TMP821DR
更新时间：2024-12-03 13:11:08
品牌：TI
描述：30-V max sensored half-wave single-phase BLDC gate driver 8-SOIC -40 to 100
概述
规格参数
数据手册
替代型号TMP821DR 概述
30-V max sensored half-wave single-phase BLDC gate driver 8-SOIC -40 to 100 电机驱动器 运动控制电子器件
TMP821DR 规格参数
| 是否无铅： | 不含铅 | 是否Rohs认证： | 符合 |
| 生命周期： | Active | 零件包装代码： | SOIC |
| 包装说明： | SOP, SOP8,.25 | 针数： | 8 |
| Reach Compliance Code： | compliant | ECCN代码： | EAR99 |
| HTS代码： | 8542.39.00.01 | Factory Lead Time： | 1 week |
| 风险等级： | 1.17 | 模拟集成电路 - 其他类型： | STEPPER MOTOR CONTROLLER |
| JESD-30 代码： | R-PDSO-G8 | JESD-609代码： | e4 |
| 长度： | 4.9 mm | 湿度敏感等级： | 1 |
| 功能数量： | 1 | 端子数量： | 8 |
| 最高工作温度： | 125 °C | 最低工作温度： | -40 °C |
| 最大输出电流： | 0.07 A | 封装主体材料： | PLASTIC/EPOXY |
| 封装代码： | SOP | 封装等效代码： | SOP8,.25 |
| 封装形状： | RECTANGULAR | 封装形式： | SMALL OUTLINE |
| 峰值回流温度（摄氏度）： | 260 | 电源： | 12 V |
| 认证状态： | Not Qualified | 座面最大高度： | 1.75 mm |
| 子类别： | Motion Control Electronics | 最大供电电流 (Isup)： | 5 mA |
| 最大供电电压 (Vsup)： | 28 V | 最小供电电压 (Vsup)： | 4 V |
| 标称供电电压 (Vsup)： | 12 V | 表面贴装： | YES |
| 技术： | BIPOLAR | 温度等级： | AUTOMOTIVE |
| 端子面层： | Nickel/Palladium/Gold (Ni/Pd/Au) | 端子形式： | GULL WING |
| 端子节距： | 1.27 mm | 端子位置： | DUAL |
| 处于峰值回流温度下的最长时间： | NOT SPECIFIED | 宽度： | 3.9 mm |
| Base Number Matches： | 1 |
TMP821DR 数据手册
通过下载TMP821DR数据手册来全面了解它。这个PDF文档包含了所有必要的细节，如产品概述、功能特性、引脚定义、引脚排列图等信息。
PDF下载TMP821
www.ti.com
SLDS152–JANUARY 2008
TWO-PHASE HALF-WAVE MOTOR PREDRIVER
1
FEATURES
BLOCK DIAGRAM
•
Built-In Lock Detection and Rotational Speed
Sensing Mechanisms
•
•
•
Compact 8-Pin Package Reduces Number of
External Components Required
Automatic Restart When Motor Lock Is
Undone
VCC
1
8
A2
Hall Amplifier Inputs Have Hysteresis
DESCRIPTION
Regulator
The TMP821 is
a two-phase half-wave motor
predriver suited for fan motors.
Hall
Amp
+
H+
2
7
A1
Logic
–
AL
3
6
LD
+
–
Lock Detect/
Auto Restart
H–
4
5
GND
+
–
ORDERING INFORMATION(1)
TJ
PACKAGE(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
TMP821
–40°C to 125°C
SOIC – D
Reel of 2500
TMP821DR
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2008, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TMP821
www.ti.com
SLDS152–JANUARY 2008
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PIN ASSIGNMENTS
D PACKAGE
(TOP VIEW)
1
2
3
4
8
7
6
5
VCC
H+
AL
H–
A2
A1
LD
GND
TERMINAL FUNCTIONS
TERMINAL
DESCRIPTION
NAME
VCC
H+
NO.
1
Power input (4 V to 28 V)
Positive Hall input
2
Speed indication
AL
3
Note: May remain high for several hundred milliseconds after power-on.
H–
4
5
6
7
8
Negative Hall input
Ground
GND
LD
Timing capacitor
Driver output
Driver output
A1
A2
2
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
TMP821
www.ti.com
SLDS152–JANUARY 2008
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
VALUE
UNIT
V
VCC
VAL
IOUT
IAL
Supply voltage
30
30
70
8
Output voltage (AL)
V
Continuous output current (A1, A2)
Continuous output current (AL)
Package thermal impedance(2)
Operating junction temperature range
Storage temperature range
mA
mA
°C/W
θJA
TJ
97
–40 to 125
–55 to 150
°C
°C
Tstg
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
MIN
4
MAX
28
UNIT
V
VCC
VH
Supply voltage
Hall amplifier input voltage
Operating free-air temperature
1
VCC – 0.5
100
V
TA
–40
°C
ELECTRICAL CHARACTERISTICS
VCC = 12 V, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
VHYS
VAL
IAL
Hall amplifier input voltage hysteresis
Lock alarm signal low-level output voltage
Lock alarm signal low-level output current
Lock detection capacitor charge current
Lock detection capacitor discharge current
±3
±15
0.5
mV
V
AL
AL
LD
LD
IAL = 5 mA
VAL = 2 V
8
2
mA
µA
µA
ILDC
ILDD
VLD = 1.5 V
VLD = 1.5 V
3.45
0.8
5.25
1.45
0.35
Lock detection capacitor charge/discharge
current ratio
rCD
LD
LD
rCD = ILDC/ILDD
3
4.5
8
VLDCL
VLDCP
V7H
Lock detection capacitor clamp voltage
2.2
0.4
10
2.6
0.6
3
V
V
Lock detection capacitor comparator voltage LD
0.8
High-level output voltage
High-level output voltage
Supply current
A1
A2
IOH = –10 mA
IOH = –10 mA
Output off
10.5
10.5
3.2
V
V8H
10
V
ICC
5
mA
Copyright © 2008, Texas Instruments Incorporated
Submit Documentation Feedback
3
TMP821
www.ti.com
SLDS152–JANUARY 2008
TYPICAL CHARACTERISTICS
AL CURRENT CONSUMPTION
vs
A1/A2 OUTPUT VOLTAGE
vs
A1/A2 OUTPUT CURRENT
AL SUPPLY VOLTAGE
(VCC = 12 V)
12
11.5
11
20
15
10
5
10.5
10
0
0
20
40
60
A1/A2 Output Current – mA
80
0
2
4
6
8
10 12 14 16 18 20
VAL – Supply Voltage – V
4
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
TMP821
www.ti.com
SLDS152–JANUARY 2008
APPLICATION INFORMATION
VCC
5
8
7
6
A2
A1
LD
GND
VCC
H+
AL
H–
3
1
2
4
Hall
Figure 1. Typical Application Circuit
Copyright © 2008, Texas Instruments Incorporated
Submit Documentation Feedback
5
TMP821
www.ti.com
SLDS152–JANUARY 2008
Lock Detection
When a motor lock is detected, the TMP821 automatically shuts down its output current. When the motor lock is
removed, the TMP821 automatically restarts. Motor lock is detected when the Hall signal stops switching, as
shown in Figure 2.
Motor Motor lock
locked detected
Motor lock
cleared
Return to
normal operation
Hall Input
On
Off
Motor Output
Clamp voltage
LD
Comparator voltage
tOFF
tON
AL
Figure 2.
tON and tOFF are determined by the capacitor connected to LD:
tON = (CLD × (VLD_CLAMP – VLD_COMP) / ILD_CHARGE (seconds)
tOFF = (CLD × (VLD_CLAMP – VLD_COMP) / ILD_DISCHARGE (seconds)
Where:
CLD = capacitance of the external capacitor on LD
VLD_CLAMP = LD clamp voltage
VLD_COMP = LD comparator voltage
ILD_CHARGE = LD charge current
ILD_DISCHARGE = LD discharge current
NOTE:
After power is supplied to the device, the the lock detection pin (AL) may remain high
for a few hundred milliseconds (see Figure 3).
Power
AL
A few hundred milliseconds
Figure 3. Power-On to AL Delay
6
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
TMP821
www.ti.com
SLDS152–JANUARY 2008
Power Dissipation
Figure 4 shows allowable power dissipation versus ambient temperature.
1
0.8
0.6
0.4
0.2
0
0
25
50
75
TA – Temperature – °C
100
Figure 4. Power Dissipation
Total power consumption can be calculated as shown in Equation 1.
Ptotal = PC1 + PC2 + PC3
(1)
Where:
PC1 = circuit power dissipation
PC1 = VCC × ICC
PC2 = output power dissipation
PC2 = (VCC – VOH) × IO
VOH = A1 and A2 high-level voltage
PC2 can be reduced by increasing the external output transistor's hFE rank to reduce the IO consumption.
PC3 = AL power dissipation
PC3 = VAL_LOW × IAL
Copyright © 2008, Texas Instruments Incorporated
Submit Documentation Feedback
7
PACKAGE OPTION ADDENDUM
www.ti.com
17-Jan-2008
PACKAGING INFORMATION
Orderable Device
TMP821DR
Status (1)
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
D
8
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TMP821DRG4
SOIC
D
8
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TMP821DR
TMP821DR
SOIC
SOIC
D
D
8
8
2500
2500
330.0
330.0
12.4
12.4
6.4
6.4
5.2
5.2
2.1
2.1
8.0
8.0
12.0
12.0
Q1
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TMP821DR
TMP821DR
SOIC
SOIC
D
D
8
8
2500
2500
340.5
367.0
338.1
367.0
20.6
35.0
Pack Materials-Page 2
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TMP821DR CAD模型
引脚图
封装焊盘图
TMP821DR 替代型号
| 型号 | 制造商 | 描述 | 替代类型 | 文档 |
| TMP821DRG4 | TI | TWO-PHASE HALF-WAVE MOTOR PREDRIVER | 类似代替 |
|
TMP821DR 相关器件
| 型号 | 制造商 | 描述 | 价格 | 文档 |
| TMP821DRG4 | TI | TWO-PHASE HALF-WAVE MOTOR PREDRIVER | 获取价格 |
|
| TMP8237AP | ETC | DMA Controller | 获取价格 |
|
| TMP8237AP-5 | ETC | DMA Controller | 获取价格 |
|
| TMP8243P | ETC | I/O Port | 获取价格 |
|
| TMP8243PI | ETC | I/O Port | 获取价格 |
|
| TMP8251AP | TOSHIBA | ROGRAMMABL COMMUNICATION INTERFACE | 获取价格 |
|
| TMP8253 | TOSHIBA | PROGRAMMABLE INTERVAL TIMER | 获取价格 |
|
| TMP8253P-5 | TOSHIBA | PROGRAMMABLE INTERVAL TIMER | 获取价格 |
|
| TMP8255A | TOSHIBA | PROGRAMMABLE PERIPHERAL INTERFACE | 获取价格 |
|
| TMP8255AP-5 | TOSHIBA | PROGRAMMABLE PERIPHERAL INTERFACE | 获取价格 |
|
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