MDS726 [ZMD]
Package SOP8; SOP8封装
| 型号： | MDS726 |
| 厂家： | 
Zentrum Mikroelektronik Dresden AG |
| 描述： | Package SOP8 |
| 文件： | 总1页 (文件大小：49K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ZMD-Standard
January 2005
Package SOP8
MDS
(150 mil)
726
Supersedes
Edition 11.95
Dimensions in millimetres
Based on IEC 191-2Q: Type 076E35 B
Dimensions
1
X
View X
k x 45°
0,1
b
M
0,2
LP
8
1
Z
e
D
Dimensions of Sub-Group B1
Amax
Dimensions of Sub-Group C1
1,95
0,35
0,49
1,27
5,80
6,30
0,40
0,635
Amin
1,55
0,10
0,30
1,40
1,80
0,15
0,25
4,80
5,00
3,80
4,00
0,33
0°
bPmin
bPmax
enom
A1min
A1max
A2min
A2max
cmin
HEmin
HEmax
LPmin
Zmax
cmax
Dmin
*
Dmax
*
2
3
4
5
6
Weight
≤ 0,3 g
Low Stress Epoxy
Emin
Emax
kmin
θmin
θmax
*
Package Body Material
Lead Material
Lead Finish
*
FeNi-Alloy or Cu-Alloy
solder plating
Z-bends
Lead Form
8°
* without mold-flash
Zentrum Mikroelektronik Dresden
Editor: signature by Schoder
Check: signature by Marx
Date: 06.01.2005
Doc-No.
QS-000726-HD-03
Quality: signature by Tina Kochan
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