PS2501L-2-A

更新时间:2024-11-07 18:32:11
品牌:NEC
描述:Transistor Output Optocoupler, 2-Element, 5000V Isolation, LEAD FREE, SURFACE MOUNT, PLASTIC, DIP-8

PS2501L-2-A 概述

Transistor Output Optocoupler, 2-Element, 5000V Isolation, LEAD FREE, SURFACE MOUNT, PLASTIC, DIP-8 光耦合器

PS2501L-2-A 规格参数

是否Rohs认证:符合生命周期:Transferred
包装说明:SURFACE MOUNT, PLASTIC PACKAGE-8Reach Compliance Code:compliant
风险等级:5.57Is Samacsys:N
其他特性:UL RECOGNIZEDColl-Emtr Bkdn Voltage-Min:80 V
配置:SEPARATE, 2 CHANNELS标称电流传输比:300%
最大暗电源:100 nA最大正向电流:0.08 A
最大绝缘电压:5000 V元件数量:2
最高工作温度:100 °C最低工作温度:-55 °C
光电设备类型:TRANSISTOR OUTPUT OPTOCOUPLERBase Number Matches:1

PS2501L-2-A 数据手册

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DATA SHEET  
PHOTOCOUPLER  
PS2501-1,-2,-4,PS2501L-1,-2,-4  
HIGH ISOLATION VOLTAGE  
SINGLE TRANSISTOR TYPE  
MULTI PHOTOCOUPLER SERIES  
NEPOC Series−  
DESCRIPTION  
The PS2501-1, -2, -4 and PS2501L-1, -2, -4 are optically coupled isolators containing a GaAs light emitting diode  
and an NPN silicon phototransistor.  
The PS2501-1, -2, -4 are in a plastic DIP (Dual In-line Package) and the PS2501L-1, -2, -4 are lead bending type  
(Gull-wing) for surface mount.  
FEATURES  
PIN CONNECTION  
High isolation voltage (BV = 5 000 Vr.m.s.)  
(Top View)  
High collector to emitter voltage (VCEO = 80 V)  
High-speed switching (tr = 3 µs TYP., tf = 5 µs TYP.)  
Ordering number of tape product: PS2501L-1-E3, E4, F3, F4, PS2501L-2-E3, E4  
Safety standards  
PS2501-1, PS2501L-1  
4
3
1. Anode  
2. Cathode  
3. Emitter  
4. Collector  
UL approved: File No. E72422  
1
2
APPLICATIONS  
PS2501-2, PS2501L-2  
Power supply  
8
7
6
5
1, 3. Anode  
Telephone/FAX.  
2, 4. Cathode  
5, 7. Emitter  
6, 8. Collector  
FA/OA equipment  
Programmable logic controller  
1
2
3
4
PS2501-4, PS2501L-4  
16 15 14 13 12 11 10  
9
8
1
2
3
4
5
6
7
1, 3, 5, 7. Anode  
2, 4, 6, 8. Cathode  
9, 11, 13, 15. Emitter  
10, 12, 14, 16. Collector  
The information in this document is subject to change without notice. Before using this document, please confirm that  
this is the latest version.  
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices  
representative for availability and additional information.  
Document No. PN10225EJ02V0DS (2nd edition)  
Date Published April 2005 CP(K)  
Printed in Japan  
The mark  shows major revised points.  
NEC Compound Semiconductor Devices, Ltd. 1988, 2005  
PS2501-1,-2,-4,PS2501L-1,-2,-4  
PACKAGE DIMENSIONS (UNIT : mm)  
DIP Type (New package)  
PS2501-1  
PS2501-4  
4.6 0.35  
19.8 0.5  
7.62  
7.62  
0 to 15˚ +0.1  
0.25–0.05  
0 to 15˚ +0.1  
0.25–0.05  
1.25 0.15  
0.50 0.10  
1.25 0.15  
0.50 0.10  
0.25  
0.25  
M
2.54  
M
2.54  
Caution New package 1-ch, 4-ch only  
DIP Type  
PS2501-1  
PS2501-2  
4.6 0.5  
9.7 0.5  
7.62  
7.62  
0 to 15˚ +0.1  
0 to 15˚ +0.1  
0.25–0.05  
0.25–0.05  
1.25 0.15  
1.25 0.15  
0.50 0.10  
0.25  
0.50 0.10  
M
0.25  
M
2.54  
2.54  
PS2501-4  
19.8 0.5  
7.62  
0 to 15˚ +0.1  
0.25–0.05  
1.25 0.15  
0.50 0.10  
0.25  
M
2.54  
2
Data Sheet PN10225EJ02V0DS  
PS2501-1,-2,-4,PS2501L-1,-2,-4  
Lead Bending Type (New package)  
PS2501L-1  
PS2501L-4  
4.6 0.35  
19.8 0.5  
1.25 0.15  
0.25  
0.9 0.25  
9.60 0.4  
0.9 0.25  
1.25 0.15  
9.60 0.4  
0.15  
M
0.25  
M
2.54  
0.15  
2.54  
Caution New package 1-ch, 4-ch only  
Lead Bending Type  
PS2501L-1  
PS2501L-2  
4.6 0.5  
9.7 0.5  
1.25 0.15  
0.25  
0.9 0.25  
9.60 0.4  
0.9 0.25  
9.60 0.4  
1.25 0.15  
M
0.25 M  
0.15  
2.54  
0.15  
2.54  
PS2501L-4  
19.8 0.5  
0.9 0.25  
9.60 0.4  
1.25 0.15  
0.25  
M
0.15  
2.54  
3
Data Sheet PN10225EJ02V0DS  
PS2501-1,-2,-4,PS2501L-1,-2,-4  
MARKING EXAMPLE  
PS2501-1  
PS2501-2, -4  
No. 1 pin  
Mark  
No. 1 pin  
Mark  
Country Assembled  
Type Number  
Assembly Lot  
2501  
MD003  
PS2501-2  
MD003  
Assembly Lot  
M
D
0
03  
M
D
0
03  
Week Assembled  
Week Assembled  
Year Assembled  
(Last 1 Digit)  
Year Assembled  
(Last 1 Digit)  
In-house Code  
CTR Rank Code  
In-house Code  
CTR Rank Code  
Package  
Made in Japan Made in Taiwan  
Package  
Standard PKG  
New PKG  
Made in Japan Made in Taiwan  
D
F
D
E
F
Standard PKG  
New PKG  
E*1  
H
*1 PS2501-4 only  
4
Data Sheet PN10225EJ02V0DS  
PS2501-1,-2,-4,PS2501L-1,-2,-4  
ORDERING INFORMATION  
Part Number  
Order Number  
Solder Plating  
Specification  
Packing Style  
Safety Standard  
Approval  
Application Part  
Number*1  
PS2501-1  
PS2501-1  
Solder  
Magazine case 100 pcs  
Standard products PS2501-1  
(UL Approved)  
PS2501L-1  
PS2501L-1  
contains lead  
PS2501L-1-E3  
PS2501L-1-E4  
PS2501L-1-F3  
PS2501L-1-F4  
PS2501-2  
PS2501L-1-E3  
PS2501L-1-E4  
PS2501L-1-F3  
PS2501L-1-F4  
PS2501-2  
Embossed Tape 1 000 pcs/reel  
Embossed Tape 2 000 pcs/reel  
Magazine case 45 pcs  
PS2501-2  
PS2501L-2  
PS2501L-2  
PS2501L-2-E3  
PS2501L-2-E4  
PS2501-4  
PS2501L-2-E3  
PS2501L-2-E4  
PS2501-4  
Embossed Tape 1 000 pcs/reel  
Magazine case 20 pcs  
PS2501-4  
PS2501-1  
PS2501L-4  
PS2501L-4  
PS2501-1  
PS2501-1-A  
Pb-Free  
Magazine case 100 pcs  
PS2501L-1  
PS2501L-1-A  
PS2501L-1-E3-A  
PS2501L-1-E4-A  
PS2501L-1-F3-A  
PS2501L-1-F4-A  
PS2501-2-A  
PS2501L-1-E3  
PS2501L-1-E4  
PS2501L-1-F3  
PS2501L-1-F4  
PS2501-2  
Embossed Tape 1 000 pcs/reel  
Embossed Tape 2 000 pcs/reel  
Magazine case 45 pcs  
PS2501-2  
PS2501-4  
PS2501L-2  
PS2501L-2-A  
PS2501L-2-E3-A  
PS2501L-2-E4-A  
PS2501-4-A  
PS2501L-2-E3  
PS2501L-2-E4  
PS2501-4  
Embossed Tape 1 000 pcs/reel  
Magazine case 20 pcs  
PS2501L-4  
PS2501L-4-A  
*1 For the application of the Safety Standard, following part number should be used.  
5
Data Sheet PN10225EJ02V0DS  
PS2501-1,-2,-4,PS2501L-1,-2,-4  
ABSOLUTE MAXIMUM RATINGS (Unless otherwise specified, TA = 25°C)  
Ratings  
Parameter  
Symbol  
PS2501-1,  
PS2501-2,-4  
PS2501L-2,-4  
Unit  
PS2501L-1  
Diode  
Reverse Voltage  
VR  
IF  
6
V
mA  
Forward Current (DC)  
Power Dissipation Derating  
Power Dissipation  
80  
PD/°C  
PD  
1.5  
1.2  
mW/°C  
mW/ch  
A
150  
120  
Peak Forward Current*1  
IFP  
1
80  
7
Transistor Collector to Emitter Voltage  
Emitter to Collector Voltage  
Collector Current  
VCEO  
VECO  
IC  
V
V
50  
mA/ch  
mW/°C  
mW/ch  
Vr.m.s.  
°C  
Power Dissipation Derating  
Power Dissipation  
PC/°C  
PC  
1.5  
1.2  
150  
120  
Isolation Voltage*2  
BV  
5 000  
Operating Ambient Temperature  
Storage Temperature  
TA  
55 to +100  
55 to +150  
Tstg  
°C  
*1 PW = 100 µs, Duty Cycle = 1%  
*2 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output.  
Pins 1-2 shorted together, 3-4 shorted together (PS2501-1, PS2501L-1).  
Pins 1-4 shorted together, 5-8 shorted together (PS2501-2, PS2501L-2).  
Pins 1-8 shorted together, 9-16 shorted together (PS2501-4, PS2501L-4).  
6
Data Sheet PN10225EJ02V0DS  
PS2501-1,-2,-4,PS2501L-1,-2,-4  
ELECTRICAL CHARACTERISTICS (TA = 25°C)  
Parameter  
Symbol  
VF  
Conditions  
MIN.  
TYP.  
1.17  
MAX.  
1.4  
5
Unit  
V
Diode  
Forward Voltage  
Reverse Current  
Terminal Capacitance  
IF = 10 mA  
VR = 5 V  
IR  
µA  
pF  
nA  
Ct  
V = 0 V, f = 1.0 MHz  
VCE = 80 V, IF = 0 mA  
50  
Transistor Collector to Emitter Dark  
Current  
ICEO  
100  
600  
0.3  
Coupled  
Current Transfer Ratio  
(IC/IF)*1  
CTR  
IF = 5 mA, VCE = 5 V  
IF = 10 mA, IC = 2 mA  
80  
300  
%
V
Collector Saturation  
Voltage  
VCE(sat)  
Isolation Resistance  
Isolation Capacitance  
Rise Time*2  
RI-O  
CI-O  
tr  
VI-O = 1.0 kVDC  
1011  
V = 0 V, f = 1.0 MHz  
0.5  
3
pF  
µs  
VCC = 10 V, IC = 2 mA, RL = 100 Ω  
Fall Time*2  
tf  
5
*1 CTR rank ( * : only PS2501-1, PS2501L-1)  
K* : 300 to 600 (%)  
L* : 200 to 400 (%)  
M* :  
D* : 100 to 300 (%)  
H* : 80 to 160 (%)  
80 to 240 (%)  
W*: 130 to 260 (%)  
Q* : 100 to 200 (%)  
N :  
80 to 600 (%)  
*2 Test circuit for switching time  
I
F
Pulse Input  
PW = 100  
V
CC  
µ
s
Duty Cycle = 1/10  
V
OUT  
50 Ω  
R
L
= 100 Ω  
7
Data Sheet PN10225EJ02V0DS  
PS2501-1,-2,-4,PS2501L-1,-2,-4  
TYPICAL CHARACTERISTICS (Unless otherwise specified, TA = 25°C)  
DIODE POWER DISSIPATION vs.  
AMBIENT TEMPERATURE  
TRANSISTOR POWER DISSIPATION  
vs. AMBIENT TEMPERATURE  
150  
100  
150  
100  
50  
PS2501-1  
PS2501-1  
PS2501L-1  
PS2501L-1  
PS2501-2  
PS2501-2  
1.5 mW/˚C  
PS2501L-2  
1.5 mW/˚C  
PS2501L-2  
PS2501-4  
PS2501L-4  
PS2501-4  
PS2501L-4  
50  
0
1.2 mW/˚C  
1.2 mW/˚C  
100  
75  
Ambient Temperature T  
25  
50  
75  
125  
(˚C)  
150  
0
25  
50  
100  
125  
(˚C)  
150  
Ambient Temperature T  
A
A
COLLECTOR CURRENT vs.  
COLLECTOR TO EMITTER VOLTAGE  
FORWARD CURRENT vs.  
FORWARD VOLTAGE  
100  
50  
70  
60  
50  
40  
30  
20  
10  
TA  
= +100˚C  
+60˚C  
+25˚C  
10  
5
0˚C  
–25˚C  
–50˚C  
1
0.5  
IF = 5 mA  
0.1  
0
4
8
10  
0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5  
Forward Voltage V (V)  
2
6
F
Collector to Emitter Voltage VCE (V)  
COLLECTOR TO EMITTER DARK  
CURRENT vs. AMBIENT TEMPERATURE  
COLLECTOR CURRENT vs.  
COLLECTOR SATURATION VOLTAGE  
40  
10 000  
1 000  
100  
10  
V
CE = 80 V  
40 V  
10  
5
24 V  
10 V  
5 V  
IF  
= 1 mA  
1
0.5  
1
0.1  
50  
–25  
0
25  
50  
75  
100  
1.0  
0
0.2  
0.4  
0.6  
0.8  
Ambient Temperature T (˚C)  
A
Collector Saturation Voltage VCE(sat) (V)  
Remark The graphs indicate nominal characteristics.  
8
Data Sheet PN10225EJ02V0DS  
PS2501-1,-2,-4,PS2501L-1,-2,-4  
NORMALIZED CURRENT TRANSFER  
RATIO vs. AMBIENT TEMPERATURE  
CURRENT TRANSFER RATIO vs.  
FORWARD CURRENT  
1.2  
450  
VCE = 5 V  
400  
350  
300  
250  
1.0  
0.8  
0.6  
0.4  
0.2  
0
Sample A  
B
C
D
200  
150  
100  
Normalized to 1.0  
at T = 25˚C,  
= 5 mA, VCE = 5 V  
A
IF  
50  
0
–50  
–25  
0
25  
50  
75  
100  
0.05 0.1  
0.5  
1
5
10  
50  
Forward Current I  
F
(mA)  
Ambient Temperature T  
A
(˚C)  
SWITCHING TIME vs.  
LOAD RESISTANCE  
SWITCHING TIME vs.  
LOAD RESISTANCE  
50  
10  
1 000  
100  
10  
t
f
I
V
C
= 2 mA,  
I
V
F
= 5 mA,  
CC = 5 V,  
CTR = 290%  
t
f
CC = 10 V,  
tr  
CTR = 290%  
µ
µ
ts  
td  
ts  
1
tr  
t
d
0.1  
10  
1
100  
10 k  
5 k  
50 100  
500  
1 k  
()  
500 1 k  
5 k 10 k  
()  
50 k 100 k  
Load Resistance R  
L
Load Resistance R  
L
FREQUENCY RESPONSE  
LONG TERM CTR DEGRADATION  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
I
V
F
= 5 mA,  
CE = 5 V  
IF = 5 mA  
0
–5  
T
A
A
= 25˚C  
= 60˚C  
–10  
–15  
–20  
100 Ω  
T
RL = 1 kΩ  
300 Ω  
0
103  
Time (Hr)  
102  
104  
105  
0.5  
1
2
5
10 20 50 100200 500  
Frequency f (kHz)  
Remark The graphs indicate nominal characteristics.  
9
Data Sheet PN10225EJ02V0DS  
PS2501-1,-2,-4,PS2501L-1,-2,-4  
TAPING SPECIFICATIONS (UNIT : mm)  
Outline and Dimensions (Tape)  
2.0 0.1  
4.0 0.1  
+0.1  
4.5 MAX.  
φ
1.5–0  
1.55 0.1  
4.0 0.1  
0.4  
5.3 0.1  
8.0 0.1  
Tape Direction  
PS2501L-1-E3  
PS2501L-1-E4  
Outline and Dimensions (Reel)  
2.0 0.5  
2.0 0.5  
φ13.0 0.2  
R 1.0  
φ
φ
φ21.0 0.8  
17.5 1.0  
21.5 1.0  
15.9 to 19.4  
Outer edge of  
flange  
Packing: 1 000 pcs/reel  
10  
Data Sheet PN10225EJ02V0DS  
PS2501-1,-2,-4,PS2501L-1,-2,-4  
Outline and Dimensions (Tape)  
2.0 0.1  
4.0 0.1  
+0.1  
4.5 MAX.  
φ
1.5–0  
1.55 0.1  
8.0 0.1  
4.0 0.1  
0.4  
5.3 0.1  
Tape Direction  
PS2501L-1-F3  
PS2501L-1-F4  
Outline and Dimensions (Reel)  
2.0 0.5  
2.0 0.5  
13.0 0.2  
φ
R 1.0  
φ
φ
φ
21.0 0.8  
17.5 1.0  
21.5 1.0  
15.9 to 19.4  
Outer edge of  
flange  
Packing: 2 000 pcs/reel  
11  
Data Sheet PN10225EJ02V0DS  
PS2501-1,-2,-4,PS2501L-1,-2,-4  
Outline and Dimensions (Tape)  
2.0 0.1  
4.0 0.1  
+0.1  
1.5  
–0  
4.5 MAX.  
10.4 0.1  
4.0 0.1  
1.55 0.1  
12.0 0.1  
0.3  
Tape Direction  
PS2501L-2-E4  
PS2501L-2-E3  
Outline and Dimensions (Reel)  
2.0 0.5  
2.0 0.5  
13.0 0.2  
φ
R 1.0  
φ
φ
φ
21.0 0.8  
17.5 1.0  
21.5 1.0  
15.9 to 19.4  
Outer edge of  
flange  
Packing: 1 000 pcs/reel  
12  
Data Sheet PN10225EJ02V0DS  
PS2501-1,-2,-4,PS2501L-1,-2,-4  
NOTES ON HANDLING  
1. Recommended soldering conditions  
(1) Infrared reflow soldering  
• Peak reflow temperature  
260°C or below (package surface temperature)  
• Time of peak reflow temperature  
• Time of temperature higher than 220°C  
10 seconds or less  
60 seconds or less  
• Time to preheat temperature from 120 to 180°C 120 30 s  
• Number of reflows  
• Flux  
Three  
Rosin flux containing small amount of chlorine (The flux with a  
maximum chlorine content of 0.2 Wt% is recommended.)  
Recommended Temperature Profile of Infrared Reflow  
(heating)  
to 10 s  
260˚C MAX.  
220˚C  
to 60 s  
180˚C  
120˚C  
120 30 s  
(preheating)  
Time (s)  
(2) Wave soldering  
• Temperature  
• Time  
260°C or below (molten solder temperature)  
10 seconds or less  
• Preheating conditions  
• Number of times  
• Flux  
120°C or below (package surface temperature)  
One (Allowed to be dipped in solder including plastic mold portion.)  
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine  
content of 0.2 Wt% is recommended.)  
(3) Soldering by soldering iron  
• Peak temperature (lead part temperature)  
• Time (each pins)  
350°C or below  
3 seconds or less  
• Flux  
Rosin flux containing small amount of chlorine (The flux with a  
maximum chlorine content of 0.2 Wt% is recommended.)  
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead.  
(b) Please be sure that the temperature of the package would not be heated over 100°C.  
13  
Data Sheet PN10225EJ02V0DS  
PS2501-1,-2,-4,PS2501L-1,-2,-4  
(4) Cautions  
• Fluxes  
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.  
2. Cautions regarding noise  
Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between  
collector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute  
maximum ratings.  
USAGE CAUTIONS  
1. Protect against static electricity when handling.  
2. Avoid storage at a high temperature and high humidity.  
14  
Data Sheet PN10225EJ02V0DS  
PS2501-1,-2,-4,PS2501L-1,-2,-4  
When the product(s) listed in this document is subject to any applicable import or export control laws and regulation of the authority  
having competent jurisdiction, such product(s) shall not be imported or exported without obtaining the import or export license.  
The information in this document is current as of April, 2005. The information is subject to change  
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data  
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products  
and/or types are available in every country. Please check with an NEC sales representative for  
availability and additional information.  
No part of this document may be copied or reproduced in any form or by any means without prior  
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.  
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of  
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liability arising from the use of such products. No license, express, implied or otherwise, is granted under any  
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Descriptions of circuits, software and other related information in this document are provided for illustrative  
purposes in semiconductor product operation and application examples. The incorporation of these  
circuits, software and information in the design of customer's equipment shall be done under the full  
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third  
parties arising from the use of these circuits, software and information.  
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers  
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize  
risks of damage to property or injury (including death) to persons arising from defects in NEC  
semiconductor products, customers must incorporate sufficient safety measures in their design, such as  
redundancy, fire-containment, and anti-failure features.  
NEC semiconductor products are classified into the following three quality grades:  
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products  
developed based on a customer-designated "quality assurance program" for a specific application. The  
recommended applications of a semiconductor product depend on its quality grade, as indicated below.  
Customers must check the quality grade of each semiconductor product before using it in a particular  
application.  
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio  
and visual equipment, home electronic appliances, machine tools, personal electronic equipment  
and industrial robots  
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster  
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed  
for life support)  
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life  
support systems and medical equipment for life support, etc.  
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's  
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not  
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness  
to support a given application.  
(Note)  
(1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd.  
and also includes its majority-owned subsidiaries.  
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for  
NEC (as defined above).  
M8E 00. 4 - 0110  
15  
Data Sheet PN10225EJ02V0DS  
PS2501-1,-2,-4,PS2501L-1,-2,-4  
This product uses gallium arsenide (GaAs).  
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe  
the following points.  
Caution GaAs Products  
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws  
and/or ordinances, dispose of the product as recommended below.  
1. Commission a disposal company able to (with a license to) collect, transport and dispose of  
materials that contain arsenic and other such industrial waste materials.  
2. Exclude the product from general industrial waste and household garbage, and ensure that the  
product is controlled (as industrial waste subject to special control) up until final disposal.  
• Do not burn, destroy, cut, crush, or chemically dissolve the product.  
• Do not lick the product or in any way allow it to enter the mouth.  
For further information, please contact  
NEC Compound Semiconductor Devices, Ltd.  
http://www.ncsd.necel.com/  
E-mail: salesinfo@ml.ncsd.necel.com (sales and general)  
techinfo@ml.ncsd.necel.com (technical)  
Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579  
NEC Compound Semiconductor Devices Hong Kong Limited  
E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general)  
TEL: +852-3107-7303  
TEL: +886-2-8712-0478 FAX: +886-2-2545-3859  
TEL: +82-2-558-2120  
FAX: +82-2-558-5209  
FAX: +852-3107-7309  
Hong Kong Head Office  
Taipei Branch Office  
Korea Branch Office  
NEC Electronics (Europe) GmbH  
http://www.ee.nec.de/  
TEL: +49-211-6503-0 FAX: +49-211-6503-1327  
California Eastern Laboratories, Inc.  
TEL: +1-408-988-3500 FAX: +1-408-988-0279  
http://www.cel.com/  
0406  

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