AD7339BSZ-REEL [ADI]

8-Bit I/O Port;
AD7339BSZ-REEL
型号: AD7339BSZ-REEL
厂家: ADI    ADI
描述:

8-Bit I/O Port

文件: 总13页 (文件大小:214K)
中文:  中文翻译
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5 V Integrated High Speed ADC/Quad  
DAC System  
a
AD7339  
FUNCTIONAL BLOCK DIAGRAM  
FEATURES  
8-Bit A/D Converter  
DVDD1  
AGND1  
DGND1  
Two 8-Bit D/A Converters  
Two 8-Bit Serial D/A Converters  
Single +5 V Supply Operation  
On-Chip Reference  
Power-Down Mode  
52-Lead PQFP Package  
ADCPDB  
AIN  
D0  
D7  
ADC  
T/H  
ADCCLK  
DA0  
DAC A  
REGISTER  
PARALLEL  
DAC A  
DA7  
DACA  
DACB  
DACCLK  
DB0  
DAC B  
REGISTER  
PARALLEL  
DAC B  
DB7  
DACPDB  
SDAC0F  
SDAC0S  
DAC 0  
SERIAL  
REGISTER  
DAC 0  
SERIAL  
CONTROL  
LOGIC  
SDATA  
SCLK  
SDAC1F  
SDAC1S  
DAC 1  
REGISTER  
SERIAL  
DAC 1  
LATCH  
VREF  
SDACPDB  
2.5V  
REFERENCE  
GENERAL DESCRIPTION  
VREFA  
VREFB  
The AD7339 is a composite IC that contains both DAC and  
ADC functions. The device includes an 8-bit parallel A-to-D  
converter. Two 8-bit parallel DACs are also included as are two  
serial control DACs. These serial DACs are 8-bit DACs.  
AVDD  
AD7339  
DVDD2 DVDD3  
The AD7339, which operates with a single 5 V power supply,  
has a bandgap reference on board with a nominal value of 2.5 V.  
To reduce the power consumption of the part, each section,  
except the reference, can be individually powered down when  
not in use.  
DGND2  
DGND3 AGND2 AGND3  
The AD7339 is available in a 52-lead PQFP package.  
REV. 0  
Information furnished by Analog Devices is believed to be accurate and  
reliable. However, no responsibility is assumed by Analog Devices for its  
use, nor for any infringements of patents or other rights of third parties  
which may result from its use. No license is granted by implication or  
otherwise under any patent or patent rights of Analog Devices.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 781/329-4700  
Fax: 781/326-8703  
World Wide Web Site: http://www.analog.com  
© Analog Devices, Inc., 1997  
AD7339* PRODUCT PAGE QUICK LINKS  
Last Content Update: 02/23/2017  
COMPARABLE PARTS  
View a parametric search of comparable parts.  
DESIGN RESOURCES  
AD7339 Material Declaration  
PCN-PDN Information  
Quality And Reliability  
Symbols and Footprints  
DOCUMENTATION  
Application Notes  
AN-284: Implement Infinite Sample-and-Hold Circuits  
Using Analog Input/Output Ports  
DISCUSSIONS  
View all AD7339 EngineerZone Discussions.  
Data Sheet  
AD7339: 5 V Integrated High Speed ADC/Quad DAC  
System Data Sheet  
SAMPLE AND BUY  
Visit the product page to see pricing options.  
REFERENCE MATERIALS  
Technical Articles  
TECHNICAL SUPPORT  
Submit a technical question or find your regional support  
number.  
MS-2210: Designing Power Supplies for High Speed ADC  
DOCUMENT FEEDBACK  
Submit feedback for this data sheet.  
This page is dynamically generated by Analog Devices, Inc., and inserted into this data sheet. A dynamic change to the content on this page will not  
trigger a change to either the revision number or the content of the product data sheet. This dynamic page may be frequently modified.  
(AVDD = DVDD = +5 V ؎ 10%, AGND = DGND = 0 V, TA = TMIN to TMAX, unless other-  
wise noted)  
AD7339–SPECIFICATIONS1  
Parameter  
B Version  
Units  
Test Conditions/Comments  
ADC  
ADCCLK = 2.048 MHz  
Resolution  
8
Bits  
Differential Nonlinearity  
Integral Nonlinearity  
Zero Input Offset Error  
Signal Range  
±1  
±1  
±3  
±1  
LSB max  
LSB max  
LSB  
8 Bits Monotonic  
V max  
The input must be biased about 1.4 V. Therefore, ac  
coupling with a 1 nF capacitor is needed if the bias  
voltage does not equal 1.4 V. The input should be  
driven with a maximum source impedance of 50 .  
Full Power Input Bandwidth  
Conversion Rate  
Signal to (Noise + Distortion)  
Effective No. of Bits (ENOB)  
Intermodulation Distortion  
Error Rate  
1.024  
2.048  
42.7  
6.8  
MHz  
MSPS  
dB min  
Bits min  
dB min  
48  
See Terminology  
4.7 × 1011  
5
Input Capacitance  
pF max  
Coding  
Offset Binary  
00H to FFH with 80H = 0 V  
DACCLK = 2.304 MHz  
PARALLEL DACS  
Resolution  
8
Bits  
Differential Nonlinearity  
Integral Nonlinearity  
Output Signal Range  
VSWING  
VBIAS  
Update Rate  
±1  
±1  
LSB max  
LSB max  
8 Bits Monotonic  
V
BIAS ± VSWING  
14/25 × VREFA/B  
V nom  
V nom  
MHz max  
mV max  
% typ  
VREFA/B means VREFA for DACA and VREFB for DACB.  
Factory Trim. Does Not Include Gain Error  
VREFA/B  
2.304  
±40  
±5  
Bipolar Zero Offset Error  
Gain Error  
Output Harmonic Content in  
Band 0 MHz to 1.152 MHz  
Gain Matching Between DACs  
Crosstalk  
50  
46  
0.2  
dB min  
dB min  
dB  
For a Full-Scale Digital Sine Wave in Band 0 kHz to 76.8 kHz  
For a Full-Scale Digital Sine Wave in Band 0 kHz to 128 kHz  
For Amplitudes Which Equal Full Scale –10 dB  
1.8 kLoad Between DACA and VREFA, and Between  
DACB and VREFB  
To B Channel from A Channel  
To A Channel from B Channel  
To VREFB from A Channel  
To VREFA from B Channel  
Load Resistance  
Load Capacitance  
Full-Scale Settling Time  
Coding  
55  
55  
55  
55  
1.8  
50  
4
dB min  
dB min  
dB min  
dB min  
kmin  
pF max  
µs typ  
A Channel has a full-scale output of frequency 128 kHz.  
B Channel has a full-scale output of frequency 128 kHz.  
A Channel has a full-scale output of frequency 128 kHz.  
B Channel has a full-scale output of frequency 128 kHz.  
Connected Between DACA/B and VREFA/B  
Offset Binary  
00H to FFH with 80H = Bias Voltage  
SCLK is a gated 256 kHz clock.  
SERIAL DACS  
Resolution  
8
Bits  
Differential Nonlinearity  
Integral Nonlinearity  
Output Range  
00H  
±1  
±1.5  
LSB  
LSB  
8 Bits Monotonic  
With Respect to Full Scale  
See Figure 1  
0.2  
V max  
FFH  
AVDD – 0.247  
V min  
When AVDD > 5.247 V, the analog output will equal 2 VREF.  
Update Rate  
Load Resistance  
Load Capacitance  
ISINK  
ISOURCE  
Full-Scale Settling Time  
SCLK/10  
20  
100  
1
100  
2.5  
kHz max  
kmax  
pF max  
mA typ  
µA typ  
µs typ  
Coding  
Straight Binary  
REV. 0  
–2–  
AD7339  
Parameter  
B Version  
Units  
Test Conditions/Comments  
REFERENCE  
VREF Voltage  
VREFA/VREFB Voltage  
Load Capacitance  
2.5 ± 2%  
2.5 ± 5%  
0.1  
V min/max  
V min/max  
µF max  
Each reference output must have a load capacitance  
of 100 pF minimum for compensation purposes.  
ISINK  
ISOURCE  
1
1
mA max  
mA max  
LOGIC INPUTS  
V
V
INH, Input High Voltage  
INL, Input Low Voltage  
DVDD – 0.8  
V min  
0.8  
10  
15  
V max  
µA max  
pF max  
I
INH, Input Leakage Current  
CIN, Input Capacitance  
LOGIC OUTPUTS  
V
V
OH, Output High Voltage  
OL, Output Low Voltage  
DVDD – 0.4  
0.4  
15  
V min  
V max  
pF max  
|IOUT| 1 mA  
|IOUT| 2 mA  
COUT, Output Capacitance  
POWER SUPPLIES  
AVDD, DVDD  
IDD  
4.5/5.5  
45  
4.5  
V min/max  
mA max  
mA max  
mA max  
Active Mode  
+25°C. No Load on VREF  
–40°C to +85°C. No Load on VREF  
Power-Down Current  
5
NOTES  
1Operating temperature range is as follows: B Version; –40°C to +85°C.  
Specifications subject to change without notice.  
2VREF  
4.753  
+5.5V  
POWER  
SUPPLY  
+5V  
POWER  
SUPPLY  
4.253  
+4.5V  
POWER  
SUPPLY  
0.2  
0
217  
ANALOG OUTPUT VOLTAGE  
243  
255  
Figure 1. Analog Output Voltage from Serial DACs vs. Power Supply  
REV. 0  
–3–  
AD7339  
TIMING CHARACTERISTICS (AVDD = +5 V ؎ 10%; AGND = DGND = 0 V; TA = TMlN to TMAX, unless otherwise noted)  
Limit at  
TA = –40؇C to +85؇C  
Parameter  
Units  
Description  
ADC  
See Figure 3.  
t1  
t2  
t3  
t4  
480  
210  
210  
100  
200  
ns min  
ns min  
ns min  
ns min  
ns min  
ADCCLK Period  
ADCCLK Width Low  
ADCCLK Width High  
Data Valid After Falling Edge of ADCCLK  
Data Valid Before Subsequent Falling Edge of ADCCLK  
See Figure 4.  
t5  
PARALLEL DACS  
t6  
t7  
t8  
t9  
t10  
t11  
t12  
430  
200  
200  
130  
50  
150  
250  
ns min  
ns min  
ns min  
ns min  
ns min  
ns max  
ns max  
DACCLK Period  
DACCLK Width Low  
DACCLK Width High  
Data Setup Before DACCLK Rising Edge Time  
Data Hold After DACCLK Rising Edge Time  
Propagation Delay  
Settling Time (from 10% to 90%)  
See Figure 5.  
SERIAL DACS  
t13  
t14  
t15  
t16  
t17  
t18  
t19  
3.9  
µs min  
µs min  
µs min  
ns min  
ns min  
ns min  
µs max  
SCLK Period  
SCLK Width Low  
SCLK Width High  
Data Setup Before SCLK Rising Edge  
Latch Enable Setup Time After SCLK Falling Edge  
LATCH Pulsewidth  
1.94  
1.94  
950  
950  
480  
100  
Conversion Delay  
I
2mA  
OL  
TO  
OUTPUT  
+2.1V  
PIN  
C
L
15pF  
I
1mA  
OH  
Figure 2. Load Circuit for Timing Specifications  
REV. 0  
–4–  
AD7339  
SAMPLE N–2  
SAMPLE N–1  
SAMPLE N  
SAMPLE N+1  
SAMPLE N+2  
t2  
ADCCLK  
D0 – D7  
t3  
t4  
t5  
t1  
N–3  
N–2  
N–1  
N
N+1  
Figure 3. ADC Timing  
t6  
t7  
DACCLK  
t8  
t9  
t10  
DA0 – DA7  
DB0 – DB7  
DATA  
DATA  
t11  
DACA  
DACB  
10%  
90%  
t12  
Figure 4. Parallel DACs Timing  
t14  
SCLK  
t15  
t13  
t16  
D9(MSB)  
D1  
D0  
D8  
D7  
SDATA  
LATCH  
t17  
t18  
t19  
SDAC0S  
SDAC1S  
10%  
Figure 5. Serial DACs Timing  
REV. 0  
–5–  
AD7339  
ABSOLUTE MAXIMUM RATINGS1  
NOTES  
1Stresses above those listed under Absolute Maximum Ratings may cause perma-  
nent damage to the device. This is a stress rating only; functional operation of the  
device at these or any other conditions above those listed in the operational sections  
of this specification is not implied. Exposure to absolute maximum rating condi-  
tions for extended periods may affect device reliability.  
(TA = +25°C unless otherwise noted)  
AVDD, DVDD to GND . . . . . . . . . . . . . . . . . –0.3 V to +7 V  
AGND to DGND . . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V  
Digital I/O Voltage to DGND . . . . . . –0.3 V to VDD + 0.3 V  
ADC Analog Input Voltage . . . . . . . . . . . . . . . . . . . . . . . ±2 V  
Input/Output Current at any Pin Except Supplies2 . . . 20 mA  
Operating Temperature Range  
2Transient currents of up to 100 mA will not cause SCR latchup.  
Industrial (B Version) . . . . . . . . . . . . . . . . . –40°C to +85°C  
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C  
Maximum Junction Temperature . . . . . . . . . . . . . . . .+150°C  
PQFP, θJA Thermal Impedance . . . . . . . . . . . . . . . . . 90°C/W  
Lead Temperature, Soldering  
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . .+215°C  
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . .+220°C  
ORDERING GUIDE  
Package  
Temperature  
Range  
Package  
Option  
Model  
Description  
AD7339BS  
–40°C to +85°C  
Plastic Quad Flatpack (PQFP)  
S-52  
CAUTION  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily  
accumulate on the human body and test equipment and can discharge without detection.  
Although this device features proprietary ESD protection circuitry, permanent damage may  
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD  
precautions are recommended to avoid performance degradation or loss of functionality.  
WARNING!  
ESD SENSITIVE DEVICE  
REV. 0  
–6–  
AD7339  
PIN CONFIGURATION  
52 51 50 49 48 47 46 45 44 43 42 41 40  
1
2
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
DACCLK  
DVDD1  
DB0  
SDAC1F  
SDAC0S  
SDAC0F  
AGND1  
VREF  
PIN 1  
IDENTIFIER  
3
4
DB1  
5
DB2  
6
AGND3  
AVDD  
DB3  
AD7339  
TOP VIEW  
(Not to Scale)  
7
DB4  
8
2
AGND  
AIN  
DB5  
9
DB6  
10  
11  
12  
13  
ADCPDB  
DVDD3  
DB7  
DACPDB  
DGND1  
SDACPDB  
DGND3  
ADCCLK  
14 15 16 17 18 19 20 21 22 23 24 25 26  
PIN FUNCTION DESCRIPTIONS  
Function  
Pin Number  
Mnemonic  
Power Supply  
33  
AVDD  
Analog power supply connection.  
2
12  
36  
22  
29  
21  
28  
32  
DVDD1  
DGND1  
AGND1  
DVDD2  
DVDD3  
DGND2  
DGND3  
AGND2  
AGND3  
Digital power supply for the parallel DACs.  
Digital ground connection for the parallel DACs.  
Analog ground connection for the parallel DACs.  
Digital power supply for the ADC.  
Digital power supply for the ADC.  
Digital ground connection for the ADC.  
Digital ground connection for the ADC.  
Analog ground connection for the ADC.  
Analog ground connection for the reference.  
34  
ADCs  
31  
AIN  
Analog input to the ADC. The analog input must be appropriately ac coupled.  
The AD7339 can accept an analog input of ±1 V maximum.  
27  
ADCCLK  
ADC Input Clock, CMOS Logic Input. The analog input is sampled on the rising edge  
of ADCCLK. ADCCLK is nominally set to 2.048 MHz.  
26–23, 20–17  
30  
D0–D7  
Digital Output from the ADC. The 8-bit digital word from the ADC is in offset binary.  
The digital output uses CMOS logic.  
Digital Input. When ADCPDB is low, the ADC is powered down. While in this mode,  
ADCCLK should be tied low. The ADC is powered up by taking ADCPDB high.  
ADCPDB  
Parallel DACs  
45–52  
DA0–DA7  
DB0–DB7  
DACCLK  
Digital input to the parallel A DAC. The digital input uses CMOS logic and the word  
is presented to the DAC in offset binary format.  
Digital input to the parallel B DAC. The digital input uses CMOS logic and the word  
is presented to the DAC in offset binary format.  
Input clock to the parallel DACs. The digital words in the A and B DAC registers are  
loaded into the DACs on the rising edge of DACCLK. DACCLK has a nominal fre-  
quency of 2.304 MHz and uses CMOS logic.  
3–10  
1
43, 41  
DACA, DACB  
Analog outputs from the A and B DACs. Both DACs have an analog output of VREFA/  
VREFB ± X volts where VREFA = VREFB = 2.5 V nominal and X = 1.4 V.  
REV. 0  
–7–  
AD7339  
Pin Number  
Mnemonic  
Function  
11  
DACPDB  
Digital Input. The parallel DACs, VREFA and VREFB, can be powered down  
using pin DACPDB. When DACPDB is low, both of the parallel DACs and the  
VREFA/VREFB outputs are placed in a standby mode, drawing a minimal cur-  
rent. The reference, which is available on the VREF pin, is not powered down.  
Serial DACs  
16  
SDATA  
Serial Input Data. Serial data is latched into the AD7339 registers on the rising  
edge of SCLK. The digital data uses CMOS logic. Data is loaded into the latches  
in 10-bit bursts (MSB first), the 2 MSBs of the word indicating the DAC to which  
the digital word is being loaded while the 8 LSBs contain the digital word being  
loaded into the DAC. The serial DACs use offset binary.  
14  
15  
SCLK  
Serial Input Clock. Data is latched into the registers on the rising edge of SCLK,  
which is nominally set to 256 kHz. SCLK is a gated clock—the clock should be active  
only when data is being loaded into the latches. The clock should idle low between  
conversions.  
Latch Enable Input. LATCH is used to load the digital data from the latch into  
the DAC and begin conversion. Both DACs are loaded with the digital data in  
their respective latches. LATCH is pulsed high to load the DACs, the DACs being  
loaded on the rising edge of LATCH.  
LATCH  
38  
37  
SDAC0S  
SDAC0F  
Analog Output from Serial DAC0. The analog output from this DAC will have a  
value of 0.2 V to AVDD – 0.247 V.  
Feedback Analog Input. By connecting a resistor between SDAC0F and SDAC0S,  
the gain of the DAC0 buffer can be altered and the magnitude of the analog out-  
put adjusted accordingly.  
40  
39  
SDAC1S  
SDAC1F  
Analog Output from Serial DAC1. The analog output from this DAC will have a  
value of 0.2 V to AVDD – 0.247 V.  
Feedback Analog Input. By connecting a resistor between SDAC1F and SDAC1S,  
the gain of the DAC1 buffer can be altered and the magnitude of the analog out-  
put adjusted accordingly.  
13  
SDACPDB  
Digital Input. The serial DACs are powered down using SDACPDB. When this  
pin is tied low, the serial DACs are placed in standby mode.  
Reference  
35  
VREF  
The onboard bandgap reference is available on the VREF pin. The reference has a  
value of 2.5 V nominal. A bypass capacitor of 0.1 µF is required between VREF  
and AGND. This output cannot be powered down.  
44, 42  
VREFA/VREFB  
A buffered version of the reference is available on VREFA/VREFB. The analog  
outputs from the parallel DACs are biased about the reference voltage. DACA is  
biased about VREFA while DACB is biased about VREFB. VREFA and VREFB  
can be used with DACA and DACB to provide differential analog inputs to the  
circuitry connected to the DACs. These outputs are powered down using DACPDB.  
These outputs should be decoupled using a capacitance of 100 pF minimum.  
REV. 0  
–8–  
AD7339  
Parallel DACs  
FUNCTIONAL DESCRIPTION  
The circuitry for each parallel DAC consists of a current source  
DAC followed by a buffer that converts the current to a voltage.  
Figure 8 shows the functional block diagram for the parallel  
DACs.  
A-to-D Converter  
The A/D conversion circuitry consists of a track-and-hold ampli-  
fier followed by a flash A-to-D converter. Figure 6 shows the  
architecture of the ADC.  
The loading of both the A and B DAC is controlled by the  
DACCLK signal, which is nominally set to 2.304 MHz. The  
digital input to each DAC is latched in on the rising edge of the  
DACCLK signal so that both DACs simultaneously perform the  
D-to-A conversion.  
AD7339  
D7  
D6  
AIN  
T/H  
HOLD  
D5  
D4  
D3  
D2  
D1  
D0  
DECODE  
LOGIC  
COMPARATOR  
NETWORK  
OUTPUT  
OUTPUT  
DRIVERS  
REGISTER  
AD7339  
DA0  
DAC A  
REGISTER  
DAC A  
DA7  
DACA  
DACB  
DACCLK  
TIMING AND  
CONTROL  
LOGIC  
REFERENCE  
RESISTOR  
LADDER  
DB0  
DB7  
DAC B  
REGISTER  
DAC B  
ADCCLK ADCPDB  
REFERENCE  
VREFA  
VREFB  
Figure 6. ADC Architecture  
Track-and-Hold Amplifier  
The track-and-hold amplifier on the analog input of the AD7339’s  
ADC allows the ADC to accurately convert input frequencies to  
8-bit accuracy. The input bandwidth of the track-and-hold am-  
plifier is much greater than the Nyquist rate of the ADC.  
CONTROL  
LOGIC  
DACPDB  
The operation of the track-and-hold is essentially transparent to  
the user. The track-and-hold amplifier goes from its tracking  
mode to its hold mode on the rising edge of ADCCLK.  
Figure 8. Parallel DACs Functional Block Diagram  
The analog output from each DAC is biased about the reference  
voltage VREFA (DAC A) or VREFB (DAC B). The analog  
output is ±1.4 V about the reference voltage. Since the analog  
outputs are biased about the reference voltage, the reference  
outputs can be used with the analog outputs to form a differen-  
tial signal for the circuitry that follows the DACs.  
Analog Input  
The ADC accepts an analog input of 2 V p-p. The analog input  
is biased about 1.4 V internally. If the signal applied to the ADC is  
biased about 1.4 V, then dc coupling can be used. AC coupling  
is needed if the analog input is biased about any voltage other  
than 1.4 V. A capacitor of 1 nF is suitable for ac coupling.  
The AD7339 includes a calibration feature that reduces the  
offset between the DAC output bias voltage and the VREFA/  
VREFB voltage. A 4-bit offset nulling feature is used to factory  
trim the offset. The device also has a 4-bit offset register that is  
user controlled; i.e., the user can disable the factory trimmed  
offset and use the 4-bit register instead. This allows the user to  
calibrate out the system offset; however, the user is also respon-  
sible for calibrating out the AD7339 offset.  
Figure 7 shows the ideal input/output transfer function for the  
ADC. The designed code transitions occur midway between  
successive integer LSB values (1/2 LSB, 3/2 LSB, 5/2 LSB . . .)  
with 1 LSB = FS/256 = 2 V/256 = 7.8 mV.  
ADC OUTPUT  
CODE  
11111111  
The 4-bit offset register is accessed via the serial interface that is  
used by DAC 0 and DAC 1. Table III gives the addresses for  
accessing these registers. D5 of the 10-bit data word enables the  
user to write to the 4-bit offset register. When this bit is set to 0,  
the factory trimmed value is used as the offset value, while the  
user programmed value is used when D5 equals 1. When the  
offset is user controlled, D4 is used to inform the AD7339 to  
reduce or increase the DAC output voltage. When D4 equals 0,  
the DAC output is reduced, while the DAC output is increased  
when D4 equals 1. When user trimming is being used, the 4-bit  
word to be loaded into the register is contained in the 4 LSBs of  
the 10-bit word being written to the serial port.  
AD7339  
ADC  
11111110  
10000010  
10000001  
10000000  
01111111  
01111110  
–1V  
+1V – 1LSB  
00000001  
00000000  
0V  
ANALOG INPUT VOLTAGE – AIN  
Figure 7. ADC Transfer Function  
REV. 0  
–9–  
AD7339  
The 8-bit word is loaded into the DAC from the register using  
LATCH. Data is loaded into the DACs on the falling edge of  
LATCH. When the D-to-A conversion is performed, the analog  
output is altered accordingly. The analog output will remain  
valid until the next falling edge of LATCH, at which stage the  
next digital word in the register is converted. LATCH is nor-  
mally low, the input being pulsed to load the DACs, the DACs  
being loaded on the falling edge of LATCH.  
The 4-bit offset nulling feature has a LSB size of 7.6 mV; thereby,  
allowing the user to vary the DAC output by ±115 mV.  
Table I. Writing to the Parallel DACs Offset Registers  
D9 D8 D7 D6 D5  
Address Factory/  
User Offset Incr  
D4  
D3 D2 D1 D0  
X
X
Decr/ Data Word  
The analog output is available on the SDAC0S/SDAC1S pin.  
Each DAC has an analog output of 0.2 V to AVDD – 0.247 V,  
an input of 00H generating an analog output of 0.2 V while a  
digital input of FFH produces an analog output of AVDD –  
0.247 V, i.e., the serial DACs use straight binary coding. The  
analog output is generated by the on board reference. There-  
fore, when AVDD is greater than 5.247 V, VOUT = 2 VREF  
when the digital word equals all 1s. However, when AVDD is  
less than 5.247 V, the output is limited to 0.247 V below AVDD  
as the amplifier clips the output.  
The DACs use offset binary coding with 1 LSB = FS/256 =  
2.8/256 = 10.94 mV. Table II shows the ideal input code to  
output voltage relationship.  
Table II. Ideal Input/Output Code Table  
DAC Latch Contents  
MSB  
LSB  
Analog Output, VOUT*  
0 0 0 0 0 0 0 0  
0 0 0 0 0 0 0 1  
0 1 1 1 1 1 1 1  
1 0 0 0 0 0 0 0  
1 0 0 0 0 0 0 1  
1 1 1 1 1 1 1 0  
1 1 1 1 1 1 1 1  
–1.4 V  
The output from the current source is converted to a voltage  
using an operational amplifier. The amplifier is configured to  
gain the signal by two; however, the gain of the amplifier can be  
adjusted by tying a resistor between SDAC0F/SDAC1F and  
SDAC0S/SDAC1S. The resistors on board the AD7339 have a  
value of 20 k.  
–1.38906 V  
–0.01094 V  
0 V  
+0.01094 V  
+1.37812 V  
+1.38906 V  
Power-Down  
*These are the nominal output voltages with VOUT = ±1.4 V.  
Each section of the AD7339 can be individually powered down.  
The ADC, parallel DACs and serial DACs have individual  
power-down pins, which allows each section to be powered  
down when it is not being used, thus minimizing the current  
consumption of the AD7339.  
Serial DACs  
The AD7339 has two serial DACs on board. The serial DACs  
have an architecture similar to the parallel DACs. The 8-bit  
digital word to each DAC is serially loaded. The serial DACs  
have a common serial port. To distinguish between the two  
DACs, 10-bit bursts are transferred to the DACs, the two MSBs  
identifying the DAC to which the 8-bit word is to be loaded.  
Table III shows the truth table for the two MSBs.  
Pin ADCPDB is used to place the ADC in sleep mode. When  
this pin is taken low, the ADC is powered down. For normal  
operation, ADCPDB is high.  
When the parallel DACs are not being used, they can be placed  
in power-down mode using DACPDB. When DACPDB is low,  
both DACs are powered down. The reference outputs VREFA  
and VREFB are also powered down. During power-down, the  
analog outputs DACA and DACB, as well as the reference out-  
puts, are pulled down to ground. When the DACs are powered up,  
the analog outputs settle to the bias voltage VREFA/VREFB.  
The serial word is loaded into the serial register using SDATA  
and SCLK. SCLK is a gated clock of nominal value 256 kHz,  
which should be active only when the 10-bit word is being  
loaded into the register; i.e., SCLK should consist of 10 pulses.  
If SCLK is continuous, or if it consists of more than 10 pulses,  
the data shifted into the serial register will be shifted out of the  
serial register so the register will not contain valid data. When  
the serial register is not being written to, SCLK should idle low.  
The serial data bits are read into the serial register on the rising  
edge of SCLK, the two MSBs of the word identifying the DAC  
to which the word is being written, and the eight LSBs of the  
10-bit word containing the 8-bit word to be converted, the 8-bit  
word being transferred MSB first. SDATA idles low.  
The serial DACs are powered down using SDACPDB. When  
this pin is tied low, the serial DACs are placed in sleep mode.  
When a converter is powered up, 100 µs are required for the  
analog and digital circuitry to settle. Conversions can commence  
when the circuitry has settled.  
The reference on board the AD7339 is permanently powered  
up. While the outputs VREFA and VREFB can be powered  
down, the reference voltage, which is available on pin VREF, is  
always available.  
Table III. Serial DACs Truth Table  
D9  
D8  
DAC to be Written to  
0
0
1
1
0
1
0
1
DAC A Offset Register Is Loaded  
DAC 1 Register Is Loaded  
DAC 0 Register Is Loaded  
DAC B Offset Register Is Loaded  
REV. 0  
–10–  
AD7339  
TERMINOLOGY  
Differential Nonlinearity  
The difference between the measured and the ideal 1 LSB change  
between any two adjacent codes in the ADC or DACs. A speci-  
fied Differential Nonlinearity of ±1 LSB max over the operating  
temperature range ensures monotonicity.  
products, of order (m + n), at sum and difference frequencies  
of mfa ± nfb, where m, n = 0, 1, 2, 3, . . .. Intermodulation  
terms are those for which m or n is not equal to zero. For the  
AD7339, the Intermodulation Distortion is the level to which  
the second and third intermodulation terms are suppressed  
below a full scale output signal level, the second order terms  
being (fa + fb) and (fa – fb) while the third order terms are  
(2fa + fb), (2fa – fb), (fa + 2fb) and (fa – 2fb).  
Integral Nonlinearity  
The maximum deviation of any code from a straight line passing  
through the endpoints of the transfer function. The endpoints  
of the transfer function are zero scale, a point 0.5 LSB below the  
first code transition (000 . . . 00 to 000 . . . 01) and full scale, a  
point 0.5 LSB above the last code transition (111 . . . 10 to  
111 . . . 11). The error is expressed in LSBs.  
Error Rate  
The rate at which A-to-D conversion errors occur.  
DACS  
Bipolar Zero Offset Error  
The deviation between the measured output voltage and the  
bias voltage (VREFA or VREFB, depending on which DAC is  
being tested) when the DAC is loaded with code 100 . . . 00  
after gain error has been adjusted out.  
Signal to (Noise + Distortion)  
Signal to (Noise + Distortion) is measured signal-to-noise at the  
output of the ADC. The signal is the rms magnitude of the  
fundamental. Noise is the rms sum of all nonfundamental sig-  
nals up to half the sampling frequency (FS/2) excluding dc.  
Signal to (Noise + Distortion) is dependent on the number of  
quantization levels used in the digitization process; the more  
levels, the smaller the quantization noise. The theoretical signal  
to (Noise + Distortion) ratio for a sine wave signal is given by  
Gain Error  
A measure of the output error between an ideal DAC and the  
actual device output with all 1s loaded after offset error has been  
adjusted out.  
Update Rate  
Signal to (Noise + Distortion) = (6.02N + 1.76) dB  
The rate at which the DACs can be loaded with new data. The  
parallel DACs have an update rate of 2.304 MHz while the  
serial DACs have an update rate of 256/10 kHz maximum.  
where N is the number of bits. Thus for an ideal 8-bit converter,  
Signal to (Noise + Distortion) is 49.92 dB.  
Gain Matching Between DACs  
ADC  
The matching between the analog output amplitudes of the  
parallel DACs when the same digital word is written to each  
DAC.  
Effective Number of Bits (ENOB)  
Signal to (Noise + Distortion) is expressed in dBs; rewriting the  
Signal to (Noise + Distortion) formula, it is possible to get a  
measure of performance expressed in effective number of bits.  
The effective number of bits for a device can be calculated di-  
rectly from its measured Signal to (Noise + Distortion) value.  
Crosstalk  
The ratio of the amplitude of a full-scale signal appearing on  
one channel to the amplitude of the same signal which couples  
onto another channel. Crosstalk is expressed in dBs.  
ENOB = (SNR – 1.76)/6.02  
Output Harmonic Content  
where SNR is the Signal to (Noise + Distortion).  
When the digital word is converted to analog form, harmonics  
will also be generated. The Output Harmonic Content specifies  
the amount by which these harmonics are attenuated relative to  
the fundamental frequency. With the parallel DACs, a full sine  
wave of frequency 0 kHz to 128 kHz is input. The resulting  
analog output is evaluated and the amount by which the  
harmonics in the frequency band 0 MHz to 1.1152 MHz are  
attenuated is measured relative to the magnitude of the fun-  
damental output signal.  
Zero Input Offset Error  
This is the offset error in the ADC when the analog input is  
zero. Ideally, the digital output should equal 100 . . . 00. The  
offset error is the deviation from the ideal output code. The  
offset error is expressed in LSBs.  
Intermodulation Distortion  
With inputs consisting of sine waves at two frequencies, fa and  
fb, any active device with nonlinearities will create distortion  
REV. 0  
–11–  
AD7339  
GROUNDING AND LAYOUT  
crossover of digital and analog signals. Traces at opposite sides  
of the board should run at right angles to each other. This will  
reduce the effects of feedthrough through the board. A microstrip  
technique is by far the best, but is not always possible with a  
double-sided board. In this technique, the component side of  
the board is dedicated to ground planes while signals are placed  
on the other side. Good decoupling is important. The analog  
and digital supplies to the AD7339 are independent and sepa-  
rately pinned out to minimize coupling between analog and  
digital sections of the device. All analog and digital supplies  
should be decoupled to AGND and DGND respectively using  
0.1 µF ceramic capacitors in parallel with 10 µF tantalum  
capacitors. To achieve the best from the decoupling capaci-  
tors, they should be placed as close as possible to the device,  
ideally right up against the device. In systems where a com-  
mon supply is used to drive both the AVDD and DVDD of  
the AD7339, it is recommended that the system’s AVDD sup-  
ply be used. This supply should have the recommended analog  
supply decoupling between the AVDD pins of the AD7339 and  
AGND and the recommended digital supply decoupling capaci-  
tors between the DVDD pins and DGND.  
The printed circuit board that houses the AD7339 should be  
designed so that the analog and digital sections are separated  
and confined to certain areas of the board. This facilitates the  
use of ground planes that can be easily separated. A minimum  
etch technique is generally best for ground planes as it gives the  
best shielding.  
Digital and analog ground planes should be joined in only one  
place. If the AD7339 is the only device requiring an AGND-to-  
DGND connection, the ground planes should be connected at  
the AGND and DGND pins of the AD7339. If the AD7339 is  
in a system where multiple devices require AGND-to-DGND  
connections, the connection should be made at one point only,  
a star point that should be established as close as possible to the  
AD7339. Avoid running digital lines under the device as these  
will couple noise onto the die. The analog ground plane should  
be allowed to run under the AD7339 to avoid noise coupling.  
The power supply lines to the AD7339 should use as large a  
track as possible to provide low impedance paths and reduce the  
effects of glitches on the power supply line. Fast switching sig-  
nals such as clocks should be shielded with digital ground to  
avoid radiating noise to other sections of the board. Avoid  
OUTLINE DIMENSIONS  
Dimensions shown in inches and (mm).  
52-Lead Plastic Quad Flatpack (PQFP)  
(S-52)  
0.557 (14.15)  
0.094 (2.39)  
0.537 (13.65)  
0.084 (2.13)  
0.398 (10.11)  
0.390 (9.91)  
0.037 (0.95)  
0.026 (0.65)  
52  
1
40  
39  
PIN 1  
SEATING  
PLANE  
TOP VIEW  
(PINS DOWN)  
0.012 (0.30)  
0.006 (0.15)  
27  
26  
13  
14  
0.008 (0.20)  
0.006 (0.15)  
0.0256  
(0.65)  
BSC  
0.014 (0.35)  
0.010 (0.25)  
0.082 (2.09)  
0.078 (1.97)  
–12–  
REV. 0  

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