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SMD type antennas
for BT/802.11b/g application
2.45 GHz
size 5.3 × 2.0
Phycomp
Product specification
SMD type antennas
for BT/802.11b/g application 2.45 GHz size 5.3 × 2.0
High Frequency
FEATURES
DESCRIPTION
• Designed for 2.45 GHz ISM-band
• Simplifies antenna circuitry
• NiSn lead-free terminations
This 2.45 GHz ceramic multilayer antenna has been
designed to meet the requirements of the BluetoothTM(1)
and IEEE 802.11b/g wireless communications protocol. It
consists of a rectangular block of low-dielectric ceramic
• Suitable for wave and reflow soldering
• Supplied in tape on reel.
material and is fabricated in a water-based non-toxic
process. The antenna is capable of providing good
connectivity using near 50 Ω microstrip directly onto the
PC board.
APPLICATIONS
Notes
• Telecommunications
1. Bluetooth is a trademark owned by
• Computing (PCs, printers, PDAs)
Telefonieaktiebolaget L M Ericsson, Sweden.
• Wireless office data communications including WLAN
• Consumer electronics (wireless headphones).
QUICK REFERENCE DATA
DESCRIPTION
VALUE
Centre frequency
2.45 GHz
0 type/01type/02 type/03 type/Default/04 type/05 type
＞100 MHz
Bandwidth
Gain
4 dBi max. (depends on the special environment)
VSWR
2.5 max. (depends on the special environment)
Polarization
Linear
Azimuth beam width
Impedance
Omni-directional
50 Ω
Power dissipation
Operating temperature
Terminations
1 W
−55 to +85 °C
NiSn
Resistance to soldering heat
260 °C for 10 seconds
2004 Oct 12 Rev.4
2
www.yageo.com
Phycomp
Product specification
SMD type antennas
for BT/802.11b/g application 2.45 GHz size 5.3 × 2.0
High Frequency
MECHANICAL DATA
W
W
C
C
L
F
T
F
IWA0001
For dimensions see Table 1.
Fig.1. Component outline.
Physical dimensions
Table 1 Antenna dimensions
SYMBOL
DETAILS
DIMENSIONS (mm)
5.3 ±0.20
L
W
T
−
−
2.0 ±0.20
−
1.3 ±0.20
F
feed termination
2.0 ±0.20
C
−
0.4 ±0.25
2004 Oct 12 Rev.4
3
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Phycomp
Product specification
SMD type antennas
for BT/802.11b/g application 2.45 GHz size 5.3 × 2.0
High Frequency
ELECTRICAL CHARACTERISTICS
DESCRIPTION
VALUE
Centre frequency
2.45 GHz
0 type/01type/02 type/03 type/Default/04 type/05 type
＞100 MHz
Bandwidth
Gain
4 dBi max. (depends on the special environment)
VSWR
2.5 max. (depends on the special environment)
Polarization
Linear
Azimuth beam width
Impedance
Omni-directional
50 Ω
Power dissipation
Operating temperature
Terminations
Resistance to soldering heat
Weight
1 W
−55 to +85 °C
NiSn
260 °C for 10 s
0.05 g/piece
FOOTPRINT DIMENSIONS
L
C
C
F
W
Antenna
IWA0002
L
1
For dimensions see Table 2.
Fig.2. Recommend dimensions of solder
Physical dimensions
Table 2 The dimensions of antenna appearance
SYMBOL DETAILS
DIMENSIONS (mm)
5.5 ±0.2
L
−
−
W
F
2.2 ±0.2ꢀ
2.2 ±0.2
feed pad
C
L1
−
−
0.5 ±0.25
4.3 ±0.5
2004 Oct 12 Rev.4
4
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Phycomp
Product specification
SMD type antennas
for BT/802.11b/g application 2.45 GHz size 5.3 × 2.0
High Frequency
IWA0005
IWA0004
Γ (dB)
SWR
10.0
0
5
10
15
20
25
30
35
40
45
9.0
8.0
7.0
6.0
5.0
4.0
1
2
3.0
1
2
2.0
1.0
2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0
f (GHz)
2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0
f (GHz)
Marker data:
Marker data:
1: SWR= 2.5; f= 2.30 GHz
2: SWR= 2.5; f= 2.70 GHz
1: Γ= −10 dB; f= 2.33 GHz
2: Γ= −10 dB; f= 2.60 GHz
Pre-tuning reference only,after-tuning performance is depending on
customer installation.
Fig.3 The measurements of typical SWR and return loss on the special environment .
2004 Oct 12 Rev.4
5
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Phycomp
Product specification
SMD type antennas
for BT/802.11b/g application 2.45 GHz size 5.3 × 2.0
High Frequency
−180°
−180°
−
90°
−
270°
IWA0058
−
90°
−
270°
0°
XY plane
YZ plane
XZ plane
0°
−180°
−
90°
−
270°
Fig.4 The definitions of X-Y-Z
plane and angle for
radiation pattern
0°
−180°
−180°
−180°
Vertical
Horizontal
−40 −30 −20 −10
0
dBi
0
dBi
0
−90°
−270° −90°
−270° −90°
−270°
dBi
−40 −30 −20 −10
−40 −30
−10
−20
XY
XZ
YZ
0°
0°
0°
IWA0006
For antenna gain value see Table 3.
Fig.5 Radiation pattern measurements
Table 3 Max. and avg. antenna gain value of radiation pattern
Plane
XY (dBi)
−3.8
−8.4
4.0
XZ(dBi)
2.6
YZ (dBi)
−1.8
−9.7
2.7
Vertical Pol. (max.)
Vertical Pol. (avg.)
Horizontal Pol. (max.)
Horizontal Pol. (avg.)
Total gain (max.)
Total gain (avg.)
−1.6
−1.9
−8.4
2.7
−2.2
4.0
−2.1
2.7
−1.9
−1.3
−1.9
2004 Oct 12 Rev.4
6
www.yageo.com
Phycomp
Product specification
SMD type antennas
for BT/802.11b/g application 2.45 GHz size 5.3 × 2.0
High Frequency
ORDERING INFORMATION
Components may be ordered by using either a Phycomp’s unique 12NC or the simple 17-digit clear text code (Yageo
part number)
12NC ORDERING CODE
EXAMPLE: 4311 153 00245
4 3 X X 1 5 3 0 0 2 X X
Family
Centre frequency
245 2.45 GHz Default
200 2.00 GHz 00type
210 2.10 GHz 01type
220 2.20 GHz 02type
230 2.30 GHz 03type
240 2.40 GHz 04type
250 2.50 GHz 05type
43 antenna
Packing
11 reel: ∅180 mm; 7", blister, 1000 pcs
13 bulk, 1000 pcs
Tolerance
00
at 100 MHz Impedance Bandwidth
Material
1
high-frequency material
Size
5.3 x 2.0 x 1.3 mm
53
IWA0008
Yageo part number
EXAMPLE: CAN4311153002451K
DESCRIPTION
CODE
Family
CAN43 = antenna products
11 = 180 mm/7” blister
1 = high frequency materials
53 = 5.3 × 2.0 × 1.3 mm
00 = large than 100 MHz
245 = 2.45 GHz (Default)
200 = 2.0 GHz (00 type)
210 = 2.1 GHz (01 type)
220 = 2.2 GHz (02 type)
230 = 2.3 GHz (03 type)
240 = 2.4 GHz (04 type)
250 = 2.5 GHz (05 type)
1K = 1,000 pcs per reel
Packing
Materials
Size
Tolerance
Working Frequency(1)
Packing type
Notes
1. Depends on the special environment.
2004 Oct 12 Rev.4
7
www.yageo.com
Phycomp
Product specification
SMD type antennas
for BT/802.11b/g application 2.45 GHz size 5.3 × 2.0
High Frequency
TESTS AND REQUIREMENTS
Table 4 Test procedures and requirements
IEC
IEC
384-10/
CECC32 100
CLAUSE
60068-2
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
4.4
mounting
the antenna may be mounted on no visible damage
printed-circuit boards or ceramic
substrates by applying wave
soldering, reflow soldering
(including vapour phase
soldering) or conductive
adhesive
4.5
4.8
visual inspection and
dimension check
any applicable method using
× 10 magnification
in accordance with
specification (chip off 4
mm)
adhesion
a force of 3 N applied for 10 s to
the line joining the terminations
and in a plane parallel to the
substrate
4.9
bond strength of
plating on end face
mounted in accordance with
CECC 32 100, paragraph 4.4
no visible damage
no visible damage
conditions: bending 0.5 mm at a
rate of 1 mm/s; radius jig: 340
mm; 2 mm warp on FR4 board of
90 mm length
4.10
20 (Tb)
resistance to soldering 260 ±5 °C for 10 ±5 s in a static
heat solder bath
the terminations should be
well tinned after recovery;
central frequency
changed to ±6%
resistance to leaching at 260 ±5 °C for 30 ±1 s in a static using visual enlargement
solder bath
of × 10, dissolution of the
terminations should not
exceed 10%
4.11
20 (Ta)
solderability
zero hour test, and test after
storage (20 to 24 months) in
original atmosphere; unmounted
chips completely immersed for 2
±0.5 s at 235 ±5 °C
good tinning (≥ 75%
covered) at terminations
2004 Oct 12 Rev.4
8
www.yageo.com
Phycomp
Product specification
SMD type antennas
for BT/802.11b/g application 2.45 GHz size 5.3 × 2.0
High Frequency
IEC
IEC
60384-10/
CECC32 100
CLAUSE
60384-2
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
4.12
4.14
4.15
4 (Na)
rapid change of
temperature
−55 °C (30 minutes) to +85 °C no visual damage;
(30 minutes); 100 cycles
central frequency changed to
±6%
3 (Ca)
damp heat
endurance
500 ±12 hours at 60 °C;
no visual damage;
90 to 95% RH
2 hours recovery; central
frequency changed to ±6%
500 ±12 hours at 85 °C
no visual damage; 2 hours
recovery; central frequency
changed to ±6%
2004 Oct 12 Rev.4
9
www.yageo.com
Phycomp
Product specification
SMD type antennas
for BT/802.11b/g application 2.45 GHz size 5.3 × 2.0
High Frequency
PACKING
Tape and reel specifications
Tape and reel specifications are in accordance with “IEC 60286-3”. Basic dimensions are given in Fig. 6 and 7, and
Table 5 and 6.
Peel-off force
Peel-off force of the blister tape is in accordance with “IEC 60286-3”; that is, at a peel-off speed of 300 ±10 mm/minute,
0.1 N to 1.3 N for 16 mm tape. The peel-off angle should be between 165° and 180°
Blister tape
ENVIRONMENTAL CONSIDERATIONS
• Cover tape, carrier tape and reel do not contain environmentally harmful PVC materials.
• Because the carrier tape is made of polycarbonate, a homogeneous material (mono-plastic), it is ideally suited for
recycling.
• Compared to other PVC-free materials polycarbonate shows excellent stiffness and very little deformation with
temperature.
Blister tape specifications
K
P
0
0
T
D
P
2
0
E
F
cover tape
W
B
0
MBG516
A
D
1
T
1
0
T
P
1
2
direction of unreeling
Cumulative pitch error: 0.2 mm over 10 pitches.
Cumulative tolerance over 10 holes: ±0.2 mm.
K : chosen so that the orientation of the component cannot change.
0
For dimensions see Table 5.
Fig.6 Blister tape
2004 Oct 12 Rev.4
10
www.yageo.com
Phycomp
Product specification
SMD type antennas
for BT/802.11b/g application 2.45 GHz size 5.3 × 2.0
High Frequency
Table 5 Dimensions of blister tape; see Fig. 6
SYMBOL
DIMENSION
TOLERANCE
±0.10
UNIT
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
A0 nominal clearance; note 1
B0 nominal clearance; note 1
K0 nominal clearance; note 1
2.28
5.70
1.58
12.0
1.75
5.50
1.50
1.50
4.0
±0.10
±0.10
W
E
±0.30
±0.10
F
±0.05
D0
±0.10
D1
P0
P1
P2
T
±0.25
±0.10
4.0
±0.10
2.0
±0.05
0.229
±0.02
Note
1. Possible product displacement in pocket.
2. P0 pitch tolerance over any 10 pitches is ±0.2 mm.
2004 Oct 12 Rev.4
11
www.yageo.com
Phycomp
Product specification
SMD type antennas
for BT/802.11b/g application 2.45 GHz size 5.3 × 2.0
High Frequency
Reel specifications
W
2
C
N
A
W
1
HBK039
Dimensions in mm.
For reel dimension see Table 6
Fig.7 Reel.
Table 6 Reel dimensions; see Fig.7
TAPE WIDTH
(mm)
A
(mm)
C
(mm)
N
(mm)
W1
(mm)
W2
(mm)
QUANTITY PER REEL
(pcs)
12 ±0.3
180 ±1.0
19 ±2.0
58 ±2.0
12.4 ±2.0
18.4 ±2.0
1,000
2004 Oct 12 Rev.4
12
www.yageo.com
Phycomp
Product specification
SMD type antennas
for BT/802.11b/g application 2.45 GHz size 5.3 × 2.0
High Frequency
REVISION HISTORY
Revision
Date
Change
Description
Notification
Rev.3
Rev.4
2004 July 15
2004 Oct 12
-
-
- Updated company logo
- Add more types of central frequency products for customized
layout.Eliminate standard demo board.
2004 Oct 12 Rev.4
13
www.yageo.com
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