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U2352B-XFP

更新时间：2025-06-29 13:11:20
品牌：TEMIC
描述：Brush DC Motor Controller, BIPolar, PDSO8, SO-8

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U2352B-XFP 概述

Brush DC Motor Controller, BIPolar, PDSO8, SO-8 运动控制电子器件

U2352B-XFP 规格参数

生命周期：Transferred包装说明：SO-8
Reach Compliance Code：unknown风险等级：5.62
模拟集成电路 - 其他类型：BRUSH DC MOTOR CONTROLLERJESD-30 代码：R-PDSO-G8
功能数量：1端子数量：8
最高工作温度：100 °C最低工作温度：-10 °C
封装主体材料：PLASTIC/EPOXY封装代码：SOP
封装形状：RECTANGULAR封装形式：SMALL OUTLINE
认证状态：Not Qualified最大供电电压 (Vsup)：7.2 V
最小供电电压 (Vsup)：6.4 V标称供电电压 (Vsup)：6 V
表面贴装：YES技术：BIPOLAR
温度等级：OTHER端子形式：GULL WING
端子位置：DUALBase Number Matches：1

U2352B-XFP 数据手册

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U2352B  
PWM Power Control for DC Loads  
Description  
The U2352B bipolar circuit is a PWM device for control- gives the option of measuring the load current via the  
ling logic level Power MOSFETs and IGBTs. It allows MOS transistor’s on-state resistance, R  
simple power control for dc loads. Integrated load current shunt resistor.  
monitoring with adjustable switch-off threshold also  
, or via a  
DS(on)  
Special Features  
Applications  
Battery-operated screwdrivers  
Battery-operated machine tools  
Halogen lamp controllers  
Dimmers  
Pulse width control up to 50 kHz clock frequency  
Load current monitoring via the on-state resistance,  
R , of the FET or via shunt resistor (optional)  
DS(on)  
100 mA push-pull output stage  
Voltage monitoring  
Electronic fuses  
Temperature-compensated supply voltage limitation  
Chip temperature monitoring  
High-performance clock generators  
Package: DIP8, SO8  
V
S
2 x I  
Reference  
voltage  
Chip  
temperature  
monitoring  
140°C  
S
1
Oscillator  
8
Voltage  
limitation 6.8 V  
1
2
V
S
I
–
Output stage  
logic  
7
6
K1  
+
Push-pull  
output stage  
Time window  
current measurement  
Q
S
Q
R
GND  
3
4
–
K2  
+
Load current  
monitoring  
POR  
5
S
2
95 9670  
Figure 1. Block diagram  
TELEFUNKEN Semiconductors  
1 (8)  
Rev. A1, 29-May-96  
U2352B  
Figure 2. Block diagram with typical circuit  
2 (8)  
TELEFUNKEN Semiconductors  
Rev. A1, 29-May-96  
U2352B  
Pin Description  
Pin  
1
Symbol  
Osc  
Function  
1
2
3
4
8
7
6
5
Osc  
V
S
Oscillator  
2
V
Contr  
Control voltage input  
V
Output  
GND  
3
I
Setpoint value current  
monitoring  
Contr  
Set  
4
5
6
7
8
S OUT Output, current switch S  
2 2  
I
Set  
S IN  
2
Input, current switch S  
Ground  
2
GND  
S OUT  
S IN  
2
Output  
Output  
2
V
S
Supply voltage  
95 9701  
Supply, Pin 8  
Pulse Width Control, Pins 1 and 2  
Internal voltage limitation in the U2352B allows a simple  
At the frequency-determining capacitor, C , at Pin 1,  
switching over of two internal current sources gives rise  
osc  
supply via a series resistor R . This enables operation of  
1
the circuit under different operating voltages. Supply  
to a triangular voltage which comparator, K , compares  
1
voltage between Pin 8 (V ) and Pin 6 (GND) builds up via  
S
with the control voltage at Pin 2. If the voltage, V , is  
1
R and is smoothed by C .  
1
1
more negative than the control voltage V , the output  
2
stage is switched on via the output stage logic. When C  
is charged, the whole process then runs in reverse order  
(see figure 3).  
osc  
The series resistor R is calculated as follows:  
1
VBmin VSmax  
R1max  
Itot  
Load Current Monitoring, Pins 3, 4, 5  
where  
Load current can be measured with the aid of an external  
shunt resistor, but this is only appropriate for decreased  
loads due to additional power loss and component size  
and costs. This involves the shunt voltage being fed  
directly to Pin 4 via a protective resistor (see figure 5).  
V
V
= Minimum operating voltage  
= Maximum supply voltage  
Bmin  
Smax  
I
I
I
= I + I  
Smax X  
tot  
= Maximum current consumption of the IS  
= Current consumption of the external elements  
Smax  
X
In order to save component costs and additional power  
loss, the integrated load current monitoring allows the  
load current to be directly measured via the voltage drop  
Various thresholds are derived from an internal reference  
voltage source.  
at the on-state resistance, R  
, of the FET, without an  
DS(on)  
Voltage Monitoring  
additional shunt resistor. The drain voltage of the FET is  
supplied via an external protective resistor to Pin 5.  
During the off-state of the FET, a diode clamp circuit  
protects the detection input, Pin 5. In the on state, the load  
During build-up and reduction of the operating voltage,  
uncontrolled output pulses with excessively low ampli-  
tude are suppressed by the internal monitoring circuit. All  
latches are reset and the output of the load current detec-  
tion Pin 4 is switched to ground.  
current flowing through the FET generates  
a
corresponding voltage drop at its R  
, which is in turn  
DS(on)  
converted into a current at Pin 5 by the protective resistor.  
This current reaches the integration element at Pin 4 via  
the switch S , which is only closed in the on-state of the  
FET. If the voltage at Pin 4 exceeds the setpoint value set  
at Pin 3, as a result of a high load current, the shutdown  
latch is set and the output stage is blocked. To enable the  
circuit again, it is necessary to switch the operating  
voltage off and then back on again.  
Chip Temperature Monitoring  
2
U2352B has integrated chip temperature monitoring  
which switches off the output stage when a temperature  
of approximately 140°C is reached. The device is not  
enabled again until cooling has taken place and the supply  
voltage has been switched off and then back on again.  
Switch-off behavior is adjusted with the resistors at Pin 4  
and Pin 5 and also with the capacitor at Pin 4.  
TELEFUNKEN Semiconductors  
3 (8)  
Rev. A1, 29-May-96  
U2352B  
A time space, t, must be observed between switching the time window, the control voltage V is reduced internally  
2
output stage off and on and switching S (current about  
V = approximately 300 mV and the resulting  
2
2
measurement enable switch) in order to avoid incorrect voltage, V *, is compared with the triangular voltage, V  
2
1
measurement and incorrect switching-off. To create this (see figure 3).  
95 9672  
V
0.6  
0.3  
V
S
V
1
V
2
V
2
V *  
2
V
S
V
7
S
2
closed  
open  
t
t
t
Figure 3. Signal characteristics of pulse width control with time window generation  
Absolute Maximum Ratings  
Reference point Pin 6, unless otherwise specified  
Parameters  
Symbol  
Value  
Unit  
mA  
Power supply  
current  
Pin 8  
Pin 8  
I
40  
400  
S
S
t < 10 s  
i
Push-pull output stage  
Output current  
t < 2 ms  
Pin 7  
Pin 7  
±I  
±i  
20  
100  
mA  
mA  
O
O
Input currents  
Pins 4 and 5  
Pins 1 and 3  
±I  
10  
2
I
I
I
Input voltages  
Pins 1, 2 and 3  
V
I
0 to V  
V
8
Storage temperature range  
Junction temperature  
Ambient temperature  
T
–40 to +125  
+125  
°C  
°C  
°C  
stg  
T
j
T
amb  
–10 to +100  
Thermal Resistance  
Parameters  
Symbol  
Maximum  
Unit  
K/W  
Junction ambient  
DIP8  
110  
220  
140  
SO8 on PC board  
SO8 on ceramic  
R
thJA  
4 (8)  
TELEFUNKEN Semiconductors  
Rev. A1, 29-May-96  
U2352B  
Electrical Characteristics  
V = 6 V, T  
= 25 C, reference point Pin 6, unless otherwise specified  
S
amb  
Parameters  
Test Conditions / Pins  
Symbol  
Min.  
Typ.  
Max.  
Unit  
V
Supply voltage limitation I = 5 mA  
Pin 8  
V
S
6.4  
6.5  
6.8  
6.9  
7.2  
7.3  
S
I = 20 mA  
S
Current consumption  
Voltage monitoring  
V = 6 V  
S
Pin 8  
I
2.7  
3.5  
mA  
V
S
Switch-on threshold  
Switch-off threshold  
Pin 8  
Pin 8  
V
V
5.2  
4.7  
5.6  
5.1  
6.0  
5.5  
SON  
SOFF  
Oscillator  
55  
COSC [nF]  
fOSC [kHz]  
Pin 1  
VS [V]  
Upper threshold (0.6 V )  
V
V
–I  
3.4  
1.7  
26  
3.6  
1.8  
33  
3.8  
1.9  
40  
V
V
A
A
S
Tu  
Lower threshold (0.3 V )  
Tl  
ch  
S
Charge current  
Discharge current  
I
26  
33  
40  
dis  
Control voltage input  
Input voltage range  
Input current,  
Pin 2  
Pin 2  
Pin 2–1  
Pin 2–1  
V
±I  
±V  
Offs  
– V  
0
V
500  
15  
V
I
8
0 V ≤ V ≤ V  
nA  
mV  
mV  
2
8
i
Offset voltage K  
1
Window, current  
measurement  
260  
300  
340  
2
Load current monitoring  
Setpoint value input:  
Input voltage range  
Input current  
Pin 3  
V
±I  
0
1
6
500  
V
nA  
I
0 V ≤ V ≤ 6 V Pin 3  
3
i
Offset voltage K  
Pin 4–3  
±V  
15  
mV  
V
2
Offs  
Load current detection:  
Voltage limitation  
Voltage limitation  
I = 1 mA  
I = –1 mA  
Pin 5  
Pin 5  
Pin 4  
V
L
2.3  
0.7  
5
–V  
5
L
Discharge current at POR  
I
mA  
dis  
Switch S  
Pin 5–4  
2
Residual voltage at closed  
switch  
V = 0 V, I = 50 A  
V
Sat  
175  
150  
125  
200  
mV  
4
5
V = 0.1 V, I = 50 A  
4
5
V = 0.3 V, I = 50 A  
4
5
V = 0.3 V, I = 100 A  
4
5
Push-pull output stage  
Upper saturation voltage  
Lower saturation voltage  
Pin 7  
I = –2 mA  
Pin 7–8  
Pin 7  
–V  
1
V
V
7
Satu  
I = 10 mA  
7
V
Satl  
0.3  
Output current  
ON state  
OFF state  
t ≤ 2 s  
t ≤ 2 s  
–i  
100  
100  
mA  
o
i
o
TELEFUNKEN Semiconductors  
5 (8)  
Rev. A1, 29-May-96  
U2352B  
1000  
800  
R =1M  
9
VIN  
500K  
R
D
= 20 k  
100K  
50K  
600  
5
4
20K  
400  
200  
0
S2  
10K  
5K  
95 9673  
1000  
0
200  
400  
600  
800  
VOUT  
R9  
95 9686  
V
( mV )  
IN  
Figure 4. Typical circuitry of the current switch S2 with associated transfer characteristics (S2 closed)  
V
B
R
1
Load  
M
D
1
R
2
R
5
82 k  
33 k  
D , T and R are  
1
1
sh  
load dependent  
C
osc  
D
2
1
2
8
7
6
5
D
3
680 pF  
Speed  
R
47 k  
6
T
C
4.7 F  
1
68 k  
1
R
8
R
G
R
7
C
2
U2352B  
R
3
27 k  
470 nF  
10 k  
3
Torque  
C
4
4
R
4
95 9674  
1k  
R
9
1.5 k  
C
10 nF  
3
R
sh  
GND  
Figure 5. Speed control with load current monitoring (load current detection via shunt resistor)  
6 (8)  
TELEFUNKEN Semiconductors  
Rev. A1, 29-May-96  
U2352B  
Dimensions in mm  
Package: DIP8  
94 8873  
Package: SO8  
94 8862  
TELEFUNKEN Semiconductors  
7 (8)  
Rev. A1, 29-May-96  
U2352B  
Ozone Depleting Substances Policy Statement  
It is the policy of TEMIC TELEFUNKEN microelectronic GmbH to  
1. Meet all present and future national and international statutory requirements.  
2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems  
with respect to their impact on the health and safety of our employees and the public, as well as their impact on  
the environment.  
It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as  
ozone depleting substances (ODSs).  
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and  
forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban  
on these substances.  
TEMIC TELEFUNKEN microelectronic GmbH semiconductor division has been able to use its policy of  
continuous improvements to eliminate the use of ODSs listed in the following documents.  
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively  
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental  
Protection Agency (EPA) in the USA  
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.  
TEMIC can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain  
such substances.  
We reserve the right to make changes to improve technical design and may do so without further notice.  
Parameters can vary in different applications. All operating parameters must be validated for each customer  
application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized  
application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of,  
directly or indirectly, any claim of personal damage, injury or death associated with such unintended or  
unauthorized use.  
TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany  
Telephone: 49 (0)7131 67 2831, Fax number: 49 (0)7131 67 2423  
8 (8)  
TELEFUNKEN Semiconductors  
Rev. A1, 29-May-96  

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