UPD168110MA-6A5-A
更新时间:2024-12-04 13:11:26
品牌:NEC
描述:Stepper Motor Controller, 0.7A, PDSO24, 5.72 MM, PLASTIC, TSSOP-24
UPD168110MA-6A5-A 概述
Stepper Motor Controller, 0.7A, PDSO24, 5.72 MM, PLASTIC, TSSOP-24 运动控制电子器件
UPD168110MA-6A5-A 规格参数
是否Rohs认证: | 符合 | 生命周期: | Transferred |
包装说明: | 5.72 MM, PLASTIC, TSSOP-24 | Reach Compliance Code: | compliant |
风险等级: | 5.7 | 模拟集成电路 - 其他类型: | STEPPER MOTOR CONTROLLER |
JESD-30 代码: | R-PDSO-G24 | 长度: | 6.65 mm |
功能数量: | 1 | 端子数量: | 24 |
最高工作温度: | 75 °C | 最低工作温度: | -10 °C |
最大输出电流: | 0.7 A | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TSSOP | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 峰值回流温度(摄氏度): | 260 |
认证状态: | Not Qualified | 座面最大高度: | 1.2 mm |
最大供电电压 (Vsup): | 3.6 V | 最小供电电压 (Vsup): | 2.7 V |
标称供电电压 (Vsup): | 3 V | 表面贴装: | YES |
温度等级: | COMMERCIAL EXTENDED | 端子形式: | GULL WING |
端子节距: | 0.5 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | 10 | 宽度: | 4.4 mm |
Base Number Matches: | 1 |
UPD168110MA-6A5-A 数据手册
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PDF下载DATA SHEET
MOS INTEGRATED CIRCUIT
µPD168110
MICROSTEP DRIVER FOR DRIVING CAMERA LENS
DESCRIPTION
The µPD168110 is a monolithic 2-channel H bridge driver that consists of a CMOS controller and a MOS output
stage. It can reduce the current consumption and the voltage loss at the output stage compared with a conventional
driver using bipolar transistors, thanks to employment of a MOS process. This product employs a P-channel
MOSFET on the high side of the output stage, eliminating a charge pump. As a result, the circuit current consumption
can be substantially reduced during operation.
This product is ideal for driving the motor of a digital still camera as it can switch over between two-phase excitation
driving and microstep driving, using a stepper motor.
FEATURES
O Two H bridge circuits employing power MOSFET
O Current feedback 64-step microstep driving and two-phase excitation driving selectable
O Low on-resistance: 2 Ω MAX.
O 3 V power supply
Minimum operating power supply voltage VDD = 2.7 V
O Under voltage lockout circuit
Shuts down internal circuitry at VDD = 1.7 V TYP.
O 24-pin TSSOP
ORDERING INFORMATION
Part Number
Package
µPD168110MA-6A5
24-pin plastic TSSOP (5.72 mm (225))
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
The mark
shows major revised points.
Document No. S15840EJ2V0DS00 (2nd edition)
Date Published June 2005 NS CP(K)
Printed in Japan
2003
µPD168110
PIN FUNCTIONS
Package: 24-pin TSSOP
MODE
CLK
1
2
24
23
22
21
20
19
18
17
16
15
14
13
RESETB
CW
LGND
3
V
DD
COSC
4
FIL2
MOB
PGND2
OUT2B
5
FIL1
6
FB1
7
OUT1B
VM2
8
VM1
OUT2A
FB2
PS
9
OUT1A
PGND1
MOBSEL
STOP
10
11
12
OE
Pin No.
1
Pin Name
Pin Function
MODE
CLK
Microstep/2-phase excitation switch pin
Pulse input pin
2
3
LGND
COSC
Control block GND pin
4
Pin connecting capacitor for output oscillator
Phase detection output pin
Output block GND pin
5
MOB
6
PGND2
OUT2B
VM2
7
Channel 2 output B
8
Motor power pin
9
OUT2A
FB2
Channel 2 output A
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
Channel 2 current detection resistor connecting pin
Power save mode pin
PS
OE
Output enable pin
STOP
MOBSEL
PGND1
OUT1A
VM1
Stop mode pin
MOB output select pin
Output block GND pin
Channel 1 output A
Motor power pin
OUT1B
FB1
Channel 1 output B
Channel 1 current detection resistor connecting pin
Channel 1 filter capacitor connecting pin
Channel 2 filter capacitor connecting pin
Control block power pin
FIL1
FIL2
VDD
CW
Revolution direction setting pin
Reset input pin
RESETB
2
Data Sheet S15840EJ2V0DS
µPD168110
BLOCK DIAGRAM
MODE MOBSEL RESET CLK CW
PS
STOP
V
DD
DECODER
V
M1
M2
PULSE
GENERATER
V
EVR1
CURRENT SET
EVR2
C
OSC
OSC
+
MOB
FB2
+
LGND
FILTER
FILTER
Internal Block
+
–
+
–
V
M
VM
Current
Sense1
Current
Sense2
FB1
H BRIDGE
ch1
H BRIDGE
ch2
PGND
OUT1A OUT1B
FIL1
OE
FIL2 OUT2A OUT2B
PGND
Truth Table
RESET
CLK
CW
L
OE
H
PS
STOP
L
MODE
H
MOBSEL
L
Operation Mode
Microstep CW mode
MOB: 1 pulse/cycle
H
H
H
H
L
L
L
L
Microstep CCW mode
MOB: 1 pulse/cycle
H
L
H
H
H
L
L
L
H
H
H
L
H
H
Microstep CW mode
MOB: 4 pulses/cycle
Microstep CCW mode
MOB: 4 pulses/cycle
H
H
H
H
L
H
X
H
H
L
L
L
L
L
L
L
X
X
X
2-phase CW mode
2-phase CCW mode
Output Hi-Z
X
X
X
X
X
STOP mode after MOB = L
(CLK must be input until MOB = L)
H
H
X
X
H
H
L
H
H
H
H
X
X
PS mode after MOB = L
(CLK must be input until MOB = L)
X
H
H
L
X
X
X
X
H
X
H
X
L
H
X
X
X
Setting prohibited
Reset mode
X
H: High level, L: Low level, X: High level or low level
3
Data Sheet S15840EJ2V0DS
µPD168110
Command Input Timing Chart
In microstep mode
RESET
1
2
3
4 5 6 7 8 9 10111213141516 17 18 19 20 21 222324252627282930
CLK
CW
OE
PS
STOP
1
2
3
4
5 6 7 8 9 10 111213 1415 161718 17 16
15 1413
PULSE
OUT
(internal)
Chopping pulse
MOB
Power save mode
STOP mode
stopped
Output when MOBSEL = H
Output Hi-Z
CW mode
CCW mode
Reset status
Reset status
4
Data Sheet S15840EJ2V0DS
µPD168110
Standard Connection Diagram
Microstep/2-phase excitation driving
CPU
MODE MOBSEL RESET CLK CW
PS
STOP
VDD
DECODER
3.3 V
V
V
M1
M2
PULSE
GENERATER
V
DD
5.0 V
330 pF
EVR1
CURRENT SET
EVR2
C
OSC
MOB
FB2
OSC
+
10 kΩ
+
LGND
FILTER
FILTER
Internal Block
– +
+ –
V
M
VM
Current
Sense1
Current
Sense2
FB1
H BRIDGE
ch1
H BRIDGE
ch2
2 kΩ
2 kΩ
1000 pF
1000 pF
PGND
OUT1A OUT1B
FIL1
1000 pF
OE
FIL2 OUT2A OUT2B
PGND
1000 pF
from CPU
M
Only 2-phase excitation driving
CPU
MODE MOBSEL RESET CLK CW
PS
STOP
V
DD
DECODER
3.3 V
V
M1
M2
VDD
PULSE
GENERATER
V
10 kΩ
5.0 V
EVR1
CURRENT SET
EVR2
C
OSC
MOB
OSC
+
+
LGND
FILTER
FILTER
V
DD
V
DD
Internal Block
– +
+ –
V
M
VM
Current
Sense1
Current
Sense2
FB1
FB2
H BRIDGE
ch1
H BRIDGE
ch2
PGND
OUT1A OUT1B
FIL1
OE
FIL2
OUT2A OUT2B
PGND
From CPU
M
5
Data Sheet S15840EJ2V0DS
µPD168110
Output Timing Chart
• Microstep output mode
position
Ch 1 current
100
98.1
92.4
99.5
95.7
88.2
83.1
77.3
70.7
63.4
55.6
47.1
38.3
29.0
19.5
9.8
0
–9.8
–19.5
–29.0
–38.3
–47.1
–55.6
–63.4
–70.7
–77.3
–83.1
–88.2
–92.4
–98.1
–100
–95.7
–99.5
0
5
10
15
20
25
30
35
40
45
50
55
60
65
Ch 2 current
100
98.1
92.4
99.5
95.7
88.2
83.1
77.3
70.7
63.4
55.6
47.1
38.3
29.0
19.5
9.8
0
—
9.8
—
19.5
29.0
—
—
—
38.3
47.1
—
—
55.6
63.4
—
70.7
—
—
77.3
83.1
—
88.2
—
—
—
92.4
98.1
100
—
—
95.7
99.5
0
5
10
10
15
15
20
20
25
30
35
40
45
50
55
60
65
MOB output (when MOBSEL = “L”)
0
5
25
30
35
40
45
50
55
60
65
MOB output (when MOBSEL = “H”)
0
5
5
10
10
15
15
20
20
25
25
30
30
35
40
40
45
45
50
50
55
55
60
60
65
65
CLK input
0
35
The horizontal axis indicates the number of steps. This figure shows an example in the CW mode. The pulse
advances in synchronization with the rising edge of CLK. The current flows into ch 1 and ch 2 in the positive direction
when it flows from OUT1A to OUT1B, and in the negative direction when it flows from OUT1B to OUT1A (the values
shown above are ideal values and do not indicate the actual values).
6
Data Sheet S15840EJ2V0DS
µPD168110
Output Timing Chart
• 2-phase excitation output mode
Ch 1 current
100
–100
0
1
2
3
4
5
6
7
8
Ch 2 current
100
–100
0
1
2
3
4
5
6
7
8
MOB output
0
1
2
3
4
5
6
7
8
CLK input
0
1
2
3
4
5
6
7
8
The horizontal axis indicates the number of steps. This figure shows an example in the CW mode. The current
flows into ch 1 and ch 2 in the positive direction when it flows from OUT1A to OUT1B, and in the negative direction
when it flows from OUT1B to OUT1A.
7
Data Sheet S15840EJ2V0DS
µPD168110
Relationship Between Revolution Angle, Phase Current, and Vector Amount (64 microsteps)
Phase A – Phase Current
Phase B – Phase Current
Vector Amount
Revolution
Angle
Step
Min.
Typ.
Max.
Min.
Typ.
Max.
Typ.
θ 0
θ 1
0
−
0
3.8
17.0
26.5
36.1
45.3
54.1
62.6
68.4
75.7
82.3
88.1
93.4
97.4
100.7
103.0
104.5
−
−
100
100
98.1
95.7
92.4
88.2
83.1
77.3
70.7
63.4
55.6
47.1
38.3
29.0
19.5
9.8
−
100
100.48
100
5.625
11.250
16.875
22.500
28.125
33.750
39.375
45
2.5
9.8
94.5
93.2
90.7
87.4
83.2
78.1
72.3
65.7
58.4
48.6
40.1
31.3
22.1
12.4
2.5
104.5
103.0
100.7
97.4
93.2
88.1
82.3
75.7
68.4
62.6
54.1
45.3
36.1
26.5
17.0
3.8
θ 2
12.4
22.1
31.3
40.1
48.6
58.4
65.7
72.3
78.1
83.2
87.4
90.7
93.2
94.5
−
19.5
29.0
38.3
47.1
55.6
63.4
70.7
77.3
83.1
88.2
92.4
95.7
98.1
100
θ 3
100.02
100.02
99.99
99.98
99.97
99.98
99.97
99.98
99.99
100.02
100.02
100
θ 4
θ 5
θ 6
θ 7
θ 8
θ 9
50.625
56.250
61.875
67.500
73.125
78.750
84.375
90
θ 10
θ 11
θ 12
θ 13
θ 14
θ 15
θ 16
100.48
100
100
−
0
The above values are ideal values and are not guaranteed values.
8
Data Sheet S15840EJ2V0DS
µPD168110
FUNCTION DESCRIPTION
2-phase excitation driving mode
By allowing a current of 100% to flow into output ch1 and ch2 at the same time, a motor can be driven with the
larger torque.
The two-phase excitation driving mode and microstep driving mode are switched by the MODE pin. In the two-
phase excitation driving mode, the chopping pulse circuit does not operate.
Microstep driving of stepper motor
To position a stepper motor with high accuracy, the µPD168110 has a function to hold constant the current flowing
through the H bridge by a vector value and to stop one cycle in 64 steps. To realize the microstep driving mode, the
driver internally realizes the following functions.
• Detecting the current flowing into each channel as a voltage value by a sense resistor
• Synthesizing the dummy sine wave of the half-wave generated by the internal D/A and PWM oscillation wave for
chopping operation
• The driver stage performs PWM driving based on the result of comparing the detected voltage value and
synthesized waves.
The internal dummy sine wave is of 64 steps per cycle, so that the stepper motor can be driven in 64 steps. The
microstep driving mode and two-phase excitation driving mode are switched by an external pin.
+
M
A
Concept of microstep driving operation
MOB output
The MOB output pin outputs “L” if the current of ch1 or ch2 reaches 100% in the microstep output mode, or if the
current of ch 1 reaches +100%. In the two-phase excitation output mode, the MOB pin outputs “L” when the current of
ch1 and ch2 reaches +100%. The excitation position of the stepper motor can be checked by monitoring the MOB
output. The MOB output also indicates the stop position information in the stop mode to be explained below.
The MOB output goes into a Hi-Z state (output H level if pulled up) when OE = “L”.
Stop mode
If the stop mode is set by the STOP pin, the pulse is automatically output until MOB = “L” when CLK is input. If
MOB = “L” in the stop mode, the pulse is not output even when CLK is input, and the output holds the excitation
status.
To advance the pulse, release the stop mode and restore the normal mode.
9
Data Sheet S15840EJ2V0DS
µPD168110
Reset function
When RESET = “L”, initialization is executed and the output goes into a Hi-Z state. When RESET = “H”, excitation
is started with the current of ch1 at +100% and the current of ch2 at 0% (one-phase excitation position). To perform
two-phase excitation driving, excitation is started with the currents of ch1 and ch2 at +100% after the mode has been
set. Be sure to execute a reset operation after power application. MOB outputs “L” until the pulse is output when
RESET goes “L”.
Output enable (OE) pin
The pulse output can be forcibly stopped from an external source by using the OE pin. When OE = “L”, the output
is forcibly made to go into a Hi-Z state.
Standby function
The µPD168110 can enter the standby mode when the pulse is not output and when PS = “H” and
STOP = “H”. In the standby mode, as many internal circuits as possible are stopped so that the self current
consumption can be reduced. In the standby mode, the current consumption is 1 µA MAX. when external CLK input is
stopped. While CLK is being input, the current consumption is reduced to 300 µA MAX. by the current flowing into the
input buffer. The standby mode is released when PS = “L” and STOP = “L”.
Under voltage lockout circuit (UVLO)
This function is used to forcibly stop the operation of the IC to prevent malfunction of the circuits if VDD of the IC
drops during operation. Note that if the VDD voltage abruptly drops in the order of µs, this function may not operate.
VM pin current shutdown circuit
A circuit that prevents a current from flowing into the VM pin when VDD = 0 V is provided. Therefore, the current
flowing into the VM pin is cut off when VDD = 0 V.
A current of up to 3 µA flows into the VM pin when VDD is applied so that the voltages on the VDD and VM pins can
be monitored.
10
Data Sheet S15840EJ2V0DS
µPD168110
OPERATION DESCRIPTION
• Setting output current
The peak value of the output current (when current of ch 1 or ch 2 is 100%) is determined by the resistor RFB that
is connected to FB1 and FB2. This IC has an internal reference power supply VREF (500 mV TYP.) for comparing
current, and drives the stepper motor with the current value calculated by RFB and VREF as the peak output
current value.
Peak output current value IMAX (A) ≅ VREF (V) ÷ RFB (Ω) x Output detection ratio
• Pulse output
The motor is driven by inputting a pulse to the CLK pin. The motor advances by one pulse at the rising edge of
the CLK signal. When MODE = “H”, the motor is driven in the 64-microstep driving mode, and the driving current
of each step is determined based on the internal motor excitation position information and revolution direction.
When MODE = “L”, the two-phase excitation mode is selected, and the current direction (100% drive) of ch 1 and
ch 2 are switched each time a pulse has been input.
• Setting motor revolution direction
The revolution direction of the motor is set by CW. In the CW mode (CW = “L”), the current of ch2 is output, 90°
degrees in phase behind the current of ch1. In the CCW mode (CW = “H”), the current of ch2 is output, 90°
degrees in phase ahead of the current of ch1.
CW Pin
Operation Mode
CW mode (forward revolution)
CCW mode (reverse revolution)
L
H
• Setting stop mode (valid only in microstep driving mode)
When STOP = “H”, the motor advances to the position of MOB output = “L”, and the output status is held.
The excitation status is not changed even when a pulse is input to CLK while MOB = “L” when STOP = “H”. The
pulse can be advanced when STOP = “L”.
STOP
Operation Mode
L
Normal mode
Stop mode
H
Caution If STOP = “L” before the stop mode is set (until MOB = “L”), the operation is performed in the
same manner as in the normal mode.
11
Data Sheet S15840EJ2V0DS
µPD168110
• Power save mode (valid only in microstep driving mode)
When PS = “H” and STOP = “H”, the motor advances to the position of MOB output = “L” and then the output
goes to a Hi-Z state.
The internal circuitry is stopped as much as possible and the standby mode is set. The power save mode is
released when PS = “L” and STOP = “L”.
STOP
Operation Mode
L
Normal mode
Power save mode (only when STOP = “H”)
H
Caution Inputting PS = “H” and STOP = “L” is prohibited.
• Setting output enable
When OE = “H”, the motor is driven (output excitation status). Be sure to set OE to “H” to drive the motor.
STOP
Operation Mode
L
Output Hi-Z
H
Enable mode
• Selecting two-phase excitation/microstep driving mode
The MODE pin can be used to select the two-phase excitation or microstep driving mode. When MODE = “H”,
the microstep driving mode is selected. When MODE = “L”, the two-phase excitation mode (both ch 1 and ch 2
are driven at +100% or –100%) is selected. The µPD168110 is initialized immediately after a RESET operation,
so excitation is started from the position at which the output current of ch 1 is 100% and the output current of ch
2 is 0% in the microstep driving mode, and from the position at which the output currents of both ch 1 and ch 2
are +100% in the two-phase excitation driving mode.
If the mode is changed from the microstep to the two-phase, the position of the microstep mode is retained until
CLK is input. When the first CLK is input, pulse output is started, the operation skips to the two-phase position of
the next quadrant, and driving is started.
2-phase
excitation stop
position
Microstep stop position
(example 1)
(1)
Skips to next quadrant
MODE
Operation Mode
L
2-phase excitation
Microstep driving
H
Microstep stop
position
(example 2)
(3)
(2)
Concept of switching operation mode
from microstep to 2-phase excitation
12
Data Sheet S15840EJ2V0DS
µPD168110
• Selecting MOB output (in microstep driving mode only)
The output function of MOB can be selected by MOBSEL. When MOBSEL = “L”, MOB is output at the position
where the current of ch1 is +100% and the current of ch2 is 0%. When MOBSEL = “H”, MOB is output at the
position where the current of ch1 or ch2 is 100%.
MOBSEL
MOB Output
L
Current of ch1 is +100% and current of ch2 is 0% (1 pulse/cycle).
Current of ch1 or ch2 is 100% (4 pulses/cycle).
H
RESET position
Ch 1 current
100
98.1
92.4
99.5
95.7
88.2
83.1
77.3
70.7
63.4
55.6
47.1
38.3
29.0
19.5
9.8
0
—9.8
—
19.5
29.0
—
—38.3
—47.1
—55.6
—
63.4
70.7
—
—
—
—
77.3
83.1
88.2
—92.4
—98.1
—100
—95.7
99.5
—
0
5
10
15
20
25
30
35
40
45
50
55
60
65
Ch 2 current
100
98.1
92.4
99.5
95.7
88.2
83.1
77.3
70.7
63.4
55.6
47.1
38.3
29.0
19.5
9.8
0
—9.8
—19.5
—29.0
—
38.3
47.1
—
—
55.6
63.4
—
—70.7
—
77.3
83.1
—
—
88.2
—
—
—
92.4
98.1
100
—95.7
99.5
—
0
5
10
15
20
25
30
35
40
45
50
55
60
65
MOB output MOBSEL = “L”
0
0
5
5
10
10
15
15
20
20
25
30
35
40
45
50
50
55
55
60
60
65
65
MOB output MOBSEL = “H”
25
30
35
40
45
13
Data Sheet S15840EJ2V0DS
µPD168110
ABSOLUTE MAXIMUM RATINGS
(TA = 25°C: GLASS EPOXY BOARD OF 100 mm × 100 mm × 1 mm WITH C OPPER FOIL OF 15%)
Parameter
Symbol
Conditions
Rating
−0.5 to +6.0
−0.5 to +6.0
−0.5 to VDD +0.5
6.2
Unit
Power supply voltage
VDD
Control block
Motor block
V
VM
Input voltage
VIN
V
V
Output pin voltage
VOUT
ID(DC)
ID(pulse)
PT
DC output current
DC
0.4
A/ch
A/ch
W
Instantaneous output current
Power consumption
Peak junction temperature
Storage temperature
PW < 10 ms, Duty 20%
0.7
0.7
TCH(MAX)
Tstg
150
°C
−55 to +150
°C
RECOMMENDED OPERATING CONDITIONS
(TA = 25°C: GLASS EPOXY BOARD OF 100 mm × 100 mm × 1 mm WITH COPPER FOIL OF 15%)
Parameter
Symbol
Conditions
MIN.
TYP.
MAX.
Unit
Power supply voltage
VDD
Control block
2.7
3.6
V
VM
Motor block
2.7
5.5
V
Input voltage
VIN
0
VDD
+0.35
+0.6
5
V
DC output current
ID(DC)
ID(pulse)
IMOB
TA
DC
−0.35
−0.6
A/ch
A/ch
mA
°C
Instantaneous output current
MOB pin output sink current
Operating temperature range
PW < 10 ms, Duty ≤ 20%
Open-drain output
−10
75
14
Data Sheet S15840EJ2V0DS
µPD168110
ELECTRICAL CHARACTERISTICS (UNLESS OTHERWISE SPECIFIED, VDD = VM = 3 V, TA = 25°C)
Parameter
Symbol
Conditions
External CLK stopped
External CLK stopped
External CLK is input
MIN.
TYP.
MAX.
Unit
VDD pin current after reset
VDD pin current in standby mode
IDD(STB)
1.0
µA
IDD(STB2)
IDD(STB3)
IDD(ACT)
30
µA
300
3.0
µA
VDD pin current during operation
VM pin current
mA
VM = 5.5 V per VM pin, after reset
and in standby mode
IM(OFF)
3.0
1.0
µA
High-level input current
Low-level input current
High-level input voltage
Low-level input voltage
Input hysteresis voltage
H bridge on-resistance
IIH
VIN = VDD
µA
µA
V
IIL
VIN = 0 V
−1.0
VIH
VIL
Vhys
2.7 V ≤ VDD ≤ 3.6 V
2.7 V ≤ VDD ≤ 3.6 V
0.7 x VDD
0.3 x VDD
2.0
V
0.3
V
IM = 0.35 A, sum of upper and
lower stages,
RON
Ω
FB1 = FB2 = 0 V
Output turn-on time
tON
RM = 20 Ω
OE pin ↑ → output SW time
0.02
0.02
450
0.5
0.5
µs
µs
Output turn-off time
tOFF
VREF
Internal reference voltage
Output detection ratio
500
550
mV
IM = 0.1 A, with 5 kΩ sense
resistor connected
950
1050
1150
Cautions 1. The undervoltage lockout detection circuit (UVLO) operates at 1.7 V TYP. whereupon the
output goes into a Hi-Z state. Internal data such as the excitation position information is
reset. The UVLO circuit does not operate after reset.
2. A shutdown circuit that prevents a current from flowing into the VM pin when VDD = 0 V is
provided.
15
Data Sheet S15840EJ2V0DS
µPD168110
PACKAGE DRAWING
24-PIN PLASTIC TSSOP (5.72 mm (225))
13
24
detail of lead end
F
G
R
P
L
S
12
1
E
H
I
A
J
A'
S
N
S
C
K
M
B
D
M
NOTE
ITEM MILLIMETERS
Each lead centerline is located within 0.10 mm of
its true position (T.P.) at maximum material condition.
A
A'
B
C
D
E
F
6.65 0.10
6.5 0.1
0.575
0.5 (T.P.)
0.22 0.05
0.1 0.05
1.2 MAX.
1.0 0.05
6.4 0.1
4.4 0.1
1.0 0.1
0.17 0.025
0.5
G
H
I
J
K
L
0.10
M
N
0.08
+5°
3°
P
−3°
R
S
0.25
0.6 0.15
P24MA-50-6A5
16
Data Sheet S15840EJ2V0DS
µPD168110
RECOMMENDED SOLDERING CONDITIONS
The µPD168110 should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Recommended Soldering Conditions for Surface Mounting Type
µPD168110MA-6A5 24pin TSSOP
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or
higher), Count: Three times or less, Exposure limit: None, Flux: Rosin flux with
low chlorine (0.2 Wt% or below) recommended
IR60-00-3
Caution Do not use different soldering methods together (except for partial heating).
17
Data Sheet S15840EJ2V0DS
µPD168110
•
The information in this document is current as of June, 2005. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or
data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all
products and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without the prior
written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may
appear in this document.
•
NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from the use of NEC Electronics products listed in this document
or any other liability arising from the use of such products. No license, express, implied or otherwise, is
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of a customer's equipment shall be done under the full
responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by
customers or third parties arising from the use of these circuits, software and information.
•
• While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products,
customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To
minimize risks of damage to property or injury (including death) to persons arising from defects in NEC
Electronics products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment and anti-failure features.
• NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and
"Specific".
The "Specific" quality grade applies only to NEC Electronics products developed based on a customer-
designated "quality assurance program" for a specific application. The recommended applications of an NEC
Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of
each NEC Electronics product before using it in a particular application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots.
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support).
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC
Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications
not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to
determine NEC Electronics' willingness to support a given application.
(Note)
(1)
"NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
majority-owned subsidiaries.
(2)
"NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).
M8E 02. 11-1
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