CY74FCT373CTSOCR

更新时间:2025-05-19 18:21:23
品牌:TI
描述:IC FCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, GREEN, SOIC-20, Bus Driver/Transceiver

CY74FCT373CTSOCR 概述

IC FCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, GREEN, SOIC-20, Bus Driver/Transceiver 总线驱动器/收发器

CY74FCT373CTSOCR 规格参数

生命周期:Obsolete零件包装代码:SOIC
包装说明:SOP,针数:20
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.06系列:FCT
JESD-30 代码:R-PDSO-G20JESD-609代码:e4
长度:12.8 mm逻辑集成电路类型:BUS DRIVER
位数:8功能数量:1
端口数量:2端子数量:20
最高工作温度:85 °C最低工作温度:-40 °C
输出特性:3-STATE输出极性:TRUE
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
传播延迟(tpd):5.5 ns认证状态:Not Qualified
座面最大高度:2.65 mm最大供电电压 (Vsup):5.25 V
最小供电电压 (Vsup):4.75 V标称供电电压 (Vsup):5 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:NICKEL PALLADIUM GOLD
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL宽度:7.5 mm
Base Number Matches:1

CY74FCT373CTSOCR 数据手册

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CY54FCT373T, CY74FCT373T  
8-BIT LATCHES  
WITH 3-STATE OUTPUTS  
SCCS021B – MAY 1994 – REVISED OCTOBER 2001  
CY54FCT373T . . . D PACKAGE  
CY74FCT373T . . . Q OR SO PACKAGE  
(TOP VIEW)  
Function and Pinout Compatible With FCT  
and F Logic  
Reduced V  
of Equivalent FCT Functions  
(Typically = 3.3 V) Versions  
OH  
OE  
1
2
3
4
5
6
7
8
9
20  
19  
18  
17  
16  
15  
14  
13  
12  
V
CC  
O
O
Edge-Rate Control Circuitry for  
Significantly Improved Noise  
Characteristics  
0
7
D
0
D
7
6
D
D
1
O
O
D
D
O
O
O
1
2
2
3
3
6
5
5
4
I
Supports Partial-Power-Down Mode  
off  
Operation  
D
D
ESD Protection Exceeds JESD 22  
– 2000-V Human-Body Model (A114-A)  
– 200-V Machine Model (A115-A)  
O
4
GND 10  
11 LE  
– 1000-V Charged-Device Model (C101)  
Matched Rise and Fall Times  
Fully Compatible With TTL Input and  
Output Logic Levels  
3-State Outputs  
CY54FCT373T  
– 32-mA Output Sink Current  
– 12-mA Output Source Current  
CY74FCT373T  
– 64-mA Output Sink Current  
– 32-mA Output Source Current  
description  
The ’FCT373T devices consist of eight latches with 3-state outputs for bus-organized applications. When the  
latch-enable (LE) input is high, the flip-flops appear transparent to the data. Data that meets the required setup  
times are latched when LE transitions from high to low. Data appears on the bus when the output-enable (OE)  
input is low. When OE is high, the bus output is in the high-impedance state. In this mode, data can be entered  
into the latches.  
These devices are fully specified for partial-power-down applications using I . The I circuitry disables the  
off  
off  
outputs, preventing damaging current backflow through the device when it is powered down.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 2001, Texas Instruments Incorporated  
On products compliant to MIL-PRF-38535, all parameters are tested  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
unless otherwise noted. On all other products, production  
testing of all parameters.  
processing does not necessarily include testing of all parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
CY54FCT373T, CY74FCT373T  
8-BIT LATCHES  
WITH 3-STATE OUTPUTS  
SCCS021B MAY 1994 REVISED OCTOBER 2001  
ORDERING INFORMATION  
SPEED  
(ns)  
ORDERABLE  
TOP-SIDE  
MARKING  
PACKAGE  
T
A
PART NUMBER  
CY74FCT373CTQCT  
CY74FCT373CTSOC  
CY74FCT373CTSOCT  
CY74FCT373ATQCT  
CY74FCT373ATSOC  
CY74FCT373ATSOCT  
CY74FCT373TSOC  
CY74FCT373TSOCT  
CY54FCT373ATDMB  
QSOP Q  
SOIC SO  
QSOP Q  
SOIC SO  
Tape and reel  
Tube  
4.7  
4.7  
4.7  
5.2  
5.2  
5.2  
8
FCT373C  
FCT373C  
FCT373A  
FCT373  
Tape and reel  
Tape and reel  
Tube  
40°C to 85°C  
55°C to 125°C  
Tape and reel  
Tube  
SOIC SO  
CDIP D  
FCT373  
Tape and reel  
Tube  
8
5.6  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are  
available at www.ti.com/sc/package.  
FUNCTION TABLE  
INPUTS  
OUTPUT  
O
OE  
L
LE  
H
H
L
D
H
L
H
L
L
L
X
X
Q
0
H
X
Z
H = High logic level, L = Low logic level,  
X = Dontcare,Z=High-impedancestate,  
Q
= Previous state of flip flops (Q  
)
n1  
n
logic diagram (positive logic)  
1
OE  
11  
LE  
CP  
Q
D
2
O
0
3
D
0
To Seven Other Channels  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
CY54FCT373T, CY74FCT373T  
8-BIT LATCHES  
WITH 3-STATE OUTPUTS  
SCCS021B MAY 1994 REVISED OCTOBER 2001  
absolute maximum rating over operating free-air temperature range (unless otherwise noted)  
Supply voltage range to ground potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 7 V  
DC input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 7 V  
DC output voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 7 V  
DC output current (maximum sink current/pin) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 mA  
Package thermal impedance, θ (see Note 1): Q package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68°C/W  
JA  
SO package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W  
Ambient temperature range with power applied, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65°C to 135°C  
A
Storage temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65°C to 150°C  
stg  
Stresses beyond those listed under absolute maximum ratingsmay cause permanent damage to the device. These are stress ratings only, and  
functionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderrecommendedoperatingconditionsisnotimplied.  
Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTE 1: The package thermal impedance is calculated in accordance with JESD 51-7.  
recommended operating conditions (see Note 2)  
CY54FCT373T  
CY74FCT373T  
MIN NOM MAX  
UNIT  
MIN NOM  
MAX  
V
V
V
Supply voltage  
4.5  
2
5
5.5  
4.75  
2
5
5.25  
V
V
CC  
High-level input voltage  
Low-level input voltage  
High-level output current  
Low-level output current  
Operating free-air temperature  
IH  
0.8  
12  
32  
0.8  
32  
64  
V
IL  
I
I
mA  
mA  
°C  
OH  
OL  
T
A
55  
125  
40  
85  
NOTE 2: All unused inputs of the device must be held at V  
or GND to ensure proper device operation.  
CC  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
CY54FCT373T, CY74FCT373T  
8-BIT LATCHES  
WITH 3-STATE OUTPUTS  
SCCS021B MAY 1994 REVISED OCTOBER 2001  
electrical characteristics over recommended operating free-air temperature range (unless  
otherwise noted)  
CY54FCT373T  
CY74FCT373T  
PARAMETER  
TEST CONDITIONS  
UNIT  
MIN TYP  
MAX  
MIN TYP  
MAX  
V
V
V
= 4.5 V,  
= 4.75 V,  
= 4.5 V,  
I
I
I
I
I
I
I
= 18 mA  
= 18 mA  
0.7  
1.2  
CC  
CC  
CC  
IN  
V
V
IK  
0.7  
1.2  
IN  
= 12 mA  
= 32 mA  
= 15 mA  
= 32 mA  
= 64 mA  
2.4  
3.3  
OH  
OH  
OH  
OL  
OL  
V
OH  
2
V
V
CC  
= 4.75 V  
2.4  
3.3  
V
V
= 4.5 V,  
0.3  
0.2  
0.55  
CC  
V
V
V
V
OL  
= 4.75 V,  
0.3  
0.2  
0.55  
CC  
All inputs  
hys  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
= 5.5 V,  
= 5.25 V,  
= 5.5 V,  
= 5.25 V,  
= 5.5 V,  
= 5.25 V,  
= 5.5 V,  
= 5.25 V,  
= 5.5 V,  
= 5.25 V,  
= 5.5 V,  
= 5.25 V,  
= 0 V,  
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
= V  
= V  
5
±1  
IN  
IN  
IN  
IN  
IN  
IN  
CC  
CC  
I
I
I
I
I
µA  
I
5
±1  
= 2.7 V  
= 2.7 V  
= 0.5 V  
= 0.5 V  
µA  
µA  
µA  
µA  
IH  
±1  
IL  
±1  
= 2.7 V  
= 2.7 V  
= 0.5 V  
= 0.5 V  
= 0 V  
10  
OUT  
OUT  
OUT  
OUT  
OUT  
OUT  
OUT  
OZH  
OZL  
10  
10  
225  
10  
60  
120  
mA  
µA  
I
I
I
OS  
= 0 V  
60  
120  
225  
±1  
= 4.5 V  
±1  
off  
= 5.5 V,  
= 5.25 V,  
0.2 V,  
V
V
V  
V  
0.2 V  
0.2 V  
0.1  
0.5  
0.2  
IN  
IN  
IN  
CC  
mA  
CC  
0.2 V,  
0.1  
0.5  
0.2  
2
IN  
CC  
§
= 5.5 V, V = 3.4 V , f = 0, Outputs open  
IN  
2
1
I  
CC  
mA  
§
= 5.25 V, V = 3.4 V , f = 0, Outputs open  
IN  
1
Typical values are at V  
CC  
= 5 V, T = 25°C.  
A
Notmorethanoneoutputshouldbeshortedatatime.Durationofshortshouldnotexceedonesecond.Theuseofhigh-speedtestapparatusand/or  
sample-and-holdtechniquesarepreferabletominimizeinternalchipheatingandmoreaccuratelyreflectoperationalvalues.Otherwise,prolonged  
shorting of a high output can raise the chip temperature well above normal and cause invalid readings in other parametric tests. In any sequence  
of parameter tests, I  
Per TTL-driven input (V = 3.4 V); all other inputs at V  
tests should be performed last.  
OS  
§
or GND  
IN CC  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
CY54FCT373T, CY74FCT373T  
8-BIT LATCHES  
WITH 3-STATE OUTPUTS  
SCCS021B MAY 1994 REVISED OCTOBER 2001  
electrical characteristics over recommended operating free-air temperature range (unless  
otherwise noted) (continued)  
CY54FCT373T  
CY74FCT373T  
PARAMETER  
TEST CONDITIONS  
UNIT  
MIN TYP  
MAX  
MIN TYP  
MAX  
V
= 5.5 V, Outputs open,  
CC  
One input switching at 50% duty cycle, OE = GND,  
0.06  
0.12  
V
0.2 V or V V  
0.2 V  
IN  
IN CC  
mA/  
MHz  
I
CCD  
V
CC  
= 5.25 V, Outputs open,  
One input switching at 50% duty cycle, OE = GND,  
0.06  
0.12  
V
IN  
0.2 V or V V  
0.2 V  
IN CC  
V
V
0.2 V or  
One bit switching  
at f = 10 MHz  
1
at 50% duty cycle  
IN  
IN  
0.7  
1
1.4  
2.4  
V  
0.2 V  
CC  
V
= 5.5 V,  
CC  
V
IN  
= 3.4 V or GND  
Outputs open,  
OE = GND,  
LE = V  
CC  
V
IN  
V
IN  
0.2 V or  
Eight bits switching  
at f = 2.5 MHz  
1
at 50% duty cycle  
||  
2.6  
1.3  
V  
0.2 V  
CC  
||  
V
IN  
= 3.4 V or GND  
3.3 10.6  
#
I
C
mA  
V
V
0.2 V or  
One bit switching  
at f = 10 MHz  
1
at 50% duty cycle  
IN  
IN  
0.7  
1
1.4  
2.4  
V  
0.2 V  
CC  
V
= 5.25 V,  
CC  
V
IN  
= 3.4 V or GND  
Outputs open,  
OE = GND,  
LE = V  
CC  
V
IN  
V
IN  
0.2 V or  
Eight bits switching  
at f = 2.5 MHz  
1
at 50% duty cycle  
||  
||  
1.3  
2.6  
V  
0.2 V  
CC  
V
IN  
= 3.4 V or GND  
3.3 10.6  
C
C
6
8
10  
12  
6
8
10  
12  
pF  
pF  
i
o
#
Typical values are at V  
CC  
= 5 V, T = 25°C.  
A
This parameter is derived for use in total power-supply calculations.  
= I + I × D × N + I (f /2 + f × N )  
I
C
CC  
CC  
H
T
CCD  
0
1
1
Where:  
I
I
I  
D
N
= Total supply current  
= Power-supply current with CMOS input levels  
C
CC  
CC  
H
T
= Power-supply current for a TTL high input (V = 3.4 V)  
IN  
= Duty cycle for TTL inputs high  
= Number of TTL inputs at D  
H
I
f
f
= Dynamic current caused by an input transition pair (HLH or LHL)  
= Clock frequency for registered devices, otherwise zero  
= Input signal frequency  
CCD  
0
1
N
= Number of inputs changing at f  
1
1
All currents are in milliamperes and all frequencies are in megahertz.  
||  
Values for these conditions are examples of the I  
CC  
formula.  
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
CY54FCT373T, CY74FCT373T  
8-BIT LATCHES  
WITH 3-STATE OUTPUTS  
SCCS021B MAY 1994 REVISED OCTOBER 2001  
timing requirements over recommended operating free-air temperature range (unless otherwise  
noted) (see Figure 1)  
CY54FCT373T  
CY54FCT373AT  
UNIT  
MIN  
6
MAX  
MIN  
6
MAX  
t
w
t
su  
t
h
Pulse duration, LE high  
Setup time, data before LE↑  
Hold time, data after LE↑  
ns  
ns  
ns  
2
2
1.5  
1.5  
timing requirements over recommended operating free-air temperature range (unless otherwise  
noted) (see Figure 1)  
CY74FCT373T  
CY74FCT373AT  
CY74FCT373CT  
UNIT  
MIN  
6
MAX  
MIN  
5
MAX  
MIN  
5
MAX  
t
w
t
su  
t
h
Pulse duration, LE high  
Setup time, data before LE↑  
Hold time, data after LE↑  
ns  
ns  
ns  
2
2
2
1.5  
1.5  
1.5  
switching characteristics over operating free-air temperature range (see Figure 1)  
CY54FCT373AT  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
UNIT  
ns  
MIN  
1.5  
1.5  
2
MAX  
5.6  
5.6  
9.8  
9.8  
7.5  
7.5  
6.5  
6.5  
t
t
t
t
t
t
t
t
PLH  
PHL  
PLH  
PHL  
PZH  
PZL  
PHZ  
PLZ  
D
O
O
O
O
LE  
OE  
OE  
ns  
2
1.5  
1.5  
1.5  
1.5  
ns  
ns  
switching characteristics over operating free-air temperature range (see Figure 1)  
CY74FCT373T CY74FCT373AT CY74FCT373CT  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
UNIT  
ns  
MIN  
1.5  
1.5  
2
MAX  
8
MIN  
1.5  
1.5  
2
MAX  
5.2  
5.2  
8.5  
8.5  
6.5  
6.5  
5.5  
5.5  
MIN  
1.5  
1.5  
2
MAX  
4.7  
4.7  
5.5  
5.5  
5.5  
5.5  
5
t
t
t
t
t
t
t
t
PLH  
PHL  
PLH  
PHL  
PZH  
PZL  
PHZ  
PLZ  
D
O
O
O
O
8
13  
13  
12  
12  
7.5  
7.5  
LE  
OE  
OE  
ns  
2
2
2
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
ns  
ns  
5
6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
CY54FCT373T, CY74FCT373T  
8-BIT LATCHES  
WITH 3-STATE OUTPUTS  
SCCS021B MAY 1994 REVISED OCTOBER 2001  
PARAMETER MEASUREMENT INFORMATION  
7 V  
Open  
GND  
S1  
500 Ω  
From Output  
Under Test  
From Output  
Under Test  
Test  
Point  
TEST  
/t  
S1  
t
Open  
7 V  
PLH PHL  
C
= 50 pF  
C
= 50 pF  
L
L
500 Ω  
500 Ω  
t
/t  
PLZ PZL  
/t  
(see Note A)  
(see Note A)  
t
Open  
PHZ PZH  
LOAD CIRCUIT FOR  
TOTEM-POLE OUTPUTS  
LOAD CIRCUIT FOR  
3-STATE OUTPUTS  
3 V  
0 V  
1.5 V  
Timing Input  
Data Input  
t
w
t
h
t
3 V  
su  
3 V  
0 V  
1.5 V  
Input  
1.5 V  
1.5 V  
1.5 V  
0 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
3 V  
0 V  
3 V  
0 V  
Output  
Control  
1.5 V  
1.5 V  
1.5 V  
1.5 V  
Input  
t
t
t
t
t
t
PLH  
PHL  
PLH  
PZL  
PZH  
PLZ  
3.5 V  
V
Output  
Waveform 1  
(see Note B)  
OH  
In-Phase  
Output  
1.5 V  
1.5 V  
1.5 V  
1.5 V  
V
V
+ 0.3 V  
OL  
V
OL  
V
OL  
t
t
PHL  
PHZ  
V
V
V
OH  
OH  
Output  
Waveform 2  
(see Note B)  
Out-of-Phase  
Output  
0.3 V  
OH  
1.5 V  
1.5 V  
0 V  
OL  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
INVERTING AND NONINVERTING OUTPUTS  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
LOW- AND HIGH-LEVEL ENABLING  
NOTES: A. includes probe and jig capacitance.  
C
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.  
C. The outputs are measured one at a time with one input transition per measurement.  
Figure 1. Load Circuit and Voltage Waveforms  
7
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
16-Aug-2012  
PACKAGING INFORMATION  
Status (1)  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
5962-9221701MRA  
5962-9221702MRA  
5962-9221703M2A  
CY54FCT373ATDMB  
CY74FCT373ATQCT  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
CDIP  
CDIP  
LCCC  
CDIP  
SSOP  
J
J
20  
20  
20  
20  
20  
1
1
TBD  
TBD  
TBD  
TBD  
A42  
N / A for Pkg Type  
Call TI  
Call TI  
FK  
J
1
POST-PLATE N / A for Pkg Type  
A42 N / A for Pkg Type  
1
DBQ  
2500  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CY74FCT373ATQCTE4  
CY74FCT373ATQCTG4  
CY74FCT373ATSOC  
CY74FCT373ATSOCE4  
CY74FCT373ATSOCG4  
CY74FCT373ATSOCT  
CY74FCT373ATSOCTE4  
CY74FCT373ATSOCTG4  
CY74FCT373TSOC  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SSOP  
SSOP  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
DBQ  
DBQ  
DW  
DW  
DW  
DW  
DW  
DW  
DW  
DW  
DW  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
2500  
2500  
25  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
25  
Green (RoHS  
& no Sb/Br)  
25  
Green (RoHS  
& no Sb/Br)  
2000  
2000  
2000  
25  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
CY74FCT373TSOCE4  
CY74FCT373TSOCG4  
25  
Green (RoHS  
& no Sb/Br)  
25  
Green (RoHS  
& no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
16-Aug-2012  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
16-Aug-2012  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
CY74FCT373ATQCT  
CY74FCT373ATSOCT  
SSOP  
SOIC  
DBQ  
DW  
20  
20  
2500  
2000  
330.0  
330.0  
16.4  
24.4  
6.5  
9.0  
2.1  
2.7  
8.0  
16.0  
24.0  
Q1  
Q1  
10.8  
13.0  
12.0  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
16-Aug-2012  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
CY74FCT373ATQCT  
CY74FCT373ATSOCT  
SSOP  
SOIC  
DBQ  
DW  
20  
20  
2500  
2000  
367.0  
367.0  
367.0  
367.0  
38.0  
45.0  
Pack Materials-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should  
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All  
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time  
of order acknowledgment.  
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily  
performed.  
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and  
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide  
adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or  
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information  
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endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the  
third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration  
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered  
documentation. Information of third parties may be subject to additional restrictions.  
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service  
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.  
TI is not responsible or liable for any such statements.  
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements  
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support  
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which  
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harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use  
of any TI components in safety-critical applications.  
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to  
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and  
requirements. Nonetheless, such components are subject to these terms.  
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties  
have executed a special agreement specifically governing such use.  
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in  
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components  
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and  
regulatory requirements in connection with such use.  
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which  
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such  
components to meet such requirements.  
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Audio  
Applications  
www.ti.com/audio  
amplifier.ti.com  
dataconverter.ti.com  
www.dlp.com  
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Communications and Telecom www.ti.com/communications  
Amplifiers  
Data Converters  
DLP® Products  
DSP  
Computers and Peripherals  
Consumer Electronics  
Energy and Lighting  
Industrial  
www.ti.com/computers  
www.ti.com/consumer-apps  
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dsp.ti.com  
Clocks and Timers  
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interface.ti.com  
logic.ti.com  
www.ti.com/industrial  
www.ti.com/medical  
www.ti.com/security  
Medical  
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RFID  
power.ti.com  
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Copyright © 2012, Texas Instruments Incorporated  

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