Approval sheet
TEST AND REQUIREMENTS(JIS C 5201-1 : 1998)
Essentially all tests are carried out according to the schedule of IEC publication 115-8, category
LCT/UCT/56(rated temperature range : Lower Category Temperature, Upper Category Temperature; damp
heat, long term, 56 days). The testing also meets the requirements specified by EIA, EIAJ and JIS.
The tests are carried out in accordance with IEC publication 68, "Recommended basic climatic and mechanical
robustness testing procedure for electronic components" and under standard atmospheric conditions according
to IEC 60068-1, subclause 5.3. Unless otherwise specified, the following value supplied :
Temperature: 15°C to 35°C.
Relative humidity: 45% to 75%.
Air pressure: 86kPa to 106 kPa (860 mbar to 1060 mbar).
All soldering tests are performed with midly activated flux.
REQUIREMENT
TEST
PROCEDURE / TEST METHOD
Resistor
0Ω
DC resistance values measured at the test voltages specified
below :
DC resistance
Clause 4.5
Within the specified tolerance
<50mΩ
<10Ω@0.1V, <100Ω@0.3V, <1KΩ@1.0V,
<10KΩ@3V, <100KΩ@10V, <1MΩ@25V, <10MΩ@30V
Natural resistance change per change in degree centigrade.
Temperature
Coefficient of
Resistance(T.C.R)
R2 − R
×106 (ppm/°C) t1 : 20°C+5°C-1°C
1
Refer to
N/a
R
(
t2 − t1
)
1
Clause 4.8
“QUICK REFERENCE DATA”
R1 : Resistance at reference temperature
R2 : Resistance at test temperature
Short time overload
(S.T.O.L)
Permanent resistance change after a 5second application of a
voltage 2.5 times RCWV or the maximum overload voltage
specified in the above list, whichever is less.
1% tol.: ∆R/R max. ±(1%+0.10Ω)
5% tol.: ∆R/R max. ±(2%+0.10Ω)
<50mΩ
<50mΩ
Clause 4.13
Resistance to
soldering heat(R.S.H)
Clause 4.18
Un-mounted chips completely immersed for 10±1second in a 1% tol.: ∆R/R max. ±(0.5%+0.10Ω)
SAC solder bath at 260℃±5ºC
5% tol.: ∆R/R max. ±(1%+0.10Ω)
95% coverage min., good tinning and no visible
damage
Un-mounted chips completely immersed for 2±0.5 second in a
SAC solder bath at 235℃±5℃
Solderability
Clause 4.17
30 minutes at -55°C±3°C, 2~3 minutes at 20°C+5°C-1°C, 30
minutes at +155°C±3°C, 2~3 minutes at 20°C+5°C-1°C, total 5
continuous cycles
Temperature cycling
1% tol.: ∆R/R max. ±(0.5%+0.10Ω)
<50mΩ
5% tol.: ∆R/R max. ±(1%+0.10Ω)
Clause 4.19
1000 +48/-0 hours, loaded with RCWV or Vmax in humidity
chamber controller at 40°C±2°C and 90~95% relative humidity,
1.5hours on and 0.5 hours off
1% tol.: ∆R/R max. ±(1%+0.10Ω)
Damp Heat
5% tol.: ∆R/R max. ±(2%+0.10Ω)
<50mΩ
(Load life in humidity)
Clause 4.24
1000 +48/-0 hours; loaded with RCWV or Vmax in chamber
1% tol.: ∆R/R max. ±(1%+0.10Ω)
Load Life(Endurance)
<50mΩ
5% tol.: ∆R/R max. ±(2%+0.10Ω)
controller 70±2ºC, 1.5 hours on and 0.5 hours off
Clause 4.25
Resistors mounted on a 90mm glass epoxy resin PCB(FR4),
bending once 3mm for 10sec, 5mm for WR04
1% tol.: ∆R/R max. ±(0.5%+0.10Ω)
<50mΩ
5 tol.: ∆R/R max. ±(1%+0.10Ω)
Bending strength
Clause 4.33
No remarkable damage or removal of the
terminations
Adhesion
Pressurizing force: 5N, Test time: 10±1sec.
Clause 4.32
Page 6 of 8
ASC_WR_TR (Pb<100ppm)_V07
Nov - 2014