A1699LUBTN-RSWPL-T中文资料_数据手册_规格书

A1699

Two-Wire, Differential, Vibration-Resistant

Sensor IC with Speed and Direction Output

FEATURES AND BENEFITS

DESCRIPTION

• Integrated IC and capacitor, single overmolded package

to reduce external EMI-protection requirements

• Two-wire, pulse-width output protocol

• Highly configurable output protocol options

• Digital output representing target profile

• Speed and direction information of target

• Vibration tolerance

The A1699 is an optimized Hall-effect integrated circuit (IC)

that provides a user-friendly solution for direction detection

and true zero-speed, digital ring-magnet sensing. The small

package can be easily assembled and used in conjunction with

a wide variety of target sensing applications.

TheICemployspatentedalgorithmsforthespecialoperational

requirements of automotive transmission applications. The

speed and direction of the target are communicated through a

variablepulse-widthoutputprotocol.TheA1699isparticularly

adept at handling vibration without sacrificing maximum air

gapcapabilityorcreatinganyerroneousdirectioninformation.

Theadvancedvibrationdetectionalgorithmwillsystematically

calibrate the sensor IC on the initial magnetic poles of true

target rotation and not on vibration, always guaranteeing an

accurate signal in running mode.

□ Small-signal lockout for small amplitude vibration

□ Proprietary vibration detection algorithms for large

amplitude vibration

• Air-gap-independent switchpoints

• Large operating air gap capability

• Undervoltage lockout

• True zero-speed operation

• Wide operating voltage range

• AEC-Q100 automotive qualified

• Robust test-coverage capability with Scan Path and

IDDQ measurement

Advanced signal processing and innovative algorithms make

the A1699 an ideal solution for a wide range of speed- and

direction-sensing needs.

Package: 2-Pin SIP (Suffix UB)

The A1699 is provided in a 2-pin miniature SIP package

(suffix UB) that is lead (Pb) free, with tin leadframe plating.

The UB package includes an IC and capacitor integrated into a

single overmolded package to reduce external EMI protection

requirements.

Not to scale

VCC

Regulator

(Analog)

Regulator

(Digital)

Offset

Adjust

Hall Amp

AGC

Filter

ADC

Synchronous

Digital Controller

Output

Control

Offset

Adjust

Hall Amp

AGC

Filter

ADC

GND

Functional Block Diagram

April 3, 2019

A1699-DS, Rev. 8

MCO-0000636

Two-Wire, Differential, Vibration-Resistant

Sensor IC with Speed and Direction Output

A1699

Conﬁguration

Complete Part

Number Format

L UB TN -X X X X X -T

A1699

Allegro Identiﬁer and Device Type

Operating Temperature Range

Package Designation

Instructions (Packing)

Leadframe Plating

Allegro Identiﬁer and Device Type

[A1699]

[L]

Operating Temperature Range

Package Designation

Instructions (Packing)

[UB] 2-pin plastic SIP

[TN] Tape and reel

[-F] pin 1-to-2 forward or

[-R] pin 2-to-1 forward

Rotation Direction

[S] single, one pulse per magnetic pole pair or

[D] dual, one pulse for each north and south pole

Number of Pulses

[N] 90 µs (narrow) or

[W] 180 µs (wide)

Reverse Pulse

Width

Conﬁguration

[B] Blanked, no output during Calibration or

[P] Pulses during Calibration

Calibration Pulses

[L] Low vibration immunity with immediate

direction change detection or

[H] High vibration immunity with non-direction

pulses

Vibration Immunity

/ Direction Change

[T] Lead (Pb) free

Leadframe Plating

For example: A1699LUBTN-RSNPL-T

Where a conﬁguration character is unspeciﬁed, “x” will be used. For example, -xSNPL applies to both

Rotation Direction conﬁguration variants.

2

Allegro MicroSystems

955 Perimeter Road

Manchester, NH 03103-3353 U.S.A.

www.allegromicro.com

Two-Wire, Differential, Vibration-Resistant

Sensor IC with Speed and Direction Output

A1699

SELECTION GUIDE

Part Number

Packing*

4000 pieces per 13-in. reel

A1699LUBTN–xxxxx–T

*Contact Allegro™ for additional packing options.

ABSOLUTE MAXIMUM RATINGS*

Characteristic

Symbol

Notes

Refer to Power Derating Section

Rating

28

Unit

V

Supply Voltage

V_CC

Reverse Supply Voltage

V_RCC

T_A

–18

V

Operating Ambient Temperature

Maximum Junction Temperature

Storage Temperature

L temperature range

–40 to 150

165

ºC

T_J(max)

T_stg

–65 to 170

INTERNAL DISCRETE CAPACITOR RATINGS

Characteristic

Symbol

Test Conditions

Value (Typ.)

Unit

Nominal Capacitance

C_SUPPLY

Connected between VCC and GND

10000

pF

Terminal List Table

Name

Number

Function

VCC

1

Supply Voltage

Ground

GND

2

1

2

Package UB, 2-Pin SIP Pinout Diagram

3

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Two-Wire, Differential, Vibration-Resistant

Sensor IC with Speed and Direction Output

A1699

OPERATING CHARACTERISTICS: Valid throughout full operating and temperature ranges, unless otherwise speciﬁed

Characteristic

ELECTRICAL CHARACTERISTICS

Supply Voltage²

Symbol

Test Conditions

Min.

Typ.¹

Max.

Unit

V_CC

V_CC(UV)

I_RCC

Operating, T_J< T_J(max)

4

–

3.6

–

24

3.95

–10

–

V

Undervoltage Lockout

V_CCtransitioning from 0 → 5 V or 5 → 0 V

Reverse Supply Current³

Supply Zener Clamp Voltage

V_CC= V_RCC(max)

–

mA³

V

V_ZSUPPLYI_CC= I_CC(max) + 3 mA, T_A= 25ºC

I_CC(LOW)Low-current state (running mode)

I_CC(HIGH)High-current state (running mode)

28

5

–

8

mA

12

–

16

Supply Current

I_CC(SU)

(LOW)

Low-current level (calibration) and Power-on

mode

5

–

8.5

–

mA

–

I_CC(HIGH)

I_CC(LOW)current

/

Measured as a ratio of high current to low

Supply Current Ratio

OUTPUT

1.9

ΔI/Δt from 10% to 90% I_CClevel; Corresponds to

measured output slew rate with C_SUPPLY

Output Rise Time

t_r

t_f

–

2

4

μs

ΔI/Δt from 90% to 10% I_CC; Corresponds to

measured output slew rate with C_SUPPLY

Output Fall Time

OUTPUT PULSE CHARACTERISTICS⁴

Pulse Width, Forward Rotation

t_w(FWD)

38

76

45

90

52

μs

-xxNxx variant

104

207

414

Pulse Width, Reverse Rotation

t_w(REV)

-xxWxx variant

153

306

180

360

-xxNPx and -xxNxH variants

-xxWPx and -xxWxH variants

Pulse Width, Non-Direction

t_w(ND)

Continued on the next page…

V_S

1

VCC

C_SUPPLY

2

GND

R_L

A1699

V_OUT

C_L

Figure 1: Typical Application Circuit

4

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Two-Wire, Differential, Vibration-Resistant

Sensor IC with Speed and Direction Output

A1699

OPERATING CHARACTERISTICS (continued): Valid throughout full operating and temperature ranges, unless otherwise

speciﬁed

Characteristic

OPERATING CHARACTERISTICS

Operate Point

Symbol

Test Conditions

Min.

Typ.¹

Max.

Unit

B_OP

B_RP

% of peak-to-peak IC-processed magnetic signal

-xSxxx variant

–

0

69

31

–

%

Release Point

%

12

6

kHz

Operating Frequency, Forward

Rotation

f_FWD

-xDxxx variant

–

-xSNxx variant

–

7

-xDNxx variant

–

3.5

4

Operating Frequency, Reverse

Rotation⁵

f_REV

-xSWxx variant

–

-xDWxx variant

–

2

-xSNxx variant

–

4

-xDNxx variant

–

2

Operating Frquency, Non-Direction

Pulses⁵

f_ND

-xSWxx variant

–

2.2

1.1

-xDWxx variant

–

DAC CHARACTERISTICS

Magnitude valid for both differential magnetic

channels

Allowable User-Induced Offset

PERFORMANCE CHARACTERISTICS

Operational Magnetic Range

–300

–

300

G

Peak to peak differential signal; valid for each

magnetic channel.

B_IN

30

–

1200

G

-xxxxL variant

See Figure 2

T_TARGET

–

deg.

Vibration Immunity (Startup)

ErrVIB(SU)

-xxxxH variant

0.12 ×

T_TARGET

-xxxxL variant

See Figure 2

–

deg.

Vibration Immunity (Running Mode)

Magnetic Temperature Coefficient

Err_VIB

-xxxxH variant

T_TARGET

–

deg.

TC_MAG

Optimized value, for ring magnet

–0.2

%/°C

¹Typical values are at T_A= 25°C and V_CC= 12 V. Performance may vary for individual units, within the speciﬁed maximum and minimum limits.

²Maximum voltage must be adjusted for power dissipation and junction temperature; see representative discussions in Power Derating section.

³Negative current is deﬁned as conventional current coming out of (sourced from) the speciﬁed device terminal.

⁴Load circuit is RL = 100 Ω and CL = 10 pF. Pulse duration measured at threshold of ( (I_CC(HIGH)+ I_CC(LOW)) /2).

⁵Maximum Operating Frequency is determined by satisfactory separation of output pulses: I_CC(LOW)of tw_(FWD)(MIN). If the customer can resolve shorter low-state durations,

maximum f_REVand f_NDmay be increased.

360º (degrees prime)

S

N

S

N

Target

V_SP

V_PROC(BOP)

T_TARGET

T_VPROC

(B_OP

)

V_PROC

V_PROC(pk-pk)

(B_RP

)

V_PROC(BRP)

V_PROC= the processed analog signal of the sinusoidal magnetic input (per channel)

V_SP

V_PROC(pk-pk)

T_TARGET= the period between successive sensed target magnetic edges of the same

polarity (either both north-to-south or both south-to-north)

V_SP(sep)

=

Figure 2: Deﬁnition of T_TARGET

5

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Two-Wire, Differential, Vibration-Resistant

Sensor IC with Speed and Direction Output

A1699

OPERATING CHARACTERISTICS (continued): Valid throughout full operating and temperature ranges, unless otherwise

speciﬁed

Characteristic

INPUT MAGNETIC CHARACTERISTICS

B_SEQ(n+1)

Symbol

Test Conditions

Min.

Typ.¹

Max.

Unit

/

Signal cycle-to-cycle variation (see Figure 3)

Overall signal variation (see Figure 3)

0.6

0.4

–

B_SEQ(n)

Allowable Differential Sequential

Signal Variation

B_SEQ(n+i)

B_SEQ(n)

/

CALIBRATION

Amount of target rotation

(constant direction) following

power-on until first electrical

output pulse of either tw_(FWD)

or tw_(REV). See Figure 2

B_IN> 60 G_PP

B_IN≤ 1200 G_PP

2 ×

T_TARGET

<3 ×

T_TARGET

–

degrees

First Direction Output Pulse⁶

30 G_PP≤ B_IN

B_IN≤ 60 G_PP

2.5 ×

T_TARGET

<4 ×

T_TARGET

Amount of target rotation

(constant direction) following

event until first electrical

output pulse of either tw_(FWD)

or tw_(REV). VSP_(sep)≥ 35.

See Figure 2

switch-

point

-xxxxL variant

-xxxxH variant

–

1

–

First Direction Pulse Output Following

Direction Change

N_CD

1 ×

T_TARGET

2 ×

T_TARGET

3 ×

T_TARGET

degrees

1.25 ×

T_TARGET

Amount of target rotation

(constant direction) following

event until first electrical

output pulse of either tw_(FWD)

or tw_(REV). See Figure 2

-xxxxL variant

-xxxxH variant

–

degrees

First Direction Pulse Output Following

Running Mode Vibration

1 ×

T_TARGET

2 ×

T_TARGET

3 ×

T_TARGET

Minimum separation between channels as a

percentage of signal amplitude at each switching

point. See Figure 2

%

pk-pk

Switch Point Separation

V_SP(sep)

20

–

⁶Power-up frequencies ≤ 200 Hz. Higher power-on frequencies may require more input magnetic cycles until output edges are achieved.

B_SEQ(n)

B_{SEQ(n + 1)}

B_SEQ(n+1), i ≥ 2

Figure 3: Diﬀerential Signal Variation

6

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955 Perimeter Road

Manchester, NH 03103-3353 U.S.A.

www.allegromicro.com

Two-Wire, Differential, Vibration-Resistant

Sensor IC with Speed and Direction Output

A1699

THERMAL CHARACTERISTICS

Characteristic

Package Thermal

Resistance

Symbol

Test Conditions*

Value

Unit

R_θJA

Single-layer PCB with copper limited to solder pads

213

ºC/W

*Additional thermal information is available on the Allegro website.

Power Derating Curve

26

24

22

20

18

16

14

12

10

8

V_CC(max)

R_θJA= 213 °C/W

6

V_CC(min)

4

2

0

20

40

60

80

100

120

140

160

Ambient Temperature, T_A(ºC)

Power Dissipation versus Ambient Temperature

1000

900

800

700

600

500

400

300

200

100

0

R_θJA= 213 °C/W

20

40

60

80

100

120

140

160

Ambient Temperature, T_A(ºC)

7

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955 Perimeter Road

Manchester, NH 03103-3353 U.S.A.

www.allegromicro.com

Two-Wire, Differential, Vibration-Resistant

Sensor IC with Speed and Direction Output

A1699

CHARACTERISTIC PERFORMANCE

Supply Current

18

16

14

12

18

V_CC= 4 V

T_A= +25ºC

16

14

12

I_CCHIGH

10

8

10

8

6

4

6

4

I_CCLOW

0

50

0

10

SUPPLY VOLTAGE (V)

25

100

150

5

20

-50

-25

125

25

75

15

AMBIENT TEMPERATURE (ºC)

18

16

14

12

18

16

14

12

V_CC= 24 V

T_A= +150ºC

I_CCHIGH

10

8

10

8

I_CCLOW

6

4

6

4

I_CCLOW

0

50

AMBIENT TEMPERATURE (ºC)

0

10

25

100

150

5

20

-50

-25

125

25

75

15

SUPPLY VOLTAGE (V)

8

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955 Perimeter Road

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Two-Wire, Differential, Vibration-Resistant

Sensor IC with Speed and Direction Output

A1699

Supply Current Ratio

5

4.5

4

5

Vcc= 4 V

T_A= +25°C

4.5

4

3.5

3

3.5

3

ICCRATIO

2.5

2

2.5

2

ICCRATIO

1.5

1

1.5

1

0.5

0

0.5

0

-50

-25

0

25

50

75

100

125

150

0

5

10

15

20

25

AMBIENT TEMPERATURE (°C)

SUPPLY VOLTAGE (V)

5

4.5

4

5

4.5

4

Vcc = 24 V

T_A= +150°C

3.5

3

3.5

3

2.5

2

2.5

2

ICCRATIO

1.5

1

1.5

1

0.5

0

0.5

0

5

10

15

20

25

-50

-25

0

25

50

75

100

125

150

SUPPLY VOLTAGE (V)

AMBIENT TEMPERATURE (°C)

9

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Two-Wire, Differential, Vibration-Resistant

Sensor IC with Speed and Direction Output

A1699

Pulse Width

500

450

400

350

300

250

200

150

100

50

T_A= +25°C

Vcc = 4 V

NON DIRECTION (-xxWPx and -xxWxH variants)

450

NON DIRECTION (-xxWPx and -xxWxH variants)

400

350

300

250

REVERSE ( -xxWxx variant )

200

REVERSE ( -xxWxx variant )

150

REVERSE ( -xxNxx variant )

100

REVERSE ( -xxNxx variant )

FORWARD

50

0

5

10

15

20

25

-50

-25

0

25

50

75

100

125

150

SUPPLY VOLTAGE (V)

AMBIENT TEMPERATURE (°C)

500

450

400

350

300

250

200

150

100

50

500

450

400

350

300

250

200

150

100

50

T_A= +150°C

Vcc = 24 V

NON DIRECTION (-xxWPx and -xxWxH variants)

REVERSE ( -xxWxx variant )

REVERSE ( -xxNxx variant )

FORWARD

REVERSE ( -xxNxx variant )

FORWARD

0

-50

-25

0

25

50

75

100

125

150

0

5

10

15

20

25

AMBIENT TEMPERATURE (°C)

SUPPLY VOLTAGE (V)

10

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955 Perimeter Road

Manchester, NH 03103-3353 U.S.A.

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Two-Wire, Differential, Vibration-Resistant

Sensor IC with Speed and Direction Output

A1699

FUNCTIONAL DESCRIPTION

Sensing Technology

Direction Detection

The sensor IC contains a single-chip Hall-effect circuit that

supports a trio of Hall elements. These elements are used in

The sensor IC compares the relative phase of its two differential

channels to determine which direction the target is moving. The

differential pairs to provide electrical signals containing informa- relative switching order is used to determine the direction, which

tion regarding edge position and direction of target rotation. The

A1699 is intended for use with ring magnet and gear targets.

is communicated through the output protocol.

Data Protocol Description

After proper power is applied to the sensor IC, it is capable of

providing digital information that is representative of the mag-

netic features of a rotating target. The waveform diagrams in

Figure 4 present the automatic translation of the target profiles to

the digital output signal of the sensor IC

When a target passes in front of the device (opposite the branded

face of the package case), the A1699 generates an output pulse(s)

for each pair of magnetic poles of the target. Speed information is

provided by the output pulse rate, while direction of target rota-

tion is provided by the duration of the output pulses. The sensor

IC can sense target movement in both the forward and reverse

directions.

Target

N

Package Case Branded Face

Device Orientation to Target

Package Case

Branded Face

Device Orientation to Target

IC

E3

E2

E1

(Pin 2 Side)

(Top View of

(Pin 1 Side)

(Pin 1

Side)

(Top View of

Package Case)

(Pin 2

Side)

IC

Channel B

Element Pitch

Channel A

Element Pitch

E3

E1

IC^E2

Pole Piece

Package Case)

(Concentrator)

Back-Biasing

Rare-Earth Pellet

B Channel

South Pole

A Channel

Mechanical Position (Target moves past device pin 1 to pin 2)

North Pole

Target

(Radial Ring Magnet)

This pole

sensed later

This pole

sensed earlier

Mechanical Position (Target moves past device pin 1 to pin 2)

N

S

N

This tooth

sensed later

This tooth

sensed earlier

Target Magnetic Profile

Channel

Element Pitch

+B

Target Magnetic Profile

+B

Channel

Element Pitch

–B

IC Internal Differential Analog Signals, V_PROC

B_OPB_OP

IC Internal Differential Analog Signals, V_PROC

B_OP

A Channel

B_RP

B_OP

B_RP

B_OP

B Channel

B_RP

Detected Channel Switching

A Channel

B Channel

Device Output Signal

CC(High)

I

CC(High)

I

CC(Low)

Figure 4: The magnetic proﬁle reﬂects the features of the target, allowing the sensor IC to present an accurate

digital output (-xSxxx variant shown).

11

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Two-Wire, Differential, Vibration-Resistant

Sensor IC with Speed and Direction Output

A1699

face. For targets rotating from pin 2 to 1, this shift (Δfwd with R

variants, with south pole of backbiasing pellet toward IC) results

Forward Rotation (see Figure 5)

When the target is rotating such that a magnetic pole near the

sensor IC (of -Fxxxx variant) passes from pin 1 to pin 2, this is

referred to as forward rotation. This direction is opposite for the

-Rxxxx variant. Forward rotation is indicated by output pulse

widths of t_w(FWD)(45 μs typical).

in the pulse corresponding to the valley with the sensed mechani-

cal edge; for targets rotating from pin 1 to 2, the shift (Δrev)

results in the pulse corresponding to the tooth with the sensed

edge. Figure 7 shows pulse timing for F variants. The sensed

mechanical edge that stimulates output pulses is kept the same for

both forward and reverse rotation by using only one channel to

control output switching.

Reverse Rotation (see Figure 5)

When the target is rotating such that a magnetic pole passes from

pin 2 to pin 1, it is referred to as reverse rotation for the -Fxxxx

variant. This direction is opposite for the -Rxxxx variant. Reverse

rotation is indicated by output pulse widths of t_w(REV)(90 μs typi-

cal for -xxNxx variant, or 180 μs typical for -xxWxx variant).

Direction Validation

For the -xxxxL variant, following a direction change in run-

ning mode, direction changes are immediately transmitted to the

output.

Timing

For the -xxxxH variant, following a direction change in running

mode, output pulses have a width of t_w(ND)until direction infor-

mation is validated.

As shown in Figure 6, the pulse appears at the output slightly

before the sensed magnetic edge traverses the package branded

Pin 2 to 1 Rotation

Pin 1 to 2 Rotation

Valley

Tooth

Δfwd

t_w(FWD)

Branded Face

of Sensor

Rotating Target

Output Pulse

(Pin 2 to 1 Rotation)

N

S

N

S

N

t

S

N

Δrev

t_w(REV)

Pin 1

Pin 2

(A) Forward Rotation

Output Pulse

(Pin 1 to 2 Rotation)

Figure 6: Output Protocol (-RSxxx variant)

Branded Face

of Sensor

Rotating Target

Δrev

N

S

t_w(REV)

S

N

S

N

S

N

Pin 1

Pin 2

Output Pulse

(Pin 2 to 1 Rotation)

(B) Reverse Rotation

t

Δfwd

t_w(FWD)

Figure 5: Target Rotation for -Fxxxx Variant.

-Rxxxx variant inverts detected direction of rotation.

Output Pulse

(Pin 1 to 2 Rotation)

Figure 7: Output Protocol (-FDxxx variant)

12

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Two-Wire, Differential, Vibration-Resistant

Sensor IC with Speed and Direction Output

A1699

Target Rotation Forward

Target Rotation Reverse

N

S

N

S

N

S

N

Target

Differential

Magnetic

Proﬁle

t_w(REV)

t_w(FWD)

I_OUT

t

Figure 8: Example Running Mode Direction Change (-FSxxL variant)

Target Rotation Forward

Target Rotation Reverse

N

S

N

S

N

S

N

Target

Differential

Magnetic

Proﬁle

t_w(ND)

t_w(REV)

t_w(FWD)

I_OUT

t

Figure 9: Example Running Mode Direction Change (-FSxxH variant)

13

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Two-Wire, Differential, Vibration-Resistant

Sensor IC with Speed and Direction Output

A1699

Startup Detection/Calibration

VPROC in the internal A-to-D range to allow for acquisition of

signal peaks. AOA and AGC function separately on the two dif-

ferential signal channels.

When power is applied to the A1699, the sensor IC internally

detects the profile of the target. The gain and offset of the

detected signals are adjusted during the calibration period, nor-

malizing the internal signal amplitude for the air gap range of the

device.

Direction information is available after calibration is complete.

For the -xxxBx variant, the output becomes active at the end of

calibration. Figure 10 shows where the first output edges may

occur for various starting target phases.

The Automatic Gain Control (AGC) feature ensures that opera-

tional characteristics are isolated from the effects of installation

air gap variation.

For the -xxxPx variant, output pulses of t_w(ND)are supplied dur-

ing calibration. Figure 11 shows where the first output edges may

occur for various starting target phases.

Automatic Offset Adjustment (AOA) is circuitry that compen-

sates for the effects of chip, magnet, and installation offsets.

This circuitry works with the AGC during calibration to adjust

Target Rotation

N

S

N

S

N

S

N

S

N

Target

Differential

Magnetic

Profile

t_W(FWD)or

t_W(REV)

t_W(FWD)or

t_W(REV)

t_W(FWD)or

t_W(REV)

t_W(FWD)or

t_W(REV)

t_W(FWD)or

t_W(REV)

t_W(FWD)or

t_W(REV)

t_W(FWD)or

t_W(REV)

Opposite

north pole

Opposite

N→S boundary

I

CC

Opposite

south pole

Opposite

t

S→N boundary

Device Location at Power-On

Figure 10: Startup Position Eﬀect on First Device Output Switching (-xxxBx variant)

Target Rotation

N

S

N

S

N

S

N

S

N

Target

Differential

Magnetic

Profile

t_W(FWD)or

t_W(REV)

t_W(FWD)or

t_W(REV)

t_W(FWD)or

t_W(REV)

t_W(FWD)or

t_W(REV)

t_W(FWD)or

t_W(REV)

t_W(FWD)or

t_W(REV)

t_W(FWD)or

t_W(REV)

t_W(ND)

Opposite

north pole

t_W(ND)

Opposite

N→S boundary

I

CC

Opposite

south pole

t_W(ND)

Opposite

t

S→N boundary

Device Location at Power-On

Figure 11: Startup Position Eﬀect on First Device Output Switching (-xxxPx variant)

14

Allegro MicroSystems

955 Perimeter Road

Manchester, NH 03103-3353 U.S.A.

www.allegromicro.com

Two-Wire, Differential, Vibration-Resistant

Sensor IC with Speed and Direction Output

A1699

Vibration Detection

ing the proper direction information will resume when direction

information is validated on constant target rotation.

Algorithms embedded in the IC’s digital controller detect the

presence of target vibration through analysis of the two magnetic

input channels.

For the -xxxxH variant, in the presence of vibration, output pulses

of t_w(ND)may occur or no pulses may occur, depending on the

amplitude and phase of the vibration. Output pulses have a width

of t_w(ND)until direction information is validated on constant

target rotation.

For the -xxxxL variant, the first direction change is immediately

transmitted to the output. During any subsequent vibration, the

output is blanked and no output pulses will occur for vibrations

less than the specified vibration immunity. Output pulses contain-

Normal Target Rotation

Vibration

S

N

S

N

S

N

S

N

Target

Differential

Magnetic

Proﬁle

t_W(FWD)

[or t_W(REV)]

t_W(FWD)

[or t_W(REV)]

t_W(REV)

[or t_W(FWD)]

t_W(FWD)

[or t_W(REV)]

t_W(FWD)

[or t_W(REV)]

t

Figure 12: Output Functionality in the Presence of Running Mode Target Vibration (-xxxxL variant)

Normal Target Rotation

Vibration

S

N

S

N

S

N

S

N

Target

Differential

Magnetic

Proﬁle

t_W(FWD)

t_W(ND)

[or t_W(REV)]

t_W(ND)

t_W(FWD)

[or t_W(REV)]

t

Figure 13: Output Functionality in the Presence of Running Mode Target Vibration (-xxxxH variant)

15

Allegro MicroSystems

955 Perimeter Road

Manchester, NH 03103-3353 U.S.A.

www.allegromicro.com

Two-Wire, Differential, Vibration-Resistant

Sensor IC with Speed and Direction Output

A1699

POWER DERATING

The device must be operated below the maximum junction

temperature of the device, T_J(max). Under certain combinations of

peak conditions, reliable operation may require derating supplied

power or improving the heat dissipation properties of the appli-

cation. This section presents a procedure for correlating factors

affecting operating T_J. (Thermal data is also available on the

Allegro MicroSystems website.)

A worst-case estimate, P_D(max), represents the maximum allow-

able power level (V_CC(max), I_CC(max)), without exceeding T_J(max)

at a selected R_θJAand T_A.

,

Example: Reliability for V_CCat T_A= 150°C.

Observe the worst-case ratings for the device, specifically:

R_θJA= 213°C/W, T_J(max)= 165°C, V_CC(max)= 24 V, and I_CC(mean)

= 14.8 mA. (Note: For variant -xxWPx, at maximum target

frequency, I_CC(LOW)= 8 mA, I_CC(HIGH)= 16 mA, and maximum

pulse widths, the result is a duty cycle of 84% and thus a worst-

case mean I_CCof 14.8 mA.)

The Package Thermal Resistance, R_θJA, is a figure of merit sum-

marizing the ability of the application and the device to dissipate

heat from the junction (die), through all paths to the ambient air.

Its primary component is the Effective Thermal Conductivity,

UB, of the printed circuit board, including adjacent devices and

traces. Radiation from the die through the device case, R_θJC, is

relatively small component of R_θJA. Ambient air temperature,

T_A, and air motion are significant external factors, damped by

overmolding.

Calculate the maximum allowable power level, P_D(max). First,

invert equation 3:

∆T_maxꢀ=ꢀT_J(max)ꢀ–ꢀT_A= 165 °C – 150 °C = 15 °C

This provides the allowable increase to T_Jresulting from internal

power dissipation. Then, invert equation 2:

The effect of varying power levels (Power Dissipation, P_D), can

be estimated. The following formulas represent the fundamental

relationships used to estimate T_J, at P_D.

P_D(max)ꢀ=ꢀ∆T_max÷ R_θJAꢀ=ꢀ15°Cꢀ÷ꢀ213ꢀ°C/Wꢀ(estimated)ꢀ=ꢀ70.4ꢀ

mW

P_D= V_IN× I_IN

∆Tꢀ=ꢀP_D× R_θJA

T_Jꢀ=ꢀT_Aꢀ+ꢀ∆Tꢀꢀ

(1)

(2)

(3)

Finally, invert equation 1 with respect to voltage:

ꢀ

V

_CC(est)= P_D(max)÷ I_CC(max)ꢀ=ꢀ70.4ꢀmWꢀ÷ꢀ14.8ꢀmAꢀ=ꢀ4.7ꢀV

The result indicates at T_A, the application and device can dissi-

pate adequate amounts of heat at voltages ≤ V_CC(est)

For example, given common conditions such as: T_A= 25°C,

V_CC= 12 V, R_θJAꢀ=ꢀ213ꢀ°C/W, and Iccꢀ=ꢀ6.5ꢀmA, then:

.

Compare V_CC(est)to V_CC(max). If V_CC(est)≤ V_CC(max), then reli-

able operation between V_CC(est)and V_CC(max)requires enhanced

R_θJA. If V_CC(est)≥ V_CC(max), then operation between V_CC(est)and

V_CC(max)is reliable under these conditions.

P_D= V_CC× I_CCꢀ=ꢀ12ꢀVꢀ×ꢀ6.5ꢀmAꢀ=ꢀ78ꢀmW

ꢀ

∆Tꢀ=ꢀP_D× R_θJAꢀ=ꢀ78ꢀmWꢀ×ꢀ213ꢀ°C/Wꢀ=ꢀ16.6°C

T_Jꢀ=ꢀT_Aꢀ+ꢀ∆Tꢀ=ꢀ25°Cꢀ+ꢀ16.6°Cꢀ=ꢀ41.6°C

16

Allegro MicroSystems

955 Perimeter Road

Manchester, NH 03103-3353 U.S.A.

www.allegromicro.com

Two-Wire, Differential, Vibration-Resistant

Sensor IC with Speed and Direction Output

A1699

PACKAGE OUTLINE DRAWING

For Reference Only – Not for Tooling Use

(Reference DWG-0000408, Rev. 1)

Dimensions in millimeters – NOT TO SCALE

Dimensions exclusive of mold ﬂash, gate burs, and dambar protrusions

Exact case and lead conﬁguration at supplier discretion within limits shown

+0.06

–0.05

4.00

B

4×10°

E 1.45

1.50 0.05

1.45 E

C

0.55 E

1.41 E

Mold Ejector

Pin Indent

+0.06

4.00

–0.07

E

E1

E3

E2

E

45°

Branded

Face

NNN

A

YYWW

0.85 0.07

LLLL

0.42 0.10

4 × 2.50 0.10

0.25 REF

0.30 REF

2.54 REF

D

Standard Branding Reference View

= Supplier emblem

N

Y

W

L

= Last three digits of device part number

= Last 2 digits of year of manufacture

= Week of manufacture

1

2

18.00 0.10

12.20 0.10

= Lot number

1.00 0.10

+0.07

0.25

4 × 7.37 REF

1.80 0.10

–0.03

A

B

C

D

E

F

Dambar removal protrusion (8×)

Gate and tie burr area

Active Area Depth, 0.38 mm 0.03

0.38 REF

0.25 REF

Branding scale and appearance at supplier discretion

Hall elements (E1, E2, and E3); not to scale

Molded Lead Bar for preventing damage to leads during shipment

4 × 0.85 REF

0.85 0.07

+0.06

1.80

–0.07

F

+0.06

4.00

1.50 0.05

–0.05

Figure 14: Package UB, 2-Pin SIP

17

Allegro MicroSystems

955 Perimeter Road

Manchester, NH 03103-3353 U.S.A.

www.allegromicro.com

Two-Wire, Differential, Vibration-Resistant

Sensor IC with Speed and Direction Output

A1699

Revision History

Number

Date

Description

–

1

2

3

March 1, 2014

October 7, 2014

December 12, 2014

March 24, 2015

Initial release.

Updated Package Outline Drawing and reformatted document.

Revised C_SUPPLY, t_r, and t_f.

Updated branding on Package Outline Drawing.

Updated Hall element number and positions in top outline of Package Outline Drawing; updated

4

5

September 23, 2015 Figures 6 and 7 and associated text on page 12; updated Pulse Width Characteristic Performance

plots on page 10; removed bulk oﬀering on page 2-3; additional editorial changes.

Updated Package Outline Drawing molded lead bar footnote and Internal Discrete Capacitor

March 1, 2016

Ratings table.

6

7

8

April 7, 2016

September 23, 2016 Updated Package Outline Drawing.

April 3, 2019 Minor editorial updates

Corrected Figure 6 and 7 captions.

Allegro MicroSystems reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit

improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the

information being relied upon is current.

Allegro’s products are not to be used in any devices or systems, including but not limited to life support devices or systems, in which a failure of

Allegro’s product can reasonably be expected to cause bodily harm.

The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems assumes no responsibility for its use; nor

for any infringement of patents or other rights of third parties which may result from its use.

Copies of this document are considered uncontrolled documents.

For the latest version of this document, visit our website:

www.allegromicro.com

18

Allegro MicroSystems

955 Perimeter Road

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www.allegromicro.com

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