1337AG

更新时间:2025-03-22 08:28:17
品牌:RENESAS
描述:Real-Time Clock With I2C Serial Interface

1337AG 概述

Real-Time Clock With I2C Serial Interface

1337AG 数据手册

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REAL-TIME CLOCK WITH I2C SERIAL INTERFACE  
IDT1337AG  
General Description  
Features  
The IDT1337AG device is a low-power serial real-time clock  
(RTC) device with two programmable time-of-day alarms  
and a programmable square-wave output. Address and  
Real-Time Clock (RTC) counts seconds, minutes, hours,  
day, date, month, and year with leap-year compensation  
valid up to 2100  
2
data are transferred serially through an I C bus. The device  
Packaged in 8-pin MSOP, 8-pin SOIC, or 16-pin SOIC  
(surface-mount package with an integrated crystal)  
provides seconds, minutes, hours, day, date, month, and  
year information. The date at the end of the month is  
automatically adjusted for months with fewer than 31 days,  
including corrections for leap year. The clock operates in  
either the 24-hour or 12-hour format with AM/PM indicator.  
2
I C serial interface (Normal and Fast modes)  
Two time-of-day alarms  
Oscillator stop flag  
Applications  
Programmable square-wave output defaults to 32kHz on  
power-up  
Telecommunication (Routers, Switches, Servers)  
Handhelds (GPS, POS terminals, MP3 players)  
Set-Top Box, Digital Recording,  
Operating voltage of 1.8 to 5.5V  
Industrial temperature range (-40 to +85°C)  
Office (Fax/Printers, Copiers)  
Medical (Glucometer, Medicine Dispensers)  
Other (Thermostats, Vending Machines, Modems, Utility  
Meters, Digital Photo Frame devices)  
Block Diagram  
VCC  
Crystal inside package  
for 16-pin SOIC ONLY  
1 Hz/4.096 kHz/  
8.192 kHz/32.768 kHz  
X1  
SQW/INTB  
INTA  
MUX/  
Buffer  
32.768 kHz  
Oscillator and  
Divider  
X2  
Clock,  
Calendar  
Counter  
Control  
Logic  
SCL  
SDA  
I2C  
Interface  
Alarm  
Registers  
1 Byte 7 Bytes  
Control  
Buffer  
GND  
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Pin Assignment (8-pin MSOP/SOIC)  
X1  
X2  
8
7
6
5
1
2
3
4
VCC  
SQW/INTB  
SCL  
IDT1337AG  
INTA  
GND  
SDA  
Pin Assignment (16-pin SOIC)  
16  
15  
14  
13  
1
2
3
4
5
6
7
8
SCL  
SDA  
GND  
INTA  
NC  
SQW/INTB  
VCC  
NC  
IDT1337AG  
NC  
NC  
NC  
NC  
NC  
12  
11  
10  
9
NC  
NC  
NC  
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Pin Descriptions  
Pin Number  
Pin  
Pin Description/Function  
Name  
MSOP SOIC  
1
2
X1  
X2  
Connections for standard 32.768 kHz quartz crystal. The internal oscillator  
circuitry is designed for operation with a crystal having a specified load  
capacitance (CL) of 7 pF. An external 32.768 kHz oscillator can also drive the  
IDT1337AG. In this configuration, the X1 pin is connected to the external  
oscillator signal and the X2 pin is left floating.  
Interrupt output. When enabled, INTA is asserted low when the time/day/date  
matches the values set in the alarm registers. This pin is an open-drain output  
and requires an external pull-up resistor (10 ktypical).  
3
14  
INTA  
4
5
15  
16  
GND  
SDA  
Connect to ground. DC power is provided to the device on these pins.  
2
Serial data input/output. SDA is the input/output pin for the I C serial interface.  
The SDA pin is an open-drain output and requires an external pull-up resistor  
(2 ktypical).  
6
7
1
2
SCL  
Serial clock input. SCL is used to synchronize data movement on the serial  
interface. The SCL pin is an open-drain output and requires an external pull-up  
resistor (2 ktypical).  
Square-Wave/Interrupt output. Programmable square-wave or interrupt output  
signal. The SQW/INT pin is an open-drain output and requires an external  
pull-up resistor (10 ktypical). This pin can also function as an additional  
interrupt pin under certain conditions (see page 6 for details).  
SQW/INTB  
8
3
VCC  
NC  
Primary power supply. DC power is applied to this pin.  
4 - 13  
No connect. These pins are unused and must be connected to ground.  
2
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Typical Operating Circuit  
CRYSTAL  
VCC  
VCC  
VCC  
2k  
VCC  
10k  
2k  
10k  
X1  
X2  
SCL  
SQW/INTB  
CPU  
IDT1337AG  
INTA  
SDA  
GND  
Detailed Description  
Communications to and from the IDT1337AG occur serially  
over an I C bus. The IDT1337AG operates as a slave device  
Effective Load Capacitance  
2
Please see diagram below for effective load capacitance  
calculation. The effective load capacitance (CL) should  
match the recommended load capacitance of the crystal in  
order for the crystal to oscillate at its specified parallel  
resonant frequency with 0ppm frequency error.  
on the serial bus. Access is obtained by implementing a  
START condition and providing a device identification code,  
followed by data. Subsequent registers can be accessed  
sequentially until a STOP condition is executed. The device  
2
is fully accessible through the I C interface whenever VCC  
2
is between 5.5 V and 1.8 V. I C operation is not guaranteed  
when VCC is below 1.8 V. The IDT1337AG maintains the  
time and date when VCC is as low as 1.3 V.  
The following sections discuss in detail the Oscillator block,  
2
Clock/Calendar Register Block and Serial I C block.  
Oscillator Block  
Selection of the right crystal, correct load capacitance and  
careful PCB layout are important for a stable crystal  
oscillator. Due to the optimization for the lowest possible  
current in the design for these oscillators, losses caused by  
parasitic currents can have a significant impact on the  
overall oscillator performance. Extra care needs to be taken  
to maintain a certain quality and cleanliness of the PCB.  
Crystal Selection  
The key parameters when selecting a 32 kHz crystal to work  
with IDT1337AG RTC are:  
In the above figure, X1 and X2 are the crystal pins of our  
device. Cin1 and Cin2 are the internal capacitors which  
include the X1 and X2 pin capacitance. Cex1 and Cex2 are  
the external capacitors that are needed to tune the crystal  
frequency. Ct1 and Ct2 are the PCB trace capacitances  
between the crystal and the device pins. CS is the shunt  
capacitance of the crystal (as specified in the crystal  
manufacturer's datasheet or measured using a network  
analyzer).  
Recommended Load Capacitance  
Crystal Effective Series Resistance (ESR)  
Frequency Tolerance  
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Note: IDT1337AGCSRI integrates a standard 32.768 kHz  
crystal in the package and contributes an additional  
frequency error of 10ppm at nominal VCC (+3.3 V) and  
TA=+25°C.  
to the GND layer. This helps to keep noise generated by  
the oscillator circuit locally on this separated island. The  
ground connections for the load capacitors and the  
oscillator should be connected to this island.  
ESR (Effective Series Resistance)  
PCB Layout  
Choose the crystal with lower ESR. A low ESR helps the  
crystal to start up and stabilize to the correct output  
frequency faster compared to high ESR crystals.  
Frequency Tolerance  
The frequency tolerance for 32 kHz crystals should be  
specified at nominal temperature (+25°C) on the crystal  
manufacturer datasheet. The crystals used with IDT1337AG  
typically have a frequency tolerance of +/-20ppm at +25°C.  
1337AG  
Specifications for a typical 32 kHz crystal used with our  
device are shown in the table below.  
Parameter  
Nominal Freq.  
Symbol Min  
Typ Max Units  
PCB Assembly, Soldering and Cleaning  
Board-assembly production process and assembly quality  
can affect the performance of the 32kHz oscillator.  
Depending on the flux material used, the soldering process  
can leave critical residues on the PCB surface. High  
humidity and fast temperature cycles that cause humidity  
condensation on the printed circuit board can create  
process residuals. These process residuals cause the  
insulation of the sensitive oscillator signal lines towards  
each other and neighboring signals on the PCB to decrease.  
High humidity can lead to moisture condensation on the  
surface of the PCB and, together with process residuals,  
reduce the surface resistivity of the board. Flux residuals on  
the board can cause leakage current paths, especially in  
humid environments. Thorough PCB cleaning is therefore  
highly recommended in order to achieve maximum  
performance by removing flux residuals from the board after  
assembly. In general, reduction of losses in the oscillator  
circuit leads to better safety margin and reliability.  
fO  
ESR  
CL  
32.768  
kHz  
k  
pF  
Series Resistance  
Load Capacitance  
80  
7
PCB Design Consideration  
Signal traces between IDT device pins and the crystal  
must be kept as short as possible. This minimizes  
parasitic capacitance and sensitivity to crosstalk and  
EMI. Note that the trace capacitances play a role in the  
effective crystal load capacitance calculation.  
Data lines and frequently switching signal lines should be  
routed as far away from the crystal connections as  
possible. Crosstalk from these signals may disturb the  
oscillator signal.  
Reduce the parasitic capacitance between X1 and X2  
signals by routing them as far apart as possible.  
The oscillation loop current flows between the crystal and  
the load capacitors. This signal path (crystal to CL1 to  
CL2 to crystal) should be kept as short as possible and  
ideally be symmetric. The ground connections for both  
capacitors should be as close together as possible.  
Never route the ground connection between the  
capacitors all around the crystal, because this long  
ground trace is sensitive to crosstalk and EMI.  
To reduce the radiation / coupling from oscillator circuit,  
an isolated ground island on the GND layer could be  
made. This ground island can be connected at one point  
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Address Map  
Table 2 (Timekeeper Registers) shows the address map for the IDT1337AG registers. During a multibyte access, when the  
2
address pointer reaches the end of the register space (0Fh), it wraps around to location 00h. On an I C START, STOP, or  
address pointer incrementing to location 00h, the current time is transferred to a second set of registers. The time  
information is read from these secondary registers, while the clock may continue to run. This eliminates the need to re-read  
the registers in case of an update of the main registers during a read.  
Table 1. Timekeeper Registers  
Address  
00h  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
Function  
Seconds  
Minutes  
Range  
00 - 59  
00 - 59  
0
0
10 seconds  
10 minutes  
AM/PM  
Seconds  
01h  
Minutes  
Hour  
1 - 12 +  
AM/PM  
00 - 23  
02h  
0
12/24  
10 hour  
0
Hours  
10 hour  
03h  
04h  
05h  
0
0
0
0
0
0
0
Day  
Day  
Date  
1 - 7  
10 date  
Date  
01 - 31  
Century  
0
10 month  
Month  
Month/Century  
01 - 12 +  
Century  
06h  
07h  
10 year  
Year  
Year  
00 - 99  
00 - 59  
A1M1  
A1M2  
10 seconds  
Seconds  
Alarm 1  
Seconds  
08h  
09h  
10 minutes  
Minutes  
Alarm 1  
Minutes  
00 - 59  
AM/PM  
10 hour  
1 - 12 +  
AM/PM  
00 - 23  
A1M3  
12/24  
10 hour  
Hour  
Alarm 1 Hours  
Day,  
Date  
Alarm 1 Day  
Alarm 1 Date  
1 - 7  
1 - 31  
00 - 59  
0Ah  
0Bh  
A1M4  
A2M2  
DY/DT  
10 date  
10 minutes  
Minutes  
Alarm 2  
Minutes  
AM/PM  
10 hour  
1 - 12 +  
AM/PM  
00 - 23  
0Ch  
0Dh  
A2M3  
A2M4  
12/24  
10 hour  
Hour  
Alarm 2 Hours  
Day,  
Date  
Alarm 2 Day  
Alarm 2 Date  
Control  
1 - 7  
DY/DT  
10 date  
1 - 31  
0Eh  
0Fh  
EOSC  
OSF  
0
0
0
0
RS2  
0
RS1  
0
INTCN  
A2IE  
A2F  
A1IE  
A1F  
0
Status  
Note: Unless otherwise specified, the state of the registers are not defined when power is first applied or when VCC falls below the V  
min  
CCT  
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Clock and Calendar  
Alarms  
The time and calendar information is obtained by reading  
the appropriate register bytes. The RTC registers are  
illustrated in Table 1. The time and calendar are set or  
initialized by writing the appropriate register bytes. The  
contents of the time and calendar registers are in the  
binary-coded decimal (BCD) format.  
The IDT1337AG contains two time of day/date alarms.  
Alarm 1 can be set by writing to registers 07h to 0Ah. Alarm  
2 can be set by writing to registers 0Bh to 0Dh. The alarms  
can be programmed (by the INTCN bits of the Control  
Register) to operate in two different modes—each alarm  
can drive its own separate interrupt output or both alarms  
can drive a common interrupt output. Bit 7 of each of the  
time-of-day/date alarm registers are mask bits (Table 1).  
When all of the mask bits for each alarm are logic 0, an  
alarm only occurs when the values in the timekeeping  
registers 00h–06h match the values stored in the  
time-of-day/date alarm registers. The alarms can also be  
programmed to repeat every second, minute, hour, day, or  
date. Table 2 (Alarm Mask Bits table) shows the possible  
settings. Configurations not listed in the table result in  
illogical operation  
The day-of-week register increments at midnight. Values  
that correspond to the day of week are user-defined but  
must be sequential (i.e., if 1 equals Sunday, then 2 equals  
Monday, and so on). Illogical time and date entries result in  
undefined operation.  
When reading or writing the time and date registers,  
secondary (user) buffers are used to prevent errors when  
the internal registers update. When reading the time and  
date registers, the user buffers are synchronized to the  
internal registers on any start or stop and when the register  
pointer rolls over to zero.  
The DY/DT bits (bit 6 of the alarm day/date registers) control  
whether the alarm value stored in bits 0 to 5 of that register  
reflects the day of the week or the date of the month. If  
DY/DT is written to a logic 0, the alarm is the result of a  
match with date of the month. If DY/DT is written to a logic  
1, the alarm is the result of a match with day of the week.  
The countdown chain is reset whenever the seconds  
register is written. Write transfers occur on the acknowledge  
pulse from the device. To avoid rollover issues, once the  
countdown chain is reset, the remaining time and date  
registers must be written within 1 second. The 1Hz  
square-wave output, if enable, transitions high 500ms after  
the seconds data transfer, provided the oscillator is already  
running.  
When the RTC register values match alarm register  
settings, the corresponding Alarm Flag (‘A1F’ or ‘A2F’) bit is  
set to logic 1. If the corresponding Alarm Interrupt Enable  
(‘A1IE’ or ‘A2IE’) is also set to logic 1, the alarm condition  
activates one of the interrupt output (INTA or SQW/INTB)  
signals. The match is tested on the once-per-second update  
of the time and date registers.  
The IDT1337AG can be run in either 12-hour or 24-hour  
mode. Bit 6 of the hours register is defined as the 12- or  
24-hour mode-select bit. When high, the 12-hour mode is  
selected. In the 12-hour mode, bit 5 is the AM/PM bit with  
logic high being PM. In the 24-hour mode, bit 5 is the second  
10-hour bit (20–23 hours). All hours values, including the  
alarms, must be reinitialized whenever the 12/24-hour mode  
bit is changed. The century bit (bit 7 of the month register)  
is toggled when the years register overflows from 99–00.  
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Table 2. Alarm Mask Bits  
DY/DT Alarm 1 Register Mask Bits (Bit 7)  
Alarm Rate  
A1M4  
A1M3  
A1M2  
A1M1  
X
X
X
X
0
1
1
1
1
0
0
1
1
1
0
0
0
1
1
0
0
0
0
1
0
0
0
0
0
Alarm once per second.  
Alarm when seconds match.  
Alarm when minutes and seconds match.  
Alarm when hours, minutes, and seconds match.  
Alarm when date, hours, minutes, and seconds match.  
Alarm when day, hours, minutes, and seconds match.  
1
DY/DT Alarm 2 Register Mask Bits (Bit 7)  
Alarm Rate  
A2M4  
A2M3  
A2M2  
X
X
X
0
1
1
1
0
0
1
1
0
0
0
1
0
0
0
0
Alarm once per minute (00 seconds of every minute).  
Alarm when minutes match.  
Alarm when hours and minutes match.  
Alarm when date, hours, and minutes match.  
Alarm when day, hours, and minutes match.  
1
Special-Purpose Registers  
The IDT1337AG has two additional registers (control and status) that control the RTC, alarms, and square-wave output.  
Control Register (0Eh)  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
EOSC  
0
0
RS2  
RS1  
INTCN  
A2IE  
A1IE  
Bit 7: Enable Oscillator (EOSC). This active-low bit when set to logic 0 starts the oscillator. When this bit is set to  
a logic 1, the oscillator is stopped. This bit is enabled (logic 0) when power is first applied.  
Bits 4 and 3: Rate Select (RS2 and RS1). These bits control the frequency of the square-wave output when the  
square wave has been enabled. Table 3 shows the square-wave frequencies that can be selected with the RS bits.  
These bits are both set to logic 1 (32 kHz) when power is first applied.  
Table 3. SQW/INT Output  
INTCN  
RS2  
RS1  
SQW/INTB Output  
1 Hz  
A2IE  
0
0
0
0
1
0
0
1
1
X
0
1
0
1
X
X
X
X
X
1
4.096 kHz  
8.192 kHz  
32.768 kHz  
A2F  
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Bit 2: Interrupt Control (INTCN). This bit controls the relationship between the two alarms and the interrupt output  
pins. When the INTCN bit is set to logic 1, a match between the timekeeping registers and the alarm 1 registers  
activate the INTA pin (provided that the alarm is enabled) and a match between the timekeeping registers and the  
alarm 2 registers activates the SQW/INTB pin (provided that the alarm is enabled). When the INTCN bit is set to  
logic 0, a square wave is output on the SQW/INTB pin.This bit is set to logic 0 when power is first applied.  
Bit 1: Alarm 2 Interrupt Enable (A2IE). When set to a logic 1, this bit permits the Alarm 2 Flag (A2F) bit in the  
status register to assert INTA (when INTCN = 0) or to assert SQW/INTB (when INTCN = 1). When the A2IE bit is  
set to logic 0, the A2F bit does not initiate an interrupt signal. The A2IE bit is disabled (logic 0) when power is first  
applied.  
Bit 0: Alarm 1 Interrupt Enable (A1IE). When set to logic 1, this bit permits the Alarm 1 Flag (A1F) bit in the status  
register to assert INTA. When the A1IE bit is set to logic 0, the A1F bit does not initiate the INTA signal. The A1IE  
bit is disabled (logic 0) when power is first applied.  
Table 4. Alarm/Interrupt Table  
Bit 2  
Bit 1  
Bit 0  
INTCN  
A2IE  
A1IE  
Alarm 1  
None  
INTA  
Alarm 2  
None  
None  
INTA  
INTA  
INTB/SQW  
SQW  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
Hi  
Alarm 1  
Alarm 2  
Alarm 1 or Alarm 2  
Hi  
SQW  
None  
INTA  
SQW  
INTA  
SQW  
None  
INTA  
None  
None  
INTB  
Hi  
Alarm 1  
Hi  
Hi  
None  
INTA  
Alarm 2  
Alarm 2  
INTB  
Alarm 1  
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Status Register (0Fh)  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
OSF  
0
0
0
0
0
A2F  
A1F  
Bit 7: Oscillator Stop Flag (OSF). A logic 1 in this bit indicates that the oscillator either is stopped or was stopped  
for some period of time and may be used to judge the validity of the clock and calendar data. This bit is set to logic  
1 anytime the oscillator stops. The following are examples of conditions that can cause the OSF bit to be set:  
1) The first time power is applied.  
2) The voltage present on VCC is insufficient to support oscillation.  
3) The EOSC bit is turned off.  
4) External influences on the crystal (e.g., noise, leakage, etc.).  
This bit remains at logic 1 until written to logic 0. This bit can only be written to a logic 0.  
Bit 1: Alarm 2 Flag (A2F). A logic 1 in the alarm 2 flag bit indicates that the time matched the alarm 2 registers.  
This flag can be used to generate an interrupt on either INTA or SQW/INTB depending on the status of the INTCN  
bit in the control register. If the INTCN bit is set to logic 0 and A2F is at logic 1 (and A2IE bit is also logic 1), the INTA  
pin goes low. If the INTCN bit is set to logic 1 and A2F is logic 1 (and A2IE bit is also logic 1), the SQW/INTB pin  
goes low. A2F is cleared when written to logic 0. This bit can only be written to logic 0. Attempting to write to logic 1  
leaves the value unchanged.  
Bit 0: Alarm 1 Flag (A1F). A logic 1 in the Alarm 1 Flag bit indicates that the time matched the alarm 1 registers. If  
the A1IE bit is also a logic 1, the INTA pin goes low. A1F is cleared when written to logic 0. This bit can only be  
written to logic 0. Attempting to write to logic 1 leaves the value unchanged.  
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acknowledges with a ninth bit.  
I C Serial Data Bus  
2
The IDT1337AG supports the I C bus protocol. A device  
that sends data onto the bus is defined as a transmitter and  
a device receiving data as a receiver. The device that  
controls the message is called a master. The devices that  
are controlled by the master are referred to as slaves. A  
master device that generates the serial clock (SCL),  
controls the bus access, and generates the START and  
STOP conditions must control the bus. The IDT1337AG  
Acknowledge: Each receiving device, when addressed, is  
obliged to generate an acknowledge after the reception of  
each byte. The master device must generate an extra clock  
pulse that is associated with this acknowledge bit.  
A device that acknowledges must pull down the SDA line  
during the acknowledge clock pulse in such a way that the  
SDA line is stable LOW during the HIGH period of the  
acknowledge related clock pulse. Of course, setup and hold  
times must be taken into account. A master must signal an  
end of data to the slave by not generating an acknowledge  
bit on the last byte that has been clocked out of the slave. In  
this case, the slave must leave the data line HIGH to enable  
the master to generate the STOP condition.  
2
operates as a slave on the I C bus. Within the bus  
specifications, a standard mode (100 kHz maximum clock  
rate) and a fast mode (400 kHz maximum clock rate) are  
defined. The IDT1337AG works in both modes.  
Connections to the bus are made via the open-drain I/O  
lines SDA and SCL.  
The following bus protocol has been defined (see the “Data  
2
Transfer on I C Serial Bus” figure):  
Data transfer may be initiated only when the bus is not  
busy.  
During data transfer, the data line must remain stable  
whenever the clock line is HIGH. Changes in the data line  
while the clock line is HIGH are interpreted as control  
signals.  
Accordingly, the followingbusconditions have been defined:  
Bus not busy: Both data and clock lines remain HIGH.  
Start data transfer: A change in the state of the data line,  
from HIGH to LOW, while the clock is HIGH, defines a  
START condition.  
Stop data transfer: A change in the state of the data line,  
from LOW to HIGH, while the clock line is HIGH, defines the  
STOP condition.  
Data valid: The state of the data line represents valid data  
when, after a START condition, the data line is stable for the  
duration of the HIGH period of the clock signal. The data on  
the line must be changed during the LOW period of the clock  
signal. There is one clock pulse per bit of data.  
Each data transfer is initiated with a START condition and  
terminated with a STOP condition. The number of data  
bytes transferred between START and STOP conditions are  
not limited, and are determined by the master device. The  
information is transferred byte-wise and each receiver  
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2
Data Transfer on I C Serial Bus  
Depending upon the state of the R/W bit, two types of data  
transfer are possible:  
1101000, followed by the direction bit (R/W), which is 0 for a  
write. After receiving and decoding the slave address byte  
the device outputs an acknowledge on the SDA line. After  
the IDT1337AG acknowledges the slave address + write bit,  
the master transmits a register address to the IDT1337AG.  
This sets the register pointer on the IDT1337AG. The  
master may then transmit zero or more bytes of data, with  
the IDT1337AG acknowledging each byte received. The  
address pointer increments after each data byte is  
transferred. The master generates a STOP condition to  
terminate the data write.  
1) Data transfer from a master transmitter to a slave  
receiver. The first byte transmitted by the master is the  
slave address. Next follows a number of data bytes. The  
slave returns an acknowledge bit after each received byte.  
Data is transferred with the most significant bit (MSB) first.  
2) Data transfer from a slave transmitter to a master  
receiver. The first byte (the slave address) is transmitted by  
the master. The slave then returns an acknowledge bit,  
followed by the slave transmitting a number of data bytes.  
The master returns an acknowledge bit after all received  
bytes other than the last byte. At the end of the last received  
byte, a “not acknowledge” is returned. The master device  
generates all of the serial clock pulses and the START and  
STOP conditions. A transfer is ended with a STOP condition  
or with a repeated START condition. Since a repeated  
START condition is also the beginning of the next serial  
transfer, the bus is not released. Data is transferred with the  
most significant bit (MSB) first.  
2) Slave Transmitter Mode (Read Mode): The first byte is  
received and handled as in the slave receiver mode.  
However, in this mode, the direction bit indicates that the  
transfer direction is reversed. Serial data is transmitted on  
SDA by the IDT1337AG while the serial clock is input on  
SCL. START and STOP conditions are recognized as the  
beginning and end of a serial transfer (see the “Data Read–  
Slave Transmitter Mode” figure). The slave address byte is  
the first byte received after the START condition is  
generated by the master. The slave address byte contains  
the 7-bit IDT1337AG address, which is 1101000, followed  
by the direction bit (R/W), which is 1 for a read. After  
receiving and decoding the slave address byte the slave  
outputs an acknowledge on the SDA line. The IDT1337AG  
then begins to transmit data starting with the register  
address pointed to by the register pointer. If the register  
pointer is not written to before the initiation of a read mode  
the first address that is read is the last one stored in the  
register pointer. The IDT1337AG must receive a “not  
acknowledge” to end a read.  
The IDT1337AG can operate in the following two modes:  
1) Slave Receiver Mode (Write Mode): Serial data and  
clock are received through SDA and SCL. After each byte is  
received an acknowledge bit is transmitted. START and  
STOP conditions are recognized as the beginning and end  
of a serial transfer. Address recognition is performed by  
hardware after reception of the slave address and direction  
bit (see the “Data Write–Slave Receiver Mode” figure). The  
slave address byte is the first byte received after the START  
condition is generated by the master. The slave address  
byte contains the 7-bit IDT1337AG address, which is  
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Data Write – Slave Receiver Mode  
Data Read (from current Pointer location) – Slave Transmitter Mode  
Data Read (Write Pointer, then Read) – Slave Receive and Transmit  
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Handling, PCB Layout, and Assembly  
The IDT1337AG package contains a quartz tuning-fork crystal. Pick-and-place equipment may be used, but precautions  
should be taken to ensure that excessive shocks are avoided. Ultrasonic cleaning equipment should be avoided to prevent  
damage to the crystal.  
Avoid running signal traces under the package, unless a ground plane is placed between the package and the signal line.  
All NC (no connect) pins must be connected to ground.  
Moisture-sensitive packages are shipped from the factory dry-packed. Handling instructions listed on the package label must  
be followed to prevent damage during reflow. Refer to the IPC/JEDEC J-STD-020 standard for moisture-sensitive device  
(MSD) classifications.  
Absolute Maximum Ratings  
Stresses above the ratings listed below can cause permanent damage to the IDT1337AG. These ratings, which are  
standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these or any  
other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute  
maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only  
over the recommended operating temperature range.  
Item  
Voltage Range (on any pin relative to ground)  
Storage Temperature  
Rating  
-0.3 V to +6.0 V  
-55 to +125C  
260C  
Soldering Temperature  
Ambient Operating Temperature (industrial)  
-40 to +85°C  
Recommended DC Operating Conditions  
Parameter  
Symbol  
Conditions  
Full operation  
Timekeeping  
Min.  
1.8  
Typ.  
Max.  
5.5  
Units  
VCC Supply Voltage  
V
3.3  
V
V
CC  
V
1.3  
1.8  
CCT  
Ambient Operating Temperature (industrial)  
Logic 1  
T
-40  
+85  
C  
V
A
V
SCL, SDA  
0.8VCC  
VCC + 0.3  
5.5  
IH  
INTA, SQW/INTB  
Logic 0  
V
-0.3  
+0.3VCC  
V
IL  
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DC Electrical Characteristics  
Unless stated otherwise, VCC = 1.8 V to 5.5 V, Ambient Temp. -40 to +85C, Note 1  
Parameter  
Symbol  
Conditions  
Min.  
-1  
Typ.  
Max. Units  
Input Leakage  
I
Note 2  
+1  
+1  
3
µA  
µA  
LI  
I/O Leakage  
I
I
Note 3  
Note 3  
-1  
LO  
OL  
Logic 0 Output  
VOL = 0.4 V  
mA  
Active Supply Current  
Standby Current  
I
I
Note 4  
5
150  
1.5  
µA  
µA  
CCA  
Notes 5, 6  
CCS  
DC Electrical Characteristics  
Unless stated otherwise, VCC = 1.3 V to 1.8 V, Ambient Temp. -40 to +85C (industrial), Note 1  
Parameter  
Symbol  
Conditions  
Min.  
Typ.  
Max.  
Units  
Timekeeper Current (Oscillator  
Enabled)  
I
Notes 5, 7, 8, 9  
725  
900  
nA  
CCTOSC  
Data-Retention Current (Oscillator  
Disabled)  
I
Notes 5, 9  
300  
nA  
CCTDDR  
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AC Electrical Characteristics  
Unless stated otherwise, VCC = 1.8 V to 5.5 V, Ambient Temp. -40 to +85C, Note 1  
Parameter  
Symbol  
Conditions  
Fast Mode  
Min.  
100  
0
Typ. Max. Units  
SCL Clock Frequency  
f
400  
100  
kHz  
µs  
µs  
µs  
µs  
µs  
µs  
ns  
ns  
ns  
µs  
pF  
SCL  
Standard Mode  
Fast Mode  
Bus Free Time Between a STOP and  
START Condition  
t
1.3  
BUF  
Standard Mode  
Fast Mode  
4.7  
Hold Time (Repeated) START  
Condition, Note 10  
t
0.6  
HD:STA  
Standard Mode  
Fast Mode  
4.0  
Low Period of SCL Clock  
High Period of SCL Clock  
t
1.3  
LOW  
Standard Mode  
Fast Mode  
4.7  
t
0.6  
HIGH  
Standard Mode  
Fast Mode  
4.0  
Setup Time for a Repeated START  
Condition  
t
0.6  
SU:STA  
Standard Mode  
Fast Mode  
4.7  
Data Hold Time, Notes 11, 12  
Data Setup Time, Note 13  
t
0
0.9  
HD:DAT  
Standard Mode  
Fast Mode  
0
t
100  
250  
20 + 0.1C  
SU:DAT  
Standard Mode  
Fast Mode  
Rise Time of Both SDA and SCL  
Signals, Note 14  
t
300  
1000  
300  
R
B
B
Standard Mode  
Fast Mode  
Fall Time of Both SDA and SCL Signals,  
Note 14  
t
20 + 0.1C  
F
Standard Mode  
Fast Mode  
300  
Setup Time for STOP Condition  
t
0.6  
4.0  
SU:STO  
Standard Mode  
Capacitive Load for Each Bus Line,  
Note 14  
C
400  
B
I/O Capacitance (SDA, SCL)  
C
Note 15  
10  
10  
pF  
I/O  
32.768 kHz Clock Accuracy with  
External Crystal  
TA=25°C  
VCC=3.3 V  
ppm  
32.768 kHz Clock Accuracy with  
Internal Crystal  
TA=25°C  
30  
ppm  
VCC=3.3 V  
(crystal accuracy  
20ppm)  
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Note 1: Limits at -40°C are guaranteed by design and are not production tested.  
Note 2: SCL only.  
Note 3: SDA, INTA, and SQW/INTB.  
Note 4: I  
—SCL clocking at maximum frequency = 400 kHz, VIL = 0.0V, VIH = VCC.  
CCA  
2
Note 5: Specified with the I C bus inactive, VIL = 0.0V, VIH = VCC.  
Note 6: SQW enabled.  
Note 7: Specified with the SQW function disabled by setting INTCN = 1.  
Note 8: Using recommended crystal on X1 and X2.  
Note 9: The device is fully accessible when 1.8 < VCC < 5.5 V. Time and date are maintained when 1.3 V < VCC <  
1.8 V.  
Note 10: After this period, the first clock pulse is generated.  
Note 11: A device must internally provide a hold time of at least 300 ns for the SDA signal (referred to the V  
of  
IHMIN  
the SCL signal) to bridge the undefined region of the falling edge of SCL.  
Note 12: The maximum t  
need only be met if the device does not stretch the LOW period (t  
) of the SCL  
LOW  
HD:DAT  
signal.  
Note 13: A fast-mode device can be used in a standard-mode system, but the requirement t  
> to 250 ns must  
SU:DAT  
then be met. This is automatically the case if the device does not stretch the LOW period of the SCL signal. If such  
a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line t  
+
R(MAX)  
t
= 1000 + 250 = 1250 ns before the SCL line is released.  
SU:DAT  
Note 14: C —total capacitance of one bus line in pF.  
B
Note 15: Guaranteed by design. Not production tested.  
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Timing Diagram  
Typical Operating Characteristics  
Icc vs Vcc  
IccA vs Vcc  
900  
800  
700  
600  
500  
400  
300  
200  
10  
8
6
INTCN=1  
INTCN=0  
ICCA  
4
2
0
1.3  
2.3  
3.3  
4.3  
5.3  
1.3  
2.3  
3.3  
4.3  
5.3  
Vcc (V)  
Vcc (V)  
Oscillator Frequency vs Vcc  
(as measured on one IDT1337C sample)  
Icc vs Temperature  
32768.4  
32768.38  
32768.36  
32768.34  
32768.32  
32768.3  
800  
700  
600  
500  
400  
300  
200  
INTCN=1  
INTCN=0  
Freq  
1.3  
2.3  
3.3  
4.3  
5.3  
-40  
-20  
0
20  
40  
60  
80  
Vcc(V)  
Temperature (C)  
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Thermal Characteristics for 8SOIC  
Parameter  
Symbol  
Conditions  
Min.  
Typ. Max. Units  
Thermal Resistance Junction to  
Ambient  
Still air  
150  
140  
120  
40  
C/W  
C/W  
C/W  
C/W  
JA  
JA  
JA  
JC  
1 m/s air flow  
3 m/s air flow  
Thermal Resistance Junction to Case  
Thermal Characteristics for 8MSOP  
Parameter  
Symbol  
Conditions  
Min.  
Min.  
Typ. Max. Units  
Thermal Resistance Junction to  
Ambient  
Still air  
95  
C/W  
JA  
Thermal Resistance Junction to Case  
48  
C/W  
JC  
Thermal Characteristics for 16SOIC  
Parameter  
Symbol  
Conditions  
Typ. Max. Units  
Thermal Resistance Junction to  
Ambient  
Still air  
120  
115  
105  
58  
C/W  
C/W  
C/W  
C/W  
JA  
JA  
JA  
JC  
1 m/s air flow  
3 m/s air flow  
Thermal Resistance Junction to Case  
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Marking Diagram (8 MSOP)  
Marking Diagram (8 SOIC)  
8
5
37AI  
YYWW$  
IDT  
1337AG  
DCGI  
YYWW$  
Marking Diagram (16 SOIC)  
16  
9
1
4
IDT  
1337AGC  
SRGI  
YYWW**$  
1
8
Notes:  
1. # = product stepping.  
2. $ = mark code.  
3. ** = sequential lot code.  
4. YYWW is the last two digits of the year and week that the part was assembled.  
5. “XXX” = traceability (lot code).  
6. “G” denotes RoHS compliant package.  
7. “I” denotes industrial grade.  
8. Bottom marking: country of origin if not USA.  
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Package Outline and Package Dimensions (8-pin SOIC, 150 Mil. Body)  
Package dimensions are kept current with JEDEC Publication No. 95  
Millimeters  
Inches  
8
Symbol  
Min  
1.35  
0.10  
0.33  
0.19  
4.80  
3.80  
Max  
1.75  
0.25  
0.51  
0.25  
5.00  
4.00  
Min  
Max  
A
A1  
B
C
D
E
e
.0532  
.0040  
.013  
.0075  
.1890  
.1497  
.0688  
.0098  
.020  
.0098  
.1968  
.1574  
E
H
INDEX  
AREA  
1.27 BASIC  
0.050 BASIC  
1
2
H
h
L
5.80  
0.25  
0.40  
0  
6.20  
0.50  
1.27  
8  
.2284  
.010  
.016  
0  
.2440  
.020  
.050  
8  
D
A
h x 45  
A1  
C
- C -  
e
SEATING  
PLANE  
B
L
.10 (.004)  
C
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Package Outline and Package Dimensions (8-pin MSOP, 3.00 mm Body)  
Package dimensions are kept current with JEDEC Publication No. 95  
Millimeters  
Min Max  
Inches*  
8
Symbol  
Min  
Max  
A
A1  
A2  
b
--  
1.10  
0.15  
0.97  
0.38  
0.23  
--  
0.043  
0.006  
0.038  
0.015  
0.009  
0
0
0.79  
0.22  
0.08  
0.031  
0.008  
0.003  
E1  
E
INDEX  
AREA  
C
D
E
3.00 BASIC  
4.90 BASIC  
3.00 BASIC  
0.65 Basic  
0.118 BASIC  
0.193 BASIC  
0.118 BASIC  
0.0256 Basic  
E1  
e
1
2
L
0.40  
0.80  
8  
0.016  
0.032  
8  
D
0  
0  
aaa  
-
0.10  
-
0.004  
*For reference only. Controlling dimensions in mm.  
A
2
A
A
1
c
- C -  
e
SEATING  
PLANE  
b
L
aaa  
C
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Package Outline and Package Dimensions (16-pin SOIC, 300 mil Body)  
Package dimensions are kept current with JEDEC Publication No. 95  
Millimeters  
Inches*  
Min Max  
16  
Symbol  
Min  
--  
Max  
2.65  
--  
2.55  
0.51  
0.32  
10.50  
10.65  
7.60  
A
A1  
A2  
b
--  
0.104  
--  
0.10  
2.05  
0.33  
0.18  
10.10  
10.00  
7.40  
0.0040  
0.081  
0.013  
0.007  
0.397  
0.394  
0.291  
0.100  
0.020  
0.013  
0.413  
0.419  
0.299  
E1  
E
INDEX  
AREA  
c
D
E
1 2  
E1  
e
L
1.27 Basic  
0.050 Basic  
D
0.40  
0  
1.27  
8  
0.016  
0.050  
8  
0  
aaa  
-
0.10  
-
0.004  
*For reference only. Controlling dimensions in mm.  
A
2
A
A
1
c
- C -  
e
SEATING  
PLANE  
b
L
aaa  
C
2
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Ordering Information  
Part / Order Number  
1337AGDVGI  
Markings  
see page 20  
Shipping Packaging  
Tubes  
Package  
8-pin MSOP  
8-pin MSOP  
16-pin SOIC  
16-pin SOIC  
8-pin SOIC  
8-pin SOIC  
Temperature  
-40 to +85C  
-40 to +85C  
-40 to +85C  
-40 to +85C  
-40 to +85C  
-40 to +85C  
1337AGDVGI8  
1337AGCSRGI  
1337AGCSRGI8  
1337AGDCGI  
Tape and Reel  
Tubes  
Tape and Reel  
Tubes  
1337AGDCGI8  
Tape and Reel  
The 1337AGC packages are RoHS compliant. Packages without the integrated crystal are Pb-free; packages that include the  
integrated crystal (as designated with a “C” before the two-letter package code) may include lead that is exempt under RoHS  
requirements. The lead finish is JESD91 category e3.  
While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes  
no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No  
other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications  
such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not  
recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT  
does not authorize or warrant any IDT product for use in life support devices or critical medical instruments.  
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Revision History  
Rev.  
Date  
Originator Description of Change  
A
B
08/02/13  
10/31/13  
J. Chao  
J. Chao  
Initial release  
1. Update Alarm/Interrupt table.  
2. Update Bit2 and Bit descriptions.  
C
D
01/15/14  
07/14/17  
J. Chao  
C. Chen  
Removed all references to VFQFPN (16NLG) package.  
Updated marking diagram for 8MSOP.  
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IMPORTANT NOTICE AND DISCLAIMER  
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OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS OR IMPLIED,  
INCLUDING, WITHOUT LIMITATION, ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A  
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1337AG 相关器件

型号 制造商 描述 价格 文档
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1337B2 ETC Peripheral IC 获取价格
1337C-100K ABRACON General Purpose Inductor, 10uH, 10%, 1 Element 获取价格
1337C-120K ABRACON General Purpose Inductor, 12uH, 10%, 1 Element 获取价格
1337C-151K ABRACON General Purpose Inductor, 150uH, 10%, 1 Element 获取价格
1337C-1R0K ABRACON General Purpose Inductor, 1uH, 10%, 1 Element 获取价格
1337C-1R2K ABRACON General Purpose Inductor, 1.2uH, 10%, 1 Element 获取价格
1337C-1R5K ABRACON General Purpose Inductor, 1.5uH, 10%, 1 Element 获取价格
1337C-1R8K ABRACON General Purpose Inductor, 1.8uH, 10%, 1 Element 获取价格

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