AD7949 [ADI]
16-Bit, 8-Channel, 250 kSPS PulSAR㈢ ADC.; 16位， 8通道， 250 kSPS时PulSAR㈢ ADC。
| 型号： | AD7949 |
| 厂家： | 
ADI |
| 描述： | 16-Bit, 8-Channel, 250 kSPS PulSAR㈢ ADC. |
| 文件： | 总20页 (文件大小：2028K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
16-Bit, 8-Channel,
250 kSPS PulSAR® ADC
Preliminary Technical Data
AD7689
FEATURES
FUNCTIONAL BLOCK DIAGRAM
2.7V to 5V
0.5V to 4.096V
0.5V to VDD
16-bit resolution with no missing codes
8-channel multiplexer with:
Unipolar single ended or
22μF
0.1μF
REFIN
REF
VDD
Differential (GND sense)/Bipolar inputs
Throughput: 250 kSPS
INL/DNL: 0.6 LSB typical
1.8V to
VDD
Band Gap
REF
VIO
AD7689
Temp
Sensor
Dynamic range: 93.5 dB
CNV
IN0
IN1
IN2
IN3
IN4
IN5
IN6
IN7
SINAD: 92.5 dB @ 20 kHz
THD: −100 dB @ 20 kHz
Analog input range:
0 V to VREF with VREF up to VDD
Reference:
SCK
SDO
DIN
16-Bit SAR
ADC
SPI Serial
Interface
MUX
1-Pole
LPF
Sequencer
Internal selectable 2.5 V/4.096 V or
External buffered (up to 4.096 V)
External (up to VDD)
COM
GND
Figure 1.
Internal temperature sensor
Channel sequencer, selectable 1-pole filter, BUSY indicator
No pipeline delay, SAR architecture
Single-supply 2.7V – 5.5 V operation with
1.8 V to 5 V logic interface
Serial interface SPI®/QSPI™/MICROWIRE™/DSP compatible
Power dissipation:
6 mW @ 5 V/100 kSPS
Table 1. Multichannel14-/16-Bit PulSAR ADC
500
kSPS
250
ADC
Driver
Type
Channels kSPS
14-Bit
16-Bit
16-Bit
8
4
8
AD7949
AD7682
AD7689
ADA4841-x
ADA4841-x
ADA4841-x
AD7699
Standby current: 1 nA
20-lead 4 mm × 4 mm LFCSP package
GENERAL DESCRIPTION
The AD7689 is an 8-channel 16-bit, charge redistribution
successive approximation register (SAR), analog-to-digital
converter (ADC) that operates from a single power supply, VDD.
APPLICATIONS
Battery-powered equipment
Medical instruments
Mobile communications
Personal digital assitants
Data acquisition
Seismic data acquisition systems
Instrumentation
Process Control
The AD7689 contains all of the components for use in a multi-
channel, low power, data acquisition system including: a true 16-
bit SAR ADC with no missing codes; an 8-channel, low crosstalk
multiplexer useful for configuring the inputs as single ended (with
or without ground sense), differential or bipolar; an internal low
drift reference (selectable 2.5V or 4.096V) and buffer; a
temperature sensor; a selectable 1-pole filter; and a sequencer
useful when channels are continuously scanned in order.
The AD7689 uses a simple SPI interface for writing to the
configuration register and receiving conversion results. The SPI
interface uses a separate supply, VIO, which is set to the host logic
level.
Power dissipation scales with throughput.
The AD7689 is housed in a tiny 20-lead LFCSP with operation
specified from −40°C to +85°C.
Rev. PrC
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registeredtrademarks arethe property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Fax: 781.461.3113
www.analog.com
©2007 Analog Devices, Inc. All rights reserved.
AD7689
Preliminary Technical Data
TABLE OF CONTENTS
Features .............................................................................................. 1
Typical Connection Diagram ................................................... 12
Configuration Register, CFG.................................................... 13
Analog Inputs ............................................................................. 13
Driver Amplifier Choice ........................................................... 14
Voltage Reference Output/Input .............................................. 15
Power Supply............................................................................... 16
Supplying the ADC from the Reference.................................. 16
Digital Interface.......................................................................... 16
Without Busy Indicator ............................................................. 17
With Busy Indicator................................................................... 18
Application Hints ........................................................................... 19
Layout .......................................................................................... 19
Evaluating AD7689 Performance............................................. 19
Outline Dimensions....................................................................... 20
Ordering Guide .......................................................................... 20
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Timing Specifications....................................................................... 5
Absolute Maximum Ratings............................................................ 7
ESD Caution.................................................................................. 7
Pin Configurations and Function Descriptions ........................... 8
Typical Performance Characteristics ............................................. 9
Terminology .................................................................................... 10
Theory of Operation ...................................................................... 11
Overview...................................................................................... 11
Converter Operation.................................................................. 11
Transfer Functions...................................................................... 12
REVISION HISTORY
Rev. PrC | Page 2 of 20
Preliminary Technical Data
SPECIFICATIONS
AD7689
VDD = 2.5 V to 5.5 V, VIO = 2.3 V to VDD, VREF = VDD, all specifications TMIN to TMAX, unless otherwise noted.
Table 2.
Parameter
Conditions/Comments
Min
Typ
Max
Unit
RESOLUTION
ANALOG INPUT
Voltage Range
16
Bits
Unipolar mode
Bipolar mode
Positive input, unipolar and
bipolar mode
0
+VREF
+VREF/2
VREF + 0.1
V
V
−VREF/2
−0.1
Absolute Input Voltage
Negative or COM input, unipolar
mode
−0.1
+0.1
Negative or COM input, bipolar
mode
VREF/2 – 0.1
VREF/2
VREF/2 + 0.1
Analog Input CMRR
Leakage Current at 25°C
Input Impedance1
THROUGHPUT
fIN = 250 kHz
Acquisition phase
TBD
1
dB
nA
Conversion Rate
VDD = 4.096V to 5.5
VDD = 2.5V to 4.096V
Full-scale step
0
1
250
200
1.8
kSPS
Transient Response
μs
ACCURACY
No Missing Codes
Integral Linearity Error
Differential Linearity Error
Transition Noise
16
-2
−1
Bits
0.6
0.25
0.5
0.5
TBD
0.3
+2
+1.5
LSB2
LSB
LSB
LSB
LSB
ppm/°C
LSB
REF = VDD = 5 V
Gain Error3
−30
−5
+30
+5
Gain Error Match
Gain Error Temperature Drift
Offset Error3
0.5
Offset Error Match
Offset Error Temperature Drift
Power Supply Sensitivity
TBD
0.3
1
LSB
ppm/°C
ppm
VDD = 5 V ± 5%
AC ACCURACY4
Dynamic Range
Signal-to-Noise
93.5
92.5
88.5
92.5
88.5
−100
110
dB5
dB
fIN = 20 kHz, VREF = 5V
fIN = 20 kHz, VREF = 2.5V
fIN = 20 kHz, VREF = 5V
fIN = 20 kHz, VREF = 2.5V
fIN = 20 kHz
fIN = 20 kHz
fIN = 100 kHz on adjacent
channel(s)
Signal-to-(Noise + Distortion)
dB
dB
dB
dB
dB
Total Harmonic Distortion
Spurious-Free Dynamic Range
Channel-to-Channel Crosstalk
-117
Intermodulation Distortion6
SAMPLING DYNAMICS
−3 dB Input Bandwidth
Aperture Delay
115
dB
Selectable
VDD = 5V
0.425
1.7
2.5
MHz
ns
1 See the Analog Inputs section.
2 LSB means least significant bit. With the 5 V input range, one LSB is 76.3 μV.
3 See the Terminology section. These specifications include full temperature range variation but not the error contribution from the external reference.
4 With VREF = 5 V, unless otherwise noted.
5 All specifications expressed in decibels are referred to a full-scale input FSR and tested with an input signal at 0.5 dB below full scale, unless otherwise specified.
6 fIN1 = 21.4 kHz and fIN2 = 18.9 kHz, with each tone at −7 dB below full scale.
Rev. PrC | Page 3 of 20
AD7689
Preliminary Technical Data
VDD = 2.5 V to 5.5 V, VIO = 2.3 V to VDD, VREF = VDD, all specifications TMIN to TMAX, unless otherwise noted.
Table 3.
Parameter
Conditions/Comments
Min
Typ
Max
Unit
INTERNAL REFERENCE
Output Voltage
V
For 4.096 V output, @ 25°C
For 2.5 V output, @ 25°C
–40°C to +85°C
VDD = 5 V 5%
1000 hours
4.086
2.490
4.096
2.500
TBD
TBD
50
4.106
2.510
V
ppm/°C
ppm/V
ppm
ms
Temperature Drift
Line Regulation
Long-Term Drift
Turn-On Settling Time
EXTERNAL REFERENCE
Voltage Range
CREF = 22 μF
TBD
REF Input
REFIN Input (Buffered)
250 kSPS, REF = 5V
0.5
0.5
VDD + 0.3
4.096
V
V
μA
Current Drain
TEMPERATURE SENSOR
Output Voltage1
Temperature Sensitivity
DIGITAL INPUTS
Logic Levels
VIL
50
@ 25°C
283
1
mV
mV/°C
−0.3
0.7 × VIO
−1
+0.3 × VIO
VIO + 0.3
+1
V
V
μA
μA
VIH
IIL
IIH
−1
+1
DIGITAL OUTPUTS
Data Format2
Pipeline Delay3
VOL
ISINK = +500 μA
ISOURCE = −500 μA
0.4
V
V
VOH
VIO − 0.3
POWER SUPPLIES
VDD
Specified performance
Specified performance
2.3
2.3
1.8
5.5
V
V
V
nA
mW
mW
mW
VIO
VDD + 0.3
VDD + 0.3
50
VIO Range
Standby Current4, 5
Power Dissipation
VDD and VIO = 5V, 25°C
VDD = 5V , 100 kSPS throughput
VDD = 5V , 250 kSPS throughput
VDD = 5V , 250 kSPS throughput
internal reference and buffer
enabled
1
6
15
18.5
Energy per Conversion
TEMPERATURE RANGE6
Specified Performance
50
nJ
°C
TMIN to TMAX
−40
+85
1 The output voltage is internal and present on a dedicated multiplexer input.
2 Unipolar mode: serial 16-bit straight binary
Bipolar mode: serial 16-bit 2’s complement.
3 Conversion results available immediately after completed conversion.
4 With all digital inputs forced to VIO or GND as required.
5 During acquisition phase.
6 Contact an Analog Devices sales representative for the extended temperature range.
Rev. PrC | Page 4 of 20
Preliminary Technical Data
AD7689
TIMING SPECIFICATIONS
VDD = 4.5 V to 5.5 V, VIO = 2.3 V to VDD, all specifications TMIN to TMAX, unless otherwise noted.
Table 4. 1
Parameter
Symbol
tCONV
tACQ
tCYC
tCNVH
tSCK
Min
0.5
1.8
4
10
15
7
Typ
Max
Unit
μs
μs
μs
ns
Conversion Time: CNV Rising Edge to Data Available
Acquisition Time
Time Between Conversions
CNV Pulse Width
SCK Period
SCK Low Time
2.2
ns
ns
tSCKL
SCK High Time
tSCKH
tHSDO
tDSDO
7
4
ns
ns
SCK Falling Edge to Data Remains Valid
SCK Falling Edge to Data Valid Delay
VIO Above 4.5 V
VIO Above 3 V
VIO Above 2.7 V
14
15
16
17
ns
ns
ns
ns
VIO Above 2.3 V
CNV Low to SDO D15 MSB Valid
VIO Above 4.5 V
VIO Above 2.7 V
VIO Above 2.3 V
CNV High or Last SCK Falling Edge to SDO High Impedance
CNV High to SCK Low
tEN
15
18
22
25
ns
ns
ns
ns
ns
ns
ns
tDIS
tCSCK
tSDIN
tHDIN
10
4
4
DIN Valid Setup Time from SCK Falling Edge
DIN Valid Hold Time from SCK Falling Edge
1 See Figure 2 and Figure 3 for load conditions.
Rev. PrC | Page 5 of 20
AD7689
Preliminary Technical Data
VDD = 2.5 V to 4.5 V, VIO = 2.3 V to VDD, all specifications TMIN to TMAX, unless otherwise noted.
Table 5. 1
Parameter
Symbol
tCONV
tACQ
tCYC
tCNVH
tSCK
Min
0.7
1.8
5
10
25
12
12
5
Typ
Max
Unit
μs
μs
μs
ns
ns
ns
ns
ns
Conversion Time: CNV Rising Edge to Data Available
Acquisition Time
Time Between Conversions
CNV Pulse Width
SCK Period
SCK Low Time
3.2
tSCKL
SCK High Time
tSCKH
tHSDO
tDSDO
SCK Falling Edge to Data Remains Valid
SCK Falling Edge to Data Valid Delay
VIO Above 3 V
VIO Above 2.7 V
VIO Above 2.3 V
24
30
35
ns
ns
ns
CNV Low to SDO D15 MSB Valid
VIO Above 2.7 V
VIO Above 2.3 V
CNV High or Last SCK Falling Edge to SDO High Impedance
CNV High to SCK Low
SDI Valid Setup Time from SCK Falling Edge
SDI Valid Hold Time from SCK Falling Edge
tEN
18
22
25
ns
ns
ns
ns
ns
ns
tDIS
tCSCK
tSDIN
tHDIN
10
5
4
1 See Figure 2 and Figure 3 for load conditions.
500µA
I
OL
1.4V
TO SDO
C
L
50pF
500µA
I
OH
Figure 2. Load Circuit for Digital Interface Timing
70% VIO
30% VIO
tDELAY
tDELAY
1
1
2V OR VIO – 0.5V
2V OR VIO – 0.5V
2
2
0.8V OR 0.5V
0.8V OR 0.5V
1. 2V IF VIO ABOVE 2.5V, VIO – 0.5V IF VIO BELOW 2.5V.
2. 0.8V IF VIO ABOVE 2.5V, 0.5V IF VIO BELOW 2.5V.
Figure 3. Voltage Levels for Timing
Rev. PrC | Page 6 of 20
Preliminary Technical Data
AD7689
ABSOLUTE MAXIMUM RATINGS
Table 6.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Parameter
Analog Inputs
INn,1 COM1
Rating
GND − 0.3 V to VDD + 0.3 V
or 130 mA
GND − 0.3 V to VDD + 0.3 V
REF, REFIN
Supply Voltages
VDD, VIO to GND
VDD to VIO
−0.3 V to +7 V
7 V
DIN, CNV, SCK to GND
SDO to GND
Storage Temperature Range
Junction Temperature
−0.3 V to VIO + 0.3 V
−0.3 V to VIO + 0.3 V
−65°C to +150°C
150°C
ESD CAUTION
θJA Thermal Impedance (MSOP-10) 200°C/W
θJC Thermal Impedance (MSOP-10) 44°C/W
1 See Analog Inputs section.
Rev. PrC | Page 7 of 20
AD7689
Preliminary Technical Data
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
PIN 1
INDICATOR
VDD
REF
REFIN
GND
1
2
3
4
5
15 VIO
14 SDO
13 SCK
12 DIN
11 CNV
TOP VIEW
GND
Figure 4. 20-Lead LFCSP Pin Configuration
Table 7. Pin Function Descriptions
Pin No.
Mnemonic
Type1
Description
1, 20
VDD
P
Power Supply. Nominally 2.5 V to 5.5 V when using an external reference, and decoupled with
10 ꢀF and 100 nF capacitors.
When using the internal reference for 2.5V output, the minimum should be 2.7V.
When using the internal reference for 4.096V output, the minimum should be 4.5V.
2
REF
AI/O
Reference Input/Output. See the Voltage Reference Output/Input section.
When the internal reference is enabled, this pin produces a selectable system reference = 2.5V or
4.096V.
When the internal reference is disabled and the buffer is enabled, REF produces a buffered
version of the voltage present on the REFIN pin (4.096V max.) useful when using low cost, low
power references.
For improved drift performance, connect a precision reference to REF (0.5V to VDD).
For any reference method, this pin needs decoupling with an external a 22 ꢀF capacitor
connected as close to REF as possible. See the Reference Decoupling section.
3
REFIN
AI/O
Internal Reference Output/Reference Buffer Input. See the Voltage Reference Output/Input
section.
When using the internal reference, the internal unbuffered reference voltage is present and
needs decoupling with a 0.1ꢀF capacitor.
When using the internal reference buffer, apply a source between 0.5V to 4.096V which is
buffered to the REF pin as described above.
4, 5
6 - 9
10
GND
IN4 – IN7
COM
AI
AI
AI
Power Supply Ground.
Channel 4 through Channel 7 Analog Inputs.
Common Channel Input. All channels [7:0] can be referenced to a common mode point of 0 V or
VREF/2 V.
11
12
13
14
CNV
DIN
SCK
SDO
DI
Convert Input. On the rising edge, CNV initiates the conversion. During conversion, if CNV is
held high, the BUSY indictor is enabled.
Data Input. This input is used for writing to the 14-bit configuration register. The configuration
register can be written to during and after conversion.
Serial Data Clock Input. This input is used to clock out the data on ADO and clock in data on DIN
in an MSB first fashion.
Serial Data Output. The conversion result is output on this pin synchronized to SCK. In unipolar
modes, conversion results are straight binary; in bipolar modes conversion results are twos
complement.
DI
DI
DO
15
VIO
P
Input/Output Interface Digital Power. Nominally at the same supply as the host interface (1.8 V,
2.5 V, 3 V, or 5 V).
16 - 19
IN0 – IN3
AI
Channel 0 through Channel 3 Analog Inputs.
1AI = analog input, AI/O = analog input/output, DI = digital input, DO = digital output, and P = power.
Rev. PrC | Page 8 of 20
Preliminary Technical Data
AD7689
TYPICAL PERFORMANCE CHARACTERISTICS
1
0.75
0.5
2
1.5
1
0.25
0
0.5
0
-0.25
-0.5
-0.75
-1
-0.5
-1
-1.5
-2
0
16384
32768
CODE
49152
65536
0
16384
32768
CODE
49152
65536
Figure 8. Differential Nonlinearity vs. Code, VREF = 5V
Figure 5. Integral Nonlinearity vs. Code, VREF = 5V
200000
180000
160000
140000
120000
100000
80000
60000
40000
20000
0
200000
180000
160000
140000
120000
100000
80000
60000
40000
20000
0
σ = 0.44
σ = 0.83
196433
V
REF = 5V
171449
V
REF = 2.5V
50640
36872
8001
37789
27695
7FFF
784
457
8000
0
0
1
8001
0
0
0
44
76
0
8003
0
7FFA 7FFB 7FFC 7FFD 7FFE 7FFF
CODE IN HEX
8002
7FFC 7FFD 7FFE
8000
CODE IN HEX
8002
8004
Figure 9. Histogram of a DC Input at Code Center, VREF = 2.5V
Figure 6. Histogram of a DC Input at Code Center, VREF = 5V
0
0
-20
fs = 250 kSPS
fIN = 10.1 kHz
fs = 250 kSPS
fIN = 10.1 kHz
-20
SNR = 87.1 dB
THD = -104 dB
SFDR = 104 dB
SINAD = 87 dB
SNR = 91.1 dB
THD = -102 dB
SFDR = 103 dB
SINAD = 91 dB
-40
-60
-40
-60
-80
-80
-100
-120
-140
-160
-180
-100
-120
-140
-160
-180
FREQUENCY (kHz)
FREQUENCY (kHz)
Figure 10. 10kHz FFT, VREF = 2.5V
Figure 7. 10kHz FFT, VREF = 5V
Rev. PrC | Page 9 of 20
AD7689
Preliminary Technical Data
TERMINOLOGY
Least Significant Bit (LSB)
Signal-to-Noise Ratio (SNR)
The LSB is the smallest increment that can be represented by a
converter. For an analog-to-digital converter with N bits of
resolution, the LSB expressed in volts is
SNR is the ratio of the rms value of the actual input signal to the
rms sum of all other spectral components below the Nyquist
frequency, excluding harmonics and dc. The value for SNR is
expressed in decibels.
VREF
2N
LSB (V) =
Signal-to-(Noise + Distortion) Ratio (SINAD)
SINAD is the ratio of the rms value of the actual input signal to
the rms sum of all other spectral components below the Nyquist
frequency, including harmonics but excluding dc. The value for
SINAD is expressed in decibels.
Integral Nonlinearity Error (INL)
INL refers to the deviation of each individual code from a line
drawn from negative full scale through positive full scale. The
point used as negative full scale occurs ½ LSB before the first
code transition. Positive full scale is defined as a level 1½ LSB
beyond the last code transition. The deviation is measured from
the middle of each code to the true straight line (see Figure 12).
Total Harmonic Distortion (THD)
THD is the ratio of the rms sum of the first five harmonic
components to the rms value of a full-scale input signal and is
expressed in decibels.
Differential Nonlinearity Error (DNL)
Spurious-Free Dynamic Range (SFDR)
SFDR is the difference, in decibels, between the rms amplitude
of the input signal and the peak spurious signal.
In an ideal ADC, code transitions are 1 LSB apart. DNL is the
maximum deviation from this ideal value. It is often specified in
terms of resolution for which no missing codes are guaranteed.
Effective Number of Bits (ENOB)
ENOB is a measurement of the resolution with a sine wave
input. It is related to SINAD by the following formula:
Offset Error
The first transition should occur at a level ½ LSB above analog
ground (38.14μV). The unipolar offset error is the deviation of
the actual transition from that point.
ENOB = (SINADdB − 1.76)/6.02
and is expressed in bits.
Gain Error
Channel-to-Channel Crosstalk
The last transition (from 111…10 to 111…11) should occur for
an analog voltage 1½ LSB below the nominal full-scale. The gain
error is the deviation in LSB (or % of full-scale range) of the
actual level of the last transition from the ideal level after the
offset error is adjusted out. Closely related is the full-scale error
(also in LSB or % of full-scale range), which includes the effects
of the offset error.
Channel-to-channel crosstalk is a measure of the level of crosstalk
between any two adjacent channels. It is measured by applying a
DC to the channel under test and applying a full-scale, 100 kHz
sine wave signal to the adjacent channel(s). The crosstalk is the
amount of signal that leaks into the test channel and is
expressed in dB.
Reference Voltage Temperature Coefficient
Aperture Delay
Reference voltage temperature coefficient is derived from the
typical shift of output voltage at 25°C on a sample of parts at the
maximum and minimum reference output voltage (VREF) meas-
ured at TMIN, T(25°C), and TMAX. It is expressed in ppm/°C as
Aperture delay is the measure of the acquisition performance. It
is the time between the rising edge of the CNV input and when
the input signal is held for a conversion.
Transient Response
Transient response is the time required for the ADC to accurately
acquire its input after a full-scale step function is applied.
VREF (Max)–VREF (Min)
TCVREF (ppm/°C) =
×106
VREF (25°C) × (TMAX –TMIN )
Dynamic Range
where:
Dynamic range is the ratio of the rms value of the full scale to
the total rms noise measured with the inputs shorted together.
The value for dynamic range is expressed in decibels.
V
V
V
REF (Max) = maximum VREF at TMIN, T(25°C), or TMAX.
REF (Min) = minimum VREF at TMIN, T(25°C), or TMAX
REF (25°C) = VREF at 25°C.
.
TMAX = +85°C.
TMIN = –40°C.
Rev. PrC | Page 10 of 20
Preliminary Technical Data
AD7689
THEORY OF OPERATION
IN+
SWITCHES CONTROL
CONTROL
MSB
LSB
LSB
SW+
SW–
32,768C 16,384C
4C
4C
2C
2C
C
C
C
C
BUSY
CAP
GND
COMP
LOGIC
OUTPUT CODE
32,768C 16,384C
MSB
CNV
IN- or
COM
Figure 11. ADC Simplified Schematic
OVERVIEW
CONVERTER OPERATION
The AD7689 is an 8-channel, 16-bit, charge redistribution
successive approximation register (SAR), analog-to-digital
converter (ADC). The AD7689 is capable of converting 250,000
samples per second (250 kSPS) and powers down between
conversions. For example, when operating with an external
reference at 1 kSPS, it consumes TBD μW typically, ideal for
battery-powered applications.
The AD7689 is a successive approximation ADC based on a
charge redistribution DAC. Figure 11 shows the simplified
schematic of the ADC. The capacitive DAC consists of two
identical arrays of 16 binary-weighted capacitors, which are
connected to the two comparator inputs.
During the acquisition phase, terminals of the array tied to the
comparator’s input are connected to GND via SW+ and SW−.
All independent switches are connected to the analog inputs.
The AD7689 contains all of the components for use in a multi-
channel, low power, data acquisition system including:
Thus, the capacitor arrays are used as sampling capacitors and
acquire the analog signal on the IN+ and IN− (or COM) inputs.
When the acquisition phase is complete and the CNV input
goes high, a conversion phase is initiated. When the conversion
phase begins, SW+ and SW− are opened first. The two
capacitor arrays are then disconnected from the inputs and
connected to the GND input. Therefore, the differential voltage
between the IN+ and IN- (or COM) inputs captured at the end
of the acquisition phase is applied to the comparator inputs,
causing the comparator to become unbalanced. By switching
each element of the capacitor array between GND and CAP, the
comparator input varies by binary-weighted voltage steps
(VREF/2, VREF/4 ... VREF/32,768). The control logic toggles these
switches, starting with the MSB, to bring the comparator back
into a balanced condition. After the completion of this process,
the part returns to the acquisition phase, and the control logic
generates the ADC output code and a busy signal indicator.
•
•
•
•
•
•
16-bit SAR ADC with no missing codes
8-channel, low crosstalk multiplexer
Internal low drift reference and buffer
Temperature sensor
Selectable 1-pole filter
Channel sequencer
all of which are configured through a SPI compatible, 14-bit
register.
The AD7689 provides the user with an on-chip track-and-hold
and does not exhibit pipeline delay or latency.
The AD7689 uses a simple SPI interface for configuring and
receiving conversion results.
The AD7689 is specified from 2.3 V to 5.5 V and can be
interfaced to any 1.8 V to 5 V digital logic family. It is housed in
a 20-lead, 4mm x 4mm LFCSP that combines space savings and
allows flexible configurations. It is pin-for-pin compatible with
the 16-bit AD7682, AD7699 and 14-bit AD7949.
Because the AD7689 has an on-board conversion clock, the
serial clock, SCK, is not required for the conversion process.
Rev. PrC | Page 11 of 20
AD7689
Preliminary Technical Data
TRANSFER FUNCTIONS
2’s COMP STRAIGHT
BINARY
With the inputs configured for unipolar range (single ended,
COM with ground sense, or paired differentially with IN- as
ground sense), the data output is straight binary.
011...111 111...111
011...110 111...110
011...101 111...101
With the inputs configured for bipolar range (COM = VREF/2, or
paired differentially with IN- = VREF/2), the data outputs are
two’s complement.
The ideal transfer characteristic for the AD7689 is shown in
Figure 12 and Table 8 for both unipolar and bipolar ranges with
the internal 4.096V reference.
100...010 000...010
100...001 000...001
100...000 000...000
–FSR
–FSR + 1LSB
+FSR – 1LSB
+FSR – 1.5LSB
–FSR + 0.5LSB
ANALOG INPUT
Figure 12. ADC Ideal Transfer Function
Table 8. Output Codes and Ideal Input Voltages
Digital Output
Code (Straight
Binary Hex)
Digital Output
Code (2’s Complement
Hex)
Unipolar Analog Input1
REF = 4.096 V
Bipolar Analog Input2
VREF = 4.096 V
Description
FSR − 1 LSB
Midscale + 1 LSB
Midscale
V
4.095938 V
2.048063 V
2.048 V
0xFFFF3
0x8001
0x8000
0x7FFF
0x0001
0x00004
+2.047938 V
62.5 μV
0
0x7FFF
0x0001
0x00004
0xFFFF3
0x8001
0x8000
Midscale − 1 LSB
−FSR + 1 LSB
−FSR
2.047938 V
62.5 μV
0 V
-62.5 μV
-2.047938 V
-2.048 V
1 With COM or IN- = 0 V or all INx referenced to GND.
2 With COM or IN- = VREF /2.
3 This is also the code for an overranged analog input ((IN+) − (IN-) , or COM, above VREF − VGND).
4 This is also the code for an underranged analog input ((IN+) − (IN-), or COM, below VGND).
TYPICAL CONNECTION DIAGRAM
Figure 13 shows an example of the recommended connection
diagram for the AD7689 when multiple supplies are available.
5V
1.8V TO VDD
2
100nF
100nF
100nF
22µF
V+
REFIN VDD
REF
VIO
0 TO V
REF
3
ADA4841-x
IN0
AD7689
V–
V+
DIN
INn
4
3-WIRE INTERFACE
SCK
SDO
CNV
0 TO V
REF
3
ADA4841-x
V–
0 V or
COM
V
REF
/2
GND
1
2
3
4
INTERNAL REFERNCE SHOWN. SEE REFERENCE SECTION FOR REFERENCE SELECTION.
IS USUALLY A 22µF CERAMIC CAPACITOR (X5R).
SEE DRIVER AMPLIFIER SECTION FOR ADDITIONAL RECOMMENDED AMPLIFIERS.
C
REF
SEE THE DIGITAL INTERFACE SECTION FOR CONFIGURING AND READING CONVERSION DATA.
Figure 13. Typical Application Diagram with Multiple Supplies
Rev. PrC | Page 12 of 20
Preliminary Technical Data
AD7689
2:1
SEQ
Channel Sequencer
CONFIGURATION REGISTER, CFG
2
0
0
1
1
0
1
0
Function
Disable Sequencer
Update config during sequence
Scan IN0–INn (set in CFG[9:7])
then TEMP
The AD7689 uses a 14-bit configuration register (CFG[13:0])
for configuring the inputs, channel to be converted, 1-pole filter
bandwidth, reference, and channel sequencer. The CFG is
latched MSB first with DIN synchronized to SCK rising edge. At
the end of conversion, the register is updated allowing the new
settings to be used. There is always a one deep conversion delay
regardless of when the CFG is written to; during or after
conversion. Note that at power up, the CFG is undefined and a
dummy conversion is required to update the register. To preload
the CFG with a factory setting, hold DIN high for 1 conversion.
Thus CFG[13:0] = 0x3FFF. This sets the AD7689 for:
1
1
Scan IN0–INn (set in CFG[9:7])
0
RB
Read back
0 – Read back current configuration at end of data
1- Do not read back contents of configuration
ANALOG INPUTS
Input Configurations
Figure 14 shows the different methods for configuring the
analog inputs with CFG[12:10].
•
•
•
•
IN[7:0] unipolar referenced to GND, sequenced in order
Full bandwidth for 1-pole filter
CH0+
CH1+
CH2+
CH0+
CH1+
CH2+
IN0
IN1
IN2
IN3
IN0
IN1
IN2
IN3
Internal reference/temp sensor disabled, buffer enabled
No read back of CFG
CH3+
CH4+
CH5+
CH6+
CH7+
CH3+
CH4+
CH5+
CH6+
CH7+
COM-
Table 9 Summarizes the configuration register bit details. Each
corresponding section, where necessary, highlights further
details of the bits used for the specific functions.
IN4
IN5
IN4
IN5
IN6
IN6
Table 9. Configuration Register Description
IN7
IN7
Bit
Name
Description
COM
GND
COM
GND
13
CFG
0 – Keep current config settings
1 – Overwrite contents of register
Input Channel Configuration
12 11 10 Function
12:10 INCC
B - 8 CHANNELS,
COMMON REFERNCE
A- 8 CHANNELS,
SINGLE ENDED
0
0
X
Bipolar differential pairs, IN-
referenced to VREF/2
0
1
0
Bipolar, IN0-IN7 referenced to
COM = VREF/2
Temperature sensor
Unipolar differential pairs, IN-
referenced to GND ( 100mV)
Unipolar, IN0-IN7 referenced to
COM = GND ( 100mV)
CH0+ (-)
CH0- (+)
CH1+ (-)
CH1- (+)
CH0+ (-)
IN0
IN1
IN2
IN3
IN0
IN1
IN2
IN3
{
{
{
{
{
{
CH0- (+)
CH1+ (-)
CH1- (+)
0
1
1
0
1
X
CH2+ (-)
CH2- (+)
CH2+
1
1
1
1
0
1
IN4
IN5
IN4
IN5
IN6
IN7
CH3+
CH4+
CH5+
COM-
Unipolar, IN0-IN7 referenced to
GND (single ended)
CH3+ (-)
CH3- (+)
IN6
IN7
9:7
INn
Channel Selection in binary fashion
COM
GND
COM
GND
9
0
0
.
8
0
0
.
7
0
1
.
Function
IN0
IN1
C - 4 CHANNELS,
DIFFERENTIAL
D - COMBINATION
1
1
1
IN7
Figure 14. Multiplexed Analog Input Configuraitons
6
BW
REF
Selects BW for Low Pass Filter
0 – ¼ of BW
1 – Full BW
The analog inputs can be configured as:
•
Figure 14A, single ended referenced to system ground;
CFG[12:10] = 1112.
5:3
Reference/Buffer Selection
5
0
0
0
0
4
0
0
1
1
3
0
1
0
1
Function
Internal ref, REF = 2.5V output
Internal ref, REF = 4.096V output
External ref, Temp enabled
External ref, internal Buffer,
Temp enabled
•
Figure 14B, bipolar differential with a common reference
point, COM, = VREF/2; CFG[12:10] = 0102.
Unipolar differential with COM connected to a ground
sense; CFG[12:10] = 1102.
•
Figure 14C, bipolar differential pairs with INx- referenced
to VREF/2; CFG[12:10] = 00X2.
Unipolar differential pairs with INx- referenced to a
1
1
1
1
0
1
External ref, Temp disabled
External ref, internal Buf, Temp
disabled
Rev. PrC | Page 13 of 20
AD7689
Preliminary Technical Data
ground sense; CFG[12:10] = 10X2.
more than 0.3 V because this causes the diodes to become
forward biased and to start conducting current. These diodes
can handle a forward-biased current of 130 mA maximum. For
instance, these conditions could eventually occur when the
input buffer’s supplies are different from VDD. In such a case,
for example, an input buffer with a short circuit, the current
limitation can be used to protect the part.
In this configuration, the IN+ is identified by the channel
in CFG[9:7]. Example: for IN0 = IN1+ and IN1 = IN1-,
CFG[9:7] = 0002; for IN1 = IN1+ and IN0 = IN1-,
CFG[9:7] = 0012
•
Figure 14D, sows the inputs configured in any of the above
combinations as the AD7689 can be configured
dynamically.
VDD
Sequencer
D1
D2
C
IN+
OR IN-
OR COM
IN
R
IN
The AD7689 includes a channel sequencer useful for scanning
channels in a IN0 to INn fashion. Channels are scanned as
single or pairs and with or without the temperature sensor, after
the last channel is sequenced.
C
PIN
GND
Figure 15. Equivalent Analog Input Circuit
The sequencer starts with IN0 and finishes with INn set in
CFG[9:7]. For paired channels, the channels are paired
depending on the last channel set in CFG[9:7]. Note that the
channel pairs are always paired IN(even) = INx+ and IN(odd) =
INx- regardless of CFG[7].
The analog input structure allows the sampling of the true
differential signal between INn+ and COM or INn+ and INn-.
By using these differential inputs, signals common to both
inputs are rejected.
During the acquisition phase, the impedance of the analog
inputs can be modeled as a parallel combination of the
capacitor, CPIN, and the network formed by the series
connection of RIN and CIN. CPIN is primarily the pin capacitance.
To enable the sequencer, CFG[2:1] are written to for initializing
the sequencer. After CFG[13:0] is updated, DIN must be held
low while reading data out (at least for bit 13) or the CFG will
begin updating again.
R
IN is typically 3.5kΩ and is a lumped component made up of
While operating in a sequence, the CFG can be changed by
writing 012 to CFG[2:1]. However, if changing CFG[11] (paired
or single channel) or CFG[9:7] (last channel in sequence), the
sequence will reinitialize and convert IN0 (or IN1) after CFG is
updated.
serial resistors and the on resistance of the switches. CIN is
typically 27 pF and is mainly the ADC sampling capacitor.
Selectable Low Pass Filter
During the conversion phase, where the switches are opened,
the input impedance is limited to CPIN. While the AD7689 is
acquiring, RIN and CIN make a 1-pole, low-pass filter that reduces
undesirable aliasing effects and limits the noise from the driving
circuitry. The low pass filter can be programmed for the full
bandwidth or ¼ of the bandwidth with CFG[6] as shown in
Table 9.
Examples (only bits for input and sequencer are highlighted)
Scan all IN[7:0] referenced to COM = GND sense with
temperature sensor:
13
CFG
-
12 11 10
INCC
9
8
INn
1
7
6
5
4
REF
-
3
2
1
0
0
BW
-
SEQ
1
RB
-
1
1
0
1
1
-
-
DRIVER AMPLIFIER CHOICE
Scan 3 paired channels without temperature sensor and
referenced to VREF/2:
Although the AD7689 is easy to drive, the driver amplifier
needs to meet the following requirements:
13
CFG
-
12 11 10
INCC
9
8
INn
0
7
6
5
4
REF
-
3
2
1
1
0
• The noise generated by the driver amplifier needs to be kept
as low as possible to preserve the SNR and transition noise
performance of the AD7689. Note that the AD7689 has a
noise much lower than most of the other 16-bit ADCs and,
therefore, can be driven by a noisier amplifier to meet a given
system noise specification. The noise coming from the
amplifier is filtered by the AD7689 analog input circuit low-
pass filter made by RIN and CIN or by an external filter, if one
is used. Because the typical noise of the AD7689 is 35 μV rms
(with VREF = 5V), the SNR degradation due to the amplifier is
BW
-
SEQ
1
RB
-
0
0
X
1
X
-
-
Scan 4 paired channels referenced to a GND sense with
temperature sensor:
13
CFG
-
12 11 10
INCC
9
8
INn
1
7
6
5
4
REF
-
3
2
1
0
0
BW
-
SEQ
1
RB
-
1
0
X
1
X
-
-
Input Structure
Figure 15 shows an equivalent circuit of the input structure of
the AD7689.
⎛
⎜
⎞
⎟
35
⎜
⎜
⎟
⎟
The two diodes, D1 and D2, provide ESD protection for the
analog inputs, IN[7:0] and COM. Care must be taken to ensure
that the analog input signal does not exceed the supply rails by
SNRLOSS = 20log
π
2
352 + f−3dB (NeN )2
⎜
⎝
⎟
⎠
Rev. PrC | Page 14 of 20
Preliminary Technical Data
AD7689
where:
the temperature sensor, the output is straight binary referenced
from the AD7689 GND pin.
f
–3dB is the input bandwidth in MHz of the AD7689
(1.7MHz in full BW or 425kHz in ¼ BW) or the cutoff
frequency of an input filter, if one is used.
The internal reference is temperature-compensated to within
15 mV. The reference is trimmed to provide a typical drift of
3 ppm/°C. This typical drift characteristic is shown in TBD.
N is the noise gain of the amplifier (for example, 1 in buffer
configuration).
External Reference and Internal Buffer
eN is the equivalent input noise voltage of the op amp, in
nV/√Hz.
For improved drift performance, and external reference can be
used with the internal buffer. The external reference is con-
nected to REFIN and the output is produced on the REF pin.
There are two modes which can use en external reference with
the internal buffer; one with the temperature sensor enabled
and one without. Refer to Table 9 for the register details. With the
buffer enabled, the gain us unity and limited to input/output of
4.096V.
• For ac applications, the driver should have a THD
performance commensurate with the AD7689. TBD shows
the AD7689’s THD vs. frequency.
• For multichannel, multiplexed applications on each input or
input pair, the driver amplifier and the AD7689 analog input
circuit must settle a full-scale step onto the capacitor array at
a 16-bit level (0.0015%). In the amplifier’s data sheet, settling
at 0.1% to 0.01% is more commonly specified. This could
differ significantly from the settling time at a 16-bit level and
should be verified prior to driver selection.
The internal reference buffer is useful in multi-converter
applications since a buffer is typically required in these
applications. Also, the use of a low power reference can be used
since the internal buffer provides the necessary performance to
drive the SAR architecture of the AD7689.
Table 10. Recommended Driver Amplifiers
External Reference
Amplifier
ADA4841-x
AD8655
AD8021
AD8022
OP184
Typical Application
In any of the six modes, an external reference can be connected
directly on the REF pin since the output impedance of REF is >
5k ohms. To reduce power consumption, the reference and
buffer can be powered down independently or together for the
lowest power consumption. However, for applications requiring
the use of the temperature sensor, the reference needs to be
active. Refer to Table 9 for register details.
Very low noise, small, and low power
5 V single supply, low noise
Very low noise and high frequency
Low noise and high frequency
Low power, low noise, and low frequency
AD8605, AD8615 5 V single supply, low power
When the source impedance of the driving circuit is low, the
AD7689 can be driven directly. Large source impedances
significantly affect the ac performance, especially total
harmonic distortion (THD). The dc performances are less
sensitive to the input impedance. The maximum source
impedance depends on the amount of THD that can be
tolerated. The THD degrades as a function of the source
impedance and the maximum input frequency.
For improved drift performance, an external reference such as
the ADR43x or ADR44x is recommended.
Reference Decoupling
Whether using an internal or external reference, the AD7689
voltage reference output/input, REF, has a dynamic input
impedance and should therefore be driven by a low impedance
source with efficient decoupling between the REF and GND
pins. This decoupling depends on the choice of the voltage
reference, but usually consists of a low ESR capacitor connected
to REF and GND with minimum parasitic inductance. A 22 μF
(X5R, 1206 size) ceramic chip capacitor is appropriate when
using either the internal reference, the ADR43x /ADR44x
external reference or from a low impedance buffer such as the
AD8031 or the AD8605.
VOLTAGE REFERENCE OUTPUT/INPUT
The AD7689 allows the choice of either a very low temperature
drift internal voltage reference, an external reference or an external
buffered reference.
The internal reference of the AD7689 provides excellent perfor-
mance and can be used in almost all applications. There are a
possible 6 choices of voltage reference schemes briefly described
in Table 9 with further details in each of the following sections.
The placement of the reference decoupling is also important to
the performance of the AD7689, as explained in the Layout
section. The decoupling capacitor should be mounted on the
same side as the ADC right at the REF pin with a thick PCB
trace. The GND should also connect to the reference
decoupling capacitor with the shortest distance and to the
analog ground plane with several vias.
Internal Reference/Temperature Sensor
The internal reference can be set for either 2.5V or a 4.096V
output as detailed in Table 9. With the internal reference enabled,
the band-gap voltage will also be present on the REFIN pin, which
requires an external 0.1 ꢀF capacitor.
If desired, smaller reference decoupling capacitor values down
to 2.2 μF can be used with a minimal impact on performance,
especially DNL.
Enabling the reference also enables the internal temperature sensor,
which measures the internal temperature of the AD7689 thus
useful for performing a system calibration. Note that when using
Rev. PrC | Page 15 of 20
AD7689
Preliminary Technical Data
Regardless, there is no need for an additional lower value
ceramic decoupling capacitor (for example, 100 nF) between the
REF and GND pins.
DIGITAL INTERFACE
The AD7689, uses a simple 4-wire interface and is compatible
with SPI, QSPI, digital hosts, and DSPs, for example, Blackfin®
ADSP-BF53x or ADSP-219x.
For applications that use multiple AD7689s or other PulSAR
devices, it is more effective to use the internal reference buffer
to buffer the external reference voltage thus reducing SAR
conversion crosstalk.
The interface uses the CNV, DIN, SCK, and SDO signals and
allows CNV, which initiates the conversions, to be independent
of the read back timing. This is useful in low jitter sampling or
simultaneous sampling applications.
The voltage reference temperature coefficient (TC) directly impacts
full scale; therefore, in applications where full-scale accuracy
matters, care must be taken with the TC. For instance, a
CFG Writing
Prior to conversion, the AD7689 needs the CFG written to
unless the factory default setting is to be used as described in
the beginning of the Configuration Register section. If DIN is
high during the 1st SCK falling edge, CFG will be updated on
the 14th falling SCK edge. After the 14th SCK, the CFG will be
disabled and not accept any new CFG data until after the end of
conversion, tCONV (max). The CFG must be updated before the
end of conversion for the setting to take effect for the next
conversion. It can also be updated while reading back data thus
minimizing the SCK activity.
15 ppm/°C TC of the reference changes full-scale by 1 LSB/°C.
POWER SUPPLY
The AD7689 uses three power supply pins: two core supplies,
VDD, and a digital input/output interface supply, VIO. VIO
allows direct interface with any logic between 1.8 V and VDD.
To reduce the supplies needed, the VIO and VDD pins can be
tied together. The AD7689 is independent of power supply
sequencing between VIO and VDD. Additionally, it is very
insensitive to power supply variations over a wide frequency
range.
Conversion Data
The AD7689 powers down automatically at the end of each
conversion phase; therefore, the operating currents and power
scale linearly with the sampling rate. This makes the part ideal
for low sampling rates (even of a few hertz) and low battery-
powered applications.
The conversion data can be read at any time; during acquisition,
during conversion and after conversion. While reading during
conversion, the data read is from the previous conversion (n-1)
as the current conversion (n) is active.
The AD7689 offers the flexibility to optionally force a start bit
in front of the data bits. This start bit can be used as a BUSY
signal indicator to interrupt the digital host and trigger the data
reading. Otherwise, without a BUSY indicator, the user must
time out the maximum conversion time prior to readback. The
BUSY indicator feature is enabled when the CNV is held low
before the maximum conversion time, tCONV (max).
SUPPLYING THE ADC FROM THE REFERENCE
For simplified applications, the AD7689, with its low operating
current, can be supplied directly using the reference circuit
shown in Figure 16. The reference line can be driven by
•
•
The system power supply directly
A reference voltage with enough current output capability,
such as the ADR43x/ADR44x
Note that in the following sections, the timing diagrams
indicate digital activity (SCK, CNV, DIN) during the
conversion. However, due to the possibility of performance
degradation, digital activity should only occur prior to the
minimum conversion time, tCONV (min) since the AD7689
provides error correction circuitry that can correct for an
incorrect bit during this time. The user should configure the
AD7689 and initiate the busy indicator (if desired) during this
time. It is also possible to corrupt the sample by having SCK or
DIN transitions near the sampling instant. Therefore, it is
recommended to keep the digital pins quiet for approximately
30 ns before and 10 ns after the rising edge of CNV. To this
extent, it is recommended, to use a discontinuous SCK whenever
possible to avoid any potential performance degradation.
•
A reference buffer, such as the AD8031, which can also
filter the system power supply, as shown in Figure 16
5V
5V
10Ω
5V 10kΩ
22µF
1µF
AD8031
1µF
1
CAP
VDD
VIO
AD7689
1
OPTIONAL REFERENCE BUFFER AND FILTER.
Figure 16. Example of an Application Circuit
Rev. PrC | Page 16 of 20
Preliminary Technical Data
AD7689
conversion, the register is updated. In this mode, the new
WITHOUT BUSY INDICATOR
configuration settings are used for the following (n + 1)
acquisition and conversion. The AD7689 can also be
configured on 14 SCKs of the data reading (not shown), thus
reducing the number of SCK bursts. However, this new CFG
setting is for the (n + 2) conversion since the (n) conversion has
ended. This mode is useful when using multiple AD7689s using
the same configuration.
This mode is usually used when the AD7689 is connected to an
SPI-compatible digital host. The connection diagram is shown
in Figure 17, and the corresponding timing is given in Figure
18.
A rising edge on CNV initiates a conversion and forces SDO to
high impedance. Once a conversion is initiated, it continues
until completion irrespective of the state of CNV. This could be
useful, for instance, to bring CNV low to select other SPI
devices, such as analog multiplexers; however, CNV must be
returned high before the minimum conversion time elapses and
then held high for the maximum possible conversion time to
avoid the generation of the busy signal indicator.
When the conversion is complete, the AD7689 enters the
acquisition phase and powers down. When CNV goes low, the
MSB is output onto SDO. The remaining data bits are clocked
by subsequent SCK falling edges. The data is valid on both SCK
edges. Although the rising edge can be used to capture the data,
a digital host using the SCK falling edge will allow a faster
reading rate, provided it has an acceptable hold time. After the
16th SCK falling edge or when CNV goes high (whichever
occurs first), SDO returns to high impedance.
Configuring the AD7689 for the (n + 1) conversion is initiated
when SCK is high and a rising edge on CNV. After this mode is
initiated, CNV is a don’t care as the CFG word is written in
MSB first with 14 SCK rising edges. As shown in Figure 18,
CFG is written to during the current (n) conversion before the
end of conversion, or tCONV minimum time. At the end of
CONVERT
DIGITAL HOST
DATA IN
CNV
SDO
AD7689
CFG DATA
DIN
SCK
CLK
Figure 17. Without Busy Indicator Connection Diagram
t CYC
tCNVH
CNV
t CONV
tACQ
CONVERSION
(n + 1)
ACQUISITION
(n)
CONVERSION
(n)
ACQUISITION
(n + 1)
tCSCK
tSCK
tSCKH
SCK
1
13
1
14
2
3
2
3
14
16
15
tHSDO
tDSDO
tHDIN
tSCKL
DIN
C12
tSDIN
C11
C0
C1
C13
tDIS
tEN
SDO
D15
D1
D14
D2
D0
D13
Figure 18. Without Busy Indicator Serial Interface Timing
Rev. PrC | Page 17 of 20
AD7689
Preliminary Technical Data
acquisition and conversion. Note that SCK must be high when
CNV goes high for this configuration mode. The AD7689 can
also be configured on the first 14 SCK of the data reading (not
shown), thus reducing the number of SCK bursts. However, this
new CFG setting is for the (n + 2) conversion.
WITH BUSY INDICATOR
This mode is usually used when the AD7689 is connected to an
SPI-compatible digital host using an interrupt input. The
connection diagram is shown in Figure 19,, and the
corresponding timing is given in Figure 20.
When the conversion is complete, SDO goes from high
impedance to low impedance. With a pull-up on the SDO line,
this transition can be used as an interrupt signal to initiate the
data reading controlled by the digital host. The AD7689 then
enters the acquisition phase and powers down. The data bits are
clocked out, MSB first, by subsequent SCK falling edges. The
data is valid on both SCK edges. Although the rising edge can
be used to capture the data, a digital host using the SCK falling
edge will allow a faster reading rate, provided it has an
acceptable hold time. After the optional 17th SCK falling edge or
when CNV goes high (whichever occurs first), SDO returns to
high impedance.
A rising edge on CNV initiates a conversion and forces SDO to
high impedance. SDO is maintained in high impedance until
the completion of the conversion irrespective of the state of
CNV. Prior to the minimum conversion time, CNV can be
used to select other SPI devices, such as analog multiplexers,
but CNV must be returned low before the minimum conversion
time elapses and then held low for the maximum possible
conversion time to guarantee the generation of the busy signal
indicator.
Configuring the AD7689 for the (n + 1) conversion is initiated
when SCK is high and a rising edge on CNV. After this mode is
initiated, CNV is a don’t care as the CFG word is written in
MSB first with 14 SCK rising edges. As shown in Figure 20,
CFG is written to during the current (n) conversion before the
end of conversion, or tCONV minimum time. At the end of
conversion, the register is updated. In this mode, the new
configuration settings are used for the following (n + 1)
If multiple AD7689s are selected at the same time, the SDO
output pin handles this contention without damage or induced
latch-up. Meanwhile, it is recommended to keep this contention
as short as possible to limit extra power dissipation.
CONVERT
VIO
DIGITAL HOST
DATA IN
CNV
SDO
IRQ
AD7689
CFG DATA
DIN
SCK
CLK
Figure 19. With Busy Indicator Connection Diagram
t CYC
t CONV
(MIN)
CNV
t CONV
tACQ
(MAX)
CONVERSION
(n + 1)
CONVERSION
(n)
ACQUISITION
(n)
ACQUISITION
(n + 1)
tSCK
tCSCK
tSCKH
SCK
1
13
1
14
2
3
2
3
4
14
16
17
15
tSDIN
tHDIN
tSCKL
tHSDO
tDSDO
tDIS
DIN
C12
C11
C0
C1
C13
SDO
D15
D14
D2
D3
D1
D0
D13
Figure 20. Wwith Busy Indicator Serial Interface Timing
Rev. PrC | Page 18 of 20
Preliminary Technical Data
AD7689
APPLICATION HINTS
LAYOUT
Figure 21. Example Layout of the AD7689 (Top Layer)
The printed circuit board that houses the AD7689 should be
designed so that the analog and digital sections are separated
and confined to certain areas of the board. The pinout of the
AD7689, with all its analog signals on the left side and all its
digital signals on the right side, eases this task.
Figure 22. Example Layout of the AD7689 (Bottom Layer)
Avoid running digital lines under the device because these
couple noise onto the die unless a ground plane under the
AD7689 is used as a shield. Fast switching signals, such as CNV
or clocks, should not run near analog signal paths. Crossover of
digital and analog signals should be avoided.
At least one ground plane should be used. It could be common
or split between the digital and analog sections. In the latter
case, the planes should be joined underneath the AD7689s.
The AD7689 voltage reference input REF has a dynamic input
impedance and should be decoupled with minimal parasitic
inductances. This is done by placing the reference decoupling
ceramic capacitor close to, ideally right up against, the REF and
GND pins and connecting them with wide, low impedance traces.
Finally, the power supplies VDD and VIO of the AD7689
should be decoupled with ceramic capacitors, typically 100 nF,
placed close to the AD7689 and connected using short, wide
traces to provide low impedance paths and reduce the effect of
glitches on the power supply lines.
An example of a layout following these rules is shown in
Figure 21 and Figure 22.
EVALUATING AD7689 PERFORMANCE
Other recommended layouts for the AD7689 are outlined
in the documentation of the evaluation board for the AD7689
(EVAL-AD7689CBZ). The evaluation board package includes
a fully assembled and tested evaluation board, documentation,
and software for controlling the board from a PC via the
EVAL-CONTROL BRD3Z.
Rev. PrC | Page 19 of 20
AD7689
Preliminary Technical Data
OUTLINE DIMENSIONS
0.60 MAX
4.00
BSC SQ
0.60 MAX
PIN 1
INDICATO
R
15
16
20
1
0.50
BSC
2.65
2.50 SQ
2.35
PIN 1
INDICATOR
3.75
BCS SQ
EXPOSED
PAD
(BOTTOM VIEW)
5
10
11
6
0.50
0.40
0.30
TOP VIEW
0.25 MIN
0.80 MAX
0.65 TYP
12° MAX
1.00
0.85
0.80
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
0.30
0.23
0.18
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-1
Figure 23. 20-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
4 mm × 4 mm Body, Very Thin Quad
(CP-20-4)
Dimensions shown in millimeters
ORDERING GUIDE
©2007 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
PR07083-0-9/07(PrC)
Rev. PrC | Page 20 of 20
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