MC33780EG 封装和模型
品牌：NXP
描述：SPECIALTY MICROPROCESSOR CIRCUIT, PDSO16, 1.27 MM PITCH, ROHS COMPLIANT, SOIC-16
EDA/CDA模型
原理图符号
PCB 封装图
3D模型
其他器件
- MC33063ADR2G
- MC33072DR2G
- MC33063ADRE4
- MC33071ADR2G
- MC33025DWG
- MC33067PG
- MC3302DR2G
- MC33063ADE4
- MC33074ADR2G
- MC33063ADG
- MC33064D-5R2G
- MC33078DGKRG4
- MC33072ADR2G
- MC33067DW
- MC33063ADRJR
- MC33064P-5G
- MC33035DWG
- MC33035DWR2G
- MC33074ADTBR2G
- MC33039DR2G
- MC33078DT
- MC3303DG
- MC33063AP1G
- MC33071DR2G
- MC3303DR2G
- MC33064DM-5R2G
- MC33064P-5RP
- MC33078DR2G
- MC33060APG
- MC33078D
- MC33030DWG
- MC33063AVDG
- MC33067DWR2
- MC33025PG
- MC33063ADG4
- MC33074DR2G
- MC33064SN-5T1G
- MC33063ADRG4
- MC33063AD
- MC3303PT
- MC33064P-5RA
- MC33063AVDR2G
- MC33067DWR2G
- MC33063ADR
- MC33030DWR2G
- MC33074ADG
- MC33064D-5G
- MC3303DT
- MC33063APE4
- MC33030DW