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WEDF1M32B-70HM5A

更新时间：2025-07-11 05:06:20

品牌：WEDC

描述：Flash Module, 1MX32, 70ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66

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WEDF1M32B-70HM5A 概述

Flash Module, 1MX32, 70ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66

WEDF1M32B-70HM5A 数据手册

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WEDF1M32B-XXX5

White Electronic Designs

ADVANCED*

1Mx32 5V Flash Module

FEATURES

ꢀ

Access Times of 70, 90, 120ns

ꢀ

Organized as 1Mx32, user conﬁgurable as 2Mx16

or 4Mx8.

ꢀ

Packaging:

Commercial, Industrial and Military Temperature

Ranges

• 66 pin, PGA Type, 1.185” square, Hermetic

Ceramic HIP (Package 401)

ꢀ

5V 10ꢀ for Read and Write Operations.

Low Power CMOS

• 68 lead, 22mm Low Proﬁle CQFP, 4.6mm

(0.180”), (Package 509)

ꢀ

Sector Architecture

Embedded Erase and Program Algorithm

• One 16KByte Sectors

• Two 8KByte Sectors

Built-in Decoupling Caps and Multiple Ground Pins

for Low Noise Operation

ꢀ

Weight

• One 32KByte Sectors

• Fifteen 64KByte Sectors

1,000,000 Erase/Program Cycles

WEDF1M32B-XG2TX5 - 8 grams typical

WEDF1M32B-XHX5 - 13 grams typical

* This product is under development, is not qualiﬁed or characterized and is subject to

change or cancellation without notice.

PIN CONFIGURATION FOR WF1M32B-XHX5

Top View

PIN DESCRIPTION

I/O0-31

A0-19

WE#

Data Inputs/Outputs

Address Inputs

Write Enable

I/O

RESET#

I/O15

I/O14

I/O13

I/O12

OE#

I/O24

I/O25

I/O26

I/O31

I/O30

I/O29

I/O28

CS1-4#

OE#

Chip Selects

CS4#

Output Enable

I/O10

GND

I/O11

RESET# Reset

V_CC

GND

Power Supply

I/O27

Ground

Not Connected

A17

WE#

Block Diagram

I/O

I/O16

I/O17

I/O18

I/O23

I/O22

I/O21

I/O20

CS1#

CS2#

CS3#

CS4#

RESET#

WE#

I/O

CS1

OE#

A0-19

A19

GND

I/O19

1M x 8

I/O

I/O16-23

I/O24-31

I/O0-7

I/O8-15

White Electronic Designs Corp. reserves the right to change products or speciﬁcations without notice.

May 1999

Rev.1

White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

WEDF1M32B-XXX5

White Electronic Designs

ADVANCED

Pin Conﬁguration for WF1M32B-XG2TX5

Top View

Pin Description

I/O0-31

Data Inputs/Outputs

Address Inputs

Write Enables

Chip Selects

A0-19

68 67 66 65 64 63 62 61

WE1-4#

CS1-4#

OE#

I/O0

I/O1

I/O2

I/O3

I/O4

I/O5

I/O6

I/O7

GND

I/O8

I/O16

I/O17

I/O18

I/O19

I/O20

I/O21

I/O22

I/O23

GND

I/O24

I/O25

I/O26

I/O27

I/O28

I/O29

I/O30

I/O31

Output Enable

RESET# Reset/Powerdown

V_CC

Power Supply

Ground

The White 68 lead G2T CQFP ﬁlls the

same ﬁt and function as the JEDEC 68 lead

CQFJ or 68 PLCC. But the G2T has the

TCE and lead inspection advantage of the

CQFP form.

GND

I/O9

I/O10

I/O11

I/O12

I/O13

I/O14

I/O15

Block Diagram

27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43

WE1# CS1#

WE2# CS2#

WE3# CS3#

WE4# CS4#

RESET#

OE#

A0-19

1M x 8

I/O16-23

I/O24-31

I/O0-7

I/O8-15

White Electronic Designs Corp. reserves the right to change products or speciﬁcations without notice.

May 1999

Rev.1

White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

WEDF1M32B-XXX5

White Electronic Designs

ADVANCED

ABSOLUTE MAXIMUM RATINGS

RECOMMENDED OPERATING CONDITIONS

Parameter

Voltage on Any Pin with Respect to GND

– V_CCand V_PP

Voltage with Respect to GND – A9, OE#, and -2.0 to +12.5 V

RESET (2)

Voltage with Respect to GND – All other

pins (1)

Unit

Parameter

Supply Voltage

Input High Voltage

Input Low Voltage

Operating Temp. (Mil.)

Symbol

V_CC

V_IH

V_IL

T_A

Min

4.5

2.0

-0.5

-55

Max

5.5

V_CC+ 0.5

+0.8

Unit

°C

-0.5 to +7.0

+125

-2.0 to +7.0 V

Output Short Circuit Current

NOTES:

200

1. Minimum DC voltage is -0.5V on input/output pins. During transitions, this level

may undershoot to -2.0V for periods <20ns. Maximum DC voltage on input/output

pins is V_CC+ 0.5V which, during transitions, may overshoot to V_CC+ 2.0V for

periods <20ns.

2. Minimum DC input voltage on pins A9, OE#, and RESET is -0.5V. During voltage

transitions, A9, OE#, and RESET may undershoot Vss to -2.0V for periods of up

to 20ns. See Figure 6. Maximum DC input voltage on pin A9 is +12.5V which may

overshoot to +13.5V for periods up to 20ns.

3. Output shorted for no more than one second. No more than one output shorted

at a time.

Stresses above those listed under “Absolute Maximum Ratings” may cause permanent

damage to the device. This is a Stress rating only and functional operation of the device

at these or any other conditions above those indicated in the operational sections of

this speciﬁcation is not implied. Exposure to absolute maximum rating conditions for

extended periods may affect device reliability.

CAPACITANCE

T_A= +25°C

Parameter

OE# capacitance

Symbol

C_OE

Conditions

V_IN= 0 V, f = 1.0 MHz

Max Unit

50 pF

20 pF

50 pF

WE#1-4 capacitance

CS1-4 capacitance

Data I/O capacitance

Address input capacitance

C_WE

C_CS

C_I/O

V_IN= 0 V, f = 1.0 MHz

V_I/O= 0 V, f = 1.0 MHz

V_IN= 0 V, f = 1.0 MHz

C_AD

This parameter is guaranteed by design but not tested.

DATA RETENTION

Parameter

Minimum Pattern Data

Retention Time

Test Conditions

150°C

Min

Unit

Years

125°C

AC TEST CIRCUIT

AC TEST CONDITIONS

Parameter

Typ

Unit

I_OL

Input Pulse Levels

V_IL= 0, V_IH= 2.5

Current Source

Input Rise and Fall

Input and Output Reference Level

Output Timing Reference Level

NOTES:

_Zis programmable from -2V to +7V.

_OL& I_OHprogrammable from 0 to 16mA.

Tester Impedance Z0 = 75 Ω.

_Zis typically the midpoint of V_OHand V_OL

_OL& I_OHare adjusted to simulate a typical resistive load circuit.

ATE tester includes jig capacitance.

1.5

D.U.T.

V_Z

≈ 1.5V

(Bipolar Supply)

C_eff= 50 pf

I_OH

Current Source

White Electronic Designs Corp. reserves the right to change products or speciﬁcations without notice.

May 1999

Rev.1

White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

WEDF1M32B-XXX5

White Electronic Designs

ADVANCED

DC CHARACTERISTICS – CMOS COMPATIBLE

V_CC= 5.0V, GND = 0V, -55°C ≤ T_A≤ +125°C

Conditions

V_IN= V_CCto GND

V_OUT= V_CCto GND

CS# = V_IL, OE# = V_IH, f = 5MHz, IOUT = 0mA

CS# = V_IL, OE# = V_IH

CS# = RESET# = OE# = CS = V_IH, f = 5MHz

V_CC= 4.5, I_OL= 5.8 mA

V_CC= 4.5, I_OH= -2.5 mA

Parameter

Symbol

I_LI

I_LO

I_CC1

I_CC2

I_CC3

V_OL

V_OH

V_LKO

Min

Max

160

200

20.0

0.45

Unit

µA

Input Leakage Current

Output Leakage Current

V_CCRead Current (1, 2)

V_CCWrite Current (2, 3 ,4)

V_CCStandby Current (2, 5)

Output Low Voltage

Output High Voltage

Low V_CCLock-Out Voltage (4)

NOTES:

2.4

3.2

4.2

1. The I_CCcurrent listed is typically less than 2mA/MHz, with OE# at V_IH

2. Maximum I_CCspeciﬁcations are tested with V_CC= V_CCmax

4. Not 100% tested.

5. _CC3= 20µA max at extended temperature (> +85°C).

I_CCactive while Embedded Erase or Embedded Program is in progress.

AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS – CS# CONTROLLED

V_CC= 5.0V, GND = 0V, -55°C ≤ T_A≤ +125°C

Parameter

Symbol

-70

-90

-120

Unit

Min

Max

Min

Max

Min

Max

t_AVAV

t_WC

t_CS

t_WP

t_AS

120

Write Cycle Time

t_ELWL

t_WLWH

t_AVWH

345

Chip Select Setup Time

Write Enable Pulse Width

Address Setup Time

t_DVWH

t_WHDX

t_WLAX

t_WHEH

t_WHWL

t_WHWH1

t_WHWH2

t_WHECL

t_DS

µs

sec

µs

sec

Data Setup Time

t_DH

t_AH

t_CH

t_WPH

Data Hold Time

Address Hold Time

Chip Select Hold Time

Write Enable Pulse Width High

Programming Operation (2)

Sector Erase Operation (3)

Write Recovery before Read

Chip Programming Time

300

NOTES:

1. Guaranteed by design, not tested.

2. Typical value for t_WHWH1is 7µs.

3. Typical value for t_WHWH2is 1sec.

White Electronic Designs Corp. reserves the right to change products or speciﬁcations without notice.

May 1999

Rev.1

White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

WEDF1M32B-XXX5

White Electronic Designs

ADVANCED

AC CHARACTERISTICS – WRITE OPERATIONS – CS# CONTROLLED⁽¹⁾

V_CC= 5.0V, GND = 0V, -55°C ≤ T_A≤ +125°C

Parameter

Symbol

-70

-90

-120

Unit

Min

Max

Min

Max

Min

120

Max

Write Enable Cycle Time

Write Enable Setup Time

Chip Select Pulse Width

Address Setup Time

Data Setup Time

Data Hold Time

t_AVAV

t_WLEL

t_ELEH

t_WC

t_WS

t_CP

t_AS

t_DS

t_DH

t_AH

t_WH

t_EPH

µs

sec

µs

t_AVEH

t_DVEH

t_EHDX

t_EHAX

t_EHWH

t_EHEL

t_WHWH1

t_WHWH2

t_EHGL

Address Hold Time

Write Enable Hold Time

Chip Select Pulse Width High

Programming Operation (1)

Sector Erase Operation (2)

Write Recovery before Read

300

NOTES:

1. Typical value for t_WHWH1is 7µs.

2. Typical value for t_WHWH2is 1sec.

AC CHARACTERISTICS – READ-ONLY OPERATIONS

V_CC= 5.0V, GND = 0V, -55°C ≤ T_A≤ +125°C

Parameter

Symbol

-70

-90

-120

Unit

Min

Max

Min

Max

Min

Max

Read Cycle Time

Address Access Time

t_AVAV

t_RC

t_ACC

t_CE

t_OE

t_LZ

t_HZ

t_OLZ

t_DF

120

t_AVQV

t_ELQV

t_GLQV

t_ELQX

t_EHQZ

t_GLQX

t_GHQZ

120

Chip Select to Output Valid (1)

Output Enable to Output Valid (1)

Chip Select to Output Low Z (2)

Chip Select High to Output High Z (2)

Output Enable to Output Low Z (2)

Output Enable High to Output High Z (2)

Output Hold from Addresses, CS# or OE#

Change, Whichever is First (2)

t_OH

NOTES:

1. OE# may be delayed up to t_CE-t_OEafter the falling edge of CS# without impact on t_CS

2. Guaranteed by design, not tested.

White Electronic Designs Corp. reserves the right to change products or speciﬁcations without notice.

May 1999

Rev.1

White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

WEDF1M32B-XXX5

White Electronic Designs

ADVANCED

PACKAGE 509: 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2T)

25.15 (0.990) 0.26 (0.010) SQ

4.57 (0.180) MAX

22.36 (0.880) 0.26 (0.010) SQ

0.27 (0.011) 0.04 (0.002)

Pin 1

0.25 (0.010) REF

R 0.25

(0.010)

24.03 (0.946)

0.26 (0.010)

0.19 (0.007)

0.06 (0.002)

1° / 7°

1.0 (0.040)

0.127 (0.005)

23.87

(0.940) REF

DETAIL A

1.27 (0.050) TYP

SEE DETAIL "A"

0.38 (0.015) 0.05 (0.002)

20.3 (0.800) REF

The WEDC 68 lead G2T

CQFP ﬁlls the same ﬁt and

function as the JEDEC 68

lead CQFJ or 68 PLCC.

But the G2T has the TCE

and lead inspection advan-

tage of the CQFP form.

ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES

White Electronic Designs Corp. reserves the right to change products or speciﬁcations without notice.

May 1999

Rev.1

White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

WEDF1M32B-XXX5

White Electronic Designs

ADVANCED

PACKAGE 401: 66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H)

30.1 (1.185) 0.38 (0.015) SQ

PIN 1 IDENTIFIER

SQUARE PAD

ON BOTTOM

25.4 (1.0) TYP

3.81 (0.150)

0.1 (0.005)

1.27 (0.050) 0.1 (0.005)

0.76 (0.030) 0.1 (0.005)

2.54 (0.100)

1.27 (0.050) TYP DIA

15.24 (0.600) TYP

25.4 (1.0) TYP

TYP

0.46 (0.018) 0.05 (0.002) DIA

ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES

White Electronic Designs Corp. reserves the right to change products or speciﬁcations without notice.

May 1999

Rev.1

White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

WEDF1M32B-XXX5

White Electronic Designs

ADVANCED

ORDERING INFORMATION

WED F 1M32 B - XXX X X 5 X

LEAD FINISH:

Blank = Gold plated leads

A = Solder dip leads

PROGRAMMING VOLTAGE

5 = 5V

DEVICE GRADE:

M = Military Screened

I = Industrial

-55°C to +125°C

-40°C to +85°C

0°C to +70°C

C = Commercial

PACKAGE TYPE:

H = Ceramic Hex In line Package, HIP (Package 401)

G2T = 22mm Ceramic Quad Flat Pack, Low Proﬁle CQFP (Package 509)

ACCESS TIME (ns)

BOTTOM BOOT BLOCK

ORGANIZATION, 1M x 32

User conﬁgurable as 2M x 16 or 4M x 8

FLASH

WHITE ELECTRONIC DESIGNS CORP.

White Electronic Designs Corp. reserves the right to change products or speciﬁcations without notice.

May 1999

Rev.1

White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

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