1N5802_07

更新时间:2024-11-30 08:47:02
品牌:MICROSEMI
描述:VOIDLESS-HERMETICALLY-SEALED ULTRAFAST RECOVERY GLASS RECTIFIERS

1N5802_07 概述

VOIDLESS-HERMETICALLY-SEALED ULTRAFAST RECOVERY GLASS RECTIFIERS 无空隙,密封的超快恢复整流二极管玻璃

1N5802_07 数据手册

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1N5802 thru 1N5806  
VOIDLESS-HERMETICALLY-SEALED  
ULTRAFAST RECOVERY GLASS  
RECTIFIERS  
S C O T T S D A L E D I V I S I O N  
APPEARANCE  
DESCRIPTION  
These “Ultrafast Recovery” rectifier diodes are military qualified to MIL-PRF-19500/477  
and are ideal for high-reliability applications where a failure cannot be tolerated. These  
industry-recognized 2.5 Amp rated rectifiers for working peak reverse voltages from 50 to  
150 volts are hermetically sealed with voidless-glass construction using an internal  
“Category I” metallurgical bond. They are also available in surface-mount packages (see  
separate data sheet for 1N5802US thru 1N5806US). Microsemi also offers numerous  
other rectifier products to meet higher and lower current ratings with various recovery  
time speed requirements including standard, fast and ultrafast in thru-hole and surface-  
mount packages.  
“A” Package  
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com  
FEATURES  
APPLICATIONS / BENEFITS  
Popular JEDEC registered 1N5802 to 1N5806 series  
Voidless hermetically sealed glass package  
Extremely robust construction  
Triple-layer passivation  
Internal “Category I” Metallurgical bonds  
Ultrafast recovery 2.5 Amp rectifier series 50 to 150V  
Military and other high-reliability applications  
Switching power supplies or other applications  
requiring extremely fast switching & low forward loss  
High forward surge current capability  
Low thermal resistance  
JAN, JANTX, JANTXV, and JANS available per MIL-PRF-  
Controlled avalanche with peak reverse power  
19500/477  
capability  
Surface mount equivalents also available in a square end-cap  
MELF configuration with “US” suffix (see separate data sheet  
for 1N5802US thru 1N5806US)  
Inherently radiation hard as described in Microsemi  
MicroNote 050  
MAXIMUM RATINGS  
MECHANICAL AND PACKAGING  
Junction Temperature: -65oC to +175oC  
Storage Temperature: -65oC to +175oC  
Average Rectified Forward Current (IO): 2.5 A @ TL = 75ºC  
Thermal Resistance: 36 ºC/W junction to lead (L=.375 in)  
Thermal Impedance: 4.5oC/W @ 10 ms heating time  
CASE: Hermetically sealed voidless hard glass with  
Tungsten slugs (package dimensions on last page)  
TERMINATIONS: Axial-leads are Tin/Lead (Sn/Pb)  
over Copper. Note: Previous JANS inventory had  
solid Silver axial-leads and no finish.  
MARKING: Body painted and part number, etc.  
POLARITY: Cathode indicated by band  
Tape & Reel option: Standard per EIA-296  
Weight: 340 mg  
Forward Surge Current: 35 Amps @ 8.3 ms half-sine  
Capacitance: 25 pF @ VR = 10 Volts, f = 1 MHz  
Solder temperature: 260ºC for 10 s (maximum)  
ELECTRICAL CHARACTERISTICS  
WORKING BREAKDOWN  
AVERAGE  
RECTIFIED RECTIFIED  
CURRENT CURRENT  
AVERAGE  
MAXIMUM  
FORWARD  
VOLTAGE  
@ 1 A  
(8.3 ms pulse)  
VF  
REVERSE  
CURRENT  
(MAX)  
SURGE  
CURRENT  
(MAX)  
REVERSE  
RECOVERY  
TIME (MAX)  
(NOTE 4)  
PEAK  
REVERSE  
VOLTAGE  
VOLTAGE  
(MIN.)  
@ 100μA  
TYPE  
I
@
I
@
@ V  
I
O1  
O2  
RWM  
FSM  
V
t
rr  
IR  
(NOTE 3)  
V
TL=+75ºC  
(NOTE 1)  
AMPS  
TA=+55ºC  
(Note 2)  
AMPS  
RWM  
BR  
VOLTS  
VOLTS  
VOLTS  
AMPS  
ns  
μA  
25oC  
100oC 25oC 100oC  
1N5802  
1N5803  
1N5804  
1N5805  
1N5806  
50  
75  
100  
125  
150  
55  
80  
110  
135  
160  
2.5  
2.5  
2.5  
2.5  
2.5  
1.0  
1.0  
1.0  
1.0  
1.0  
0.875  
0.800  
0.800  
0.800  
1
1
1
1
1
50  
50  
50  
50  
50  
35  
35  
35  
35  
35  
25  
25  
25  
25  
25  
0.875  
0.875  
NOTE 1: IO1 is rated at 2.5 A @ TL = 75ºC at 3/8 inch lead length. Derate at 25 mA/ºC for TL above 75ºC.  
NOTE 2: IO2 is rated at 1.0 A @ TA = 55ºC for PC boards where thermal resistance from mounting point to  
ambient is sufficiently controlled where TJ(max) does not exceed 175ºC. Derate at 8.33 mA/ºC for TA above 55ºC.  
NOTE 3: TA = 25oC @ IO = 1.0 A and VRWM for ten 8.3 ms surges at 1 minute intervals  
NOTE 4: I = 0.5 A, I  
= 0.5 A, I  
= .05 A  
F
RM  
R(REC)  
Copyright © 2007  
1-15-2007 REV A  
Microsemi  
Page 1  
Scottsdale Division  
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503  
1N5802 thru 1N5806  
S C O T T S D A L E D I V I S I O N  
RECTIFIERS  
SYMBOLS & DEFINITIONS  
Symbol  
Definition  
VBR  
Minimum Breakdown Voltage: The minimum voltage the device will exhibit at a specified current  
Working Peak Reverse Voltage: The maximum peak voltage that can be applied over the operating temperature  
range  
VRWM  
Average Rectified Output Current: Output Current Averaged over a full cycle with a 50 Hz or 60 Hz sine-wave  
input and a 180 degree conduction angle  
IO  
VF  
IR  
Maximum Forward Voltage: The maximum forward voltage the device will exhibit at a specified current  
Maximum Leakage Current: The maximum leakage current that will flow at the specified voltage and temperature  
Capacitance: The capacitance in pF at a frequency of 1 MHz and specified voltage  
C
Reverse Recovery Time: The time interval between the instant the current passes through zero when changing  
from the forward direction to the reverse direction and a specified recovery decay point after a peak reverse  
current occurs.  
trr  
GRAPHS  
FIGURE 1  
OUTPUT CURRENT vs. LEAD TEMP.  
PACKAGE DIMENSIONS inches/[mm]  
NOTE: Lead tolerance = +0.002/-0.003 inches  
Copyright © 2007  
1-15-2007 REV A  
Microsemi  
Scottsdale Division  
Page 2  
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503  

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