型号起始:87835* (16) 87835-* (16)
所属品牌:不限 MOLEX(16)
功能分类:不限 连接器(1) 集管和边缘连接器(1)
品牌 图片 型号 描述 用途标签 PDF 供应商
87835-0842
中文翻译 品牌: MOLEX
2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating 连接器 集管和边缘连接器
87835-1042
中文翻译 品牌: MOLEX
2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating<
87835-1043
中文翻译 品牌: MOLEX
2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating<
87835-1242
中文翻译 品牌: MOLEX
2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 12 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating<
87835-1442
中文翻译 品牌: MOLEX
2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating<
87835-1642
中文翻译 品牌: MOLEX
2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating<
87835-1643
中文翻译 品牌: MOLEX
2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating<
87835-2042
中文翻译 品牌: MOLEX
2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 20 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating<
87835-2043
中文翻译 品牌: MOLEX
2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 20 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating<
87835-2442
中文翻译 品牌: MOLEX
2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 24 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating<
87835-2642
中文翻译 品牌: MOLEX
2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 26 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating<
87835-3442
中文翻译 品牌: MOLEX
2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 34 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating,
87835-4042
中文翻译 品牌: MOLEX
2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating<
87835-4043
中文翻译 品牌: MOLEX
2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating<
87835-5042
中文翻译 品牌: MOLEX
2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 50 Circuits, 0.76μm (30μ) Gold (Au) Selective Plati
87835-5043
中文翻译 品牌: MOLEX
2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 50 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating<
Total:161
总16条记录,每页显示30条记录分1页显示。