ADF4351BCPZ [ADI]
Wideband Synthesizer; 宽带频率合成器型号: | ADF4351BCPZ |
厂家: | ADI |
描述: | Wideband Synthesizer |
文件: | 总28页 (文件大小:577K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Wideband Synthesizer
with Integrated VCO
ADF4351
Data Sheet
FEATURES
GENERAL DESCRIPTION
Output frequency range: 35 MHz to 4400 MHz
Fractional-N synthesizer and integer-N synthesizer
Low phase noise VCO
The ADF4351 allows implementation of fractional-N or integer-N
phase-locked loop (PLL) frequency synthesizers when used with
an external loop filter and external reference frequency.
Programmable divide-by-1/-2/-4/-8/-16/-32/-64 output
Typical jitter: 0.3 ps rms
Typical EVM at 2.1 GHz: 0.4%
Power supply: 3.0 V to 3.6 V
Logic compatibility: 1.8 V
Programmable dual-modulus prescaler of 4/5 or 8/9
Programmable output power level
RF output mute function
The ADF4351 has an integrated voltage controlled oscillator (VCO)
with a fundamental output frequency ranging from 2200 MHz to
4400 MHz. In addition, divide-by-1/-2/-4/-8/-16/-32/-64 circuits
allow the user to generate RF output frequencies as low as 35 MHz.
For applications that require isolation, the RF output stage can be
muted. The mute function is both pin- and software-controllable.
An auxiliary RF output is also available, which can be powered
down when not in use.
3-wire serial interface
Control of all on-chip registers is through a simple 3-wire interface.
The device operates with a power supply ranging from 3.0 V to
3.6 V and can be powered down when not in use.
Analog and digital lock detect
Switched bandwidth fast lock mode
Cycle slip reduction
APPLICATIONS
Wireless infrastructure (W-CDMA, TD-SCDMA, WiMAX,
GSM, PCS, DCS, DECT)
Test equipment
Wireless LANs, CATV equipment
Clock generation
FUNCTIONAL BLOCK DIAGRAM
SDV
AV
DV
V
R
V
VCO
DD
DD
DD
P
SET
MULTIPLEXER
MUXOUT
10-BIT R
COUNTER
÷2
DIVIDER
×2
REF
DOUBLER
IN
LOCK
DETECT
FAST LOCK
SWITCH
SW
LD
CLK
DATA
LE
DATA REGISTER
FUNCTION
LATCH
CHARGE
PUMP
CP
OUT
PHASE
COMPARATOR
V
V
TUNE
REF
V
VCO
CORE
COM
TEMP
INTEGER
VALUE
FRACTION
VALUE
MODULUS
VALUE
RF
RF
A+
A–
OUT
OUT
OUTPUT
STAGE
THIRD-ORDER
FRACTIONAL
INTERPOLATOR
÷1/2/4/8/16/
32/64
PDB
RF
RF
RF
B+
B–
OUTPUT
STAGE
OUT
OUT
N COUNTER
MULTIPLEXER
ADF4351
AGND
DGND
CP
SD
GND
A
GNDVCO
CE
GND
Figure 1.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registeredtrademarks arethe property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Fax: 781.461.3113
www.analog.com
©2012 Analog Devices, Inc. All rights reserved.
ADF4351
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Register 1 ..................................................................................... 18
Register 2 ..................................................................................... 18
Register 3 ..................................................................................... 19
Register 4 ..................................................................................... 20
Register 5 ..................................................................................... 20
Register Initialization Sequence ............................................... 20
RF Synthesizer—A Worked Example ...................................... 21
Reference Doubler and Reference Divider ............................. 21
12-Bit Programmable Modulus................................................ 21
Cycle Slip Reduction for Faster Lock Times........................... 22
Spurious Optimization and Fast Lock..................................... 22
Fast Lock Timer and Register Sequences................................ 22
Fast Lock Example ..................................................................... 22
Fast Lock Loop Filter Topology................................................ 23
Spur Mechanisms ....................................................................... 23
Spur Consistency and Fractional Spur Optimization ........... 24
Phase Resync............................................................................... 24
Applications Information .............................................................. 25
Direct Conversion Modulator .................................................. 25
Interfacing to the ADuC70xx and the ADSP-BF527............. 26
PCB Design Guidelines for a Chip Scale Package ................. 26
Output Matching........................................................................ 27
Outline Dimensions....................................................................... 28
Ordering Guide .......................................................................... 28
Applications....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Timing Characteristics ................................................................ 5
Absolute Maximum Ratings............................................................ 6
Transistor Count........................................................................... 6
Thermal Resistance ...................................................................... 6
ESD Caution.................................................................................. 6
Pin Configuration and Function Descriptions............................. 7
Typical Performance Characteristics ............................................. 9
Circuit Description......................................................................... 11
Reference Input Section............................................................. 11
RF N Divider............................................................................... 11
Phase Frequency Detector (PFD) and Charge Pump............ 11
MUXOUT and Lock Detect...................................................... 12
Input Shift Registers................................................................... 12
Program Modes .......................................................................... 12
VCO.............................................................................................. 12
Output Stage................................................................................ 13
Register Maps.................................................................................. 14
Register 0 ..................................................................................... 18
REVISION HISTORY
5/12—Revision 0: Initial Version
Rev. 0 | Page 2 of 28
Data Sheet
ADF4351
SPECIFICATIONS
AVDD = DVDD = VVCO = SDVDD = VP = 3.3 V 10%; AGND = DGND = 0 V; TA = TMIN to TMAX, unless otherwise noted. Operating
temperature range is −40°C to +85°C.
Table 1.
Parameter
Min
Typ
Max
Unit
Test Conditions/Comments
REFIN CHARACTERISTICS
Input Frequency
Input Sensitivity
10
0.7
250
AVDD
MHz
V p-p
pF
For f < 10 MHz, ensure slew rate > 21 V/µs
Biased at AVDD/2; ac coupling ensures AVDD/2 bias
Input Capacitance
10
Input Current
60
µA
PHASE FREQUENCY DETECTOR (PFD)
Phase Detector Frequency
32
45
90
MHz
MHz
MHz
Fractional-N
Integer-N (band select enabled)
Integer-N (band select disabled)
CHARGE PUMP
ICP Sink/Source1
RSET = 5.1 kΩ
High Value
Low Value
RSET Range
Sink and Source Current Matching
ICP vs. VCP
5
mA
mA
kΩ
%
%
%
0.312
3.9
1.5
10
2
1.5
2
0.5 V ≤ VCP ≤ 2.5 V
0.5 V ≤ VCP ≤ 2.5 V
VCP = 2.0 V
ICP vs. Temperature
LOGIC INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current, IINH/IINL
Input Capacitance, CIN
LOGIC OUTPUTS
Output High Voltage, VOH
Output High Current, IOH
Output Low Voltage, VOL
POWER SUPPLIES
AVDD
V
V
µA
pF
0.6
1
3.0
DVDD − 0.4
V
µA
V
CMOS output selected
IOL = 500 µA
500
0.4
3.0
3.6
27
V
DVDD, VVCO, SDVDD, VP
AVDD
21
6 to 36
70
21
7
These voltages must equal AVDD
2
DIDD + AIDD
mA
mA
mA
mA
µA
Output Dividers
Each output divide-by-2 consumes 6 mA
RF output stage is programmable
2
IVCO
80
26
10
2
IRFOUT
Low Power Sleep Mode
RF OUTPUT CHARACTERISTICS
VCO Output Frequency
Minimum VCO Output Frequency
Using Dividers
2200
34.375
4400
MHz
MHz
Fundamental VCO mode
2200 MHz fundamental output and
divide-by-64 selected
VCO Sensitivity, KV
40
1
90
−19
−20
−13
−10
MHz/V
MHz/V
kHz
dBc
dBc
Frequency Pushing (Open-Loop)
Frequency Pulling (Open-Loop)
Harmonic Content (Second)
Into 2.00 VSWR load
Fundamental VCO output
Divided VCO output
Fundamental VCO output
Divided VCO output
Harmonic Content (Third)
dBc
dBc
Rev. 0 | Page 3 of 28
ADF4351
Data Sheet
Parameter
Min
Typ
−4
5
Max
Unit
dBm
dBm
dB
Test Conditions/Comments
Minimum RF Output Power3
Maximum RF Output Power3
Output Power Variation
Programmable in 3 dB steps
1
Minimum VCO Tuning Voltage
Maximum VCO Tuning Voltage
NOISE CHARACTERISTICS
VCO Phase Noise Performance
0.5
2.5
V
V
VCO noise is measured in open-loop conditions
10 kHz offset from 2.2 GHz carrier
100 kHz offset from 2.2 GHz carrier
1 MHz offset from 2.2 GHz carrier
5 MHz offset from 2.2 GHz carrier
10 kHz offset from 3.3 GHz carrier
100 kHz offset from 3.3 GHz carrier
1 MHz offset from 3.3 GHz carrier
5 MHz offset from 3.3 GHz carrier
10 kHz offset from 4.4 GHz carrier
100 kHz offset from 4.4 GHz carrier
1 MHz offset from 4.4 GHz carrier
5 MHz offset from 4.4 GHz carrier
PLL loop BW = 500 kHz
−89
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
−114
−134
−148
−86
−111
−134
−145
−83
−110
−131
−145
Normalized Phase Noise Floor
4
(PNSYNTH
)
−220
−221
dBc/Hz
dBc/Hz
ABP = 6 ns
ABP = 3 ns
5
Normalized 1/f Noise (PN1_f
)
10 kHz offset; normalized to 1 GHz
ABP = 6 ns
ABP = 3 ns
−116
−118
−100
0.27
dBc/Hz
dBc/Hz
dBc/Hz
ps
In-Band Phase Noise
Integrated RMS Jitter6
3 kHz from 2111.28 MHz carrier
Spurious Signals Due to PFD
Frequency
−80
dBc
Level of Signal with RF Mute Enabled
−40
dBm
1 ICP is internally modified to maintain constant loop gain over the frequency range.
2 TA = 25°C; AVDD = DVDD = VVCO = 3.3 V; prescaler = 8/9; fREFIN = 100 MHz; fPFD = 25 MHz; fRF = 4.4 GHz.
3 Using 50 Ω resistors to VVCO, into a 50 Ω load. Power measured with auxiliary RF output disabled. The current consumption of the auxiliary output is the same as for the
main output.
4 The synthesizer phase noise floor is estimated by measuring the in-band phase noise at the output of the VCO and subtracting 20 log N (where N is the N divider
value) and 10 log fPFD. To calculate in-band phase noise performance as seen at the VCO output, use the following formula: PNSYNTH = PNTOT − 10 log(fPFD) − 20 log N.
5 The PLL phase noise is composed of flicker (1/f) noise plus the normalized PLL noise floor. The formula for calculating the 1/f noise contribution at an RF frequency (fRF)
and at a frequency offset (f) is given by PN = PN1_f + 10 log(10 kHz/f) + 20 log(fRF/1 GHz). Both the normalized phase noise floor and flicker noise are modeled in ADIsimPLL.
6 fREFIN = 122.88 MHz; fPFD = 30.72 MHz; VCO frequency = 4222.56 MHz; RFOUT = 2111.28 MHz; N = 137; loop BW = 60 kHz; ICP = 2.5 mA; low noise mode. The noise was
measured with an EVAL-ADF4351EB1Z and the Rohde & Schwarz FSUP signal source analyzer.
Rev. 0 | Page 4 of 28
Data Sheet
ADF4351
TIMING CHARACTERISTICS
AVDD = DVDD = VVCO = SDVDD = VP = 3.3 V 10%; AGND = DGND = 0 V; 1.8 V and 3 V logic levels used; TA = TMIN to TMAX, unless
otherwise noted.
Table 2.
Parameter
Limit
20
10
10
25
25
10
20
Unit
Description
t1
t2
t3
t4
t5
t6
t7
ns min
ns min
ns min
ns min
ns min
ns min
ns min
LE setup time
DATA to CLK setup time
DATA to CLK hold time
CLK high duration
CLK low duration
CLK to LE setup time
LE pulse width
Timing Diagram
t4
t5
CLK
t2
t3
DB2
(CONTROL BIT C3)
DB1
DB0 (LSB)
(CONTROL BIT C1)
DB31 (MSB)
DB30
DATA
LE
(CONTROL BIT C2)
t7
t1
t6
LE
Figure 2. Timing Diagram
Rev. 0 | Page 5 of 28
ADF4351
Data Sheet
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
This device is a high performance RF integrated circuit with an
ESD rating of <1.5 kV and is ESD sensitive. Proper precautions
should be taken for handling and assembly.
Table 3.
Parameter
AVDD to GND1
Rating
TRANSISTOR COUNT
−0.3 V to +3.9 V
−0.3 V to +0.3 V
−0.3 V to +3.9 V
−0.3 V to +0.3 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−40°C to +85°C
−65°C to +125°C
150°C
AVDD to DVDD
The transistor count for the ADF4351 is 36,955 (CMOS) and
986 (bipolar).
VVCO to GND1
VVCO to AVDD
THERMAL RESISTANCE
Digital I/O Voltage to GND1
Analog I/O Voltage to GND1
REFIN to GND1
Thermal impedance (θJA) is specified for a device with the
exposed pad soldered to GND.
Operating Temperature Range
Storage Temperature Range
Maximum Junction Temperature
Reflow Soldering
Table 4. Thermal Resistance
Package Type
θJA
Unit
32-Lead LFCSP (CP-32-2)
27.3
°C/W
Peak Temperature
Time at Peak Temperature
260°C
40 sec
ESD CAUTION
1 GND = AGND = DGND = CPGND = SDGND = AGNDVCO = 0 V.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rev. 0 | Page 6 of 28
Data Sheet
ADF4351
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
24
23
22
21
20
19
18
17
V
V
R
A
CLK
DATA
LE
CE
SW
1
2
REF
PIN 1
COM
INDICATOR
3
4
SET
ADF4351
GNDVCO
5
6
7
8
V
TOP VIEW
TUNE
VP
(Not to Scale)
TEM
A
V
P
CP
OUT
GND
GNDVCO
VCO
CP
NOTES
1. THE LFCSP HAS AN EXPOSED PAD THAT
MUST BE CONNECTED TO GND.
Figure 3. Pin Configuration
Table 5. Pin Function Descriptions
Pin No.
Mnemonic
Description
1
CLK
Serial Clock Input. Data is clocked into the 32-bit shift register on the CLK rising edge. This input is a high
impedance CMOS input.
2
3
4
DATA
LE
Serial Data Input. The serial data is loaded MSB first with the three LSBs as the control bits. This input is a high
impedance CMOS input.
Load Enable. When LE goes high, the data stored in the 32-bit shift register is loaded into the register that is
selected by the three control bits. This input is a high impedance CMOS input.
Chip Enable. A logic low on this pin powers down the device and puts the charge pump into three-state mode.
A logic high on this pin powers up the device, depending on the status of the power-down bits.
CE
5
6
SW
VP
Fast Lock Switch. A connection should be made from the loop filter to this pin when using the fast lock mode.
Charge Pump Power Supply. VP must have the same value as AVDD. Place decoupling capacitors to the ground
plane as close to this pin as possible.
7
CPOUT
Charge Pump Output. When enabled, this output provides ICP to the external loop filter. The output of the
loop filter is connected to VTUNE to drive the internal VCO.
8
9
10
CPGND
AGND
AVDD
Charge Pump Ground. This output is the ground return pin for CPOUT
Analog Ground. Ground return pin for AVDD
Analog Power Supply. This pin ranges from 3.0 V to 3.6 V. Place decoupling capacitors to the analog ground
.
.
plane as close to this pin as possible. AVDD must have the same value as DVDD
.
11, 18, 21
12
AGNDVCO
RFOUTA+
VCO Analog Ground. Ground return pins for the VCO.
VCO Output. The output level is programmable. The VCO fundamental output or a divided-down version is
available.
13
RFOUTA−
RFOUTB+
RFOUTB−
VVCO
Complementary VCO Output. The output level is programmable. The VCO fundamental output or a divided-
down version is available.
Auxiliary VCO Output. The output level is programmable. The VCO fundamental output or a divided-down
version is available.
Complementary Auxiliary VCO Output. The output level is programmable. The VCO fundamental output or a
divided-down version is available.
Power Supply for the VCO. This pin ranges from 3.0 V to 3.6 V. Place decoupling capacitors to the analog
14
15
16, 17
19
ground plane as close to these pins as possible. VVCO must have the same value as AVDD
.
TEMP
Temperature Compensation Output. Place decoupling capacitors to the ground plane as close to this pin as
possible.
20
VTUNE
Control Input to the VCO. This voltage determines the output frequency and is derived from filtering the CPOUT
output voltage.
Rev. 0 | Page 7 of 28
ADF4351
Data Sheet
Pin No.
Mnemonic
Description
22
RSET
Connecting a resistor between this pin and ground sets the charge pump output current. The nominal voltage
bias at the RSET pin is 0.55 V. The relationship between ICP and RSET is as follows:
ICP = 25.5/RSET
where:
RSET = 5.1 kΩ.
ICP = 5 mA.
23
VCOM
Internal Compensation Node. Biased at half the tuning range. Place decoupling capacitors to the ground plane
as close to this pin as possible.
24
25
VREF
LD
Reference Voltage. Place decoupling capacitors to the ground plane as close to this pin as possible.
Lock Detect Output Pin. A logic high output on this pin indicates PLL lock. A logic low output indicates loss
of PLL lock.
26
27
28
PDBRF
DGND
DVDD
RF Power-Down. A logic low on this pin mutes the RF outputs. This function is also software controllable.
Digital Ground. Ground return pin for DVDD
.
Digital Power Supply. DVDD must have the same value as AVDD. Place decoupling capacitors to the ground
plane as close to this pin as possible.
29
30
REFIN
Reference Input. This CMOS input has a nominal threshold of AVDD/2 and a dc equivalent input resistance of
100 kΩ. This input can be driven from a TTL or CMOS crystal oscillator, or it can be ac-coupled.
Multiplexer Output. The multiplexer output allows the lock detect value, the N divider value, or the R counter
value to be accessed externally.
MUXOUT
31
32
SDGND
SDVDD
Digital Σ-Δ Modulator Ground. Ground return pin for the Σ-Δ modulator.
Power Supply Pin for the Digital Σ-Δ Modulator. SDVDD must have the same value as AVDD. Place decoupling
capacitors to the ground plane as close to this pin as possible.
EP
Exposed Pad Exposed Pad. The LFCSP has an exposed pad that must be connected to GND.
Rev. 0 | Page 8 of 28
Data Sheet
ADF4351
TYPICAL PERFORMANCE CHARACTERISTICS
–90
–100
–110
–120
–130
–140
–150
–160
–170
–40
–50
DIV1
DIV2
DIV4
DIV8
DIV16
DIV32
DIV64
–60
–70
–80
–90
–100
–110
–120
–130
–140
–150
–160
1k
10k
100k
1M
10M
1k
10k
100k
1M
10M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 4. Open-Loop VCO Phase Noise, 2.2 GHz
Figure 7. Closed-Loop Phase Noise, Fundamental VCO and Dividers,
VCO = 2.2 GHz, PFD = 25 MHz, Loop Filter Bandwidth = 63 kHz
–40
–90
DIV1
–50
–60
DIV2
DIV4
DIV8
–100
DIV16
DIV32
DIV64
–70
–110
–120
–130
–140
–150
–160
–170
–80
–90
–100
–110
–120
–130
–140
–150
–160
1k
10k
100k
1M
10M
1k
10k
100k
1M
10M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 5. Open-Loop VCO Phase Noise, 3.3 GHz
Figure 8. Closed-Loop Phase Noise, Fundamental VCO and Dividers,
VCO = 3.3 GHz, PFD = 25 MHz, Loop Filter Bandwidth = 63 kHz
–40
–50
–90
DIV1
DIV2
DIV4
DIV8
DIV16
DIV32
DIV64
–100
–110
–120
–60
–70
–80
–90
–100
–110
–120
–130
–140
–150
–160
–130
–140
–150
–160
–170
1k
10k
100k
1M
10M
1k
10k
100k
1M
10M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 6. Open-Loop VCO Phase Noise, 4.4 GHz
Figure 9. Closed-Loop Phase Noise, Fundamental VCO and Dividers,
VCO = 4.4 GHz, PFD = 25 MHz, Loop Filter Bandwidth = 63 kHz
Rev. 0 | Page 9 of 28
ADF4351
Data Sheet
–60
–70
–60
–70
–80
–80
–90
–90
–100
–110
–120
–130
–140
–150
–100
–110
–120
–130
–140
–150
–160
–160
1k
10k
100k
1M
10M
1k
10k
100k
1M
10M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 13. Fractional-N Spur Performance, Low Noise Mode, LTE Band;
RFOUT = 2646.96 MHz, REFIN = 122.88 MHz, PFD = 30.72 MHz; Loop Filter
Bandwidth = 60 kHz, Channel Spacing = 240 kHz; Phase Word = 9,
RMS Phase Error = 0.28°, RMS Jitter = 0.29 ps, EVM = 0.49%
Figure 10. Fractional-N Spur Performance, Low Noise Mode, W-CDMA Band;
RFOUT = 2111.28 MHz, REFIN = 122.88 MHz, PFD = 30.72 MHz, Output Divide-by-2
Selected; Loop Filter Bandwidth = 60 kHz, Channel Spacing = 240 kHz;
RMS Phase Error = 0.21°, RMS Jitter = 0.27 ps, EVM = 0.37%
–60
–70
–60
–70
–80
–80
–90
–90
–100
–110
–120
–130
–140
–150
–160
–100
–110
–120
–130
–140
–150
–160
1k
10k
100k
1M
10M
1k
10k
100k
1M
10M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 11. Fractional-N Spur Performance, Low Spur Mode, W-CDMA Band;
RFOUT = 2111.28 MHz, REFIN = 122.88 MHz, PFD = 30.72 MHz, Output Divide-by-2
Selected; Loop Filter Bandwidth = 60 kHz, Channel Spacing = 240 kHz;
RMS Phase Error = 0.37°, RMS Jitter = 0.49 ps, EVM = 0.64%
Figure 14. Fractional-N Spur Performance, Low Spur Mode, LTE Band;
RFOUT = 2646.96 MHz, REFIN = 122.88 MHz, PFD = 30.72 MHz;
Loop Filter Bandwidth = 60 kHz, Channel Spacing = 240 kHz;
RMS Phase Error = 0.56°, RMS Jitter = 0.59 ps, EVM = 0.98%
–60
–70
–60
–70
–80
–80
–90
–90
–100
–110
–120
–130
–140
–150
–160
–100
–110
–120
–130
–140
–150
–160
1k
10k
100k
1M
10M
1k
10k
100k
1M
10M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 15. Fractional-N Spur Performance, Low Noise Mode, W-CDMA Band;
RFOUT = 2646.96 MHz, REFIN = 122.88 MHz, PFD = 30.72 MHz;
Loop Filter Bandwidth = 20 kHz, Channel Spacing = 240 kHz;
RMS Phase Error = 0.35°, RMS Jitter = 0.36 ps, EVM = 0.61%
Figure 12. Fractional-N Spur Performance, Low Noise Mode, W-CDMA Band;
RFOUT = 2111.28 MHz, REFIN = 122.88 MHz, PFD = 30.72 MHz, Output Divide-by-2
Selected; Loop Filter Bandwidth = 20 kHz, Channel Spacing = 240 kHz;
RMS Phase Error = 0.25°, RMS Jitter = 0.32 ps, EVM = 0.44%
Rev. 0 | Page 10 of 28
Data Sheet
ADF4351
CIRCUIT DESCRIPTION
The PFD frequency (fPFD) equation is
PFD = REFIN × [(1 + D)/(R × (1 + T))]
REFERENCE INPUT SECTION
f
(2)
The reference input stage is shown in Figure 16. The SW1 and
SW2 switches are normally closed. The SW3 switch is normally
open. When power-down is initiated, SW3 is closed, and SW1
and SW2 are opened. In this way, no loading of the REFIN pin
occurs during power-down.
where:
REFIN is the reference input frequency.
D is the REFIN doubler bit (0 or 1).
R is the preset divide ratio of the binary 10-bit programmable
reference counter (1 to 1023).
POWER-DOWN
CONTROL
T is the REFIN divide-by-2 bit (0 or 1).
100kΩ
SW2
NC
Integer-N Mode
TO R COUNTER
REF
IN
NC
SW1
If FRAC = 0 and the DB8 (LDF) bit in Register 2 is set to 1, the
synthesizer operates in integer-N mode. The DB8 bit in Register 2
should be set to 1 for integer-N digital lock detect.
BUFFER
SW3
NO
R Counter
Figure 16. Reference Input Stage
The 10-bit R counter allows the input reference frequency
(REFIN) to be divided down to produce the reference clock
to the PFD. Division ratios from 1 to 1023 are allowed.
RF N DIVIDER
The RF N divider allows a division ratio in the PLL feedback
path. The division ratio is determined by the INT, FRAC, and
MOD values, which build up this divider (see Figure 17).
PHASE FREQUENCY DETECTOR (PFD) AND
CHARGE PUMP
RF N DIVIDER
N = INT + FRAC/MOD
FROM
VCO OUTPUT/
OUTPUT DIVIDERS
The phase frequency detector (PFD) takes inputs from the
R counter and N counter and produces an output proportional
to the phase and frequency difference between them. Figure 18
is a simplified schematic of the phase frequency detector.
UP
TO PFD
N COUNTER
THIRD-ORDER
FRACTIONAL
INTERPOLATOR
HIGH
D1
Q1
U1
CLR1
INT
VALUE
FRAC
VALUE
MOD
VALUE
+IN
CHARGE
PUMP
CP
U3
DELAY
DOWN
OUT
Figure 17. RF N Divider
INT, FRAC, MOD, and R Counter Relationship
The INT, FRAC, and MOD values, in conjunction with the
R counter, make it possible to generate output frequencies that
are spaced by fractions of the PFD frequency. For more informa-
tion, see the RF Synthesizer—A Worked Example section.
CLR2
D2 Q2
HIGH
U2
–IN
Figure 18. PFD Simplified Schematic
The RF VCO frequency (RFOUT) equation is
The PFD includes a programmable delay element that sets the
width of the antibacklash pulse (ABP). This pulse ensures that
there is no dead zone in the PFD transfer function. Bit DB22 in
Register 3 (R3) is used to set the ABP as follows:
RFOUT = fPFD × (INT + (FRAC/MOD))
where:
RFOUT is the output frequency of the voltage controlled oscillator
(1)
(VCO).
•
When Bit DB22 is set to 0, the ABP width is programmed to
6 ns, the recommended value for fractional-N applications.
When Bit DB22 is set to 1, the ABP width is programmed to
3 ns, the recommended value for integer-N applications.
INT is the preset divide ratio of the binary 16-bit counter (23 to
65,535 for the 4/5 prescaler; 75 to 65,535 for the 8/9 prescaler).
FRAC is the numerator of the fractional division (0 to MOD − 1).
MOD is the preset fractional modulus (2 to 4095).
•
For integer-N applications, the in-band phase noise is improved
by enabling the shorter pulse width. The PFD frequency can
operate up to 90 MHz in this mode. To operate with PFD
frequencies higher than 45 MHz, VCO band select must be dis-
abled by setting the phase adjust bit (DB28) to 1 in Register 1.
Rev. 0 | Page 11 of 28
ADF4351
Data Sheet
MUXOUT AND LOCK DETECT
PROGRAM MODES
The multiplexer output on the ADF4351 allows the user to access
various internal points on the chip. The state of MUXOUT is
controlled by the M3, M2, and M1 bits in Register 2 (see Figure 26).
Figure 19 shows the MUXOUT section in block diagram form.
Table 6 and Figure 23 through Figure 29 show how the program
modes are set up in the ADF4351.
The following settings in the ADF4351 are double buffered: phase
value, modulus value, reference doubler, reference divide-by-2,
R counter value, and charge pump current setting. Before the part
uses a new value for any double-buffered setting, the following
two events must occur:
DV
DD
THREE-STATE OUTPUT
DV
DD
1. The new value is latched into the device by writing to the
appropriate register.
2. A new write is performed on Register 0 (R0).
DGND
R COUNTER OUTPUT
N DIVIDER OUTPUT
MUX
CONTROL
MUXOUT
ANALOG LOCK DETECT
For example, any time that the modulus value is updated,
Register 0 (R0) must be written to, to ensure that the modulus
value is loaded correctly. The divider select value in Register 4
(R4) is also double buffered, but only if the DB13 bit of
Register 2 (R2) is set to 1.
DIGITAL LOCK DETECT
RESERVED
DGND
Figure 19. MUXOUT Schematic
VCO
INPUT SHIFT REGISTERS
The VCO core in the ADF4351 consists of three separate VCOs,
each of which uses 16 overlapping bands, as shown in Figure 20,
to allow a wide frequency range to be covered without a large
VCO sensitivity (KV) and resultant poor phase noise and spur-
ious performance.
The ADF4351 digital section includes a 10-bit RF R counter,
a 16-bit RF N counter, a 12-bit FRAC counter, and a 12-bit
modulus counter. Data is clocked into the 32-bit shift register
on each rising edge of CLK. The data is clocked in MSB first.
Data is transferred from the shift register to one of six latches
on the rising edge of LE. The destination latch is determined by
the state of the three control bits (C3, C2, and C1) in the shift
register. As shown in Figure 2, the control bits are the three LSBs:
DB2, DB1, and DB0. Table 6 shows the truth table for these bits.
Figure 23 summarizes how the latches are programmed.
3.0
2.5
2.0
1.5
1.0
0.5
0
Table 6. Truth Table for the C3, C2, and C1 Control Bits
Control Bits
C3
0
C2
0
C1
0
Register
Register 0 (R0)
Register 1 (R1)
Register 2 (R2)
Register 3 (R3)
Register 4 (R4)
Register 5 (R5)
0
0
1
0
1
0
2.0
2.5
3.0
3.5
4.0
4.5
0
1
1
FREQUENCY (GHz)
1
0
0
Figure 20. VTUNE vs. Frequency
1
0
1
The correct VCO and band are selected automatically by the
VCO and band select logic at power-up or whenever Register 0
(R0) is updated.
VCO and band selection take 10 PFD cycles multiplied by the
value of the band select clock divider. The VCO VTUNE is discon-
nected from the output of the loop filter and is connected to an
internal reference voltage.
Rev. 0 | Page 12 of 28
Data Sheet
ADF4351
The R counter output is used as the clock for the band select
logic. A programmable divider is provided at the R counter
output to allow division by an integer from 1 to 255; the divider
value is set using Bits[DB19:DB12] in Register 4 (R4). When the
required PFD frequency is higher than 125 kHz, the divide ratio
should be set to allow enough time for correct band selection.
OUTPUT STAGE
The RFOUTA+ and RFOUTA− pins of the ADF4351 are connected
to the collectors of an NPN differential pair driven by buffered
outputs of the VCO, as shown in Figure 22.
RF
A+
RF
A–
OUT
OUT
Band selection takes 10 cycles of the PFD frequency, equal to
80 µs. If faster lock times are required, Bit DB23 in Register 3
(R3) must be set to 1. This setting allows the user to select a
higher band select clock frequency of up to 500 kHz, which
speeds up the minimum band select time to 20 µs. For phase
adjustments and small (<1 MHz) frequency adjustments, the
user can disable VCO band selection by setting Bit DB28 in
Register 1 (R1) to 1. This setting selects the phase adjust feature.
BUFFER/
DIVIDE-BY-1/-2/-4/-8/
-16/-32/-64
VCO
Figure 22. Output Stage
To allow the user to optimize the power dissipation vs. the
output power requirements, the tail current of the differential
pair is programmable using Bits[DB4:DB3] in Register 4 (R4).
Four current levels can be set. These levels give output power
levels of −4 dBm, −1 dBm, +2 dBm, and +5 dBm, using a 50 Ω
resistor to AVDD and ac coupling into a 50 Ω load. Alternatively,
both outputs can be combined in a 1 + 1:1 transformer or a 180°
microstrip coupler (see the Output Matching section).
After band selection, normal PLL action resumes. The nominal
value of KV is 40 MHz/V when the N divider is driven from the
VCO output or from this value divided by D. D is the output
divider value if the N divider is driven from the RF divider output
(selected by programming Bits[DB22:DB20] in Register 4). The
ADF4351 contains linearization circuitry to minimize any vari-
ation of the product of ICP and KV to keep the loop bandwidth
constant.
If the outputs are used individually, the optimum output stage
consists of a shunt inductor to VVCO. The unused complementary
output must be terminated with a similar circuit to the used output.
The VCO shows variation of KV as the VTUNE varies within the
band and from band to band. For wideband applications cover-
ing a wide frequency range (and changing output dividers), a
value of 40 MHz/V provides the most accurate KV because this
value is closest to an average value. Figure 21 shows how KV
varies with fundamental VCO frequency, along with an average
value for the frequency band. Users may prefer this figure when
using narrow-band designs.
An auxiliary output stage exists on the RFOUTB+ and RFOUTB−
pins, providing a second set of differential outputs that can be
used to drive another circuit. The auxiliary output stage can be
used only if the primary outputs are enabled. If the auxiliary
output stage is not used, it can be powered down.
Another feature of the ADF4351 is that the supply current to
the RF output stage can be shut down until the part achieves
lock, as measured by the digital lock detect circuitry. This
feature is enabled by setting the mute till lock detect (MTLD)
bit in Register 4 (R4).
80
70
60
50
40
30
20
10
0
2.0
2.5
3.0
3.5
4.0
4.5
FREQUENCY (GHz)
Figure 21. VCO Sensitivity (KV) vs. Frequency
Rev. 0 | Page 13 of 28
ADF4351
Data Sheet
REGISTER MAPS
REGISTER 0
CONTROL
BITS
16-BIT INTEGER VALUE (INT)
12-BIT FRACTIONAL VALUE (FRAC)
DB31 DB30 DB29 DB28 DB27 DB26 DB25 DB24 DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
0
N16 N15 N14 N13 N12 N11 N10
N9
N8
N7
N6
N5
N4
N3
N2
N1
F12 F11
F10
F9
F8
F7
F6
F5
F4
F3
F2
F1 C3(0) C2(0) C1(0)
REGISTER 1
CONTROL
BITS
1
1
RESERVED
12-BIT PHASE VALUE (PHASE)
12-BIT MODULUS VALUE (MOD)
DBR
DBR
DB31 DB30 DB29 DB28 DB27 DB26 DB25 DB24 DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
0
0
0
PH1 PR1 P12 P11 P10
P9
P8
P7
P6
P5
P4
P3
P2
P1
M12 M11 M10
M9
M8
M7 M6 M5 M4 M3 M2 M1 C3(0) C2(0) C1(1)
REGISTER 2
LOW
CHARGE
PUMP
CURRENT
SETTING
NOISE AND
LOW SPUR
MODES
1
CONTROL
BITS
1
MUXOUT
10-BIT R COUNTER
DBR
DBR
DB31 DB30 DB29 DB28 DB27 DB26 DB25 DB24 DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
0
L2
L1
M3
M2
M1 RD2 RD1 R10
R9
R8
R7
R6
R5
R4
R3
R2
R1
D1
CP4 CP3 CP2 CP1 U6
U5
U4
U3
U2
U1 C3(0) C2(1) C1(0)
REGISTER 3
CLK
DIV
MODE
RESERVED
RESERVED
CONTROL
BITS
12-BIT CLOCK DIVIDER VALUE
DB31 DB30 DB29 DB28 DB27 DB26 DB25 DB24 DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
0
0
0
0
0
0
0
0
F4
F3
F2
0
0
F1
0
C2
C1
D12 D11 D10
D9
D8
D7
D6
D5
D4
D3
D2
D1 C3(0) C2(1) C1(1)
REGISTER 4
2
DBB
AUX
OUTPUT
POWER
RF DIVIDER
SELECT
OUTPUT
POWER
RESERVED
CONTROL
BITS
8-BIT BAND SELECT CLOCK DIVIDER VALUE
DB31 DB30 DB29 DB28 DB27 DB26 DB25 DB24 DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
0
0
0
0
0
0
0
0
D13 D12 D11 D10 BS8 BS7 BS6 BS5 BS4 BS3 BS2 BS1
D9
D8
D7
D6
D5
D4
D3
D2
D1 C3(1) C2(0) C1(0)
REGISTER 5
LD PIN
MODE
CONTROL
BITS
RESERVED
RESERVED
RESERVED
DB31 DB30 DB29 DB28 DB27 DB26 DB25 DB24 DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
D15 D14 C3(1) C2(0) C1(1)
0
0
0
0
0
0
0
0
0
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
2
DBR = DOUBLE-BUFFERED REGISTER—BUFFERED BY THE WRITE TO REGISTER 0.
DBB = DOUBLE-BUFFERED BITS—BUFFERED BY THE WRITE TO REGISTER 0, IF AND ONLY IF DB13 OF REGISTER 2 IS HIGH.
Figure 23. Register Summary
Rev. 0 | Page 14 of 28
Data Sheet
ADF4351
CONTROL
BITS
16-BIT INTEGER VALUE (INT)
12-BIT FRACTIONAL VALUE (FRAC)
DB31 DB30 DB29 DB28 DB27 DB26 DB25 DB24 DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
0
N16
N15
N14
N13
N12
N11
N10
N9
N8
N7
N6
N5
N4
N3
N2
N1
F12
F11
F10
F9
F8
F7
F6
F5
F4
F3
F2
F1 C3(0) C2(0) C1(0)
F12
F11 ... F2
F1
FRACTIONAL VALUE (FRAC)
N16
N15
...
...
...
...
...
...
...
...
...
...
...
...
N5
N4
N3
N2
N1
INTEGER VALUE (INT)
0
0
0
0
.
0
0
0
0
.
...
...
...
...
...
...
...
...
...
...
...
0
0
1
1
.
0
1
0
1
.
0
0
0
0
.
0
0
0
.
0
0
0
.
0
0
0
.
0
0
0
.
0
0
1
.
0
1
0
.
NOT ALLOWED
1
NOT ALLOWED
2
NOT ALLOWED
3
...
.
0
0
0
.
0
0
0
.
1
1
1
.
0
0
1
.
1
1
0
.
1
1
0
.
0
1
0
.
NOT ALLOWED
23
.
.
.
.
.
24
.
.
.
.
.
...
1
1
1
1
1
1
1
1
0
0
1
1
0
1
0
1
4092
4093
4094
4095
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
1
1
1
0
1
65,533
65,534
65,535
INTmin = 75 WITH PRESCALER = 8/9
Figure 24. Register 0 (R0)
CONTROL
BITS
RESERVED
12-BIT PHASE VALUE (PHASE)
DBR
12-BIT MODULUS VALUE (MOD)
DBR
DB31 DB30 DB29 DB28 DB27 DB26 DB25 DB24 DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
0
0
0
PH1
PR1 P12
P11
P10
P9
P8
P7
P6
P5
P4
P3
P2
P1
M12 M11 M10
M9
M8
M7 M6
M5
M4
M3
M2
M1 C3(0) C2(0) C1(1)
P12
P11 ... P2
P1
0
1
0
1
.
PHASE VALUE (PHASE)
M12
M11 ... M2
M1
INTERPOLATOR MODULUS (MOD)
0
0
0
0
.
0
0
0
0
.
...
...
...
...
...
...
...
...
...
...
...
0
0
1
1
.
0
0
0
.
0
0
.
...
...
...
...
...
...
...
...
...
1
1
.
0
1
.
2
3
1 (RECOMMENDED)
.
2
.
.
.
.
.
3
.
.
.
.
.
.
PH1 PHASE ADJ
1
1
1
1
1
1
1
1
0
0
1
1
0
1
0
1
4092
4093
4094
4095
0
1
OFF
ON
.
.
.
.
.
.
.
.
.
.
1
1
1
1
1
1
1
1
0
0
1
1
0
1
0
1
4092
4093
4094
4095
PR1 PRESCALER
0
1
4/5
8/9
Figure 25. Register 1 (R1)
Rev. 0 | Page 15 of 28
ADF4351
Data Sheet
CHARGE
PUMP
CURRENT
SETTING
LOW
NOISE AND
LOW SPUR
MODES
CONTROL
BITS
MUXOUT
10-BIT R COUNTER
DBR
DB31 DB30 DB29 DB28 DB27 DB26 DB25 DB24 DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
0
L2
L1
M3
M2
M1 RD2 RD1 R10
R9
R8
R7
R6
R5
R4
R3
R2
R1
D1
CP4 CP3 CP2 CP1 U6
U5
U4
U3
U2
U1 C3(0) C2(1) C1(0)
REFERENCE
RD2
COUNTER
RESET
DOUBLE BUFFER
R4 [DB22:DB20]
U1
L2
0
L1
NOISE MODE
DOUBLER
D1
U6
0
LDF
0
1
DISABLED
ENABLED
0
1
0
1
LOW NOISE MODE
RESERVED
FRAC-N
INT-N
0
1
DISABLED
ENABLED
0
1
DISABLED
ENABLED
0
1
1
RESERVED
RD1 REFERENCE DIVIDE-BY-2
CP
1
LOW SPUR MODE
I
(mA)
CP
U2
U5
LDP
THREE-STATE
0
1
DISABLED
ENABLED
CP4
CP3
CP2
CP1
5.1kΩ
0
1
10ns
6ns
0
1
DISABLED
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0.31
0.63
0.94
1.25
1.56
1.88
2.19
2.50
2.81
3.13
3.44
3.75
4.06
4.38
4.69
5.00
ENABLED
R10
R9
... R2
R1
R COUNTER (R)
U3
POWER-DOWN
DISABLED
U4
0
PD POLARITY
NEGATIVE
POSITIVE
0
0
.
0
0
.
...
...
...
...
...
...
...
...
...
0
1
.
1
0
.
1
0
1
2
ENABLED
1
.
.
.
.
.
.
.
.
.
.
.
1
1
1
1
1
1
1
1
0
0
1
1
0
1
0
1
1020
1021
1022
1023
M3
M2
0
M1
0
OUTPUT
0
0
0
0
1
1
1
1
THREE-STATE OUTPUT
0
1
DV
DD
1
0
DGND
1
1
R COUNTER OUTPUT
N DIVIDER OUTPUT
ANALOG LOCK DETECT
DIGITAL LOCK DETECT
RESERVED
0
0
0
1
1
0
1
1
Figure 26. Register 2 (R2)
CLK
DIV
MODE
CONTROL
BITS
RESERVED
12-BIT CLOCK DIVIDER VALUE
DB31 DB30 DB29 DB28 DB27 DB26 DB25 DB24 DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
0
0
0
0
0
0
0
0
F4
F3
F2
0
F1
0
C2
C1
D12 D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1 C3(0) C2(1) C1(1)
0
D12
D11 ... D2
D1
CLOCK DIVIDER VALUE
CYCLE SLIP
REDUCTION
F1
0
0
0
0
.
0
...
...
...
...
...
...
...
...
...
...
...
0
0
1
1
.
0
1
0
1
.
0
0
1
DISABLED
ENABLED
0
0
0
.
1
2
3
BAND SELECT
CLOCK MODE
CHARGE
.
F4
F2
CANCELATION
.
.
.
.
.
C2
0
C1
0
CLOCK DIVIDER MODE
CLOCK DIVIDER OFF
FAST LOCK ENABLE
RESYNC ENABLE
RESERVED
0
1
LOW
HIGH
0
1
DISABLED
ENABLED
.
.
.
.
.
1
1
1
1
1
1
1
1
0
0
1
1
0
1
0
1
4092
4093
4094
4095
0
1
ANTIBACKLASH
PULSE WIDTH
1
0
F3
1
1
0
1
6ns (FRAC-N)
3ns (INT-N)
Figure 27. Register 3 (R3)
Rev. 0 | Page 16 of 28
Data Sheet
ADF4351
AUX
OUTPUT
POWER
RF DIVIDER
SELECT
OUTPUT
POWER
CONTROL
BITS
RESERVED
DBB
8-BIT BAND SELECT CLOCK DIVIDER VALUE
DB31 DB30 DB29 DB28 DB27 DB26 DB25 DB24 DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
0
0
0
0
0
0
0
0
D13 D12 D11 D10 BS8 BS7 BS6 BS5 BS4 BS3 BS2 BS1
D9
D8
D7
D6
D5
D4
D3
D2
D1 C3(1) C2(0) C1(0)
FEEDBACK
SELECT
VCO
D13
D2
0
D1
0
OUTPUT POWER
D9
POWER-DOWN
0
1
–4dBm
–1dBm
+2dBm
+5dBm
DIVIDED
0
1
VCO POWERED UP
FUNDAMENTAL
0
1
VCO POWERED DOWN
1
0
MUTE TILL
D12
D11
D10
RF DIVIDER SELECT
1
1
D8
0
LOCK DETECT
0
0
0
0
1
1
1
0
0
1
1
0
0
1
0
1
0
1
0
1
0
÷1
MUTE DISABLED
MUTE ENABLED
D3
0
RF OUT
÷2
1
DISABLED
ENABLED
÷4
1
÷8
AUX OUTPUT
D7
SELECT
÷16
÷32
÷64
D5
D4
0
AUX OUTPUT POWER
–4dBm
0
1
DIVIDED OUTPUT
FUNDAMENTAL
0
0
1
1
1
–1dBm
0
+2dBm
D6
0
AUX OUT
BS8
BS7
... BS2
BS1
BAND SELECT CLOCK DIVIDER
1
+5dBm
DISABLED
ENABLED
0
0
.
0
0
.
...
...
...
...
...
...
...
...
...
0
1
.
1
0
.
1
1
2
.
.
.
.
.
.
.
.
.
.
.
1
1
1
1
1
1
1
1
0
0
1
1
0
1
0
1
252
253
254
255
Figure 28. Register 4 (R4)
LD PIN
MODE
CONTROL
BITS
RESERVED
RESERVED
RESERVED
DB31 DB30 DB29 DB28 DB27 DB26 DB25 DB24 DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
0
0
0
0
0
0
0
0
D15
D14
0
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
C3(1) C2(0) C1(1)
D15
0
D14
0
LOCK DETECT PIN OPERATION
LOW
0
1
DIGITAL LOCK DETECT
1
0
LOW
HIGH
1
1
Figure 29. Register 5 (R5)
Rev. 0 | Page 17 of 28
ADF4351
Data Sheet
12-Bit Phase Value
REGISTER 0
Bits[DB26:DB15] control the phase word. The phase word must
be less than the MOD value programmed in Register 1. The phase
word is used to program the RF output phase from 0° to 360°
with a resolution of 360°/MOD (see the Phase Resync section).
Control Bits
When Bits[C3:C1] are set to 000, Register 0 is programmed.
Figure 24 shows the input data format for programming this
register.
In most applications, the phase relationship between the RF
signal and the reference is not important. In such applications,
the phase value can be used to optimize the fractional and sub-
fractional spur levels. For more information, see the Spur
Consistency and Fractional Spur Optimization section.
16-Bit Integer Value (INT)
The 16 INT bits (Bits[DB30:DB15]) set the INT value, which
determines the integer part of the feedback division factor. The
INT value is used in Equation 1 (see the INT, FRAC, MOD, and
R Counter Relationship section). Integer values from 23 to
65,535 are allowed for the 4/5 prescaler; for the 8/9 prescaler,
the minimum integer value is 75.
If neither the phase resync nor the spurious optimization func-
tion is used, it is recommended that the phase word be set to 1.
12-Bit Modulus Value (MOD)
12-Bit Fractional Value (FRAC)
The 12 MOD bits (Bits[DB14:DB3]) set the fractional modulus.
The fractional modulus is the ratio of the PFD frequency to the
channel step resolution on the RF output. For more information,
see the 12-Bit Programmable Modulus section.
The 12 FRAC bits (Bits[DB14:DB3]) set the numerator of the
fraction that is input to the Σ-Δ modulator. This fraction, along
with the INT value, specifies the new frequency channel that
the synthesizer locks to, as shown in the RF Synthesizer—A
Worked Example section. FRAC values from 0 to (MOD − 1)
cover channels over a frequency range equal to the PFD refer-
ence frequency.
REGISTER 2
Control Bits
When Bits[C3:C1] are set to 010, Register 2 is programmed.
Figure 26 shows the input data format for programming this
register.
REGISTER 1
Control Bits
When Bits[C3:C1] are set to 001, Register 1 is programmed.
Figure 25 shows the input data format for programming this
register.
Low Noise and Low Spur Modes
The noise mode on the ADF4351 is controlled by setting
Bits[DB30:DB29] in Register 2 (see Figure 26). The noise mode
allows the user to optimize a design either for improved spurious
performance or for improved phase noise performance.
Phase Adjust
The phase adjust bit (Bit DB28) enables adjustment of the output
phase of a given output frequency. When phase adjustment is
enabled (Bit DB28 is set to 1), the part does not perform VCO
band selection or phase resync when Register 0 is updated.
When phase adjustment is disabled (Bit DB28 is set to 0), the
part performs VCO band selection and phase resync (if phase
resync is enabled in Register 3, Bits[DB16:DB15]) when Register 0
is updated. Disabling VCO band selection is recommended only
for fixed frequency applications or for frequency deviations of
<1 MHz from the originally selected frequency.
When the low spur mode is selected, dither is enabled. Dither
randomizes the fractional quantization noise so that it resembles
white noise rather than spurious noise. As a result, the part is
optimized for improved spurious performance. Low spur mode
is normally used for fast-locking applications when the PLL
closed-loop bandwidth is wide. Wide loop bandwidth is a loop
bandwidth greater than 1/10 of the RFOUT channel step resolu-
tion (fRES). A wide loop filter does not attenuate the spurs to the
same level as a narrow loop bandwidth.
Prescaler Value
For best noise performance, use the low noise mode option.
When the low noise mode is selected, dither is disabled. This
mode ensures that the charge pump operates in an optimum
region for noise performance. Low noise mode is extremely
useful when a narrow loop filter bandwidth is available. The
synthesizer ensures extremely low noise, and the filter attenuates
the spurs. Figure 10 through Figure 12 show the trade-offs in a
typical W-CDMA setup for different noise and spur settings.
The dual-modulus prescaler (P/P + 1), along with the INT,
FRAC, and MOD values, determines the overall division
ratio from the VCO output to the PFD input. The PR1 bit
(DB27) in Register 1 sets the prescaler value.
Operating at CML levels, the prescaler takes the clock from the
VCO output and divides it down for the counters. The prescaler
is based on a synchronous 4/5 core. When the prescaler is set to
4/5, the maximum RF frequency allowed is 3.6 GHz. Therefore,
when operating the ADF4351 above 3.6 GHz, the prescaler must
be set to 8/9. The prescaler limits the INT value as follows:
MUXOUT
The on-chip multiplexer is controlled by Bits[DB28:DB26]
(see Figure 26). Note that N counter output must be disabled
for VCO band selection to operate correctly.
•
•
Prescaler = 4/5: NMIN = 23
Prescaler = 8/9: NMIN = 75
Rev. 0 | Page 18 of 28
Data Sheet
ADF4351
Reference Doubler
For fractional-N applications, the recommended setting for
Bits[DB8:DB7] is 00; for integer-N applications, the recom-
mended setting for Bits[DB8:DB7] is 11.
Setting the DB25 bit to 0 disables the doubler and feeds the REFIN
signal directly into the 10-bit R counter. Setting this bit to 1 multi-
plies the REFIN frequency by a factor of 2 before feeding it into
the 10-bit R counter. When the doubler is disabled, the REFIN
falling edge is the active edge at the PFD input to the fractional
synthesizer. When the doubler is enabled, both the rising and
falling edges of REFIN become active edges at the PFD input.
Phase Detector Polarity
The DB6 bit sets the phase detector polarity. When a passive
loop filter or a noninverting active loop filter is used, this bit
should be set to 1. If an active filter with an inverting charac-
teristic is used, this bit should be set to 0.
When the doubler is enabled and the low spur mode is selected,
the in-band phase noise performance is sensitive to the REFIN duty
cycle. The phase noise degradation can be as much as 5 dB for
REFIN duty cycles outside a 45% to 55% range. The phase noise
is insensitive to the REFIN duty cycle in the low noise mode and
when the doubler is disabled.
Power-Down (PD)
The DB5 bit provides the programmable power-down mode.
Setting this bit to 1 performs a power-down. Setting this bit to 0
returns the synthesizer to normal operation. In software power-
down mode, the part retains all information in its registers. The
register contents are lost only if the supply voltages are removed.
The maximum allowable REFIN frequency when the doubler is
enabled is 30 MHz.
When power-down is activated, the following events occur:
•
•
•
•
•
•
Synthesizer counters are forced to their load state conditions.
VCO is powered down.
Charge pump is forced into three-state mode.
Digital lock detect circuitry is reset.
RFOUT buffers are disabled.
RDIV2
Setting the DB24 bit to 1 inserts a divide-by-2 toggle flip-flop
between the R counter and the PFD, which extends the maximum
REFIN input rate. This function allows a 50% duty cycle signal to
appear at the PFD input, which is necessary for cycle slip reduction.
Input registers remain active and capable of loading and
latching data.
10-Bit R Counter
The 10-bit R counter (Bits[DB23:DB14]) allows the input reference
frequency (REFIN) to be divided down to produce the reference
clock to the PFD. Division ratios from 1 to 1023 are allowed.
Charge Pump Three-State
Setting the DB4 bit to 1 puts the charge pump into three-state
mode. This bit should be set to 0 for normal operation.
Double Buffer
Counter Reset
The DB13 bit enables or disables double buffering of
Bits[DB22:DB20] in Register 4. For information about how
double buffering works, see the Program Modes section.
The DB3 bit is the reset bit for the R counter and the N counter
of the ADF4351. When this bit is set to 1, the RF synthesizer
N counter and R counter are held in reset. For normal opera-
tion, this bit should be set to 0.
Charge Pump Current Setting
Bits[DB12:DB9] set the charge pump current. This value should
be set to the charge pump current that the loop filter is designed
with (see Figure 26).
REGISTER 3
Control Bits
When Bits[C3:C1] are set to 011, Register 3 is programmed.
Figure 27 shows the input data format for programming this
register.
Lock Detect Function (LDF)
The DB8 bit configures the lock detect function (LDF). The LDF
controls the number of PFD cycles monitored by the lock detect
circuit to ascertain whether lock has been achieved. When DB8 is
set to 0, the number of PFD cycles monitored is 40. When DB8
is set to 1, the number of PFD cycles monitored is 5. It is recom-
mended that the DB8 bit be set to 0 for fractional-N mode and
to 1 for integer-N mode.
Band Select Clock Mode
Setting the DB23 bit to 1 selects a faster logic sequence of band
selection, which is suitable for high PFD frequencies and is
necessary for fast lock applications. Setting the DB23 bit to 0 is
recommended for low PFD (<125 kHz) values. For the faster
band select logic modes (DB23 set to 1), the value of the band
select clock divider must be less than or equal to 254.
Lock Detect Precision (LDP)
The lock detect precision bit (Bit DB7) sets the comparison
window in the lock detect circuit. When DB7 is set to 0, the
comparison window is 10 ns; when DB7 is set to 1, the window
is 6 ns. The lock detect circuit goes high when n consecutive
PFD cycles are less than the comparison window value; n is set
by the LDF bit (DB8). For example, with DB8 = 0 and DB7 = 0,
40 consecutive PFD cycles of 10 ns or less must occur before
digital lock detect goes high.
Antibacklash Pulse Width (ABP)
Bit DB22 sets the PFD antibacklash pulse width. When Bit DB22
is set to 0, the PFD antibacklash pulse width is 6 ns. This setting is
recommended for fractional-N use. When Bit DB22 is set to 1,
the PFD antibacklash pulse width is 3 ns, which results in phase
noise and spur improvements in integer-N operation. For
fractional-N operation, the 3 ns setting is not recommended.
Rev. 0 | Page 19 of 28
ADF4351
Data Sheet
Charge Cancelation
VCO Power-Down
Setting the DB21 bit to 1 enables charge pump charge cancel-
ation. This has the effect of reducing PFD spurs in integer-N
mode. In fractional-N mode, this bit should be set to 0.
Setting the DB11 bit to 0 powers the VCO up; setting this bit to 1
powers the VCO down.
Mute Till Lock Detect (MTLD)
CSR Enable
When the DB10 bit is set to 1, the supply current to the RF output
stage is shut down until the part achieves lock, as measured by
the digital lock detect circuitry.
Setting the DB18 bit to 1 enables cycle slip reduction. CSR is
a method for improving lock times. Note that the signal at the
phase frequency detector (PFD) must have a 50% duty cycle for
cycle slip reduction to work. The charge pump current setting
must also be set to a minimum. For more information, see the
Cycle Slip Reduction for Faster Lock Times section.
AUX Output Select
The DB9 bit sets the auxiliary RF output. If DB9 is set to 0, the
auxiliary RF output is the output of the RF dividers; if DB9 is set
to 1, the auxiliary RF output is the fundamental VCO frequency.
Clock Divider Mode
AUX Output Enable
Bits[DB16:DB15] must be set to 10 to activate phase resync
(see the Phase Resync section). These bits must be set to 01
to activate fast lock (see the Fast Lock Timer and Register
Sequences section). Setting Bits[DB16:DB15] to 00 disables
the clock divider (see Figure 27).
The DB8 bit enables or disables the auxiliary RF output. If DB8
is set to 0, the auxiliary RF output is disabled; if DB8 is set to 1,
the auxiliary RF output is enabled.
AUX Output Power
Bits[DB7:DB6] set the value of the auxiliary RF output power
level (see Figure 28).
12-Bit Clock Divider Value
Bits[DB14:DB3] set the 12-bit clock divider value. This value
is the timeout counter for activation of phase resync (see the
Phase Resync section). The clock divider value also sets the
timeout counter for fast lock (see the Fast Lock Timer and
Register Sequences section).
RF Output Enable
The DB5 bit enables or disables the primary RF output. If DB5
is set to 0, the primary RF output is disabled; if DB5 is set to 1,
the primary RF output is enabled.
REGISTER 4
Output Power
Control Bits
Bits[DB4:DB3] set the value of the primary RF output power
level (see Figure 28).
When Bits[C3:C1] are set to 100, Register 4 is programmed.
Figure 28 shows the input data format for programming this
register.
REGISTER 5
Control Bits
Feedback Select
When Bits[C3:C1] are set to 101, Register 5 is programmed.
Figure 29 shows the input data format for programming this
register.
The DB23 bit selects the feedback from the VCO output to the
N counter. When this bit is set to 1, the signal is taken directly
from the VCO. When this bit is set to 0, the signal is taken from
the output of the output dividers. The dividers enable coverage
of the wide frequency band (34.375 MHz to 4.4 GHz). When
the dividers are enabled and the feedback signal is taken from
the output, the RF output signals of two separately configured
PLLs are in phase. This is useful in some applications where the
positive interference of signals is required to increase the power.
Lock Detect Pin Operation
Bits[DB23:DB22] set the operation of the lock detect (LD) pin
(see Figure 29).
REGISTER INITIALIZATION SEQUENCE
At initial power-up, after the correct application of voltages to
the supply pins, the ADF4351 registers should be started in the
following sequence:
RF Divider Select
Bits[DB22:DB20] select the value of the RF output divider (see
Figure 28).
1. Register 5
2. Register 4
3. Register 3
4. Register 2
5. Register 1
6. Register 0
Band Select Clock Divider Value
Bits[DB19:DB12] set a divider for the band select logic clock input.
By default, the output of the R counter is the value used to clock
the band select logic, but, if this value is too high (>125 kHz), a
divider can be switched on to divide the R counter output to a
smaller value (see Figure 28).
Rev. 0 | Page 20 of 28
Data Sheet
ADF4351
RF SYNTHESIZER—A WORKED EXAMPLE
REFERENCE DOUBLER AND REFERENCE DIVIDER
The following equations are used to program the ADF4351
synthesizer:
The on-chip reference doubler allows the input reference signal
to be doubled. Doubling the reference signal doubles the PFD
comparison frequency, which improves the noise performance of
the system. Doubling the PFD frequency usually improves noise
performance by 3 dB. Note that in fractional-N mode, the PFD
cannot operate above 32 MHz due to a limitation in the speed
of the Σ-Δ circuit of the N divider. For integer-N applications,
the PFD can operate up to 90 MHz.
RFOUT = [INT + (FRAC/MOD)] × (fPFD/RF Divider)
(3)
where:
RFOUT is the RF frequency output.
INT is the integer division factor.
FRAC is the numerator of the fractional division (0 to MOD − 1).
MOD is the preset fractional modulus (2 to 4095).
RF Divider is the output divider that divides down the
VCO frequency.
The reference divide-by-2 divides the reference signal by 2,
resulting in a 50% duty cycle PFD frequency. This is necessary
for the correct operation of the cycle slip reduction (CSR)
function. For more information, see the Cycle Slip Reduction
for Faster Lock Times section.
fPFD = REFIN × [(1 + D)/(R × (1 + T))]
(4)
where:
REFIN is the reference frequency input.
D is the RF REFIN doubler bit (0 or 1).
R is the RF reference division factor (1 to 1023).
T is the reference divide-by-2 bit (0 or 1).
12-BIT PROGRAMMABLE MODULUS
The choice of modulus (MOD) depends on the reference signal
(REFIN) available and the channel resolution (fRES) required at the
RF output. For example, a GSM system with 13 MHz REFIN sets
the modulus to 65. This means that the RF output resolution
(fRES) is the 200 kHz (13 MHz/65) necessary for GSM. With
dither off, the fractional spur interval depends on the selected
modulus values (see Table 7).
As an example, a UMTS system requires a 2112.6 MHz RF
frequency output (RFOUT); a 10 MHz reference frequency input
(REFIN) is available and a 200 kHz channel resolution (fRESOUT) is
required on the RF output.
Note that the ADF4351 VCO operates in the frequency range
of 2.2 GHz to 4.4 GHz. Therefore, the RF divider of 2 should be
used (VCO frequency = 4225.2 MHz, RFOUT = VCO frequency/
RF divider = 4225.2 MHz/2 = 2112.6 MHz).
Unlike most other fractional-N PLLs, the ADF4351 allows the
user to program the modulus over a 12-bit range. When com-
bined with the reference doubler and the 10-bit R counter, the
12-bit modulus allows the user to set up the part in many
different configurations for the application.
It is also important where the loop is closed. In this example,
the loop is closed before the output divider (see Figure 30).
For example, consider an application that requires a 1.75 GHz
RF frequency output with a 200 kHz channel step resolution.
The system has a 13 MHz reference signal.
fPFD
RF
OUT
PFD
VCO
÷2
One possible setup is to feed the 13 MHz reference signal
directly into the PFD and to program the modulus to divide
by 65. This results in the required 200 kHz resolution.
N
DIVIDER
Figure 30. Loop Closed Before Output Divider
Another possible setup is to use the reference doubler to create
26 MHz from the 13 MHz input signal. The 26 MHz is then fed
into the PFD, and the modulus is programmed to divide by 130.
This setup also results in 200 kHz resolution but offers superior
phase noise performance over the first setup.
Channel resolution (fRESOUT) of 200 kHz is required at the output
of the RF divider. Therefore, the channel resolution at the output
of the VCO (fRES) needs to be 2 × fRESOUT, that is, 400 kHz.
MOD = REFIN/fRES
MOD = 10 MHz/400 kHz = 25
The programmable modulus is also very useful for multi-
standard applications. For example, if a dual-mode phone
requires PDC and GSM 1800 standards, the programmable
modulus is of great benefit.
From Equation 4,
f
PFD = [10 MHz × (1 + 0)/1] = 10 MHz
2112.6 MHz = 10 MHz × [(INT + (FRAC/25))/2]
where:
(5)
(6)
PDC requires 25 kHz channel step resolution, whereas GSM 1800
requires 200 kHz channel step resolution. A 13 MHz reference
signal can be fed directly to the PFD, and the modulus can be
programmed to 520 when in PDC mode (13 MHz/520 = 25 kHz).
The modulus must be reprogrammed to 65 for GSM 1800 opera-
tion (13 MHz/65 = 200 kHz).
INT = 422.
FRAC = 13.
Rev. 0 | Page 21 of 28
ADF4351
Data Sheet
It is important that the PFD frequency remain constant (in this
example, 13 MHz). This allows the user to design one loop filter
for both setups without encountering stability issues. Note that
the ratio of the RF frequency to the PFD frequency principally
affects the loop filter design, not the actual channel spacing.
SPURIOUS OPTIMIZATION AND FAST LOCK
Narrow loop bandwidths can filter unwanted spurious signals,
but these bandwidths usually have a long lock time. A wider
loop bandwidth achieves faster lock times but may lead to
increased spurious signals inside the loop bandwidth.
CYCLE SLIP REDUCTION FOR FASTER LOCK TIMES
The fast lock feature can achieve the same fast lock time as the
wider bandwidth but with the advantage of a narrow final loop
bandwidth to keep spurs low.
As described in the Low Noise and Low Spur Modes section, the
ADF4351 contains a number of features that allow optimization
for noise performance. However, in fast-locking applications,
the loop bandwidth generally needs to be wide and, therefore,
the filter does not provide much attenuation of the spurs. If the
cycle slip reduction feature is enabled, the narrow loop band-
width is maintained for spur attenuation, but faster lock times
are still possible.
FAST LOCK TIMER AND REGISTER SEQUENCES
If the fast lock mode is used, a timer value must be loaded into
the PLL to determine the duration of the wide bandwidth mode.
When Bits[DB16:DB15] in Register 3 are set to 01 (fast lock
enable), the timer value is loaded by the 12-bit clock divider
value (Bits[DB14:DB3] in Register 3). The following sequence
must be programmed to use fast lock:
Cycle Slips
Cycle slips occur in integer-N/fractional-N synthesizers when
the loop bandwidth is narrow compared to the PFD frequency.
The phase error at the PFD inputs accumulates too fast for the
PLL to correct, and the charge pump temporarily pumps in the
wrong direction. This slows down the lock time dramatically.
The ADF4351 contains a cycle slip reduction feature that
extends the linear range of the PFD, allowing faster lock times
without modifications to the loop filter circuitry.
1. Start the initialization sequence (see the Register Initialization
Sequence section). This sequence occurs only once after
powering up the part.
2. Load Register 3 by setting Bits[DB16:DB15] to 01 and by
setting the selected fast lock timer value (Bits[DB14:DB3]).
The duration that the PLL remains in wide bandwidth mode
is equal to the fast lock timer/fPFD
.
When the circuitry detects that a cycle slip is about to occur, it
turns on an extra charge pump current cell. This cell outputs a
constant current to the loop filter or removes a constant current
from the loop filter (depending on whether the VCO tuning
voltage needs to increase or decrease to acquire the new
frequency). The effect is that the linear range of the PFD is
increased. Loop stability is maintained because the current is
constant and is not a pulsed current.
FAST LOCK EXAMPLE
If a PLL has a reference frequency of 13 MHz, fPFD of 13 MHz,
and a required lock time of 60 µs, the PLL is set to wide bandwidth
mode for 20 µs. This example assumes a modulus of 65 for channel
spacing of 200 kHz. The VCO calibration time of 20 µs must also
be taken into account (achieved by programming the higher band
select clock mode using Bit DB23 of Register 3).
If the time set for the PLL lock time in wide bandwidth mode is
20 µs, then
If the phase error increases again to a point where another cycle
slip is likely, the ADF4351 turns on another charge pump cell.
This continues until the ADF4351 detects that the VCO fre-
quency has exceeded the desired frequency. The extra charge
pump cells are turned off one by one until all the extra charge
pump cells are disabled and the frequency settles to the original
loop filter bandwidth.
Fast Lock Timer Value = (VCO Band Select Time +
PLL Lock Time in Wide Bandwidth) × fPFD/MOD
Fast Lock Timer Value = (20 µs + 20 µs) × 13 MHz/65 = 8
Therefore, a value of 8 must be loaded into the clock divider
value in Register 3 (see Step 2 in the Fast Lock Timer and
Register Sequences section).
Up to seven extra charge pump cells can be turned on. In most
applications, seven cells are enough to eliminate cycle slips
altogether, providing much faster lock times.
Setting Bit DB18 in Register 3 to 1 enables cycle slip reduction.
Note that the PFD requires a 45% to 55% duty cycle for CSR to
operate correctly. If the REFIN frequency does not have a suitable
duty cycle, enabling the RDIV2 mode (Bit DB24 in Register 2)
ensures that the input to the PFD has a 50% duty cycle.
Rev. 0 | Page 22 of 28
Data Sheet
ADF4351
In low noise mode (dither off), the quantization noise from the
Σ-Δ modulator appears as fractional spurs. The interval between
spurs is fPFD/L, where L is the repeat length of the code sequence
in the digital Σ-Δ modulator. For the third-order Σ-Δ modulator
used in the ADF4351, the repeat length depends on the value of
MOD (see Table 7).
FAST LOCK LOOP FILTER TOPOLOGY
To use fast lock mode, the damping resistor in the loop filter is
reduced to one-fourth its value while in wide bandwidth mode.
To achieve the wider loop filter bandwidth, the charge pump
current increases by a factor of 16; to maintain loop stability,
the damping resistor must be reduced by a factor of one-fourth.
To enable fast lock, the SW pin is shorted to the AGND pin by
setting Bits[DB16:DB15] in Register 3 to 01. The following two
topologies are available:
Table 7. Fractional Spurs with Dither Off (Low Noise Mode)
Repeat
Length
MOD Value (Dither Off)
Spur Interval
MOD is divisible by 2, but not by 3 2 × MOD Channel step/2
MOD is divisible by 3, but not by 2 3 × MOD Channel step/3
The damping resistor (R1) is divided into two values
(R1 and R1A) that have a ratio of 1:3 (see Figure 31).
An extra resistor (R1A) is connected directly from SW, as
shown in Figure 32. The extra resistor is calculated such
that the parallel combination of the extra resistor and the
damping resistor (R1) is reduced to one-fourth the original
value of R1 (see Figure 32).
MOD is divisible by 6
MOD is not divisible by 2, 3, or 6
6 × MOD Channel step/6
MOD Channel step
In low spur mode (dither on), the repeat length is extended
to 221 cycles, regardless of the value of MOD, which makes the
quantization error spectrum look like broadband noise. This
may degrade the in-band phase noise at the PLL output by as
much as 10 dB. For lowest noise, dither off is a better choice,
particularly when the final loop bandwidth is low enough to
attenuate even the lowest frequency fractional spur.
ADF4351
R2
CP
VCO
OUT
C1
C2
R1
C3
SW
Integer Boundary Spurs
R1A
Another mechanism for fractional spur creation is the inter-
actions between the RF VCO frequency and the reference
frequency. When these frequencies are not integer related (the
purpose of a fractional-N synthesizer), spur sidebands appear
on the VCO output spectrum at an offset frequency that corre-
sponds to the beat note, or difference frequency, between an
integer multiple of the reference and the VCO frequency. These
spurs are attenuated by the loop filter and are more noticeable
on channels close to integer multiples of the reference, where
the difference frequency can be inside the loop bandwidth (thus
the name integer boundary spurs).
Figure 31. Fast Lock Loop Filter Topology 1
ADF4351
R2
CP
VCO
OUT
C1
C2
R1
C3
R1A
SW
Reference Spurs
Reference spurs are generally not a problem in fractional-N
synthesizers because the reference offset is far outside the loop
bandwidth. However, any reference feedthrough mechanism
that bypasses the loop may cause a problem. Feedthrough of
low levels of on-chip reference switching noise, coupling to the
VCO, can result in reference spur levels as high as −80 dBc. The
PCB layout must ensure adequate isolation between VCO circuitry
and the input reference to avoid a possible feedthrough path on
the board.
Figure 32. Fast Lock Loop Filter Topology 2
SPUR MECHANISMS
This section describes the three different spur mechanisms that
arise with a fractional-N synthesizer and how to minimize them
in the ADF4351.
Fractional Spurs
The fractional interpolator in the ADF4351 is a third-order
Σ-Δ modulator with a modulus (MOD) that is programmable
to any integer value from 2 to 4095. In low spur mode (dither
on), the minimum allowable value of MOD is 50. The Σ-Δ
modulator is clocked at the PFD reference rate (fPFD), which
allows PLL output frequencies to be synthesized at a channel
step resolution of fPFD/MOD.
Rev. 0 | Page 23 of 28
ADF4351
Data Sheet
In the example shown in Figure 33, the PFD reference is 25 MHz
and MOD = 125 for a 200 kHz channel spacing. tSYNC is set to
400 µs by programming CLK_DIV_VALUE = 80.
SPUR CONSISTENCY AND FRACTIONAL SPUR
OPTIMIZATION
With dither off, the fractional spur pattern due to the quantiza-
tion noise of the Σ-Δ modulator also depends on the particular
phase word with which the modulator is seeded.
LE
tSYNC
SYNC
(INTERNAL)
The phase word can be varied to optimize the fractional and
subfractional spur levels on any particular frequency. Thus, a
lookup table of phase values corresponding to each frequency
can be created for use when programming the ADF4351.
LAST CYCLE SLIP
FREQUENCY
PLL SETTLES TO
INCORRECT PHASE
If a lookup table is not used, keep the phase word at a constant
value to ensure consistent spur levels on any particular frequency.
PLL SETTLES TO
CORRECT PHASE
AFTER RESYNC
PHASE
PHASE RESYNC
The output of a fractional-N PLL can settle to any one of the
MOD phase offsets with respect to the input reference, where
MOD is the fractional modulus. The phase resync feature of
the ADF4351 produces a consistent output phase offset with
respect to the input reference. This phase offset is necessary in
applications where the output phase and frequency are important,
such as digital beamforming. See the Phase Programmability
section to program a specific RF output phase when using
phase resync.
–100
0
100 200 300 400 500 600 700 800 900 1000
TIME (µs)
Figure 33. Phase Resync Example
Phase Programmability
The phase word in Register 1 controls the RF output phase. As
this word is swept from 0 to MOD, the RF output phase sweeps
over a 360° range in steps of 360°/MOD. In many applications,
it is advisable to disable VCO band selection by setting Bit DB28
in Register 1 (R1) to 1. This setting selects the phase adjust feature.
Phase resync is enabled by setting Bits[DB16:DB15] in
Register 3 to 10. When phase resync is enabled, an internal
timer generates sync signals at intervals of tSYNC given by the
following formula:
High PFD Frequencies
VCO band selection is required to ensure that the correct VCO
band is chosen for the relevant frequency. VCO band selection
can operate with PFD frequencies up to 45 MHz using the high
VCO band select mode (set Bit DB23 in Register 3 to 1).
tSYNC = CLK_DIV_VALUE × MOD × tPFD
where:
CLK_DIV_VALUE is the decimal value programmed in
Bits[DB14:DB3] of Register 3. This value can be any integer
from 1 to 4095.
For PFD frequencies higher than 45 MHz, it is recommended
that the user perform the following steps:
1. Program the desired VCO frequency with phase adjustment
disabled (set Bit DB28 in Register 1 to 0). Ensure that the
PFD frequency is less than 45 MHz.
MOD is the modulus value programmed in Bits[DB14:DB3]
of Register 1 (R1).
t
PFD is the PFD reference period.
2. After the correct frequency is achieved, enable phase adjust-
ment (set Bit DB28 in Register 1 to 1).
When a new frequency is programmed, the second sync pulse
after the LE rising edge is used to resynchronize the output
phase to the reference. The tSYNC time must be programmed to
a value that is at least as long as the worst-case lock time. This
guarantees that the phase resync occurs after the last cycle slip
in the PLL settling transient.
3. PFD frequencies higher than 32 MHz are permissible only
with integer-N applications; therefore, set the antibacklash
pulse width to 3 ns (set Bit DB22 in Register 3 to 1).
4. Using the desired PFD frequency, program the appropriate
values for the reference R and feedback N counters.
Using this procedure, the lowest rms in-band phase noise can
be achieved.
Rev. 0 | Page 24 of 28
Data Sheet
ADF4351
APPLICATIONS INFORMATION
The LO ports of the ADL5375 can be driven differentially from
the complementary RFOUTA outputs of the ADF4351. This setup
provides better performance than a single-ended LO driver and
eliminates the use of a balun to convert from a single-ended LO
input to the more desirable differential LO input for the ADL5375.
The typical rms phase noise (100 Hz to 5 MHz) of the LO in this
configuration is 0.61° rms.
DIRECT CONVERSION MODULATOR
Direct conversion architectures are increasingly being used
to implement base station transmitters. Figure 34 shows how
Analog Devices, Inc., parts can be used to implement such a
system.
Figure 34 shows the AD9788 TxDAC® used with the ADL5375.
The use of dual integrated DACs, such as the AD9788 with its
specified 2% FSR and 0.001% FSR gain and offset character-
istics, ensures minimum error contribution (over temperature)
from this portion of the signal chain.
The ADL5375 accepts LO drive levels from −6 dBm to +6 dBm.
The optimum LO power can be software programmed on the
ADF4351, which allows levels from −4 dBm to +5 dBm from
each output.
The local oscillator (LO) is implemented using the ADF4351. The
low-pass filter was designed using ADIsimPLL™ for a channel
spacing of 200 kHz and a closed-loop bandwidth of 35 kHz.
The RF output is designed to drive a 50 Ω load, but it must be
ac-coupled, as shown in Figure 34. If the I and Q inputs are
driven in quadrature by 2 V p-p signals, the resulting output
power from the ADL5375 modulator is approximately 2 dBm.
51Ω
51Ω
OUT1_P
OUT1_N
LOW-PASS
FILTER
MODULATED
DIGITAL
DATA
AD9788
TxDAC
OUT2_P
OUT2_N
LOW-PASS
FILTER
51Ω
51Ω
V
V
LOCK
DETECT
VCO
DD
16
17
26
30
25
28
DV
10
AV
4
6
32
MUXOUT LD
V
PDB
SDV
DD
CE
V
P
VCO
RF
DD
DD
ADL5375
1nF 1nF
IBBP
IBBN
f
REF
RF
B+ 14
29
51Ω
REFIN
IN
OUT
V
VCO
RF
B–
15
OUT
1
2
3
CLK
3.9nH 3.9nH
DATA
LE
1nF
LOIP
LOIN
12
13
RF
RF
A+
A–
OUT
OUT
V
QUADRATURE
PHASE
SPLITTER
LPF
LPF
RFOUT
DSOP
ADF4351
22
R
SET
4.7kΩ
1nF
20
7
TUNE
680Ω
QBBP
QBBN
CP
OUT
39nF
2700pF
1200pF
SW
REF
24
5
360Ω
CP
SD
A
V
V
GND
GND AGND
31
GNDVCO DGND TEMP COM
8
9
11 18 21
27 19 23
10pF
0.1µF 10pF
10pF
0.1µF
0.1µF
Figure 34. Direct Conversion Modulator
Rev. 0 | Page 25 of 28
ADF4351
Data Sheet
ADSP-BF527 Interface
INTERFACING TO THE ADuC70xx AND
THE ADSP-BF527
Figure 36 shows the interface between the ADF4351 and the
Blackfin® ADSP-BF527 digital signal processor (DSP). The
ADF4351 needs a 32-bit serial word for each latch write. The
easiest way to accomplish this using the Blackfin family is to
use the autobuffered transmit mode of operation with alternate
framing. This mode provides a means for transmitting an entire
block of serial data before an interrupt is generated.
The ADF4351 has a simple SPI-compatible serial interface for
writing to the device. The CLK, DATA, and LE pins control the
data transfer. When LE goes high, the 32 bits that were clocked
into the appropriate register on each rising edge of CLK are
transferred to the appropriate latch. See Figure 2 for the timing
diagram and Table 6 for the register address table.
ADuC70xx Interface
ADF4351
ADSP-BF527
SCK
MOSI
GPIO
CLK
DATA
LE
Figure 35 shows the interface between the ADF4351 and the
ADuC70xx family of analog microcontrollers. The ADuC70xx
family is based on an AMR7 core, but the same interface can be
used with any 8051-based microcontroller.
CE
I/O PORTS
MUXOUT
(LOCK DETECT)
ADF4351
ADuC70xx
SCLOCK
MOSI
CLK
Figure 36. ADSP-BF527 to ADF4351 Interface
DATA
LE
Set up the word length for eight bits and use four memory
locations for each 32-bit word. To program each 32-bit latch,
store the four 8-bit bytes, enable the autobuffered mode, and
write to the transmit register of the DSP. This last operation
initiates the autobuffer transfer. Make sure that the SPI timing
requirements listed in Table 2 are adhered to.
CE
I/O PORTS
MUXOUT
(LOCK DETECT)
Figure 35. ADuC70xx to ADF4351 Interface
The microcontroller is set up for SPI master mode with CPHA =
0. To initiate the operation, the I/O port driving LE is brought
low. Each latch of the ADF4351 needs a 32-bit word, which is
accomplished by writing four 8-bit bytes from the micro-
controller to the device. After the fourth byte is written, the
LE input should be brought high to complete the transfer.
PCB DESIGN GUIDELINES FOR A CHIP SCALE
PACKAGE
The lands on the chip scale package (CP-32-2) are rectangular.
The PCB pad for these lands must be 0.1 mm longer than the
package land length and 0.05 mm wider than the package land
width. Each land must be centered on the pad to ensure that the
solder joint size is maximized.
When power is first applied to the ADF4351, the part requires
six writes (one each to R5, R4, R3, R2, R1, and R0) for the output
to become active.
The bottom of the chip scale package has a central exposed thermal
pad. The thermal pad on the PCB must be at least as large as the
exposed pad. On the PCB, there must be a minimum clearance
of 0.25 mm between the thermal pad and the inner edges of the
pad pattern to ensure that shorting is avoided.
I/O port lines on the microcontroller are also used to control
the power-down input (CE) and to detect lock (MUXOUT
configured as lock detect and polled by the port input).
When operating in the mode described, the maximum SPI
transfer rate of the ADuC70xx is 20 Mbps. This means that
the maximum rate at which the output frequency can be
changed is 833 kHz. If using a faster SPI clock, make sure that
the SPI timing requirements listed in Table 2 are adhered to.
Thermal vias can be used on the PCB thermal pad to improve
the thermal performance of the package. If vias are used, they
must be incorporated into the thermal pad at 1.2 mm pitch grid.
The via diameter must be between 0.3 mm and 0.33 mm, and
the via barrel must be plated with 1 oz. of copper to plug the via.
Rev. 0 | Page 26 of 28
Data Sheet
ADF4351
V
VCO
OUT
OUTPUT MATCHING
3.9nF
For optimum operation, the output of the ADF4351 can be
matched in a number of ways; the most basic method is to con-
nect a 50 Ω resistor to VVCO. A dc bypass capacitor of 100 pF is
connected in series, as shown in Figure 37. Because the resistor
is not frequency dependent, this method provides a good broad-
band match. When connected to a 50 Ω load, this circuit typically
gives a differential output power equal to the value selected by
Bits[DB4:DB3] in Register 4 (R4).
RF
1nF
50Ω
Figure 38. Optimum Output Stage
If differential outputs are not needed, the unused output can be
terminated, or both outputs can be combined using a balun.
A balun using discrete inductors and capacitors can be imple-
mented with the architecture shown in Figure 39. The LC balun
comprises Component L1 and Component C1. L2 provides a dc
path for RFOUTA−, and Capacitor C2 is used for dc blocking.
V
VCO
50Ω
RF
OUT
100pF
50Ω
V
VCO
L2
L1
Figure 37. Simple Output Stage
RF
RF
A+
A–
OUT
OUT
C2
C1
L1
A better solution is to use a shunt inductor (acting as an RF choke)
to VVCO. This solution gives a better match and, therefore, more
output power.
50Ω
C1
Experiments have shown that the circuit shown in Figure 38
provides an excellent match to 50 Ω for the W-CDMA UMTS
Band 1 (2110 MHz to 2170 MHz). The maximum output power
in this case is approximately 5 dBm. Both single-ended archi-
tectures can be examined using the EVAL-ADF4351EB1Z
evaluation board.
Figure 39. LC Balun for the ADF4351
Table 8. LC Balun Components
Frequency
Range (MHz)
RF Choke
Inductor L2 (nH)
DC Blocking
Capacitor C2 (pF)
Measured Output
Power (dBm)
Inductor L1 (nH)
Capacitor C1 (pF)
137 to 300
300 to 460
400 to 600
600 to 900
860 to 1240
1200 to 1600
1600 to 3600
2800 to 3800
100
51
30
18
12
5.6
3.3
2.2
10
5.6
5.6
4
2.2
1.2
0.7
0.5
390
180
120
68
39
15
1000
120
120
120
10
10
10
10
9
10
10
10
9
9
8
10
10
8
Rev. 0 | Page 27 of 28
ADF4351
Data Sheet
OUTLINE DIMENSIONS
5.00
BSC SQ
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
25
32
1
24
0.50
BSC
PIN 1
INDICATOR
4.75
BSC SQ
3.25
3.10 SQ
2.95
EXPOSED
PAD
17
8
16
9
0.50
0.40
0.30
0.25 MIN
TOP VIEW
BOTTOM VIEW
3.50 REF
0.80 MAX
0.65 TYP
12° MAX
1.00
0.85
0.80
0.05 MAX
0.02 NOM
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
COPLANARITY
0.08
0.30
0.25
0.18
SEATING
PLANE
SECTION OF THIS DATA SHEET.
0.20 REF
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
Figure 40. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
5 mm × 5 mm Body, Very Thin Quad
(CP-32-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Temperature Range
−40°C to +85°C
−40°C to +85°C
Package Description
Package Option
ADF4351BCPZ
ADF4351BCPZ-RL7
EVAL-ADF4351EB1Z
32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
Evaluation Board
CP-32-2
CP-32-2
1 Z = RoHS Compliant Part.
©2012 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D09800-0-5/12(0)
Rev. 0 | Page 28 of 28
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