AD9119-CBLTX-EBZ [ADI]
11-/14-Bit, 5.6 GSPS, RF Digital-to-Analog Converter; 11-位/ 14位, 5.6 GSPS , RF数位类比转换器型号: | AD9119-CBLTX-EBZ |
厂家: | ADI |
描述: | 11-/14-Bit, 5.6 GSPS, RF Digital-to-Analog Converter |
文件: | 总68页 (文件大小:2723K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
11-/14-Bit, 5.6 GSPS,
RF Digital-to-Analog Converter
Data Sheet
AD9119/AD9129
FEATURES
FUNCTIONAL BLOCK DIAGRAM
RESET
IRQ
I250U VREF
DAC update rate: up to 5.6 GSPS
Direct RF synthesis at 2.8 GSPS data rate
DC to 1.4 GHz in baseband mode
DC to 1.0 GHz in 2× interpolation mode
1.4 GHz to 4.2 GHz in Mix-Mode
AD9129
SDIO
SDO
CS
1.2V
SPI
SCLK
FRM_x
Bypassable 2× interpolation
Excellent dynamic performance
Supports DOCSIS 3.0 wideband ACLR/harmonic performance
8 QAM carriers: ACLR > 65 dBc
(FRAME/
PARITY)
MIX-
NORMAL MODE
BASEBAND
MODE
P0_D[13:0]P,
P0_D[13:0]N
IOUTP
IOUTN
Tx DAC
CORE
DLL
DCI_x
Industry-leading single/multicarrier IF or RF synthesis
4-carrier W-CDMA ACLR at 2457.6 MSPS
2×
f
f
f
OUT = 900 MHz, ACLR = 71 dBc (baseband mode)
OUT = 2100 MHz, ACLR = 68 dBc (Mix-Mode)
OUT = 2700 MHz, ACLR = 67 dBc (Mix-Mode)
P1_D[13:0]P,
P1_D[13:0]N
PLL
Dual-port LVDS and DHSTL data interface
Up to 1.4 GSPS operation
CLOCK
DISTRIBUTION
DCR
DCO_x
Source synchronous DDR clocking with parity bit
Low power: 1.0 W at 2.8 GSPS (1.3 W at 5.6 GSPS)
DACCLK_x
Figure 1.
APPLICATIONS
Broadband communications systems
CMTS/VOD
Wireless infrastructure: W-CDMA, LTE, point-to-point
Instrumentation, automatic test equipment (ATE)
Radars, jammers
GENERAL DESCRIPTION
The AD9119/AD9129 are high performance, 11-/14-bit RF digital-
to-analog converters (DACs) supporting data rates up to 2.8 GSPS.
The DAC core is based on a quad-switch architecture that enables
dual-edge clocking operation, effectively increasing the DAC
update rate to 5.6 GSPS when configured for Mix-Mode™ or 2×
interpolation. The high dynamic range and bandwidth enable
multicarrier generation up to 4.2 GHz.
The AD9119/AD9129 include several features that may further
simplify system integration. A dual-port, source synchronous
LVDS interface simplifies the data interface to a host FPGA/ASIC.
A differential frame/parity bit is also included to monitor the
integrity of the interface. On-chip delay locked loops (DLLs)
are used to optimize timing between different clock domains.
A serial peripheral interface (SPI) is used to configure the
AD9119/AD9129 and monitor the status of readback registers.
The AD9119/AD9129 is manufactured on a 0.18 µm CMOS
process and operates from +1.8 V and −1.5 V supplies. It is
supplied in a 160-ball chip scale package ball grid array.
In baseband mode, wide bandwidth capability combines with high
dynamic range to support from 1 to 158 contiguous carriers for
CATV infrastructure applications. A choice of two optional 2×
interpolation filters is available to simplify the postreconstruction
filter by effectively increasing the DAC update rate by a factor of 2.
In Mix-Mode operation, the AD9119/AD9129 can reconstruct
RF carriers in the second and third Nyquist zone while still
maintaining exceptional dynamic range up to 4.2 GHz. The
high performance NMOS DAC core features a quad-switch
architecture that enables industry-leading direct RF synthesis
performance with minimal loss in output power. The output
current can be programmed over a range of 9.5 mA to 34.4 mA.
PRODUCT HIGHLIGHTS
1. High dynamic range and signal reconstruction bandwidth
support RF signal synthesis of up to 4.2 GHz.
2. Dual-port interface with double data rate (DDR) LVDS
data receivers supports 2800 MSPS maximum conversion rate.
3. Manufactured on a CMOS process; a proprietary switching
technique enhances dynamic performance.
Rev. 0
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AD9119/AD9129
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Serial Peripheral Interface Pin Descriptions .......................... 36
MSB/LSB Transfers .................................................................... 37
Serial Port Configuration.......................................................... 37
Theory of Operation ...................................................................... 38
LVDS Data Port Interface.......................................................... 39
Digital Datapath Description ................................................... 42
Interrupt Requests...................................................................... 46
Interface Timing Validation.......................................................... 48
Sample Error Detection (SED) Operation.............................. 48
SED Example............................................................................... 48
Analog Interface Considerations.................................................. 49
Analog Modes of Operation ..................................................... 49
Clock Input.................................................................................. 50
PLL ............................................................................................... 50
Voltage Reference ....................................................................... 51
Analog Outputs .......................................................................... 51
Start-Up Sequence...................................................................... 54
Device Configuration Registers.................................................... 55
Device Configuration Register Map........................................ 55
Device Configuration Register Descriptions.......................... 56
Outline Dimensions....................................................................... 66
Ordering Guide .......................................................................... 66
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
DC Specifications ......................................................................... 3
LVDS Digital Specifications........................................................ 4
HSTL Digital Specifications........................................................ 4
Serial Port and CMOS Pin Specifications ................................. 5
AC Specifications.......................................................................... 6
Absolute Maximum Ratings............................................................ 7
Thermal Resistance ...................................................................... 7
ESD Caution.................................................................................. 7
Pin Configurations and Function Descriptions ........................... 8
Typical Performance Characteristics ........................................... 12
AD9119........................................................................................ 12
AD9129........................................................................................ 22
Terminology .................................................................................... 35
Serial Communications Port Overview....................................... 36
Serial Peripheral Interface (SPI)............................................... 36
General Operation of the SPI.................................................... 36
Instruction Mode (8-Bit Instruction)...................................... 36
REVISION HISTORY
1/13—Revision 0: Initial Version
Rev. 0 | Page 2 of 68
Data Sheet
AD9119/AD9129
SPECIFICATIONS
DC SPECIFICATIONS
VDDA = VDD = 1.8 V, VSSA = −1.5 V, IOUTFS = 33 mA, TA = −40°C to +85°C.
Table 1.
AD9119
AD9129
Parameter
Min
Typ
Max
Min
Typ
Max
Unit
RESOLUTION
11
14
Bits
ACCURACY
Integral Nonlinearity (INL)
Differential Nonlinearity (DNL)
ANALOG OUTPUTS
0.2
0.15
1.4
1.1
LSB
LSB
Gain Error (with Internal Reference)
Full-Scale Output Current Maximum
Full-Scale Output Current Minimum
Output Compliance Range
Output Impedance1
DAC CLOCK INPUT (DACCLK_P, DACCLK_N)
Differential Peak-to-Peak Voltage
Common-Mode Voltage
TEMPERATURE DRIFT
Gain
+2.5
34.2
9.4
+2.5
34.2
9.4
%
33.4
9.1
1.5
34.9
9.6
2.5
33.4
9.1
1.5
34.9
9.6
2.5
mA
mA
V
0.4
1
1.2
2
0.4
1
1.2
2
V
V
60
20
60
20
ppm/°C
ppm/°C
Reference Voltage
REFERENCE
Internal Reference Voltage
Output Resistance
1.0
5
1.0
5
V
kΩ
ANALOG SUPPLY VOLTAGES
VDDA
VSSA
1.70
−1.4
1.80
−1.5
1.90
−1.6
1.70
−1.4
1.80
−1.5
1.90
−1.6
V
V
DIGITAL SUPPLY VOLTAGES
VDD
1.70
1.8
1.8
1.9
1.90
2.0
1.70
1.8
1.8
1.9
1.90
2.0
V
V
FIR40 Enabled, DACCLK > 2600 MSPS
SUPPLY CURRENTS AND POWER DISSIPATION, 2.3 GSPS
(NORMAL MODE)
IVDDA
IVSSA
IDVDD
202
53
307
209
54
327
202
53
307
209
54
327
mA
mA
mA
Power Dissipation
Normal Mode
FIR25 Enabled
FIR40 Enabled
1.0
1.17
1.3
1.05
1.24
1.4
1.0
1.17
1.3
1.05
1.24
1.4
W
W
W
Reduced Power Mode, Power-Down Enabled
(Register 0x01 = 0xEF)
IVDDA
IVSSA
IVDD
7.6
6
0.4
7.6
6
0.4
mA
µA
mA
SUPPLY CURRENTS AND POWER DISSIPATION, 2.8 GSPS
(NORMAL MODE)
IVDDA
IVSSA
IDVDD
230
53
336
1.1
230
53
336
1.1
mA
mA
mA
W
Power Dissipation (Normal Mode)
1 For more information about output impedance, see the Output Stage Configuration section.
Rev. 0 | Page 3 of 68
AD9119/AD9129
Data Sheet
LVDS DIGITAL SPECIFICATIONS
VDDA = VDD = 1.8 V, VSSA = −1.5 V, IOUTFS = 33 mA, TA = −40°C to +85°C. LVDS drivers and receivers are compatible with the IEEE
Standard 1596.3-1996, unless otherwise noted.
Table 2.
Parameter
Symbol
Test Conditions/Comments
Min
Typ
Max
Unit
LVDS DATA INPUTS (P1_D[13:0]P, P1_D[13:0]N,
P0_D[13:0]P, P0_D[13:0]N)
Px_DxP = VIA, Px_DxN = VIB
Input Voltage Range
VIA, VIB
VIDTH
VIDTHH − VIDTHL
RIN
825
−100
1575 mV
+100 mV
mV
Input Differential Threshold
Input Differential Hysteresis
Receiver Differential Input Impedance
LVDS Input Rate
20
80
1400
120
Ω
MSPS
pF
Input Capacitance
1.2
LVDS CLOCK INPUTS (DCI_P, DCI_N)
Input Voltage Range
Input Differential Threshold
Input Differential Hysteresis
Receiver Differential Input Impedance
Maximum Clock Rate
DCI_P = VIA, DCI_N = VIB
VIA, VIB
VIDTH
VIDTHH − VIDTHL
RIN
825
−225
1575 mV
+225 mV
mV
20
80
700
120
Ω
MHz
LVDS CLOCK OUTPUTS (DCO_P, DCO_N)
DCO_P = VOA, DCO_N = VOB,
100 Ω termination
Output Voltage High
Output Voltage Low
Output Differential Voltage
Output Offset Voltage
Output Impedance, Single-Ended
RO Mismatch Between A and B
Change in |VOD| Between Setting 0 and Setting 1
Change in VOS Between Setting 0 and Setting 1
Output Current
VOA, VOB
VOA, VOB
|VOA|, |VOB|
VOS
RO
∆RO
1375 mV
mV
1025
Register 0x7C[7:6] = 01b (default) 200
1150
225
100
250
mV
1250 mV
80
120
10
Ω
%
|∆VOD|
∆VOS
25
25
mV
mV
Driver Shorted to Ground
Drivers Shorted Together
Power-Off Output Leakage
Maximum Clock Rate
ISA, ISB
ISAB
|IXA|, |IXB|
20
4
10
mA
mA
µA
700
MHz
HSTL DIGITAL SPECIFICATIONS
VDDA = VDD = 1.8 V, VSSA = −1.5 V, IOUTFS = 33 mA, TA = −40°C to +85°C. HSTL receiver levels are compatible with the EIA/JEDEC
JESD8-6 standard, unless otherwise noted.
Table 3.
Parameter
Symbol
Test Comments/Conditions
Min
Typ
Max
Unit
HSTL DATA INPUTS (P1_D[13:0]P, P1_D[13:0]N,
P0_D[13:0]P, P0_D[13:0]N)
Px_DxP = VIA, Px_DxN = VIB
Common-Mode Input Voltage Range
Differential Input Voltage
Receiver Differential Input Impedance
HSTL Input Rate
VIA, VIB
RIN
0.68
200
80
0.9
V
mV
Ω
MSPS
pF
120
1400
1.2
Input Capacitance
HSTL CLOCK INPUT (DCI_P, DCI_N)
Common-Mode Input Voltage Range
Differential Input Voltage
Receiver Differential Input Impedance
Maximum Clock Rate
DCI_P = VIA, DCI_N = VIB
VIA, VIB
RIN
0.68
450
80
0.9
mV
mV
Ω
120
700
MHz
Rev. 0 | Page 4 of 68
Data Sheet
AD9119/AD9129
SERIAL PORT AND CMOS PIN SPECIFICATIONS
VDDA = VDD = 1.8 V, VSSA = −1.5 V, IOUTFS = 33 mA, TA = −40°C to +85°C.
Table 4.
Parameter
Symbol
Test Comments/Conditions
Min
Typ
Max
Unit
WRITE OPERATION
SCLK Clock Rate
SCLK Clock High
See Figure 126
fSCLK, 1/tSCLK
20
MHz
ns
ns
ns
ns
tHIGH
tLOW
tDS
tDH
tS
20
20
10
5
10
5
SCLK Clock Low
SDIO to SCLK Setup Time
SCLK to SDIO Hold Time
CS to SCLK Setup Time
SCLK to CS Hold Time
ns
tH
ns
READ OPERATION
See Figure 127
SCLK Clock Rate
SCLK Clock High
SCLK Clock Low
SDIO to SCLK Setup Time
SCLK to SDIO Hold Time
CS to SCLK Setup Time
SCLK to SDIO (or SDO) Data Valid Time
fSCLK, 1/tSCLK
20
10
MHz
ns
ns
ns
ns
tHIGH
tLOW
tDS
tDH
tS
20
20
10
5
10
ns
tDV
ns
CS to SDIO (or SDO) Output Valid to High-Z tEZ
INPUTS (SDI, SDIO, SCLK, CS)
2
Voltage In High
Voltage In Low
Current In High
VIH
VIL
IIH
1.2
1.8
0
V
V
µA
µA
0.4
+75
Current In Low
IIL
−150
OUTPUTS (SDIO, SYNC)
Voltage Out High
Voltage Out Low
Current Out High
Current Out Low
VOH
VOL
IOH
IOL
1.3
0
2.0
0.3
V
V
mA
mA
4
4
Rev. 0 | Page 5 of 68
AD9119/AD9129
Data Sheet
AC SPECIFICATIONS
VDDA = VDD = 1.8 V, VSSA = −1.5 V, IOUTFS = 33 mA, TA = −40°C to +85°C, unless otherwise noted.
Table 5.
AD9119
Typ
AD9129
Typ
Parameter
Min
Max
Min
Max
Unit
DYNAMIC PERFORMANCE
DAC Update Rate (DACCLK_x Inputs)
Normal Mode, FIR25 Enabled, or FIR40 Enabled with VDD = 1.9 V
FIR40 Filter Enabled, VDD = 1.8 V
Adjusted DAC Update Rate1
Output Settling Time to 0.1%
SPURIOUS-FREE DYNAMIC RANGE (SFDR)
fDAC = 2600 MSPS
1400
1400
1400
2800 1400
2600 1400
2800 1400
2800
2600
2800
MSPS
MSPS
MSPS
ns
13
13
fOUT = 100 MHz
fOUT = 350 MHz
fOUT = 550 MHz
fOUT = 950 MHz
−76
−65
−63
−55
−76
−65
−64
−55
dBc
dBc
dBc
dBc
TWO-TONE INTERMODULATION DISTORTION (IMD)
fDAC = 2600 MSPS, fOUT2 = fOUT1 + 1.4 MHz
fOUT = 100 MHz
−82
−78
−73
−67
−86
−85
−83
−76
dBc
dBc
dBc
dBc
fOUT = 350 MHz
fOUT = 550 MHz
fOUT = 950 MHz
NOISE SPECTRAL DENSITY (NSD)
Single Tone, fDAC = 2800 MSPS
fOUT = 100 MHz
−157
−157
−155
−154
−166
−162
−158
−157
dBm/Hz
dBm/Hz
dBm/Hz
dBm/Hz
fOUT = 350MHz
fOUT = 550 MHz
fOUT = 850 MHz
DOCSIS ACLR PERFORMANCE (50 MHz to 1000 MHz) at ≥6 MHz OFFSET
fDAC = 2782 MSPS
8 Contiguous Carriers
16 Contiguous Carriers
32 Contiguous Carriers
64
62
60
64
63
61
dBc
dBc
dBc
W-CDMA ACLR (SINGLE CARRIER)
Adjacent Channel
fDAC = 2605.056 MSPS, fOUT = 750 MHz
fDAC= 2605.056 MSPS, fOUT = 950 MHz
fDAC = 2605.056 MSPS, fOUT = 1700 MHz (Mix-Mode)
fDAC = 2605.056 MSPS, fOUT = 2100 MHz (Mix-Mode)
Alternate Adjacent Channel
fDAC = 2605.056 MSPS, fOUT = 750 MHz
fDAC = 2605.056 MSPS, fOUT = 950 MHz
fDAC = 2605.056 MSPS, fOUT = 1700 MHz (Mix-Mode)
fDAC = 2605.056 MSPS, fOUT = 2100 MHz (Mix-Mode)
75
74
73.5
69
75
74
73.5
69
dBc
dBc
dBc
dBc
80
78
74
72
80
78
74
72
dBc
dBc
dBc
dBc
1 Adjusted DAC update rate is calculated as fDAC divided by the minimum required interpolation factor. For the AD9119/AD9129, the minimum interpolation factor is 1.
Thus, with fDAC = 2800 MSPS, fDAC adjusted = 2800 MSPS.
Rev. 0 | Page 6 of 68
Data Sheet
AD9119/AD9129
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 6.
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Parameter
Rating
DCI, DCO to VSS
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
VSSA − 0.3V to +2.5V
VSSA − 0.3 V to VDDA + 0.3 V
−0.3 V to VDD + 0.3 V
LVDS Data Inputs to VSS
IOUTP, IOUTN to VSSA
I250U, VREF to VSSA
IRQ, CS, SCLK, SDO, SDIO, RESET,
SYNC to VSS
Table 7. Thermal Resistance
Package Type
θJA
θJC
Unit
°C/W1
160-Ball CSP_BGA
31.2
7.0
1 With no airflow movement.
Junction Temperature
Operating Temperature Range
Storage Temperature Range
150°C
−40°C to +85°C
−65°C to +150°C
ESD CAUTION
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rev. 0 | Page 7 of 68
AD9119/AD9129
Data Sheet
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
I250U
VREF
VSSA
VSSA
VDDA SH
IOUTP
IOUTN
VDDA SH
VDDA
VDDA
VDDA
VSSC
VSSC
VSSC
A
B
C
D
E
F
VDDA
DACCLK_N
DACCLK_P
VDDA
VDDA
VDDA
VDDA
VDDA
VSSA
VDDA
VDDA
VSSC
VSSA
VSSA
VDDA
VSSC
VSSA
VSSA
VSSC
VDDA SH
VSSA
VDDA SH
VDDA
VDDA
VDDA
VSSC
VDDA
VDDA
VSSC
VDDA
VDDA
VSSC
VDDA
VSSC
VSSC
VSS
VSSC
VSSC
VSS
VSSC
VSS
VSS
VSS
SYNC
VSS
VSS
VSS
VSSC
VDDA
VSS
VSSC
VSSC
VSSC
VSSC
VSS
VSS
VSS
VSS
VSS
VSS
IRQ
VSS
VSS
VSSC
VSS
VSS
VDD
VDD
VDD
VDD
VDD
VDD
VDD
G
H
J
AD9119
RESET
SDIO
SCLK
NC
SDO
CS
VDD
DCI_P
NC
VDD
VDD
VDD
VDD
VDD
DCI_N
DCO_P
P1_D7P
P1_D7N
P0_D7P
P0_D7N
DCO_N
P1_D8P
P1_D8N
P0_D8P
P0_D8N
FRM_P
P1_D9P
P1_D9N
P0_D9P
P0_D9N
FRM_N
K
L
NC
NC
NC
NC
P1_D0P
P1_D0N
P0_D0P
P0_D0N
P1_D1P
P1_D1N
P0_D1P
P0_D1N
P1_D2P
P1_D2N
P0_D2P
P0_D2N
P1_D3P
P1_D3N
P0_D3P
P0_D3N
P1_D4P
P1_D4N
P0_D4P
P0_D4N
P1_D5P
P1_D5N
P0_D5P
P0_D5N
P1_D6P
P1_D6N
P0_D6P
P0_D6N
P1_D10P
P1_D10N
P0_D10P
P0_D10N
NC
NC
M
N
NC
NC
NC
NC
P
NOTES
1. NC = NO CONNECT. DO NOT CONNECT TO THIS PIN.
Figure 2. AD9119 Pin Configuration
Table 8. AD9119 Pin Function Descriptions
Pin No.
Mnemonic
Description
A1
I250U
Nominal 1.0 V Reference. Tie this pin to VSSA via a 4.0 kΩ resistor to generate
a 250 µA reference current.
A2
VREF
VSSA
VDDA SH
Voltage Reference Input/Output. Decouple to VSSA with a 1 nF capacitor.
−1.5 V Analog Supply Voltage Input.
+1.8 V Analog Supply Shield. Tie these pins to VDDA at the DAC.
+1.8 V Analog Supply Voltage Input.
A3, A4, B3, B4, B5, C4, C5, C6
A5, A8, B6, B7
A9, A10, A11, B1, B2, B8, B9, B10, VDDA
B11, C2, C3, C7, C8, C9, C10, D2,
D3, D4, D7, E1, E2
Rev. 0 | Page 8 of 68
Data Sheet
AD9119/AD9129
Pin No.
Mnemonic
Description
G12, G13, G14, H11, H12, H13,
H14, J3, J4, J11, J12, J13, J14
VDD
+1.8 V Digital Supply Voltage Input.
C13, C14, D12, D13, D14, E11,
E12, E13, E14, F11, F12, F13, F14,
G1, G2, G3, G11, H3, H4
A12, A13, A14, B12, B13, C11,
C12, D5, D6, D8, D9, D10, D11,
E3, E4, F1, F2, F3, F4, G4
VSS
+1.8 V Digital Supply Return.
Analog Supply Return.
VSSC
A6
A7
B14
C1, D1
H1
IOUTP
IOUTN
SYNC
DACCLK_N, DACCLK_P
RESET
IRQ
DAC Positive Current Output Source.
DAC Negative Current Output Source.
Synchronization Signal Output.
Negative/Positive DAC Clock Input.
Reset Input. Active high. If unused, tie this pin to VSS.
H2
Interrupt Request Open Drain Output. Active high. Pull up this pin to VDD
with a 1 kΩ resistor.
J1
SDIO
Serial Port Data Input/Output.
J2
SDO
Serial Port Data Output.
K1
SCLK
Serial Port Clock Input.
K2
CS
Serial Port Enable Input.
K3, K4
DCI_P, DCI_N
D CO _ P, DCO_N
FRM_P, FRM_N
NC, NC
NC, NC
NC, NC
P1_D0P, P1_D0N
P1_D1P, P1_D1N
P1_D2P, P1_D2N
P1_D3P, P1_D3N
P1_D4P, P1_D4N
P1_D5P, P1_D5N
P1_D6P, P1_D6N
P1_D7P, P1_D7N
P1_D8P, P1_D8N
P1_D9P, P1_D9N
P1_D10P, P1_D10N
NC, NC
Positive, Negative Data Clock Input (DCI).
Positive, Negative Data Clock Output (DCO).
Positive, Negative Data Frame/Parity Signal (FRAME/PARITY).
No Connect. Do not connect to this pin.
No Connect. Do not connect to this pin.
No Connect. Do not connect to this pin.
Data Port 1 Positive/Negative Data Input Bit 0.
Data Port 1 Positive/Negative Data Input Bit 1.
Data Port 1 Positive/Negative Data Input Bit 2.
Data Port 1 Positive/Negative Data Input Bit 3.
Data Port 1 Positive/Negative Data Input Bit 4.
Data Port 1 Positive/Negative Data Input Bit 5.
Data Port 1 Positive/Negative Data Input Bit 6.
Data Port 1 Positive/Negative Data Input Bit 7.
Data Port 1 Positive/Negative Data Input Bit 8.
Data Port 1 Positive/Negative Data Input Bit 9.
Data Port 1 Positive/Negative Data Input Bit 10.
No Connect. Do not connect to this pin.
No Connect. Do not connect to this pin.
No Connect. Do not connect to this pin.
Data Port 0 Positive/Negative Data Input Bit 0.
Data Port 0 Positive/Negative Data Input Bit 1.
Data Port 0 Positive/Negative Data Input Bit 2.
Data Port 0 Positive/Negative Data Input Bit 3.
Data Port 0 Positive/Negative Data Input Bit 4.
Data Port 0 Positive/Negative Data Input Bit 5.
Data Port 0 Positive/Negative Data Input Bit 6.
Data Port 0 Positive/Negative Data Input Bit 7.
Data Port 0 Positive/Negative Data Input Bit 8.
Data Port 0 Positive/Negative Data Input Bit 9.
Data Port 0 Positive/Negative Data Input Bit 10.
K11, K12
K13, K14
L1, M1
L2, M2
L3, M3
L4, M4
L5, M5
L6, M6
L7, M7
L8, M8
L9, M9
L10, M10
L11, M11
L12,M12
L13, M13
L14, M14
N1, P1
N2, P2
N3, P3
N4, P4
N5, P5
N6, P6
N7, P7
N8, P8
N9, P9
N10, P10
N11, P11
N12, P12
N13, P13
N14, P14
NC, NC
NC, NC
P0_D0P, P0_D0N
P0_D1P, P0_D1N
P0_D2P, P0_D2N
P0_D3P, P0_D3N
P0_D4P, P0_D4N
P0_D5P, P0_D5N
P0_D6P, P0_D6N
P0_D7P, P0_D7N
P0_D8P, P0_D8N
P0_D9P, P0_D9N
P0_D10P, P0_D10N
Rev. 0 | Page 9 of 68
AD9119/AD9129
Data Sheet
1
2
3
4
5
6
7
8
9
10
11
12
13
14
I250U
VREF
VSSA
VSSA
VDDA SH
IOUTP
IOUTN
VDDA SH
VDDA
VDDA
VDDA
VSSC
VSSC
VSSC
SYNC
VSS
A
B
C
D
E
F
VDDA
DACCLK_N
DACCLK_P
VDDA
VDDA
VDDA
VDDA
VDDA
VSSA
VDDA
VDDA
VSSC
VSSA
VSSA
VDDA
VSSC
VSSA
VSSA
VSSC
VDDA SH
VSSA
VDDA SH
VDDA
VDDA
VDDA
VSSC
VDDA
VDDA
VSSC
VDDA
VDDA
VSSC
VDDA
VSSC
VSSC
VSS
VSSC
VSSC
VSS
VSSC
VSS
VSS
VSS
VSSC
VDDA
VSS
VSS
VSS
VSSC
VSSC
VSSC
VSSC
VSS
VSS
VSS
VSS
G
H
J
VSS
VSS
IRQ
VSS
VSS
VSSC
VSS
VSS
VDD
VDD
VDD
VDD
VDD
VDD
VDD
AD9129
RESET
SDIO
SCLK
SDO
CS
VDD
VDD
VDD
VDD
VDD
VDD
K
L
DCI_P
DCI_N
DCO_P
DCO_N
FRM_P
FRM_N
P1_D0P
P1_D0N
P0_D0P
P0_D0N
P1_D1P
P1_D1N
P0_D1P
P0_D1N
P1_D2P
P1_D2N
P0_D2P
P0_D2N
P1_D3P
P1_D3N
P0_D3P
P0_D3N
P1_D4P
P1_D4N
P0_D4P
P0_D4N
P1_D5P
P1_D5N
P0_D5P
P0_D5N
P1_D6P
P1_D6N
P0_D6P
P0_D6N
P1_D7P
P1_D7N
P0_D7P
P0_D7N
P1_D8P
P1_D8N
P0_D8P
P0_D8N
P1_D9P
P1_D9N
P0_D9P
P0_D9N
P1_D10P
P1_D10N
P0_D10P
P0_D10N
P1_D11P
P1_D11N
P0_D11P
P0_D11N
P1_D12P
P1_D12N
P0_D12P
P0_D12N
P1_D13P
P1_D13N
P0_D13P
P0_D13N
M
N
P
Figure 3. AD9129 Pin Configuration
Table 9. AD9129 Pin Function Descriptions
Pin No.
Mnemonic
Description
A1
I250U
Nominal 1.0 V Reference. Tie this pin to VSSA via a 4.0 kΩ resistor to generate
a 250 µA reference current.
A2
VREF
VSSA
VDDA SH
Voltage Reference Input/Output. Decouple to VSSA with a 1 nF capacitor.
−1.5 V Analog Supply Voltage Input.
+1.8 V Analog Supply Shield. Tie these pins to VDDA at the DAC.
+1.8 V Analog Supply Voltage Input.
A3, A4, B3, B4, B5, C4, C5, C6
A5, A8, B6, B7
A9, A10, A11, B1, B2, B8, B9, B10, VDDA
B11, C2, C3, C7, C8, C9, C10, D2,
D3, D4, D7, E1, E2
G12, G13, G14, H11, H12, H13,
H14, J3, J4, J11, J12, J13, J14
C13, C14, D12, D13, D14, E11,
E12, E13, E14, F11, F12, F13, F14,
G1, G2, G3, G11, H3, H4
VDD
+1.8 V Digital Supply Voltage Input.
+1.8 V Digital Supply Return.
VSS
Rev. 0 | Page 10 of 68
Data Sheet
AD9119/AD9129
Pin No.
Mnemonic
Description
A12, A13, A14, B12, B13, C11,
C12, D5, D6, D8, D9, D10, D11,
E3, E4, F1, F2, F3, F4, G4
VSSC
Analog Supply Return.
A6
A7
B14
C1, D1
H1
IOUTP
IOUTN
SYNC
DACCLK_N, DACCLK_P
RESET
IRQ
DAC Positive Current Output Source.
DAC Negative Current Output Source.
Synchronization Signal Output.
Negative/Positive DAC Clock Input.
Reset Input. Active high. If unused, tie this pin to VSS.
H2
Interrupt Request Open-Drain Output. Active high. Pull up this pin to VDD
with a 1 kΩ resistor.
J1
SDIO
Serial Port Data Input/Output.
J2
SDO
Serial Port Data Output.
K1
SCLK
Serial Port Clock Input.
K2
CS
Serial Port Enable Input.
K3, K4
DCI_P, DCI_N
Positive, Negative Data Clock Input (DCI).
Positive, Negative Data Clock Output (DCO).
Positive, Negative Data Frame/Parity Signal (FRAME/PARITY).
Data Port 1 Positive/Negative Data Input Bit 0.
Data Port 1 Positive/Negative Data Input Bit 1.
Data Port 1 Positive/Negative Data Input Bit 2.
Data Port 1 Positive/Negative Data Input Bit 3.
Data Port 1 Positive/Negative Data Input Bit 4.
Data Port 1 Positive/Negative Data Input Bit 5.
Data Port 1 Positive/Negative Data Input Bit 6.
Data Port 1 Positive/Negative Data Input Bit 7.
Data Port 1 Positive/Negative Data Input Bit 8.
Data Port 1 Positive/Negative Data Input Bit 9.
Data Port 1 Positive/Negative Data Input Bit 10.
Data Port 1 Positive/Negative Data Input Bit 11.
Data Port 1 Positive/Negative Data Input Bit 12.
Data Port 1 Positive/Negative Data Input Bit 13.
Data Port 0 Positive/Negative Data Input Bit 0.
Data Port 0 Positive/Negative Data Input Bit 1.
Data Port 0 Positive/Negative Data Input Bit 2.
Data Port 0 Positive/Negative Data Input Bit 3.
Data Port 0 Positive/Negative Data Input Bit 4.
Data Port 0 Positive/Negative Data Input Bit 5.
Data Port 0 Positive/Negative Data Input Bit 6.
Data Port 0 Positive/Negative Data Input Bit 7.
Data Port 0 Positive/Negative Data Input Bit 8.
Data Port 0 Positive/Negative Data Input Bit 9.
Data Port 0 Positive/Negative Data Input Bit 10.
Data Port 0 Positive/Negative Data Input Bit 11.
Data Port 0 Positive/Negative Data Input Bit 12.
Data Port 0 Positive/Negative Data Input Bit 13.
K11, K12
K13, K14
L1, M1
L2, M2
L3, M3
L4, M4
L5, M5
L6, M6
L7, M7
L8, M8
L9, M9
L10, M10
L11, M11
L12,M12
L13, M13
L14, M14
N1, P1
N2, P2
N3, P3
N4, P4
N5, P5
N6, P6
N7, P7
N8, P8
N9, P9
N10, P10
N11, P11
N12, P12
N13, P13
N14, P14
D CO _ P, DCO_N
FRM_P, FRM_N
P1_D0P, P1_D0N
P1_D1P, P1_D1N
P1_D2P, P1_D2N
P1_D3P, P1_D3N
P1_D4P, P1_D4N
P1_D5P, P1_D5N
P1_D6P, P1_D6N
P1_D7P, P1_D7N
P1_D8P, P1_D8N
P1_D9P, P1_D9N
P1_D10P, P1_D10N
P1_D11P, P1_D11N
P1_D12P, P1_D12N
P1_D13P, P1_D13N
P0_D0P, P0_D0N
P0_D1P, P0_D1N
P0_D2P, P0_D2N
P0_D3P, P0_D3N
P0_D4P, P0_D4N
P0_D5P, P0_D5N
P0_D6P, P0_D6N
P0_D7P, P0_D7N
P0_D8P, P0_D8N
P0_D9P, P0_D9N
P0_D10P, P0_D10N
P0_D11P, P0_D11N
P0_D12P, P0_D12N
P0_D13P, P0_D13N
Rev. 0 | Page 11 of 68
AD9119/AD9129
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
AD9119
Static Linearity
IOUTFS = 28 mA, nominal supplies, TA = 25°C, unless otherwise noted.
0.3
0.10
0.08
0.06
0.04
0.02
0
0.2
0.1
–0.02
–0.04
–0.06
–0.08
–0.10
0
–0.1
–0.2
0
200 400 600 800 1000 1200 1400 1600 1800 2000
0
0
0
200 400 600 800 1000 1200 1400 1600 1800 2000
CODE
CODE
Figure 4. Typical INL, 11 mA at 25°C
Figure 7. Typical DNL, 11 mA at 25°C
0.10
0.08
0.06
0.04
0.02
0
0.3
0.2
0.1
0
–0.02
–0.04
–0.06
–0.08
–0.10
–0.1
–0.2
0
200 400 600 800 1000 1200 1400 1600 1800 2000
CODE
200 400 600 800 1000 1200 1400 1600 1800 2000
CODE
Figure 8. Typical DNL, 22 mA at 25°C
Figure 5. Typical INL, 22 mA at 25°C
0.10
0.08
0.06
0.04
0.02
0
0.3
0.2
0.1
0
–0.02
–0.04
–0.06
–0.08
–0.10
–0.1
–0.2
0
200 400 600 800 1000 1200 1400 1600 1800 2000
CODE
200 400 600 800 1000 1200 1400 1600 1800 2000
CODE
Figure 9. Typical DNL, 33 mA at 25°C
Figure 6. Typical INL, 33 mA at 25°C
Rev. 0 | Page 12 of 68
Data Sheet
AD9119/AD9129
AC (Normal Mode)
IOUTFS = 28 mA, fDAC = 2.6 GSPS, nominal supplies, TA = 25°C, unless otherwise noted.
REF 5dBm
REF 5dBm
5
–5
5
–5
–15
–25
–35
–45
–55
–65
–75
–85
–95
–15
–25
–35
–45
–55
–65
–75
–85
–95
START 20MHz
RES BW 20kHz
STOP 2.6GHz
SWEEP 7.78s (1001 pts)
START 20MHz
RES BW 20kHz
STOP 2.6GHz
SWEEP 7.78s (1001 pts)
VBW 20kHz
VBW 20kHz
Figure 13. Single-Tone Spectrum at fOUT = 1000 MHz
Figure 10. Single-Tone Spectrum at fOUT = 70 MHz
–55
–60
–65
–70
–75
–80
–85
–90
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
1600MSPS
2200MSPS
2600MSPS
2800MSPS
1400MSPS
1600MSPS
2200MSPS
2600MSPS
2800MSPS
0
200
400
600
800
1000
1200
1400
0
200
400
600
800
1000
1200
1400
fOUT (MHz)
fOUT (MHz)
Figure 11. SFDR vs. fOUT over fDAC
Figure 14. IMD vs. fOUT over fDAC
–150
–155
–160
–165
–170
–145
–150
–155
–160
–165
–170
1600MSPS
2200MSPS
2800MSPS
1600MSPS
2200MSPS
2800MSPS
0
200
400
600
800
1000
1200
0
200
400
600
800
1000
1200
1400
fOUT (MHz)
fOUT (MHz)
Figure 12. Single-Tone NSD vs. fOUT
Figure 15. W-CDMA NSD vs. fOUT
Rev. 0 | Page 13 of 68
AD9119/AD9129
Data Sheet
IOUTFS = 28 mA, fDAC = 2.6 GSPS, nominal supplies, TA = 25°C, unless otherwise noted.
–30
–40
–50
–60
–70
–80
–90
–45
–50
–55
–60
–65
–70
–75
–80
11mA
22mA
33mA
–16dBFS
–12dBFS
–6dBFS
0dBFS
0
200
400
600
800
1000
1200
1400
0
200
400
600
800
1000
1200
1400
fOUT (MHz)
fOUT (MHz)
Figure 16. SFDR vs. fOUT over Digital Full Scale
Figure 18. SFDR vs. fOUT over DAC IOUTFS
–40
–50
–60
–70
–80
–90
–100
–55
–60
–65
–70
–75
–80
–85
–90
–16dBFS
–12dBFS
–6dBFS
0dBFS
11mA
22mA
33mA
0
200
400
600
800
1000
1200
1400
0
200
400
600
800
1000
1200
1400
fOUT (MHz)
fOUT (MHz)
Figure 17. IMD vs. fOUT over Digital Full Scale
Figure 19. IMD vs. fOUT over DAC IOUTFS
Rev. 0 | Page 14 of 68
Data Sheet
AD9119/AD9129
IOUTFS = 28 mA, fDAC = 2.6 GSPS, nominal supplies, TA = 25°C, unless otherwise noted.
–150
–155
–160
–165
–170
–145
–150
–155
–160
–165
–170
–40°C
+25°C
+85°C
–40°C
+25°C
+85°C
0
200
400
600
800
1000
1200
0
200
400
600
800
1000
1200
1400
fOUT (MHz)
fOUT (MHz)
Figure 20. Single-Tone NSD vs. fOUT over Temperature
Figure 22. W-CDMA NSD vs. fOUT over Temperature
–20
–20
–30
–30
–40
–40
–50
–50
–60
–60
–70
–70
–80
–80
–90
–90
–100
–110
–120
–100
–110
–120
CENTER 877.5MHz
VBW 3kHz
SPAN 53.84MHz
SWEEP 1.485s
CENTER 877.5MHz
VBW 3kHz
SPAN 58.84MHz
SWEEP 1.623s
TOTAL CARRIER POWER –10.705dBm/3.84MHz
LOWER
OFFSET FREQ INTEG BW
TOTAL CARRIER POWER –10.646dBm/7.68MHz
LOWER
OFFSET FREQ INTEG BW
UPPER
dBc dBm FILTER
UPPER
dBc dBm FILTER
dBc
dBm
dBc
dBm
5MHz
3.84MHz
3.84MHz
3.84MHz
3.84MHz
3.84MHz
–74.97 –85.68 –75.24 –85.95 OFF
–77.99 –88.69 –78.44 –89.14 OFF
–78.68 –89.38 –78.94 –89.65 OFF
–78.79 –89.50 –78.58 –89.29 OFF
–76.81 –87.52 –77.20 –87.91 OFF
5MHz
3.84MHz
3.84MHz
3.84MHz
3.84MHz
3.84MHz
–71.62 –85.23 –71.61 –85.22 OFF
–74.36 –87.96 –74.94 –88.55 OFF
–74.35 –87.95 –74.91 –88.52 OFF
–72.89 –86.50 –74.53 –88.14 OFF
–67.34 –80.95 –73.68 –87.29 OFF
10MHz
15MHz
20MHz
25MHz
10MHz
15MHz
20MHz
25MHz
Figure 21. Single-Carrier W-CDMA at 877.5 MHz
Figure 23. Two-Carrier W-CDMA at 877.5 MHz
Rev. 0 | Page 15 of 68
AD9119/AD9129
Data Sheet
AC (Mix-Mode)
IOUTFS = 28 mA, fDAC = 2.6 GSPS, nominal supplies, TA = 25°C, unless otherwise noted.
REF 0dBm
REF 5dBm
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
5
–5
–15
–25
–35
–45
–55
–65
–75
–85
–95
START 20MHz
RES BW 20kHz
STOP 2.6GHz
SWEEP 7.78s (1001 pts)
START 20MHz
RES BW 20kHz
STOP 2.6GHz
SWEEP 7.78s (1001 pts)
VBW 20kHz
VBW 20kHz
Figure 24. Single Tone Spectrum at fOUT = 2350 MHz
Figure 27. Single-Tone Spectrum at fOUT = 1600 MHz
–40
–50
–60
–70
–80
–90
–50
–55
–60
–65
–70
–75
–80
–85
1600MSPS
2200MSPS
2800MSPS
1600MSPS
2200MSPS
2800MSPS
500
1000
1500
2000
2500
3000
500
1000
1500
2000
2500
3000
fOUT (MHz)
fOUT (MHz)
Figure 28. IMD vs. fOUT over fDAC
Figure 25. SFDR vs. fOUT over fDAC
–145
–150
–155
–160
–165
–170
–145
–150
–155
–160
–165
–170
1000
1500
2000
2500
3500
3500
4000
4500
1500
2000
2500
3000
3500
4000
fOUT (MHz)
fOUT (MHz)
Figure 26. Single-Tone NSD vs. fOUT
Figure 29. W-CDMA NSD vs. fOUT
Rev. 0 | Page 16 of 68
Data Sheet
AD9119/AD9129
IOUTFS = 28 mA, fDAC = 2.6 GSPS, nominal supplies, TA = 25°C, unless otherwise noted.
–25
–30
–35
–40
–45
–50
–55
–60
–65
–70
–25
–30
–35
–40
–45
–50
–55
–60
–65
–70
SECOND NYQUIST ZONE
THIRD NYQUIST ZONE
SECOND NYQUIST ZONE
THIRD NYQUIST ZONE
–16dBFS
–12dBFS
–6dBFS
0dBFS
11mA
22mA
33mA
1000
1500
2000
2500
3500
3500
4000
1000
1500
2000
2500
3000
3500
4000
fOUT (MHz)
fOUT (MHz)
Figure 30. SFDR vs. fOUT over Digital Full Scale
Figure 32. SFDR vs. fOUT over DAC IOUTFS
–45
–50
–55
–60
–65
–70
–75
–80
–45
–50
–55
–60
–65
–70
–75
–80
SECOND NYQUIST ZONE
THIRD NYQUIST ZONE
–16dBFS
–12dBFS
–6dBFS
0dBFS
11mA
22mA
33mA
SECOND NYQUIST ZONE
THIRD NYQUIST ZONE
1000
1500
2000
2500
fOUT (MHz)
3000
3500
4000
1000
1500
2000
2500
3000
3500
4000
fOUT (MHz)
Figure 31. IMD vs. fOUT over Digital Full Scale
Figure 33. IMD vs. fOUT over DAC IOUTFS
Rev. 0 | Page 17 of 68
AD9119/AD9129
Data Sheet
IOUTFS = 28 mA, fDAC = 2.6 GSPS, nominal supplies, TA = 25°C, unless otherwise noted.
–145
–150
–155
–160
–165
–145
–150
–155
–160
–165
–170
–40°C
+25°C
+85°C
–40°C
+25°C
+85°C
1500
2000
2500
3000
3500
3500
1000
1500
2000
2500
3500
3500
4000
fOUT (MHz)
fOUT (MHz)
Figure 34. Single-Tone NSD vs. fOUT over Temperature
Figure 36. W-CDMA NSD vs. fOUT over Temperature
–20
–30
–20
–30
–40
–40
–50
–50
–60
–60
–70
–70
–80
–80
–90
–90
–100
–110
–120
–100
–110
–120
CENTER 1.98GHz
VBW 3kHz
SPAN 58.84MHz
SWEEP 1.623s
CENTER 1.888GHz
VBW 3kHz
SPAN 53.84MHz
SWEEP 1.485s
TOTAL CARRIER POWER –10.125dBm/3.84MHz
LOWER
OFFSET FREQ INTEG BW
TOTAL CARRIER POWER –10.251dBm/15.36MHz
LOWER
OFFSET FREQ INTEG BW
UPPER
dBc dBm FILTER
UPPER
dBc dBm FILTER
dBc
dBm
dBc
dBm
5MHz
3.84MHz
3.84MHz
3.84MHz
3.84MHz
3.84MHz
–70.25 –80.37 –70.38 –80.50 OFF
–74.47 –84.60 –74.54 –84.66 OFF
–75.55 –85.68 –75.72 –85.85 OFF
–76.03 –86.15 –76.25 –86.37 OFF
–76.62 –86.75 –76.70 –86.83 OFF
5MHz
3.84MHz
3.84MHz
3.84MHz
3.84MHz
–65.84 –82.06 –65.79 –82.01 OFF
–67.02 –83.23 –66.75 –82.97 OFF
–68.05 –84.27 –67.99 –84.21 OFF
–69.07 –85.29 –69.03 –85.25 OFF
10MHz
15MHz
20MHz
25MHz
10MHz
15MHz
20MHz
Figure 35. Single-Carrier W-CDMA at 1887.5 MHz
Figure 37. Four-Carrier W-CDMA at 1980 MHz
Rev. 0 | Page 18 of 68
Data Sheet
AD9119/AD9129
DOCSIS Performance (Normal Mode)
IOUTFS = 33 mA, fDAC = 2.782 GSPS, nominal supplies, TA = 25°C, unless otherwise noted.
REF –20dBm
REF –20dBm
–20
–30
–20
–30
1
1
–40
–40
–50
–50
–60
–60
–70
–70
–80
–80
2Δ1
–90
–90
3Δ1
2Δ1 3Δ1
–100
–110
–120
–100
–110
–120
START 0Hz
RES BW 20kHz
STOP 1.1GHz
SWEEP 27.9s (1001 pts)
START 0Hz
RES BW 20kHz
STOP 1.1GHz
SWEEP 27.9s (1001 pts)
VBW 2kHz
VBW 2kHz
FUNCTION
WIDTH
FUNCTION
VALUE
FUNCTION
WIDTH
FUNCTION
VALUE
MODE TRC SCL
X
Y
FUNCTION
MODE TRC SCL
X
Y
FUNCTION
N
Δ1
Δ1
1
1
1
f
f
f
70MHz
(Δ) 70MHz
(Δ) 140MHz
–3.819dBm BAND POWER
(Δ) –74.107dB BAND POWER
(Δ) –74.148dB BAND POWER
6MHz
6MHz
6MHz
–3.819dBm
(Δ) –74.24dB
(Δ) –74.17dB
N
Δ1
Δ1
1
1
1
f
f
f
950MHz
(Δ) –68MHz
(Δ) –882MHz
–6.351dBm BAND POWER
(Δ) –66.696dB BAND POWER
(Δ) –70.598dB BAND POWER
6MHz
6MHz
6MHz
–6.349dBm
(Δ) –66.696dB
(Δ) –70.598dB
Figure 38. Single Carrier at 70 MHz Output
Figure 41. Single Carrier at 950 MHz Output
REF –20dBm
REF –20dBm
–20
–30
–20
–30
1
1
–40
–40
–50
–50
–60
–60
–70
–70
–80
–80
–90
–90
2Δ1
2Δ1
–100
–110
–120
–100
–110
–120
3Δ1
3Δ1
START 0Hz
RES BW 20kHz
STOP 1.1GHz
SWEEP 27.9s (1001 pts)
START 0Hz
RES BW 20kHz
STOP 1.1GHz
SWEEP 27.9s (1001 pts)
VBW 2kHz
VBW 2kHz
FUNCTION
WIDTH
FUNCTION
VALUE
FUNCTION
WIDTH
FUNCTION
VALUE
MODE TRC SCL
X
Y
FUNCTION
MODE TRC SCL
X
Y
FUNCTION
N
Δ1
Δ1
1
1
1
f
f
f
959MHz
(Δ) –77MHz
(Δ) –891MHz
–14.282dBm BAND POWER
(Δ) –64.535dB BAND POWER
(Δ) –68.529dB BAND POWER
6MHz
6MHz
6MHz
–14.264dBm
(Δ) –64.535dB
(Δ) –68.597dB
N
Δ1
Δ1
1
1
1
f
f
f
79MHz
(Δ) 61MHz
(Δ) 131MHz
–12.143dBm BAND POWER
(Δ) –70.38dB BAND POWER
(Δ) –67.78dB BAND POWER
6MHz
6MHz
6MHz
–12.142dBm
(Δ) –70.351dB
(Δ) –67.775dB
Figure 39. Four Carrier at 70 MHz Output
Figure 42. Four Carrier at 950 MHz Output
REF –20dBm
REF –20dBm
–20
–30
–20
–30
1
1
–40
–40
–50
–50
–60
–60
–70
–70
–80
–80
–90
–90
2Δ1 3Δ1
–100
–110
–120
–100
–110
–120
2Δ1
3Δ1
START 0Hz
RES BW 20kHz
STOP 1.1GHz
SWEEP 27.9s (1001 pts)
START 0Hz
RES BW 20kHz
STOP 1.1GHz
SWEEP 27.9s (1001 pts)
VBW 20kHz
VBW 2kHz
FUNCTION
WIDTH
FUNCTION
VALUE
FUNCTION
WIDTH
FUNCTION
VALUE
MODE TRC SCL
X
Y
FUNCTION
MODE TRC SCL
X
Y
FUNCTION
N
Δ1
Δ1
1
1
1
f
f
f
91MHz
(Δ) 49MHz
(Δ) 117.9MHz
–15.295dBm BAND POWER
(Δ) –66.768dB BAND POWER
(Δ) –66.821dB BAND POWER
6MHz
6MHz
6MHz
–15.294dBm
(Δ) –66.669dB
(Δ) –66.833dB
N
Δ1
Δ1
1
1
1
f
f
f
971MHz
(Δ) –89MHz
(Δ) –903MHz
–14.632dBm BAND POWER
(Δ) –62.657dB BAND POWER
(Δ) –66.131dB BAND POWER
6MHz
6MHz
6MHz
–18.397dBm
(Δ) –62.657dB
(Δ) –66.195dB
Figure 40. Eight Carrier at 70 MHz Output
Figure 43. Eight Carrier at 950 MHz Output
Rev. 0 | Page 19 of 68
AD9119/AD9129
Data Sheet
IOUTFS = 33 mA, fDAC = 2.782 GSPS, nominal supplies, TA = 25°C, unless otherwise noted.
–40
–50
–60
–70
–80
–90
–40
–50
–60
–70
–80
–90
0
0.2
0.4
0.6
0.8
1.0
0
0.2
0.4
0.6
0.8
1.0
fOUT (GHz)
fOUT (GHz)
Figure 44. Second Harmonic vs. fOUT Performance for One DOCSIS Carrier
Figure 47. Third Harmonic vs. fOUT Performance for One DOCSIS Carrier
–40
–40
–50
–60
–70
–80
–90
–50
–60
–70
–80
–90
0
0.2
0.4
0.6
0.8
1.0
0
0.2
0.4
0.6
0.8
1.0
fOUT (GHz)
fOUT (GHz)
Figure 48. Third Harmonic vs. fOUT Performance for Four DOCSIS Carriers
Figure 45. Second Harmonic vs. fOUT Performance for Four DOCSIS Carriers
–40
–40
–50
–60
–70
–80
–90
–50
–60
–70
–80
–90
0
0.2
0.4
0.6
0.8
1.0
0
0.2
0.4
0.6
0.8
1.0
fOUT (GHz)
fOUT (GHz)
Figure 49. Third Harmonic vs. fOUT Performance for Eight DOCSIS Carriers
Figure 46. Second Harmonic vs. fOUT Performance for Eight DOCSIS Carriers
Rev. 0 | Page 20 of 68
Data Sheet
AD9119/AD9129
IOUTFS = 33 mA, fDAC = 2.782 GSPS, nominal supplies, TA = 25°C, unless otherwise noted.
–50
–55
–60
–65
–70
–75
–80
–85
–90
–50
–55
–60
–65
–70
–75
–80
–85
–90
ACP1
ACP2
ACP3
ACP4
ACP5
ACP1
ACP2
ACP3
ACP4
ACP5
0
0.2
0.4
0.6
0.8
1.0
0
0.2
0.4
0.6
0.8
1.0
fOUT (GHz)
fOUT (GHz)
Figure 50. Single-Carrier ACPR vs. fOUT
Figure 53. 16-Carrier ACPR vs. fOUT
–50
–55
–60
–65
–70
–75
–80
–85
–90
–50
–55
–60
–65
–70
–75
–80
–85
–90
ACP1
ACP2
ACP3
ACP4
ACP5
ACP1
ACP2
ACP3
ACP4
ACP5
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
0
0.2
0.4
0.6
0.8
1.0
fOUT (MHz)
fOUT (GHz)
Figure 51. Four-Carrier ACPR vs. fOUT
Figure 54. 32-Carrier ACPR vs. fOUT
–50
–55
–60
–65
–70
–75
–80
–85
–90
REF –20dBm
ACP1
ACP2
ACP3
ACP4
ACP5
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
0
0.2
0.4
0.6
0.8
1.0
CENTER 77MHz
RES BW 10kHz
SPAN 60MHz
SWEEP 6.08s (1001 pts)
fOUT (GHz)
VBW 1kHz
Figure 52. Eight-Carrier ACPR vs. fOUT
Figure 55. Gap Channel ACPR at 77 MHz
Rev. 0 | Page 21 of 68
AD9119/AD9129
Data Sheet
AD9129
Static Linearity
IOUTFS = 28 mA, nominal supplies, TA = 25°C, unless otherwise noted.
1.0
0.5
2.0
1.5
1.0
0
0.5
0
–0.5
–1.0
–1.5
–0.5
–1.0
–1.5
0
2000 4000 6000 8000 10000 12000 14000 16000
0
2000 4000 6000 8000 10000 12000 14000 16000
CODE
CODE
Figure 56. Typical INL, 11 mA at 25°C
Figure 59. Typical DNL, 11 mA at 25°C
1.0
0.5
2.0
1.5
1.0
0
0.5
0
–0.5
–1.0
–1.5
–0.5
–1.0
–1.5
0
2000 4000 6000 8000 10000 12000 14000 16000
CODE
0
2000 4000 6000 8000 10000 12000 14000 16000
CODE
Figure 57. Typical INL, 22 mA at 25°C
Figure 60. Typical DNL, 22 mA at 25°C
2.0
1.5
1.0
0.5
1.0
0
0.5
0
–0.5
–1.0
–1.5
–0.5
–1.0
–1.5
0
2000 4000 6000 8000 10000 12000 14000 16000
CODE
0
2000 4000 6000 8000 10000 12000 14000 16000
CODE
Figure 58. Typical INL, 33 mA at 25°C
Figure 61. Typical DNL, 33 mA at 25°C
Rev. 0 | Page 22 of 68
Data Sheet
AD9119/AD9129
AC (Normal Mode)
IOUTFS = 28 mA, fDAC = 2.6 GSPS, nominal supplies, TA = 25°C, unless otherwise noted.
REF 5dBm
REF 5dBm
5
–5
5
–5
–15
–25
–35
–45
–55
–65
–75
–85
–95
–15
–25
–35
–45
–55
–65
–75
–85
–95
START 20MHz
RES BW 20kHz
STOP 2.6GHz
SWEEP 7.78s (1001 pts)
START 20MHz
RES BW 20kHz
STOP 2.6GHz
SWEEP 7.78s (1001 pts)
VBW 20kHz
VBW 20kHz
Figure 62. Single-Tone Spectrum at fOUT = 70 MHz
Figure 65. Single-Tone Spectrum at fOUT = 1000 MHz
0
–40
1400MSPS
1600MSPS
2200MSPS
2600MSPS
2800MSPS
1600MSPS
2200MSPS
2600MSPS
2800MSPS
–10
–50
–60
–20
–30
–40
–50
–60
–70
–80
–90
–70
–80
–90
–100
0
200
400
600
800
1000
1200
1400
0
200
400
600
800
1000
1200
1400
fOUT (MHz)
fOUT (MHz)
Figure 63. SFDR vs. fOUT over fDAC
Figure 66. IMD vs. fOUT over fDAC
–145
–150
–155
–160
–165
–170
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
1600MSPS
2200MSPS
2800MSPS
1600MSPS
2200MSPS
2800MSPS
0
200
400
600
800
1000
1200
1400
0
200
400
600
800
1000
1200
fOUT (MHz)
fOUT (MHz)
Figure 64. Single-Tone NSD vs. fOUT
Figure 67. W-CDMA NSD vs. fOUT
Rev. 0 | Page 23 of 68
AD9119/AD9129
Data Sheet
IOUTFS = 28 mA, fDAC = 2.6 GSPS, nominal supplies, TA = 25°C, unless otherwise noted.
–40
–50
–60
–70
–80
–90
–100
–45
–50
–55
–60
–65
–70
–75
–80
–16dBFS
–12dBFS
–6dBFS
0dBFS
–16dBFS
–12dBFS
–6dBFS
0dBFS
0
200
400
600
800
1000
1200
1400
0
200
400
600
800
1000
1200
1400
fOUT (MHz)
fOUT (MHz)
Figure 68. SFDR vs. fOUT over Digital Full Scale
Figure 71. IMD vs. fOUT over Digital Full Scale
–40
–50
–60
–70
–80
–90
–100
–30
–40
–50
–60
–70
–80
–90
11mA
22mA
33mA
–16dBFS
–12dBFS
–6dBFS
0dBFS
0
200
400
600
800
1000
1200
1400
0
200
400
600
800
1000
1200
1400
fOUT (MHz)
fOUT (MHz)
Figure 69. SFDR for Second Harmonic vs. fOUT over Digital Full Scale
Figure 72. SFDR vs. fOUT over DAC IOUTFS
–40
–55
–60
–65
–70
–75
–80
–85
–90
–16dBFS
–12dBFS
–6dBFS
11mA
22mA
33mA
–50
0dBFS
–60
–70
–80
–90
–100
0
200
400
600
800
1000
1200
1400
0
200
400
600
800
1000
1200
1400
fOUT (MHz)
fOUT (MHz)
Figure 73. IMD vs. fOUT over DAC IOUTFS
Figure 70. SFDR for Third Harmonic vs. fOUT over Digital Full Scale
Rev. 0 | Page 24 of 68
Data Sheet
AD9119/AD9129
IOUTFS = 28 mA, fDAC = 2.6 GSPS, nominal supplies, TA = 25°C, unless otherwise noted.
–50
–55
–60
–65
–70
–75
–80
–150
–155
–160
–165
–170
–40°C
+25°C
+85°C
–40°C
+25°C
+85°C
0
200
400
600
800
1000
1200
1400
0
200
400
600
800
1000
1200
fOUT (MHz)
fOUT (MHz)
Figure 74. SFDR vs. fOUT over Temperature
Figure 77. W-CDMA NSD vs. fOUT over Temperature
–145
–150
–155
–160
–165
–170
–60
–65
–70
–75
–80
–85
–40°C
+25°C
+85°C
–40°C
+25°C
+85°C
0
200
400
600
800
1000
1200
1400
0
200
400
600
800
1000
1200
1400
fOUT (MHz)
fOUT (MHz)
Figure 75. IMD vs. fOUT over Temperature
Figure 78. Single-Tone NSD vs. fOUT over Temperature
–20
–20
–30
–30
–40
–40
–50
–50
–60
–60
–70
–70
–80
–80
–90
–90
–100
–110
–120
–100
–110
–120
CENTER 877.5MHz
VBW 3kHz
SPAN 58.84MHz
SWEEP 1.623s
CENTER 877.5MHz
VBW 3kHz
SPAN 53.84MHz
SWEEP 1.485s
TOTAL CARRIER POWER –10.599dBm/7.68MHz
OFFSET FREQ INTEG BW dBc dBm
TOTAL CARRIER POWER –10.794dBm/3.84MHz
OFFSET FREQ INTEG BW dBc dBm
dBc
dBm FILTER
dBc
dBm FILTER
5MHz
3.84MHz
3.84MHz
3.84MHz
3.84MHz
3.84MHz
–72.33 –85.89 –72.37 –85.93 OFF
–75.18 –88.74 –75.19 –88.75 OFF
–74.76 –88.32 –74.92 –88.48 OFF
–72.69 –86.25 –74.60 –88.16 OFF
–65.42 –78.99 –73.53 –87.09 OFF
5MHz
3.84MHz
3.84MHz
3.84MHz
3.84MHz
3.84MHz
–76.29 –87.08 –75.85 –86.64 OFF
–80.60 –91.39 –79.88 –90.68 OFF
–81.37 –92.16 –81.09 –91.89 OFF
–81.76 –92.56 –81.89 –92.68 OFF
–79.29 –90.08 –80.89 –91.69 OFF
10MHz
15MHz
20MHz
25MHz
10MHz
15MHz
20MHz
25MHz
Figure 76. Single-Carrier W-CDMA at 877.5 MHz
Figure 79. Two-Carrier W-CDMA at 875 MHz
Rev. 0 | Page 25 of 68
AD9119/AD9129
Data Sheet
IOUTFS = 28 mA, fDAC = 2.6 GSPS, nominal supplies, TA = 25°C, unless otherwise noted.
–60
–65
–70
–75
–80
–85
–90
–60
–65
–70
–75
–80
–85
–90
FIRST ACLR (dBc)
FIRST ACLR (dBc)
SECOND ACLR (dBc)
SECOND ACLR (dBc)
700
750
800
850
900
950
1000
700
750
800
850
900
950
fOUT (MHz)
fOUT (MHz)
Figure 80. Single-Carrier W-CDMA ACLR vs. fOUT (First ACLR, Second ACLR)
Figure 82. Two-Carrier W-CDMA ACLR vs. fOUT (First ACLR, Second ACLR)
–60
–60
THIRD ACLR (dBc)
FOURTH ACLR (dBc)
FIFTH ACLR (dBc)
THIRD ACLR (dBc)
FOURTH ACLR (dBc)
FIFTH ACLR (dBc)
–65
–65
–70
–75
–80
–85
–90
–70
–75
–80
–85
–90
700
750
800
850
900
950
700
750
800
850
900
950
1000
fOUT (MHz)
fOUT (MHz)
Figure 83. Two-Carrier W-CDMA ACLR vs. fOUT (Third ACLR, Fourth ACLR,
Fifth ACLR)
Figure 81. Single-Carrier W-CDMA ACLR vs. fOUT (Third ACLR, Fourth ACLR,
Fifth ACLR)
Rev. 0 | Page 26 of 68
Data Sheet
AD9119/AD9129
AC (Mix-Mode)
IOUTFS = 28 mA, fDAC = 2.6 GSPS, nominal supplies, TA = 25°C, unless otherwise noted.
REF 0dBm
REF 5dBm
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
5
–5
–15
–25
–35
–45
–55
–65
–75
–85
–95
START 20MHz
RES BW 20kHz
STOP 2.6GHz
SWEEP 7.78s (1001 pts)
START 20MHz
RES BW 20kHz
STOP 2.6GHz
SWEEP 7.78s (1001 pts)
VBW 20kHz
VBW 20kHz
Figure 84. Single-Tone Spectrum at fOUT = 2350 MHz
Figure 87. Single-Tone Spectrum at fOUT = 1600 MHz
–50
–40
–55
–60
–65
–70
–75
–80
–85
–50
–60
–70
–80
–90
1600MSPS
2200MSPS
2800MSPS
1600
2200
2800
500
1000
1500
fOUT (MHz)
2000
2500
3000
500
1000
1500
fOUT (MHz)
2000
2500
3000
Figure 85. SFDR vs. fOUT over fDAC
Figure 88. IMD vs. fOUT over fDAC
–145
–150
–155
–160
–165
–170
–145
–150
–155
–160
–165
–170
1000
1500
2000
2500
fOUT (MHz)
3000
3500
4000
4500
1500
2000
2500
fOUT (MHz)
3000
3500
4000
Figure 86. Single-Tone NSD vs. fOUT
Figure 89. W-CDMA NSD vs. fOUT
Rev. 0 | Page 27 of 68
AD9119/AD9129
Data Sheet
IOUTFS = 28 mA, fDAC = 2.6 GSPS, nominal supplies, TA = 25°C, unless otherwise noted.
–25
–30
–35
–40
–45
–50
–55
–60
–65
–70
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
SECOND NYQUIST ZONE
THIRD NYQUIST ZONE
SECOND NYQUIST ZONE
THIRD NYQUIST ZONE
11mA
22mA
33mA
–16dBFS
–12dBFS
–6dBFS
0dBFS
1000
1500
2000
2500
3000
3500
4000
1000
1500
2000
2500
3000
3500
4000
fOUT (MHz)
fOUT (MHz)
Figure 90. SFDR vs. fOUT over Digital Full Scale
Figure 92. SFDR vs. fOUT over DAC IOUTFS
–45
–50
–55
–60
–65
–70
–75
–80
–30
–40
–50
–60
–70
–80
–90
SECOND NYQUIST ZONE
THIRD NYQUIST ZONE
SECOND NYQUIST ZONE
THIRD NYQUIST ZONE
–16dBFS
–12dBFS
–6dBFS
0dBFS
11mA
22mA
33mA
1000
1500
2000
2500
fOUT (MHz)
3000
3500
4000
1000
1500
2000
2500
3000
3500
4000
fOUT (MHz)
Figure 93. IMD vs. fOUT over DAC IOUTFS
Figure 91. IMD vs. fOUT over Digital Full Scale
Rev. 0 | Page 28 of 68
Data Sheet
AD9119/AD9129
IOUTFS = 28 mA, fDAC = 2.6 GSPS, nominal supplies, TA = 25°C, unless otherwise noted.
–145
–150
–155
–160
–165
–170
–145
–150
–155
–160
–165
–40°C
+25°C
+85°C
–40°C
+25°C
+85°C
1000
1500
2000
2500
fOUT (MHz)
3000
3500
4000
1500
2000
2500
fOUT (MHz)
3000
3500
Figure 94. Single-Tone NSD vs. fOUT over Temperature
Figure 96. W-CDMA NSD vs. fOUT over Temperature
–20
–20
–30
–40
–30
–40
–50
–50
–60
–60
–70
–70
–80
–80
–90
–90
–100
–110
–120
–100
–110
–120
CENTER 1.888GHz
VBW 3kHz
SPAN 53.84MHz
SWEEP 1.485s
CENTER 1.98GHz
VBW 3kHz
SPAN 58.84MHz
SWEEP 1.623s
TOTAL CARRIER POWER –9.445dBm/3.84MHz
LOWER
OFFSET FREQ INTEG BW
TOTAL CARRIER POWER –10.211dBm/15.36MHz
LOWER
OFFSET FREQ INTEG BW
UPPER
dBc dBm FILTER
UPPER
dBc dBm FILTER
dBc
dBm
dBc
dBm
5MHz
3.84MHz
3.84MHz
3.84MHz
3.84MHz
3.84MHz
–73.71 –83.15 –74.00 –83.45 OFF
–77.40 –86.84 –77.31 –86.75 OFF
–78.04 –87.48 –77.85 –87.30 OFF
–78.13 –87.57 –78.51 –87.96 OFF
–78.01 –87.46 –78.43 –87.87 OFF
5MHz
3.84MHz
3.84MHz
3.84MHz
3.84MHz
–69.05 –85.24 –69.03 –85.22 OFF
–69.86 –86.05 –69.71 –85.90 OFF
–70.81 –87.00 –70.52 –86.71 OFF
–71.03 –87.22 –70.91 –87.10 OFF
10MHz
15MHz
20MHz
25MHz
10MHz
15MHz
20MHz
Figure 95. Single-Carrier W-CDMA at 1887.5 MHz
Figure 97. Four-Carrier W-CDMA at 1980 MHz
Rev. 0 | Page 29 of 68
AD9119/AD9129
Data Sheet
IOUTFS = 28 mA, fDAC = 2.6 GSPS, nominal supplies, TA = 25°C, unless otherwise noted.
–50
–55
–60
–65
–70
–75
–80
–85
–90
–50
–55
–60
–65
–70
–75
–80
–85
–90
FIRST ACLR (dBc)
FIRST ACLR (dBc)
SECOND ACLR (dBc)
SECOND ACLR (dBc)
1.4
1.6
1.8
2.0
2.2
2.4
2.6
1.4
1.6
1.8
2.0
2.2
2.4
2.6
fOUT (GHz)
fOUT (GHz)
Figure 98. Single-Carrier W-CDMA ACLR vs. fOUT (First ACLR, Second ACLR)
Figure 100. Four-Carrier W-CDMA ACLR vs. fOUT (First ACLR, Second ACLR)
–50
–50
THIRD ACLR (dBc)
FOURTH ACLR (dBc)
THIRD ACLR (dBc)
FOURTH ACLR (dBc)
FIFTH ACLR (dBc)
–55
–60
–65
–70
–75
–80
–85
–90
FIFTH ACLR (dBc)
–55
–60
–65
–70
–75
–80
–85
–90
1.4
1.6
1.8
2.0
2.2
2.4
2.6
1.4
1.6
1.8
2.0
2.2
2.4
2.6
fOUT (GHz)
fOUT (GHz)
Figure 99. Single-Carrier W-CDMA ACLR vs. fOUT (Third ACLR, Fourth ACLR,
Fifth ACLR)
Figure 101. Four-Carrier W-CDMA ACLR vs. fOUT (Third ACLR, Fourth ACLR,
Fifth ACLR)
Rev. 0 | Page 30 of 68
Data Sheet
AD9119/AD9129
DOCSIS Performance (Normal Mode)
IOUTFS = 33 mA, fDAC = 2.782 GSPS, nominal supplies, TA = 25°C, unless otherwise noted.
REF –20dBm
REF –20dBm
–20
–30
–20
–30
1
1
–40
–40
–50
–50
–60
–60
–70
–70
–80
–80
–90
–90
2Δ1
2Δ1
3Δ1
3Δ1
–100
–110
–120
–100
–110
–120
START 0Hz
RES BW 20kHz
STOP 1.1GHz
SWEEP 27.9s (1001 pts)
START 0Hz
RES BW 20kHz
STOP 1.1GHz
SWEEP 27.9s (1001 pts)
VBW 2kHz
VBW 20kHz
FUNCTION
WIDTH
FUNCTION
VALUE
FUNCTION
WIDTH
FUNCTION
VALUE
MODE TRC SCL
X
Y
FUNCTION
MODE TRC SCL
X
Y
FUNCTION
N
Δ1
Δ1
1
1
1
f
f
f
950MHz
(Δ) –68MHz
(Δ) –882MHz
–6.221dBm BAND POWER
(Δ) –68.115dB BAND POWER
(Δ) –71.783dB BAND POWER
6MHz
6MHz
6MHz
–6.223dBm
(Δ) –68.115dB
(Δ) –71.783dB
N
Δ1
Δ1
1
1
1
f
f
f
70MHz
–3.611dBm BAND POWER
(Δ) –72.929dB BAND POWER
(Δ) –74.629dB BAND POWER
6MHz
6MHz
6MHz
–3.612dBm
(Δ) –72.903dB
(Δ) –74.583dB
(Δ)
(Δ) 70MHz
(Δ) (Δ) 140MHz
Figure 105. Single Carrier at 950 MHz Output
Figure 102. Single Carrier at 70 MHz Output
REF –20dBm
REF –20dBm
–20
–20
–30
–30
–40
1
1
–40
–50
–50
–60
–60
–70
–70
–80
–80
–90
–90
2Δ1 3Δ1
2Δ1
–100
–110
–120
–100
–110
–120
3Δ1
START 0Hz
RES BW 20kHz
STOP 1.1GHz
SWEEP 27.9s (1001 pts)
START 0Hz
RES BW 20kHz
STOP 1.1GHz
SWEEP 27.9s (1001 pts)
VBW 20kHz
VBW 2kHz
FUNCTION
WIDTH
FUNCTION
VALUE
MODE TRC SCL
X
Y
FUNCTION
FUNCTION
WIDTH
FUNCTION
VALUE
MODE TRC SCL
X
Y
FUNCTION
N
Δ1
Δ1
1
1
1
f
f
f
79MHz
–11.506dBm BAND POWER
(Δ) –71.473dB BAND POWER
(Δ) –69.109dB BAND POWER
6MHz
6MHz
6MHz
–11.506dBm
(Δ) –71.606dB
(Δ) –69.155dB
(Δ)
(Δ) 61MHz
N
1
1
1
f
f
f
959MHz
(Δ) –77MHz
(Δ) –891MHz
–14.583dBm BAND POWER
(Δ) –65.064dB BAND POWER
(Δ) –71.759dB BAND POWER
6MHz
6MHz
6MHz
–14.584dBm
(Δ) –65.064dB
(Δ) –71.759dB
(Δ) (Δ) 131MHz
Δ1
Δ1
Figure 103. Four Carrier at 70 MHz Output
Figure 106. Four Carrier at 950 MHz Output
REF –20dBm
REF –20dBm
–20
–30
–20
–30
1
1
–40
–40
–50
–50
–60
–60
–70
–70
–80
–80
–90
–90
2Δ1
–100
–110
–120
3Δ1
–100
–110
–120
3Δ1
START 0Hz
STOP 1.1GHz
START 0Hz
RES BW 20kHz
STOP 1.1GHz
SWEEP 27.9s (1001 pts)
RES BW 20kHz
VBW 20kHz
SWEEP 27.9s (1001 pts)
VBW 2kHz
FUNCTION
WIDTH
FUNCTION
VALUE
FUNCTION
WIDTH
FUNCTION
VALUE
MODE TRC SCL
X
Y
FUNCTION
MODE TRC SCL
X
Y
FUNCTION
N
Δ1
Δ1
1
1
1
f
f
f
91MHz
–15.917dBm BAND POWER
(Δ) –66.430dB BAND POWER
(Δ) –67.401dB BAND POWER
6MHz
6MHz
6MHz
–15.919dBm
(Δ) –66.658dB
(Δ) –67.436dB
N
Δ1
Δ1
1
1
1
f
f
f
971MHz
(Δ) –89MHz
(Δ) –903.0MHz
–18.364dBm BAND POWER
(Δ) –63.858dB BAND POWER
(Δ) –70.065dB BAND POWER
6MHz
6MHz
6MHz
–18.364dBm
(Δ) –63.858dB
(Δ) –70.065dB
(Δ)
(Δ) 49MHz
(Δ) (Δ) 117.9MHz
Figure 104. Eight Carrier at 70 MHz Output
Figure 107. Eight Carrier at 950 MHz Output
Rev. 0 | Page 31 of 68
AD9119/AD9129
Data Sheet
IOUTFS = 33 mA, fDAC = 2.782 GSPS, nominal supplies, TA = 25°C, unless otherwise noted.
–40
–50
–60
–70
–80
–90
–40
–50
–60
–70
–80
–90
0
0.2
0.4
0.6
0.8
1.0
0
0.2
0.4
0.6
0.8
1.0
fOUT (GHz)
fOUT (GHz)
Figure 108. Second Harmonic vs. fOUT Performance for One DOCSIS Carrier
Figure 111. Third Harmonic vs. fOUT Performance for One DOCSIS Carrier
–40
–40
–50
–60
–70
–80
–90
–50
–60
–70
–80
–90
0
0.2
0.4
0.6
0.8
1.0
0
0.2
0.4
0.6
0.8
1.0
fOUT (GHz)
fOUT (GHz)
Figure 109. Second Harmonic vs. fOUT Performance for Four DOCSIS Carriers
Figure 112. Third Harmonic vs. fOUT Performance for Four DOCSIS Carriers
–40
–40
–50
–60
–70
–80
–90
–50
–60
–70
–80
–90
0
0.2
0.4
0.6
0.8
1.0
0
0.2
0.4
0.6
0.8
1.0
fOUT (GHz)
fOUT (GHz)
Figure 110. Second Harmonic vs. fOUT Performance for Eight DOCSIS Carriers
Figure 113. Third Harmonic vs. fOUT Performance for Eight DOCSIS Carriers
Rev. 0 | Page 32 of 68
Data Sheet
AD9119/AD9129
IOUTFS = 33 mA, fDAC = 2.782 GSPS, nominal supplies, TA = 25°C, unless otherwise noted.
–50
–55
–60
–65
–70
–75
–80
–85
–90
–50
–55
–60
–65
–70
–75
–80
–85
–90
ACP1
ACP2
ACP3
ACP4
ACP5
ACP1
ACP2
ACP3
ACP4
ACP5
0
0.2
0.4
0.6
0.8
1.0
0
0.2
0.4
0.6
0.8
1.0
fOUT (GHz)
fOUT (GHz)
Figure 117. 16-Carrier ACPR vs. fOUT
Figure 114. Single-Carrier ACPR vs. fOUT
–50
–55
–60
–65
–70
–75
–80
–85
–90
–50
–55
–60
–65
–70
–75
–80
–85
–90
ACP1
ACP2
ACP3
ACP4
ACP5
ACP1
ACP2
ACP3
ACP4
ACP5
1
2
3
4
5
6
7
8
9
0
0.2
0.4
0.6
0.8
1.0
fOUT (GHz)
fOUT (GHz)
Figure 115. Four-Carrier ACPR vs. fOUT
Figure 118. 32-Carrier ACPR vs. fOUT
–50
–55
–60
–65
–70
–75
–80
–85
–90
ACP1
ACP2
ACP3
ACP4
ACP5
0
0.2
0.4
0.6
0.8
1.0
fOUT (GHz)
Figure 116. Eight-Carrier ACPR vs. fOUT
Rev. 0 | Page 33 of 68
AD9119/AD9129
Data Sheet
IOUTFS = 33 mA, fDAC = 2.782 GSPS, nominal supplies, TA = 25°C, unless otherwise noted.
REF –20dBm
–40
–50
–60
–70
–80
–90
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
0
0.2
0.4
0.6
0.8
1.0
CENTER 77MHz
RES BW 10kHz
SPAN 60MHz
SWEEP 6.08s (1001 pts)
VBW 1kHz
fOUT (GHz)
Figure 119. Gap Channel ACLR at 77 MHz
Figure 120. Gap Channel ACLR vs. fOUT
Rev. 0 | Page 34 of 68
Data Sheet
AD9119/AD9129
TERMINOLOGY
Linearity Error (Integral Nonlinearity or INL)
The maximum deviation of the actual analog output from the
ideal output, determined by a straight line drawn from zero to
full scale.
Spurious-Free Dynamic Range
The difference, in decibels (dB), between the rms amplitude of
the output signal and the peak spurious signal over the specified
bandwidth.
Differential Nonlinearity (DNL)
The measure of the variation in analog value, normalized to full
scale, associated with a 1 LSB change in digital input code.
Total Harmonic Distortion (THD)
The ratio of the rms sum of the first six harmonic components
to the rms value of the measured input signal. It is expressed as
a percentage or in decibels (dB).
Monotonicity
A DAC is monotonic if the output either increases or remains
constant as the digital input increases.
Noise Spectral Density (NSD)
The converter noise power per unit of bandwidth. This is
usually specified in dBm/Hz in the presence of a 0 dBm full-
scale signal.
Offset Error
The deviation of the output current from the ideal of zero.
For IOUTP, 0 mA output is expected when the inputs are all 0s.
For IOUTN, 0 mA output is expected when all inputs are set to 1.
Adjacent Channel Leakage Ratio (ACLR)
The ratio, in dBc, between the measured power within a channel
relative to its adjacent channels.
Gain Error
The difference between the actual and ideal output span. The
actual span is determined by the output when all inputs are set
to 1 minus the output when all inputs are set to 0.
Adjacent Channel Power Ratio (ACPR)
The ratio, in dBc, between the total power of an adjacent channel
(intermodulation signal) to the main channel's power (useful
signal).
Output Compliance Range
The range of allowable voltage at the output of a current output
DAC. Operation beyond the maximum compliance limits may
cause either output stage saturation or breakdown, resulting in
nonlinear performance.
Modulation Error Ratio (MER)
A measure of the discrepancy between the average output
symbol magnitude and the rms error magnitude of the individual
symbol. Modulated signals create a discrete set of output values
referred to as a constellation, and each symbol creates an output
signal corresponding to one point on the constellation.
Temperature Drift
Specified as the maximum change from the ambient (25°C) value
to the value at either TMIN or TMAX. For offset and gain drift, the
drift is reported in ppm of full-scale range (FSR) per degree
Celsius (°C). For reference drift, the drift is reported in ppm per °C.
Intermodulation Distortion (IMD)
The result of two or more signals at different frequencies mixing
together. Many products are created according to the formula
aF1 bF2, where a and b are integer values.
Power Supply Rejection
The maximum change in the full-scale output as the supplies
are varied from nominal to minimum and maximum specified
voltages.
Rev. 0 | Page 35 of 68
AD9119/AD9129
Data Sheet
SERIAL COMMUNICATIONS PORT OVERVIEW
The AD9119/AD9129 are 11-bit/14-bit DACs that operate at an
update rate of up to 2.8 GSPS. Due to internal timing requirements,
the minimum allowable sample rate is 1400 MSPS. Input data is
sampled through two 11-/14-bit LVDS ports that are internally
multiplexed. Each port has its own data inputs, but both ports
share a common data clock input (DCI). The LVDS inputs meet
the IEEE-1596 specification with the exception of input hysteresis,
which is not guaranteed over all process corners. Each DCI input
runs at one-quarter the input data rate in a double data rate
(DDR) format. Each edge of the DCI is used to transfer data
into the AD9119/AD9129.
AD9129 and the system controller. Phase 2 of the communication
cycle is a transfer of one byte only. Single-byte data transfers are
useful to reduce CPU overhead when register access requires
one byte only. Registers change immediately upon writing to the
CS
last bit of each transfer byte.
each sequence of eight bits (except the last byte) to stall the bus.
CS
(chip select) can be raised after
The serial transfer resumes when
nonbyte boundaries resets the SPI.
is lowered. Stalling on
INSTRUCTION MODE (8-BIT INSTRUCTION)
The instruction byte is shown in the following table.
MSB
LSB
I0
The DACCLK_N and DACCLK_P inputs directly drive the
DAC core to minimize clock jitter. The DACCLK signal is
divided by 4 and then output as the DCO for each port. The
DCO signal can be used to clock the data source. The DAC
expects DDR LVDS data (P0_D[13:0]x, P1_D[13:0]x), with
each channel aligned with the single DDR DCI signal.
I7
I6
I5
I4
I3
I2
I1
R/W
A6
A5
A4
A3
A2
A1
A0
R/W, Bit 7 of the instruction byte, determines whether a read or
a write data transfer occurs after the instruction byte write.
Logic 1 indicates a read operation. Logic 0 indicates a write
operation, the data transfer cycle. A6 to A0 (Bit 6 through Bit 0
of the instruction byte) determine which register is accessed
during the data transfer portion of the communications cycle.
Control of the AD9119/AD9129 functions is via a SPI.
SERIAL PERIPHERAL INTERFACE (SPI)
The AD9119/AD9129 SPI is a flexible, synchronous serial
communications port, allowing easy interface to many
industry-standard microcontrollers and microprocessors. The
serial I/O is compatible with most synchronous transfer formats,
including the Motorola® SPI and the Intel® SSR protocols. The
interface allows read/write access to all registers that configure
the AD9119/AD9129. Most significant bit first (MSB-first) or
least significant bit first (LSB-first) transfer formats are supported.
The AD9119/AD9129 serial interface port can be configured as
a single I/O pin (SDIO) or two unidirectional pins for input/
output (SDIO and SDO).
SERIAL PERIPHERAL INTERFACE PIN
DESCRIPTIONS
SCLK—Serial Clock
The serial clock pin is used to synchronize data to and from the
AD9119/AD9129 and to run the internal state machines. The
maximum frequency of SCLK is 20 MHz. All data input to the
AD9119/AD9129 is registered on the rising edge of SCLK. All
data is driven out of the AD9119/AD9129 on the rising edge
of SCLK.
CS
—Chip Select
SDO (PIN J2)
Active low input starts and gates a communication cycle. It allows
more than one device to be used on the same serial communi-
cations lines. The SDO and SDIO pins go to a high impedance
state when this input is high. Chip select should stay low during
the entire communication cycle.
AD9119/
AD9129
SPI PORT
SDIO (PIN J1)
SCLK (PIN K1)
CS (PIN K2)
Figure 121. AD9119/AD9129 SPI Port
SDIO—Serial Data I/O
GENERAL OPERATION OF THE SPI
Data is always written into the AD9119/AD9129 on this pin.
However, this pin can be used as a bidirectional data line. The
configuration of this pin is controlled by Register 0x00, Bit 7
(SDIO_DIR). The default is Logic 1, which configures the SDIO
pin as bidirectional.
There are two phases to a communication cycle with the AD9119/
AD9129. Phase 1 is the instruction cycle, which is the writing of
an instruction byte into the AD9119/AD9129, coincident with
the first eight SCLK rising edges. The instruction byte provides
the AD9119/AD9129 serial port controller with information
about the data transfer cycle, which is Phase 2 of the communi-
cation cycle. The Phase 1 instruction byte defines whether the
upcoming data transfer is read or write and the starting register
address for the first byte of the data transfer. The first eight SCLK
rising edges of each communication cycle are used to write the
instruction byte into the AD9119/AD9129.
SDO—Serial Data Out
Data is read from this pin for protocols that use separate lines
for transmitting and receiving data. When the AD9119/AD9129
are operating in a single bidirectional I/O mode, this pin does
not output data and is set to a high impedance state.
The remaining SCLK edges are for Phase 2 of the communication
cycle. Phase 2 is the actual data transfer between the AD9119/
Rev. 0 | Page 36 of 68
Data Sheet
AD9119/AD9129
MSB/LSB TRANSFERS
INSTRUCTION CYCLE
DATA TRANSFER CYCLE
CS
SCLK
SDIO
The AD9119/AD9129 serial port can support both MSB-first
and LSB-first data formats. This functionality is controlled by
the LSB/MSB bit, Bit 6 in Register 0x00. The default is MSB first
(LSB/MSB = 0). When the MSB-first data format is selected, the
instruction and data bytes must be written from the most
significant bit to the least significant bit.
D0 D1 D2
D4 D5 D6 D7
0
N N N
R/W A0 A1 A2 A3 A4 A5 A6
0
0
0
Figure 124. Serial Register Interface Timing, LSB-First Write
When LSB/MSB = 1 (LSB first), the instruction and data bytes
must be written from the least significant bit to the most
significant bit.
INSTRUCTION CYCLE
DATA TRANSFER CYCLE
CS
SCLK
SDIO
SDO
SERIAL PORT CONFIGURATION
The AD9119/AD9129 serial port configuration is controlled
by Register 0x00, Bits[7:5]. Note that the configuration changes
immediately upon writing to the last bit of the register. When
setting the software reset bit (SoftReset in Register 0x00, Bit 5),
all registers are set to their default values except Register 0x00,
which remains unchanged.
D10 D20
D10 D20
D40 D5N D6N D7N
R/W A0 A1 A2 A3 A4 A5 A6
D0
D40 D5N D6N D7N
D0
Figure 125. Serial Register Interface Timing, LSB-First Read
In the event of unexpected programming sequences, the
AD9119/AD9129 SPI can become inaccessible. For example,
if user code inadvertently changes the LSB/MSB bit, the bits that
follow experience unexpected results. The SPI can be returned
to a known state by writing an incomplete byte (1 to 7 bits) of
all 0s, followed by three bytes of 0x00. This returns to the MSB-
first instructions (Register 0x00 = 0x00) so that the device can
be reinitialized.
tDS
tSCLK
CS
SCLK
SDIO
tDS
tDH
INSTRUCTION BIT 7
INSTRUCTION BIT 6
Figure 126. Timing Diagram for an SPI Register Write
INSTRUCTION CYCLE
DATA TRANSFER CYCLE
CS
CS
SCLK
SDIO
R/W A6 A5 A4 A3 A2 A1 A0 D7 D6 D5
D3 D2 D1 D0
0
SCLK
N
N
N
0
0
0
t
DNV
Figure 122. Serial Register Interface Timing, MSB-First Write
t
DV
I1
I0
D7
D6
D5
SDIO
INSTRUCTION CYCLE
DATA TRANSFER CYCLE
Figure 127. Timing Diagram for an SPI Register Read
CS
After the last instruction bit is written to the SDIO pin, the
driving signal must be set to a high impedance in time for the
bus to turn around. The serial output data from the AD9119/
AD9129 is enabled by the falling edge of SCLK. This causes the
first output data bit to be shorter than the remaining data bits,
as shown in Figure 127. To assure proper reading of data, read
the SDIO pin or the SDO pin before changing SCLK from low
to high. Due to the more complex multibyte protocol, multiple
AD9119/ AD9129 devices cannot be daisy-chained on the SPI bus.
SCLK
D6N D5N
D6N D5N
D30 D20 D10 D00
D30 D20 D10 D00
R/W A6 A5 A4 A3 A2 A1 A0
D7
SDIO
SDO
D7
Figure 123. Serial Register Interface Timing, MSB-First Read
CS
Control multiple DACs by using independent
signals.
Rev. 0 | Page 37 of 68
AD9119/AD9129
Data Sheet
THEORY OF OPERATION
The AD9119/AD9129 are 11-bit/14-bit DACs that are capable of
reconstructing signal bandwidths up to 1.4 GHz while operating
with an input data rate up to 2.8 GSPS. Figure 128 shows a top
level functional diagram of the AD9119/AD9129. A high perfor-
mance NMOS DAC delivers a signal dependent, differential
current to a balanced external load referenced a nominal 1.8 V
analog supply. The current source array of the DAC is referenced
This effectively reduces the bus interface speed to ½ the data
rate (for example, fDATA/2) with the DCI clock operating at fDATA/4.
An optional parity bit can also be sent along with the data to
enhance the robustness of the interface. In this case, a counter
is available to count parity errors and generate an interrupt
request (IRQ) when a programmable threshold is exceeded.
The AD9119/AD9129 provide the host with a DCO clock that is
equal to the DCI clock frequency to establish synchronous opera-
tion. A delay locked loop (DLL) with programmable phase offset
is used to generate an internal sampling clock with optimum edge
placement for the input data latches of the LVDS DDR receivers.
When data is latched into the AD9119/AD9129, an eight-sample-
deep FIFO is used to hand off the data between the host and the
AD9119/AD9129 clock domains. The FIFO can be reset with an
external synchronization signal, fSYNC, to ensure consistent pipeline
latency. The pipeline delay, from a sample being latched into the
data port to when it appears at the DAC output, varies depending
on the chosen configuration (see the Pipeline Delay (Latency)
section).
to an external −1.5 V supply, and its full-scale current, IOUTFS
can be adjusted over a 9.5 mA to 34.4 mA span.
,
RESET
IRQ
I250U VREF
AD9129
SDIO
SDO
CS
1.2V
SPI
SCLK
FRM_x
(FRAME/
PARITY)
MIX-
NORMAL MODE
BASEBAND
MODE
P0_D[13:0]P,
P0_D[13:0]N
IOUTP
IOUTN
Tx DAC
CORE
DLL
DCI_x
2×
P1_D[13:0]P,
P1_D[13:0]N
The de-interleaved data is reassembled into its original data stream
after passing into the internal clock domain of the AD9119/
AD9129. Because the quad-switch architecture of the DAC
updates its output on both the rising and falling edge (for example,
dual edge clocking) of the DACCLK signal, the following two
additional modes of operation are available:
PLL
CLOCK
DISTRIBUTION
DCR
DCO_x
DACCLK_x
•
A 2× interpolation filter can be selected to increase the
effective DAC update rate (fDAC) to be 2× the input data
rate, hence simplifying the analog postfiltering require-
ments and reducing the effects of alias harmonics in the
desired baseband region.
A Mix-Mode option essentially generates the complement
sample on the falling edge such that the original Nyquist
spectrum is shifted to fDACCLK, with the sinc null of the DAC
Figure 128. Functional Block Diagram of the AD9119/AD9129
A low jitter differential clock receiver is used to square up the
signal appearing at the DACCLK_x input that sets the update
rate of the DAC. The differential clock receiver can accept
sinusoidal signals with negligible noise spectral density degra-
dation if the input signal level is maintained above 0 dBm.
A +1 dB degradation occurs at a −5 dBm input, and degradation
increases as the signal approaches −10 dBm and its associated
+2 dB additional degradation. A duty cycle restorer (DCR),
following the clock receiver, ensures near 50% duty-cycle to the
subsequent circuitry. The output of the DCR serves as the
master clock and is routed directly to the DAC, as well as to a
clock distribution block that generates all critical internal and
external clocks. The clock source quality, as defined by its phase
noise characteristics, jitter, and drive capability, is an important
consideration in maintaining optimum ac performance.
•
falling at 2 × fDACCLK
.
The digital handoff between the digital domain and mixed signal
domain of a high speed DAC is critical in preserving its output
dynamic range. A phase locked loop (PLL) with programmable
phase offset is used to optimize the timing handoff between these
two clock domains. State machines are used to initialize both the
DLL and the PLL during the initial boot sequence after receiving
a stable DACCLK signal. Following initialization of the two loops,
they maintain optimum timing alignment over temperature, time,
and power supply variation. The AD9119/AD9129 also provide
IRQ capability to monitor the DLL, the PLL, and other internal
circuitry.
The AD9119/AD9129 supports a source synchronous, LVDS
double data-rate (DDR) data interface to the host processor.
Two 11-bit/14-bit LVDS data ports (P0_DxP, P0_DxN and
P1_Dx P, P 1 _ Dx N ) are used to sample de-interleaved data from
the host on the rising and falling edge of the host DCI clock.
Rev. 0 | Page 38 of 68
Data Sheet
AD9119/AD9129
The data timing requirements are defined by a minimum data
valid margin that is dependent on the data clock input skew,
input data jitter, and the variations of the DLL delay line across
delay settings. This margin is defined by subtracting from the
data period any data skew, data jitter, and the keep-out window
(KOW) that is defined by the sum of the set and hold times, as
follows:
LVDS DATA PORT INTERFACE
The AD9119/AD9129 can operate with input data rates of up to
2.8 GSPS. A source synchronous LVDS interface is used between
the host and the AD9119/AD9129 to achieve these high data rates,
while simplifying the interface. As shown in Figure 129, the host
feeds the AD9119/AD9129 with de-interleaved input data into
two 11-bit/14-bit LVDS data ports (P0_DxP, P0_DxN and
P1_DxP, P1_DxN) at ½ the DAC clock rate (that is, fDACCLK/2).
Along with the input data, the host provides an embedded DDR
data clock input (DCI_x) at fDACCLK/4.
t
DATA VALID MARGIN = tDATA PERIOD − tDATA SKEW − tDATA JITTER − (tH + tS)
The keep-out window, which is the sum of the set and hold times,
is the area where data transitions should not occur. The timing
margin allows tuning of the DLL delay setting, either automatically
or in manual mode (see Figure 130).
A DLL circuit that is designed to operate with DCI clock rates
of between 350 MHz and 700 MHz is used to generate a phase
shifted version of DCI, called the data sampling clock (DSC),
to register the input data on both the rising and falling edges.
Figure 130 shows that the ideal location for the DSC signal is 90°
out of phase from the DCI input. However, due to skew of the DCI
relative to the data, it may be necessary to change the DSC phase
offset to sample the data at the center of its eye diagram. The
sampling instance can be varied in discrete increments by offsetting
the nominal DLL phase shift value of 90° via Register 0x0A,
Bits[3:0]. The following equation defines the phase offset
relationship:
As shown in Figure 130, the DCI clock edges must be coincident
with the data bit transitions with minimum skew and jitter. The
nominal sampling point of the input data occurs in the middle
of the DCI clock edges because this point corresponds to the
center of the data eye. This is also equivalent to a nominal phase
shift of 90°of the DCI clock.
Phase Offset = 90° n × 11.25°, |n| < 8
HOST
PROCESSOR
AD9129
COMBINED
ODD/EVEN
PARITY BIT
OPTIONAL PARITY
EVEN DATA
SAMPLES
14 × 2
DELAY
LOCK
LOOP
f
= f /2
DACCLK
DATA
ODD DATA
SAMPLES
14 × 2
1 × 2
DCI
f
= f
/4
DCI
DACCLK
1 × 2
= f
DCO
CLOCK
fDACCLK
DISTRIBUTION
f
/4
DACCLK
DCO
Figure 129. Recommended Digital Interface Between the AD9119/AD9129 and the Host Processor
tDATA JITTER
tDSC SETUP AND HOLD
DLL PHASE
tDATA SKEW
DELAY
DATA EYE
INPUT DATA[13:0]
DCI
tDATA PERIOD
DATA SAMPLE CLOCK
Figure 130. LVDS Data Port Timing Requirements
Rev. 0 | Page 39 of 68
AD9119/AD9129
Data Sheet
Figure 131 shows the DSC set and hold times with respect to
the DCI signal and data signals.
Table 10 lists the values that are guaranteed over the operating
conditions. These values were taken with 50% duty cycle and
DCI swing of 450 mV p-p. For best performance, the duty cycle
variation should be kept below 5%, and the DCI input should
be as high as possible, up to 800 mV p-p.
DATA
DCI
Table 10. Data Port Set and Hold Time Window (Guaranteed)
DSC
Data Port Set and Hold Times (ps)
at DLL Phase
tS
tH
Frequency,
fDAC (MHz)
Time (ps)
−3
0
+3
Figure 131. LVDS Data Port Set and Hold Times
1600
tS
tH
tS
tH
tS
tH
−272
682
−168
564
−88
457
−489
911
−292
705
−185
559
−683
1120
−420
839
Table 11 shows the typical times for various DAC clock frequencies
that are required to calculate the data valid margin. The amount
of margin that is available for tuning of the DSC sampling point
can be determined using Table 11.
2300
2800
−285
652
Table 11. Data Port Set and Hold Time Window (Typical)
Data Port Set and Hold Times (ps) at DLL Phase
Frequency, Time
fDAC1 (MHz) (ps)
−6
−106 −205 −274 −353 −436 −523 −604 −680 −798
426 499 571 651 730 813 900 977 1069
−124 −197 −291 −351 −453 −524 −600 −670 −732
427 490 556 637 713 795 870 942 1025
−120 −191 −252 −335 −402 −495 −552 −626 −704
421 485 550 619 689 760 836 910 989
−111 −184 −226 −301 −370 −442 −528 −580 −641
−5
−4
−3
−2
−1
0
+1
+2
+3
+4
+5
+6
1400
1500
1600
1700
1800
1900
2000
2100
2200
2300
2400
2500
2600
2700
2800
tS
tH
tS
tH
tS
tH
tS
tH
tS
tH
tS
tH
tS
tH
tS
tH
tS
tH
tS
tH
tS
tH
tS
tH
tS
tH
tS
tH
tS
tH
−906
1152
−815
1100
−776
1049
−719
970
−993
1235
−908
1181
−847
1128
−784
1032
−709
1003
−663
963
−1064
1303
−982
1241
−902
1195
−822
1095
−765
1061
−700
1021
−660
958
−1131
1387
−1071
1320
−978
1250
−895
1151
−823
1122
−765
1070
−713
1015
−675
954
382
−93
400
−90
398
−82
389
−87
370
−94
415
−93
390
429
−133 −209 −265 −326 −401 −475 −524 −596
442 492 555 617 677 754 816 883
−139 −182 −254 −298 −359 −430 −496 −547
443 488 535 593 664 717 778 849
−122 −170 −220 −272 −346 −399 −452 −517
423 468 522 571 625 683 733 789
−133 −161 −206 −274 −331 −384 −443 −488
409 451 491 536 592 636 696 751
−143 −182 −245 −283 −334 −378 −427 −487
453 487 523 571 622 673 722 778
−131 −182 −227 −270 −312 −357 −388 −439
422 456 500 542 595 644 686 731
489
549
619
700
762
825
907
−646
950
−593
900
−565
854
−607
908
−540
794
−586
855
−623
911
−521
818
−565
859
−604
908
−659
956
−485
778
−531
821
−570
858
−623
902
−130 −156 −196 −244 −277 −313 −366 −404 −457
−496
769
−534
815
−560
862
−615
911
426
−73
370
−43
338
−54
316
−36
335
459
494
529
567
607
653
698
731
−106 −142 −177 −216 −258 −308 −348 −394
−430
702
−458
740
−486
780
−535
828
407
−76
369
−77
340
−72
355
433
−115 −145 −184 −228 −275 −306 −351
396 430 466 503 535 567 614
−108 −144 −179 −228 −277 −305 −336
372 406 441 475 499 539 580
−101 −143 −175 −208 −243 −287 −320
379 404 442 480 511 545 575
467
502
546
582
619
662
−375
652
−402
690
−443
725
−491
766
−354
622
−400
654
−424
685
−471
729
−347
607
−382
638
−408
676
−463
717
1 Table 11 shows characterization data for selected fDAC frequencies. Other frequencies are possible, and Table 11 can be used to estimate performance.
Rev. 0 | Page 40 of 68
Data Sheet
AD9119/AD9129
Maximizing the opening of the eye in both the DCI and data
signals improves reliability of the data port interface. Use differ-
ential controlled impedance traces of equal length (that is, delay)
between the host processor and the AD9119/AD9129 input. To
ensure coincident transitions with the data bits, implement the
DCI as an additional data line with an alternating (010101…)
bit sequence from the same output drivers that are used for
the data.
Before losing lock, the DLL controller issues a DLL warning by
setting Register 0x0E, Bit 6, to 1b and setting either Bit 5 or Bit 4
to 1b. This setting indicates that the DLL is near to losing lock. If
the DLL is going to reach the beginning of the delay line soon,
the controller issues a start warning by setting Register 0x0E, Bit 5
and Bit 6 to 1b. This setting indicates that the DLL is at the start
of the delay line, and losing lock is imminent.
USER DCI
For synchronous operation between the host and the AD9119/
AD9129, the AD9119/AD9129 provide a data clock output, DCO,
to the host at the same rate as DCI (that is, fDACCLK/4). Note that
the DCI signal can have arbitrary phase alignment with respect to
the DCO because the DLL of the AD9119/AD9129 ensures proper
data hand-off between the two clock domains (that is, the host
processors and the internal digital core of the AD9119/AD9129).
D0
USER DATA
D1
DATA
SAMPLE CLK
90°
DELAY LINE – COLD
DELAY LINE
– HOT
Figure 132. Example of DLL Length Variation Across Temperature
The default reset state of the AD9119/AD9129 is to have the
DCO signal disabled. To enable it, write a 1b to Register 0x0C,
Bit 6. The DCO output level is controlled in Register 0x7C,
Bits[7:6]. The default setting is 01b, or 2.8 mA, but it can be
increased to as high as 4 mA (11b) if higher swing is necessary.
A similar situation can happen at the end of the delay line, in
which case a DLL warning and a DLL end is issued. DLL end is
indicated when Register 0x0E, Bit 4 and Bit 6 are set to 1b.
In case of a DLL warning, action must be taken to prevent loss
of lock. On a start warning, reduce the minimum delay of the
delay line by removing one or several of the delay cells. This
can be accomplished by setting the bits in Registers 0x70 and
Register 0x71 to 0b. Begin by setting Bit 0 of Register 0x70 to 0b,
then Bit 1, and so on. In some cases, up to three delay cells may
need to be disabled. It is possible to disable up to six delay cells.
However, in most cases, none of the cells need to be disabled.
The situation varies, depending on the temperature range needed,
as well as the DACCLK signal rate used. The end warning case
is a theoretical possibility, but practical conditions normally
dictate that it is not reachable. If the end warning is reached, the
DLL must be relocked immediately. When doing initial lock (or
relock) of the DLL, all delay cells must be active, with all delay cell
bits in Register 0x70 and Register 0x71 set to 1b.
The DCI signal is ac-coupled internally; therefore, a possibility
exists that removing the DCI signal can cause DAC output chatter
due to randomness on the DCI input. To avoid this chatter, it is
recommended that the DAC output be disabled when the DCI
signal is not present. To do this, program the DAC output current
power-down bit in Register 0x01, Bit 6, to 1b. When the DCI signal
is again present, the DAC output can be enabled by programming
Register 0x01, Bit 6, to 0b. The DAC output powers up in ~2 µs.
The status of the DLL can be polled by reading the data status
register at Address 0x0E. Bit 0 indicates that the DLL is running
and attempting lock, and Bit 7 is set to 1b when the DLL is locked.
Bit 2 is set to 1b when a valid data clock is detected. The warning
bits in Address 0x0E, Bits[6:4] can be used as indicators that the
DAC may be operating in a nonideal location in the delay line.
Note that these bits are read at the SPI port speed, which is much
slower than the actual speed of the DLL. This means that these
bits can show only a snapshot of what is happening, rather than
giving real-time feedback.
Parity
The data interface can be continuously monitored by enabling
the parity bit feature in Register 0x5C, Bit 7, and configuring
the FRM_P, FRM_N pins (Pin K13 and Pin K14) as parity pins
by setting Register 0x07, Bits[1:0] = 1 dec. When this pin con-
figuration is used, the host sends a parity bit along with each data
sample. This bit is set according to the following formulas,
where n is the data sample that is being checked.
Temperature Effects
The length of the delay line varies slightly across the operating
temperature range, as the amount of delay through a delay cell
expands or contracts slightly due to the temperature change.
This can introduce a situation where the DLL may lock at one
temperature extreme and then approach an unlocked state as
the temperature changes (see Figure 132).
For even parity on the AD9129,
XOR[FRM(n), P0_D0(n), P0_D1(n), P0_D2(n), ..., P0_D13(n),
P1_D0(n), P1_D1(n), P1_D2(n), …, P1_D13(n)] = 0.
In the example shown in Figure 132, the DLL can lock at Phase
Setting 0 at 90° in a cold temperature. As the temperature gets
hotter, the delay line changes length, and the controller adjusts
the DLL control voltage to keep the 90° offset. In this case, a voltage
beyond the acceptable control voltage range is required to hold
the 90° phase offset.
For odd parity on the AD9129,
XOR[FRM(n), P0_D0(n), P0_D1(n), P0_D2(n), ..., P0_D13(n),
P1_D0(n), P1_D1(n), P1_D2(n), …, P1_D13(n)] = 1.
Rev. 0 | Page 41 of 68
AD9119/AD9129
Data Sheet
For the AD9119, the data port is 11-bit instead of 14-bit, so
P0_D11, P0_D12, P0_D13, P1_D11, P1_D12, and P1_D13 are
not used in the calculation of the parity bit. Thus, the parity bit
is calculated over 29 bits (including the frame/parity bit) for the
AD9129 and over 23 bits for the AD9119.
pin and more than one IRQ is enabled, check Register 0x06,
Bits[3:2] when an IRQ event occurs to determine whether the
IRQ was caused by a parity error. The IRQ can also be cleared
by writing 1b to Register 0x06, Bit 2 or Register 0x06, Bit 3.
The parity bit feature can also be used to validate the interface
timing. As described previously, the host provides a parity bit
with the data samples and configures the AD9119/AD9129 to
generate an IRQ. The user can then sweep the sampling instance
of the AD9119/AD9129 input registers to determine at what
point a sampling error occurs.
If a parity error occurs, the parity error counter (Register 0x5D
or Register 0x5E) is incremented. Parity errors on the bits that
are sampled by the rising edge of DCI increment the parity
rising edge error counter (Register 0x5D) and set the parity
error rising edge bit (Register 0x5C, Bit 0). Parity errors on the
bits that are sampled by the falling edge of DCI increment the
parity falling edge error counter (Register 0x5E) and set the
parity error falling edge bit (Register 0x5C, Bit 1). The parity
counter continues to accumulate until it is cleared, or until it
reaches a maximum value of 255. The count can be cleared by
writing 1b to Register 0x5C, Bit 5.
DIGITAL DATAPATH DESCRIPTION
Figure 133 provides a more detailed diagram of the AD9119/
AD9129 digital datapath. The 22-bit/28-bit datapath with
internal DDR clocking interfaces with the dual 11-bit/14-bit
input data ports. Because two 11-bit/14-bit samples are captured
on each clock edge of DCI, four consecutive samples are captured
per DCI clock cycle. Samples captured on the rising edge of DCI
propagate through the upper section at a rate of DACCLK/2
(DDR), and those captured on the falling edge propagate through
the lower section.
An IRQ can be enabled to trigger when a parity error occurs by
writing 1b to Register 0x04, Bit 2 for rising edge-based parity
detection or to Register 0x04, Bit 3 for falling edge-based parity.
The status of IRQ can be measured via Register 0x06, Bit 2 or
Register 0x06, Bit 3 or by using the IRQ pin. When using the IRQ
FIFO PH0
FIFO PH1
REG 0
REG 1
REG 2
REG 3
REG 4
REG 5
REG 6
REG 7
14
14
TO DAC
DECODE
FRAME
1
FRAME/
PARITY
28
14
14
INPUT
LATCH
PARITY/
SED LOGIC
MIX-MODE
2×
28
DATA
1
DCI
DLL
DACCLK/4
FIFO PH2
FIFO PH3
14
REG 0
REG 1
REG 2
REG 3
REG 4
REG 5
REG 6
REG 7
14
14
INPUT
LATCH
PARITY/
SED LOGIC
28
14
DACCLK/4
DACCLK/4 DIST.
FRAME
SPI FIFO ALIGN ACKNOWLEDGE
REG 0x11[6]
RESET
LOGIC
SPI FIFO ALIGN REQUEST
REG 0x11[7]
FIFO WRITE POINTER OFFSET
REG 0x12[2:0]
Figure 133. Digital Datapath of the AD9119/AD9129
Rev. 0 | Page 42 of 68
Data Sheet
AD9119/AD9129
After the input data has been captured, the data is passed through a
logic block that monitors and/or determines the signal integrity
of the high speed digital data interface. The optional parity check
is used to continuously monitor the digital interface on a sample-
per-sample basis, and the sample error detection (SED) can be
used to validate the input data interface for system debug/test
purposes. Note that the FRAME and PARITY signals share the
same pin assignment because the FRAME signal is typically
used during system initialization (for FIFO synchronization
purposes), and parity is used in normal operation.
The two preferred methods are use of the FRAME signal and
via a write sequence to the serial port. Before initializing the
FIFO data level, the LVDS DLL and the DAC clock PLL must be
locked.
The FRM_x input can be used to initialize the FIFO data level
value. First, set up the FRM_N and FRM_P pins for frame mode
(Register 0x07, Bits[1:0] = 2). Next, assert the FRAME signal
high for at least one DCI clock cycle. When the FRAME signal is
asserted in this manner, the write pointer is set to 4 (by default
or to the FIFO start level (Register 0x12, Bits[2:0])) the next
time the read pointer becomes 0 (see Figure 134).
FIFO Description
READ
The next functional block in the datapath is a set of four FIFOs
that are eight registers deep. The dual port data is clocked into
the FIFOs on both the rising and the falling edge of the DCI signal.
The FIFO acts as a buffer that absorbs timing variations between
the data source and DAC, such as the clock-to-data variation of
an FPGA or ASIC. For the greatest timing margin, maintain the
FIFO level near half full (that is, a difference of four between the
write and read pointers). The value of the write pointer determines
the FIFO register into which the input data is written, and the
value of the read pointer determines the register from which data
is read and fed into the data assembler. The write and read pointers
are updated every time new data is loaded and removed,
respectively, from the FIFO.
0
1
2
3
4
5
6
7
0
1
2
3
POINTER
FIFO WRITE RESETS
FRAME
WRITE
POINTER
3
4
5
6
7
0
1
2
4
5
6
7
Figure 134. Timing of the Frame Input vs. Write Pointer Value
To initialize the FIFO data level through the serial port, toggle
Bit 7 of Register 0x11 from 0b to 1b. When the write to the
register is complete, the FIFO data level is initialized.
The recommended procedure for a serial port FIFO data level
initialization is as follows:
1. Request FIFO level reset by setting Register 0x11, Bit 7,
to 1b.
2. Verify that the part acknowledges the request by ensuring
that Register 0x11, Bit 6, is set to 1b.
3. Remove the request by setting Register 0x11, Bit 7, to 0b.
4. Verify that the part drops the acknowledge signal by
ensuring that Register 0x11, Bit 6, is set to 0b.
Valid data is transmitted through the FIFO as long as the FIFO
does not overflow or become empty. Note that an overflow or
empty condition of the FIFO is the same as the write pointer and
read pointer being equal. When both pointers are equal, an
attempt is made to simultaneously read and write a single FIFO
register. This simultaneous register access leads to unreliable
data transfer through the FIFO and must be avoided by ensuring
that data is written to the FIFO at the same rate that data is read
from the FIFO, keeping the data level in the FIFO constant.
This condition must be met by ensuring that DCI is equal to
DACCLK/4 (or equivalently, DCO).
Monitoring the FIFO Status
The relative FIFO data levels can be read from Register 0x13
through Register 0x16 at any time. The FIFO data level reported
by the serial port is denoted as a 7-bit thermometer code of the
write counter state, relative to the absolute read counter being at 0.
Resetting the FIFO Data Level
FIFO initialization is required to ensure a four-sample spacing
and a deterministic pipeline latency. If the clocks are running
at power-up, the FIFO initializes to 50% full. The AD9119/
AD9129 has an internal delay that effectively offsets the FIFO
pointers by 2, such that the optimal FIFO data level of 4 (center)
reads back as 2 (0000011b) from Register 0x13 to Register 0x16.
To achieve this level, set Register 0x12 to 0x20 (hexadecimal) before
resetting the FIFO. This sets the read pointer to Level 2 and the
write pointer to Level 0.
For example, the FIFO data level of 2 is reported as a value of
0000011b in the status register. Adding the internal delay of 2 to
this value makes the reported FIFO level equal to 4. It should be
noted that, depending on the timing relationship between DCI
and the main DACCLK signal, the FIFO level value can be off by
a count of 1. Therefore, it is important that the difference
between the read and write pointers be maintained at ≥2.
Multiple DAC Synchronization
Synchronization of multiple AD9119/AD9129s implies that all
of the DAC outputs are time aligned to the same phase when all
devices are fed with the same data pattern (along with DCI) at
the same instance of time. FIFO initialization ensures that the
initial pipeline latency in the FIFO is set to four samples and
remains at this level, assuming that no process, voltage, or tem-
perature variations occur between the host and the AD9119/
AD9129 clock domains.
To maximize the timing margin between the DCI input and the
internal DAC data rate clock, initialize the FIFO data level before
beginning data transmission. The value of the FIFO data level
can be initialized in three ways: by resetting the device, by strobing
the FRM_x input, and via a write sequence to the serial port.
Rev. 0 | Page 43 of 68
AD9119/AD9129
Data Sheet
Figure 136 shows an example of two AD9119/AD9129 devices
that are synchronized to the same host (that is, FPGA and ASIC).
Note that, when the same resources are used to generate these out-
put signals, synchronization to a single host IC ensures minimum
data and DCI time skew between devices.
provide a DACCLK/8 signal. Using the SYNC output from each
DAC, enabled by Register 0x1A, Bit 4 = 1, the user can create
a simple phase detector with an external XOR gate.
DAC 1
SYNC
Even after FIFO initialization, a phase ambiguity exists between
the read pointers of each device because the read counter of each
device powers up in an arbitrary state. Therefore, the exact instance
when the respective write pointer is set to 4, after the FRAME
signal is asserted, also remains ambiguous. It is possible for the
read pointer of one device to reach its 0 count several clock
cycles before another device (see Figure 134).
XOR
DAC 2
SYNC
Figure 135. Example of Synchronization of Two DACs to
1 DACCLK Accuracy
Synchronization within a data sample requires insight into the
difference between the read pointers of the master and slave
devices, as well as the ability to vary the delay of the slave device(s)
within the host to compensate for initial offsets between devices.
It is possible to calculate how many data samples the slave device(s)
is offset from the master device for the following reasons:
By adjusting the internal delay (incrementing or decrementing
by one DACCLK cycle with each write to Register 0x1A, Bit 7 or
Bit 6, respectively), the user can align the DACCLKs inside the two
DACs to within 1 DACCLK cycle, when errors from the external
phase detector, low-pass filter, and delay differences are taken
into account. The existing phase position can be read from
Register 0x1A, Bits[2:0]. Align the SYNC outputs first, then reset
the FIFOs on each DAC to ensure that proper sync is achieved.
•
•
•
•
The pipeline delay of each device is the same after FIFO
initialization.
The read counter of each device is derived from the same
phase aligned DACCLK source.
The state of the read counters of each device is sampled at
the same instance in time via the FRAME signal.
The readback value (Register 0x12[6:4]) is normalized to
a data sample (that is, a DACCLK period).
This calibration must be performed at each power-up because
the FIFOs can be reset to any of four levels based on the divide-
by-4 output of the clock distribution block (see Figure 133). For
example, a FIFO reset to Level 2 could have an actual FIFO level
of 1.5, 1.75, 2, or 2.25, based on the location of the div-by-4 clock
edge. Adjusting the SYNC signals to align with each other
eliminates this ambiguity.
By calculating the difference between the read pointer settings
of the master and slave devices, the user can advance or delay
the data stream of the slave device within the FPGA. Because
this difference can be up to 4 data samples, the FPGA must
provide this adjustment range for DAC synchronization alone.
Note that additional range must be added to compensate for any
other system delay variation.
When the two DACs are aligned, the drift over temperature and
supply voltage of the DACCLK signal of one DAC, relative to
another DAC, is expected to be no more than 450 ps.
The DCO signal is derived from the SYNC signal such that if
the SYNC signal is adjusted by a DACCLK cycle, the DCO
signal must also be adjusted by the same amount.
In addition to synchronizing to the data sample level, the AD9119/
AD9129 can enable synchronization to the DACCLK level (see
Figure 135). A 1.8 V CMOS output pin, SYNC, can be used to
When all adjustments of the SYNC signal are complete, it is
recommended to disable the SYNC output by programming
Register 0x1A, Bit 4 = 0, to eliminate a possible source of clock
spurious signals.
MATCHED
DELAYS
COMMON
CLOCK
SOURCE
1.4GHz
TO
2.8GHz
0+ dBm
DCI
ADCLK925
DCO_x
DACCLK
AD9129
MASTER
DCI_x
FRM_x
0+ dBm
FPGA
DCI_x
FRM_x
DACCLK
AD9129
SLAVE
DCO_x
Figure 136. Example of Synchronization of Two DACs to One FPGA
Rev. 0 | Page 44 of 68
Data Sheet
AD9119/AD9129
5
0
Data Assembler and Signal Processing Modes
–5
The data assembler reconstructs the original sample sequence.
It consists of a 4:1 multiplexer operating at fDACCLK. Each of the
four FIFOs provides a sample that is now referenced to the
internal clock domain of the AD9119/AD9129, fDACCLK. The
reconstructed sample sequence can be directed to the DAC
decode logic or undergo additional signal processing. In 2×
interpolation mode, a FIR filter is used to generate a new data
sample that is inserted between each sample, such that it can
update the DAC decode logic on the falling edge of DACCLK.
In Mix-Mode, the complement of each data sample is generated
and inserted after it, such that it also updates the DAC in a similar
manner. The 2× interpolator can be used with Mix-Mode enabled.
–10
–15
–20
–25
–30
–35
–40
–45
–50
0
500
1000
1500
2000
2500
FREQUENCY (MHz)
Figure 137. FIR25 2× Interpolation Filter Plot, Complete Frequency Response;
2× Digital Filter
fDAC = 2.5 GHz
The AD9119/AD9129 include a bypassable 2× half-band
interpolation filter to help simplify the analog reconstruction
filter. The filter has the potential benefit of minimizing the
impact of folded back harmonics in the desired baseband
region. The filter operates in a dual-edge clocking mode, where
it generates a new interpolated sample value for every alternate
DACCLK edge. This effectively increases the DAC update rate
to 2 × fDACCLK with the DAC’s sinc response null moving from
1.0
0.5
0
–0.5
–1.0
–1.5
–2.0
fDACCLK to 2 × fDACCLK.
There are two different filters, FIR25 and FIR40, that can be
chosen using Register 0x18, Bit 5, when the 2× interpolator is
enabled with Register 0x18, Bit 7.
The FIR25 half-band filter provides 25 dB of stop-band rejection.
Its response is shown in Figure 137. Coefficients were optimized
for practical implementation purposes with the notion that the
0.5 dB pass-band ripple effects on a multicarrier application
(for example, DOCSIS) can be compensated by the digital host
adjusting individual channel powers. Note that the worst-case
tilt across any 6 MHz channel is less than −0.05 dB.
0
200
400
600
800
1000
1200
FREQUENCY (MHz)
Figure 138. FIR25 2× Interpolation Filter Plot, Pass-Band Ripple; fDAC = 2.5 GHz
5
0
–5
The FIR40 half-band filter provides 40 dB of stop-band rejection,
and its response is shown in Figure 139. Coefficients were
chosen to reduce pass-band ripple and increase out-of-band
rejection for multicarrier applications (for example, DOCSIS).
As a result, the frequency response has a flatter in-band response
and a sharper transition region, and the trade-off is a higher phase
count, leading to higher pipeline delay and higher power
consumption. The two filters are compared in Table 12.
–10
–15
–20
–25
–30
–35
–40
–45
–50
–55
–60
Table 12. Features of the Two 2× Interpolation Filters
Filter
FIR25
FIR40
Ripple (dB)
Attenuation (dB)
Power (mW)
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0.5
0.1
25
40
150
450
NORMALIZED FREQUENCY (×π RAD/Sample)
Figure 139. FIR40 2× Interpolation Filter Plot, Complete Frequency Response
A duty cycle restore circuit follows the DACCLK clock receiver
to minimize impact of duty cycle errors on image rejection.
Rev. 0 | Page 45 of 68
AD9119/AD9129
Data Sheet
1.0
To ensure repeatable pipeline delay over multiple power-up cycles,
the SYNC output of the DAC must be aligned with a known system
sync reference. Follow a calibration process that is similar to the
multiple DAC sync process (see the Multiple DAC Synchronization
section for more information) after each power-up event to align
the DAC to the system sync reference.
0.5
0
–0.5
–1.0
–1.5
–2.0
–2.5
–3.0
Power-Up Time
The AD9119/AD9129 have a power-down register (Register 0x01)
that enables the user to power down various portions of the DAC.
The power-up time for several usage cases is shown in Table 14.
The recommended way to power up the AD9119/AD9129 is
to power up all parts of the circuit with IREF disabled (by setting
Register 0x01, Bit 6 = 1b), and then enable IREF by programming
Register 0x01, Bit 6 = 0b.
0
0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50
NORMALIZED FREQUENCY (×π RAD/Sample)
Figure 140. FIR40 2× Interpolation Filter Plot, Pass-Band Ripple
Pipeline Delay (Latency)
Table 14. Power-Up Times for Several Usage Cases
The pipeline delay, or latency, of the AD9129 varies, based on
the configuration that is chosen and can be calculated using the
following formula:
State
Register State
Time (μs)
Power-Up
Clock Path Up
Wake-Up
From 0x01 = 0xEF to 0x01 = 0x08
From 0x01 = 0x0C to 0x01 = 0x08
From 0x01 = 0x48 to 0x01 = 0x08
250
220
2
Pipeline_Total = Pipeline_Delay + 2×_Delay
+ Group_Delay + FIFO_Level
INTERRUPT REQUESTS
The values listed in Table 13 can be used, depending on the
mode of operation that is selected.
The AD9119/AD9129 can provide the host processor with an
interrupt request output signal (IRQ), indicating that one or
more of the following events has occurred:
Table 13. Pipeline Delay Values for Each Block
One of the clock controllers has established or lost lock.
A parity error has occurred.
A sample error detection status or result is ready.
The FIFO is nearing an overwrite status.
Pipeline
Delay
Group
Delay
Total
Pipeline
Total
Delay
Mode
(fDAC cycles) (fDAC cycles) (fDAC cycles) (fDAC cycles)
No 2× filter
With FIR25
With FIR40
74
43
67
N/A
2
9
74
117
141
74
119
150
The IRQ output signal is an active low output signal that is available
on the IRQ pin (Pin H2). If used, connect the output to VDD via
a 10 kΩ pull-up resistor.
The terms used in Table 13 are defined as follows:
Pipeline delay is the time from DAC code latched until the
DAC output begins to move.
Each IRQ is enabled by setting the enable bits in Register 0x03
and Register 0x04 that have the same bit mapping as the IRQ
status bits in Registers 0x05 and Register 0x06. If an interrupt bit
is not enabled, a read request of that bit shows a direct readback
of the current state of the source. Thus, a read request of either
register shows the current state of all eight interrupts in that
register, regardless of whether each individual bit is actually
enabled to generate an interrupt. When an interrupt bit is enabled,
it captures a rising edge of the interrupt source and holds it,
even if the source subsequently returns to its zero state. It is
possible, for example, for the retimer lost interrupt enable and
retimer lock interrupt enable status bits (Register 0x03[1:0],
respectively) to be set when a controller temporarily loses lock
but then reestablishes lock before the IRQ is serviced by the host.
In such a case, the host should validate the present status of the
suspect block by reading back its current status bits. Based on
the status of these bits, the host can take appropriate action, if
required.
Group delay is the time for the maximum amplitude pulse
to reach the DAC output, as compared to the first time the
output moves.
No 2× filter is the base pipeline delay, including data
interface, analog circuitry (six cycles), and data FIFO at
half-full/Position 3.
FIR25 is the 2× interpolator with 25 dB of out-of-band
rejection.
FIR40 is the 2× interpolator with 40 dB of out-of-band
rejection.
Note that the values for pipeline delay apply in both normal
mode and Mix-Mode. After the total delay through the digital
blocks is calculated, add the FIFO level to that delay to find the
total pipeline delay. Note that the pipeline delay can be considered
fixed, with the only ambiguity being the FIFO state. The FIFO
state can be initialized as part of the startup sequence to ensure
a four sample spacing and, therefore, a fixed pipeline delay, or
deterministic latency (see the Resetting the FIFO Data Level
section for more information).
Rev. 0 | Page 46 of 68
Data Sheet
AD9119/AD9129
The IRQ pin responds only to those interrupts that are enabled. To
clear an IRQ, it is necessary to write a 1b to the bit in Register 0x05
or Register 0x06 that caused the interrupt. See Figure 141 for
a detailed diagram of the interrupt circuitry.
interrupt enable bit (Register 0x03[0]) can be set, and the IRQ
output signal can be monitored to determine when lock is
established, before continuing in a similar manner with the data
receiver controller. Clear the relevant lock bit, after locking, before
continuing to the next controller. When all of the controllers are
locked, set the appropriate lost lock enable bits in Register 0x03
to continuously monitor the controllers for loss of lock.
The IRQ can also be used during the AD9119/AD9129
initialization phase after power-up to determine when the
retimer PLL and data receiver controllers achieve lock. For
example, before enabling the retimer PLL, the retimer lock
WRITE 1b TO
REQUEST BIT
SINGLE IRQ BIT
R
IRQ ENABLE
IRQ ENABLE
IRQ PIN
D
Q
IRQ REQUEST
IRQ ENABLE
SOURCE
Figure 141. Interrupt Request Circuitry
Table 15. Interrupt Request Registers
Addr (Hex) Bit Bit Name
Description
0x05
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
FIFO_Warn2 interrupt status
FIFO_Warn1 interrupt status
SPIFrmAck interrupt status
Reserved
Indicates that the FIFO is within two slots of overwrite
Indicates that the FIFO is within one slot of overwrite
Indicates acknowledgement that the SFrmReq bit has changed from 0b to 1b
Reserved
DLL warn interrupt status
DLL lock interrupt status
Retimer lost interrupt status
Retimer lock interrupt status
Reserved
Indicates that the DLL is close to coming unlocked and action is needed
Indicates that the DLL is now locked
Indicates that the retimer PLL is no longer locked
Indicates that the retimer PLL is now locked
Reserved
0x06
AED pass interrupt status
AED fail interrupt status
SED fail interrupt status
Parity error falling edge status
Parity error rising edge status
Reserved
Indicates that the AED logic has captured eight valid samples
Indicates that the AED logic has detected a miscompare
Indicates that the SED logic has detected a miscompare
Indicates a parity fault due to data captured on the falling edge
Indicates a parity fault due to data captured on the rising edge
Reserved
Reserved
Reserved
Rev. 0 | Page 47 of 68
AD9119/AD9129
Data Sheet
INTERFACE TIMING VALIDATION
The AD9119/AD9129 provide on-chip sample error detection
(SED) circuitry that simplifies verification of the input data
interface. The SED compares the input data samples captured
at the digital input pins with a set of comparison values. The
comparison values are loaded into registers through the SPI port.
Differences between the captured values and the comparison
values are detected and stored.
The compare pass bit is set if the last comparison indicates that
the sample is error free. The compare fail bit is set if an error is
detected. The compare fail bit is automatically cleared by the
reception of eight consecutive error-free comparisons. When
autoclear mode is enabled, Register 0x51 through Register 0x58
accumulate errors as previously described but reset to all 0s after
eight consecutive error-free sample comparisons are made.
The sample error, compare pass, and compare fail flags can be
configured to trigger an IRQ when active, if desired. This is
accomplished by enabling the appropriate bits in the event flag
register (Register 0x06, Bit 4, Bit 5, and Bit 6).
SAMPLE ERROR DETECTION (SED) OPERATION
The SED circuitry operates on a data set made up of eight
11-bit/14-bit input words, denoted as R0L, R1L, R0H, R1H,
F0L, F1L, F0H, and F1H. These represent the rising edge and
falling edge data of Data Port 0 and Data Port 1. (The AD9119/
AD9129 use both edges of the DCI clock to sample data on each
input port.) To properly align the input samples, the rising edge
data-words of the data ports (that is, RxL and RxH) are indicated
by asserting the FRAME signal for a minimum of two complete
input samples.
SED EXAMPLE
Normal Operation
The following example illustrates the SED configuration for
continuously monitoring the input data and assertion of an IRQ
when a single error is detected.
1. Write to the following registers to load the comparison values:
a) Register 0x51: SED Patt/Err R0L, Bits[7:0].
b) Register 0x52: SED Patt/Err R0H, Bits[13:8].
c) Register 0x53: SED Patt/Err R1L, Bits[7:0].
d) Register 0x54: SED Patt/Err R1H, Bits[13:8].
e) Register 0x55: SED Patt/Err F0L, Bits[7:0].
f) Register 0x56: SED Patt/Err F0H, Bits[13:8].
g) Register 0x57: SED Patt/Err F1L, Bits[7:0].
h) Register 0x58: SED Patt/Err F1H, Bits[13:8].
i) Comparison values can be chosen arbitrarily;
however, choosing values that require frequent
bit toggling provides the most robust test.
Figure 142 shows the input timing of the interface in word mode.
The FRAME signal can be issued once at the start of the data
transmission, or it can be asserted repeatedly at intervals coinciding
with the RxL and RxH data-words.
DCI
FRAME
P0[7:0]
P0[13:8]
P1[7:0]
R0L
F0L
R0H
R1L
F0H
F1L
2. Enable the SED error detect flag to assert the IRQ pin.
a) Register 0x04: set to 0x10.
3. Begin transmitting the input data pattern.
4. Write three times to Register 0x50 to enable the SED.
a) Register 0x50: set to 0x80.
P1[13:8]
R1H
F1H
Figure 142. Timing Diagram of FRAME Signal Required to Align Input Data
for SED
The SED has three flag bits (Register 0x50, Bit 0, Bit 1, and Bit 2)
that indicate the results of the input sample comparisons. The
SED fail bit (Register 0x50, Bit 0) is set when an error is detected
and remains set until cleared. The SED also provides registers that
indicate which input data bits experienced errors (Register 0x51
through Register 0x58). These bits are latched and indicate the
accumulated errors detected until cleared. To clear the SED
registers, write 1b to Register 0x50, Bit 6.
b) Register 0x50: set to 0xC0.
c) Register 0x50: set to 0x80.
If IRQ is asserted, read Register 0x50 and Register 0x51 through
Register 0x58 to verify that a SED error is detected and determine
which input bits are in error. The bits in Register 0x51 through
Register 0x58 are latched. This means that the bits indicate any
errors that occur on those bits throughout the test and not just
the errors that caused the error detected flag to be set.
The autosample error detection (AED) mode is an autoclear
mode that has the following two effects:
•
AED mode activates the AED fail bit and the AED pass bit
(Register 0x50, Bit 1 and Bit 2).
•
AED mode changes the behavior of Register 0x51 through
Register 0x58.
Rev. 0 | Page 48 of 68
Data Sheet
AD9119/AD9129
ANALOG INTERFACE CONSIDERATIONS
When Mix-Mode is used, the output is effectively chopped at
the DAC sample rate. This has the effect of reducing the power
of the fundamental signal while increasing the power of the
images centered around the DAC sample rate, thus improving
the dynamic range of these images.
ANALOG MODES OF OPERATION
The AD9119/AD9129 use the quad-switch architecture shown in
Figure 143. Only one pair of switches is enabled during a half-clock
cycle, thus requiring each pair to be clocked on alternative clock
edges. A key benefit of the quad-switch architecture is that it masks
the code-dependent glitches that occur in the conventional two-
switch DAC architecture.
INPUT
DATA
D
D
D
D
D
D
D
D
D
D
10
1
2
3
4
5
6
7
8
9
DACCLK_x
D3
–D8
DACCLK_x
IOUTP
IOUTN
CLK
D2
D4
–D7
–D9
V
V
V
V
1
2
3
4
G
G
G
D1
D5
–D6
–D10
FOUR-SWITCH
DAC OUTPUT
(fS MIX-MODE)
t
LATCHES
V
1
V
2
V
3
V 4
G
G
G
G
D6
–D5
D10
–D1
–D2
–D4
D7
D9
Px_D[13:0]x
G
–D3
D8
Figure 145. Mix-Mode Waveform
This ability to change modes provides the user the flexibility to
place a carrier anywhere in the first three Nyquist zones, depending
on the operating mode selected. Switching between baseband
and Mix-Mode reshapes the sinc roll-off inherent at the DAC
output. In baseband mode, the sinc null appears at fDACCLK
because the same sample latched on the rising clock edge is also
latched again on the falling clock edge, thus resulting in the
same ubiquitous sinc response of a traditional DAC. In Mix-
Mode, the complement sample of the rising edge is latched on
V
SSA
Figure 143. Quad-Switch Architecture
In two-switch architecture, when a switch transition occurs and
D1 and D2 are in different states, a glitch occurs. But, if D1 and
D2 happen to be at the same state, the switch transitions, and no
glitches occur. This code-dependent glitching causes an increased
amount of distortion in the DAC. In quad-switch architecture
(no matter what the codes are), there are always two switches
that are transitioning at each half-clock cycle, thus eliminating
the code-dependent glitches but, in the process, creating a constant
glitch at 2 × DACCLK. For this reason, a significant clock spur
at 2 × fDACCLK is evident in the DAC output spectrum.
INPUT
the falling edge, therefore pushing the sinc null to 2 × fDACCLK
.
Figure 146 shows the ideal frequency response of both modes
with the sinc roll-off included.
FIRST
NYQUIST ZONE
SECOND
NYQUIST ZONE
THIRD
NYQUIST ZONE
D
D
D
D
D
D
D
D
D
D
1
2
3
4
5
6
7
8
9
10
DATA
0
–5
MIX-MODE
DACCLK_x
–10
–15
–20
–25
–30
–35
D
D
D
3
D
D
t
t
1
2
4
5
TWO-SWITCH
DAC OUTPUT
D
D
D
D
D
6
7
8
9
10
BASEBAND
MODE
FOUR-SWITCH
DAC OUTPUT
(NORMAL MODE)
D
D
D
D
D
10
6
7
8
9
D
D
D
D
D
5
1
2
3
4
Figure 144. Two-Switch and Quad-Switch DAC Waveforms
0
0.25
0.50
0.75
1.00
1.25
1.50
As a consequence of the quad-switch architecture enabling
updates on each half-clock cycle, it is possible to operate that
DAC core at 2× the DACCLK rate if new data samples are latched
into the DAC core on both the rising and falling edge of the
DACCLK. This notion serves as the basis when operating the
AD9119/AD9129 in either Mix-Mode or with the 2× interpo-
lation filter enabled. In each case, the DAC core is presented
with new data samples on each clock edge, albeit in Mix-Mode;
the falling edge sample is simply the complement of the rising
edge sample value.
NORMALIZED FREQUENCY RELATIVE TO fDACCLK (Hz)
Figure 146. Sinc Roll-Off for Baseband Mode and Mix-Mode Operation
The quad-switch can be configured via SPI (Register 0x19, Bit 0)
to operate in either baseband mode (0b) or Mix-Mode (1b).
Rev. 0 | Page 49 of 68
AD9119/AD9129
Data Sheet
A clock control register exists at Address 0x30. This register can
be used to enable automatic duty cycle correction (Bit 1), enable
zero-crossing control (Bit 6), and set the zero-crossing point
(Bits[5:2]). Recommended settings for this register are listed in
the recommended start-up sequence section (see the Start-Up
Sequence section).
CLOCK INPUT
The AD9119/AD9129 contain a low jitter, differential clock
receiver that is capable of interfacing directly to a differential
or single-ended clock source. Because the input is self-biased to
a nominal midsupply voltage of 1.25 V with a nominal impedance
of 10 kΩ//2 pF, it is recommended that the clock source be
ac-coupled to the DACCLK_x input pins with an external
differential load of 100 Ω. When the nominal differential input
span is 1 V p-p, the clock receiver can operate with a span that
ranges from 250 mV p-p to 2.0 V p-p.
PLL
The DACCLK_x input goes to a high frequency PLL to ensure
robust locking of the DAC sample clock to the input clock. The
PLL is enabled by default such that the PLL locks upon power-up.
The PLL (or DAC clock retimer) control registers are located at
Register 0x33 and Register 0x34. Register 0x33 enables the user
to set the phase detector phase offset level (Bits[7:4]), clear the PLL
lost lock status bit (Bit 3), choose the PLL divider for optimum per-
formance (Bit 2), and choose the phase detector mode (Bits[1:0]).
These settings are determined during product characterization
and are given in the recommended start-up sequence (see the
Start-Up Sequence section). It is not normally necessary to change
these values, nor is the product characterization data valid on
any settings other than the recommended ones. Register 0x34 is
used to reset the PLL, should that become necessary.
TO DAC
AND DLL
DACCLK_P
DACCLK_N
DUTY CYCLE
RESTORER
5kΩ
5kΩ
25µA
1.25V
50kΩ
Figure 147. Clock Input
The quality of the clock source, as well as its interface to the
AD9119/AD9129 clock input, directly impacts ac performance.
Select the phase noise and spur characteristics of the clock source
to meet the target application requirements. Phase noise and
spurs at a given frequency offset on the clock source are directly
translated to the output signal. It can be shown that the phase noise
characteristics of a reconstructed output sine wave are related to
the clock source by 20 × log10 (fOUT/fCLK) when the DAC clock
path contribution is negligible. (The wideband noise is not
dominated by the thermal and quantization noise of the DAC.)
At DACCLK = 2.8 GSPS, the lock time is about 10 µs. In most
situations, no action is required with the PLL. If the DACCLK
is changed and, especially, if it is changed multiple times, as in
a frequency hopping application, a phase slip or glitch may be
caused by the change in frequency, and it may become necessary
to reset the PLL. This can be checked by reading the PLL retimer
lost lock bit (Register 0x35, Bit 6). If that is the case, toggle the
PLL reset bit by programming Register 0x34, Bit 3, high and then
low. In addition, clear the PLL retimer lost lock bit by writing 0b
to Register 0x35, Bit 6. PLL lock can be verified by reading the
PLL lock bit at Register 0x35, Bit 7. It is possible to use the IRQ
registers to set an interrupt for these events. See the Interrupt
Requests section for more details.
Figure 148 shows a clock source based on the ADF4350 low phase
noise/jitter PLL. The ADF4350 can provide output frequencies
from 140 MHz up to 4.4 GHz with jitter as low as 0.5 ps rms. Its
squared-up output level can be varied from −4 dBm to +5 dBm,
allowing further optimization of the clock drive level.
AD9129
ADF4350
2.4nF
DACCLK_P
N
DIV-BY-2
N = 0 – 4
100Ω
PLL
VCO
2.4nF
DACCLK_N
fREF
0.8GHz TO 2.8GHz
1V p-p
Figure 148. Possible Signal Chain for DACCLK_x Input
Rev. 0 | Page 50 of 68
Data Sheet
AD9119/AD9129
VOLTAGE REFERENCE
I
= 9.5mA – 34mA
OUTFS
The AD9119/AD9129 output current is set by a combination of
digital control bits and the I250U reference current, as shown in
Figure 149.
(9/17) × I
OUTFS
I
=
PEAK
(8/17) × I
AC
OUTFS
AD9129
FSC[9:0]
V
BG
1.0V
(9/17) × I
OUTFS
DAC
VREF
I250U
–
+
CURRENT
SCALING
1nF
Figure 150. Equivalent DAC Output Circuit
I
FULLSCALE
4kΩ
The example shown in Figure 150 can be modeled as a pair of
dc current sources that source a current of 9/17 × IOUTFS to each
output. A differential ac current source, IPEAK, is used to model
the signal (that is, a digital code) dependent nature of the DAC
output. The polarity and signal dependency of this ac current
source is related to the digital code (F) by the following equation:
I250
V
SSA
Figure 149. Voltage Reference Circuit
The reference current is obtained by forcing the band gap
voltage across an external 4.0 kΩ resistor from I250U (Pin A1)
to ground. The 1.0 V nominal band gap voltage (VREF) generates
a 250 µA reference current in the 4.0 kΩ resistor. Note the
following constraints when configuring the voltage reference
circuit:
F (code) = (DACCODE − 8192)/8192
−1 < F (code) < +1
(2)
(3)
where DACCODE = 0 to 16,383 (decimal).
•
•
•
Both the 4.0 kΩ resistor and 1 nF bypass capacitor are
required for proper operation.
Because IPEAK can swing (8/17) × IOUTFS, the output currents
that are measured at IOUTP and IOUTN can span from
IOUTFS/17 to IOUTFS. However, because the ac signal-dependent
current component is complementary, the sum of the two
outputs is always constant (that is, IOUTP + IOUTN =
(18/17) × IOUTFS).
Adjusting the DAC output full-scale current, IOUTFS, from
its default setting of 20 mA should be performed digitally.
The AD9119/AD9129 are not multiplying DACs. Modula-
tion of the reference current, I250U, with an ac signal is not
supported.
The band gap voltage appearing at the VREF pin must be
buffered for use with an external circuitry because its output
impedance is approximately 7.5 kΩ.
The code-dependent current that is measured at the IOUTP
(and IOUTN) output is as follows:
•
•
IOUTP = (9/17) × IOUTFS (mA) + (8/17) × IOUTFS (mA)
× F (code)
(4)
An external reference can be used to overdrive the internal
reference by connecting it to the VREF pin.
IOUTN = (9/17) × IOUTFS (mA) − (8/17) × IOUTFS (mA)
× F (code)
As mentioned, the IOUTFS can be adjusted digitally over a 9.4 mA
to 34.2 mA range by the FSC_x[9:0] bits (Register 0x20, Bits[7:0]
and Register 0x21, Bits[1:0]). The following equation relates
Figure 151 shows the IOUTP vs. DACCODE transfer function
when IOUTFS is set to 19.65 mA.
20
IOUTFS to the FSC_x[9:0] bits, which can be set from 0 to 1023.
18
16
14
12
10
8
I
OUTFS = 24.21875 mA × FSC_x[9:0]/1000 + 9.4 mA
(1)
Note that the default value of 0x200 generates 21.937 mA full scale,
but most of the characterization presented in this datasheet uses
33 mA, unless noted otherwise.
ANALOG OUTPUTS
Equivalent DAC Output and Transfer Function
6
The AD9119/AD9129 provide complementary current outputs,
IOUTP and IOUTN, that sink current from an external load
that is referenced to the 1.8 V VDDA supply. Figure 150 shows
an equivalent output circuit for the DAC. Compared to most
current output DACs of this type, the outputs of the AD9119/
AD9129 exhibit a slight offset current (that is, IOUTFS/17), and the
peak differential ac current is slightly below IOUTFS/2 (that is,
8/17 × IOUTFS).
4
2
0
0
4096
8192
12,288
16,384
DAC CODE
Figure 151. Gain Curve for FSC_x[9:0] = 512, DAC Offset = 1.228 mA
Rev. 0 | Page 51 of 68
AD9119/AD9129
Data Sheet
Peak DAC Output Power Capability
Figure 152 shows the AD9119/AD9129 interfacing to the JTX-2-
10T transformer. This transformer provides excellent amplitude/
phase balance (that is, <1 dB/1°) up to 1 GHz while providing
a 0 Ω D dc bias path to VDDA. If filtering of the DAC images
and clock components is required, applying an analog LC filter
on the single-ended side has the advantage of preserving the
balance of the transformer.
The maximum peak power capability of a differential current
output DAC is dependent on its peak differential ac current,
I
PEAK, and the equivalent load resistance it sees. In the case of a
1:1 balun with 50 Ω source termination, the equivalent load that
is seen by the DAC ac current source is 25 Ω. If the AD9119/
AD9129 is programmed for an IOUTFS = 20 mA, its peak ac current
is 9.375 mA and its peak power, delivered to the equivalent
load, is 2.2 mW (that is, P = I2R). Because the source and load
resistance seen by the 1:1 balun are equal, this power is shared
equally. Hence, the output load receives 1.1 mW, or 0.4 dBm
peak power.
JTX-2-10T+
MINI-CIRCUITS
IOUTP
2:1
50Ω
VDDA
50Ω
To calculate the rms power delivered to the load, consider the
following:
IOUTN
Figure 152. Recommended Transformer for Wideband Applications with
Upper Bandwidths of up to 2.2 GHz
•
•
•
Peak-to-rms of digital waveform
Any digital backoff from digital full scale
DAC sinc response and nonideal losses in the external
network
Figure 153 shows an interface that can be considered when
interfacing the DAC output to a self-biased differential gain block.
The inductors (L) shown serve as RF chokes that provide the
dc bias path to AGND. Its value, along with the dc blocking
capacitors, determines the lower cut-off frequency of the
composite pass-band response. (The dc blocking capacitors
form a high-pass response with the input resistance of the RF
differential gain stage.)
For example, a reconstructed sine wave with no digital backoff
ideally measures −2.6 dBm because it has a peak-to-rms ratio of
3 dB. If a typical balun loss of 0.4 dBm is included, the user would
expect to measure −3 dBm of actual power in the region where
the sinc response of the DAC has negligible influence. Increasing
the output power is best accomplished by increasing IOUTFS
.
C
IOUTP
Output Stage Configuration
L
The AD9119/AD9129 are intended to serve high dynamic range
applications that require wide signal reconstruction bandwidth
(that is, a DOCSIS cable modem termination system (CMTS))
and/or high IF/RF signal generation. Optimum ac performance
can be realized only if the DAC output is configured for differential
(that is, balanced) operation with its output common-mode
voltage biased to a stable, low noise 1.8 V nominal analog supply
(VDDA). The ADP150 LDO can be used to generate a clean 1.8
V supply.
RF DIFF_
AMP
100Ω
VDDA
L
C
IOUTN
Figure 153. Interfacing the DAC Output to Self-Biased,
Differential Gain Stage
Many RF differential amplifiers consist of two single-ended
amplifiers with matched gain, thus providing no common-mode
rejection while possibly degrading the balance, due to poor
matching characteristics. Also, depending on the component
tolerances, differential LC filters can further degrade the balance
in a differential signal path. In both cases, the use of a balun could
be advantageous in rejecting the common-mode distortion and
noise components from the RF DAC prior to filtering or further
amplification.
The output network used to interface to the DAC should provide
a near 0 Ω dc bias path to VDDA. Any imbalance in the output
impedance over frequency between the IOUTP and IOUTN pins
degrades the distortion performance (mostly even order) and
noise performance. Component selection and layout are critical
in realizing the performance potential of the AD9119/AD9129.
Most applications that require balanced-to-unbalanced conversion
from 10 MHz to 1 GHz can take advantage of the Mini-Circuits
JTX series of transformers that offer impedance ratios of both
2:1 and 1:1.
Rev. 0 | Page 52 of 68
Data Sheet
AD9119/AD9129
For applications that operate the AD9119/AD9129 in Mix-Mode
with output frequencies extending beyond 2.2 GHz, the user may
want to consider the circuit shown in Figure 154. This circuit
uses a wideband balun (for example, −3 dB at 4.0 GHz), with a
configuration that is similar to the example shown in Figure 152,
to provide a dc bias path for the DAC outputs. This circuit was
implemented on an evaluation board, and the frequency response
was measured to compare it with the ideal curve in Figure 146.
The result is shown in Figure 155.
To assist in matching the AD9119/AD9129 output, a Smith chart
is provided in Figure 156. The plot was taken using the circuit
in Figure 154, with the balun and the coupling capacitors
removed, and L = 270 nH. For the measured vs. ideal response of
the DAC output, see Figure 155, which illustrates that a nonideal
response occurs in the second half of the second Nyquist zone.
This area corresponds to the low impedance area between 2 GHz
and 3 GHz, as shown in the Smith chart in Figure 156. Output
matching can be used to compensate for this nonideal response;
the possible reduction in signal bandwidth must be considered if
such matching is used.
MINI-CIRCUITS
TCI-1-13M+
TCI-1-33M+
C
IOUTP
L
L
50Ω
50Ω
VDDA
IOUTN
C
Figure 154. Recommended Mix-Mode Configuration Offering Extended RF
Bandwidth Using TC1-1-13M+ Balun
4
1
3
NORMAL MODE
0
–3
MIX-MODE
3
MEASURED NORMAL
MEASURED MIX-MODE
–6
2
–9
–12
–15
–18
–21
–24
–27
–30
–33
–36
1. 300kHz 3.1341Ω 710.55mΩ 376.96nH
2. 1GHz
3. 2GHz
4. 3GHz
54.333Ω –44.210Ω 3.5999pF
13.113Ω –11.207Ω 7.1006pH
13.022Ω –14.259Ω 756.48pF
Figure 156. Measured Smith Chart Showing the DAC Output Impedance;
DAC = 2.6 GSPS
f
0
500 1000 1500 2000 2500 3000 3500 4000 4500 5000
FREQUENCY (MHz)
Figure 155. Measured vs. Ideal DAC Output Response; fDAC = 2.6 GSPS
Rev. 0 | Page 53 of 68
AD9119/AD9129
Data Sheet
START-UP SEQUENCE
A small number of steps is required to program the AD9119/AD9129 to the proper operating state after the device is powered up. This
sequence is listed in Table 16, along with an explanation of the purpose of each step.
Table 16. Start-Up Sequence After Power-Up
Register
0x00
0x30
0x0C
0x0B
0x01
0x34
0x01
0x33
0x33
Value
Description
0x00
4-wire SPI, MSB-first packing, short addressing mode
Enable cross control, cross location = 7 dec, duty cycle correction off
Set DLL minimum delay = 4 dec, enable DCO
Set clock divider to DCI/512
0x5C
0x64
0x39
0x68
Set bias power-down
0x6D or 0x5D
0x48
Set PLL mode for normal or 2× mode; normal mode or FIR25 on = 0x6D, FIR40 on = 0x5D
Enable bias
0x13
Initialize PLL to phase step = 1 dec
0xF8 or 0xD8
Select PFD, set PLL phase step, keep PLL lost bit cleared; phase step is as follows: normal mode or
FIR25 on = 0xF8, FIR40 on = 0xD8
0x33
0x0D
0x0A
0x18
0x20
0x21
0x30
0x12
0x11
0x11
0x01
0xF0 or 0xD0
0x06
Deassert the PLL lost bit, keeping the phase step; normal mode or FIR25 on = 0xF0, FIR40 on = 0xD0
Set duty correction bandwidth to lowest
0xC0
Enable DLL
0xm0
0xC6
Select data mode, filter mode to set value of m; for example: 0x40, unsigned data, interpolator off
Set full-scale current (FSC) to 33 mA
Complete the setting of FSC
Enable cross control, cross location = 1 dec, enable duty cycle correction
Set the FIFO pointers
0x03
0x46
0x20
0x81
Assert FIFO reset
0x01
Deassert FIFO reset
0x00
Enable IREF (DAC output)
Rev. 0 | Page 54 of 68
Data Sheet
AD9119/AD9129
DEVICE CONFIGURATION REGISTERS
DEVICE CONFIGURATION REGISTER MAP
The blank bits in Table 17 are reserved and should be programmed to their default values. A setting of 1 or 0 indicates the required
programming for the bit.
Table 17. Device Configuration Register Map
Address
Register Name Hex
Dec
0
Type Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Default
0x81
0x48
0x00
0x00
0x00
0x00
Mode
0x00
0x01
0x03
0x04
0x05
0x06
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
SDIO_DIR
LSB/MSB
IREF_PD
SoftReset
BIAS_PD
SPIFrmAck
AED fail
0
0
SoftReset
LSB/MSB
SDIO_DIR
DLL_PD
Power-Down
IRQ Enable 0
IRQ Enable 1
IRQ Request 0
IRQ Request 1
1
BG_PD
1
CLKPATH_PD Retimer_PD
3
FIFO_Warn2
FIFO_Warn1
AED pass
FIFO_Warn1
AED pass
DLL warn
Parity err fall
DLL warn
Parity err fall
DLL lock
Retimer lost
Retimer lock
4
SED fail
Parity err rise
DLL lock
5
FIFO_Warn2
SPIFrmAck
AED fail
Retimer lost
Retimer lock
6
SED fail
Parity err rise
Frame Pin Usage 0x07
7
ParUsage
FrmUsage
FRM_x pin usage mode, Bits[1:0] 0x00
0x58
Reserved_0
Data Ctrl 0
0x08
0x0A
8
Must maintain default (reset) value of 0x58
10
DLL enable
Warn clear
Duty cycle
correction
enable
Phase offset, Bits[3:0]
0x40
Data Ctrl 1
0x0B
11
R/W
Lock delay
divider
Controller clock divider,
Bits[1:0]
Delay line middle set, Bits[3:0]
0x29
Data Ctrl 2
Data Ctrl 3
Data Status 0
0x0C
0x0D
0x0E
12
13
14
R/W
R/W
R
DCO enable
Maximum delay set, Bits[2:0]
Minimum delay set, Bits[2:0]
Duty correction BW, Bits[1:0]
DCI on DLL lock phase DLL running
0x23
0x04
N/A
DLL lock
DLL warn
DLL delay line DLL delay line DLL correct
start warning end warning phase
FIFO Ctrl
0x11
17
R/W
SPIFrmReq
SPIFrmAck
Enable pin
framing
Phase report 0x00
enable
FIFO Offset
FIFO Ph0 Thrm
FIFO Ph1 Thrm
FIFO Ph2 Thrm
FIFO Ph3 Thrm
Data Mode Ctrl
Decode Ctrl
Sync
0x12
0x13
0x14
0x15
0x16
0x18
0x19
0x1A
0x20
0x21
0x22
0x23
0x30
0x33
0x34
0x35
0x50
18
19
20
21
22
24
25
26
32
33
34
35
48
51
52
53
80
81
82
83
84
85
86
87
88
92
R/W
R
RdPtrOff, Bits[2:0]
WtPtrOff, Bits[2:0]
0x04
Phz0Thrm, Bits[6:0]
N/A
R
Phz1Thrm, Bits[6:0]
Phz2Thrm, Bits[6:0]
Phz3Thrm, Bits[6:0]
N/A
R
N/A
R
N/A
0x00
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R
Filter enable
Inc latency
Binary select FILT_SEL
Dec latency
Mix-Mode en 0x00
Sync enable
Sync done
Phase readback, Bits[2:0]
0x00
0x00
0x02
0x00
0x0C
0x00
0x30
0x55
N/A
FSC_1
Full-scale current, Bits[7:0]
FSC_2
Full-scale current, Bits[9:8]
ANA_CNT1
ANA_CNT2
CLK REG1
0
Cross enable
Cross location, Bits[3:0]
Clear lost
Duty enable
0
Retimer Ctrl 0
Retimer Ctrl 1
Retimer Stat 0
SED Control
Phase step, Bits[3:0]
PLL divider
AED pass
Retimer mode, Bits[1:0]
PLL reset_Z
PLL lock
PLL lost
R/W
R
SED enable
SED error clear AED enable
0
0
AED fail
SED fail
0x00
N/A
SED Patt/Err R0L 0x51
SED Patt/Err R0H 0x52
SED Patt/Err R1L 0x53
SED Patt/Err R1H 0x54
SED Patt/Err F0L 0x55
SED Patt/Err F0H 0x56
SED Patt/Err F1L 0x57
SED Patt/Err F1H 0x58
SED Data Port 0 rising edge low part error, Bits[7:0]
SED Data Port 0 rising edge high part error, Bits[13:8]
SED Data Port 1 rising edge low part error, Bits[7:0]
SED Data Port 1 rising edge high part error, Bits[13:8]
SED Data Port 0 falling edge low part error, Bits[7:0]
SED Data Port 0 falling edge high part error, Bits[13:8]
SED Data Port 1 falling edge low part error, Bits[7:0]
SED Data Port 1 falling edge high part error, Bits[13:8]
R
N/A
R
N/A
R
N/A
R
N/A
R
N/A
R
N/A
R
N/A
Parity Control
0x5C
R/W
Parity enable Parity even
Parity error
clear
Parity error
falling edge
Parity error
rising edge
0x00
Parity Err Rising 0x5D
Parity Err Falling 0x5E
93
R
Parity rising edge error count, Bits[7:0]
Parity falling edge error count, Bits[7:0]
Enable delay cell, Bits[7:0]
N/A
94
R
N/A
Delay Ctrl 0
Delay Ctrl 1
Drive Strength
Part ID
0x70
0x71
0x7C
0x7F
112
113
124
127
R/W
R/W
R/W
R
0xFF
0x67
0x7C
Enable delay cell, Bits[10:8]
DCO drive strength, Bits[1:0]
Part ID, Bits[7:0]
0x07 or
0x87
Rev. 0 | Page 55 of 68
AD9119/AD9129
Data Sheet
DEVICE CONFIGURATION REGISTER DESCRIPTIONS
SPI Communications Control Register
Address: 0x00, Reset: 0x81, Name: Mode
Table 18. Bit Descriptions for Mode
Bits Bit Name
Description
Reset
Access
7
SDIO_DIR
Selects 3-wire or 4-wire mode
1: 3-wire bidirectional
1
R/W
0: 4-wire unidirectional
6
LSB/MSB
LSB/MSB data packing
1: LSB-first packing
0: MSB-first packing
0
R/W
5
4
3
2
1
0
SoftReset
Reserved
Reserved
SoftReset
LSB/MSB
SDIO_DIR
1: performs a software-based reset
Must be set to 0; reserved (short addressing mode)
Mirror Bit 4 for safety
0
0
0
0
0
1
R/W
R/W
R
Mirror Bit 5 for safety
R
Mirror Bit 6 for safety
R
Mirror Bit 7 for safety
R
Power Control Register
Address: 0x01, Reset: 0x48, Name: Power-Down
Table 19. Bit Descriptions for Power-Down
Bits Bit Name
Description
Reset
Access
7
6
5
BG_PD
Band gap power-down
1: band gap is powered down
0: band gap is active
0
R/W
IREF_PD
BIAS_PD
IREF power-down
1: FSC is 0 mA
0: FSC is as programmed
1
0
R/W
R/W
Bias power-down
1: all bias currents are off
0: all bias currents are on
4
3
2
Reserved
Reserved
0
1
0
R/W
R/W
R/W
Reserved
Must be set to 1; reserved
CLKPATH_PD
Clock path power-down
1: DAC clock is powered down
0: DAC clock is active
1
0
Retimer_PD
DLL_PD
1: PLL is powered down
0
0
R/W
R/W
DLL (data receiver) power-down
1: DLL (data receiver) is powered down
Rev. 0 | Page 56 of 68
Data Sheet
AD9119/AD9129
Interrupt Enable Register 0
Address: 0x03, Reset: 0x00, Name: IRQ Enable 0
Table 20. Bit Descriptions for IRQ Enable 0
Bits Bit Name
Description
Reset Access
7
6
5
FIFO_Warn2 interrupt enable
Enables the FIFO warning within two slots of overwrite interrupt
Enables the FIFO warning within one slot of overwrite interrupt
0
0
0
R/W
R/W
R/W
FIFO_Warn1 interrupt enable
SPIFrmAck interrupt enable
Enables the FIFO SPI-based calibration acknowledgement of SPIFrmReq
(Address 0x11, Bit 7) going from 0b to1b
4
3
2
1
0
Reserved
Reserved
0
0
0
0
0
R
DLL warn interrupt enable
DLL lock interrupt enable
Retimer lost interrupt enable
Retimer lock interrupt enable
Enables the DLL warning flag that the data receiver is no longer locked
Enables the DLL warning flag that the data receiver is now locked
Enables the retimer lost interrupt indication
Enables the retimer lock interrupt indication
R/W
R/W
R/W
R/W
Interrupt Enable Register 1
Address: 0x04, Reset: 0x00, Name: IRQ Enable 1
Table 21. Bit Descriptions for IRQ Enable 1
Bits Bit Name
Description
Reset Access
7
6
5
4
3
2
1
0
Reserved
Reserved
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R
AED pass interrupt enable
AED fail interrupt enable
SED fail interrupt enable
Enables the AED pass interrupt reporting saying that eight valid samples captured
Enables the AED fail interrupt reporting that a miscompare occurred
Enables the SED fail interrupt reporting that a miscompare occurred
Parity error falling edge enable Enables the parity fail due to a falling edge-based parity detected error
Parity error rising edge enable
Reserved
Enables the parity fail due to a rising edge-based parity detected error
Reserved
Reserved
Reserved
R
Interrupt Status Register 0
Address: 0x05, Reset: 0x00, Name: IRQ Request 0
Table 22. Bit Descriptions for IRQ Request 0
Bits Bit Name
Description
Reset Access
7
6
5
4
3
FIFO_Warn2 interrupt status
Indicates that the FIFO is within two slots of overwrite
Indicates that the FIFO is within one slot of overwrite
Indicates acknowledgement of SPIFrmReq has changed from 0b to1b
Reserved
0
0
0
0
0
R
R
R
R
R
FIFO_Warn1 interrupt status
SPIFrmAck interrupt status
Reserved
DLL warn interrupt status
Indicates that the DLL (data receiver) is close to coming unlocked and action is
needed
2
1
0
DLL lock interrupt status
Indicates that the DLL (data receiver) is now locked
Indicates that the retimer PLL is no longer locked
Indicates that the retimer PLL is now locked
0
0
0
R
R
R
Retimer lost interrupt status
Retimer lock interrupt status
Rev. 0 | Page 57 of 68
AD9119/AD9129
Data Sheet
Interrupt Status Register1
Address: 0x06, Reset: 0x00, Name: IRQ Request 1
Table 23. Bit Descriptions for IRQ Request 1
Bits Bit Name
Description
Reset Access
7
6
5
4
3
2
1
0
Reserved
Reserved
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
AED pass interrupt status
AED fail interrupt status
SED fail interrupt status
Indicates that the AED logic has captured eight valid samples
Indicates that the AED logic has detected a miscompare
Indicates that the SED logic has detected a miscompare
Parity error falling edge status Indicates a parity fault due to data captured on the falling edge
Parity error rising edge status
Reserved
Indicates a parity fault due to data captured on the rising edge
Reserved
Reserved
Reserved
Frame Pin Usage Register
Address: 0x07, Reset: 0x00, Name: Frame Pin Usage
Table 24. Bit Descriptions for Frame Pin Usage
Bits Bit Name
Description
Reserved
Reset Access
7
6
5
Reserved
Reserved
ParUsage
0
0
0
R/W
R/W
R
Reserved
1: FRM_x pin is in parity mode, and parity is enabled
Note that parity must be enabled, and the type must be chosen in Register 0x5C[7:6]
4
FrmUsage
1: FRM_x pin is in frame mode and enable pin framing (Register 0x11[5] = 1b) is
enabled
0
R
3
2
Reserved
Reserved
Reserved
Reserved
0
R
0
R
[1:0] FRM_x pin usage mode
3: reserved
2: frame
0x0
R/W
1: parity
0: no effect
Reserved_0 Register
Address: 0x08, Reset: 0x58, Name: Reserved_0
Table 25. Bit Descriptions for Reserved_0
Bits Bit Name
Description
Reset Access
0x58
[7:0] Reserved
Must keep default (reset) value; reserved
R
Data Receiver Control 0 Register
Address: 0x0A, Reset: 0x40, Name: Data Ctrl 0
Table 26. Bit Descriptions for Data Ctrl 0
Bits Bit Name
Description
Reset Access
7
DLL enable
1: enables DLL
0: disables DLL
0
R/W
6
Duty cycle correction enable 1: enables duty cycle correction
0: disables duty cycle correction
1
R/W
5
4
Reserved
Reserved
Reserved
0
R/W
R/W
R/W
Reserved
0
[3:0] Phase offset
Locked phase = 90° n × 11.25°, where n is the 4-bit signed magnitude number
0x0
Rev. 0 | Page 58 of 68
Data Sheet
AD9119/AD9129
Data Receiver Control 1 Register
Address: 0x0B, Reset: 0x29, Name: Data Ctrl 1
Table 27. Bit Descriptions for Data Ctrl 1
Bits Bit Name
Description
Reset
Access
R/W
7
6
Warn clear
1: clears data receiver warning bit
0
0
Lock delay divider
1: long delay
0: short delay
R/W
[5:4] Controller clock divider
Controller clock divider
00: DCI/4
01: DCI/16
10: DCI/64
11: DCI/512
0x2
0x9
R/W
[3:0] Delay line middle set
Sets nominal delay line delay
R/W
Data Receiver Control 2 Register
Address: 0x0C, Reset: 0x23, Name: Data Ctrl 2
Table 28. Bit Descriptions for Data Ctrl 2
Bits Bit Name
Description
Reset
0
Access
R/W
7
6
Reserved
Reserved
DCO enable
1: enables DCO output driver
0
R/W
[5:3] Maximum delay set
[2:0] Minimum delay set
Sets maximum delay line delay (larger number = longer delay line)
Sets minimum delay line delay (larger number = smaller delay line)
0x2
0x3
R/W
R/W
Data Receiver Control 3 Register
Address: 0x0D, Reset: 0x04, Name: Data Ctrl 3
Table 29. Bit Descriptions for Data Ctrl 3
Bits Bit Name
Description
Reset
0x00
0x2
Access
R
[7:3] Reserved
Reserved.
[2:1] Duty correction BW set
Controller clock divider.
00: highest BW.
01: higher BW.
R/W
10: lower BW.
11: lowest BW.
0
Reserved
Reserved
0
R/W
Data Receiver Status 0 Register
Address: 0x0E, Reset: 0x00, Name: Data Status 0
Table 30. Bit Descriptions for Data Status 0
Bits Bit Name
Description
Reset
Access
7
6
5
4
3
DLL lock
1: DLL lock
0
0
0
0
0
R
R
R
R
R
DLL warning
1: DLL near beginning/end of delay line
DLL delay line start warning 1: DLL at beginning of delay line
DLL delay line end warning 1: DLL at end of delay line
DLL correct phase
1: data is sampled on correct phase
0: data is sampled on incorrect phase.
1: user has provided a clock > 100 MHz
2
1
DCI on
0
0
R
R
DLL lock phase
1: DLL is locked on negative half of DCI.
0: DLL is locked on positive half of DCI
0
DLL running
1: closed loop DLL attempting to lock
0: delay fixed at middle of delay line
0
R
Rev. 0 | Page 59 of 68
AD9119/AD9129
Data Sheet
FIFO Control Register
Address: 0x11, Reset: 0x00, Name: FIFO Ctrl
Table 31. Bit Descriptions for FIFO Ctrl
Bits
Bit Name
Description
Reset
Access
R/W
R/W
R/W
R
7
SPIFrmReq
Requests a SPI-based FIFO alignment (FIFO reset)
Acknowledges SPIFrmReq change (tracks SPIFrmReq setting)
1: enables hardware pin-based FIFO framing
Reserved
0
6
SPIFrmAck
0
5
Enable pin framing
0
[4:1] Reserved
0x0
0
0
Phase report enable
1: enables FIFO phase reporting
R/W
FIFO Offset Register
Address: 0x12, Reset: 0x04, Name: FIFO Offset
Table 32. Bit Descriptions for FIFO Offset
Bits Bit Name
Reserved
[6:4] RdPtrOff[2:0]
Reserved
[2:0] WtPtrOff[2:0]
Description
Reset
0
Access
R
7
Reserved
FIFO read pointer offset
Reserved
0x0
0
R/W
R
3
FIFO write pointer offset
0x4
R/W
FIFO Thermometer for Phase 0 Status Register
Address: 0x13, Reset: 0x00, Name: FIFO PH0 THRM
Table 33. Bit Descriptions for FIFO PH0 THRM
Bits Bit Name
Reserved
[6:0] Phz0Thrm
Description
Reset
0
Access
7
Reserved
R
R
Phase 0-based FIFO thermometer status. Phase 0 relative FIFO phasing, as 0000000b
to 1111111b, where 0000011b is considered the middle of the FIFO storage space.
0x00
FIFO Thermometer for Phase 1 Status Register
Address: 0x14, Reset: 0x00, Name: FIFO PH1 THRM
Table 34. Bit Descriptions for FIFO PH1 THRM
Bits Bit Name
Reserved
[6:0] Phz1Thrm
Description
Reset
0
Access
7
Reserved
R
R
Phase 1-based FIFO thermometer status. Phase 1 relative FIFO phasing, as 0000000b
to 1111111b, where 0000011b is considered the middle of the FIFO storage space.
0x00
FIFO Thermometer for Phase 2 Status Register
Address: 0x15, Reset: 0x00, Name: FIFO PH2 THRM
Table 35. Bit Descriptions for FIFO PH2 THRM
Bits Bit Name
Reserved
[6:0] Phz2Thrm
Description
Reset
0
Access
7
Reserved
R
R
Phase 2-based FIFO thermometer status. Phase 2 relative FIFO phasing, as 0000000b
to 1111111b, where 0000011b is considered the middle of the FIFO storage space.
0x00
FIFO Thermometer for Phase 3 Status Register
Address: 0x16, Reset: 0x00, Name: FIFO PH3 THRM
Table 36. Bit Descriptions for FIFO PH3 THRM
Bits Bit Name
Reserved
[6:0] Phz3Thrm
Description
Reset
0
Access
7
Reserved
R
R
Phase 3-based FIFO thermometer status. Phase 3 relative FIFO phasing, as 0000000b
to 1111111b, where 0000011b is considered the middle of the FIFO storage space.
0x00
Rev. 0 | Page 60 of 68
Data Sheet
AD9119/AD9129
Data Mode Control Register
Address: 0x18, Reset: 0x00, Name: Data Mode Ctrl
Table 37. Bit Descriptions for Data Mode Ctrl
Bits Bit Name
Description
Reset Access
7
6
Filter enable
Binary select
1: enables 2× interpolation filter
0: bypasses 2× interpolation filter
0
R/W
Selects input data format
1: unsigned
0
R/W
0: signed
5
FILT_SEL
2× interpolator filter select
1: 40 dB OOB rejection
0: 25 dB out-of-band (OOB) rejection
0
0
R
R
[4:0] Reserved
Reserved
Decoder Control (Program Thermometer Type) Register
Address: 0x19, Reset: 0x00, Name: Decode Ctrl
Table 38. Bit Descriptions for Decode Ctrl
Bits Bit Name
Description
Reset Access
[7:1] Reserved
Reserved
0x00
0
R
0
Mix-Mode enable
1: Mix-Mode
0: normal
R/W
Sync Control Register
Address: 0x1A, Reset: 0x00, Name: Sync
Table 39. Bit Descriptions for Sync
Bits Bit Name
Description
Reset Access
7
6
5
4
Inc latency
Dec latency
Reserved
Increment delay by 1
Decrement delay by 1
0
0
0
0
R/W
R/W
R
Reserved
Sync enable
1: multi-DAC sync output pin enabled
0: multi-DAC sync output pin disabled
1: last increment or decrement request is complete
R/W
3
Sync done
0
0
R
R
[2:0] Phase readback
Readback of existing SYNC phase delay value
Full-Scale Current Adjust (Lower) Register
Address: 0x20, Reset: 0x00, Name: FSC_1
Table 40. Bit Descriptions for FSC_1
Bits Bit Name
Description
DAC gain adjust; DAC full-scale current (LSB)
Reset Access
0x00 R/W
[7:0] Full-scale current, Bits[7:0]
Full-Scale Current Adjust (Upper) Register
Address: 0x21 Reset: 0x02, Name: FSC_2
Table 41. Bit Descriptions for FSC_2
Bits Bit Name
Description
Reset Access
7
Reserved
Reserved
0
R/W
R
[6:2] Reserved
Reserved
0
[1:0] Full-scale current, Bits[9:8]
DAC gain adjust; DAC full-scale current (MSB)
0x02
R/W
Rev. 0 | Page 61 of 68
AD9119/AD9129
Data Sheet
Analog Control 1 Register
Address: 0x22, Reset: 0x00, Name: ANA_CNT1
Table 42. Bit Descriptions for ANA_CNT1
Bits Bit Name
Description
Reset
Access
[7:0] Reserved
Reserved
0x0
R/W
Analog Control 2 Register
Address: 0x23, Reset: 0x0C, Name: ANA_CNT2
Table 43. Bit Descriptions for ANA_CNT2
Bits Bit Name
Description
Reserved
Reset
Access
[7:0] Reserved
0x0C
R/W
Clock Control 1 Register
Address: 0x30, Reset: 0x00, Name: CLK REG1
Table 44. Bit Descriptions for CLK REG1
Bits Bit Name
Description
Reset
Access
R/W
7
6
Reserved
Must be set to 0; reserved
0
0
0
0
0
Cross enable
Enables zero-crossing control
Adjusts zero-crossing control location (signed magnitude)
Enables duty cycle correction
Must be set to 0
R/W
[5:2] Cross location
R/W
1
0
Duty enable
R/W
Select internal
R/W
Retimer Control 0 Register
Address: 0x33, Reset: 0x30, Name: Retimer Ctrl 0
Table 45. Bit Descriptions for Retime Ctrl 0
Bits Bit Name
Description
Reset
0x3
0
Access
[7:4] Phase step
4-bit signed magnitude; PFD phase step = n × 30°
R/W
3
2
Clear lost
Clear lost status bit
1: divide-by-4
PLL divider
0
0: divide-by-8
[1:0] Retimer mode
0: enable PFD, normal mode
1: reserved
0x0
2: reserved
3: reserved
Retimer Control 1 Register
Address: 0x34, Reset: 0x55, Name: Retimer Ctrl 1
Table 46. Bit Descriptions for Retimer Ctrl 1
Bits Bit Name
Description
Reset
0x5
0
Access
R/W
[7:4] Reserved
Reserved
3
PLL reset_Z
1: normal operation for DAC clock PLL
0: resets the DAC clock PLL
Reserved
R/W
[2:0] Reserved
0x5
R/W
Retimer Status 0 Register
Address: 0x35, Reset: 0x00, Name: Retimer Stat 0
Table 47. Bit Descriptions for Retimer Stat 0
Bits Bit Name
Description
Reset
0
Access
7
6
PLL lock
PLL lost
1: retimer PLL locked
1: retimer PLL lost (can be sticky)
Reserved
R
R
R
R
0
[5:4] Reserved
[3:0] Reserved
0x0
0x0
Reserved
Rev. 0 | Page 62 of 68
Data Sheet
AD9119/AD9129
Sample Error Detection (SED) Control Register
Address: 0x50, Reset: 0x00, Name: SED Control
Table 48. Bit Descriptions for SED Control
Bits Bit Name
Description
Reset
Access
R/W
R/W
R/W
R
7
6
5
4
3
2
1
0
SED enable
SED error clear
AED enable
Reserved
Reserved
AED pass
AED fail
1: setting this bit to 1 enables the SED compare logic
1: clears all SED reported error bits below
1: enables the AED function (SED with autoclear after eight passing sets)
Must be set to 0; reserved
0
0
0
0
0
0
0
0
Must be set to 0; reserved
R
1: signals eight true compare cycles
1: signals a miscompare
R/W
R
SED fail
1: signals an SED miscompare (with SED or AED enabled)
R
Sample Error Detection (SED) Data Port 0 Rising Edge Status Low Register
Address: 0x51, Reset: 0x00, Name: SED Patt/Err R0L
Table 49. Bit Descriptions for SED Patt/Err R0L
Bits Bit Name
Description
Reset
Access
[7:0] SED Data Port 0 rising edge low part error bits
SED Data Port 0 rising edge error, Bits[7:0]
0x00
R
Sample Error Detection (SED) Data Port 0 Rising Edge Status High Register
Address: 0x52, Reset: 0x000, Name: SED Patt/Err R0H
Table 50. Bit Descriptions for SED Patt/Err R0H
Bits Bit Name
Description
Reset
0x0
Access
[7:6] Reserved
Reserved
R
R
[5:0] SED Data Port 0 rising edge high part error bits
SED Data Port 0 rising edge error, Bits[13:8]
0x00
Sample Error Detection (SED) Data Port 1 Rising Edge Status Low Register
Address: 0x53, Reset: 0x00, Name: SED Patt/Err R1L
Table 51. Bit Descriptions for SED Patt/Err R1L
Bits Bit Name
Description
Reset
Access
[7:0] SED Data Port 1 rising edge low part error bits
SED Data Port 1 rising edge error, Bits[7:0]
0x00
R
Sample Error Detection (SED) Data Port 1 Rising Edge Status High Register
Address: 0x54, Reset: 0x00, Name: SED Patt/Err R1H
Table 52. Bit Descriptions for SED Patt/Err R1H
Bits Bit Name
Description
Reset
0x0
Access
[7:6] Reserved
Reserved
R
R
[5:0] SED Data Port 1 rising edge high part error bits
SED Data Port 1 rising edge error, Bits[13:8]
0x00
Rev. 0 | Page 63 of 68
AD9119/AD9129
Data Sheet
Sample Error Detection (SED) Data Port 0 Falling Edge Status Low Register
Address: 0x55, Reset: 0x00, Name: SED Patt/Err F0L
Table 53. Bit Descriptions for SED Patt/Err F0L
Bits Bit Name
Description
Reset
Access
[7:0] SED Data Port 0 falling edge low part error bits
SED Data Port 0 falling edge error, Bits[7:0]
0x00
R
Sample Error Detection (SED) Data Port 0 Falling Edge Status High Register
Address: 0x56, Reset: 0x000, Name: SED Patt/Err F0H
Table 54. Bit Descriptions for SED Patt/Err F0H
Bits Bit Name
Description
Reset
0x0
Access
[7:6] Reserved
Reserved
R
R
[5:0] SED Data Port 0 falling edge high part error bits
SED Data Port 0 falling edge error, Bits[13:8]
0x00
Sample Error Detection (SED) Data Port 1 Falling Edge Status Low Register
Address: 0x57, Reset: 0x00, Name: SED Patt/Err F1L
Table 55. Bit Descriptions for SED Patt/Err F1L
Bits Bit Name
Description
Reset
Access
[7:0] SED Data Port 1 falling edge low part error bits
SED Data Port 1 falling edge error, Bits[7:0]
0x00
R
Sample Error Detection (SED) Data Port 1 Falling Edge Status High Register
Address: 0x58, Reset: 0x00, Name: SED Patt/Err F1H
Table 56. Bit Descriptions for SED Patt/Err F1H
Bits Bit Name
Description
Reset
0x0
Access
[7:6] Reserved
Reserved
R
R
[5:0] SED Data Port 1 falling edge high part error bits
SED Data Port 1 falling edge error, Bits[13:8]
0x00
Parity Control Register
Address: 0x5C, Reset: 0x00, Name: Parity Control
Table 57. Bit Descriptions for Parity Control
Bits Bit Name
Description
Reset
0x00
0
Access
R/W
7
6
Parity enable
Parity even
1: enables parity
1: even parity; if the parity bit from the FRM_x pin = 1,
the number of 1s in the word is even
R/W
0: odd parity; if the parity bit from the FRM_x pin = 1,
the number of 1s in the word is odd
Note that the parity bit must be enabled in Register 0x07
5
Parity error clear
1: clears parity error counters
0
R/W
R
[4:2] Reserved
Reserved
0x0
0
1
0
Parity error falling edge
Parity error rising edge
1: signals detection of a falling edge parity error
1: signals detection of a rising edge parity error
R
0
R
Parity Rising Edge Count Register
Address: 0x5D, Reset: 0x00, Name: Parity Err Rising
Table 58. Bit Descriptions for Parity Err Rising
Bits Bit Name
Description
Reset
Access
[7:0] Parity rising edge error count
Number of rising edge-based errors detected, clipped to 256
0x00
R
Parity Falling Edge Count Register
Address: 0x5E, Reset: 0x00, Name: Parity Err Falling
Table 59. Bit Descriptions for Parity Err Falling
Bits Bit Name
Description
Reset
Access
[7:0] Parity falling edge error count
Number of falling edge-based errors detected, clipped to 256
Rev. 0 | Page 64 of 68
0x00
R
Data Sheet
AD9119/AD9129
Delay Control Register 0
Address: 0x70, Reset: 0xFF, Name: Delay Ctrl 0
Table 60. Bit Descriptions for Delay Ctrl 0
Bits Bit Name
Description
Reset Access
[7:0] Enable delay cell
Sets each bit to enable or disable the delay cell, Bits[7:0]; delay cell number corresponds to bit
0xFF
R/W
number
1: enables delay cell (default)
0: disables delay cell
Delay Control Register 1
Address: 0x71, Reset: 0x67, Name: Delay Ctrl 1
Table 61. Bit Descriptions for Delay Ctrl 1
Bits Bit Name
Description
Reset Access
[7:3] Reserved
Reserved
0x60
0x7
R/W
R/W
[2:0] Enable delay cell
Sets each bit to enable or disable the delay cell, Bits[10:8]; delay cell numbers are 10, 9,
and 8, which correspond to Bit 2, Bit 1, and Bit 0, respectively
1: enables delay cell (default)
0: disables delay cell
Drive Strength Register
Address: 0x7C, Reset: 0x7C, Name: Drive Strength
Table 62. Bit Descriptions for Drive Strength
Bits Bit Name
Description
Reset Access
[7:6] DCO drive strength
Sets DCO drive strength
00: 2 mA
0x1
R/W
01: 2.8 mA (default)
10: 3.4 mA
11: 4 mA
[5:0] Reserved
Reserved
0x3C
R/W
Part ID Register
Address: 0x7F, Reset: 0x03 or 0x83, Name: Part ID
Table 63. Bit Descriptions for Part ID
Bits Bit Name
Description
Reset Access
[7:0] Part ID
Version information
0x07 = the AD9129 (14-bit version)
0x87 = the AD9119 (11-bit version)
0x07
or
0x87
R
Rev. 0 | Page 65 of 68
AD9119/AD9129
Data Sheet
OUTLINE DIMENSIONS
12.10
12.00 SQ
11.90
A1 BALL
CORNER
A1 BALL
CORNER
13 11
14 12 10
9
7
5
3
1
8
6
4
2
A
B
C
D
E
F
10.40
BSC SQ
G
H
J
K
L
0.80
BSC
M
N
P
BOTTOM VIEW
DETAIL A
TOP VIEW
1.00 MAX
0.85 MIN
DETAIL A
0.43 MAX
1.40 MAX
0.25 MIN
0.55
0.50
0.45
COPLANARITY
0.12
SEATING
PLANE
BALL DIAMETER
COMPLIANT WITH JEDEC STANDARDS MO-275-GGAA-1.
Figure 157. 160-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-160-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Temperature Range
Package Description
Package Option
AD9119BBCZ
AD9119BBCZRL
AD9119-EBZ
AD9119-MIX-EBZ
AD9119-CBLTX-EBZ
AD9129BBCZ
AD9129BBCZRL
AD9129BBC
AD9129BBCRL
AD9129-EBZ
AD9129-MIX-EBZ
AD9129-CBLTX-EBZ
−40°C to +85°C
−40°C to +85°C
160-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
160-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
Evaluation Board for Normal Mode Evaluation
Evaluation Board for Mix-Mode Evaluation
Evaluation Board for Cable Transmitter Evaluation
160-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
160-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
160-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
160-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
Evaluation Board for Normal Mode Evaluation
Evaluation Board for Mix-Mode Evaluation
BC-160-1
BC-160-1
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
BC-160-1
BC-160-1
BC-160-1
BC-160-1
Evaluation Board for Cable Transmitter Evaluation
1 Z = RoHS Compliant Part.
Rev. 0 | Page 66 of 68
Data Sheet
NOTES
AD9119/AD9129
Rev. 0 | Page 67 of 68
AD9119/AD9129
NOTES
Data Sheet
©2013 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D11149-0-1/13(0)
Rev. 0 | Page 68 of 68
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