ADG5409TCPZ-EP [ADI]

High Voltage Latch-up Proof 4-Channel Multiplexer;
ADG5409TCPZ-EP
型号: ADG5409TCPZ-EP
厂家: ADI    ADI
描述:

High Voltage Latch-up Proof 4-Channel Multiplexer

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High Voltage Latch-Up Proof,  
4-/8-Channel Multiplexers  
Enhanced Product  
ADG5408-EP/ADG5409-EP  
FEATURES  
FUNCTIONAL BLOCK DIAGRAMS  
Latch-up proof  
ADG5408-EP  
ADG5409-EP  
8 kV human body model (HBM) ESD rating  
Low on resistance (13.5 Ω)  
9 V to 22 V dual-supply operation  
9 V to 40 V single-supply operation  
Fully specified at 15 V, 20 V, +12 V, and +36 V  
S1  
S1A  
S4A  
DA  
DB  
D
S1B  
S4B  
VSS to VDD analog signal range  
S8  
ENHANCED PRODUCT FEATURES  
Supports defense and aerospace applications  
(AQEC standard)  
1-OF-8  
DECODER  
1-OF-4  
DECODER  
Military temperature range: –55°C to +125°C  
Controlled manufacturing baseline  
One assembly/test site  
A0 A1 A2 EN  
A0 A1 EN  
Figure 1.  
One fabrication site  
Enhanced product change notification  
Qualification data available on request  
APPLICATIONS  
Relay replacement  
Automatic test equipment  
Data acquisition  
Instrumentation  
Avionics  
Communication systems  
GENERAL DESCRIPTION  
The ADG5408-EP/ADG5409-EP are monolithic CMOS analog  
multiplexers comprising eight single channels and four differential  
channels, respectively. The ADG5408-EP switches one of eight  
inputs to a common output, as determined by the 3-bit binary  
address lines, A0, A1, and A2. The ADG5409-EP switches one  
of four differential inputs to a common differential output, as  
determined by the 2-bit binary address lines, A0 and A1.  
The ADG5408-EP/ADG5409-EP do not have VL pins; rather, the  
logic power supply is generated internally by an on-chip voltage  
generator.  
Additional application and technical information can be found  
in the ADG5408/ADG5409 data sheet.  
PRODUCT HIGHLIGHTS  
1. Trench isolation guards against latch-up. A dielectric trench  
separates the P and N channel transistors thereby preventing  
latch-up even under severe overvoltage conditions.  
An EN input on both devices enables or disables the device.  
When EN is disabled, all channels switch off. The on-resistance  
profile is very flat over the full analog input range, which ensures  
good linearity and low distortion when switching audio signals.  
High switching speed also makes the parts suitable for video  
signal switching.  
2. Low RON  
.
3. Dual-supply operation. For applications where the analog  
signal is bipolar, the ADG5408-EP/ADG5409-EP can be  
operated from dual supplies up to 22 V.  
4. Single-supply operation. For applications where the analog  
signal is unipolar, the ADG5408-EP/ADG5409-EP can be  
operated from a single rail power supply up to 40 V.  
5. 3 V logic compatible digital inputs: VINH = 2.0 V, VINL = 0.8 V.  
6. No VL logic power supply required.  
Each switch conducts equally well in both directions when on,  
and each switch has an input signal range that extends to the  
power supplies. In the off condition, signal levels up to the  
supplies are blocked.  
Rev. 0  
Document Feedback  
Information furnished by Analog Devices is believed to be accurate and reliable. However, no  
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other  
rights of third parties that may result from its use. Specifications subject to change without notice. No  
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.  
Trademarks and registeredtrademarks arethe property of their respective owners.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 781.329.4700  
Technical Support  
©2015 Analog Devices, Inc. All rights reserved.  
www.analog.com  
 
 
 
 
 
 
ADG5408-EP/ADG5409-EP  
Enhanced Product  
TABLE OF CONTENTS  
Features .............................................................................................. 1  
36 V Single Supply.........................................................................6  
Continuous Current per Channel, Sx or D................................8  
Absolute Maximum Ratings ............................................................9  
ESD Caution...................................................................................9  
Pin Configurations and Function Descriptions......................... 10  
Typical Performance Characteristics ........................................... 12  
Test Circuits..................................................................................... 16  
Outline Dimensions....................................................................... 18  
Ordering Guide .......................................................................... 18  
Enhanced Product Features ............................................................ 1  
Applications....................................................................................... 1  
Functional Block Diagrams............................................................. 1  
General Description......................................................................... 1  
Product Highlights ........................................................................... 1  
Revision History ............................................................................... 2  
Specifications..................................................................................... 3  
15 V Dual Supply ....................................................................... 3  
20 V Dual Supply ....................................................................... 4  
12 V Single Supply........................................................................ 5  
REVISION HISTORY  
9/15—Revision 0: Initial Version  
Rev. 0 | Page 2 of 18  
 
Enhanced Product  
ADG5408-EP/ADG5409-EP  
SPECIFICATIONS  
15 V DUAL SUPPLY  
VDD = +15 V 10%, VSS = −15 V 10%, GND = 0 V, unless otherwise noted.  
Table 1.  
Parameter  
25°C  
−40°C to +85°C −55°C to +125°C Unit  
Test Conditions/Comments  
ANALOG SWITCH  
Analog Signal Range  
On Resistance, RON  
VDD to VSS  
22  
V
13.5  
15  
0.3  
Ω typ  
Ω max  
Ω typ  
VS = 10 V, IS = −10 mA; see Figure 24  
VDD = +13.5 V, VSS = −13.5 V  
VS = 10 V, IS = −10 mA  
18  
On-Resistance Match Between  
Channels, ∆RON  
0.8  
1.8  
2.2  
1.3  
2.6  
1.4  
3
Ω max  
Ω typ  
Ω max  
On-Resistance Flatness, RFLAT (ON)  
VS = 10 V, IS = −10 mA  
LEAKAGE CURRENTS  
VDD = +16.5 V, VSS = −16.5 V  
Source Off Leakage, IS (Off)  
0.05  
0.25  
0.1  
0.4  
0.1  
nA typ  
nA max  
nA typ  
nA max  
nA typ  
nA max  
VS = 10 V, VD = 10 V; see Figure 27  
1
4
4
7
Drain Off Leakage, ID (Off)  
Channel On Leakage, ID (On), IS (On)  
DIGITAL INPUTS  
VS = 10 V, VD = 10 V; see Figure 27  
30  
30  
VS = VD = 10 V; see Figure 23  
0.4  
Input High Voltage, VINH  
Input Low Voltage, VINL  
Input Current, IINL or IINH  
2.0  
0.8  
V min  
V max  
μA typ  
μA max  
pF typ  
0.002  
3
VIN = VGND or VDD  
0.1  
Digital Input Capacitance, CIN  
DYNAMIC CHARACTERISTICS1  
Transition Time, tTRANSITION  
170  
217  
140  
175  
130  
161  
ns typ  
ns max  
ns typ  
ns max  
ns typ  
ns max  
ns typ  
ns min  
pC typ  
RL = 300 Ω, CL = 35 pF  
VS = 10 V; see Figure 30  
RL = 300 Ω, CL = 35 pF  
VS = 10 V; see Figure 32  
RL = 300 Ω, CL = 35 pF  
VS = 10 V; see Figure 32  
RL = 300 Ω, CL = 35 pF  
VS1 = VS2 = 10 V; see Figure 31  
258  
213  
183  
292  
242  
198  
13  
tON (EN)  
tOFF (EN)  
Break-Before-Make Time Delay, tD 50  
Charge Injection, QINJ  
115  
VS = 0 V, RS = 0 Ω, CL = 1 nF;  
see Figure 33  
Off Isolation  
−60  
−60  
0.01  
dB typ  
dB typ  
% typ  
RL = 50 Ω, CL = 5 pF, f = 1 MHz; see  
Figure 26  
RL = 50 Ω, CL = 5 pF, f = 1 MHz; see  
Figure 25  
RL = 1 kΩ, 15 V p-p, f = 20 Hz to 20 kHz;  
see Figure 28  
Channel-to-Channel Crosstalk  
Total Harmonic Distortion + Noise  
−3 dB Bandwidth  
ADG5408-EP  
ADG5409-EP  
RL = 50 Ω, CL = 5 pF; see Figure 29  
50  
87  
0.9  
MHz typ  
MHz typ  
dB typ  
Insertion Loss  
RL = 50 Ω, CL = 5 pF, f = 1 MHz;  
Figure 29  
CS (Off)  
15  
pF typ  
VS = 0 V, f = 1 MHz  
CD (Off)  
ADG5408-EP  
ADG5409-EP  
102  
50  
pF typ  
pF typ  
VS = 0 V, f = 1 MHz  
VS = 0 V, f = 1 MHz  
Rev. 0 | Page 3 of 18  
 
 
ADG5408-EP/ADG5409-EP  
Enhanced Product  
Parameter  
25°C  
−40°C to +85°C −55°C to +125°C Unit  
pF typ  
Test Conditions/Comments  
CD (On), CS (On)  
ADG5408-EP  
ADG5409-EP  
POWER REQUIREMENTS  
IDD  
133  
81  
VS = 0 V, f = 1 MHz  
VS = 0 V, f = 1 MHz  
pF typ  
VDD = +16.5 V, VSS = −16.5 V  
Digital inputs = 0 V or VDD  
45  
55  
0.001  
μA typ  
μA max  
μA typ  
μA max  
80  
1
ISS  
Digital inputs = 0 V or VDD  
VDD/VSS  
9/ 22  
V min/V max GND = 0 V  
1 Guaranteed by design; not subject to production test.  
20 V DUAL SUPPLY  
VDD = +20 V 10%, VSS = −20 V 10%, GND = 0 V, unless otherwise noted.  
Table 2.  
Parameter  
25°C −40°C to +85°C −55°C to +125°C Unit  
Test Conditions/Comments  
ANALOG SWITCH  
Analog Signal Range  
On Resistance, RON  
VDD to VSS  
21  
V
12.5  
14  
0.3  
Ω typ  
Ω max  
Ω typ  
VS = 15 V, IS = −10 mA; see Figure 24  
VDD = +18 V, VSS = −18 V  
VS = 15 V, IS = −10 mA  
17  
On-Resistance Match Between  
Channels, ∆RON  
0.8  
2.3  
2.7  
1.3  
3.1  
1.4  
3.5  
Ω max  
Ω typ  
Ω max  
On-Resistance Flatness, RFLAT (ON)  
VS = 15 V, IS = −10 mA  
LEAKAGE CURRENTS  
VDD = +22 V, VSS = −22 V  
Source Off Leakage, IS (Off)  
0.1  
0.25  
0.15  
0.4  
0.15  
0.4  
nA typ  
nA max  
nA typ  
nA max  
nA typ  
nA max  
VS = 15 V, VD = 15 V; see Figure 27  
1
4
4
7
Drain Off Leakage, ID (Off)  
VS = 15 V, VD = 15 V; see Figure 27  
30  
30  
Channel On Leakage, ID (On), IS (On)  
VS = VD = 15 V; see Figure 23  
DIGITAL INPUTS  
Input High Voltage, VINH  
Input Low Voltage, VINL  
Input Current, IINL or IINH  
2.0  
0.8  
V min  
V max  
μA typ  
μA max  
pF typ  
0.002  
3
VIN = VGND or VDD  
0.1  
Digital Input Capacitance, CIN  
DYNAMIC CHARACTERISTICS1  
Transition Time, tTRANSITION  
160  
207  
140  
165  
133  
153  
ns typ  
ns max  
ns typ  
ns max  
ns typ  
ns max  
ns typ  
ns min  
pC typ  
RL = 300 Ω, CL = 35 pF  
VS = 10 V; see Figure 30  
RL = 300 Ω, CL = 35 pF  
VS = 10 V; see Figure 32  
RL = 300 Ω, CL = 35 pF  
VS = 10 V; see Figure 32  
RL = 300 Ω, CL = 35 pF  
VS1 = VS2 = 10 V; see Figure 31  
VS = 0 V, RS = 0 Ω, CL = 1 nF; see  
Figure 33  
RL = 50 Ω, CL = 5 pF, f = 1 MHz; see  
Figure 26  
237  
194  
174  
262  
218  
189  
8
tON (EN)  
tOFF (EN)  
Break-Before-Make Time Delay, tD 38  
Charge Injection, QINJ  
Off Isolation  
155  
−60  
−60  
dB typ  
dB typ  
Channel-to-Channel Crosstalk  
RL = 50 Ω, CL = 5 pF, f = 1 MHz;  
see Figure 25  
Rev. 0 | Page 4 of 18  
 
Enhanced Product  
ADG5408-EP/ADG5409-EP  
Parameter  
25°C −40°C to +85°C −55°C to +125°C Unit  
Test Conditions/Comments  
Total Harmonic Distortion + Noise  
0.012  
% typ  
RL = 1 kΩ, 20 V p-p, f = 20 Hz to 20 kHz;  
see Figure 28  
−3 dB Bandwidth  
ADG5408-EP  
ADG5409-EP  
RL = 50 Ω, CL = 5 pF; see Figure 29  
50  
88  
0.8  
MHz typ  
MHz typ  
dB typ  
Insertion Loss  
RL = 50 Ω, CL = 5 pF, f = 1 MHz;  
see Figure 29  
CS (Off)  
17  
pF typ  
VS = 0 V, f = 1 MHz  
CD (Off)  
ADG5408-EP  
ADG5409-EP  
CD (On), CS (On)  
ADG5408-EP  
ADG5409-EP  
POWER REQUIREMENTS  
IDD  
98  
48  
pF typ  
pF typ  
VS = 0 V, f = 1 MHz  
VS = 0 V, f = 1 MHz  
128  
80  
pF typ  
pF typ  
VS = 0 V, f = 1 MHz  
VS = 0 V, f = 1 MHz  
VDD = +22 V, VSS = −22 V  
Digital inputs = 0 V or VDD  
50  
70  
0.001  
μA typ  
μA max  
μA typ  
μA max  
120  
1
ISS  
Digital inputs = 0 V or VDD  
VDD/VSS  
9/ 22  
V min/V max GND = 0 V  
1 Guaranteed by design; not subject to production test.  
12 V SINGLE SUPPLY  
VDD = 12 V 10%, VSS = 0 V, GND = 0 V, unless otherwise noted.  
Table 3.  
Parameter  
25°C −40°C to +85°C −55°C to +125°C Unit  
Test Conditions/Comments  
ANALOG SWITCH  
Analog Signal Range  
On Resistance, RON  
0 V to VDD  
42  
V
26  
Ω typ  
VS = 0 V to 10 V, IS = −10 mA; see  
Figure 24  
VDD = 10.8 V, VSS = 0 V  
30  
0.3  
36  
Ω max  
Ω typ  
On-Resistance Match Between  
Channels, ∆RON  
VS = 0 V to 10 V, IS = −10 mA  
1
5.5  
6.5  
1.5  
8
1.6  
12  
Ω max  
Ω typ  
Ω max  
On-Resistance Flatness, RFLAT (ON)  
VS = 0 V to 10 V, IS = −10 mA  
VDD = 13.2 V, VSS = 0 V  
LEAKAGE CURRENTS  
Source Off Leakage, IS (Off)  
0.02  
nA typ  
VS = 1 V/10 V, VD = 10 V/1 V; see  
Figure 27  
0.25  
0.05  
1
7
nA max  
nA typ  
Drain Off Leakage, ID (Off)  
VS = 1 V/10 V, VD = 10 V/1 V; see  
Figure 27  
0.4  
0.05  
0.4  
4
4
30  
30  
nA max  
nA typ  
nA max  
Channel On Leakage, ID (On), IS (On)  
VS = VD = 1 V/10 V; see Figure 23  
DIGITAL INPUTS  
Input High Voltage, VINH  
Input Low Voltage, VINL  
Input Current, IINL or IINH  
2.0  
0.8  
V min  
V max  
μA typ  
μA max  
pF typ  
0.002  
3
VIN = VGND or VDD  
0.1  
Digital Input Capacitance, CIN  
Rev. 0 | Page 5 of 18  
 
ADG5408-EP/ADG5409-EP  
Enhanced Product  
Parameter  
DYNAMIC CHARACTERISTICS1  
25°C −40°C to +85°C −55°C to +125°C Unit  
Test Conditions/Comments  
Transition Time, tTRANSITION  
230  
321  
215  
276  
134  
161  
ns typ  
ns max  
ns typ  
ns max  
ns typ  
ns max  
ns typ  
ns min  
pC typ  
RL = 300 Ω, CL = 35 pF  
VS = 8 V; see Figure 30  
RL = 300 Ω, CL = 35 pF  
VS = 8 V; see Figure 32  
RL = 300 Ω, CL = 35 pF  
VS = 8 V; see Figure 32  
RL = 300 Ω, CL = 35 pF  
VS1 = VS2 = 8 V; see Figure 31  
388  
345  
187  
430  
397  
209  
44  
tON (EN)  
tOFF (EN)  
Break-Before-Make Time Delay, tD 118  
Charge Injection, QINJ  
45  
VS = 6 V, RS = 0 Ω, CL = 1 nF; see  
Figure 33  
Off Isolation  
−60  
−60  
0.1  
dB typ  
dB typ  
% typ  
RL = 50 Ω, CL = 5 pF, f = 1 MHz;  
see Figure 26  
RL = 50 Ω, CL = 5 pF, f = 1 MHz;  
see Figure 25  
RL = 1 kΩ, 6 V p-p, f = 20 Hz to 20 kHz;  
see Figure 28  
Channel-to-Channel Crosstalk  
Total Harmonic Distortion + Noise  
−3 dB Bandwidth  
ADG5408-EP  
ADG5409-EP  
RL = 50 Ω, CL = 5 pF; see Figure 29  
35  
74  
−1.8  
MHz typ  
MHz typ  
dB typ  
Insertion Loss  
RL = 50 Ω, CL = 5 pF, f = 1 MHz;  
see Figure 29  
CS (Off)  
22  
pF typ  
VS = 6 V, f = 1 MHz  
CD (Off)  
ADG5408-EP  
ADG5409-EP  
CD (On), CS (On)  
ADG5408-EP  
ADG5409-EP  
POWER REQUIREMENTS  
IDD  
119  
59  
pF typ  
pF typ  
VS = 6 V, f = 1 MHz  
VS = 6 V, f = 1 MHz  
146  
86  
pF typ  
pF typ  
VS = 6 V, f = 1 MHz  
VS = 6 V, f = 1 MHz  
VDD = 13.2 V  
40  
50  
μA typ  
μA max  
Digital inputs = 0 V or VDD  
75  
VDD  
9/40  
V min/V max GND = 0 V, VSS = 0 V  
1 Guaranteed by design; not subject to production test.  
36 V SINGLE SUPPLY  
VDD = 36 V 10%, VSS = 0 V, GND = 0 V, unless otherwise noted.  
Table 4.  
Parameter  
25°C −40°C to +85°C −55°C to +125°C Unit  
Test Conditions/Comments  
ANALOG SWITCH  
Analog Signal Range  
On Resistance, RON  
0 V to VDD  
23  
V
14.5  
Ω typ  
VS = 0 V to 30 V, IS = −10 mA; see  
Figure 24  
VDD = 32.4 V, VSS = 0 V  
16  
0.3  
19  
Ω max  
Ω typ  
On-Resistance Match Between  
Channels, ∆RON  
VS = 0 V to 30 V, IS = −10 mA  
0.8  
3.5  
4.3  
1.3  
5.5  
1.4  
6.5  
Ω max  
Ω typ  
Ω max  
On-Resistance Flatness, RFLAT (ON)  
VS = 0 V to 30 V, IS = −10 mA  
Rev. 0 | Page 6 of 18  
 
Enhanced Product  
ADG5408-EP/ADG5409-EP  
Parameter  
25°C −40°C to +85°C −55°C to +125°C Unit  
Test Conditions/Comments  
LEAKAGE CURRENTS  
Source Off Leakage, IS (Off)  
VDD =39.6 V, VSS = 0 V  
VS = 1 V/30 V, VD = 30 V/1 V; see  
Figure 27  
0.1  
nA typ  
0.25  
0.15  
1
7
nA max  
nA typ  
Drain Off Leakage, ID (Off)  
VS = 1 V/30 V, VD = 30 V/1 V; see  
Figure 27  
0.4  
0.15  
0.4  
4
4
30  
30  
nA max  
nA typ  
nA max  
Channel On Leakage, ID (On), IS (On)  
VS = VD = 1 V/30 V; see Figure 23  
DIGITAL INPUTS  
Input High Voltage, VINH  
Input Low Voltage, VINL  
Input Current, IINL or IINH  
2.0  
0.8  
V min  
V max  
μA typ  
μA max  
pF typ  
0.002  
3
VIN = VGND or VDD  
0.1  
Digital Input Capacitance, CIN  
DYNAMIC CHARACTERISTICS1  
Transition Time, tTRANSITION  
187  
242  
160  
195  
147  
184  
ns typ  
ns max  
ns typ  
ns max  
ns typ  
ns max  
ns typ  
ns min  
pC typ  
RL = 300 Ω, CL = 35 pF  
VS = 18 V; see Figure 30  
RL = 300 Ω, CL = 35 pF  
VS = 18 V; see Figure 32  
RL = 300 Ω, CL = 35 pF  
VS = 18 V; see Figure 32  
RL = 300 Ω, CL = 35 pF  
VS1 = VS2 = 18 V; see Figure 31  
257  
219  
184  
281  
237  
190  
14  
tON (EN)  
tOFF (EN)  
Break-Before-Make Time Delay, tD 53  
Charge Injection, QINJ  
150  
VS = 18 V, RS = 0 Ω, CL = 1 nF;  
see Figure 33  
Off Isolation  
−60  
−60  
0.4  
dB typ  
dB typ  
% typ  
RL = 50 Ω, CL = 5 pF, f = 1 MHz;  
see Figure 26  
RL = 50 Ω, CL = 5 pF, f = 1 MHz;  
see Figure 25  
RL = 1 kΩ, 18 V p-p, f = 20 Hz to 20 kHz;  
see Figure 28  
Channel-to-Channel Crosstalk  
Total Harmonic Distortion + Noise  
−3 dB Bandwidth  
ADG5408-EP  
ADG5409-EP  
RL = 50 Ω, CL = 5 pF; see Figure 29  
45  
76  
−1  
MHz typ  
MHz typ  
dB typ  
Insertion Loss  
RL = 50 Ω, CL = 5 pF, f = 1 MHz;  
see Figure 29  
CS (Off)  
18  
pF typ  
VS = 18 V, f = 1 MHz  
CD (Off)  
ADG5408-EP  
ADG5409-EP  
CD (On), CS (On)  
ADG5408-EP  
ADG5409-EP  
POWER REQUIREMENTS  
IDD  
120  
60  
pF typ  
pF typ  
VS = 18 V, f = 1 MHz  
VS = 18 V, f = 1 MHz  
137  
80  
pF typ  
pF typ  
VS = 18 V, f = 1 MHz  
VS = 18 V, f = 1 MHz  
VDD = 39.6 V  
80  
μA typ  
Digital inputs = 0 V or VDD  
100  
155  
μA max  
VDD  
9/40  
V min/V max GND = 0 V, VSS = 0 V  
1 Guaranteed by design; not subject to production test.  
Rev. 0 | Page 7 of 18  
ADG5408-EP/ADG5409-EP  
Enhanced Product  
CONTINUOUS CURRENT PER CHANNEL, Sx OR D  
Table 5. ADG5408-EP  
Parameter  
25°C  
85°C  
125°C  
Unit  
CONTINUOUS CURRENT, Sx OR D (θJA = 30.4°C/W)  
VDD = +15 V, VSS = −15 V  
VDD = +20 V, VSS = −20 V  
VDD = 12 V, VSS = 0 V  
207  
218  
168  
214  
113  
117  
99  
60  
61  
57  
61  
mA maximum  
mA maximum  
mA maximum  
mA maximum  
VDD = 36 V, VSS = 0 V  
116  
Table 6. ADG5409-EP  
Parameter  
25°C  
85°C  
125°C  
Unit  
CONTINUOUS CURRENT, Sx OR D (θJA = 30.4°C/W)  
VDD = +15 V, VSS = −15 V  
VDD = +20 V, VSS = −20 V  
VDD = 12 V, VSS = 0 V  
156  
165  
126  
161  
95  
98  
81  
97  
55  
56  
50  
56  
mA maximum  
mA maximum  
mA maximum  
mA maximum  
VDD = 36 V, VSS = 0 V  
Rev. 0 | Page 8 of 18  
 
 
Enhanced Product  
ADG5408-EP/ADG5409-EP  
ABSOLUTE MAXIMUM RATINGS  
TA = 25°C, unless otherwise noted.  
Stresses at or above those listed under Absolute Maximum  
Ratings may cause permanent damage to the product. This is a  
stress rating only; functional operation of the product at these  
or any other conditions above those indicated in the operational  
section of this specification is not implied. Operation beyond  
the maximum operating conditions for extended periods may  
affect product reliability.  
Table 7.  
Parameter  
Rating  
VDD to VSS  
48 V  
VDD to GND  
VSS to GND  
Analog Inputs1  
−0.3 V to +48 V  
+0.3 V to −48 V  
VSS − 0.3 V to VDD + 0.3 V or  
Only one absolute maximum rating can be applied at any  
one time.  
30 mA, whichever occurs first  
VSS − 0.3 V to VDD + 0.3 V or  
Digital Inputs1  
30 mA, whichever occurs first  
ESD CAUTION  
Peak Current, Sx or D Pins  
ADG5408-EP  
435 mA (pulsed at 1 ms, 10%  
duty cycle maximum)  
ADG5409-EP  
300 mA (pulsed at 1 ms, 10%  
duty cycle maximum)  
Continuous Current, Sx or D2  
Temperature Range  
Operating  
Storage  
Junction Temperature  
Thermal Impedance, θJA  
Data + 15%  
−55°C to +125°C  
−65°C to +150°C  
150°C  
16-Lead LFCSP (4-Layer  
Board)  
30.4°C/W  
Reflow Soldering Peak  
Temperature, Pb-Free  
As per JEDEC J-STD-020  
1 Overvoltages at the Ax, EN, Sx, and D pins are clamped by internal diodes.  
Limit current to the maximum ratings given.  
2 See Table 5.  
Rev. 0 | Page 9 of 18  
 
 
ADG5408-EP/ADG5409-EP  
Enhanced Product  
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS  
V
1
2
3
4
12 GND  
SS  
ADG5408-EP  
V
11  
10 S5  
S6  
S1  
S2  
S3  
DD  
TOP VIEW  
(Not to Scale)  
9
NOTES  
1. THE EXPOSED PAD IS  
CONNECTED INTERNALLY. FOR  
INCREASED RELIABILITY OF THE  
SOLDER JOINTS AND MAXIMUM  
THERMAL CAPABILITY, IT IS  
RECOMMENDED THAT THE PAD BE  
SOLDERED TO THE SUBSTRATE, V  
.
SS  
Figure 2. ADG5408-EP Pin Configuration  
Table 8. ADG5408-EP Pin Function Descriptions  
Pin No. Mnemonic  
Description  
15  
16  
A0  
EN  
Logic Control Input.  
Active High Digital Input. When low, the device is disabled and all switches are off. When high, Ax logic inputs  
determine on switches.  
1
2
3
4
5
6
7
8
VSS  
S1  
S2  
S3  
S4  
D
S8  
S7  
S6  
S5  
VDD  
GND  
A2  
A1  
Most Negative Power Supply Potential. In single-supply applications, this pin can be connected to ground.  
Source Terminal 1. This pin can be an input or an output.  
Source Terminal 2. This pin can be an input or an output.  
Source Terminal 3. This pin can be an input or an output.  
Source Terminal 4. This pin can be an input or an output.  
Drain Terminal. This pin can be an input or an output.  
Source Terminal 8. This pin can be an input or an output.  
Source Terminal 7. This pin can be an input or an output.  
Source Terminal 6. This pin can be an input or an output.  
Source Terminal 5. This pin can be an input or an output.  
Most Positive Power Supply Potential.  
9
10  
11  
12  
13  
14  
EP  
Ground (0 V) Reference.  
Logic Control Input.  
Logic Control Input.  
Exposed Pad  
The exposed pad is connected internally. For increased reliability of the solder joints and maximum thermal  
capability, it is recommended that the pad be soldered to the substrate, VSS.  
Table 9. ADG5408-EP Truth Table  
A2  
X
0
0
0
0
1
1
1
A1  
X
0
0
1
1
0
0
1
A0  
X
0
1
0
1
0
1
0
EN  
0
1
1
1
1
1
1
1
On Switch  
None  
1
2
3
4
5
6
7
8
1
1
1
1
Rev. 0 | Page 10 of 18  
 
Enhanced Product  
ADG5408-EP/ADG5409-EP  
V
1
2
3
4
12 V  
SS  
DD  
S1B  
S2B  
S3B  
ADG5409-EP  
11  
10  
9
S1A  
S2A  
S3A  
TOP VIEW  
(Not to Scale)  
NOTES  
1. THE EXPOSED PAD IS  
CONNECTED INTERNALLY. FOR  
INCREASED RELIABILITY OF THE  
SOLDER JOINTS AND MAXIMUM  
THERMAL CAPABILITY, IT IS  
RECOMMENDED THAT THE PAD BE  
SOLDERED TO THE SUBSTRATE, V  
.
SS  
Figure 3. ADG5409-EP Pin Configuration  
Table 10. ADG5409-EP Pin Function Descriptions  
Pin No.  
Mnemonic  
Description  
15  
16  
A0  
EN  
Logic Control Input.  
Active High Digital Input. When low, the device is disabled and all switches are off. When high, Ax logic  
inputs determine on switches.  
1
2
3
4
5
6
7
8
VSS  
Most Negative Power Supply Potential. In single-supply applications, this pin can be connected to ground.  
Source Terminal 1A. This pin can be an input or an output.  
Source Terminal 2A. This pin can be an input or an output.  
Source Terminal 3A. This pin can be an input or an output.  
Source Terminal 4A. This pin can be an input or an output.  
Drain Terminal A. This pin can be an input or an output.  
Drain Terminal B. This pin can be an input or an output.  
Source Terminal 4B. This pin can be an input or an output.  
Source Terminal 3B. This pin can be an input or an output.  
Source Terminal 2B. This pin can be an input or an output.  
Source Terminal 1B. This pin can be an input or an output.  
Most Positive Power Supply Potential.  
S1A  
S2A  
S3A  
S4A  
DA  
DB  
S4B  
S3B  
S2B  
S1B  
VDD  
GND  
A1  
Exposed Pad  
9
10  
11  
12  
13  
14  
EP  
Ground (0 V) Reference.  
Logic Control Input.  
The exposed pad is connected internally. For increased reliability of the solder joints and maximum thermal  
capability, it is recommended that the pad be soldered to the substrate, VSS.  
Table 11. ADG5409-EP Truth Table  
A1  
A0  
EN  
0
On Switch Pair  
X
X
None  
0
0
1
1
0
1
0
1
1
1
1
1
1
2
3
4
Rev. 0 | Page 11 of 18  
ADG5408-EP/ADG5409-EP  
Enhanced Product  
TYPICAL PERFORMANCE CHARACTERISTICS  
16  
14  
12  
10  
8
25  
T
= 25°C  
T
= 25°C  
A
A
V
V
= +10V  
= –10V  
V
V
= +9V  
= –9V  
DD  
SS  
DD  
SS  
20  
15  
10  
5
V
V
= +11V  
= –11V  
DD  
SS  
V
V
= 32.4V  
= 0V  
DD  
SS  
V
V
= 39.6V  
= 0V  
V
V
= 36V  
= 0V  
DD  
SS  
DD  
SS  
V
V
= +13.5V  
= –13.5V  
6
DD  
SS  
V
= +15V  
= –15V  
DD  
SS  
V
V
V
= +16.5V  
= –16.5V  
DD  
SS  
4
2
0
0
–18  
–14  
–10  
–6  
–2  
2
6
10  
14  
18  
0
5
10  
15  
20  
25  
30  
35  
40  
45  
V , V (V)  
V , V (V)  
S
D
S
D
Figure 7. RON as a Function of VS, VD (Single Supply)  
Figure 4. RON as a Function of VS, VD (Dual Supply)  
25  
20  
15  
10  
5
16  
14  
12  
10  
8
T
= 25°C  
A
V
V
= +18V  
= –18V  
DD  
SS  
T
= +125°C  
= +85°C  
A
T
A
V
V
= +22V  
= –22V  
V
V
= +20V  
= –20V  
DD  
SS  
DD  
T
= +25°C  
A
SS  
6
T
T
= –40°C  
= –55°C  
A
A
4
2
V
V
= +15V  
= –15V  
DD  
SS  
0
0
–15  
–10  
–5  
0
5
10  
15  
–25 –20 –15 –10  
–5  
0
5
10  
15  
20  
25  
V , V (V)  
V , V (V)  
S
D
S
D
Figure 5. RON as a Function of VS, VD (Dual Supply)  
Figure 8. RON as a Function of VS (VD) for Different Temperatures,  
15 V Dual Supply  
20  
–35  
–30  
–25  
–20  
–15  
–10  
–5  
T
= 25°C  
V
V
= +20V  
= –20V  
A
DD  
SS  
V
V
= 10V  
= 0V  
DD  
SS  
18  
16  
14  
12  
10  
8
V
V
= 10.8V  
= 0V  
DD  
SS  
V
V
= 9V  
= 0V  
DD  
SS  
T
= +125°C  
= +85°C  
A
T
A
A
T
T
= +25°C  
V
V
= 11V  
= 0V  
DD  
SS  
V
V
= 12V  
= 0V  
DD  
SS  
= –40°C  
= –55°C  
A
V
V
= 13.2V  
= 0V  
DD  
SS  
6
T
A
4
2
0
–20  
0
–15  
–10  
–5  
0
5
10  
15  
20  
0
–2  
–4  
–6  
–8  
V , V (V)  
–10  
–12  
–14  
S
D
V , V (V)  
S
D
Figure 6. RON as a Function of VS, VD (Single Supply)  
Figure 9. RON as a Function of VS (VD) for Different Temperatures,  
20 V Dual Supply  
Rev. 0 | Page 12 of 18  
 
Enhanced Product  
ADG5408-EP/ADG5409-EP  
1
0
40  
35  
30  
25  
20  
15  
10  
5
V
V
V
= +20V  
= –20V  
BIAS  
I
, I (ON) + +  
S
DD  
SS  
D
I
(OFF) + –  
S
= +15V/–15V  
T
= +125°C  
= +85°C  
A
I
(OFF) – +  
D
T
A
A
I
(OFF) – +  
S
T
= +25°C  
–1  
–2  
–3  
I
, I (ON) – –  
S
D
T
T
= –40°C  
= –55°C  
A
I
(OFF) + –  
A
D
V
V
= 12V  
= 0V  
DD  
SS  
0
0
25  
50  
75  
100  
125  
0
2
4
6
8
10  
12  
TEMPERATURE (°C)  
V , V (V)  
S
D
Figure 13. Leakage Currents vs. Temperature, 20 V Dual Supply  
Figure 10. RON as a Function of VS (VD) for Different Temperatures,  
12 V Single Supply  
25  
0.5  
V
V
V
= 12V  
= 0V  
BIAS  
V
V
= 36V  
= 0V  
I
, I (ON) + +  
S
DD  
SS  
DD  
SS  
D
= 1V/10V  
I
(OFF) + –  
S
20  
15  
10  
5
0
–0.5  
–1.0  
–1.5  
–2.0  
I
(OFF) – +  
D
T
= +125°C  
= +85°C  
A
I
(OFF) – +  
S
T
A
A
I
, I (ON) – –  
S
D
T
= +25°C  
I
(OFF) + –  
D
T
T
= –40°C  
= –55°C  
A
A
0
0
25  
50  
75  
100  
125  
0
4
8
12  
16  
20  
24  
28  
32  
36  
TEMPERATURE (°C)  
V , V (V)  
S
D
Figure 14. Leakage Currents vs. Temperature, 12 V Single Supply  
Figure 11. RON as a Function of VD (VS) for Different Temperatures,  
36 V Single Supply  
1
0.5  
V
V
V
= +15V  
= –15V  
BIAS  
V
V
V
= +36V  
= 0V  
BIAS  
I
, I (ON) + +  
S
DD  
SS  
DD  
SS  
D
I
, I (ON) + +  
S
D
I (OFF) + –  
S
= +10V/–10V  
I
(OFF) + –  
= 1V/30V  
S
0
–0.5  
–1.0  
–1.5  
–2.0  
0
–1  
–2  
–3  
I
(OFF) – +  
D
I
(OFF) – +  
I
(OFF) – +  
D
S
I
(OFF) – +  
S
I
, I (ON) – –  
S
D
I
, I (ON) – –  
S
D
I
(OFF) + –  
D
I
(OFF) + –  
D
0
25  
50  
75  
100  
125  
0
25  
50  
75  
100  
125  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
Figure 15. Leakage Currents vs. Temperature, 36 V Single Supply  
Figure 12. Leakage Currents vs. Temperature, 15 V Dual Supply  
Rev. 0 | Page 13 of 18  
ADG5408-EP/ADG5409-EP  
Enhanced Product  
0
0
–10  
–20  
–30  
–40  
–50  
–60  
–70  
–80  
–90  
–100  
T
V
V
= 25°C  
= +15V  
T
= 25°C  
= +15V  
SS  
A
A
DD  
V
V
DD  
–10  
–20  
–30  
–40  
–50  
–60  
–70  
–80  
–90  
–100  
= –15V  
= –15V  
SS  
NO DECOUPLING  
CAPACITORS  
DECOUPLING  
CAPACITORS  
1k  
10k  
100k  
1M  
10M  
100M  
1G  
1G  
40  
1k  
10k  
100k  
1M  
10M  
FREQUENCY (Hz)  
FREQUENCY (Hz)  
Figure 16. Off Isolation vs. Frequency, 15 V Dual Supply  
Figure 19. ACPSRR vs. Frequency, 15 V Dual Supply  
0.12  
0.10  
0.08  
0.06  
0.04  
0.02  
0
0
–10  
–20  
–30  
–40  
–50  
–60  
–70  
–80  
–90  
–100  
T
V
V
= 25°C  
A
= +15V  
= –15V  
DD  
SS  
V
= 12V, V = 0V, V = 6V p-p  
SS S  
DD  
LOAD = 1k  
T
= 25°C  
A
V
V
= 36V, V = 0V, V = 18V p-p  
SS S  
DD  
= 15V, V = 15V, V = 15V p-p  
DD  
SS  
S
V
= 20V, V = 20V, V = 20V p-p  
SS S  
DD  
10k  
100k  
1M  
10M  
100M  
0
5
10  
FREQUENCY (kHz)  
15  
20  
FREQUENCY (Hz)  
Figure 17. Crosstalk vs. Frequency, 15 V Dual Supply  
Figure 20. THD + N vs. Frequency  
300  
250  
200  
150  
100  
50  
0
–0.5  
–1.0  
–1.5  
–2.0  
–2.5  
–3.0  
–3.5  
–4.0  
–4.5  
–5.0  
T
V
V
= 25°C  
= +15V  
T
= 25°C  
A
A
V
V
= +20V  
= –20V  
DD  
SS  
DD  
SS  
= –15V  
ADG5409 -EP  
ADG5408-EP  
V
V
= +36V  
= 0V  
DD  
SS  
V
V
= +12V  
= 0V  
DD  
SS  
V
V
= +15V  
= –15V  
DD  
SS  
0
1k  
10k  
100k  
1M  
10M  
100M  
1G  
20  
10  
0
10  
20  
30  
FREQUENCY (Hz)  
V
(V)  
S
Figure 21. Bandwidth  
Figure 18. Charge Injection vs. Source Voltage  
Rev. 0 | Page 14 of 18  
Enhanced Product  
ADG5408-EP/ADG5409-EP  
380  
330  
V
= +12V, V = 0V  
SS  
DD  
280  
230  
180  
130  
V
= +36V, V = 0V  
SS  
DD  
V
= +15V, V = –15V  
SS  
DD  
V
= +20V, V = –20V  
SS  
DD  
5
–55  
–35  
–15  
25  
45  
65  
85  
105  
125  
TEMPERATURE (°C)  
Figure 22. tTRANSITION Times vs. Temperature  
Rev. 0 | Page 15 of 18  
ADG5408-EP/ADG5409-EP  
TEST CIRCUITS  
Enhanced Product  
I
(ON)  
A
D
S1  
D
NC  
I
(OFF)  
A
I
(OFF)  
A
S
D
S1  
S8  
S2  
D
S8  
A
V
V
D
V
V
D
S
D
NC = NO CONNECT  
Figure 23. On Leakage  
Figure 27. Off Leakage  
V
V
DD  
SS  
0.1µF  
0.1µF  
AUDIO PRECISION  
V
V
DD  
SS  
R
S
Sx  
V
IN  
V
S
V p-p  
D
S
D
V
OUT  
V
IN  
R
L
10k  
I
DS  
GND  
R
= V/I  
DS  
V
ON  
S
Figure 28. THD + Noise Figure  
Figure 24. On Resistance  
V
V
DD  
SS  
V
V
SS  
DD  
0.1µF  
0.1µF  
0.1µF  
0.1µF  
NETWORK  
ANALYZER  
V
NETWORK  
ANALYZER  
V
DD  
SS  
V
V
DD  
SS  
S1  
V
OUT  
R
L
50  
D
Sx  
50  
S2  
R
L
V
S
50ꢀ  
D
V
OUT  
V
S
R
50ꢀ  
L
GND  
V
GND  
V
WITH SWITCH  
OUT  
OUT  
INSERTION LOSS = 20 log  
CHANNEL-TO-CHANNEL CROSSTALK = 20 log  
V
WITHOUT SWITCH  
V
OUT  
S
Figure 29. Bandwidth  
Figure 25. Channel-to-Channel Crosstalk  
V
V
DD  
SS  
0.1µF  
0.1µF  
NETWORK  
ANALYZER  
V
V
DD  
SS  
50  
Sx  
50ꢀ  
V
S
D
V
OUT  
R
L
50ꢀ  
GND  
V
V
OUT  
OFF ISOLATION = 20 log  
S
Figure 26. Off Isolation  
Rev. 0 | Page 16 of 18  
 
 
 
 
 
 
 
 
Enhanced Product  
ADG5408-EP/ADG5409-EP  
V
V
V
DD  
DD  
SS  
3V  
tr < 20ns  
tf < 20ns  
V
SS  
ADDRESS  
DRIVE (V  
50%  
50%  
A0  
A1  
A2  
)
IN  
S1  
V
S1  
0V  
V
IN  
50  
S2 TO S7  
tTRANSITION  
tTRANSITION  
S8  
V
S8  
90%  
ADG5408-EP*  
OUTPUT  
D
2.4V  
EN  
OUTPUT  
300ꢀ  
GND  
35pF  
90%  
*SIMILAR CONNECTION FOR ADG5409-EP.  
Figure 30. Address to Output Switching Times, tTRANSITION  
V
V
V
DD  
DD  
SS  
SS  
3V  
V
ADDRESS  
A0  
A1  
A2  
DRIVE (V  
)
IN  
S1  
V
S
V
IN  
50ꢀ  
0V  
S2 TO S7  
S8  
80%  
80%  
ADG5408-EP*  
OUTPUT  
OUTPUT  
D
2.4V  
EN  
300ꢀ  
GND  
35pF  
tD  
*SIMILAR CONNECTION FOR ADG5409-EP.  
Figure 31. Break-Before-Make Delay, tD  
V
V
V
V
DD  
DD  
SS  
SS  
3V  
A0  
A1  
A2  
ENABLE  
DRIVE (V  
50%  
50%  
)
S1  
S2 TO S8  
V
IN  
S
0V  
ADG5408-EP*  
tON (EN)  
tOFF (EN)  
OUTPUT  
0.9V  
0.9V  
O
D
EN  
O
OUTPUT  
V
35pF  
IN  
50ꢀ  
300ꢀ  
GND  
*SIMILAR CONNECTION FOR ADG5409-EP.  
Figure 32. Enable Delay, tON (EN), tOFF (EN)  
V
V
V
V
DD  
DD  
SS  
SS  
3V  
A0  
A1  
A2  
V
V
IN  
ADG5408-EP*  
R
S
Sx  
EN  
D
OUT  
V
V  
OUT  
OUT  
C
1nF  
L
V
Q
= C × V  
L OUT  
S
INJ  
GND  
V
IN  
*SIMILAR CONNECTION FOR ADG5409-EP.  
Figure 33. Charge Injection  
Rev. 0 | Page 17 of 18  
 
 
 
 
ADG5408-EP/ADG5409-EP  
OUTLINE DIMENSIONS  
Enhanced Product  
4.10  
4.00 SQ  
3.90  
0.35  
0.30  
0.25  
PIN 1  
INDICATOR  
PIN 1  
INDICATOR  
13  
16  
0.65  
BSC  
12  
1
EXPOSED  
PAD  
2.70  
2.60 SQ  
2.50  
4
9
8
5
0.45  
0.40  
0.35  
0.20 MIN  
TOP VIEW  
BOTTOM VIEW  
0.80  
0.75  
0.70  
FOR PROPER CONNECTION OF  
THE EXPOSED PAD, REFER TO  
THE PIN CONFIGURATION AND  
FUNCTION DESCRIPTIONS  
0.05 MAX  
0.02 NOM  
COPLANARITY  
0.08  
SECTION OF THIS DATA SHEET.  
SEATING  
PLANE  
0.20 REF  
COMPLIANT TO JEDEC STANDARDS MO-220-WGGC.  
Figure 34. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]  
4 mm × 4 mm Body, Very Very Thin Quad  
(CP-16-17)  
Dimensions shown in millimeters  
ORDERING GUIDE  
Model1  
Temperature Range  
−55°C to +125°C  
−55°C to +125°C  
−55°C to +125°C  
−55°C to +125°C  
Package Description  
Package Option  
ADG5408TCPZ-EP-RL7  
ADG5408TCPZ-EP  
ADG5409TCPZ-EP-RL7  
ADG5409TCPZ-EP  
16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]  
CP-16-17  
CP-16-17  
CP-16-17  
CP-16-17  
16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]  
16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]  
16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]  
1 Z = RoHS Compliant Part.  
©2015 Analog Devices, Inc. All rights reserved. Trademarks and  
registered trademarks are the property of their respective owners.  
D13397-0-9/15(0)  
Rev. 0 | Page 18 of 18  
 
 

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