UF3006PT
ULTRAFAST RECOVERYRECTIFIERS
VOLTAGE
600 Volts
CURRENT 30 Amperes
FEATURES
0.640(16.25)
0.620(15.75)
0.199(5.05)
0.175(4.45)
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-O utilizing
Flame Retardant Epoxy Molding Compound
0.142(3.60)
0.125(3.20)
• Exceeds environmental standards of MIL-S-19500/228
• Low power loss, high efficiency
• Low forward voltage, high current capability
• High surge capacity
0.095(2.40)
0.087(2.20)
0.070(1.80)
0.126(3.20)
0.110(2.80)
0.050(1.25)
0.045(1.15)
• Ultra fast recovery times, high voltage
• Lead free in comply with EU RoHS 2002/95/EC directives
0.030(0.75)
0.017(0.45)
MECHANCAL DATA
0.225(5.70)
0.204(5.20)
0.225(5.70)
0.204(5.20)
• Case: TO-3P molded plastic
• Terminals: Lead solderable per MIL-STD-750, Method 2026
• Polarity: As marked.
• Standard packaging: Any
• Weight: 0.2245 ounces, 6.367 grams.
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
PARAMETER
SYMBOL
VRRM
VALUE
600
UNITS
Maximum Recurrent Peak Reverse Voltage
V
V
V
A
A
V
Maximum RMS Voltage
VRMS
VDC
IF(AV)
IFSM
VF
420
600
15
Maximum DC Blocking Voltage
Maximum Average Forward Current
per diode
per diode
per diode
Peak Forward Surge Current : 8.3ms single half sine-wave
superimposed on rated load (JEDEC method)
250
1.7
Maximum Forward Voltage at 15A
Maximum DC Reverse Current at Rated DC Blocking Voltage
per diode
IR
10
μA
Typical Junction Capacitance (Notes 1)
Maximum Reverse Recovery Time (Notes 2)
Typical Thermal Resistance (Notes 3)
CJ
trr
80
pF
ns
90
37
per diode
per diode
RθJA
RθJC
TJ,TSTG
OC / W
OC / W
OC
Typical Thermal Resistance (Notes 4)
2.5
Operating Junction and Storage Temperature Range
-55 to +150
NOTES :
1. Measured at 1 MHz and applied reverse voltage of 4.0 VDC.
2. Reverse Recovery Test Conditions: IF=0.5A, IR=1A, Irr=0.25A.
3. Mounted on minimum pad for each lead on board.
4. Mounted on infinite heatsink.
March 9,2012-REV.01
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