TC648BEUA中文资料_数据手册_规格书

TC648

M

Fan Speed Controller with Auto-Shutdown

and Over-Temperature Alert

Features

Package Types

SOIC/PDIP/MSOP

• Temperature Proportional Fan Speed for Acoustic

Control and Longer Fan Life

• Efficient PWM Fan Drive

• 3.0V to 5.5V Supply Range:

- Fan Voltage Independent of TC648

Supply Voltage

- Supports any Fan Voltage

V

1

2

3

4

8

7

6

5

IN

DD

C

F

OUT

TC648

V

AS

GND

OTF

NC

• Over-temperature Fault Detection

• Automatic Shutdown Mode for “Green” Systems

• Supports Low Cost NTC/PTC Thermistors

• Space Saving 8-Pin MSOP Package

General Description

The TC648 is a switch mode, fan speed controller for

use with brushless DC fans. Temperature proportional

speed control is accomplished using pulse width mod-

ulation (PWM). A thermistor (or other voltage output

Applications

• Power Supplies

• Computers

• Portable Computers

• Telecom Equipment

• UPSs, Power Amps

• General Purpose Fan Speed Control

temperature sensor) connected to the V

input

IN

furnishes the required control voltage of 1.25V to 2.65V

(typical) for 0% to 100% PWM duty cycle. The TC648

can be configured to operate in either auto-shutdown or

minimum speed mode. In auto-shutdown mode, fan

operation is automatically suspended when measured

temperature (V ) is lower than a user programmed

IN

minimum setting (V ). The fan is automatically

AS

Available Tools

• Fan Controller Demonstration Board (TC642DEMO)

• Fan Controller Evaluation Kit (TC642EV)

restarted, and proportional speed control restored,

when V exceeds V (plus hysteresis). Operation in

IN

AS

minimum speed mode is similar to auto-shutdown

mode, with the exception that the fan is operated at a

user programmed minimum setting when the mea-

sured temperature is low. An integrated Start-up Timer

ensures reliable motor start-up at turn-on, and when

coming out of shutdown or auto-shutdown mode.

The over-temperature fault output (OTF) is asserted

when the PWM reaches 100% duty cycle, indicating a

possible thermal runaway situation.

The TC648 is available in the 8-pin plastic DIP, SOIC

and MSOP packages and is available in the industrial

and extended commercial temperature ranges.

2002 Microchip Technology Inc.

DS21448C-page 1

TC648

Functional Block Diagram

V

IN

+

V

DD

V

OTF

–

OTF

–

+

PWM

V

Control

OUT

Logic

C

F

Clock

Generator

–

OTF

Start-up

Timer

V

AS

+

–

SHDN

+

V

TC648

SHDN

NC

GND

DS21448C-page 2

2002 Microchip Technology Inc.

TC648

*Stresses above those listed under "Absolute Maximum Rat-

ings" may cause permanent damage to the device. These are

stress ratings only and functional operation of the device at

these or any other conditions above those indicated in the

operation sections of the specifications is not implied. Expo-

sure to absolute maximum rating conditions for extended peri-

ods may affect device reliability.

1.0

ELECTRICAL

CHARACTERISTICS

Absolute Maximum Ratings*

Supply Voltage ......................................................... 6V

Input Voltage, Any Pin... (GND – 0.3V) to (V + 0.3V)

DD

Package Thermal Resistance:

PDIP (R ).............................................125°C/W

θJA

SOIC (R ) ............................................155°C/W

θJA

MSOP (R ) ..........................................200°C/W

θJA

Specified Temperature Range ........... -40°C to +125°C

Storage Temperature Range.............. -65°C to +150°C

DC ELECTRICAL SPECIFICATIONS

Electrical Characteristics: Unless otherwise specified, T_MIN≤ T_A≤ T_MAX, V_DD= 3.0V to 5.5V

Symbol

V_DD

I_DD

Parameter

Supply Voltage

Supply Current, Operating

Min

Typ

Max

Units

Test Conditions

3.0

—

0.5

5.5

1.0

V

mA Pins 6, 7 Open,

C_F= 1 µF, V_IN= V_C(MAX)

I_DD(SHDN)

Supply Current, Shutdown/

Auto-shutdown Mode

—

25

—

µA Pins 6, 7 Open;

Note 1

C_F=1 µF, V_IN= 0.35V

µA Note 1

I_IN

V_IN, V_ASInput Leakage

-1.0

+1.0

V_OUTOutput

t_R

t_F

I_OL

I_OH

V_OUTRise Time

V_OUTFall Time

Sink Current at V_OUTOutput

Source Current at V_OUT

Output

—

1.0

5.0

—

50

—

µsec I_OH= 5 mA, Note 1

µsec I_OL= 1 mA, Note 1

mA V_OL= 10% of V_DD

mA V_OH= 80% of V_DD

SENSE Input

V_TH(SENSE)

SENSE Input Threshold

50

—

70

90

mV Note 1

Voltage with Respect to GND

OTF Output

V_OL

Output Low Voltage

—

0.3

2.8

V

I_OL= 2.5 mA

V_IN, V_ASInputs

V_C(MAX),V_OTFVoltage at V_INfor 100% Duty

Cycle and Overtemp. Fault

V_C(SPAN)

V_AS

2.5

1.3

V_{C(MAX) ~}

V_C(SPAN)

2.65

V_C(MAX)- V_C(MIN)

Auto-shutdown Threshold

1.4

—

1.5

V_C(MAX)

V

V_SHDN

V_REL

Voltage Applied to V_INto

Ensure Reset/Shutdown

Voltage Applied to V_INto

Release Reset Mode

—

V_DDx 0.13

—

V

V_DDx 0.19

V

V_DD= 5V

V_HYST

V_HAS

Hysteresis on V_SHDN,V_REL

Hysteresis on Auto-shutdown

Comparator

—

0.01 x V_DD

70

—

V

mV

Note 1: Ensured by design, not tested.

2002 Microchip Technology Inc.

DS21448C-page 3

TC648

DC ELECTRICAL SPECIFICATIONS (CONTINUED)

Electrical Characteristics: Unless otherwise specified, T_MIN≤ T_A≤ T_MAX, V_DD= 3.0V to 5.5V

Symbol

Parameter

Min

Typ

Max

Units

Test Conditions

Pulse Width Modulator

F_OSC

t_STARTUP

PWM Frequency

Start-up Timer

26

—

30

32/F

34

—

Hz C_F= 1.0 µF

Sec C_F= 1.0 µF

Note 1: Ensured by design, not tested.

DS21448C-page 4

2002 Microchip Technology Inc.

TC648

2.3

Analog Input (V

)

2.0

PIN DESCRIPTIONS

AS

An external resistor divider connected to the V input

The descriptions of the pins are listed in Table 2-1.

AS

sets the auto-shutdown threshold. Auto-shutdown

occurs when V ≤ V . During shutdown, supply

IN

AS

TABLE 2-1:

Pin No. Symbol

PIN FUNCTION TABLE

Description

V Analog Input

IN

current falls to 25 µA (typical). The fan is automatically

restarted when V ≥ (V +V ) (see Section 5.0,

IN

AS

HAS

“Typical Applications” for more details).

1

2

3

4

5

6

7

8

C

Analog Output

Analog Input

F

2.4

Ground (GND)

V

AS

GND denotes the ground Terminal.

GND Ground Terminal

NC

No Internal Connection

2.5

No Connect

OTF

Digital (Open Collector) Output

Digital Output

No internal connection.

V

OUT

V

Power Supply Input

2.6

Digital Output (OTF)

DD

OTF goes low to indicate an over-temperature

2.1

Analog Input (V )

IN

condition. This occurs when the voltage at V > V

IN

OTF

The thermistor network (or other temperature sensor)

(see Section 1.0, "Electrical Characteristics"). An over-

temperature indication is a non-latching condition.

connects to the V input. A voltage range of 1.25V to

IN

2.65V (typical) on this pin drives an active duty cycle of

2.7

Digital Output (V

)

0% to 100% on the V

pin (see Section 5.0, “Typical

OUT

is an active high complimentary output that drives

Applications”, for more details).

V

OUT

the base of an external NPN transistor (via an appropri-

ate base resistor) or the gate of an N-channel MOS-

FET. This output has asymmetrical drive (see

Section 1.0, “Electrical Characteristics”).

2.2

Analog Output (C )

F

C is the positive terminal for the PWM ramp generator

F

timing capacitor. The recommended C is 1 µF for

F

30 Hz PWM operation.

2.8

Power Supply Input (V

)

DD

may be independent of the fan’s power supply

V

DD

(see Section 1.0, “Electrical Characteristics”).

2002 Microchip Technology Inc.

DS21448C-page 5

TC648

3.5

Auto-Shutdown Mode

3.0

DETAILED DESCRIPTION

If the voltage on V becomes less than the voltage on

IN

3.1

PWM

V

, the fan is automatically shut off (auto-shutdown

AS

mode). The TC648 exits auto-shutdown mode when

The PWM circuit consists of a ramp generator and

threshold detector. The frequency of the PWM is

determined by the value of the capacitor connected to

the voltage on V becomes higher than the voltage on

IN

V

by V

(the auto-shutdown hysteresis voltage

AS

HAS

(see Figure 3-1)). The Start-up Timer is triggered and

normal operation is resumed upon exiting auto-shut-

the C pin. A frequency of 30 Hz is recommended for

F

most applications (C = 1 µF). The PWM is also the

F

down mode. The V input should be grounded if auto-

time base for the Start-up Timer (see Section 3.3,

“Start-up Timer”). The PWM voltage control range is

1.25V to 2.65V (typical) for 0% to 100% output duty

cycle.

AS

shutdown mode is not used.

3.6

Shutdown Mode (Reset)

If an unconditional shutdown and/or device reset is

3.2

The V

V_OUTOutput

desired, the TC648 may be placed in shutdown mode

by forcing V to a logic low (i.e., V < V ) (see

SHDN

pin is designed to drive a low cost transistor

IN

OUT

Figure 3-1). In this mode, all functions cease and the

OTF output is unconditionally inactive. The TC648

should not be shut down unless all heat producing

activity in the system is at a negligible level. The TC648

or MOSFET as the low side power switching element in

the system. Various examples of driver circuits will be

shown throughout this data sheet. This output has

asymmetric complementary drive and is optimized for

driving NPN transistors or N-channel MOSFETs. Since

the system relies on PWM rather than linear control,

the power dissipation in the power switch is kept to a

minimum. Generally, very small devices (TO-92 or SOT

packages) will suffice.

exits shutdown mode when V becomes greater than

IN

V

, the release voltage.

REL

Entering shutdown mode also performs a complete

device reset. Shutdown mode resets the TC648 into its

power-up state. OTF is unconditionally inactive in shut-

down mode. Upon exiting shutdown mode (V

>

IN

3.3

Start-Up Timer

V

), the Start-up Timer will be triggered and normal

REL

operation will resume, assuming V > V

+ V

HAS

IN

AS

To ensure reliable fan start-up, the Start-up Timer turns

the V

output on for 32 cycles of the PWM whenever

OUT

Note: If V < V when the device exits shutdown

IN

AS

the fan is started from the off state. This occurs at

power-up and when coming out of shutdown or auto-

shutdown mode. If the PWM frequency is 30 Hz

mode, the fan will not restart as it will be in auto-shut-

down mode.

If V is not greater than (V + V ) upon exiting

(C = 1 µF), the resulting start-up time will be

IN

AS

HAS

F

shutdown mode, the fan will not be restarted. To ensure

that a complete reset takes place, the user’s circuitry

approximately one second.

must ensure that V > (V + V ) when the device

HAS

3.4

Over-Temperature Fault (OTF)

Output

IN

AS

is released from shutdown mode. A recommended

algorithm for management of the TC648 by a host

microcontroller or other external circuitry is given in

Section 5.0, “Typical Applications”. A small amount of

OTF is asserted when the PWM control voltage applied

to V becomes greater than that needed to drive 100%

IN

duty cycle (see Section 1.0, “Electrical Characteris-

tics”). This indicates that the fan is at maximum drive,

and the potential exists for system overheating. Either

heat dissipation in the system has gone beyond the

cooling system’s design limits, or some subtle fault

exists (such as fan bearing failure or an airflow obstruc-

tion). This output may be treated as a “System Over-

heat” warning and used to trigger system shutdown or

some other corrective action. OTF will become inactive

hysteresis, typically one percent of V

(50 mV at

DD

V

= 5.0V), is designed into the V

/V

thresh-

DD

SHDN REL

SHDN

old. The levels specified for V

and V

in

REL

Section 1.0, “Electrical Characteristics”, include this

hysteresis plus adequate margin to account for normal

variations in the absolute value of the threshold and

hysteresis.

CAUTION: Shutdown mode is unconditional. That is,

when V < V

.

OTF

the fan will remain off as long as the V pin is being

IN

held low or V < V + V .

HAS

IN

AS

DS21448C-page 6

2002 Microchip Technology Inc.

TC648

TC646

Status

Normal

Operation

Auto-Shutdown

Mode

Normal

Operation

Shut-

Down

Normal

Operation

HI

2.6V

V

+ V

AS

HAS

V

AS

TEMP.

1.2V

t

RESET

V

IN

V

REL

V

SHDN

LO

GND

Time

FIGURE 3-1:

TC648 Nominal Operation.

4.2

Normal Operation

4.0

SYSTEM BEHAVIOR

Normal Operation is an endless loop which may only

be exited by entering shutdown or auto-shutdown

mode. The loop can be thought of as executing at the

frequency of the oscillator and PWM.

The flowcharts describing the TC648’s behavioral

algorithms are shown in Figure 4-1. They can be

summarized as follows:

4.1

Power-Up

(1) Drive V

to a duty cycle proportional to V on a

IN

OUT

cycle by cycle basis.

(1) Assuming the device is not being held in shut-

down or auto-shutdown mode (V > V )..........

(2) If an over-temperature fault occurs, (V > V

),

OTF

IN

AS

IN

activate OTF; release OTF when V < V

.

OTF

(2) Turn V

output on for 32 cycles of the PWM

IN

OUT

clock. This ensures that the fan will start from a

(3) Is the TC648 in shutdown or auto-shutdown

mode?

dead stop.

(3) Branch to Normal Operation.

(4) End.

If so.....

a. V

duty cycle goes to zero.

OUT

b. OTF is disabled.

c. Exit the loop and wait for V > (V + V

),

IN

AS

HAS

then execute Power-up sequence.

(4) End.

2002 Microchip Technology Inc.

DS21448C-page 7

TC648

Normal

Operation

Power-Up

Power-on

Reset

OTF = 1

V

Duty

OUT

Cycle Prop.

to V

IN

Yes

≈ 0V

Minimum

Speed Mode

V

AS

Yes

V

> V

OTF

?

IN

No

OTF = 0

Auto-

Shutdown

= 0

Yes

OTF = 1

V

< V ?

AS

IN

V

OUT

No

V

AS

>

HAS

IN

+ V

Yes

(V

)

V

< V

AS

?

IN

YES

No

Auto-

Fire Start-up

Timer

Shutdown

V

= 0

OUT

Normal

Operation

Minimum

Speed Mode

Yes

V

= 0

V

≈ 0V ?

OUT

IN

No

V

= 0

No

OUT

V

> 1.25V ?

Yes

IN

V

> 1.25V

Yes

IN

Power-Up

V

Duty Cycle Proportional to V

IN

OUT

Yes

V

> V

?

IN

OTF

No

OTF = 0

OTF = 1

FIGURE 4-1:

TC648 Behavioral Algorithm Flowcharts.

DS21448C-page 8

2002 Microchip Technology Inc.

TC648

analysis. At the very least, anyone contemplating a

design using the TC648 should consult the documen-

tation for both the TC642EV (DS21403) and

TC642DEMO (DS21401). Figure 5-1 shows the base

schematic for the TC642DEMO.

An Excel-based spreadsheet is also available for

designing the thermistor network for the TC64X fan

controllers. This file (TC64X Therm) is available for

downloading from the Microchip website at

www.microchip.com.

5.0

TYPICAL APPLICATIONS

Designing with the TC648 involves the following:

(1) The temperature sensor network must be

configured to deliver 1.25V to 2.65V on V for 0%

IN

to 100% of the temperature range to be regulated.

(2) The auto-shutdown temperature must be set with

a voltage divider on V (if used).

AS

(3) The output drive transistor and base resistor must

be selected.

(4) If reset/shutdown capability is desired, the drive

requirements of the external signal or circuit must

be considered.

The TC642 demonstration and prototyping board

(TC642DEMO) and the TC642 Evaluation Kit

(TC642EV) provide working examples of TC648 cir-

cuits and prototyping aids. The TC642DEMO is a

printed circuit board optimized for small size and ease

of inclusion into system prototypes. The TC642EV is a

larger board intended for benchtop development and

+5V*

C

1 µF

+12V

B

NTC

R

1

Fan

Q

Shutdown**

V

DD

IN

Over-

Temperature

Interrupt

C

B

0.01 µF

R

2

1

OTF

OUT

+5V

R

BASE

TC648

V

R

3

V

AS

C

B

0.01 µF

NC

C

F

R

4

C

F

1 µF

GND

NOTES:

*See cautions regarding latch-up considerations in Section 5.0, "Typical Applications".

**Optional. See Section 5.0, "Typical Applications", for details.

FIGURE 5-1:

Typical Application Circuit.

2002 Microchip Technology Inc.

DS21448C-page 9

TC648

EQUATION

5.1

Temperature Sensor Design

V

x R

2

The temperature signal connected to V must output a

DD

IN

= V(T )

1

voltage in the range of 1.25V to 2.65V (typical) for 0%

to 100% of the temperature range of interest. The

circuit in Figure 5-2 illustrates a convenient way to pro-

vide this signal using a temperature dependent voltage

divider circuit.

R

(T ) + R

1 2

TEMP

V

x R

2

DD

= V(T )

2

R

(T ) + R

2 2

TEMP

Where T and T are the chosen temperatures and

1

2

V

DD

R

is the parallel combination of the thermistor

TEMP

and R .

1

I

DIV

These two equations facilitate solving for the two

unknown variables, R and R . More information about

1

2

thermistors may be obtained from AN679, “Tempera-

ture Sensing Technologies”, and AN685, “Thermistors

in Single Supply Temperature Sensing Circuits”, which

can be downloaded from Microchip's web site at

www.microchip.com.

RT

R

= 100 kΩ

= 23.2 kΩ

1

2

NTC Thermistor

100 kΩ @25˚C

V

IN

5.2

Minimum Speed Mode

R

The TC648 is configured for minimum speed mode by

grounding V and designing the temperature sensor

AS

network such that V operates the fan at relatively con-

IN

stant, minimum speed when the thermistor is at

minimum temperature. Figure 5-3 shows operation in

minimum speed mode. The 0% and 100% fan speeds

FIGURE 5-2:

Temperature Sensing

Circuit.

correspond to V values of 1.25V and 2.65V, typical.

IN

RT is a conventional NTC thermistor and R and R

1

2

Minimum system temperature (T

) is defined as the

MIN

are standard resistors. The supply voltage (V ) is

DD

lowest measured temperature at which proportional fan

speed control is required by the system. The fan

operates at minimum speed for all temperatures below

divided between R and the parallel combination of

2

RT and R . For convenience, the parallel combination

1

of RT and R will be referred to as R . The resis-

TEMP

1

T

and at speeds proportional to the measured

MIN

tance of the thermistor at various temperatures is

obtained from the manufacturer’s specifications. Ther-

mistors are often referred to in terms of their resistance

at 25°C.

temperature between T

and T

.

MIN

MAX

Fan Speed

100%

Generally, the thermistor shown in Figure 5-2 is a non-

linear device with a negative temperature coefficient

(also called an NTC thermistor). In Figure 5-2, R is

1

used to linearize the thermistor temperature response

and R is used to produce a positive temperature

Minimum

Speed

2

coefficient at the V node. As an added benefit, this

IN

configuration produces an output voltage delta of 1.4V,

0%

which is well within the range of the V

C(SPAN)

specification of the TC648. A 100 kΩ NTC thermistor is

T

MAX

MIN

selected for this application in order to keep I

minimum.

to a

DIV

FIGURE 5-3:

Minimum Fan Speed Mode

For the voltage range at V to be equal to 1.25V to

Operation.

IN

2.65V, the temperature range of this configuration is

0°C to 50°C. If a different temperature range is required

Temperature sensor design consists of a two-point

calculation: one at T and one at T . At T , the

MIN

MAX

MIN

from this circuit, R should be chosen to equal the

1

ohmic value of the thermistor must be much higher

resistance value of the thermistor at the center of this

new temperature range. It is suggested that a maxi-

mum temperature range of 50°C be used with this cir-

cuit due to thermistor linearity limitations. With this

than that of R so that minimum speed is determined

1

primarily by the values of R and R . At T , the

1

2

MAX

ohmic value of the thermistor must result in a V of

IN

2.65V nominal. The design procedure consists of ini-

change, R is adjusted according to the following

2

tially choosing R to be 10 times smaller than the ther-

1

equations:

DS21448C-page 10

2002 Microchip Technology Inc.

TC648

mistor resistance at T . R is then calculated to

5.3

Auto-Shutdown Temperature

MIN

2

deliver the desired speed at T

. The values for R , R

1 2

MIN

MAX

Design

and RT are then checked at T

for 2.65V nominal.

1

A voltage divider on V sets the temperature at which

It may be necessary to adjust the values of R and R

AS

1

2

the part is automatically shut down if the sensed

after the initial calculation to obtain the desired results.

The design equations are:

temperature at V drops below the set temperature at

IN

V

(i.e. V < V ).

AS

IN

AS

EQUATION

As with the V input, 1.25V to 2.65V corresponds to

IN

the temperature range of interest from T to T ,

1

2

R = (0.1)(RT

)

1MIN

1

respectively. Assuming that the temperature sensor

network designed previously is linearly related to

Where: RT = Thermistor resistance at T

1

MIN

temperature, the shutdown temperature T is related

AS

to T and T by:

EQUATION

2

1

(RT

)(R )(V

)

MIN

1MIN

1

EQUATION

R

=

2

(RT

+ R )(V - V

)

1MIN

1

DD

MIN

V

- 1.25

2.65 - 1.25V

T - T

AS

=

Where V

= the value of V required for

IN

T

- T

2

1

MIN

AS

1

minimum fan speed. V = Power Supply Voltage

DD

1.4V

2

(T - T ) + 1.25

V

=

AS

1

)

(

AS

T - T

1

EQUATION

(RT

)(R )(V

)

MIN

1MIN

1

For example, if 1.25V and 2.65V at V corresponds to

IN

V

=

MAX

a temperature range of T = 0°C to T = 125°C, and the

R (R + RT

)(V

)

DD

1

2

1

1MAX

auto-shutdown temperature desired is 25°C, then the

Where RT

MAX

fan speed.

= thermistor resistance at T

= the value of V required for maximum

,

MAX

V

voltage is:

1MAX

AS

V

IN

EQUATION

1.4V

(125 - 0)

Because the thermistor characteristics are fixed, it may

not be possible, in certain applications, to obtain the

V

=

(25 - 0) + 1.25 = 1.53V

AS

desired values of V

and V

using the above

MAX

MIN

equations. In this case, the circuit in Figure 5-4 can be

The V voltage may be set using a simple resistor

divider, as shown in Figure 5-5.

AS

used. Diode D clamps V to the voltage required to

1

IN

sustain minimum speed. The calculations of R and

1

R

for the temperature sensor are identical to the

2

V

DD

equation on the previous page.

V

DD

R

1

I

IN

R

1

3

RT

1

I

V

AS

DIV

V

IN

D

1

R

2

R

4

2

GND

FIGURE 5-4:

Minimum Fan Speed Circuit.

FIGURE 5-5:

V

Circuit.

AS

2002 Microchip Technology Inc.

DS21448C-page 11

TC648

Per Section 1.0, “Electrical Characteristics”, the leak-

fans with nominal operating currents of no more than

200 mA, a single transistor usually suffices. Above

200 mA, the Darlington or MOSFET solution is

recommended. For the power dissipation to be kept

low, it is imperative that the pass transistor be fully sat-

urated when "on".

age current at the V pin is no more than 1 µA. It is

AS

conservative to design for a divider current, I , of

DIV

100 µA. If V = 5.0V then…

DD

EQUATION

Table 5-1 gives examples of some commonly available

transistors and MOSFETs. This table should be used

as a guide only since there are many transistors and

MOSFETs which will work just as well as those listed.

The critical issues when choosing a device to use as

5.0V

–4

I

= 1e A =

, therefore

DIV

R + R

1

2

5.0V

R + R =

= 50,000Ω = 50 kΩ

1

2

–4

1e A

Q1 are: (1) the breakdown voltage (V

or V

DS

(BR)CEO

(MOSFET)) must be large enough to withstand the

highest voltage applied to the fan (Note: This will occur

when the fan is off); (2) 5 mA of base drive current must

be enough to saturate the transistor when conducting

the full fan current (transistor must have sufficient

We can further specify R and R by the condition that

1

2

the divider voltage is equal to our desired V . This

AS

yields the following:

gain); (3) the V

voltage must be high enough to suf-

OUT

EQUATION

ficiently drive the gate of the MOSFET to minimize the

V

x R

R

of the device; (4) rated fan current draw must

DD

2

DS(on)

V

=

AS

be within the transistor's/MOSFET's current handling

capability; and (5) power dissipation must be kept

within the limits of the chosen device.

R + R

1

2

Solving for the relationship between R and R results

1

2

A base-current limiting resistor is required with bipolar

transistors. The correct value for this resistor can be

determined as follows:

in the following equation:

EQUATION

V

= V

= R

+ V

BE R

(SAT)

OH

R

V

- V

AS

BASE

FE

R x (5 - 1.53)

DD

2

R = R x

1

2

=

x I

1.53

BASE

V

BASE

AS

I

= I

/ h

FAN

BASE

For this example, R = (2.27) R . Substituting this rela-

1

2

V

is specified as 80% of V

in Section 1.0,

DD

OH

tionship back into the original equation yields the

resistor values:

“Electrical Characteristics”; V

is given in the

BE

(SAT)

chosen transistor data sheet. It is now possible to solve

for R

R = 15.3 kΩ, and R = 34.7 kΩ

.

2

1

BASE

In this case, the standard values of 34.8 kΩ and

15.4 kΩ are very close to the calculated values and

would be more than adequate.

EQUATION

V

- V

OH

I

BE(SAT)

R

=

BASE

5.4

Output Drive Transistor Selection

The TC648 is designed to drive an external transistor

Some applications benefit from the fan being powered

from a negative supply to keep motor noise out of the

positive supply rails. This can be accomplished by the

or MOSFET for modulating power to the fan. This is

shown as Q in Figures 5-1, 5-6, 5-7,and 5-8. The

1

V

pin has a minimum source current of 5 mA and a

OUT

method shown in Figure 5-7. Zener diode D offsets

1

minimum sink current of 1 mA. Bipolar transistors or

MOSFETs may be used as the power switching ele-

ment, as is shown in Figure 5-6. When high current

gain is needed to drive larger fans, two transistors may

be used in a Darlington configuration. These circuit

topologies are shown in Figure 5-6: (a) shows a single

NPN transistor used as the switching element; (b) illus-

trates the Darlington pair; and (c) shows an N-channel

MOSFET.

the -12V power supply voltage, holding transistor Q off

1

when V

is low. When V

is high, the voltage at

OUT

the anode of D increases by V , causing Q to turn

1

OH

1

on. Operation is otherwise the same as in the case of

fan operation from +12V.

One major advantage of the TC648’s PWM control

scheme versus linear speed control is that the power

dissipation in the pass element is kept very low.

Generally, low cost devices in very small packages,

such as TO-92 or SOT, can be used effectively. For

DS21448C-page 12

2002 Microchip Technology Inc.

TC648

V

DD

V

DD

Fan

R

BASE

V

OUT

Q

1

Q

1

V

OUT

Q

2

GND

b) Darlington Transistor Pair

a) Single Bipolar Transistor

C) N-Channel MOSFET

FIGURE 5-6:

Output Drive Transistor Circuit Topologies.

TABLE 5-1:

Device

TRANSISTORS AND MOSFETS FOR Q (V = 5V)

1

DD

Max. V

/V

V

/V

Fan Current

(mA)

Suggested

BE(sat) GS

CEO DS

Package

Min. H

FE

(V)

R

(Ω)

BASE

800

301

Note 1

MMBT2222A

MPS2222A

MPS6602

SI2302

MGSF1N02E

SI4410

SOT-23

TO-92

SOT-23

SO-8

1.2

2.5

4.5

50

NA

40

20

30

60

150

500

1000

500

SI2308

SOT-23

Note 1: A series gate resistor may be used in order to control the MOSFET turn-on and turn-off times.

2002 Microchip Technology Inc.

DS21448C-page 13

TC648

+5V

V

DD

R *

2

2.2 kΩ

V

OUT

D

12.0V

Zener

1

Fan

TC648

Q *

1

R *

4

GND

10 kΩ

-12V

NOTE: *Value depends on the specific application and is shown for example only.

FIGURE 5-7:

Powering the Fan from a -12V Supply.

5.5

Latch-up Considerations

Auto-Shutdown Mode Design Example

Step 1. Calculate R and R based on using an NTC

1

2

As with any CMOS IC, the potential exists for latch-up

if signals are applied to the device which are outside

the power supply range. This is of particular concern

during power-up if the external circuitry (such as the

having a resistance of 10 kΩ at T

(25°C)

MIN

and 4.65 kΩ at T

(45°C) (see Figure 5-8).

MAX

R = 20.5 kΩ

1

sensor network, V

divider or shutdown circuit) are

R = 3.83 kΩ

AS

2

powered by a supply different from that of the TC648.

Care should be taken to ensure that the TC648’s V

Step 2. Set auto-shutdown level.

= 1.8V

DD

V

AS

supply powers up first. If possible, the networks

attached to V and V should connect to the V sup-

Limit the divider current to 100 µA

IN

AS

DD

R = 33 kΩ

R = 18 kΩ

5

6

ply at the same physical location as the IC itself. Even

if the IC and any external networks are powered by the

same supply, physical separation of the connecting

points can result in enough parasitic capacitance and/

or inductance in the power supply connections to delay

one power supply “routing” versus another.

Step 3. Design the output circuit

Maximum fan motor current = 250 mA.

Q beta is chosen at 50 from which

1

R = 800 Ω.

7

5.6

Power Supply Routing and

Bypassing

5.7

Minimum Speed Mode Design

Example

Noise present on the V and V inputs may cause

IN

AS

Given:

erroneous operation of the OTF output. As a result,

these inputs should be bypassed with a 0.01 µF capac-

itor mounted as close to the package as possible. This

Minimum speed = 40%(1.8V)

T

= 30°C, T

= 95°C

MAX

MIN

Thermistor = 100 kΩ at 25°C

RT = 79.4 kΩ, RT = 6.5 kΩ

is especially true of V , which is usually driven from a

IN

MIN

MAX

high impedance source (such as a thermistor). Addi-

tionally, the V input should be bypassed with a 1 µF

Step 1: Calculate R :

DD

1

capacitor and grounds should be kept as short as pos-

sible. To keep fan noise off the TC648 ground pin, indi-

vidual ground returns for the TC648 and the low side of

the fan drive device should be used.

R

= 7.9 kΩ (Use closest standard value:

1

7.87 kΩ)

Calculate R2:

R

= 4.05 kΩ (Use closest standard value:

2

4.02 kΩ)

Step 2: Verify V

:

MAX

V

= 2.64V

MAX

DS21448C-page 14

2002 Microchip Technology Inc.

TC648

+5V

+12V

Fan

+5V

C

1 µF

B

NTC

10 kΩ

@ 25˚C

1

R

1

Open-Drain

Device

20.5 kΩ

4

8

RESET

Shutdown

V

DD

V

GND

IN

C

B

R

2

3.83 kΩ

6

0.01 µF

Thermal

Fault

Q

1

OTF

(Optional)

R

7

+5V

800Ω

TC648

7

5

V

R

5

OUT

NC

33 kΩ

3

V

AS

C

B

0.01 µF

2

R

C

F

6

18 kΩ

C

B

1 µF

FIGURE 5-8:

Design Example.

5.8

TC648 as a Microcontroller

Peripheral

In a system containing a microcontroller or other host

intelligence, the TC648 can be effectively managed as

a CPU peripheral. Routine fan control functions can be

performed by the TC648 without processor interven-

tion. The microcontroller receives temperature data

from one or more points throughout the system. It

calculates a fan operating speed based on an algorithm

specifically designed for the application at hand. The

processor controls fan speed using complementary

port bits I/O1 through I/O3.

Resistors R through R (5% tolerance) form a crude

1

6

3-bit DAC that translates the 3-bit code from the

processor's outputs into a 1.6V DC control signal. A

monolithic DAC or digital pot may be used instead of

the circuit shown in Figure 5-9.

With V set at 1.8V, the TC648 enters auto-shutdown

AS

when the processor's output code is 000[B]. Output

codes 001[B] to 111[B] operate the fan from roughly

40% to 100% of full speed. An open-drain output from

the processor (I/O0) can be used to reset the TC648

following detection of a fault condition. The OTF output

can be connected to the processor's interrupt input, or

to another I/O pin, for polled operation.

2002 Microchip Technology Inc.

DS21448C-page 15

TC648

+12V

Fan

+5V

(RESET)

(Optional)

Open-Drain

Outputs

I/O0

+5V

R

1

110 kΩ

1

2

8

(MSB)

V

C

V

I/O1

I/O2

I/O3

IN

DD

C

+

B

C

R

2

B

Analog or Digital

Temperature

Data from one or

more Sensors

1 µF

240 kΩ

R

.01 µF

CMOS

Outputs

9

800Ω

7

R

3

F

V

OUT

2N2222A

+

360 kΩ

+5V

TC648

1 µF

R

7

33 kΩ

(LSB)

R

10

10 kΩ

R

18 k

CMOS

Microcontroller

4

3

6

5

R

5

V

AS

Ω

+5V

OTF

NC

C

B

1.5 kΩ

R

18 kΩ

8

+5V

.01 µF

4

R

6

GND

1 kΩ

GND

INT

FIGURE 5-9:

TC648 as a Microcontroller Peripheral.

DS21448C-page 16

2002 Microchip Technology Inc.

TC648

6.0

6.1

PACKAGING INFORMATION

Package Marking Information

8-Lead PDIP (300 mil)

Example:

XXXXXXXX

NNN

TC648VPA

025

YYWW

0215

8-Lead SOIC (150 mil)

Example:

XXXXXXXX

YYWW

TC648VOA

0215

NNN

025

Example:

8-Lead MSOP

TC648E

XXXXXX

YWWNNN

215025

Legend: XX...X Customer specific information*

YY

WW

NNN

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

Alphanumeric traceability code

Note:

In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line thus limiting the number of available characters

for customer specific information.

*

Standard marking consists of Microchip part number, year code, week code, traceability code (facility

code, mask rev#, and assembly code). For marking beyond this, certain price adders apply. Please check

with your Microchip Sales Office.

2002 Microchip Technology Inc.

DS21448C-page 17

TC648

8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)

E1

D

2

n

1

α

E

A2

A

L

c

A1

β

B1

B

p

eB

Units

Dimension Limits

INCHES*

NOM

MILLIMETERS

MIN

MAX

MIN

NOM

8

MAX

n

p

A

A2

A1

E

E1

D

L

c

B1

B

Number of Pins

Pitch

Top to Seating Plane

Molded Package Thickness

Base to Seating Plane

Shoulder to Shoulder Width

Molded Package Width

Overall Length

Tip to Seating Plane

Lead Thickness

Upper Lead Width

Lower Lead Width

Overall Row Spacing

Mold Draft Angle Top

Mold Draft Angle Bottom

8

.100

.155

.130

2.54

3.94

3.30

.140

.170

.145

3.56

2.92

4.32

3.68

.115

.015

.300

.240

.360

.125

.008

.045

.014

.310

5

0.38

7.62

6.10

9.14

3.18

0.20

1.14

0.36

7.87

5

.313

.250

.373

.130

.012

.058

.018

.370

10

.325

.260

.385

.135

.015

.070

.022

.430

15

7.94

6.35

9.46

3.30

0.29

1.46

0.46

9.40

10

8.26

6.60

9.78

3.43

0.38

1.78

0.56

10.92

15

§

eB

α

β

5

10

15

5

10

15

* Controlling Parameter

§ Significant Characteristic

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MS-001

Drawing No. C04-018

DS21448C-page 18

2002 Microchip Technology Inc.

TC648

8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)

E

E1

p

D

2

B

n

1

h

α

45×

c

A2

A

f

β

L

A1

Units

INCHES*

NOM

MILLIMETERS

Dimension Limits

MIN

MAX

MIN

NOM

8

MAX

n

p

A

A2

A1

E

E1

D

h

L

f

Number of Pins

Pitch

Overall Height

8

.050

.061

.056

.007

.237

.154

.193

.015

.025

4

1.27

.053

.069

1.35

1.32

1.55

1.42

0.18

6.02

3.91

4.90

0.38

0.62

4

1.75

1.55

0.25

6.20

3.99

5.00

0.51

0.76

8

Molded Package Thickness

Standoff

.052

.004

.228

.146

.189

.010

.019

0

.061

.010

.244

.157

.197

.020

.030

8

§

0.10

5.79

3.71

4.80

0.25

0.48

0

Overall Width

Molded Package Width

Overall Length

Chamfer Distance

Foot Length

Foot Angle

c

Lead Thickness

Lead Width

.008

.013

0

.009

.017

12

.010

.020

15

0.20

0.33

0

0.23

0.42

12

0.25

0.51

15

B

α

β

Mold Draft Angle Top

Mold Draft Angle Bottom

0

12

15

0

12

15

* Controlling Parameter

§ Significant Characteristic

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MS-012

Drawing No. C04-057

2002 Microchip Technology Inc.

DS21448C-page 19

TC648

8-Lead Plastic Micro Small Outline Package (MS) (MSOP)

E

p

E1

D

2

B

n

1

α

A2

A

c

φ

A1

(F)

L

β

Units

Dimension Limits

INCHES

NOM

MILLIMETERS*

NOM

MIN

MAX

MIN

MAX

n

p

Number of Pins

Pitch

8

.026

0.65

Overall Height

Molded Package Thickness

A

A2

A1

E

E1

D

.044

1.18

.030

.034

.038

.006

.200

.122

.028

.039

0.76

0.05

0.86

0.97

0.15

.5.08

3.10

0.70

1.00

Standoff

§

.002

.184

.114

.016

.035

Overall Width

Molded Package Width

Overall Length

Foot Length

Footprint (Reference)

Foot Angle

.193

.118

.022

.037

4.90

3.00

0.55

0.95

4.67

2.90

0.40

0.90

L

F

φ

0

6

0

6

c

Lead Thickness

Lead Width

Mold Draft Angle Top

Mold Draft Angle Bottom

.004

.010

.006

.012

.008

.016

0.10

0.25

0.15

0.30

0.20

0.40

B

α

β

7

*Controlling Parameter

§ Significant Characteristic

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not

exceed. 010" (0.254mm) per side.

Drawing No. C04-111

DS21448C-page 20

2002 Microchip Technology Inc.

TC648

6.2

Taping Form

Component Taping Orientation for 8-Pin SOIC (Narrow) Devices

User Direction of Feed

PIN 1

W

P

Standard Reel Component Orientation

for 713 Suffix Device

Carrier Tape, Number of Components Per Reel and Reel Size

Package

Carrier Width (W)

Pitch (P)

Part Per Full Reel

Reel Size

8-Pin SOIC (N)

12 mm

8 mm

2500

13 in

Component Taping Orientation for 8-Pin MSOP Devices

User Direction of Feed

PIN 1

W

P

Standard Reel Component Orientation

for 713 Suffix Device

Carrier Tape, Number of Components Per Reel and Reel Size

Package

Carrier Width (W)

Pitch (P)

Part Per Full Reel

Reel Size

8-Pin MSOP

12 mm

8 mm

2500

13 in

2002 Microchip Technology Inc.

DS21448C-page 21

TC648

NOTES:

DS21448C-page 22

2002 Microchip Technology Inc.

TC648

ON-LINE SUPPORT

Microchip provides on-line support on the Microchip

World Wide Web site.

SYSTEMS INFORMATION AND

UPGRADE HOT LINE

The Systems Information and Upgrade Line provides

system users a listing of the latest versions of all of

Microchip's development systems software products.

Plus, this line provides information on how customers

can receive the most current upgrade kits.The Hot Line

Numbers are:

1-800-755-2345 for U.S. and most of Canada, and

1-480-792-7302 for the rest of the world.

The web site is used by Microchip as a means to make

files and information easily available to customers. To

view the site, the user must have access to the Internet

®

and a web browser, such as Netscape or Microsoft

Internet Explorer. Files are also available for FTP

download from our FTP site.

ConnectingtotheMicrochipInternetWebSite

The Microchip web site is available at the following

URL:

092002

www.microchip.com

The file transfer site is available by using an FTP ser-

vice to connect to:

ftp://ftp.microchip.com

The web site and file transfer site provide a variety of

services. Users may download files for the latest

Development Tools, Data Sheets, Application Notes,

User's Guides, Articles and Sample Programs. A vari-

ety of Microchip specific business information is also

available, including listings of Microchip sales offices,

distributors and factory representatives. Other data

available for consideration is:

• Latest Microchip Press Releases

• Technical Support Section with Frequently Asked

Questions

• Design Tips

• Device Errata

• Job Postings

• Microchip Consultant Program Member Listing

• Links to other useful web sites related to

Microchip Products

• Conferences for products, Development Systems,

technical information and more

• Listing of seminars and events

2002 Microchip Technology Inc.

DS21448C-page23

TC648

READER RESPONSE

It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-

uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation

can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.

Please list the following information, and use this outline to provide us with your comments about this document.

To:

Technical Publications Manager

Reader Response

Total Pages Sent ________

RE:

From:

Name

Company

Address

City / State / ZIP / Country

Telephone: (_______) _________ - _________

FAX: (______) _________ - _________

Application (optional):

Would you like a reply?

Y

N

Literature Number:

DS21448C

Device:

TC648

Questions:

1. What are the best features of this document?

2. How does this document meet your hardware and software development needs?

3. Do you find the organization of this document easy to follow? If not, why?

4. What additions to the document do you think would enhance the structure and subject?

5. What deletions from the document could be made without affecting the overall usefulness?

6. Is there any incorrect or misleading information (what and where)?

7. How would you improve this document?

DS21448C-page24

2002 Microchip Technology Inc.

TC648

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

PART NO.

Device

X

/XX

Examples:

Temperature Package

Range

a)

b)

c)

d)

TC648VOA:

PWM Fan Speed Controller

w/Auto Shutdown and Over-Temperature Alert,

SOIC package.

TC648VUA:

w/Auto Shutdown and Over-Temperature Alert,

MSOP package.

TC648VPA:

w/Auto Shutdown and Over-Temperature Alert,

PDIP package.

TC648EOA713: PWM Fan Speed Controller

w/Auto Shutdown and Over-Temperature Alert,

SOIC package, Tape and Reel.

PWM Fan Speed Controller

Device:

TC648:

PWM Fan Speed Controller w/Auto Shutdown

and Overtemperature Alert

PWM Fan Speed Controller

Temperature Range:

Package:

V

E

=

0°C to +85°C

= -40°C to +85°C

PA

OA

UA

=

Plastic DIP (300 mil Body), 8-lead

Plastic SOIC, (150 mil Body), 8-lead

Plastic Micro Small Outline (MSOP), 8-lead

* PDIP package is only offered in the V temp range

Sales and Support

Data Sheets

Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-

mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:

1. Your local Microchip sales office

2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277

3. The Microchip Worldwide Site (www.microchip.com)

Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.

New Customer Notification System

Register on our web site (www.microchip.com/cn) to receive the most current information on our products.

2002 Microchip Technology Inc.

DS21448C-page25

TC648

NOTES:

DS21448C-page 26

2002 Microchip Technology Inc.

Information contained in this publication regarding device

applications and the like is intended through suggestion only

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

No representation or warranty is given and no liability is

assumed by Microchip Technology Incorporated with respect

to the accuracy or use of such information, or infringement of

patents or other intellectual property rights arising from such

use or otherwise. Use of Microchip’s products as critical com-

ponents in life support systems is not authorized except with

express written approval by Microchip. No licenses are con-

veyed, implicitly or otherwise, under any intellectual property

rights.

Trademarks

The Microchip name and logo, the Microchip logo, KEELOQ,

MPLAB, PIC, PICmicro, PICSTART and PRO MATE are

registered trademarks of Microchip Technology Incorporated

in the U.S.A. and other countries.

FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL

and The Embedded Control Solutions Company are

registered trademarks of Microchip Technology Incorporated

in the U.S.A.

dsPIC, dsPICDEM.net, ECONOMONITOR, FanSense,

FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP,

ICEPIC, microPort, Migratable Memory, MPASM, MPLIB,

MPLINK, MPSIM, PICC, PICDEM, PICDEM.net, rfPIC, Select

Mode and Total Endurance are trademarks of Microchip

Technology Incorporated in the U.S.A. and other countries.

Serialized Quick Turn Programming (SQTP) is a service mark

of Microchip Technology Incorporated in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

Microchip received QS-9000 quality system

certification for its worldwide headquarters,

design and wafer fabrication facilities in

Chandler and Tempe, Arizona in July 1999

and Mountain View, California in March 2002.

The Company’s quality system processes and

procedures are QS-9000 compliant for its

®

PICmicro 8-bit MCUs, KEELOQ^®code hopping

devices, Serial EEPROMs, microperipherals,

non-volatile memory and analog products. In

addition, Microchip’s quality system for the

design and manufacture of development

systems is ISO 9001 certified.

2002 Microchip Technology Inc.

DS21448C - page 27

M

WORLDWIDE SALES AND SERVICE

Japan

AMERICAS

ASIA/PACIFIC

Microchip Technology Japan K.K.

Benex S-1 6F

Corporate Office

Australia

2355 West Chandler Blvd.

Microchip Technology Australia Pty Ltd

Suite 22, 41 Rawson Street

Epping 2121, NSW

3-18-20, Shinyokohama

Kohoku-Ku, Yokohama-shi

Kanagawa, 222-0033, Japan

Tel: 81-45-471- 6166 Fax: 81-45-471-6122

Chandler, AZ 85224-6199

Tel: 480-792-7200 Fax: 480-792-7277

Technical Support: 480-792-7627

Web Address: http://www.microchip.com

Australia

Tel: 61-2-9868-6733 Fax: 61-2-9868-6755

Korea

Rocky Mountain

China - Beijing

Microchip Technology Korea

168-1, Youngbo Bldg. 3 Floor

Samsung-Dong, Kangnam-Ku

Seoul, Korea 135-882

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7966 Fax: 480-792-4338

Microchip Technology Consulting (Shanghai)

Co., Ltd., Beijing Liaison Office

Unit 915

Bei Hai Wan Tai Bldg.

Tel: 82-2-554-7200 Fax: 82-2-558-5934

Atlanta

No. 6 Chaoyangmen Beidajie

Beijing, 100027, No. China

Tel: 86-10-85282100 Fax: 86-10-85282104

500 Sugar Mill Road, Suite 200B

Atlanta, GA 30350

Singapore

Microchip Technology Singapore Pte Ltd.

200 Middle Road

Tel: 770-640-0034 Fax: 770-640-0307

China - Chengdu

#07-02 Prime Centre

Boston

Microchip Technology Consulting (Shanghai)

Co., Ltd., Chengdu Liaison Office

Rm. 2401, 24th Floor,

Singapore, 188980

2 Lan Drive, Suite 120

Westford, MA 01886

Tel: 978-692-3848 Fax: 978-692-3821

Tel: 65-6334-8870 Fax: 65-6334-8850

Taiwan

Ming Xing Financial Tower

Microchip Technology (Barbados) Inc.,

Taiwan Branch

Chicago

No. 88 TIDU Street

333 Pierce Road, Suite 180

Itasca, IL 60143

Chengdu 610016, China

11F-3, No. 207

Tel: 86-28-86766200 Fax: 86-28-86766599

Tung Hua North Road

Taipei, 105, Taiwan

Tel: 630-285-0071 Fax: 630-285-0075

China - Fuzhou

Dallas

Microchip Technology Consulting (Shanghai)

Co., Ltd., Fuzhou Liaison Office

Unit 28F, World Trade Plaza

Tel: 886-2-2717-7175 Fax: 886-2-2545-0139

4570 Westgrove Drive, Suite 160

Addison, TX 75001

Tel: 972-818-7423 Fax: 972-818-2924

No. 71 Wusi Road

EUROPE

Austria

Detroit

Fuzhou 350001, China

Tri-Atria Office Building

Tel: 86-591-7503506 Fax: 86-591-7503521

Microchip Technology Austria GmbH

Durisolstrasse 2

32255 Northwestern Highway, Suite 190

Farmington Hills, MI 48334

Tel: 248-538-2250 Fax: 248-538-2260

China - Shanghai

Microchip Technology Consulting (Shanghai)

Co., Ltd.

A-4600 Wels

Austria

Kokomo

Room 701, Bldg. B

Tel: 43-7242-2244-399

Fax: 43-7242-2244-393

Denmark

2767 S. Albright Road

Kokomo, Indiana 46902

Tel: 765-864-8360 Fax: 765-864-8387

Los Angeles

Far East International Plaza

No. 317 Xian Xia Road

Shanghai, 200051

Microchip Technology Nordic ApS

Regus Business Centre

Lautrup hoj 1-3

Tel: 86-21-6275-5700 Fax: 86-21-6275-5060

18201 Von Karman, Suite 1090

Irvine, CA 92612

China - Shenzhen

Microchip Technology Consulting (Shanghai)

Co., Ltd., Shenzhen Liaison Office

Rm. 1315, 13/F, Shenzhen Kerry Centre,

Renminnan Lu

Ballerup DK-2750 Denmark

Tel: 949-263-1888 Fax: 949-263-1338

Tel: 45 4420 9895 Fax: 45 4420 9910

New York

France

150 Motor Parkway, Suite 202

Hauppauge, NY 11788

Microchip Technology SARL

Parc d’Activite du Moulin de Massy

43 Rue du Saule Trapu

Shenzhen 518001, China

Tel: 631-273-5305 Fax: 631-273-5335

Tel: 86-755-2350361 Fax: 86-755-2366086

San Jose

China - Hong Kong SAR

Batiment A - ler Etage

Microchip Technology Inc.

2107 North First Street, Suite 590

San Jose, CA 95131

Microchip Technology Hongkong Ltd.

Unit 901-6, Tower 2, Metroplaza

223 Hing Fong Road

91300 Massy, France

Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79

Germany

Tel: 408-436-7950 Fax: 408-436-7955

Kwai Fong, N.T., Hong Kong

Microchip Technology GmbH

Steinheilstrasse 10

Tel: 852-2401-1200 Fax: 852-2401-3431

Toronto

6285 Northam Drive, Suite 108

Mississauga, Ontario L4V 1X5, Canada

Tel: 905-673-0699 Fax: 905-673-6509

India

D-85737 Ismaning, Germany

Tel: 49-89-627-144 0 Fax: 49-89-627-144-44

Microchip Technology Inc.

India Liaison Office

Italy

Divyasree Chambers

Microchip Technology SRL

Centro Direzionale Colleoni

Palazzo Taurus 1 V. Le Colleoni 1

20041 Agrate Brianza

1 Floor, Wing A (A3/A4)

No. 11, O’Shaugnessey Road

Bangalore, 560 025, India

Tel: 91-80-2290061 Fax: 91-80-2290062

Milan, Italy

Tel: 39-039-65791-1 Fax: 39-039-6899883

United Kingdom

Microchip Ltd.

505 Eskdale Road

Winnersh Triangle

Wokingham

Berkshire, England RG41 5TU

Tel: 44 118 921 5869 Fax: 44-118 921-5820

08/01/02

DS21448C-page 28

2002 Microchip Technology Inc.

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Active	零件包装代码：	MSOP
包装说明：	TSSOP, TSSOP8,.19	针数：	8
Reach Compliance Code：	compliant	ECCN代码：	EAR99
HTS代码：	8542.39.00.01	Factory Lead Time：	16 weeks
风险等级：	1.29	模拟集成电路 - 其他类型：	BRUSHLESS DC MOTOR CONTROLLER
JESD-30 代码：	S-PDSO-G8	JESD-609代码：	e3
长度：	3 mm	湿度敏感等级：	1
功能数量：	1	端子数量：	8
最高工作温度：	85 °C	最低工作温度：	-40 °C
封装主体材料：	PLASTIC/EPOXY	封装代码：	TSSOP
封装等效代码：	TSSOP8,.19	封装形状：	SQUARE
封装形式：	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	峰值回流温度（摄氏度）：	260
电源：	3.3/5 V	认证状态：	Not Qualified
座面最大高度：	1.1 mm	子类别：	Motion Control Electronics
最大供电电流 (Isup)：	0.4 mA	最大供电电压 (Vsup)：	5.5 V
最小供电电压 (Vsup)：	3 V	标称供电电压 (Vsup)：	5 V
表面贴装：	YES	温度等级：	INDUSTRIAL
端子面层：	Matte Tin (Sn)	端子形式：	GULL WING
端子节距：	0.65 mm	端子位置：	DUAL
处于峰值回流温度下的最长时间：	40	宽度：	3 mm
Base Number Matches：	1

型号	制造商	描述	替代类型	文档
TC648BEUA713	MICROCHIP	PWM Fan Speed Controllers With Auto-Shutdown,	类似代替

型号	制造商	描述	价格	文档
TC648BEUA713	MICROCHIP	PWM Fan Speed Controllers With Auto-Shutdown, Fan Restart and FanSense⑩ Technology for Fault Detection	获取价格
TC648BEUATR	MICROCHIP	PWM Fan Speed Controllers With Auto-Shutdown, Fan Restart and FanSense⑩ Technology for Fault Detection	获取价格
TC648E	MICROCHIP	Fan Speed Controller with Auto-Shutdown and Over-Temperature Alert	获取价格
TC648EOA	MICROCHIP	Fan Speed Controller with Auto-Shutdown and Over-Temperature Alert	获取价格
TC648EOA713	MICROCHIP	BRUSHLESS DC MOTOR CONTROLLER, PDSO8, 0.150 INCH, PLASTIC, SOIC-8	获取价格
TC648EPA	MICROCHIP	Fan Speed Controller with Auto-Shutdown and Over-Temperature Alert	获取价格
TC648EUA	MICROCHIP	Fan Speed Controller with Auto-Shutdown and Over-Temperature Alert	获取价格
TC648EUA713	MICROCHIP	BRUSHLESS DC MOTOR CONTROLLER, PDSO8, PLASTIC, MSOP-8	获取价格
TC648VOA	MICROCHIP	Fan Speed Controller with Auto-Shutdown and Over-Temperature Alert	获取价格
TC648VOA713	MICROCHIP	BRUSHLESS DC MOTOR CONTROLLER, PDSO8, 0.150 INCH, PLASTIC, SOIC-8	获取价格

TC648BEUA

TC648BEUA 概述

TC648BEUA 规格参数

TC648BEUA 数据手册

TC648BEUA CAD模型

TC648BEUA 替代型号

TC648BEUA 相关器件

TC648BEUA 相关文章

热门型号