LM5109BMA/NOPB

更新时间:2024-12-05 05:36:02
品牌:TI
描述:具有 8V UVLO 和高噪声抗扰度的 1A、100V 半桥栅极驱动器 | D | 8 | -40 to 125

LM5109BMA/NOPB 概述

具有 8V UVLO 和高噪声抗扰度的 1A、100V 半桥栅极驱动器 | D | 8 | -40 to 125 FET驱动器 MOSFET 驱动器

LM5109BMA/NOPB 规格参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:SOP, SOP8,.25
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:1.63
高边驱动器:YES接口集成电路类型:HALF BRIDGE BASED MOSFET DRIVER
JESD-30 代码:R-PDSO-G8JESD-609代码:e3
长度:4.9 mm湿度敏感等级:1
功能数量:1端子数量:8
最高工作温度:125 °C最低工作温度:-40 °C
最大输出电流:1 A标称输出峰值电流:1 A
输出极性:TRUE封装主体材料:PLASTIC/EPOXY
封装代码:SOP封装等效代码:SOP8,.25
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260电源:12 V
认证状态:Not Qualified座面最大高度:1.75 mm
子类别:MOSFET Drivers最大压摆率:2.9 mA
最大供电电压:14 V最小供电电压:8 V
标称供电电压:12 V表面贴装:YES
温度等级:AUTOMOTIVE端子面层:Matte Tin (Sn)
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
断开时间:0.056 µs接通时间:0.056 µs
宽度:3.9 mmBase Number Matches:1

LM5109BMA/NOPB 数据手册

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LM5109A  
www.ti.com  
SNVS412A APRIL 2006REVISED MARCH 2013  
LM5109A High Voltage 1A Peak Half Bridge Gate Driver  
Check for Samples: LM5109A  
1
FEATURES  
DESCRIPTION  
The LM5109A is a cost effective, high voltage gate  
driver designed to drive both the high-side and the  
low-side N-Channel MOSFETs in a synchronous  
buck or a half bridge configuration. The floating high-  
side driver is capable of working with rail voltages up  
to 90V. The outputs are independently controlled with  
TTL compatible input thresholds. The robust level  
shift technology operates at high speed while  
consuming low power and providing clean level  
transitions from the control input logic to the high-side  
gate driver. Under-voltage lockout is provided on both  
the low-side and the high-side power rails. The  
device is available in the SOIC and the thermally  
enhanced WSON packages.  
2
Drives Both a High-Side and Low-Side N-  
Channel MOSFET  
1A peak Output Current (1.0A Sink / 1.0A  
Source)  
Independent TTL Compatible Inputs  
Bootstrap Supply Voltage to 108V DC  
Fast Propagation Times (30 ns Typical)  
Drives 1000 pF Load with 15ns Rise and Fall  
Times  
Excellent Propagation Delay Matching (2 ns  
Typical)  
Supply Rail Under-Voltage Lockout  
Low Power Consumption  
Package  
Pin Compatible with ISL6700  
SOIC  
WSON-8 (4 mm x 4 mm)  
TYPICAL APPLICATIONS  
Current Fed Push-Pull Converters  
Half and Full Bridge Power Converters  
Solid State Motor Drives  
Two Switch Forward Power Converters  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
All trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2006–2013, Texas Instruments Incorporated  
LM5109A  
SNVS412A APRIL 2006REVISED MARCH 2013  
www.ti.com  
Simplified Block Diagram  
V
DD  
HV  
HB  
HO  
HS  
DRIVER  
LEVEL  
SHIFT  
UVLO  
HI  
V
DD  
UVLO  
LO  
DRIVER  
LI  
V
SS  
Connection Diagrams  
VDD  
HI  
VDD  
HI  
1
2
3
4
8
7
6
5
HB  
HO  
HS  
LO  
1
2
3
4
8
7
6
5
HB  
HO  
HS  
LO  
LI  
LI  
VSS  
VSS  
Figure 1. 8-Lead SOIC  
See D Package  
Figure 2. 8-Lead WSON  
See NGT0008A Package  
PIN DESCRIPTIONS  
Pin #  
WSON(1)  
NAME  
VDD  
DESCRIPTION  
APPLICATION INFORMATION  
SOIC  
Locally decouple to VSS using low ESR/ESL capacitor located as  
close to IC as possible.  
1
1
2
3
Positive gate drive supply  
High side control input  
Low side control input  
The HI input is compatible with TTL input thresholds. Unused HI input  
should be tied to ground and not left open  
2
3
HI  
LI  
The LI input is compatible with TTL input thresholds. Unused LI input  
should be tied to ground and not left open.  
4
5
4
5
VSS  
LO  
Ground reference  
All signals are referenced to this ground.  
Low side gate driver output  
Connect to the gate of the low-side N- MOS device.  
Connect to the negative terminal of the bootstrap capacitor and to the  
source of the high-side N-MOS device.  
6
7
6
7
HS  
HO  
High side source connection  
High side gate driver output  
Connect to the gate of the high-side N-MOS device.  
(1) For WSON package it is recommended that the exposed pad on the bottom of the package be soldered to ground plane on the PCB  
and the ground plane should extend out from underneath the package to improve heat dissipation.  
2
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LM5109A  
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SNVS412A APRIL 2006REVISED MARCH 2013  
PIN DESCRIPTIONS (continued)  
Pin #  
NAME  
DESCRIPTION  
APPLICATION INFORMATION  
SOIC  
WSON(1)  
Connect the positive terminal of the bootstrap capacitor to HB and  
the negative terminal of the bootstrap capacitor to HS. The bootstrap  
capacitor should be placed as close to IC as possible.  
High side gate driver positive  
supply rail  
8
8
HB  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
Absolute Maximum Ratings(1)(2)  
VDD to VSS  
–0.3V to 18V  
0.3V to 18V  
HB to HS  
LI or HI to VSS  
LO to VSS  
0.3V to VDD + 0.3V  
0.3V to VDD + 0.3V  
HS 0.3V to VHB + 0.3V  
5V to 90V  
HO to VSS  
V
(3)  
HS to VSS  
HB to VSS  
108V  
Junction Temperature  
Storage Temperature Range  
ESD Rating HBM(4)  
–40°C to 150°C  
55°C to 150°C  
1.5 kV  
(1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under  
which operation of the device is specified. Operating Ratings do not imply performance limits. For performance limits and associated test  
conditions, see the Electrical Characteristics .  
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and  
specifications.  
(3) In the application the HS node is clamped by the body diode of the external lower N-MOSFET, therefore the HS voltage will generally  
not exceed –1V. However in some applications, board resistance and inductance may result in the HS node exceeding this stated  
voltage transiently. If negative transients occur on HS, the HS voltage must never be more negative than VDD – 15V. For example, if  
VDD = 10V, the negative transients at HS must not exceed –5V.  
(4) The human body model is a 100 pF capacitor discharged through a 1.5kresistor into each pin.  
Recommended Operating Conditions  
VDD  
HS(1)  
8V to 14V  
1V to 90V  
HB  
VHS + 8V to VHS + 14V  
< 50 V/ns  
HS Slew Rate  
Junction Temperature  
40°C to 125°C  
(1) In the application the HS node is clamped by the body diode of the external lower N-MOSFET, therefore the HS voltage will generally  
not exceed –1V. However in some applications, board resistance and inductance may result in the HS node exceeding this stated  
voltage transiently. If negative transients occur on HS, the HS voltage must never be more negative than VDD – 15V. For example, if  
VDD = 10V, the negative transients at HS must not exceed –5V.  
Electrical Characteristics  
Specifications in standard typeface are for TJ = 25°C, and those in boldface type apply over the full operating junction  
temperature range. Unless otherwise specified, VDD = VHB = 12V, VSS = VHS = 0V, No Load on LO or HO(1)  
.
SYMBOL  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
Supply Currents  
IDD  
VDD quiescent current  
VDD operating current  
LI = HI = 0V  
f = 500 kHz  
LI = HI = 0V  
f = 500 kHz  
0.3  
1.8  
0.6  
2.9  
0.2  
2.8  
mA  
mA  
mA  
mA  
IDDO  
IHB  
Total HB quiescent current  
Total HB operating current  
0.06  
1.4  
IHBO  
(1) Minimum and maximum limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through  
correlation using Statistical Quality Control (SQC) methods. Limits are used to calculate Average Outgoing Quality Level (AOQL).  
Copyright © 2006–2013, Texas Instruments Incorporated  
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SNVS412A APRIL 2006REVISED MARCH 2013  
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Electrical Characteristics (continued)  
Specifications in standard typeface are for TJ = 25°C, and those in boldface type apply over the full operating junction  
temperature range. Unless otherwise specified, VDD = VHB = 12V, VSS = VHS = 0V, No Load on LO or HO(1)  
.
SYMBOL  
IHBS  
PARAMETER  
HB to VSS current, quiescent  
HB to VSS current, operating  
CONDITIONS  
VHS = VHB = 90V  
MIN  
TYP  
0.1  
MAX  
10  
UNIT  
µA  
IHBSO  
f = 500 kHz  
0.5  
mA  
Input Pins LI and HI  
VIL  
VIH  
RI  
Low-level input voltage threshold  
0.8  
100  
6.0  
5.7  
1.8  
1.8  
200  
V
V
High-level input voltage threshold  
Input pulldown resistance  
2.2  
500  
kΩ  
Under-Voltage Protection  
VDDR  
VDDH  
VHBR  
VHBH  
VDD rising threshold  
VDDR = VDD – VSS  
6.7  
0.5  
6.6  
0.4  
7.4  
7.1  
V
V
V
V
VDD threshold hysteresis  
HB rising threshold  
VHBR = VHB – VHS  
HB threshold hysteresis  
LO Gate Driver  
VOLL  
VOHL  
IOHL  
IOLL  
Low-level output voltage  
ILO = 100 mA, VOHL = VLO – VSS  
ILO = 100 mA, VOHL = VDD – VLO  
VLO = 0V  
0.38  
0.72  
1.0  
0.65  
1.20  
V
V
A
A
High-level output voltage  
Peak pullup current  
Peak pulldown current  
VLO = 12V  
1.0  
HO Gate Driver  
VOLH  
VOHH  
IOHH  
IOLH  
Low-level output voltage  
IHO = 100 mA, VOLH = VHO – VHS  
IHO = 100 mA, VOHH = VHB – VHO  
VHO = 0V  
0.38  
0.72  
1.0  
0.65  
1.20  
V
V
A
A
High-level output voltage  
Peak pullup current  
Peak pulldown current  
VHO = 12V  
1.0  
Thermal Resistance  
θJA  
SOIC(2)(3)  
WSON(2)(3)  
160  
40  
Junction to ambient  
°C/W  
(2) 4-layer board with Cu finished thicknesses 1.5/1/1/1.5 oz. Maximum die size used. 5x body length of Cu trace on PCB top. 50 x 50mm  
ground and power planes embedded in PCB. See Application Note AN-1187.  
(3) The θJA is not a constant for the package and depends on the printed circuit board design and the operating conditions.  
Switching Characteristics  
Specifications in standard typeface are for TJ = 25°C, and those in boldface type apply over the full operating junction  
temperature range. Unless otherwise specified, VDD = VHB = 12V, VSS = VHS = 0V, No Load on LO or HO.  
SYMBOL  
LM5109A  
tLPHL  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
Lower turn-off propagation delay  
(LI falling to LO falling)  
30  
30  
32  
32  
2
56  
56  
56  
56  
15  
ns  
ns  
ns  
ns  
ns  
tHPHL  
tLPLH  
tHPLH  
tMON  
tMOFF  
Upper turn-off propagation delay  
(HI falling to HO falling)  
Lower turn-on propagation delay  
(LI rising to LO rising)  
Upper turn-on propagation delay  
(HI rising to HO rising)  
Delay matching: lower turn-on and upper  
turn-off  
Delay matching: lower turn-off and upper  
turn-on  
2
15  
ns  
ns  
ns  
tRC, tFC  
tPW  
Either output rise or fall time  
CL = 1000 pF  
15  
50  
-
Minimum input pulse width that changes  
the output  
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SNVS412A APRIL 2006REVISED MARCH 2013  
Typical Performance Characteristics  
VDD Operating Current vs Frequency  
HB Operating Current vs Frequency  
100  
10  
1
100  
V
= V = 12V  
HB  
V
= V = 12V  
HB  
DD  
DD  
C
L
= 1000 pF  
V
= V = 0V  
HS  
SS  
V
= V = 0V  
HS  
SS  
C
= 1000 pF  
L
10  
C
= 2200 pF  
L
C
L
= 2200 pF  
C
= 4400 pF  
L
C
L
= 4400 pF  
1
C
L
= 0 pF  
0.1  
0.01  
C
= 0 pF  
L
C
L
= 470 pF  
C
L
= 470 pF  
0.1  
1
10  
100  
1000  
1
10  
100  
1000  
FREQUENCY (kHz)  
FREQUENCY (kHz)  
Figure 3.  
Figure 4.  
Operating Current vs Temperature  
Quiescent Current vs Temperature  
0.45  
2.2  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.40  
0.35  
0.30  
0.25  
0.20  
0.15  
0.10  
0.05  
0.00  
I
DDO  
I
DDO  
C
= 0 pF  
L
f = 500 kHz  
LI = HI = 0V  
V
= V = 12V  
HB  
DD  
SS  
V
V
= V = 12V  
HB  
DD  
SS  
V
= V = 0V  
HS  
= V = 0V  
HS  
I
HBO  
50  
I
HBO  
50  
20 35  
65  
80 95 110 125  
-40 -25 -10  
5
5
20 35  
65  
80 95 110 125  
-40 -25 -10  
TEMPERATURE (oC)  
TEMPERATURE (°C)  
Figure 5.  
Figure 6.  
Quiescent Current vs Voltage  
Propagation Delay vs Temperature  
600  
500  
44  
40  
36  
32  
28  
24  
20  
C
= 0 pF  
L
t
LI = HI = 0V  
LPHL  
t
HPHL  
V
V
= V = 12V  
HB  
DD  
SS  
V
V
= V  
HB  
DD  
= V  
HS  
= 0V  
= V = 0V  
SS HS  
I
DD  
400  
300  
200  
turn off  
t
HPLH  
t
LPLH  
I
HB  
turn on  
100  
0
8
10  
12  
14  
, V (V)  
16  
18  
50  
20 35  
65  
-40 -25 -10 5  
80 95 110 125  
TEMPERATURE (oC)  
V
DD HB  
Figure 7.  
Figure 8.  
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Typical Performance Characteristics (continued)  
LO and HO High Level Output Voltage  
LO and HO Low Level Output Voltage  
vs Temperature  
vs Temperature  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
0.6  
0.5  
0.4  
0.3  
0.2  
Output Current : -100 mA  
Output Current : -100 mA  
V
= V = 0V  
HS  
SS  
V
= V = 0V  
HS  
SS  
V
= V = 8V  
HB  
DD  
V
= V = 8V  
HB  
DD  
V
DD  
= V = 12V  
HB  
V
= V = 12V  
HB  
DD  
V
DD  
= V = 16V  
V
= V = 16V  
HB  
HB  
DD  
50  
-40 -25 -10  
5
20 35  
65  
80 95 110 125  
50  
20 35  
65 80 95 110 125  
-40 -25 -10  
5
TEMPERATURE (°C)  
TEMPERATURE (°C)  
Figure 9.  
Figure 10.  
Undervoltage Rising Thresholds vs Temperature  
Undervoltage Hysteresis vs Temperature  
0.50  
7.0  
V
V
= V - V  
DD  
DDR  
SS  
0.48  
0.46  
0.44  
0.42  
0.40  
0.38  
0.36  
0.34  
0.32  
0.30  
6.9  
6.8  
6.7  
6.6  
6.5  
6.4  
6.3  
= V - V  
HB  
HBR  
HS  
V
DDH  
V
DDR  
V
HBR  
V
HBH  
50  
-40 -25 -10  
5
20 35  
65  
80 95 110 125  
50  
-40 -25 -10  
5
20 35  
65  
80 95 110 125  
TEMPERATURE (oC)  
TEMPERATURE (oC)  
Figure 11.  
Figure 12.  
Input Thresholds vs Temperature  
Input Thresholds vs Supply Voltage  
1.92  
1.91  
1.90  
1.89  
1.88  
1.87  
1.86  
1.85  
1.84  
1.83  
1.82  
1.81  
1.80  
2.00  
1.95  
1.90  
1.85  
1.80  
1.75  
1.70  
V
= 12V  
= 0V  
DD  
Rising  
V
SS  
Rising  
Falling  
Falling  
12  
(V)  
8
9
10  
11  
13  
14 15 16  
50  
-40 -25 -10  
5
20 35  
65  
80 95 110 125  
V
DD  
TEMPERATURE (oC)  
Figure 13.  
Figure 14.  
6
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SNVS412A APRIL 2006REVISED MARCH 2013  
Timing Diagram  
LI  
LI  
HI  
HI  
t
HPLH  
t
LPLH  
t
HPHL  
t
LPHL  
LO  
LO  
HO  
HO  
t
t
MOFF  
MON  
Figure 15.  
Layout Considerations  
Optimum performance of high and low-side gate drivers cannot be achieved without taking due considerations  
during circuit board layout. The following points are emphasized:  
1. Low ESR / ESL capacitors must be connected close to the IC between VDD and VSS pins and between HB  
and HS pins to support high peak currents being drawn from VDD and HB during the turn-on of the external  
MOSFETs.  
2. To prevent large voltage transients at the drain of the top MOSFET, a low ESR electrolytic capacitor and a  
good quality ceramic capacitor must be connected between the MOSFET drain and ground (VSS).  
3. In order to avoid large negative transients on the switch node (HS) pin, the parasitic inductances between  
the top MOSFET source and the of the bottom MOSFET drain (synchronous rectifier) must be minimized.  
4. Grounding considerations:  
The first priority in designing grounding connections is to confine the high peak currents that charge and  
discharge the MOSFET gates to a minimal physical area. This will decrease the loop inductance and  
minimize noise issues on the gate terminals of the MOSFETs. The gate driver should be placed as close  
as possible to the MOSFETs.  
The second consideration is the high current path that includes the bootstrap capacitor, the bootstrap  
diode, the local ground referenced bypass capacitor, and the low-side MOSFET body diode. The  
bootstrap capacitor is recharged on a cycle-by-cycle basis through the bootstrap diode from the ground  
referenced VDD bypass capacitor. The recharging occurs in a short time interval and involves high peak  
current. Minimizing this loop length and area on the circuit board is important to ensure reliable operation.  
HS Transient Voltages Below Ground  
The HS node will always be clamped by the body diode of the lower external FET. In some situations, board  
resistances and inductances can cause the HS node to transiently swing several volts below ground. The HS  
node can swing below ground provided:  
1. HS must always be at a lower potential than HO. Pulling HO more than –0.3V below HS can activate  
parasitic transistors resulting in excessive current flow from the HB supply, possibly resulting in damage to  
the IC. The same relationship is true with LO and VSS. If necessary, a Schottky diode can be placed  
externally between HO and HS or LO and GND to protect the IC from this type of transient. The diode must  
be placed as close to the IC pins as possible in order to be effective.  
2. HB to HS operating voltage should be 15V or less. Hence, if the HS pin transient voltage is –5V, VDD should  
be ideally limited to 10V to keep HB to HS below 15V.  
3. Low ESR bypass capacitors from HB to HS and from VDD to VSS are essential for proper operation. The  
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capacitor should be located at the leads of the IC to minimize series inductance. The peak currents from LO  
and HO can be quite large. Any series inductances with the bypass capacitor will cause voltage ringing at the  
leads of the IC which must be avoided for reliable operation.  
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REVISION HISTORY  
Changes from Original (March 2013) to Revision A  
Page  
Changed layout of National Data Sheet to TI format ............................................................................................................ 7  
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PACKAGE OPTION ADDENDUM  
www.ti.com  
1-Nov-2013  
PACKAGING INFORMATION  
Orderable Device  
LM5109AMA/NOPB  
LM5109AMAX/NOPB  
Status Package Type Package Pins Package  
Eco Plan  
Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-40 to 125  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(6)  
(3)  
(4/5)  
ACTIVE  
SOIC  
SOIC  
D
8
8
95  
Green (RoHS  
& no Sb/Br)  
SN | CU SN  
Level-1-260C-UNLIM  
L5109  
AMA  
ACTIVE  
D
2500  
Green (RoHS  
& no Sb/Br)  
SN | CU SN  
Level-1-260C-UNLIM  
-40 to 125  
L5109  
AMA  
LM5109ASD  
NRND  
WSON  
WSON  
NGT  
NGT  
8
8
1000  
1000  
TBD  
Call TI  
SN  
Call TI  
-40 to 125  
-40 to 125  
5109ASD  
5109ASD  
LM5109ASD/NOPB  
ACTIVE  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LM5109ASDX/NOPB  
ACTIVE  
WSON  
NGT  
8
4500  
Green (RoHS  
& no Sb/Br)  
SN  
Level-1-260C-UNLIM  
-40 to 125  
5109ASD  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish  
value exceeds the maximum column width.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
1-Nov-2013  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
23-Sep-2013  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
LM5109AMAX/NOPB  
LM5109ASD  
SOIC  
WSON  
WSON  
WSON  
D
8
8
8
8
2500  
1000  
1000  
4500  
330.0  
178.0  
178.0  
330.0  
12.4  
12.4  
12.4  
12.4  
6.5  
4.3  
4.3  
4.3  
5.4  
4.3  
4.3  
4.3  
2.0  
1.3  
1.3  
1.3  
8.0  
8.0  
8.0  
8.0  
12.0  
12.0  
12.0  
12.0  
Q1  
Q1  
Q1  
Q1  
NGT  
NGT  
NGT  
LM5109ASD/NOPB  
LM5109ASDX/NOPB  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
23-Sep-2013  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
LM5109AMAX/NOPB  
LM5109ASD  
SOIC  
WSON  
WSON  
WSON  
D
8
8
8
8
2500  
1000  
1000  
4500  
367.0  
210.0  
210.0  
367.0  
367.0  
185.0  
185.0  
367.0  
35.0  
35.0  
35.0  
35.0  
NGT  
NGT  
NGT  
LM5109ASD/NOPB  
LM5109ASDX/NOPB  
Pack Materials-Page 2  
MECHANICAL DATA  
NGT0008A  
SDC08A (Rev A)  
www.ti.com  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest  
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale  
supplied at the time of order acknowledgment.  
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily  
performed.  
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and  
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide  
adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or  
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information  
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LM5109BMA/NOPB CAD模型

  • 引脚图

  • 封装焊盘图

  • LM5109BMA/NOPB 替代型号

    型号 制造商 描述 替代类型 文档
    LM5109BMAX/NOPB TI 1-A, 100-V half bridge gate driver with 8-V UVLO and high noise immunity 8-SOIC -40 to 125 完全替代
    LM5109BMA TI High Voltage 1-A Peak Half-Bridge Gate Driver 类似代替

    LM5109BMA/NOPB 相关器件

    型号 制造商 描述 价格 文档
    LM5109BMAX NSC High Voltage 1A Peak Half Bridge Gate Driver 获取价格
    LM5109BMAX/NOPB TI 1-A, 100-V half bridge gate driver with 8-V UVLO and high noise immunity 8-SOIC -40 to 125 获取价格
    LM5109BQNGTRQ1 TI High Voltage 1-A Peak Half Bridge Gate Driver 获取价格
    LM5109BQNGTTQ1 TI High Voltage 1-A Peak Half Bridge Gate Driver 获取价格
    LM5109BSD NSC High Voltage 1A Peak Half Bridge Gate Driver 获取价格
    LM5109BSD/NOPB TI 1-A, 100-V half bridge gate driver with 8-V UVLO and high noise immunity 8-WSON -40 to 125 获取价格
    LM5109BSDX NSC High Voltage 1A Peak Half Bridge Gate Driver 获取价格
    LM5109BSDX/NOPB TI 具有 8V UVLO 和高噪声抗扰度的 1A、100V 半桥栅极驱动器 | NGT | 8 | -40 to 125 获取价格
    LM5109MA NSC 100V / 1A Peak Half Bridge Gate Driver 获取价格
    LM5109MA/NOPB NSC IC 1 A HALF BRDG BASED MOSFET DRIVER, PDSO8, MS-012AA, SOIC-8, MOSFET Driver 获取价格

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