ZXTD4591AM832TC [ZETEX]

COMPLEMENTARY DUAL 40V HIGH PERFORMANCE TRANSISTOR; 互补双40V高性能晶体管
ZXTD4591AM832TC
型号: ZXTD4591AM832TC
厂家: ZETEX SEMICONDUCTORS    ZETEX SEMICONDUCTORS
描述:

COMPLEMENTARY DUAL 40V HIGH PERFORMANCE TRANSISTOR
互补双40V高性能晶体管

晶体 晶体管 开关
文件: 总8页 (文件大小:351K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ZXTD4591AM832  
MPPS™ Miniature Package Power Solutions  
COMPLEMENTARY DUAL 40V HIGH PERFORMANCE TRANSISTOR  
SUMMARY  
NPN Transistor  
V
= 40V; R  
= 195m ;  
= 350m ;  
= 2.5A  
= -2A  
C
CEO  
SAT  
C
PNP Transistor  
V
= -40V; R  
SAT  
CEO  
DESCRIPTION  
Packaged in the new innovative 3mm x 2mm MLP (Micro Leaded Package),  
these high performance NPN / PNP combination dual transistors offer lower on  
state losses making them ideal for use in DC-DC circuits and various driving  
and power-management functions.  
Users will also gain several other key benefits:  
Performance capability equivalent to much larger packages  
3mm x 2mm Dual Die MLP  
Improved circuit efficiency & power levels  
PCB area and device placement savings  
Lower package height (0.9mm nom)  
Reduced component count  
C1  
C2  
FEATURES  
B2  
B1  
Low Saturation Voltage (500mV max @1A)  
H
specified up to 2A  
FE  
I
= 2.5A Continuous Collector Current  
E2  
C
E1  
3mm x 2mm MLP  
APPLICATIONS  
DC - DC Converters  
Power switches  
PINOUT  
Motor control  
LED Backlighting circuits  
ORDERING INFORMATION  
DEVICE  
REE  
L
TAPE  
QUANTITY  
WIDTH PER REEL  
ZXTD4591AM832TA  
7
؅؅
 
8mm  
8mm  
3000  
3mm x 2mm Dual MLP  
underside view  
ZXTD4591AM832TC 13
؅
؅
 
10000  
DEVICE MARKING  
91A  
ISSUE 1 - JUNE 2002  
1
ZXTD4591AM832  
ABSOLUTE MAXIMUM RATINGS.  
PARAMETER  
SYMBOL  
NPN  
40  
40  
5
PNP  
-40  
-40  
-5  
UNIT  
V
Collector-Base Voltage  
Collector-Emitter Voltage  
Emitter-Base Voltage  
Peak Pulse Current  
V
V
V
CBO  
CEO  
EBO  
V
V
I
I
I
I
3
-3  
A
CM  
Continuous Collector Current (a)(f)  
Continuous Collector Current (b)(f)  
Base Current  
2
-1.5  
-2.0  
A
C
C
B
2.5  
A
300  
mA  
Power Dissipation at TA=25°C (a)(f)  
Linear Derating Factor  
P
P
P
P
P
P
1.5  
12  
W
D
D
D
D
D
D
mW/°C  
Power Dissipation at TA=25°C (b)(f)  
Linear Derating Factor  
2.45  
19.6  
W
mW/°C  
Power Dissipation at TA=25°C (c)(f)  
Linear Derating Factor  
1
8
W
mW/°C  
Power Dissipation at TA=25°C (d)(f)  
Linear Derating Factor  
1.13  
9
W
mW/°C  
Power Dissipation at TA=25°C (d)(g)  
Linear Derating Factor  
1.7  
13.6  
W
mW/°C  
Power Dissipation at TA=25°C (e)(g)  
Linear Derating Factor  
3
24  
W
mW/°C  
Storage Temperature Range  
Junction Temperature  
T
T
-55 to +150  
150  
°C  
°C  
stg  
j
THERMAL RESISTANCE  
PARAMETER  
SYMBOL  
VALUE  
83.3  
51  
UNIT  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
Junction to Ambient (a)(f)  
Junction to Ambient (b)(f)  
Junction to Ambient (c)(f)  
Junction to Ambient (d)(f)  
Junction to Ambient (d)(g)  
Junction to Ambient (e)(g)  
Notes  
R
R
R
R
R
R
θJA  
θJA  
θJA  
θJA  
θJA  
θJA  
125  
111  
73.5  
41.7  
(a) For a dual device surface mounted on 8 sq cm single sided 2oz copper on FR4 PCB, in still air conditions with all exposed pads attached. The  
copper area is split down the centre line into two separate areas with one half connected to each half of the dual device.  
(b) Measured at t<5 secs for a dual device surface mounted on 8 sq cm single sided 2oz copper on FR4 PCB, in still air conditions with all exposed  
pads attached. The copper area is split down the centre line into two separate areas with one half connected to each half of the dual device.  
(c) For a dual device surface mounted on 8 sq cm single sided 2oz copper on FR4 PCB, in still air conditions with minimal lead connections only.  
(d) For a dual device surface mounted on 10 sq cm single sided 1oz copper on FR4 PCB, in still air conditions with all exposed pads attached  
attached. The copper area is split down the centre line into two separate areas with one half connected to each half of the dual device.  
(e) For a dual device surface mounted on 85 sq cm single sided 2oz copper on FR4 PCB, in still air conditions with all exposed pads attached  
attached. The copper area is split down the centre line into two separate areas with one half connected to each half of the dual device.  
(f) For a dual device with one active die.  
(g) For dual device with 2 active die running at equal power.  
(h) Repetitive rating - pulse width limited by max junction temperature. Refer to Transient Thermal Impedance graph.  
(i) The minimum copper dimensions required for mounting are no smaller than the exposed metal pads on the base of the device as shown in the  
package dimensions data. The thermal resistance for a dual device mounted on 1.5mm thick FR4 board using minimum copper 1 oz weight, 1mm  
wide tracks and one half of the device active is Rth = 250°C/W giving a power rating of Ptot = 500mW.  
ISSUE 1 - JUNE 2002  
2
ZXTD4591AM832  
TYPICAL CHARACTERISTICS  
AWAITING GRAPH  
AWAITING GRAPH  
NPN Safe Operating Area  
PNP Safe Operating Area  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
Tamb=25°C  
2oz Cu  
Note (a)(f)  
80  
60  
40  
20  
0
Note (e)(g)  
2oz Cu  
Note (a)(f)  
D=0.5  
D=0.2  
1oz Cu  
Note (d)(g)  
Single Pulse  
D=0.05  
D=0.1  
1oz Cu  
Note (d)(f)  
100µ 1m 10m 100m  
1
10 100 1k  
0
25  
50  
75  
100 125 150  
Pulse Width (s)  
Temperature (°C)  
Derating Curve  
Transient Thermal Impedance  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
225  
200  
175  
150  
125  
100  
75  
2oz copper  
Note (g)  
Tamb=25°C  
jmax=150°C  
Continuous  
1oz copper  
Note (f)  
T
1oz copper  
Note (g)  
2oz copper  
Note (f)  
2oz copper  
Note (f)  
1oz copper  
Note (g)  
50  
1oz copper  
Note (f)  
2oz copper  
Note (g)  
25  
0
0.1  
1
10  
100  
0.1  
1
10  
100  
BoardCuArea(sqcm)  
BoardCuArea(sqcm)  
Thermal Resistance v Board Area  
Power Dissipation v Board Area  
ISSUE 1 - JUNE 2002  
3
ZXTD4591AM832  
NPN TRANSISTOR  
ELECTRICAL CHARACTERISTICS (at T  
= 25°C unless otherwise stated).  
amb  
PARAMETER  
SYMBOL  
MIN.  
TYP.  
MAX. UNIT  
CONDITIONS.  
I =100A  
Collector-Base Breakdown  
Voltage  
V
V
V
40  
V
(BR)CBO  
C
Collector-Emitter Breakdown  
Voltage  
40  
5
V
I =10mA*  
C
(BR)CEO  
Emitter-Base Breakdown Voltage  
Collector Cut-Off Current  
V
I =100A  
E
(BR)EBO  
CBO  
I
I
I
100  
100  
100  
nA  
nA  
nA  
V
V
V
=30V  
=4V  
CB  
EB  
CE  
Emitter Cut-Off Current  
EBO  
Collector Emitter Cut-Off Current  
=30V  
CES  
Collector-Emitter Saturation  
Voltage  
V
300  
500  
mV  
mV  
I =0.5A, I =50mA*  
C B  
CE(sat)  
I =1A, I =100mA*  
C
B
Base-Emitter Saturation Voltage  
Base-Emitter Turn-On Voltage  
V
V
h
1.1  
1.0  
V
V
I =1A, I =100mA*  
C B  
BE(sat)  
BE(on)  
FE  
I =1A, V =5V*  
C
CE  
Static Forward Current Transfer  
Ratio  
300  
300  
200  
35  
I =1mA, V =5V*  
C CE  
900  
10  
I =0.5A, V =5V*  
C CE  
I =1A, V =5V*  
C
C
CE  
CE  
I =2A, V =5V*  
Transition Frequency  
f
150  
MHz I =-50mA, V =-10V  
T
C
CE  
f=100MHz  
Output Capacitance  
C
pF  
V
=-10V, f=1MHz  
CB  
obo  
*Measured under pulsed conditions.  
ISSUE 1 - JUNE 2002  
4
ZXTD4591AM832  
ISSUE 1 - JUNE 2002  
5
ZXTD4591AM832  
PNP TRANSISTOR  
ELECTRICAL CHARACTERISTICS (at T  
= 25°C unless otherwise stated).  
amb  
PARAMETER  
SYMBOL  
MIN.  
TYP.  
MAX. UNIT  
CONDITIONS.  
I =-100A  
Collector-Base Breakdown  
Voltage  
V
V
V
-40  
V
(BR)CBO  
C
Collector-Emitter Breakdown  
Voltage  
-40  
-5  
V
I =-10mA*  
C
(BR)CEO  
Emitter-Base Breakdown Voltage  
Collector Cut-Off Current  
V
I =-100A  
E
(BR)EBO  
CBO  
I
I
I
-100  
-100  
-100  
nA  
nA  
nA  
V
V
V
=-30V  
=-4V  
CB  
EB  
CE  
Emitter Cut-Off Current  
EBO  
Collector Emitter Cut-Off Current  
=-30V  
CES  
Collector-Emitter Saturation  
Voltage  
V
-200  
-350  
-500  
mV  
mV  
mV  
I =-0.1A, I =-1mA*  
C B  
CE(sat)  
I =-0.5A, I =-20mA*  
C
B
I =-1A, I =-100mA*  
C
B
Base-Emitter Saturation Voltage  
Base-Emitter Turn-On Voltage  
V
V
h
-1.1  
-1.0  
V
V
I =-1A, I =-50mA*  
C B  
BE(sat)  
BE(on)  
FE  
I =-1A, V =-5V*  
C
CE  
Static Forward Current Transfer  
Ratio  
300  
300  
250  
160  
30  
I =-1mA, V =-5V*  
C CE  
800  
I =-0.1A, V =-5V*  
C CE  
I =-0.5A, V =-5V*  
C
C
CE  
CE  
CE  
I =-1A, V =-5V*  
I =-2A, V =-5V*  
C
Transition Frequency  
f
150  
MHz I =-50mA, V =-10V  
T
C
CE  
f=100MHz  
Output Capacitance  
C
10  
pF  
V
=-10V, f=1MHz  
CB  
obo  
*Measured under pulsed conditions.  
ISSUE 1 - JUNE 2002  
6
ZXTD4591AM832  
ISSUE 1 - JUNE 2002  
7
ZXTD4591AM832  
MLP832 PACKAGE OUTLINE (3mm x 2mm Micro Leaded Package)  
CONTROLLING DIMENSIONS IN MILLIMETRES  
APPROX. CONVERTED DIMENSIONS IN INCHES  
MLP832 PACKAGE DIMENSIONS  
MILLIMETRES  
INCHES  
MILLIMETRES  
MIN. MAX.  
0.65 REF  
2.00 BSC  
INCHES  
MIN. MAX.  
DIM  
DIM  
MIN.  
0.80  
0.00  
0.65  
0.15  
0.24  
0.17  
MAX.  
1.00  
0.05  
0.75  
0.25  
0.34  
0.30  
MIN.  
MAX.  
0.039  
A
0.031  
0.00  
e
E
0.0256 BSC  
0.0787 BSC  
A1  
A2  
A3  
b
0.002  
0.0255  
0.006  
0.009  
0.0066  
0.0295  
0.0098  
0.013  
E2  
E4  
L
0.43  
0.63  
0.36  
0.017  
0.0249  
0.014  
0.16  
0.20  
0.006  
0.0078  
0.00  
0.45  
0.0157  
0.005  
b1  
D
0.0118  
L2  
r
0.125  
3.00 BSC  
0.118 BSC  
0.075 BSC  
0.0029 BSC  
D2  
D3  
0.82  
1.01  
1.02  
1.21  
0.032  
0.040  
0Њ  
12Њ  
0Њ  
12Њ  
0.0397  
0.0476  
© Zetex plc 2002  
Europe  
Americas  
Asia Pacific  
Zetex (Asia) Ltd  
Zetex plc  
Zetex GmbH  
Zetex Inc  
Fields New Road  
Chadderton  
Oldham, OL9 8NP  
United Kingdom  
Telephone (44) 161 622 4422  
Fax: (44) 161 622 4420  
uksales@zetex.com  
Streitfeldstraße 19  
D-81673 München  
700 Veterans Memorial Hwy  
Hauppauge, NY11788  
3701-04 Metroplaza, Tower 1  
Hing Fong Road  
Kwai Fong  
Germany  
USA  
Hong Kong  
Telefon: (49) 89 45 49 49 0  
Fax: (49) 89 45 49 49 49  
europe.sales@zetex.com  
Telephone: (631) 360 2222  
Fax: (631) 360 8222  
usa.sales@zetex.com  
Telephone: (852) 26100 611  
Fax: (852) 24250 494  
asia.sales@zetex.com  
These offices are supported by agents and distributors in major countries world-wide.  
This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or reproduced  
for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. The Company  
reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service.  
For the latest product information, log on to www.zetex.com  
ISSUE 1 - JUNE 2002  
8

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