MC33596FCER2 封装和模型

品牌:NXP
描述:接收灵敏度(dBm)绝对值:-104dBm;最大数据速率(kbps):22.4kBaud;最小工作温度(℃):-40°C;最大工作温度(℃):85°C;元器件封装:32-QFN Exposed Pad;
EDA/CDA模型
原理图符号
PCB 封装图
其他器件
- MC33FS6522LAE
- MC33389CDHR2
- MC33202DR2G
- MC33275DT-2.5G
- MC33771CTP1AE
- MC33171DG
- MC33063AD
- MC33269D-5.0G
- MC33275ST-2.5T3G
- MC33172DR2G
- MC33179PG
- MC3303PT
- MC33910BAC
- MC33166TVG
- MC33063ADRJRG4
- MC33742SPEGR2
- MC33171DR2G
- MC33897CTEFR2
- MC33982CHFK
- MC33363APG
- MC33064P-5G
- MC33269D-5.0
- MC33565D
- MC33275D-3.0G
- MC33364D2R2G
- MC33072DR2G
- MC33074ADTBR2G
- MC33151DR2G
- MC33486ADHR2
- MC33262CDR2G
- MC33063AVDG
- MC33882PEP
- MC33385DHR2
- MC3303DR2G
- MC33275D-3.0R2G
- MC33204DTBR2G
- MC33262PG
- MC33269DT-012
- MC33179DTBR2G
- MC33762DM-2525RG
- MC33742PEPR2
- MC33375ST-2.5T3G
- MC33288DDHR2
- MC33975ATEK
- MC33886PVW
- MC33067DWR2G
- MC33375D-2.5G
- MC33931EKR2
- MC33164P-5RA
- MC33298DW