M5M5V4R01J-12
更新时间:2024-09-15 01:49:41
品牌:MITSUBISHI
描述:4194304-BIT (4194304-WORD BY 1-BIT) CMOS STATIC RAM
M5M5V4R01J-12 概述
4194304-BIT (4194304-WORD BY 1-BIT) CMOS STATIC RAM 4194304 - BIT ( 4194304 - WORD BY 1位) CMOS静态RAM SRAM
M5M5V4R01J-12 规格参数
是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | SOJ | 包装说明: | SOJ, SOJ32,.44 |
针数: | 32 | Reach Compliance Code: | unknown |
ECCN代码: | 3A991.B.2.A | HTS代码: | 8542.32.00.41 |
风险等级: | 5.92 | Is Samacsys: | N |
最长访问时间: | 12 ns | I/O 类型: | SEPARATE |
JESD-30 代码: | R-PDSO-J32 | JESD-609代码: | e0 |
内存密度: | 4194304 bit | 内存集成电路类型: | STANDARD SRAM |
内存宽度: | 1 | 功能数量: | 1 |
端子数量: | 32 | 字数: | 4194304 words |
字数代码: | 4000000 | 工作模式: | ASYNCHRONOUS |
最高工作温度: | 70 °C | 最低工作温度: | |
组织: | 4MX1 | 输出特性: | 3-STATE |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | SOJ |
封装等效代码: | SOJ32,.44 | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE | 并行/串行: | PARALLEL |
电源: | 3.3 V | 认证状态: | Not Qualified |
最大待机电流: | 0.01 A | 最小待机电流: | 3.14 V |
子类别: | SRAMs | 最大压摆率: | 0.16 mA |
最大供电电压 (Vsup): | 3.6 V | 最小供电电压 (Vsup): | 3.13 V |
标称供电电压 (Vsup): | 3.3 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子面层: | Tin/Lead (Sn/Pb) | 端子形式: | J BEND |
端子节距: | 1.27 mm | 端子位置: | DUAL |
Base Number Matches: | 1 |
M5M5V4R01J-12 数据手册
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PDF下载MITSUBISHI LSIs
M5M5V4R01J-12,-15
1997.11.20 Rev.F
4194304-BIT (4194304-WORD BY 1-BIT) CMOS STATIC RAM
DESCRIPTION
The M5M5V4R01J is a family of 4194304-word by 1-bit static
RAMs, fabricated with the high performance CMOS silicon gate
process and designed for high speed application.
PIN CONFIGURATION (TOP VIEW)
A0
1
2
32 A21
31 A20
The M5M5V4R01J is offered in a 32-pin plastic small outline J-
lead package(SOJ).
A1
A2
A3
A4
30
address
inputs
3
4
5
A19
address
inputs
29
28
27
A18
A17
A16
These device operate on a single 3.3V supply, and are directly
TTL compatible. They include a power down feature as well.
A5
S
VCC
GND
D
6
7
8
chip select
input
output enable
input
(0V)
26
25
24
FEATURES
OE
GND
VCC
(3.3V)
• Fast access time
M5M5V4R01J-12 •••• 12ns(max)
M5M5V4R01J-15 •••• 15ns(max)
(0V)
9
(3.3V)
data outputs
data inputs
10
23 Q
• Low power dissipation
Active •••••••••• 297mW(typ)
Stand by •••••••••• 3.3mW(typ)
22
11
12
13
A15
write control
input
W
A6
A7
A8
A9
A10
21
A14
A13
A12
• Single +3.3V power supply
• Fully static operation : No clocks, No refresh
• Test mode is available
address
inputs
20
19
address
inputs
14
15
16
18 A11
17
• Easy memory expansion by S
byte control
input
• Three-state outputs : OR-tie capability
• OE prevents data contention in the I/O bus
• Directly TTL compatible : All inputs and outputs
B1/B4
Outline 32P0K
APPLICATION
High-speed memory units
PACKAGE
32pin 400mil SOJ
BLOCK DIAGRAM
A0
1
2
A1
A2
3
MEMORY ARRAY
512 ROWS
8192 COLUMNS
A3
A4
A5
data
outputs
4
address
inputs
Q
23
5
6
A6
A7
A8
12
13
14
COLUMN I/O CIRCUITS
S
7
data
inputs/
D
COLUMN ADDRESS
10
DECODERS
W
11
8
VCC(3.3V)
GND(0V)
COLUMN INPUT BUFFERS
24
OE 26
B1/B4 17
9
25
15 16 18
29 30 31 32
19 20 21 22 27 28
A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 A21
address inputs
MITSUBISHI
ELECTRIC
1
MITSUBISHI LSIs
M5M5V4R01J-12,-15
4194304-BIT (4194304-WORD BY 1-BIT) CMOS STATIC RAM
FUNCTION
The operation mode of the M5M5V4R01J is determined by a
combination of the device control inputs S, W and OE. Each
mode is summarized in the function table.
A write cycle is executed whenever the low level W overlaps
with the low level S. The address must be set-up before the
write cycle and must be stable during the entire cycle.
The data is latched into a cell on the trailing edge of W or S,
whichever occurs first, requiring the set-up and hold time
relative to these edge to be maintained. The output enable
input OE directly controls the output stage. Setting the OE at
a high level, the output stage is in a high impedance state,
and the data bus
A read cycle is excuted by setting W at a high level and OE
at a low level while S are in an active state (S=L).
When setting S at high level, the chip is in a non-selectable
mode in which both reading and writing are disable. In this
mode, the output stage is in a high-impedance state, allowing
OR-tie with other chips and memory expansion by S.
Signal-S controls the power-down feature. When S goes
high, power dissapation is reduced extremely. The access time
from S is equivalent to the address access time.
The RAM works with an organization of 4194304-word by 1
bit,when B1/B4 is low of floating. And an organization of 10485
76-word by 4bit is also obtained for reducing the test time,
when B1/B4 is high.
contention problem in the write cycle is eliminated.
FUNCTION TABLE
Mode
Non selection
Write
D
High-impedance
Din
Q
Icc
S
H
L
W
X
L
OE
X
Stand by
High-impedance
High-impedance
Active
Active
Active
X
Read
High-impedance
High-impedance
L
L
H
H
L
Dout
High-impedance
H
ABSOLUTE MAXIMUM RATINGS
Parameter
Supply voltage
Conditions
With respect to GND
Ta=25 C
Ratings
-2.0* ~ 4.6
Unit
V
Symbol
Vcc
-2.0* ~ VCC+0.5
-2.0* ~ VCC+0.5
VI
Input voltage
V
V
VO
Output voltage
Pd
Power dissipation
Operating temperature
Storage temperature(bias)
Storage temperature
1000
mW
C
Topr
0 ~ 70
Tstg(bias)
-10 ~ 85
-65 ~ 150
C
T
stg
C
*Pulse width ≤ 20ns, In case of DC:-0.5V
(Ta=0 ~ 70 C, Vcc=3.3V +10% unless otherwise noted)
DC ELECTRICAL CHARACTERISTICS
-5%
Limits
Condition
Symbol
Parameter
Unit
Typ
Max
Min
VIH
VIL
VOH
VOL
I I
V
V
V
V
High-level input voltage
Low-level input voltage
High-level output voltage
Low-level output voltage
Input current
Vcc+0.3
0.8
2.2
-0.3
2.0
IOH =-4mA
IOL= 8mA
VI = 0~Vcc
0.4
2
µA
VI (S)= VIH
VO= 0~Vcc
µA
I OZ
Output current in off-state
10
12ns cycle
15ns cycle
160
VI (S)= VIL
other inputs VIH or VIL
Output-open(duty 100%)
Active supply current
(TTL level)
AC
DC
mA
I CC1
150
100
75
90
12ns cycle
15ns cycle
Stand by current
(TTL level)
AC
DC
mA
mA
I CC2
70
VI (S)= VIH
50
VI (S)= Vcc≥0.2V
other inputs VI≤0.2V
or VI≥Vcc-0.2V
I CC3 Stand by current
1
10
MITSUBISHI
ELECTRIC
2
MITSUBISHI LSIs
M5M5V4R01J-12,-15
4194304-BIT (4194304-WORD BY 1-BIT) CMOS STATIC RAM
+10% unless otherwise noted)
CAPACITANCE (Ta=0 ~ 70 C, Vcc=3.3V
-5%
Limit
Typ
Unit
Symbol
Parameter
Test Condition
Min
Max
8
pF
pF
CI
Input capacitance
Output capacitance
V I =GND, VI =25mVrms,f=1MHz
VO=25mVrms,f=1MHz
VO=GND,
8
CO
Note 1: Direction for current flowing into an IC is positive (no mark).
2: Typical value is Vcc=5V,Ta=25 C
3: CI,CO are periodically sampled and are not 100% tested.
(Ta=0 ~ 70 C, Vcc=3.3V +10% unless otherwise noted)
AC ELECTRICAL CHARACTERISTICS
(1)MEASUREMENT CONDITION
-5%
Input pulse levels
V
IH =3.0V, V IL =0.0V
••••••••••••••••••••••••
Input rise and fall time
3ns
••••••••••••••••••••••••••••••••••••••
Input timing reference levels •••••••••••• V IH=1.5V, V IL=1.5V
Output timing reference levels =1.5V, V OL =1.5V
V
••••••••••
OH
Output loads
Fig1 ,Fig2
••••••••••••••••••••••••••••••••••••••••••
Vcc
Z0=50Ω
OUTPUT
480Ω
DQ
5pF
(including
scope and JIG)
255Ω
RL=50Ω
VL=1.5V
Fig.1 Output load
Fig.2 Output load for t en, t dis
MITSUBISHI
ELECTRIC
3
MITSUBISHI LSIs
M5M5V4R01J-12,-15
4194304-BIT (4194304-WORD BY 1-BIT) CMOS STATIC RAM
(2)READ CYCLE
Limits
M5M5V4R01J -12 M5M5V4R01J -15
Unit
Parameter
Symbol
Max
Max
Min
12
Min
15
tCR
Read cycle time
Address access time
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ta(A)
ta(S)
12
12
6
15
15
8
Chip select access time
(OE)
ta
Output enable access time
Output disable time after S high
Output disable time after OE high
Output enable time after S low
Output enable time after OE low
Data valid time after address change
Power-up time after chip selection
Power-down time after chip selection
tdis(S)
0
0
0
0
3
6
0
0
0
0
3
7
tdis(OE)
ten(S)
6
7
ten(OE)
tv(A)
tPU
tPD
0
0
12
15
(3)WRITE CYCLE
Limits
M5M5V4R01J -12 M5M5V4R01J -15
Parameter
Symbol
Unit
ns
Min
12
Max
Max
Min
15
tCW
Write cycle time
tw(W)
tsu(A)1
tsu(A)2
Write pulse width
Address setup time(W)
ns
ns
ns
10
0
12
0
Address setup time(S)
0
0
10
6
(S)
tsu
Chip select setup time
Data setup time
ns
ns
ns
ns
ns
ns
ns
12
7
(D)
tsu
th(D)
Data hold time
0
0
(W)
trec
Write recovery time
1
1
(W)
Output disable time after W low
Output disable time after OE high
Output enable time after W high
tdis
0
6
6
0
7
7
tdis (OE)
ten (W)
0
0
0
0
ten(OE)
Output enable time after OE low
Address to W High
ns
ns
0
0
(A-WH)
tsu
12
10
MITSUBISHI
ELECTRIC
4
MITSUBISHI LSIs
M5M5V4R01J-12,-15
4194304-BIT (4194304-WORD BY 1-BIT) CMOS STATIC RAM
(4)TIMING DIAGRAMS
Read cycle 1
t CR
VIH
A
0~21
VIL
(A)
ta
(A)
tv
(A)
tv
VOH
VOL
Q
PREVIOUS DATA VALID
UNKNOWN
DATA VALID
W=H
S=L
OE=L
Read cycle 2 (Note 4)
t CR
VIH
S
VIL
(Note 5)
(S)
(S)
tdis
ta
(Note 5)
ten(S)
VOH
UNKNOWN
DATA VALID
Q
VOL
tPU
tPD
ICC1
50%
50%
Icc
ICC2
W=H
OE=L
Note 4. Addresses valid prior to or coincident with S transition low.
5. Transition is measured ±500mv from steady state voltage with specified loading in Figure 2.
Read cycle 3 (Note 6)
t CR
VIH
VIL
OE
(Note 5)
(OE)
tdis(OE)
ta
(Note 5)
ten(OE)
VOH
VOL
UNKNOWN
DATA VALID
Q
W=H
S=L
Note 6. Addresses and S valid prior to OE transition low by (ta(A)-ta(OE)), (ta(S)-ta(OE))
MITSUBISHI
ELECTRIC
5
MITSUBISHI LSIs
M5M5V4R01J-12,-15
4194304-BIT (4194304-WORD BY 1-BIT) CMOS STATIC RAM
Write cycle ( W control mode )
tCW
VIH
A
S
0~21
VIL
(S)
tsu
VIH
VIL
(Note7)
(Note7)
(A-WH)
tsu
VIH
VIL
OE
W
(A)
tsu
tw(W)
trec(W)
VIH
VIL
(D)
(D)
th
tsu
VIH
VIL
D
Q
DATA STABLE
(Note 5)
(W)
tdis
(Note 5)
(OE)
ten
(OE)
ten(W)
tdis
VOH
VOL
Hi-Z
Write cycle (S control mode )
tCW
VIH
0~21
A
S
VIL
(S)
tsu
tw
(W)
(A)
trec
tsu
VIH
VIL
(W)
VIH
VIL
W
D
(Note7)
(Note7)
(D)
(D)
tsu
th
VIH
VIL
DATA STABLE
(W)
tdis
(S)
ten
(Note5)
VOH
VOL
(Note5)
Hi-Z
Q
(Note8)
Note 7: Hatching indicates the state is don't care.
8: When the falling edge of W is simultaneous or prior to the falling edge of S, the output is maintained in the high impedance.
9: ten,tdis are periodically sampled and are not 100% tested.
MITSUBISHI
ELECTRIC
6
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