ADG5409TCPZ-EP [ADI]
High Voltage Latch-up Proof 4-Channel Multiplexer;型号: | ADG5409TCPZ-EP |
厂家: | ADI |
描述: | High Voltage Latch-up Proof 4-Channel Multiplexer |
文件: | 总18页 (文件大小:368K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
High Voltage Latch-Up Proof,
4-/8-Channel Multiplexers
Enhanced Product
ADG5408-EP/ADG5409-EP
FEATURES
FUNCTIONAL BLOCK DIAGRAMS
Latch-up proof
ADG5408-EP
ADG5409-EP
8 kV human body model (HBM) ESD rating
Low on resistance (13.5 Ω)
9 V to 22 V dual-supply operation
9 V to 40 V single-supply operation
Fully specified at 15 V, 20 V, +12 V, and +36 V
S1
S1A
S4A
DA
DB
D
S1B
S4B
VSS to VDD analog signal range
S8
ENHANCED PRODUCT FEATURES
Supports defense and aerospace applications
(AQEC standard)
1-OF-8
DECODER
1-OF-4
DECODER
Military temperature range: –55°C to +125°C
Controlled manufacturing baseline
One assembly/test site
A0 A1 A2 EN
A0 A1 EN
Figure 1.
One fabrication site
Enhanced product change notification
Qualification data available on request
APPLICATIONS
Relay replacement
Automatic test equipment
Data acquisition
Instrumentation
Avionics
Communication systems
GENERAL DESCRIPTION
The ADG5408-EP/ADG5409-EP are monolithic CMOS analog
multiplexers comprising eight single channels and four differential
channels, respectively. The ADG5408-EP switches one of eight
inputs to a common output, as determined by the 3-bit binary
address lines, A0, A1, and A2. The ADG5409-EP switches one
of four differential inputs to a common differential output, as
determined by the 2-bit binary address lines, A0 and A1.
The ADG5408-EP/ADG5409-EP do not have VL pins; rather, the
logic power supply is generated internally by an on-chip voltage
generator.
Additional application and technical information can be found
in the ADG5408/ADG5409 data sheet.
PRODUCT HIGHLIGHTS
1. Trench isolation guards against latch-up. A dielectric trench
separates the P and N channel transistors thereby preventing
latch-up even under severe overvoltage conditions.
An EN input on both devices enables or disables the device.
When EN is disabled, all channels switch off. The on-resistance
profile is very flat over the full analog input range, which ensures
good linearity and low distortion when switching audio signals.
High switching speed also makes the parts suitable for video
signal switching.
2. Low RON
.
3. Dual-supply operation. For applications where the analog
signal is bipolar, the ADG5408-EP/ADG5409-EP can be
operated from dual supplies up to 22 V.
4. Single-supply operation. For applications where the analog
signal is unipolar, the ADG5408-EP/ADG5409-EP can be
operated from a single rail power supply up to 40 V.
5. 3 V logic compatible digital inputs: VINH = 2.0 V, VINL = 0.8 V.
6. No VL logic power supply required.
Each switch conducts equally well in both directions when on,
and each switch has an input signal range that extends to the
power supplies. In the off condition, signal levels up to the
supplies are blocked.
Rev. 0
Document Feedback
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rights of third parties that may result from its use. Specifications subject to change without notice. No
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Trademarks and registeredtrademarks arethe property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Technical Support
©2015 Analog Devices, Inc. All rights reserved.
www.analog.com
ADG5408-EP/ADG5409-EP
Enhanced Product
TABLE OF CONTENTS
Features .............................................................................................. 1
36 V Single Supply.........................................................................6
Continuous Current per Channel, Sx or D................................8
Absolute Maximum Ratings ............................................................9
ESD Caution...................................................................................9
Pin Configurations and Function Descriptions......................... 10
Typical Performance Characteristics ........................................... 12
Test Circuits..................................................................................... 16
Outline Dimensions....................................................................... 18
Ordering Guide .......................................................................... 18
Enhanced Product Features ............................................................ 1
Applications....................................................................................... 1
Functional Block Diagrams............................................................. 1
General Description......................................................................... 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
15 V Dual Supply ....................................................................... 3
20 V Dual Supply ....................................................................... 4
12 V Single Supply........................................................................ 5
REVISION HISTORY
9/15—Revision 0: Initial Version
Rev. 0 | Page 2 of 18
Enhanced Product
ADG5408-EP/ADG5409-EP
SPECIFICATIONS
15 V DUAL SUPPLY
VDD = +15 V 10%, VSS = −15 V 10%, GND = 0 V, unless otherwise noted.
Table 1.
Parameter
25°C
−40°C to +85°C −55°C to +125°C Unit
Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range
On Resistance, RON
VDD to VSS
22
V
13.5
15
0.3
Ω typ
Ω max
Ω typ
VS = 10 V, IS = −10 mA; see Figure 24
VDD = +13.5 V, VSS = −13.5 V
VS = 10 V, IS = −10 mA
18
On-Resistance Match Between
Channels, ∆RON
0.8
1.8
2.2
1.3
2.6
1.4
3
Ω max
Ω typ
Ω max
On-Resistance Flatness, RFLAT (ON)
VS = 10 V, IS = −10 mA
LEAKAGE CURRENTS
VDD = +16.5 V, VSS = −16.5 V
Source Off Leakage, IS (Off)
0.05
0.25
0.1
0.4
0.1
nA typ
nA max
nA typ
nA max
nA typ
nA max
VS = 10 V, VD = 10 V; see Figure 27
1
4
4
7
Drain Off Leakage, ID (Off)
Channel On Leakage, ID (On), IS (On)
DIGITAL INPUTS
VS = 10 V, VD = 10 V; see Figure 27
30
30
VS = VD = 10 V; see Figure 23
0.4
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current, IINL or IINH
2.0
0.8
V min
V max
μA typ
μA max
pF typ
0.002
3
VIN = VGND or VDD
0.1
Digital Input Capacitance, CIN
DYNAMIC CHARACTERISTICS1
Transition Time, tTRANSITION
170
217
140
175
130
161
ns typ
ns max
ns typ
ns max
ns typ
ns max
ns typ
ns min
pC typ
RL = 300 Ω, CL = 35 pF
VS = 10 V; see Figure 30
RL = 300 Ω, CL = 35 pF
VS = 10 V; see Figure 32
RL = 300 Ω, CL = 35 pF
VS = 10 V; see Figure 32
RL = 300 Ω, CL = 35 pF
VS1 = VS2 = 10 V; see Figure 31
258
213
183
292
242
198
13
tON (EN)
tOFF (EN)
Break-Before-Make Time Delay, tD 50
Charge Injection, QINJ
115
VS = 0 V, RS = 0 Ω, CL = 1 nF;
see Figure 33
Off Isolation
−60
−60
0.01
dB typ
dB typ
% typ
RL = 50 Ω, CL = 5 pF, f = 1 MHz; see
Figure 26
RL = 50 Ω, CL = 5 pF, f = 1 MHz; see
Figure 25
RL = 1 kΩ, 15 V p-p, f = 20 Hz to 20 kHz;
see Figure 28
Channel-to-Channel Crosstalk
Total Harmonic Distortion + Noise
−3 dB Bandwidth
ADG5408-EP
ADG5409-EP
RL = 50 Ω, CL = 5 pF; see Figure 29
50
87
0.9
MHz typ
MHz typ
dB typ
Insertion Loss
RL = 50 Ω, CL = 5 pF, f = 1 MHz;
Figure 29
CS (Off)
15
pF typ
VS = 0 V, f = 1 MHz
CD (Off)
ADG5408-EP
ADG5409-EP
102
50
pF typ
pF typ
VS = 0 V, f = 1 MHz
VS = 0 V, f = 1 MHz
Rev. 0 | Page 3 of 18
ADG5408-EP/ADG5409-EP
Enhanced Product
Parameter
25°C
−40°C to +85°C −55°C to +125°C Unit
pF typ
Test Conditions/Comments
CD (On), CS (On)
ADG5408-EP
ADG5409-EP
POWER REQUIREMENTS
IDD
133
81
VS = 0 V, f = 1 MHz
VS = 0 V, f = 1 MHz
pF typ
VDD = +16.5 V, VSS = −16.5 V
Digital inputs = 0 V or VDD
45
55
0.001
μA typ
μA max
μA typ
μA max
80
1
ISS
Digital inputs = 0 V or VDD
VDD/VSS
9/ 22
V min/V max GND = 0 V
1 Guaranteed by design; not subject to production test.
20 V DUAL SUPPLY
VDD = +20 V 10%, VSS = −20 V 10%, GND = 0 V, unless otherwise noted.
Table 2.
Parameter
25°C −40°C to +85°C −55°C to +125°C Unit
Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range
On Resistance, RON
VDD to VSS
21
V
12.5
14
0.3
Ω typ
Ω max
Ω typ
VS = 15 V, IS = −10 mA; see Figure 24
VDD = +18 V, VSS = −18 V
VS = 15 V, IS = −10 mA
17
On-Resistance Match Between
Channels, ∆RON
0.8
2.3
2.7
1.3
3.1
1.4
3.5
Ω max
Ω typ
Ω max
On-Resistance Flatness, RFLAT (ON)
VS = 15 V, IS = −10 mA
LEAKAGE CURRENTS
VDD = +22 V, VSS = −22 V
Source Off Leakage, IS (Off)
0.1
0.25
0.15
0.4
0.15
0.4
nA typ
nA max
nA typ
nA max
nA typ
nA max
VS = 15 V, VD = 15 V; see Figure 27
1
4
4
7
Drain Off Leakage, ID (Off)
VS = 15 V, VD = 15 V; see Figure 27
30
30
Channel On Leakage, ID (On), IS (On)
VS = VD = 15 V; see Figure 23
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current, IINL or IINH
2.0
0.8
V min
V max
μA typ
μA max
pF typ
0.002
3
VIN = VGND or VDD
0.1
Digital Input Capacitance, CIN
DYNAMIC CHARACTERISTICS1
Transition Time, tTRANSITION
160
207
140
165
133
153
ns typ
ns max
ns typ
ns max
ns typ
ns max
ns typ
ns min
pC typ
RL = 300 Ω, CL = 35 pF
VS = 10 V; see Figure 30
RL = 300 Ω, CL = 35 pF
VS = 10 V; see Figure 32
RL = 300 Ω, CL = 35 pF
VS = 10 V; see Figure 32
RL = 300 Ω, CL = 35 pF
VS1 = VS2 = 10 V; see Figure 31
VS = 0 V, RS = 0 Ω, CL = 1 nF; see
Figure 33
RL = 50 Ω, CL = 5 pF, f = 1 MHz; see
Figure 26
237
194
174
262
218
189
8
tON (EN)
tOFF (EN)
Break-Before-Make Time Delay, tD 38
Charge Injection, QINJ
Off Isolation
155
−60
−60
dB typ
dB typ
Channel-to-Channel Crosstalk
RL = 50 Ω, CL = 5 pF, f = 1 MHz;
see Figure 25
Rev. 0 | Page 4 of 18
Enhanced Product
ADG5408-EP/ADG5409-EP
Parameter
25°C −40°C to +85°C −55°C to +125°C Unit
Test Conditions/Comments
Total Harmonic Distortion + Noise
0.012
% typ
RL = 1 kΩ, 20 V p-p, f = 20 Hz to 20 kHz;
see Figure 28
−3 dB Bandwidth
ADG5408-EP
ADG5409-EP
RL = 50 Ω, CL = 5 pF; see Figure 29
50
88
0.8
MHz typ
MHz typ
dB typ
Insertion Loss
RL = 50 Ω, CL = 5 pF, f = 1 MHz;
see Figure 29
CS (Off)
17
pF typ
VS = 0 V, f = 1 MHz
CD (Off)
ADG5408-EP
ADG5409-EP
CD (On), CS (On)
ADG5408-EP
ADG5409-EP
POWER REQUIREMENTS
IDD
98
48
pF typ
pF typ
VS = 0 V, f = 1 MHz
VS = 0 V, f = 1 MHz
128
80
pF typ
pF typ
VS = 0 V, f = 1 MHz
VS = 0 V, f = 1 MHz
VDD = +22 V, VSS = −22 V
Digital inputs = 0 V or VDD
50
70
0.001
μA typ
μA max
μA typ
μA max
120
1
ISS
Digital inputs = 0 V or VDD
VDD/VSS
9/ 22
V min/V max GND = 0 V
1 Guaranteed by design; not subject to production test.
12 V SINGLE SUPPLY
VDD = 12 V 10%, VSS = 0 V, GND = 0 V, unless otherwise noted.
Table 3.
Parameter
25°C −40°C to +85°C −55°C to +125°C Unit
Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range
On Resistance, RON
0 V to VDD
42
V
26
Ω typ
VS = 0 V to 10 V, IS = −10 mA; see
Figure 24
VDD = 10.8 V, VSS = 0 V
30
0.3
36
Ω max
Ω typ
On-Resistance Match Between
Channels, ∆RON
VS = 0 V to 10 V, IS = −10 mA
1
5.5
6.5
1.5
8
1.6
12
Ω max
Ω typ
Ω max
On-Resistance Flatness, RFLAT (ON)
VS = 0 V to 10 V, IS = −10 mA
VDD = 13.2 V, VSS = 0 V
LEAKAGE CURRENTS
Source Off Leakage, IS (Off)
0.02
nA typ
VS = 1 V/10 V, VD = 10 V/1 V; see
Figure 27
0.25
0.05
1
7
nA max
nA typ
Drain Off Leakage, ID (Off)
VS = 1 V/10 V, VD = 10 V/1 V; see
Figure 27
0.4
0.05
0.4
4
4
30
30
nA max
nA typ
nA max
Channel On Leakage, ID (On), IS (On)
VS = VD = 1 V/10 V; see Figure 23
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current, IINL or IINH
2.0
0.8
V min
V max
μA typ
μA max
pF typ
0.002
3
VIN = VGND or VDD
0.1
Digital Input Capacitance, CIN
Rev. 0 | Page 5 of 18
ADG5408-EP/ADG5409-EP
Enhanced Product
Parameter
DYNAMIC CHARACTERISTICS1
25°C −40°C to +85°C −55°C to +125°C Unit
Test Conditions/Comments
Transition Time, tTRANSITION
230
321
215
276
134
161
ns typ
ns max
ns typ
ns max
ns typ
ns max
ns typ
ns min
pC typ
RL = 300 Ω, CL = 35 pF
VS = 8 V; see Figure 30
RL = 300 Ω, CL = 35 pF
VS = 8 V; see Figure 32
RL = 300 Ω, CL = 35 pF
VS = 8 V; see Figure 32
RL = 300 Ω, CL = 35 pF
VS1 = VS2 = 8 V; see Figure 31
388
345
187
430
397
209
44
tON (EN)
tOFF (EN)
Break-Before-Make Time Delay, tD 118
Charge Injection, QINJ
45
VS = 6 V, RS = 0 Ω, CL = 1 nF; see
Figure 33
Off Isolation
−60
−60
0.1
dB typ
dB typ
% typ
RL = 50 Ω, CL = 5 pF, f = 1 MHz;
see Figure 26
RL = 50 Ω, CL = 5 pF, f = 1 MHz;
see Figure 25
RL = 1 kΩ, 6 V p-p, f = 20 Hz to 20 kHz;
see Figure 28
Channel-to-Channel Crosstalk
Total Harmonic Distortion + Noise
−3 dB Bandwidth
ADG5408-EP
ADG5409-EP
RL = 50 Ω, CL = 5 pF; see Figure 29
35
74
−1.8
MHz typ
MHz typ
dB typ
Insertion Loss
RL = 50 Ω, CL = 5 pF, f = 1 MHz;
see Figure 29
CS (Off)
22
pF typ
VS = 6 V, f = 1 MHz
CD (Off)
ADG5408-EP
ADG5409-EP
CD (On), CS (On)
ADG5408-EP
ADG5409-EP
POWER REQUIREMENTS
IDD
119
59
pF typ
pF typ
VS = 6 V, f = 1 MHz
VS = 6 V, f = 1 MHz
146
86
pF typ
pF typ
VS = 6 V, f = 1 MHz
VS = 6 V, f = 1 MHz
VDD = 13.2 V
40
50
μA typ
μA max
Digital inputs = 0 V or VDD
75
VDD
9/40
V min/V max GND = 0 V, VSS = 0 V
1 Guaranteed by design; not subject to production test.
36 V SINGLE SUPPLY
VDD = 36 V 10%, VSS = 0 V, GND = 0 V, unless otherwise noted.
Table 4.
Parameter
25°C −40°C to +85°C −55°C to +125°C Unit
Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range
On Resistance, RON
0 V to VDD
23
V
14.5
Ω typ
VS = 0 V to 30 V, IS = −10 mA; see
Figure 24
VDD = 32.4 V, VSS = 0 V
16
0.3
19
Ω max
Ω typ
On-Resistance Match Between
Channels, ∆RON
VS = 0 V to 30 V, IS = −10 mA
0.8
3.5
4.3
1.3
5.5
1.4
6.5
Ω max
Ω typ
Ω max
On-Resistance Flatness, RFLAT (ON)
VS = 0 V to 30 V, IS = −10 mA
Rev. 0 | Page 6 of 18
Enhanced Product
ADG5408-EP/ADG5409-EP
Parameter
25°C −40°C to +85°C −55°C to +125°C Unit
Test Conditions/Comments
LEAKAGE CURRENTS
Source Off Leakage, IS (Off)
VDD =39.6 V, VSS = 0 V
VS = 1 V/30 V, VD = 30 V/1 V; see
Figure 27
0.1
nA typ
0.25
0.15
1
7
nA max
nA typ
Drain Off Leakage, ID (Off)
VS = 1 V/30 V, VD = 30 V/1 V; see
Figure 27
0.4
0.15
0.4
4
4
30
30
nA max
nA typ
nA max
Channel On Leakage, ID (On), IS (On)
VS = VD = 1 V/30 V; see Figure 23
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current, IINL or IINH
2.0
0.8
V min
V max
μA typ
μA max
pF typ
0.002
3
VIN = VGND or VDD
0.1
Digital Input Capacitance, CIN
DYNAMIC CHARACTERISTICS1
Transition Time, tTRANSITION
187
242
160
195
147
184
ns typ
ns max
ns typ
ns max
ns typ
ns max
ns typ
ns min
pC typ
RL = 300 Ω, CL = 35 pF
VS = 18 V; see Figure 30
RL = 300 Ω, CL = 35 pF
VS = 18 V; see Figure 32
RL = 300 Ω, CL = 35 pF
VS = 18 V; see Figure 32
RL = 300 Ω, CL = 35 pF
VS1 = VS2 = 18 V; see Figure 31
257
219
184
281
237
190
14
tON (EN)
tOFF (EN)
Break-Before-Make Time Delay, tD 53
Charge Injection, QINJ
150
VS = 18 V, RS = 0 Ω, CL = 1 nF;
see Figure 33
Off Isolation
−60
−60
0.4
dB typ
dB typ
% typ
RL = 50 Ω, CL = 5 pF, f = 1 MHz;
see Figure 26
RL = 50 Ω, CL = 5 pF, f = 1 MHz;
see Figure 25
RL = 1 kΩ, 18 V p-p, f = 20 Hz to 20 kHz;
see Figure 28
Channel-to-Channel Crosstalk
Total Harmonic Distortion + Noise
−3 dB Bandwidth
ADG5408-EP
ADG5409-EP
RL = 50 Ω, CL = 5 pF; see Figure 29
45
76
−1
MHz typ
MHz typ
dB typ
Insertion Loss
RL = 50 Ω, CL = 5 pF, f = 1 MHz;
see Figure 29
CS (Off)
18
pF typ
VS = 18 V, f = 1 MHz
CD (Off)
ADG5408-EP
ADG5409-EP
CD (On), CS (On)
ADG5408-EP
ADG5409-EP
POWER REQUIREMENTS
IDD
120
60
pF typ
pF typ
VS = 18 V, f = 1 MHz
VS = 18 V, f = 1 MHz
137
80
pF typ
pF typ
VS = 18 V, f = 1 MHz
VS = 18 V, f = 1 MHz
VDD = 39.6 V
80
μA typ
Digital inputs = 0 V or VDD
100
155
μA max
VDD
9/40
V min/V max GND = 0 V, VSS = 0 V
1 Guaranteed by design; not subject to production test.
Rev. 0 | Page 7 of 18
ADG5408-EP/ADG5409-EP
Enhanced Product
CONTINUOUS CURRENT PER CHANNEL, Sx OR D
Table 5. ADG5408-EP
Parameter
25°C
85°C
125°C
Unit
CONTINUOUS CURRENT, Sx OR D (θJA = 30.4°C/W)
VDD = +15 V, VSS = −15 V
VDD = +20 V, VSS = −20 V
VDD = 12 V, VSS = 0 V
207
218
168
214
113
117
99
60
61
57
61
mA maximum
mA maximum
mA maximum
mA maximum
VDD = 36 V, VSS = 0 V
116
Table 6. ADG5409-EP
Parameter
25°C
85°C
125°C
Unit
CONTINUOUS CURRENT, Sx OR D (θJA = 30.4°C/W)
VDD = +15 V, VSS = −15 V
VDD = +20 V, VSS = −20 V
VDD = 12 V, VSS = 0 V
156
165
126
161
95
98
81
97
55
56
50
56
mA maximum
mA maximum
mA maximum
mA maximum
VDD = 36 V, VSS = 0 V
Rev. 0 | Page 8 of 18
Enhanced Product
ADG5408-EP/ADG5409-EP
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Table 7.
Parameter
Rating
VDD to VSS
48 V
VDD to GND
VSS to GND
Analog Inputs1
−0.3 V to +48 V
+0.3 V to −48 V
VSS − 0.3 V to VDD + 0.3 V or
Only one absolute maximum rating can be applied at any
one time.
30 mA, whichever occurs first
VSS − 0.3 V to VDD + 0.3 V or
Digital Inputs1
30 mA, whichever occurs first
ESD CAUTION
Peak Current, Sx or D Pins
ADG5408-EP
435 mA (pulsed at 1 ms, 10%
duty cycle maximum)
ADG5409-EP
300 mA (pulsed at 1 ms, 10%
duty cycle maximum)
Continuous Current, Sx or D2
Temperature Range
Operating
Storage
Junction Temperature
Thermal Impedance, θJA
Data + 15%
−55°C to +125°C
−65°C to +150°C
150°C
16-Lead LFCSP (4-Layer
Board)
30.4°C/W
Reflow Soldering Peak
Temperature, Pb-Free
As per JEDEC J-STD-020
1 Overvoltages at the Ax, EN, Sx, and D pins are clamped by internal diodes.
Limit current to the maximum ratings given.
2 See Table 5.
Rev. 0 | Page 9 of 18
ADG5408-EP/ADG5409-EP
Enhanced Product
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
V
1
2
3
4
12 GND
SS
ADG5408-EP
V
11
10 S5
S6
S1
S2
S3
DD
TOP VIEW
(Not to Scale)
9
NOTES
1. THE EXPOSED PAD IS
CONNECTED INTERNALLY. FOR
INCREASED RELIABILITY OF THE
SOLDER JOINTS AND MAXIMUM
THERMAL CAPABILITY, IT IS
RECOMMENDED THAT THE PAD BE
SOLDERED TO THE SUBSTRATE, V
.
SS
Figure 2. ADG5408-EP Pin Configuration
Table 8. ADG5408-EP Pin Function Descriptions
Pin No. Mnemonic
Description
15
16
A0
EN
Logic Control Input.
Active High Digital Input. When low, the device is disabled and all switches are off. When high, Ax logic inputs
determine on switches.
1
2
3
4
5
6
7
8
VSS
S1
S2
S3
S4
D
S8
S7
S6
S5
VDD
GND
A2
A1
Most Negative Power Supply Potential. In single-supply applications, this pin can be connected to ground.
Source Terminal 1. This pin can be an input or an output.
Source Terminal 2. This pin can be an input or an output.
Source Terminal 3. This pin can be an input or an output.
Source Terminal 4. This pin can be an input or an output.
Drain Terminal. This pin can be an input or an output.
Source Terminal 8. This pin can be an input or an output.
Source Terminal 7. This pin can be an input or an output.
Source Terminal 6. This pin can be an input or an output.
Source Terminal 5. This pin can be an input or an output.
Most Positive Power Supply Potential.
9
10
11
12
13
14
EP
Ground (0 V) Reference.
Logic Control Input.
Logic Control Input.
Exposed Pad
The exposed pad is connected internally. For increased reliability of the solder joints and maximum thermal
capability, it is recommended that the pad be soldered to the substrate, VSS.
Table 9. ADG5408-EP Truth Table
A2
X
0
0
0
0
1
1
1
A1
X
0
0
1
1
0
0
1
A0
X
0
1
0
1
0
1
0
EN
0
1
1
1
1
1
1
1
On Switch
None
1
2
3
4
5
6
7
8
1
1
1
1
Rev. 0 | Page 10 of 18
Enhanced Product
ADG5408-EP/ADG5409-EP
V
1
2
3
4
12 V
SS
DD
S1B
S2B
S3B
ADG5409-EP
11
10
9
S1A
S2A
S3A
TOP VIEW
(Not to Scale)
NOTES
1. THE EXPOSED PAD IS
CONNECTED INTERNALLY. FOR
INCREASED RELIABILITY OF THE
SOLDER JOINTS AND MAXIMUM
THERMAL CAPABILITY, IT IS
RECOMMENDED THAT THE PAD BE
SOLDERED TO THE SUBSTRATE, V
.
SS
Figure 3. ADG5409-EP Pin Configuration
Table 10. ADG5409-EP Pin Function Descriptions
Pin No.
Mnemonic
Description
15
16
A0
EN
Logic Control Input.
Active High Digital Input. When low, the device is disabled and all switches are off. When high, Ax logic
inputs determine on switches.
1
2
3
4
5
6
7
8
VSS
Most Negative Power Supply Potential. In single-supply applications, this pin can be connected to ground.
Source Terminal 1A. This pin can be an input or an output.
Source Terminal 2A. This pin can be an input or an output.
Source Terminal 3A. This pin can be an input or an output.
Source Terminal 4A. This pin can be an input or an output.
Drain Terminal A. This pin can be an input or an output.
Drain Terminal B. This pin can be an input or an output.
Source Terminal 4B. This pin can be an input or an output.
Source Terminal 3B. This pin can be an input or an output.
Source Terminal 2B. This pin can be an input or an output.
Source Terminal 1B. This pin can be an input or an output.
Most Positive Power Supply Potential.
S1A
S2A
S3A
S4A
DA
DB
S4B
S3B
S2B
S1B
VDD
GND
A1
Exposed Pad
9
10
11
12
13
14
EP
Ground (0 V) Reference.
Logic Control Input.
The exposed pad is connected internally. For increased reliability of the solder joints and maximum thermal
capability, it is recommended that the pad be soldered to the substrate, VSS.
Table 11. ADG5409-EP Truth Table
A1
A0
EN
0
On Switch Pair
X
X
None
0
0
1
1
0
1
0
1
1
1
1
1
1
2
3
4
Rev. 0 | Page 11 of 18
ADG5408-EP/ADG5409-EP
Enhanced Product
TYPICAL PERFORMANCE CHARACTERISTICS
16
14
12
10
8
25
T
= 25°C
T
= 25°C
A
A
V
V
= +10V
= –10V
V
V
= +9V
= –9V
DD
SS
DD
SS
20
15
10
5
V
V
= +11V
= –11V
DD
SS
V
V
= 32.4V
= 0V
DD
SS
V
V
= 39.6V
= 0V
V
V
= 36V
= 0V
DD
SS
DD
SS
V
V
= +13.5V
= –13.5V
6
DD
SS
V
= +15V
= –15V
DD
SS
V
V
V
= +16.5V
= –16.5V
DD
SS
4
2
0
0
–18
–14
–10
–6
–2
2
6
10
14
18
0
5
10
15
20
25
30
35
40
45
V , V (V)
V , V (V)
S
D
S
D
Figure 7. RON as a Function of VS, VD (Single Supply)
Figure 4. RON as a Function of VS, VD (Dual Supply)
25
20
15
10
5
16
14
12
10
8
T
= 25°C
A
V
V
= +18V
= –18V
DD
SS
T
= +125°C
= +85°C
A
T
A
V
V
= +22V
= –22V
V
V
= +20V
= –20V
DD
SS
DD
T
= +25°C
A
SS
6
T
T
= –40°C
= –55°C
A
A
4
2
V
V
= +15V
= –15V
DD
SS
0
0
–15
–10
–5
0
5
10
15
–25 –20 –15 –10
–5
0
5
10
15
20
25
V , V (V)
V , V (V)
S
D
S
D
Figure 5. RON as a Function of VS, VD (Dual Supply)
Figure 8. RON as a Function of VS (VD) for Different Temperatures,
15 V Dual Supply
20
–35
–30
–25
–20
–15
–10
–5
T
= 25°C
V
V
= +20V
= –20V
A
DD
SS
V
V
= 10V
= 0V
DD
SS
18
16
14
12
10
8
V
V
= 10.8V
= 0V
DD
SS
V
V
= 9V
= 0V
DD
SS
T
= +125°C
= +85°C
A
T
A
A
T
T
= +25°C
V
V
= 11V
= 0V
DD
SS
V
V
= 12V
= 0V
DD
SS
= –40°C
= –55°C
A
V
V
= 13.2V
= 0V
DD
SS
6
T
A
4
2
0
–20
0
–15
–10
–5
0
5
10
15
20
0
–2
–4
–6
–8
V , V (V)
–10
–12
–14
S
D
V , V (V)
S
D
Figure 6. RON as a Function of VS, VD (Single Supply)
Figure 9. RON as a Function of VS (VD) for Different Temperatures,
20 V Dual Supply
Rev. 0 | Page 12 of 18
Enhanced Product
ADG5408-EP/ADG5409-EP
1
0
40
35
30
25
20
15
10
5
V
V
V
= +20V
= –20V
BIAS
I
, I (ON) + +
S
DD
SS
D
I
(OFF) + –
S
= +15V/–15V
T
= +125°C
= +85°C
A
I
(OFF) – +
D
T
A
A
I
(OFF) – +
S
T
= +25°C
–1
–2
–3
I
, I (ON) – –
S
D
T
T
= –40°C
= –55°C
A
I
(OFF) + –
A
D
V
V
= 12V
= 0V
DD
SS
0
0
25
50
75
100
125
0
2
4
6
8
10
12
TEMPERATURE (°C)
V , V (V)
S
D
Figure 13. Leakage Currents vs. Temperature, 20 V Dual Supply
Figure 10. RON as a Function of VS (VD) for Different Temperatures,
12 V Single Supply
25
0.5
V
V
V
= 12V
= 0V
BIAS
V
V
= 36V
= 0V
I
, I (ON) + +
S
DD
SS
DD
SS
D
= 1V/10V
I
(OFF) + –
S
20
15
10
5
0
–0.5
–1.0
–1.5
–2.0
I
(OFF) – +
D
T
= +125°C
= +85°C
A
I
(OFF) – +
S
T
A
A
I
, I (ON) – –
S
D
T
= +25°C
I
(OFF) + –
D
T
T
= –40°C
= –55°C
A
A
0
0
25
50
75
100
125
0
4
8
12
16
20
24
28
32
36
TEMPERATURE (°C)
V , V (V)
S
D
Figure 14. Leakage Currents vs. Temperature, 12 V Single Supply
Figure 11. RON as a Function of VD (VS) for Different Temperatures,
36 V Single Supply
1
0.5
V
V
V
= +15V
= –15V
BIAS
V
V
V
= +36V
= 0V
BIAS
I
, I (ON) + +
S
DD
SS
DD
SS
D
I
, I (ON) + +
S
D
I (OFF) + –
S
= +10V/–10V
I
(OFF) + –
= 1V/30V
S
0
–0.5
–1.0
–1.5
–2.0
0
–1
–2
–3
I
(OFF) – +
D
I
(OFF) – +
I
(OFF) – +
D
S
I
(OFF) – +
S
I
, I (ON) – –
S
D
I
, I (ON) – –
S
D
I
(OFF) + –
D
I
(OFF) + –
D
0
25
50
75
100
125
0
25
50
75
100
125
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 15. Leakage Currents vs. Temperature, 36 V Single Supply
Figure 12. Leakage Currents vs. Temperature, 15 V Dual Supply
Rev. 0 | Page 13 of 18
ADG5408-EP/ADG5409-EP
Enhanced Product
0
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
T
V
V
= 25°C
= +15V
T
= 25°C
= +15V
SS
A
A
DD
V
V
DD
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
= –15V
= –15V
SS
NO DECOUPLING
CAPACITORS
DECOUPLING
CAPACITORS
1k
10k
100k
1M
10M
100M
1G
1G
40
1k
10k
100k
1M
10M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 16. Off Isolation vs. Frequency, 15 V Dual Supply
Figure 19. ACPSRR vs. Frequency, 15 V Dual Supply
0.12
0.10
0.08
0.06
0.04
0.02
0
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
T
V
V
= 25°C
A
= +15V
= –15V
DD
SS
V
= 12V, V = 0V, V = 6V p-p
SS S
DD
LOAD = 1kΩ
T
= 25°C
A
V
V
= 36V, V = 0V, V = 18V p-p
SS S
DD
= 15V, V = 15V, V = 15V p-p
DD
SS
S
V
= 20V, V = 20V, V = 20V p-p
SS S
DD
10k
100k
1M
10M
100M
0
5
10
FREQUENCY (kHz)
15
20
FREQUENCY (Hz)
Figure 17. Crosstalk vs. Frequency, 15 V Dual Supply
Figure 20. THD + N vs. Frequency
300
250
200
150
100
50
0
–0.5
–1.0
–1.5
–2.0
–2.5
–3.0
–3.5
–4.0
–4.5
–5.0
T
V
V
= 25°C
= +15V
T
= 25°C
A
A
V
V
= +20V
= –20V
DD
SS
DD
SS
= –15V
ADG5409 -EP
ADG5408-EP
V
V
= +36V
= 0V
DD
SS
V
V
= +12V
= 0V
DD
SS
V
V
= +15V
= –15V
DD
SS
0
1k
10k
100k
1M
10M
100M
1G
20
10
0
10
20
30
FREQUENCY (Hz)
V
(V)
S
Figure 21. Bandwidth
Figure 18. Charge Injection vs. Source Voltage
Rev. 0 | Page 14 of 18
Enhanced Product
ADG5408-EP/ADG5409-EP
380
330
V
= +12V, V = 0V
SS
DD
280
230
180
130
V
= +36V, V = 0V
SS
DD
V
= +15V, V = –15V
SS
DD
V
= +20V, V = –20V
SS
DD
5
–55
–35
–15
25
45
65
85
105
125
TEMPERATURE (°C)
Figure 22. tTRANSITION Times vs. Temperature
Rev. 0 | Page 15 of 18
ADG5408-EP/ADG5409-EP
TEST CIRCUITS
Enhanced Product
I
(ON)
A
D
S1
D
NC
I
(OFF)
A
I
(OFF)
A
S
D
S1
S8
S2
D
S8
A
V
V
D
V
V
D
S
D
NC = NO CONNECT
Figure 23. On Leakage
Figure 27. Off Leakage
V
V
DD
SS
0.1µF
0.1µF
AUDIO PRECISION
V
V
DD
SS
R
S
Sx
V
IN
V
S
V p-p
D
S
D
V
OUT
V
IN
R
L
10kꢀ
I
DS
GND
R
= V/I
DS
V
ON
S
Figure 28. THD + Noise Figure
Figure 24. On Resistance
V
V
DD
SS
V
V
SS
DD
0.1µF
0.1µF
0.1µF
0.1µF
NETWORK
ANALYZER
V
NETWORK
ANALYZER
V
DD
SS
V
V
DD
SS
S1
V
OUT
R
L
50ꢀ
D
Sx
50ꢀ
S2
R
L
V
S
50ꢀ
D
V
OUT
V
S
R
50ꢀ
L
GND
V
GND
V
WITH SWITCH
OUT
OUT
INSERTION LOSS = 20 log
CHANNEL-TO-CHANNEL CROSSTALK = 20 log
V
WITHOUT SWITCH
V
OUT
S
Figure 29. Bandwidth
Figure 25. Channel-to-Channel Crosstalk
V
V
DD
SS
0.1µF
0.1µF
NETWORK
ANALYZER
V
V
DD
SS
50ꢀ
Sx
50ꢀ
V
S
D
V
OUT
R
L
50ꢀ
GND
V
V
OUT
OFF ISOLATION = 20 log
S
Figure 26. Off Isolation
Rev. 0 | Page 16 of 18
Enhanced Product
ADG5408-EP/ADG5409-EP
V
V
V
DD
DD
SS
3V
tr < 20ns
tf < 20ns
V
SS
ADDRESS
DRIVE (V
50%
50%
A0
A1
A2
)
IN
S1
V
S1
0V
V
IN
50ꢀ
S2 TO S7
tTRANSITION
tTRANSITION
S8
V
S8
90%
ADG5408-EP*
OUTPUT
D
2.4V
EN
OUTPUT
300ꢀ
GND
35pF
90%
*SIMILAR CONNECTION FOR ADG5409-EP.
Figure 30. Address to Output Switching Times, tTRANSITION
V
V
V
DD
DD
SS
SS
3V
V
ADDRESS
A0
A1
A2
DRIVE (V
)
IN
S1
V
S
V
IN
50ꢀ
0V
S2 TO S7
S8
80%
80%
ADG5408-EP*
OUTPUT
OUTPUT
D
2.4V
EN
300ꢀ
GND
35pF
tD
*SIMILAR CONNECTION FOR ADG5409-EP.
Figure 31. Break-Before-Make Delay, tD
V
V
V
V
DD
DD
SS
SS
3V
A0
A1
A2
ENABLE
DRIVE (V
50%
50%
)
S1
S2 TO S8
V
IN
S
0V
ADG5408-EP*
tON (EN)
tOFF (EN)
OUTPUT
0.9V
0.9V
O
D
EN
O
OUTPUT
V
35pF
IN
50ꢀ
300ꢀ
GND
*SIMILAR CONNECTION FOR ADG5409-EP.
Figure 32. Enable Delay, tON (EN), tOFF (EN)
V
V
V
V
DD
DD
SS
SS
3V
A0
A1
A2
V
V
IN
ADG5408-EP*
R
S
Sx
EN
D
OUT
V
∆V
OUT
OUT
C
1nF
L
V
Q
= C × ∆V
L OUT
S
INJ
GND
V
IN
*SIMILAR CONNECTION FOR ADG5409-EP.
Figure 33. Charge Injection
Rev. 0 | Page 17 of 18
ADG5408-EP/ADG5409-EP
OUTLINE DIMENSIONS
Enhanced Product
4.10
4.00 SQ
3.90
0.35
0.30
0.25
PIN 1
INDICATOR
PIN 1
INDICATOR
13
16
0.65
BSC
12
1
EXPOSED
PAD
2.70
2.60 SQ
2.50
4
9
8
5
0.45
0.40
0.35
0.20 MIN
TOP VIEW
BOTTOM VIEW
0.80
0.75
0.70
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
0.05 MAX
0.02 NOM
COPLANARITY
0.08
SECTION OF THIS DATA SHEET.
SEATING
PLANE
0.20 REF
COMPLIANT TO JEDEC STANDARDS MO-220-WGGC.
Figure 34. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm × 4 mm Body, Very Very Thin Quad
(CP-16-17)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Temperature Range
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
Package Description
Package Option
ADG5408TCPZ-EP-RL7
ADG5408TCPZ-EP
ADG5409TCPZ-EP-RL7
ADG5409TCPZ-EP
16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
CP-16-17
CP-16-17
CP-16-17
CP-16-17
16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
1 Z = RoHS Compliant Part.
©2015 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D13397-0-9/15(0)
Rev. 0 | Page 18 of 18
相关型号:
ADG5412BFBCPZ-RL7
Bidirectional Fault Protection and Detection, 10 Ω RON, Quad SPST Switches
ADI
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