CGB3B3X5R0J475M055AB 封装和模型
品牌：TDK
描述：Ceramic Capacitor, Multilayer, Ceramic, 6.3V, 20% +Tol, 20% -Tol, X5R, 15% TC, 4.7uF, Surface Mount, 0603, CHIP
EDA/CDA模型
原理图符号
PCB 封装图
3D模型
其他器件
- CGB3B1JB1E105K055AC
- CGB3C1X5R0J106M065AC
- CGB3B3X6S0G225K055AB
- CGB3S3X5R0G106M050AB
- CGB3B1X5R1C225K055AC
- CGB3B1X6S1C105K055AC
- CGB3B3JB1A225K055AB
- CGB3B1X5R1E105K055AC
- CGB3S1JB0J106M050AC
- CGB3B1X5R1C225M055AC
- CGB3B1X6S0G475K055AC
- CGB3B3X5R1A225K055AB
- CGB3B1X6S1A225K055AC
- CGB3B1X6S1A225M055AC
- CGB3B3X5R1A225M055AB
- CGB3B1X7R1A105M055AC
- CGB3B3JB0J475K055AB
- CGB3B1X5R1A475M055AC
- CGB3B1X7R1A105K055AC
- CGB3B1X5R1A475K055AC
- CGB3B3X6S1A105K055AB
- CGB3S1X5R0J106M050AC
- CGB3S3JB0G106M050AB
- CGB3B3X7R0J105K055AB
- CGB3B3X5R1E474K055AB
- CGB3B1X6S0G475M055AC
- CGB3B3X5R0J475M055AB
- CGB3B3X5R0J475K055AB