissipation at TA=25°C (d)(g)
Linear Derating Factor
1.7
13.6
W
mW/°C
Power Dissipation at TA=25°C (e)(g)
Linear Derating Factor
3
24
W
mW/°C
Storage Temperature Range
Junction Temperature
T
T
-55 to +150
150
°C
°C
stg
j
THERMAL RESISTANCE
PARAMETER
SYMBOL
VALUE
83.3
51
UNIT
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Junction to Ambient (a)(f)
Junction to Ambient (b)(f)
Junction to Ambient (c)(f)
Junction to Ambient (d)(f)
Junction to Ambient (d)(g)
Junction to Ambient (e)(g)
Notes
R
R
R
R
R
R
θJA
θJA
θJA
θJA
θJA
θJA
125
111
73.5
41.7
(a) For a dual device surface mounted on 8 sq cm single sided 2oz copper on FR4 PCB, in still air conditions with all exposed pads attached. The
copper area is split down the centre line into two separate areas with one half connected to each half of the dual device.
(b) Measured at t<5 secs for a dual device surface mounted on 8 sq cm single sided 2oz copper on FR4 PCB, in still air conditions with all exposed
pads attached. The copper area is split down the centre line into two separate areas with one half connected to each half of the dual device.
(c) For a dual device surface mounted on 8 sq cm single sided 2oz copper on FR4 PCB, in still air conditions with minimal lead connections only.
(d) For a dual device surface mounted on 10 sq cm single sided 1oz copper on FR4 PCB, in still air conditions with all exposed pads attached
attached. The copper area is split down the centre line into two separate areas with one half connected to each half of the dual device.
(e) For a dual device surface mounted on 85 sq cm single sided 2oz copper on FR4 PCB, in still air conditions with all exposed pads attached
attached. The copper area is split down the centre line into two separate areas with one half connected to each half of the dual device.
(f) For a dual device with one active die.
(g) For dual device with 2 active die running at equal power.
(h) Repetitive rating - pulse width limited by max junction temperature. Refer to Transient Thermal Impedance graph.
(i) The minimum copper dimensions required for mounting are no smaller than the exposed metal pads on the base of the device as shown in the
package dimensions data. The thermal resistance for a dual device mounted on 1.5mm thick FR4 board using minimum copper 1 oz weight, 1mm
wide tracks and one half of the device active is Rth = 250°C/W giving a power rating of Ptot = 500mW.
ISSUE 1 - JUNE 2002
2
ZXTD4591AM832
TYPICAL CHARACTERISTICS
AWAITING GRAPH
AWAITING GRAPH
NPN Safe Operating Area
PNP Safe Operating Area
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
Tamb=25°C
2oz Cu
Note (a)(f)
80
60
40
20
0
Note (e)(g)
2oz Cu
Note (a)(f)
D=0.5
D=0.2
1oz Cu
Note (d)(g)
Single Pulse
D=0.05
D=0.1
1oz Cu
Note (d)(f)
100µ 1m 10m 100m
1
10 100 1k
0
25
50
75
100 125 150
Pulse Width (s)
Temperature (°C)
Derating Curve
Transient Thermal Impedance
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
225
200
175
150
125
100
75
2oz copper
Note (g)
Tamb=25°C
jmax=150°C
Continuous
1oz copper
Note (f)
T
1oz copper
Note (g)
2oz copper
Note (f)
2oz copper
Note (f)
1oz copper
Note (g)
50
1oz copper
Note (f)
2oz copper
Note (g)
25
0
0.1
1
10
100
0.1
1
10
100
BoardCuArea(sqcm)
BoardCuArea(sqcm)
Thermal Resistance v Board Area
Power Dissipation v Board Area
ISSUE 1 - JUNE 2002
3
ZXTD4591AM832
NPN TRANSISTOR
ELECTRICAL CHARACTERISTICS (at T
= 25°C unless otherwise stated).
amb
PARAMETER
SYMBOL
MIN.
TYP.
MAX. UNIT
CONDITIONS.
I =100A
Collector-Base Breakdown
Voltage
V
V
V
40
V
(BR)CBO
C
Collector-Emitter Breakdown
Voltage
40
5
V
I =10mA*
C
(BR)CEO
Emitter-Base Breakdown Voltage
Collector Cut-Off Current
V
I =100A
E
(BR)EBO
CBO
I
I
I
100
100
100
nA
nA
nA
V
V
V
=30V
=4V
CB
EB
CE
Emitter Cut-Off Current
EBO
Collector Emitter Cut-Off Current
=30V
CES
Collector-Emitter Saturation
Voltage
V
300
500
mV
mV
I =0.5A, I =50mA*
C B
CE(sat)
I =1A, I =100mA*
C
B
Base-Emitter Saturation Voltage
Base-Emitter Turn-On Voltage
V
V
h
1.1
1.0
V
V
I =1A, I =100mA*
C B
BE(sat)
BE(on)
FE
I =1A, V =5V*
C
CE
Static Forward Current Transfer
Ratio
300
300
200
35
I =1mA, V =5V*
C CE
900
10
I =0.5A, V =5V*
C CE
I =1A, V =5V*
C
C
CE
CE
I =2A, V =5V*
Transition Frequency
f
150
MHz I =-50mA, V =-10V
T
C
CE
f=100MHz
Output Capacitance
C
pF
V
=-10V, f=1MHz
CB
obo
*Measured under pulsed conditions.
ISSUE 1 - JUNE 2002
4
ZXTD4591AM832
ISSUE 1 - JUNE 2002
5
ZXTD4591AM832
PNP TRANSISTOR
ELECTRICAL CHARACTERISTICS (at T
= 25°C unless otherwise stated).
amb
PARAMETER
SYMBOL
MIN.
TYP.
MAX. UNIT
CONDITIONS.
I =-100A
Collector-Base Breakdown
Voltage
V
V
V
-40
V
(BR)CBO
C
Collector-Emitter Breakdown
Voltage
-40
-5
V
I =-10mA*
C
(BR)CEO
Emitter-Base Breakdown Voltage
Collector Cut-Off Current
V
I =-100A
E
(BR)EBO
CBO
I
I
I
-100
-100
-100
nA
nA
nA
V
V
V
=-30V
=-4V
CB
EB
CE
Emitter Cut-Off Current
EBO
Collector Emitter Cut-Off Current
=-30V
CES
Collector-Emitter Saturation
Voltage
V
-200
-350
-500
mV
mV
mV
I =-0.1A, I =-1mA*
C B
CE(sat)
I =-0.5A, I =-20mA*
C
B
I =-1A, I =-100mA*
C
B
Base-Emitter Saturation Voltage
Base-Emitter Turn-On Voltage
V
V
h
-1.1
-1.0
V
V
I =-1A, I =-50mA*
C B
BE(sat)
BE(on)
FE
I =-1A, V =-5V*
C
CE
Static Forward Current Transfer
Ratio
300
300
250
160
30
I =-1mA, V =-5V*
C CE
800
I =-0.1A, V =-5V*
C CE
I =-0.5A, V =-5V*
C
C
CE
CE
CE
I =-1A, V =-5V*
I =-2A, V =-5V*
C
Transition Frequency
f
150
MHz I =-50mA, V =-10V
T
C
CE
f=100MHz
Output Capacitance
C
10
pF
V
=-10V, f=1MHz
CB
obo
*Measured under pulsed conditions.
ISSUE 1 - JUNE 2002
6
ZXTD4591AM832
ISSUE 1 - JUNE 2002
7
ZXTD4591AM832
MLP832 PACKAGE OUTLINE (3mm x 2mm Micro Leaded Package)
CONTROLLING DIMENSIONS IN MILLIMETRES
APPROX. CONVERTED DIMENSIONS IN INCHES
MLP832 PACKAGE DIMENSIONS
MILLIMETRES
INCHES
MILLIMETRES
MIN. MAX.
0.65 REF
2.00 BSC
INCHES
MIN. MAX.
DIM
DIM
MIN.
0.80
0.00
0.65
0.15
0.24
0.17
MAX.
1.00
0.05
0.75
0.25
0.34
0.30
MIN.
MAX.
0.039
A
0.031
0.00
e
E
0.0256 BSC
0.0787 BSC
A1
A2
A3
b
0.002
0.0255
0.006
0.009
0.0066
0.0295
0.0098
0.013
E2
E4
L
0.43
0.63
0.36
0.017
0.0249
0.014
0.16
0.20
0.006
0.0078
0.00
0.45
0.0157
0.005
b1
D
0.0118
L2
r
0.125
3.00 BSC
0.118 BSC
0.075 BSC
0.0029 BSC
D2
D3
0.82
1.01
1.02
1.21
0.032
0.040
⍜
0Њ
12Њ
0Њ
12Њ
0.0397
0.0476
© Zetex plc 2002
Europe
Americas
Asia Pacific
Zetex (Asia) Ltd
Zetex plc
Zetex GmbH
Zetex Inc
Fields New Road
Chadderton
Oldham, OL9 8NP
United Kingdom
Telephone (44) 161 622 4422
Fax: (44) 161 622 4420
uksales@zetex.com
Streitfeldstraße 19
D-81673 München
700 Veterans Memorial Hwy
Hauppauge, NY11788
3701-04 Metroplaza, Tower 1
Hing Fong Road
Kwai Fong
Germany
USA
Hong Kong
Telefon: (49) 89 45 49 49 0
Fax: (49) 89 45 49 49 49
europe.sales@zetex.com
Telephone: (631) 360 2222
Fax: (631) 360 8222
usa.sales@zetex.com
Telephone: (852) 26100 611
Fax: (852) 24250 494
asia.sales@zetex.com
These offices are supported by agents and distributors in major countries world-wide.
This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or reproduced
for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. The Company
reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service.
For the latest product information, log on to www.zetex.com
ISSUE 1 - JUNE 2002
8
相关型号:
©2020 ICPDF网 联系我们和版权申明