AD8196-EVAL [ADI]

2:1 HDMI/DVI Switch with Equalization; 2 : 1 HDMI / DVI开关,具有均衡
AD8196-EVAL
型号: AD8196-EVAL
厂家: ADI    ADI
描述:

2:1 HDMI/DVI Switch with Equalization
2 : 1 HDMI / DVI开关,具有均衡

开关
文件: 总24页 (文件大小:539K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
2:1 HDMI/DVI Switch with Equalization  
Preliminary Data Sheet  
AD8196  
FEATURES  
FUNCTIONAL BLOCK DIAGRAM  
Two inputs, one output HDMI™/DVI links  
Enables HDMI 1.3-compliant receiver  
Pin-to-pin compatible with the AD8190  
Four TMDS channels per link  
Supports 250 Mbps to 2.25 Gbps data rates  
Supports 25 MHz to 225 MHz pixel clocks  
Equalized inputs for operation with long HDMI cables  
(20 meters at 2.25Gbps)  
Fully buffered unidirectional inputs/outputs  
Globally switchable 50 Ω on-chip terminations  
Pre-emphasized outputs  
Low added jitter  
Single-supply operation (3.3 V)  
Four auxiliary channels per link  
Bidirectional unbuffered inputs/outputs  
Flexible supply operation (3.3 V to 5 V)  
HDCP standard compatible  
Allows switching of DDC bus and two additional signals  
Output disable feature  
Figure 1.  
Reduced power dissipation  
Output termination removal  
TYPICAL APPLICATION  
Two AD8196s support HDMI/DVI dual-link  
Standards compliant: HDMI receiver, HDCP, DVI  
Serial (I2C slave) control interface  
56-lead, 8 mm x 8 mm, LFCSP, Pb-free package  
APPLICATIONS  
Multiple input displays  
Projectors  
Figure 2. Typical AD8196 Application for HDTV Sets  
A/V receivers  
Set-top boxes  
Advanced television (HDTV) sets  
GENERAL DESCRIPTION  
PRODUCT HIGHLIGHTS  
The AD8196 is an HDMI/DVI switch featuring equalized  
TMDS inputs and pre-emphasized TMDS outputs, ideal for  
systems with long cable runs. Outputs can be set to a high  
impedance state to reduce the power dissipation and/or allow  
the construction of larger arrays using the wire-OR technique.  
1. Supports data rates up to 2.25 Gbps, enabling greater than  
1080p HDMI formats with deep color, and UXGA (1600 ×  
1200) DVI resolutions.  
2. Input cable equalizer enables use of long cables at the  
input (more than 20 meters of 24 AWG cable at 2.25Gbps).  
The AD8196 is provided in a space saving, 56-lead, LFCSP,  
surface-mount, Pb-free, plastic package and is specified to  
operate over the −40°C to +85°C temperature range.  
3. Auxiliary switch allows routing of the DDC bus and two  
additional single-ended signals for a single chip, HDMI 1.3  
receive-compliant solution.  
PrA  
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responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other  
rights of third parties that may result from its use. Specifications subject to change without notice. No  
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Trademarks and registeredtrademarks arethe property of their respective owners.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 781.329.4700  
Fax: 781.461.3113  
www.analog.com  
©2006 Analog Devices, Inc. All rights reserved.  
 
AD8196  
Preliminary Technical Data  
TABLE OF CONTENTS  
Features .............................................................................................. 1  
Applications....................................................................................... 1  
Functional Block Diagram .............................................................. 1  
Typical Application........................................................................... 1  
General Description......................................................................... 1  
Product Highlights ........................................................................... 1  
Specifications..................................................................................... 3  
Absolute Maximum Ratings............................................................ 5  
Thermal Resistance ...................................................................... 5  
Maximum Power Dissipation ..................................................... 5  
ESD Caution.................................................................................. 5  
Pin Configuration and Function Descriptions............................. 6  
Typical Performance Characteristics ............................................. 8  
Theory of Operation ...................................................................... 12  
Introduction................................................................................ 12  
Input Channels............................................................................ 12  
Output Channels ........................................................................ 12  
Switching Mode .......................................................................... 13  
Auxiliary Lines Switching.......................................................... 13  
Serial Control Interface ................................................................. 14  
Reset............................................................................................. 14  
Write Procedure.......................................................................... 14  
Read Procedure........................................................................... 15  
Switching/Update Delay............................................................ 15  
Configuration Registers................................................................. 16  
High Speed Device Modes Register......................................... 16  
Auxiliary Device Modes Register............................................. 16  
Receiver Settings Register ......................................................... 17  
Input Termination Pulse Register ............................................ 17  
Receive Equalizer Register ........................................................ 17  
Transmitter Settings Register.................................................... 17  
Application Notes........................................................................... 18  
Pinout........................................................................................... 18  
Cable Lengths and Equalization............................................... 19  
The AD8196 as a Single-Channel Buffer ................................ 19  
PCB Layout Guidelines.............................................................. 19  
Outline Dimensions....................................................................... 23  
Ordering Guide .......................................................................... 23  
PrA | Page 2 of 24  
Preliminary Data Sheet  
SPECIFICATIONS  
AD8196  
TA = 27°C, AVCC = 3.3 V, VTTI = 3.3 V, VTTO = 3.3 V, DVCC = 3.3 V, AMUXVCC = 5 V, AVEE = 0 V, DVEE = 0 V, differential input swing =  
1000 mV, TMDS outputs terminated with external 50 Ω resistors to 3.3 V, unless otherwise noted.  
Table 1.  
Parameter  
Conditions/Comments  
Min  
Typ Max  
Unit  
DYNAMIC PERFORMANCE  
Maximum Data Rate (DR) per Channel  
Bit Error Rate (BER)  
Added Deterministic Jitter  
Added Random Jitter  
Differential Intrapair Skew  
Differential Interpair Skew1  
EQUALIZATION PERFORMANCE  
Receiver (Highest Setting)2  
Transmitter (Highest Setting)3  
INPUT CHARACTERISTICS  
Input Voltage Swing  
NRZ  
2.25  
Gbps  
PRBS 223 − 1  
10−9  
TBD  
DR 2.25 Gbps, PRBS 223 − 1  
ps (p-p)  
ps (rms)  
ps  
TBD  
TBD  
TBD  
At output  
At output  
ps  
Boost frequency = 825 MHz  
Boost frequency = 825 MHz  
12  
6
dB  
dB  
Differential  
150  
AVCC − 800  
1200  
AVCC  
mV  
mV  
Input Common-Mode Voltage (VICM  
OUTPUT CHARACTERISTICS  
High Voltage Level  
)
Single-ended high speed channel  
Single-ended high speed channel  
AVCC − 10  
AVCC − 600  
75  
AVCC + 10  
mV  
Low Voltage Level  
Rise/Fall Time (20% to 80%)  
AVCC − 400 mV  
135 200  
ps  
INPUT TERMINATION  
Resistance  
Single-ended  
50  
Ω
AUXILIARY CHANNELS  
On Resistance, RAUX  
On Capacitance, CAUX  
Input/Output Voltage Range  
POWER SUPPLY  
AVCC  
100  
8
Ω
pF  
V
DC bias = 2.5 V, ac voltage = 3.5 V, f = 100 kHz  
Operating range  
DVEE  
3
AMUXVCC  
3.6  
3.3  
V
QUIESCENT CURRENT  
AVCC  
Outputs disabled  
30  
53  
98  
5
36  
73  
40  
60  
45  
66  
mA  
mA  
mA  
mA  
mA  
mA  
Outputs enabled, no pre-emphasis  
Outputs enabled, maximum pre-emphasis  
Input termination on4  
Output termination on, no pre-emphasis  
Output termination on, maximum  
pre-emphasis  
108 120  
VTTI  
VTTO  
40  
40  
80  
54  
44  
88  
DVCC  
AMUXVCC  
4
7
10  
mA  
mA  
0.01 0.1  
POWER DISSIPATION  
Outputs disabled  
Outputs enabled, no pre-emphasis  
Outputs enabled, maximum pre-emphasis  
115  
411  
754  
271 364  
574 664  
936 1057  
mW  
mW  
mW  
TIMING CHARACTERISTICS  
Switching/Update Delay  
High speed switching register: HS_CH  
All other configuration registers  
200  
1.5  
ms  
μs  
RESET  
50  
ns  
Pulse Width  
PrA | Page 3 of 24  
 
 
AD8196  
Preliminary Technical Data  
Parameter  
Conditions/Comments  
Min  
Typ Max  
Unit  
SERIAL CONTROL INTERFACE5  
Input High Voltage, VIH  
Input Low Voltage, VIL  
Output High Voltage, VOH  
Output Low Voltage, VOL  
2
V
V
V
V
0.8  
0.4  
2.4  
1 Differential interpair skew is measured between the TMDS pairs of a single link.  
2 AD8196 output meets the transmitter eye diagram as defined in the DVI Standard Revision 1.0 and the HDMI Standard Revision 1.3.  
3 Cable output meets the receiver eye diagram mask as defined in the DVI Standard Revision 1.0 and the HDMI Standard Revision 1.3.  
4 Typical value assumes only the selected HDMI/DVI link is active with nominal signal swings and that the unselected HDMI/DVI link is deactivated. Minimum and  
maximum limits are measured at the respective extremes of input termination resistance and input voltage swing.  
5 The AD8196 is an I2C slave and its serial control interface is based on the 3.3 V I2C bus specification.  
PrA | Page 4 of 24  
Preliminary Data Sheet  
AD8196  
ABSOLUTE MAXIMUM RATINGS  
Table 2.  
THERMAL RESISTANCE  
Parameter  
AVCC to AVEE  
DVCC to DVEE  
DVEE to AVEE  
VTTI  
Rating  
3.7 V  
3.7 V  
θJA is specified for the worst-case conditions: a device soldered  
in a 4-layer JEDEC circuit board for surface-mount packages.  
θJC is specified for the exposed pad soldered to the circuit board  
with no airflow.  
0.3 V  
AVCC + 0.6 V  
AVCC + 0.6 V  
5.5 V  
Table 3. Thermal Resistance  
Package Type  
VTTO  
AMUXVCC  
θJA  
θJC  
Unit  
Internal Power Dissipation 4.62 W  
56-Lead LFCSP  
27  
2.1  
°C/W  
High Speed Input Voltage AVCC − 1.4V <VIN < AVCC + 0.6 V  
High Speed Differential  
Input Voltage  
2.0 V  
MAXIMUM POWER DISSIPATION  
Low Speed Input Voltage  
I2C Logic Input Voltage  
Storage Temperature  
Range  
Operating Temperature  
Range  
Junction Temperature  
DVEE − 0.3 V <VIN < AMUXVCC + 0.6 V  
DVEE − 0.3 V < VIN < DVCC + 0.6 V  
−65°C to +125°C  
The maximum power that can be safely dissipated by the  
AD8196 is limited by the associated rise in junction tempera-  
ture. The maximum safe junction temperature for plastic  
encapsulated devices is determined by the glass transition  
temperature of the plastic, approximately 150°C. Temporarily  
exceeding this limit may cause a shift in parametric performance  
due to a change in the stresses exerted on the die by the package.  
Exceeding a junction temperature of 175°C for an extended  
period can result in device failure. To ensure proper operation,  
it is necessary to observe the maximum power derating as  
determined by the coefficients in Table 3.  
−40°C to +85°C  
150°C  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
ESD CAUTION  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on  
the human body and test equipment and can discharge without detection. Although this product features  
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy  
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance  
degradation or loss of functionality.  
PrA | Page 5 of 24  
 
 
AD8196  
Preliminary Technical Data  
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS  
NOTES  
1. THE AD8196 LFCSP HAS AN EXPOSED PADDLE (ePAD) ON THE UNDERSIDE OF THE PACKAGE WHICH AIDS IN HEAT  
DISSIPATION. THE ePAD MUST BE ELECTRICALLY CONNECTED TO THE AVEE SUPPLY PLANE IN ORDER TO MEET THERMAL  
SPECIFICATIONS.  
Figure 3. Pin Configuration  
Table 4. Pin Function Descriptions  
Pin No.  
Mnemonic  
AVCC  
IN_A0  
IP_A0  
AVEE  
Type1  
Power  
HS I  
Description  
1, 10, 33, 42  
Positive Analog Supply. 3.3 V nominal.  
High Speed Input Complement.  
High Speed Input.  
2
3
HS I  
4, 13, 30, 39, ePAD  
Power  
HS I  
Negative Analog Supply. 0 V nominal.  
High Speed Input Complement.  
High Speed Input.  
5
IN_A1  
IP_A1  
VTTI  
6
HS I  
7, 36  
8
Power  
HS I  
Input Termination Supply. Nominally connected to AVCC.  
High Speed Input Complement.  
High Speed Input.  
IN_A2  
IP_A2  
IN_A3  
IP_A3  
I2C_ADDR  
DVCC  
ON0  
9
HS I  
11  
12  
14  
15, 21  
16  
17  
18, 24  
19  
20  
22  
23  
25  
26  
27  
28  
29  
HS I  
High Speed Input Complement.  
High Speed Input.  
I2C Address LSB.  
HS I  
Control  
Power  
HS O  
HS O  
Power  
HS O  
HS O  
HS O  
HS O  
HS O  
HS O  
Control  
Control  
Control  
Positive Digital Power Supply. 3.3 V nominal.  
High Speed Output Complement.  
High Speed Output.  
OP0  
VTTO  
ON1  
Output Termination Supply. Nominally connected to AVCC.  
High Speed Output Complement.  
High Speed Output.  
OP1  
ON2  
High Speed Output Complement.  
High Speed Output.  
OP2  
ON3  
High Speed Output Complement.  
High Speed Output.  
OP3  
E
RESET  
Configuration Registers Reset. This pin is normally pulled up to DVCC.  
I2C Clock.  
I2C Data.  
A
EA  
I2C_SCL  
I2C_SDA  
PrA | Page 6 of 24  
 
Preliminary Data Sheet  
AD8196  
Pin No.  
31  
32  
34  
35  
37  
38  
40  
41  
43  
44  
45  
46  
47  
48  
49  
50  
51  
52  
53  
54  
55  
56  
Mnemonic  
IN_B0  
Type1  
HS I  
Description  
High Speed Input Complement.  
High Speed Input.  
IP_B0  
HS I  
IN_B1  
HS I  
High Speed Input Complement.  
High Speed Input.  
IP_B1  
HS I  
IN_B2  
HS I  
High Speed Input Complement.  
High Speed Input.  
IP_B2  
HS I  
IN_B3  
HS I  
High Speed Input Complement.  
High Speed Input.  
IP_B3  
HS I  
AUX_B3  
AUX_B2  
AUX_B1  
AUX_B0  
AMUXVCC  
AUX_COM3  
AUX_COM2  
AUX_COM1  
AUX_COM0  
DVEE  
LS I/O  
LS I/O  
LS I/O  
LS I/O  
Power  
LS I/O  
LS I/O  
LS I/O  
LS I/O  
Power  
LS I/O  
LS I/O  
LS I/O  
LS I/O  
Low Speed Input/Output.  
Low Speed Input/Output.  
Low Speed Input/Output.  
Low Speed Input/Output.  
Positive Auxiliary Switch Supply. 5 V typical.  
Low Speed Common Input/Output.  
Low Speed Common Input/Output.  
Low Speed Common Input/Output.  
Low Speed Common Input/Output.  
Negative Digital and Auxiliary Switch Power Supply. 0 V nominal.  
Low Speed Input/Output.  
AUX_A3  
AUX_A2  
AUX_A1  
AUX_A0  
Low Speed Input/Output.  
Low Speed Input/Output.  
Low Speed Input/Output.  
1 HS = high speed, LS = low speed, I = input, O = output.  
PrA | Page 7 of 24  
AD8196  
Preliminary Technical Data  
TYPICAL PERFORMANCE CHARACTERISTICS  
TA = 27°C, AVCC = 3.3 V, VTTI = 3.3 V, VTTO = 3.3 V, DVCC = 3.3 V, AMUXVCC = 5 V, AVEE = 0 V, DVEE = 0 V, differential input swing =  
1000 mV, TMDS outputs terminated with external 50 Ω resistors to 3.3 V, pattern = PRBS 27 − 1, data rate = 2.25 Gbps, unless otherwise noted.  
Figure 4. Test Circuit Diagram for RX Eye Diagrams  
Figure 5. RX Eye Diagram at TP2 (Cable = 2 m, 30 AWG)  
Figure 7. RX Eye Diagram at TP3, EQ = 6 dB (Cable = 2 m, 30 AWG)  
Figure 6. RX Eye Diagram at TP2 (Cable = 20 m, 24 AWG)  
Figure 8. RX Eye Diagram at TP3, EQ = 12 dB (Cable = 20 m, 24 AWG)  
PrA | Page 8 of 24  
 
 
 
Preliminary Data Sheet  
AD8196  
TA = 27°C, AVCC = 3.3 V, VTTI = 3.3 V, VTTO = 3.3 V, DVCC = 3.3 V, AMUXVCC = 5 V, AVEE = 0 V, DVEE = 0 V, differential input swing =  
1000 mV, TMDS outputs terminated with external 50 Ω resistors to 3.3 V, pattern = PRBS 27 − 1, data rate = 2.25 Gbps, unless otherwise noted.  
Figure 9. Test Circuit Diagram for TX Eye Diagram  
Figure 10. TX Eye Diagram at TP2, PE = 2 dB  
Figure 12. TX Eye Diagram at TP3, PE = 2 dB (Cable = 2 m, 30 AWG)  
Figure 11. TX Eye Diagram at TP2, PE = 6 dB  
Figure 13. TX Eye Diagram at TP3, PE = 6 dB (Cable = 10 m, 28 AWG)  
PrA | Page 9 of 24  
 
AD8196  
Preliminary Technical Data  
TA = 27°C, AVCC = 3.3 V, VTTI = 3.3 V, VTTO = 3.3 V, DVCC = 3.3 V, AMUXVCC = 5 V, AVEE = 0 V, DVEE = 0 V, differential input swing =  
1000 mV, TMDS outputs terminated with external 50 Ω resistors to 3.3 V, pattern = PRBS 27 − 1, data rate = 2.25 Gbps, unless otherwise noted.  
Figure 14. Jitter vs. Input Cable Length (See Figure 4 for Test Setup)  
Figure 17. Jitter vs. Output Cable Length (See Figure 9 for Test Setup)  
Figure 15. Jitter vs. Data Rate  
Figure 18. Eye Height vs. Data Rate  
Figure 16. Jitter vs. Supply Voltage  
Figure 19. Eye Height vs. Supply Voltage  
PrA | Page 10 of 24  
 
Preliminary Data Sheet  
AD8196  
TA = 27°C, AVCC = 3.3 V, VTTI = 3.3 V, VTTO = 3.3 V, DVCC = 3.3 V, AMUXVCC = 5 V, AVEE = 0 V, DVEE = 0 V, differential input swing =  
1000 mV, TMDS outputs terminated with external 50 Ω resistors to 3.3 V, pattern = PRBS 27 − 1, data rate = 2.25 Gbps, unless otherwise noted.  
Figure 20. Jitter vs. Differential Input Swing  
Figure 23. Jitter vs. Input Common-Mode Voltage  
Figure 21. Jitter vs. Temperature  
Figure 24. Differential Input Termination Resistance vs. Temperature  
Figure 22. Rise and Fall Time vs. Temperature  
PrA | Page 11 of 24  
AD8196  
Preliminary Technical Data  
THEORY OF OPERATION  
INTRODUCTION  
VTTI  
The AD8196 is a pin-to-pin HDMI 1.3 receive compliant  
replacement for the AD8190. The primary function of the  
AD8196 is to switch one of two (DVI or HDMI) single-link  
sources to one output. Each HDMI/DVI link consists of four  
differential, high speed channels and four auxiliary single-  
ended, low speed control signals. The high speed channels  
include a data-word clock and three transition minimized  
differential signaling (TMDS) data channels running at 10× the  
data-word clock frequency for data rates up to 2.25 Gbps. The  
four low speed control signals are 5 V tolerant bidirectional  
lines that can carry configuration signals, HDCP encryption,  
and other information, depending upon the specific  
application.  
50  
50Ω  
IP_xx  
IN_xx  
CABLE  
EQ  
AVEE  
Figure 25. High Speed Input Simplified Schematic  
OUTPUT CHANNELS  
Each high speed output differential pair is terminated to the  
3.3 V VTTO power supply through two single-ended 50 Ω  
on-chip resistors (see Figure 26). This output termination is  
user-selectable; all the output terminations can be turned on  
or off by programming the TX_PTO bit of the transmitter  
settings register.  
All four high speed TMDS channels in a given link are identical;  
that is, the pixel clock can be run on any of the four TMDS  
channels. Transmit and receive channel compensation is  
provided for the high speed channels where the user can  
(manually) select among a number of fixed settings.  
VTTO  
50  
50Ω  
The AD8196 has I2C serial programming with two user pro-  
grammable I2C slave addresses. The I2C slave address of the  
AD8196 is 0b100100X. The least significant bit, represented by  
X in the address, is set by tying the I2C_ADDR pin to either  
3.3 V (for the value, X = 1) or to 0 V (for X = 0).  
OPx  
ONx  
DISABLE  
AVEE  
I
OUT  
INPUT CHANNELS  
Figure 26. High Speed Output Simplified Schematic  
Each high speed input differential pair terminates to the  
3.3 V VTTI power supply through a pair of single-ended 50 Ω  
on-chip resistors, as shown in Figure 25. The input terminations  
can be optionally disconnected for approximately 100 ms following  
a source switch. The user can program which of the eight high  
speed input channels employs this feature by selectively  
programming the associated RX_PT bits in the input  
termination pulse register. Additionally, all the input  
terminations can be disconnected by programming the RX_TO  
bit in the receiver settings register. By default, the input  
termination is enabled.  
The output termination resistors of the AD8196 back-terminate  
the output TMDS transmission lines. These back-terminations,  
as recommended in the HDMI 1.3 specification, act to absorb  
reflections from impedance discontinuities on the output traces,  
improving the signal integrity of the output traces and adding  
flexibility to how the output traces can be routed. For example,  
interlayer vias can be used to route the AD8196 TMDS outputs  
on multiple layers of the PCB without severely degrading the  
quality of the output signal.  
The AD8196 output has a disable feature that places the outputs  
in a tristate mode. This mode is enabled by programming the  
HS_EN bit of the high speed device modes register. Larger wire-  
ORed arrays can be constructed using the AD8196 in this  
mode.  
The input equalizer can be manually configured to provide two  
different levels of high frequency boost: 6 dB or 12 dB. The user  
can individually control the equalization level of the eight high  
speed input channels by selectively programming the associated  
RX_EQ bits in the receive equalizer register. No specific cable  
length is suggested for a particular equalization setting because  
cable performance varies widely between manufacturers;  
however, in general, the equalization of the AD8196 can be set  
to 12 dB without degrading the signal integrity, even for short  
input cables. At the 12 dB setting, the AD8196 can equalize  
more than 20 meters of 24 AWG cable at data rates of 2.25Gbps.  
The AD8196 requires output termination resistors when the  
high speed outputs are enabled. Termination can be internal  
and/or external. The internal terminations of the AD8196 are  
enabled by programming the TX_PTO bit of the transmitter  
settings register (the default upon reset). External terminations  
can be provided either by on-board resistors or by the input  
termination resistors of an HDMI/DVI receiver. If both the  
internal terminations are enabled and external terminations are  
present, set the output current level to 20 mA by programming  
PrA | Page 12 of 24  
 
 
 
Preliminary Data Sheet  
AD8196  
the TX_OCL bit of the transmitter settings register (the default  
upon reset). If only external terminations are provided (if the  
internal terminations are disabled), set the output current level  
to 10 mA by programming the TX_OCL bit of the transmitter  
settings register. The high speed outputs must be disabled if  
there are no output termination resistors present in the system.  
pins are in a high impedance state. A scenario that illustrates  
this requirement is one where the auxiliary multiplexer is used  
to switch the display data channel (DDC) bus. In some applica-  
tions, additional devices can be connected to the DDC bus  
(such as an EEPROM with EDID information) upstream of the  
AD8196. Extended display identification data (EDID) is a VESA  
standard-defined data format for conveying display configuration  
information to sources to optimize display use. EDID devices  
may need to be available via the DDC bus, regardless of the  
state of the AD8196 and any downstream circuit. For this  
configuration, the auxiliary inputs of the powered down  
AD8196 need to be in a high impedance state to avoid pulling  
down on the DDC lines and preventing these other devices  
from using the bus.  
The output pre-emphasis can be manually configured to provide  
one of four different levels of high frequency boost. The specific  
boost level is selected by programming the TX_PE bits of the  
transmitter settings register. No specific cable length is suggested  
for a particular pre-emphasis setting because cable performance  
varies widely between manufacturers.  
SWITCHING MODE  
The AD8196 behaves like a 2:1 HDMI/DVI link multiplexer by  
routing groups of four TMDS input channels to the four  
channel output. In this mode, the user selects the group of high  
speed source signals (A or B) that is routed to the output by  
programming the HS_CH bit of the high speeds modes register  
as shown in Table 7. The group of low speed auxiliary source  
signals (AUX_A or AUX_B) that is routed to the common  
output is separately set by programming the AUX_CH bit of the  
auxiliary device register as shown in Table 9.  
When the AD8196 is powered from a simple resistor network,  
as shown in Figure 28, it uses the 5 V supply that is required  
from any HDMI/DVI source to guarantee high impedance of  
the auxiliary multiplexer pins. The AMUXVCC supply does not  
draw any static current; therefore, it is recommended that the  
resistor network tap the 5 V supplies as close to the connectors  
as possible to avoid any additional voltage drop.  
This precaution does not need to be taken if the DDC  
peripheral circuitry is connected to the bus downstream of  
the AD8196.  
AUXILIARY LINES SWITCHING  
The auxiliary (low speed) lines have no amplification. They are  
routed using a passive switch that is bandwidth compatible with  
standard speed I2C. The schematic equivalent for this passive  
connection is shown in Figure 27.  
R
AUX  
AUX_A0  
½C  
AUX_COM0  
½C  
AUX  
AUX  
Figure 27. Auxiliary Channel Simplified Schematic  
Showing AUX_A0 to AUX_COM0 Routing  
When turning off the AD8196, care needs to be taken with  
the AMUXVCC supply to ensure that the auxiliary multiplexer  
Figure 28. Suggested AMUXVCC Power Scheme  
PrA | Page 13 of 24  
 
 
 
AD8196  
Preliminary Technical Data  
SERIAL CONTROL INTERFACE  
RESET  
6. Wait for the AD8196 to acknowledge the request.  
On initial power-up, or at any point in operation, the AD8196  
register set can be restored to the default values by pulling the  
7. Send the data (eight bits) to be written to the register  
whose address was set in Step 5. This transfer should be  
MSB first.  
RESET  
pin to low according to the specification in Table 1.  
RESET  
During normal operation, however, the  
pin must be  
8. Wait for the AD8196 to acknowledge the request.  
9. Do one of the following:  
RESET  
pulled up to 3.3 V. Pulling the  
pin to low sets the  
HS_CH register to 0 (Input A) and incurs the associated  
switching delay before the input can be switched to Input B,  
regardless of the previous state of the AD8196.  
a. Send a stop condition (while holding the I2C_SCL  
line high, pull the I2C_SDA line high) and release  
control of the bus to end the transaction (shown in  
Figure 29).  
WRITE PROCEDURE  
To write data to the AD8196 register set, an I2C master (such as  
a microcontroller) needs to send the appropriate control signals  
to the AD8196 slave device. The signals are controlled by the  
I2C master unless otherwise specified. For a diagram of the  
procedure, see Figure 29. The steps for a write procedure are as  
follows:  
b. Send a repeated start condition (while holding the  
I2C_SCL line high, pull the I2C_SDA line low) and  
continue with Step 2 in this procedure to perform  
another write.  
c. Send a repeated start condition (while holding the  
I2C_SCL line high, pull the I2C_SDA line low) and  
continue with Step 2 of the read procedure (in the  
Read Procedure section) to perform a read from  
another address.  
1. Send a start condition (while holding the I2C_SCL line  
high, pull the I2C_SDA line low).  
2. Send the AD8196 part address (seven bits). The upper six  
bits of the AD8196 part address are the static value  
[100100] and the LSB is set by Input Pin I2C_ADDR. This  
transfer should be MSB first.  
d. Send a repeated start condition (while holding the  
I2C_SCL line high, pull the I2C_SDA line low) and  
continue with Step 8 of the read procedure (in the  
Read Procedure section) to perform a read from the  
same address set in Step 5.  
3. Send the write indicator bit (0).  
4. Wait for the AD8196 to acknowledge the request.  
5. Send the register address (eight bits) to which data is to be  
written. This transfer should be MSB first.  
*
I2C_SCL  
R/W  
GENERAL CASE  
START  
FIXED ADDR PART  
REGISTER ADDR  
DATA  
STOP  
I2C_SDA  
ADDR  
ACK  
ACK  
ACK  
EXAMPLE  
I2C_SDA  
1
2
3
4
5
6
7
8
9
*THE SWITCHING/UPDATE DELAY BEGINS AT THE FALLING EDGE OF THE  
LAST DATA BIT; FOR EXAMPLE, THE FALLING EDGE JUST BEFORE STEP 8.  
Figure 29. I2C Write Procedure  
PrA | Page 14 of 24  
 
 
 
Preliminary Data Sheet  
AD8196  
I2C_SCL  
R/W  
R/W  
GENERAL CASE  
START  
FIXED PART ADDR  
REGISTER ADDR  
SR  
FIXED PART ADDR  
DATA  
STOP  
I2C_SDA  
ADDR ACK  
ACK  
ADDR ACK  
ACK  
EXAMPLE  
I2C_SDA  
1
2
3
4
5
6
7
8
9
10 11  
12  
13  
Figure 30. I2C Read Procedure  
13. Do one of the following:  
READ PROCEDURE  
To read data from the AD8196 register set, an I2C master (such  
as a microcontroller) needs to send the appropriate control  
signals to the AD8196 slave device. The signals are controlled  
by the I2C master unless otherwise specified. For a diagram of  
the procedure, see Figure 30. The steps for a read procedure are  
as follows:  
a. Send a stop condition (while holding the I2C_SCL  
line high, pull the SDA line high) and release control  
of the bus to end the transaction (shown in Figure 30).  
b. Send a repeated start condition (while holding the  
I2C_SCL line high, pull the I2C_SDA line low) and  
continue with Step 2 of the write procedure (see the  
previous Write Procedure section) to perform a write.  
1. Send a start condition (while holding the I2C_SCL line  
high, pull the I2C_SDA line low).  
c. Send a repeated start condition (while holding the  
I2C_SCL line high, pull the I2C_SDA line low) and  
continue with Step 2 of this procedure to perform a  
read from another address.  
2. Send the AD8196 part address (seven bits). The upper six  
bits of the AD8196 part address are the static value  
[100100] and the LSB is set by Input Pin I2C_ADDR. This  
transfer should be MSB first.  
d. Send a repeated start condition (while holding the  
I2C_SCL line high, pull the I2C_SDA line low) and  
continue with Step 8 of this procedure to perform a  
read from the same address.  
3. Send the write indicator bit (0).  
4. Wait for the AD8196 to acknowledge the request.  
5. Send the register address (eight bits) from which data is to  
be read. This transfer should be MSB first.  
SWITCHING/UPDATE DELAY  
There is a delay between when a user writes to the configura-  
tion registers of the AD8196 and when that state change takes  
physical effect. This update delay begins at the falling edge of  
I2C_SCL for the last data bit transferred, as shown in Figure 29.  
This update delay is register specific and the times are specified  
in Table 1.  
6. Wait for the AD8196 to acknowledge the request.  
7. Send a repeated start condition (Sr) by holding the  
I2C_SCL line high and pulling the I2C_SDA line low.  
8. Resend the AD8196 part address (seven bits) from Step 2.  
The upper six bits of the AD8196 part address compose the  
static value [100100]. The LSB is set by Input Pin I2C_ADDR.  
This transfer should be MSB first.  
During a delay window, new values can be written to the  
configuration registers but the AD8196 does not physically  
update until the end of that registers delay window. Writing  
new values during the delay window does not reset the window;  
new values supersede the previously written values. At the end  
of the delay window, the AD8196 physically assumes the state  
indicated by the last set of values written to the configuration  
registers. If the configuration registers are written after the delay  
window ends, the AD8196 immediately updates and a new  
delay window begins.  
9. Send the read indicator bit (1).  
10. Wait for the AD8196 to acknowledge the request.  
11. The AD8196 serially transfers the data (eight bits) held in  
the register indicated by the address set in Step 5. This data  
is sent MSB first.  
12. Acknowledge the data from the AD8196.  
PrA | Page 15 of 24  
 
 
 
AD8196  
Preliminary Technical Data  
CONFIGURATION REGISTERS  
The serial interface configuration registers can be read and written using the I2C serial interface, Pin I2C_SDA, and Pin I2C_SCL.  
The LSB of the AD8196 I2C part address is set by tying Pin I2C_ADDR to 3.3 V (I2C_ADDR = 1) or 0 V (I2C_ADDR = 0).  
Table 5. Register Map  
Name  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
Addr. Default  
High Speed  
Device  
High speed  
switch enable  
High speed  
source select  
0x00  
0x40  
Modes  
HS_EN  
HS_CH  
Auxiliary  
Device  
Modes  
Auxiliary  
switch enable  
Auxiliary  
switch  
source select  
0x01  
0x40  
AUX_EN  
AUX_CH  
Receiver  
Settings  
High speed  
input  
termination  
select  
0x10  
0x11  
0x01  
0x00  
RX_TO  
Input  
Input termination pulse-on-source-switch select (disconnect termination for a short period of time)  
Termination  
Pulse  
RX_PT[7] RX_PT[6]  
RX_PT[5] RX_PT[4] RX_PT[3] RX_PT[2] RX_PT[1]  
RX_PT [0]  
Receive  
Equalizer  
Input equalization level select  
0x13  
0x20  
0x00  
0x03  
RX_EQ[7] RX_EQ[6]  
RX_EQ[5] RX_EQ[4] RX_EQ[3] RX_EQ[2] RX_EQ[1]  
RX_EQ[0]  
Transmitter  
Settings  
High speed output  
pre-emphasis level  
select  
High speed High speed  
output output  
termination current level  
select  
select  
TX_PE[1] TX_PE[0] TX_PTO  
TX_OCL  
AUXILIARY DEVICE MODES REGISTER  
HIGH SPEED DEVICE MODES REGISTER  
AUX_EN: Auxiliary (Low Speed) Switch Enable Bit  
Table 8. AUX_EN Description  
HS_EN: High Speed (TMDS) Switch Enable Bit  
Table 6. HS_EN Description  
AUX_EN Description  
HS_EN Description  
0
Auxiliary switch off, no low speed input/output to  
low speed common input/output connection  
Auxiliary switch on  
0
1
High speed channels off, low power/standby mode  
High speed channels on  
1
HS_CH: High Speed (TMDS) Source Select Bit  
Table 7. HS_CH Mapping  
AUX_CH: Auxiliary (Low Speed) Switch Source Select Bit  
Table 9. AUX_CH Mapping  
HS_CH O[3:0]  
Description  
AUX_CH AUX_COM[3:0]  
Description  
0
1
A[3:0]  
B[3:0]  
High speed Source A switched to output  
High speed Source B switched to output  
0
AUX_A[3:0]  
Auxiliary Source A switched to  
output  
1
AUX_B[3:0]  
Auxiliary Source B switched to  
output  
PrA | Page 16 of 24  
 
 
 
Preliminary Data Sheet  
AD8196  
RECEIVER SETTINGS REGISTER  
RECEIVE EQUALIZER REGISTER  
RX_TO: High Speed (TMDS) Input Termination On/Off  
Select Bit  
Table 10. RX_TO Description  
RX_EQ[X]: High Speed (TMDS) Input X Equalization Level  
Select Bit  
Table 13. RX_EQ[X] Description  
RX_TO  
Description  
RX_EQ[X]  
Description  
0
1
Input termination off  
0
1
Low equalization (6 dB)  
High equalization (12 dB)  
Input termination on (can be pulsed on and off  
when source is switched, according to settings in  
the input termination pulse register)  
Table 14. RX_EQ[X] Mapping  
RX_EQ[X]  
Corresponding Input TMDS Channel  
Bit 0  
Bit 1  
Bit 2  
Bit 3  
Bit 4  
Bit 5  
Bit 6  
Bit 7  
A0  
A1  
A2  
A3  
B3  
B2  
B1  
B0  
INPUT TERMINATION PULSE REGISTER  
RX_PT[X]: High Speed (TMDS) Input Termination X  
Pulse-On-Source Switch Select Bit  
Table 11. RX_PT[X] Description  
RX_PT[X] Description  
0
Input termination for TMDS Channel X always  
connected when source is switched  
1
Input termination for TMDS Channel X  
disconnected for approximately 100 ms when  
source is switched  
TRANSMITTER SETTINGS REGISTER  
TX_PE[1:0]: High Speed (TMDS) Output Pre-Emphasis  
Level Select Bus (All TMDS Channels)  
Table 15. TX_PE[1:0] Description  
Table 12. RX_PT[X] Mapping  
RX_PT[X] Corresponding Input TMDS Channel  
Bit 0  
Bit 1  
Bit 2  
Bit 3  
Bit 4  
Bit 5  
Bit 6  
Bit 7  
A0  
A1  
A2  
A3  
B3  
B2  
B1  
B0  
TX_PE[1:0]  
Description  
00  
01  
10  
11  
No pre-emphasis (0 dB)  
Low pre-emphasis (2 dB)  
Medium pre-emphasis (4 dB)  
High pre-emphasis (6 dB)  
X_PTO: High Speed (TMDS) Output Termination On/Off  
Select Bit (All Channels)  
Table 16. TX_PTO Description  
TX_PTO  
Description  
0
1
Output termination off  
Output termination on  
TX_OCL: High Speed (TMDS) Output Current Level Select  
Bit (All Channels)  
Table 17. TX_OCL Description  
TX_OCL  
Description  
0
1
Output current set to 10 mA  
Output current set to 20 mA  
PrA | Page 17 of 24  
 
AD8196  
Preliminary Technical Data  
APPLICATION NOTES  
Figure 31. Evaluation Board Layout of the TMDS Traces  
allows the AD8196 to precompensate when driving long PCB  
traces or output cables. The net effect of the input equalization  
and output pre-emphasis of the AD8196 is that the AD8196 can  
compensate for the signal degradation of both input and output  
cables; it acts to reopen a closed input data eye and transmit a  
full-swing HDMI signal to an end receiver. More information  
on the specific performance metrics of the AD8196 can be  
found in the Typical Performance Characteristics section.  
The AD8196 is an HDMI/DVI switch featuring equalized  
TMDS inputs and pre-emphasized TMDS outputs. It is in-  
tended for use as a 2:1 switch in systems with long cable runs  
on both the input and/or the output, and is fully HDMI 1.3  
receive compliant.  
PINOUT  
The AD8196 was designed to have an HDMI/DVI receiver  
pinout at its input and a transmitter pinout at its output. This  
makes the AD8196 ideal for use in AVR-type applications  
where a designer routes both the inputs and the outputs directly  
to HDMI/DVI connectors as shown in Figure 31. When the  
AD8196 is used in receiver-type applications, it is necessary to  
change the ordering of the output pins on the PCB to match up  
with the on-board receiver.  
The AD8196 also provides a distinct advantage in receive-type  
applications because it is a fully buffered HDMI/DVI switch.  
Although inverting the output pin order of the AD8196 on the  
PCB requires a designer to place vias in the high speed signal  
path, the AD8196 fully buffers and electrically decouples the  
outputs from the inputs. Therefore, the effects of the vias placed  
on the output signal lines are not seen at the input of the AD8196.  
The programmable output terminations also improve signal  
quality at the output of the AD8196. The PCB designer, there-  
fore, has significantly improved flexibility in the placement and  
routing of the output signal path with the AD8196 over other  
solutions.  
One advantage of the AD8196 in an AVR-type application is  
that all of the high speed signals can be routed on one side (the  
topside) of the board, as shown in Figure 31. In addition to  
12 dB of input equalization, the AD8196 provides up to 6 dB of  
output pre-emphasis that boosts the output TMDS signals and  
PrA | Page 18 of 24  
 
 
Preliminary Data Sheet  
AD8196  
designed with a controlled differential impedance of 100 Ω. The  
AD8196 provides single-ended 50 Ω terminations on-chip for  
both its inputs and outputs, and both the input and output  
terminations can be enabled or disabled through the serial  
interface. Transmitter termination is not required by the HDMI  
1.3 standard but its inclusion improves the overall system signal  
integrity.  
CABLE LENGTHS AND EQUALIZATION  
The AD8196 offers two levels of programmable equalization  
for the high speed inputs: 6 dB and 12 dB. The equalizer of  
the AD8196 supports video data rates of up to 2.25 Gbps, and  
as shown in Figure 14, it can equalize more than 20 meters of 24  
AWG HDMI cable at 2.25Gbps, which corresponds to the video  
format, 1080p with deep color.  
The audiovisual (AV) data carried on these high speed channels  
is encoded by a technique called transition minimized differ-  
ential signaling (TMDS) and in the case of HDMI, is also encrypted  
according to the high bandwidth digital copy protection (HDCP)  
standard.  
The length of cable that can be used in a typical HDMI/DVI  
application depends on a large number of factors including:  
Cable quality: the quality of the cable in terms of conductor  
wire gauge and shielding. Thicker conductors have lower  
signal degradation per unit length.  
The second group of signals consists of low speed auxiliary  
control signals used for communication between a source and a  
sink. Depending upon the application, these signals can include  
the DDC bus (this is an I2C bus used to send EDID information  
and HDCP encryption keys between the source and the sink),  
the consumer electronics control (CEC) line, and the hot plug  
detect (HPD) line. These auxiliary signals are bidirectional, low  
speed, and transferred over a single-ended transmission line  
that does not need to have controlled impedance. The primary  
concern with laying out the auxiliary lines is ensuring that they  
conform to the I2C bus standard and do not have excessive  
capacitive loading.  
Data rate: the data rate being sent over the cable. The signal  
degradation of HDMI cables increases with data rate.  
Edge rates: the edge rates of the source input. Slower input  
edges result in more significant data eye closure at the end  
of a cable.  
Receiver sensitivity: the sensitivity of the terminating  
receiver.  
As such, specific cable types and lengths are not recommended  
for use with a particular equalizer setting. In nearly all applica-  
tions, the AD8196 equalization level can be set to high, or 12 dB,  
for all input cable configurations at all data rates, without  
degrading the signal integrity.  
TMDS Signals  
In the HDMI/DVI standard, four differential pairs carry the  
TMDS signals. In DVI, three of these pairs are dedicated to  
carrying RGB video and sync data. For HDMI, audio data is  
interleaved with the video data; the DVI standard does  
not incorporate audio information. The fourth high speed  
differential pair is used for the AV data-word clock, and runs  
at one-tenth the speed of the TMDS data channels.  
THE AD8196 AS A SINGLE-CHANNEL BUFFER  
The AD8196 can be used as a single-channel TMDS buffer  
without the need for any external I2C control. In its default  
configuration, the AD8196 connects both the high speed and  
low speed channels of Input A to their respective outputs, sets  
the input equalization level to 6 dB, the output pre-emphasis  
level to 0 dB, enables both the output and input terminations,  
and provides a fully functioning HDMI link with TMDS  
buffering.  
The four high speed channels of the AD8196 are identical.  
No concession was made to lower the bandwidth of the fourth  
channel for the pixel clock, so any channel can be used for any  
TMDS signal. The user chooses which signal is routed over  
which channel. Additionally, the TMDS channels are symmetrical;  
therefore, the p and n of a given differential pair are inter-  
changeable, provided the inversion is consistent across all inputs  
and outputs of the AD8196. However, the routing between  
inputs and outputs through the AD8196 is fixed. For example,  
Output Channel 0 always switches between Input A0 and  
Input B0, and so forth.  
RESET  
The AD8196 enters this default state whenever the  
pin  
is pulled to low in accordance with the specification in Table 1.  
PCB LAYOUT GUIDELINES  
The AD8196 is used to switch two distinctly different types of  
signals, both of which are required for HDMI and DVI video.  
These signal groups require different treatment when laying out  
a PC board.  
The AD8196 buffers the TMDS signals and the input traces can  
be considered electrically independent of the output traces. In  
most applications, the quality of the signal on the input TMDS  
traces are more sensitive to the PCB layout. Regardless of the  
data being carried on a specific TMDS channel, or whether the  
TMDS line is at the input or the output of the AD8196, all four  
high speed signals should be routed on a PCB in accordance  
with the same RF layout guidelines.  
The first group of signals carries the audiovisual (AV) data.  
HDMI/DVI video signals are differential, unidirectional, and  
high speed (up to 2.25 Gbps). The channels that carry the video  
data over the PCB must be controlled impedance, terminated at  
the receiver, and capable of operating at the maximum specified  
system data rate. It is especially important to note that the  
differential traces that carry the TMDS signals should be  
PrA | Page 19 of 24  
 
AD8196  
Preliminary Technical Data  
Layout for the TMDS Signals  
Controlling the Characteristic Impedance of a TMDS  
Differential Pair  
The TMDS differential pairs can either be microstrip traces,  
routed on the outer layer of a board, or stripline traces, routed  
on an internal layer of the board. If microstrip traces are used,  
there should be a continuous reference plane on the PCB layer  
directly below the traces. If stripline traces are used, they must  
be sandwiched between two continuous reference planes in the  
PCB stack-up. Additionally, the p and n of each differential pair  
must have a controlled differential impedance of 100 Ω. The  
characteristic impedance of a differential pair is a function of  
several variables including the trace width, the distance separating  
the two traces, the spacing between the traces and the reference  
plane, and the dielectric constant of the PC board binder material.  
Interlayer vias introduce impedance discontinuities that can  
cause reflections and jitter on the signal path, therefore, it is  
preferable to route the TMDS lines exclusively on one layer of the  
board, particularly for the input traces. Additionally, to prevent  
unwanted signal coupling and interference, route the TMDS  
signals away from other signals and noise sources on the PCB.  
The characteristic impedance of a differential pair depends on a  
number of variables including the trace width, the distance  
between the two traces, the height of the dielectric material  
between the trace and the reference plane below it, and the  
dielectric constant of the PCB binder material. To a lesser  
extent, the characteristic impedance also depends upon the  
trace thickness and the presence of solder mask. There are  
many combinations that can produce the correct characteristic  
impedance. It is generally required to work with the PC board  
fabricator to obtain a set of parameters to produce the desired  
results.  
One consideration is how to guarantee a differential pair with a  
differential impedance of 100 Ω over the entire length of the  
trace. One technique to accomplish this is to change the width  
of the traces in a differential pair based on how closely one trace  
is coupled to the other. When the two traces of a differential  
pair are close and strongly coupled, they should have a width  
that produces a 100 Ω differential impedance. When the traces  
split apart to go into a connector, for example, and are no longer  
so strongly coupled, the width of the traces should be increased  
to yield a differential impedance of 100 Ω in the new configuration.  
Both traces of a given differential pair must be equal in length  
to minimize intrapair skew. Maintaining the physical symmetry  
of a differential pair is integral to ensuring its signal integrity;  
excessive intrapair skew can introduce jitter through duty cycle  
distortion (DCD). The p and n of a given differential pair should  
always be routed together in order to establish the required 100 Ω  
differential impedance. Enough space should be left between  
the differential pairs of a given group so that the n of one pair  
does not couple to the p of another pair. For example, one tech-  
nique is to make the interpair distance 4 to 10 times wider than  
the intrapair spacing.  
Ground Current Return  
In some applications, it can be necessary to invert the output  
pin order of the AD8196. This requires a designer to route the  
TMDS traces on multiple layers of the PCB. When routing  
differential pairs on multiple layers, it is necessary to also re-  
route the corresponding reference plane in order to provide one  
continuous ground current return path for the differential  
signals. An example of this is illustrated in Figure 32.  
Any one group of four TMDS channels (Input A, Input B, or the  
output) should have closely matched trace lengths in order to  
minimize interpair skew. Severe interpair skew can cause the  
data on the four different channels of a group to arrive out of  
alignment with one another. A good practice is to match the  
trace lengths for a given group of four channels to within  
0.05 inches on FR4 material.  
Minimizing intra- and interpair skew becomes increasingly  
important as data rates increase. Any introduced error will  
constitute a correspondingly larger fraction of a bit period at  
higher data rates.  
While the AD8196 features input equalization and output pre-  
emphasis, the length of the TMDS traces should be minimized  
to reduce overall system signal degradation. Commonly used  
PC board material such as FR4 is lossy at high frequencies, so  
long traces on the circuit board increase signal attenuation,  
resulting in decreased signal swing and increased jitter through  
intersymbol interference (ISI).  
Figure 32. Example Routing of Reference Plane  
TMDS Terminations  
The AD8196 provides internal 50 Ω single-ended terminations  
for all of its high speed inputs and outputs. It is not necessary to  
PrA | Page 20 of 24  
 
Preliminary Data Sheet  
AD8196  
3W  
W
3W  
include external termination resistors for the TMDS differential  
pairs on the PCB.  
The output termination resistors of the AD8196 back-terminate  
the output TMDS transmission lines. These back-terminations  
act to absorb reflections from impedance discontinuities on the  
output traces, improving the signal integrity of the output traces  
and adding flexibility to how the output traces can be routed.  
For example, interlayer vias can be used to route the AD8196  
TMDS outputs on multiple layers of the PCB without severely  
degrading the quality of the output signal.  
SILKSCREEN  
LAYER 1: MICROSTRIP  
PCB DIELECTRIC  
LAYER 2: REFERENCE PLANE  
PCB DIELECTRIC  
LAYER 3: REFERENCE PLANE  
PCB DIELECTRIC  
LAYER 4: MICROSTRIP  
SILKSCREEN  
Auxiliary Control Signals  
There are four single-ended control signals associated with each  
source or sink in an HDMI/DVI application. These are hot plug  
detect (HPD), consumer electronics control (CEC), and two  
display data channel (DDC) lines. The two signals on the DDC  
bus are SDA and SCL (serial data and serial clock, respectively).  
These four signals can be switched through the auxiliary bus of  
the AD8196 and do not need to be routed with the same strict  
considerations as the high speed TMDS signals.  
REFERENCE LAYER  
RELIEVED UNDERNEATH  
MICROSTRIP  
Figure 33. Example Board Stackup  
HPD is a dc signal presented by a sink to a source to indicate  
that the source EDID is available for reading. The placement of  
this signal is not critical, but it should be routed as directly as  
possible.  
In general, it is sufficient to route each auxiliary signal as a  
single-ended trace. These signals are not sensitive to impedance  
discontinuities, do not require a reference plane, and can be  
routed on multiple layers of the PCB. However, it is best to  
follow strict layout practices whenever possible to prevent the  
PCB design from affecting the overall application. The specific  
routing of the HPD, CEC, and DDC lines depends upon the  
application in which the AD8196 is being used.  
When the AD8196 is powered up, one set of the auxiliary inputs  
is passively routed to the outputs. In this state, the AD8196  
looks like a 100 Ω resistor between the selected auxiliary inputs  
and the corresponding outputs as illustrated in Figure 27. The  
AD8196 does not buffer the auxiliary signals, therefore, the  
input traces, output traces, and the connection through the  
AD8196 all must be considered when designing a PCB to meet  
HDMI/DVI specifications. The unselected auxiliary inputs of the  
AD8196 are placed into a high impedance mode when the device  
is powered up. To ensure that all of the auxiliary inputs of the  
AD8196 are in a high impedance mode when the device is  
powered off, it is necessary to power the AMUXVCC supply as  
illustrated in Figure 28.  
For example, the maximum speed of signals present on the  
auxiliary lines are 100 kHz I2C data on the DDC lines, therefore,  
any layout that enables 100 kHz I2C to be passed over the DDC  
bus should suffice. The HDMI 1.3 specification, however, places  
a strict 50 pF limit on the amount of capacitance that can be  
measured on either SDA or SCL at the HDMI input connector.  
This 50 pF limit includes the HDMI connector, the PCB, and  
whatever capacitance is seen at the input of the AD8196, or an  
equivalent receiver. There is a similar limit of 100 pF of input  
capacitance for the CEC line.  
In contrast to the auxiliary signals, the AD8196 buffers the  
TMDS signals, allowing a PCB designer to layout the TMDS  
inputs independently of the outputs.  
The parasitic capacitance of traces on a PCB increases with  
trace length. To help ensure that a design satisfies the HDMI  
specification, the length of the CEC and DDC lines on the PCB  
should be made as short as possible. Additionally, if there is a  
reference plane in the layer adjacent to the auxiliary traces in  
the PCB stackup, relieving or clearing out this reference plane  
immediately under the auxiliary traces significantly decreases  
the amount of parasitic trace capacitance. An example of the  
board stackup is shown in Figure 33.  
PrA | Page 21 of 24  
 
AD8196  
Preliminary Technical Data  
RECOMMENDED  
Power Supplies  
The AD8196 has five separate power supplies referenced to  
two separate grounds. The supply/ground pairs are:  
EXTRA ADDED INDUCTANCE  
AVCC/AVEE  
VTTI/AVEE  
VTTO/AVEE  
DVCC/DVEE  
NOT RECOMMENDED  
AMUXVCC/DVEE  
Figure 34. Recommended Pad Outline for Bypass Capacitors  
The AVCC/AVEE (3.3 V) and DVCC/DVEE (3.3 V) supplies  
power the core of the AD8196. The VTTI/AVEE supply (3.3 V)  
powers the input termination (see Figure 25). Similarly, the  
VTTO/AVEE supply (3.3 V) powers the output termination  
(see Figure 26). The AMUXVCC/DVEE supply (3.3 V to 5 V)  
powers the auxiliary multiplexer core and determines the  
maximum allowed voltage on the auxiliary lines. For example,  
if the DDC bus is using 5 V I2C, then AMUXVCC should be  
connected to +5 V relative to DVEE.  
In applications where the AD8196 is powered by a single 3.3 V  
supply, it is recommended to use two reference supply planes  
and bypass the 3.3 V reference plane to the ground reference  
plane with one 220 pF, one 1000 pF, two 0.01 μF, and one 4.7 μF  
capacitors. The capacitors should via down directly to the  
supply planes and be placed within a few centimeters of the  
AD8196. The AMUXVCC supply does not require additional  
bypassing. This scheme is illustrated in Figure 35.  
In a typical application, all pins labeled AVEE or DVEE should  
be connected directly to ground. All pins labeled AVCC,  
DVCC, VTTI, or VTTO should be connected to 3.3 V, and  
Pin AMUXVCC tied to 5 V. The supplies can also be powered  
individually, but care must be taken to ensure that each stage of  
the AD8196 is powered correctly.  
Power Supply Bypassing  
The AD8196 requires minimal supply bypassing. When  
powering the supplies individually, place a 0.01 μF capacitor  
between each 3.3 V supply pin (AVCC, DVCC, VTTI, and  
VTTO) and ground to filter out supply noise. Generally, bypass  
capacitors should be placed near the power pins and should  
connect directly to the relevant supplies (without long inter-  
vening traces). For example, to improve the parasitic inductance  
of the power supply decoupling capacitors, minimize the trace  
length between capacitor landing pads and the vias as shown in  
Figure 34.  
Figure 35. Example Placement of Power Supply Decoupling Capacitors  
Around the AD8196  
PrA | Page 22 of 24  
 
 
Preliminary Data Sheet  
OUTLINE DIMENSIONS  
AD8196  
0.30  
0.23  
0.18  
8.00  
BSC SQ  
0.60 MAX  
0.60 MAX  
PIN 1  
INDICATOR  
56  
43  
42  
1
PIN 1  
INDICATOR  
4.95  
4.80 SQ  
4.65  
TOP  
VIEW  
EXPOSED  
7.75  
BSC SQ  
PAD  
(BOTTOM VIEW)  
0.50  
0.40  
0.30  
14  
15  
29  
28  
0.30 MIN  
6.50  
REF  
0.80 MAX  
0.65 TYP  
1.00  
0.85  
0.80  
12° MAX  
0.05 MAX  
0.02 NOM  
COPLANARITY  
0.08  
SEATING  
PLANE  
0.50 BSC  
0.20 REF  
COMPLIANT TO JEDEC STANDARDS MO-220-VLLD-2  
Figure 36. 56-Lead Lead Frame Chip Scale Package [LFCSP_VQ]  
8 mm × 8 mm Body, Very Thin Quad  
(CP-56-3)  
Dimensions shown in millimeters  
ORDERING GUIDE  
Temperature  
Range  
Package  
Option  
Ordering  
Quantity  
Model  
Package Description  
AD8196ACPZ1  
AD8196ACPZ-R7  
AD8196ACPZ-RL  
AD8196-EVAL  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
56-Lead Lead Frame Chip Scale Package [LFCSP_VQ]  
CP-56-3  
56-Lead Lead Frame Chip Scale Package [LFCSP_VQ], Reel CP-56-3  
56-Lead Lead Frame Chip Scale Package [LFCSP_VQ], Reel CP-56-3  
Evaluation Kit  
750  
2500  
1 Z = Pb-free part.  
PrA | Page 23 of 24  
 
AD8196  
NOTES  
Preliminary Technical Data  
Purchase of licensed I2C components of Analog Devices or one of its sublicensed Associated Companies conveys a license for the purchaser under the Philips  
I2C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips.  
©2006 Analog Devices, Inc. All rights reserved. Trademarks and  
registered trademarks are the property of their respective owners.  
PR06470-0-12/06(PrA)  
PrA | Page 24 of 24  
 
 
 
 

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