ADG749BKS-REEL [ADI]
IC 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, PDSO6, PLASTIC, MO-203AB, SC-70, 6 PIN, Multiplexer or Switch;型号: | ADG749BKS-REEL |
厂家: | ADI |
描述: | IC 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, PDSO6, PLASTIC, MO-203AB, SC-70, 6 PIN, Multiplexer or Switch 开关 光电二极管 |
文件: | 总8页 (文件大小:126K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
CMOS Low Voltage
2.5 ꢀ SPDT Switch In SC70 Package
a
ADG749
FUNCTIONAL BLOCK DIAGRAM
FEATURES
1.8 V to 5.5 V Single Supply
5 ꢀ (Max) On Resistance
0.75 ꢀ (Typ) On-Resistance Flatness
–3 dB Bandwidth >200 MHz
Rail-to-Rail Operation
6-Lead SC70 Package
Fast Switching Times
tON 20 ns
ADG749
S2
D
S1
IN
tOFF 6 ns
SWITCHES SHOWN FOR
A LOGIC "1" INPUT
Typical Power Consumption (<0.01 ꢁW)
TTL/CMOS-Compatible
APPLICATIONS
Battery-Powered Systems
Communication Systems
Sample Hold Systems
Audio Signal Routing
Video Switching
PRODUCT HIGHLIGHTS
1. 1.8 V to 5.5 V Single Supply Operation. The ADG749
offers high performance, including low on resistance and
fast switching times, and is fully specified and guaranteed
with 3 V and 5 V supply rails.
Mechanical Reed Relay Replacement
GENERAL DESCRIPTION
2. Very Low RON (5 Ω max at 5 V, 10 Ω max at 3 V). At 1.8 V
The ADG749 is a monolithic CMOS SPDT switch. This switch
is designed on a submicron process that provides low power
dissipation yet gives high switching speed, low on resistance and
low leakage currents.
operation, RON is typically 40 Ω over the temperature range.
3. On-Resistance Flatness (RFLAT(ON)) (0.75 Ω typ).
4. –3 dB Bandwidth >200 MHz.
The ADG749 can operate from a single supply range of 1.8 V to
5.5 V, making it ideal for use in battery-powered instruments and
with the new generation of DACs and ADCs from Analog Devices.
5. Low Power Dissipation. CMOS construction ensures low
power dissipation.
6. Fast tON/tOFF.
Each switch of the ADG749 conducts equally well in both
directions when on. The ADG749 exhibits break-before-make
switching action.
7. Tiny 6-lead SC70 package.
Because of the advanced submicron process, –3 dB bandwidths
of greater than 200 MHz can be achieved.
The ADG749 is available in a 6-lead SC70 package.
REV. 0
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781/329-4700
Fax: 781/326-8703
World Wide Web Site: http://www.analog.com
© Analog Devices, Inc., 2000
(VDD = 5 V ꢃ 10%, GND = 0 V. All specifications –40ꢂC to +85ꢂC, unless otherwise
noted.)
B Version
ADG749–SPECIFICATIONS1
–40ꢂC to
+85ꢂC
Parameter
25ꢂC
Unit
Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range
0 V to VDD
6
V
On Resistance (RON
)
2 .5
5
Ω typ
Ω max
VS = 0 V to VDD, IS = –10 mA
Test Circuit 1
On Resistance Match Between
Channels (∆RON
)
0.1
0.8
Ω typ
Ω max
Ω typ
Ω max
VS = 0 V to VDD, IS = –10 mA
VS = 0 V to VDD, IS = –10 mA
On-Resistance Flatness (RFLAT(ON)
)
0.75
1.2
LEAKAGE CURRENTS2
Source OFF Leakage IS (OFF)
VDD = 5.5 V
VS = 4.5 V/1 V, VD = 1 V/4.5 V
Test Circuit 2
VS = VD = 1 V, or VS = VD = 4.5 V
Test Circuit 3
0.01
0.25
0.01
0.25
nA typ
nA max
nA typ
nA max
0.35
0.35
Channel ON Leakage ID, IS (ON)
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current
2.4
0.8
V min
V max
IINL or IINH
0.005
µA typ
µA max
VIN = VINL or VINH
0.1
DYNAMIC CHARACTERISTICS2
tON
14
3
ns typ
ns max
ns typ
ns max
ns typ
ns min
dB typ
dB typ
RL = 300 Ω, CL = 35 pF
VS = 3 V, Test Circuit 4
RL = 300 Ω, CL = 35 pF
VS = 3 V, Test Circuit 4
RL = 300 Ω, CL = 35 pF,
20
6
tOFF
Break-Before-Make Time Delay, tD
Off Isolation
8
1
VS1 = VS2 = 3 V, Test Circuit 5
–67
–87
RL = 50 Ω, CL = 5 pF, f = 10 MHz
RL = 50 Ω, CL = 5 pF, f = 1 MHz,
Test Circuit 6
Channel-to-Channel Crosstalk
–62
–82
dB typ
dB typ
RL = 50 Ω, CL = 5 pF, f = 10 MHz
RL = 50 Ω, CL = 5 pF, f = 1 MHz,
Test Circuit 7
Bandwidth –3 dB
CS (OFF)
200
7
MHz typ
pF typ
RL = 50 Ω, CL = 5 pF, Test Circuit 8
CD, CS (ON)
27
pF typ
POWER REQUIREMENTS
VDD = 5.5 V
Digital Inputs = 0 V or 5 V
IDD
0.001
µA typ
µA max
1.0
NOTES
1Temperature ranges are as follows: B Version, –40°C to +85°C.
2Guaranteed by design, not subject to production test.
Specifications subject to change without notice.
–2–
REV. 0
ADG749
SPECIFICATIONS1(VDD = 3 V ꢃ 10%, GND = 0 V. All specifications –40ꢂC to +85ꢂC, unless otherwise noted.)
B Version
–40ꢂC to
+85ꢂC
Parameter
25ꢂC
Unit
Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range
0 V to VDD
V
On Resistance (RON
)
6
7
10
Ω typ
VS = 0 V to VDD, IS = –10 mA,
Test Circuit 1
Ω max
On Resistance Match Between
Channels (∆RON
)
0.1
0.8
2.5
Ω typ
Ω max
Ω typ
VS = 0 V to VDD, IS = –10 mA
VS = 0 V to VDD, IS = –10 mA
On-Resistance Flatness (RFLAT(ON)
)
LEAKAGE CURRENTS2
VDD = 3.3 V
Source OFF Leakage IS (OFF)
0.01
0.25
0.01
0.25
nA typ
nA max
nA typ
nA max
VS = 3 V/1 V, VD = 1 V/3 V,
Test Circuit 2
VS = VD = 1 V, or VS = VD = 3 V,
Test Circuit 3
0.35
0.35
Channel ON Leakage ID, IS (ON)
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current
2.0
0.4
V min
V max
I
INL or IINH
0.005
µA typ
µA max
VIN = VINL or VINH
0.1
DYNAMIC CHARACTERISTICS2
tON
16
4
ns typ
ns max
ns typ
ns max
ns typ
ns min
dB typ
dB typ
RL = 300 Ω, CL = 35 pF
VS = 2 V, Test Circuit 4
RL = 300 Ω, CL = 35 pF
VS = 2 V, Test Circuit 4
RL = 300 Ω, CL = 35 pF
24
7
tOFF
Break-Before-Make Time Delay, tD
Off Isolation
8
1
VS1 = VS2 = 2 V, Test Circuit 5
–67
–87
RL = 50 Ω, CL = 5 pF, f = 10 MHz
RL = 50 Ω, CL = 5 pF, f = 1 MHz,
Test Circuit 6
Channel-to-Channel Crosstalk
–62
–82
dB typ
dB typ
RL = 50 Ω, CL = 5 pF, f = 10 MHz
RL = 50 Ω, CL = 5 pF, f = 1 MHz,
Test Circuit 7
Bandwidth –3 dB
CS (OFF)
200
7
MHz typ
pF typ
RL = 50 Ω, CL = 5 pF, Test Circuit 8
CD, CS (ON)
27
pF typ
POWER REQUIREMENTS
VDD = 3.3 V
Digital Inputs = 0 V or 3 V
IDD
0.001
µA typ
µA max
1.0
NOTES
1Temperature ranges are as follows: B Version, –40°C to +85°C.
2Guaranteed by design, not subject to production test.
Specifications subject to change without notice.
REV. 0
–3–
ADG749
ABSOLUTE MAXIMUM RATINGS1
TERMINOLOGY
(TA = 25°C unless otherwise noted)
VDD
GND
S
D
IN
RON
∆RON
Most Positive Power Supply Potential.
Ground (0 V) Reference.
Source Terminal. May be an input or output.
Drain Terminal. May be an input or output.
Logic Control Input.
Ohmic resistance between D and S.
On resistance match between any two channels
i.e., RON max – RON min.
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Analog, Digital Inputs2 . . . . . . . . . . –0.3 V to VDD + 0.3 V or
30 mA, Whichever Occurs First
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA
(Pulsed at 1 ms, 10% Duty Cycle max)
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
SC70 Package, Power Dissipation . . . . . . . . . . . . . . . . 315 mW
RFLAT(ON)
Flatness is defined as the difference between the
maximum and minimum value of on resistance as
measured over the specified analog signal range.
θ
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 332°C/W
θ
JC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 120°C/W
IS (OFF)
Source Leakage Current with the switch “OFF.”
Lead Temperature, Soldering
ID, IS (ON) Channel Leakage Current with the switch “ON.”
VD (VS)
CS (OFF)
CD (OFF)
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 kV
Analog Voltage on Terminals D, S.
“OFF” Switch Source Capacitance.
“OFF” Switch Drain Capacitance.
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
CD, CS (ON) “ON” Switch Capacitance.
tON
tOFF
tD
Delay between applying the digital control input
and the output switching on.
Delay between applying the digital control input
and the output switching off.
“OFF” time or “ON” time measured between the
90% points of both switches, when switching
from one address state to another.
2Overvoltages at IN, S or D will be clamped by internal diodes. Current should be
limited to the maximum ratings given.
Table I. Truth Table
Crosstalk
A measure of unwanted signal that is coupled
through from one channel to another as a result
of parasitic capacitance.
ADG749 IN
Switch S1
Switch S2
0
1
ON
OFF
OFF
ON
Off Isolation A measure of unwanted signal coupling through
an “OFF” switch.
Bandwidth
The frequency at which the output is attenuated
by –3 dBs.
PIN CONFIGURATION
6-Lead SC70
On Response The frequency response of the “ON” switch.
On Loss
The voltage drop across the “ON” switch seen on
the On Response vs. Frequency plot as how many
dBs the signal is away from 0 dB at very low
frequencies.
S2
D
IN
1
2
3
6
5
4
ADG749
TOP VIEW
(Not to Scale)
V
DD
GND
S1
ORDERING GUIDE
Model
Temperature Range
Package Description
SC70 (Plastic Surface Mount)
Package Option
Branding Information*
ADG749BKS
–40°C to +85°C
KS-6
SHB
*Brand = Brand on these packages is limited to three characters due to space constraints.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADG749 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
–4–
REV. 0
Typical Performance Characteristics–
ADG749
6.0
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
10m
V
= 5V
DD
V
= 2.7V
DD
T
= 25ꢂC
A
1m
100ꢁ
10ꢁ
1ꢁ
V
= 4.5V
DD
V
= 3.0V
DD
V
= 5.0V
DD
100n
10n
1n
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
1
10
100
1k
10k
100k
1M
10M
100M
FREQUENCY – Hz
V
OR V – DRAIN OR SOURCE VOLTAGE – V
S
D
TPC 1. On Resistance as a Function of VD (VS) Single
Supplies
TPC 4. Supply Current vs. Input Switching Frequency
6.0
–30
V
= 5V, 3V
DD
V
= 3V
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
DD
–40
–50
–60
–70
+85ꢂC
+25ꢂC
–40ꢂC
–80
–90
–100
–110
–120
–130
0
100M
10k
100k
1M
10M
0
0.5
1.0
1.5
2.0
2.5
3.0
FREQUENCY – Hz
V
OR V – DRAIN OR SOURCE VOLTAGE – V
S
D
TPC 2. On Resistance as a Function of VD (VS) for
Different Temperatures VDD = 3 V
TPC 5. Off Isolation vs. Frequency
6.0
–30
–40
V
= 5V, 3V
DD
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
V
= 5V
DD
–50
–60
–70
+85ꢂC
–80
+25ꢂC
–40ꢂC
–90
–100
–110
–120
–130
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0 4.5
5.0
10k
100k
1M
10M
100M 0
V
OR V – DRAIN OR SOURCE VOLTAGE – V
S
FREQUENCY – Hz
D
TPC 3. On Resistance as a Function of VD (VS) for
Different Temperatures VDD = 5 V
TPC 6. Crosstalk vs. Frequency
REV. 0
–5–
ADG749
0
V
= 5V
DD
–2
–4
–6
10k
100k
1M
10M
100M
FREQUENCY – Hz
TPC 7. On Response vs. Frequency
Test Circuits
I
DS
V1
I
(OFF)
A
I
(OFF)
A
I
(ON)
A
S
D
D
S
D
S
D
S
D
V
S
V
V
V
S
V
S
D
D
R
= V1/I
DS
ON
Test Circuit 1. On Resistance
Test Circuit 2. Off Leakage
Test Circuit 3. On Leakage
V
DD
0.1ꢁF
V
IN
50%
50%
90%
V
DD
90%
S
D
V
OUT
V
OUT
IN
R
L
C
L
V
S
300ꢀ
35pF
GND
tOFF
tON
Test Circuit 4. Switching Times
V
V
DD
0.1ꢁF
V
IN
50%
50%
50%
DD
D
0V
S1
V
S1
D2
V
OUT
50%
S2
IN
C
35pF
R
300ꢀ
V
OUT
L2
L2
V
S2
0V
GND
tD
tD
V
IN
Test Circuit 5. Break-Before-Make Time Delay, tD
V
DD
0.1ꢁF
V
V
V
DD
DD
0.1ꢁF
0.1ꢁF
V
DD
S1
S2
V
V
DD
DD
OUT
D
S1
S1
S2
R
50ꢀ
D
L
D
V
OUT
V
OUT
S2
R
L
R
L
50ꢀ
50ꢀ
IN
V
S
IN
IN
GND
V
V
IN
IN
V
V
S
S
GND
GND
CHANNEL-TO-CHANNEL
CROSSTALK = 20 ꢄ LOG |V /V
|
S
OUT
Test Circuit 6. Off Isolation
Test Circuit 8. Bandwidth
REV. 0
Test Circuit 7. Channel-to-Channel
Crosstalk
–6–
ADG749
APPLICATIONS INFORMATION
The signal transfer characteristic is dependent on the switch
channel capacitance, CDS. This capacitance creates a frequency
zero in the numerator of the transfer function A(s). Because the
switch on resistance is small, this zero usually occurs at high
frequencies. The bandwidth is a function of the switch output
capacitance combined with CDS and the load capacitance. The
frequency pole corresponding to these capacitances appears in
the denominator of A(s).
The ADG749 belongs to Analog Devices’ new family of
CMOS switches. This series of general purpose switches have
improved switching times, lower on resistance, higher band-
widths, low power consumption and low leakage currents.
ADG749 Supply Voltages
Functionality of the ADG749 extends from 1.8 V to 5.5 V single
supply, which makes it ideal for battery powered instruments,
where important design parameters are power efficiency and
performance.
The dominant effect of the output capacitance, CD, causes the
pole breakpoint frequency to occur first. Therefore, in order to
maximize bandwidth a switch must have a low input and output
capacitance and low on resistance. The On Response vs. Fre-
quency plot for the ADG749 can be seen in TPC 7.
It is important to note that the supply voltage effects the input
signal range, the on resistance and the switching times of the
part. By taking a look at the typical performance characteristics
and the specifications, the effects of the power supplies can be
clearly seen.
Off Isolation
Off isolation is a measure of the input signal coupled through an
off switch to the switch output. The capacitance, CDS, couples
the input signal to the output load, when the switch is off as
shown in Figure 2.
For VDD = 1.8 V operation, RON is typically 40 Ω over the tem-
perature range.
On Response vs. Frequency
Figure 1 illustrates the parasitic components that affect the ac
performance of CMOS switches (the switch is shown surrounded
by a box). Additional external capacitances will further degrade
some performance. These capacitances affect feedthrough,
crosstalk and system bandwidth.
C
DS
D
S
V
OUT
C
D
C
V
LOAD
IN
R
LOAD
C
DS
Figure 2. Off Isolation Is Affected by External Load Resis-
tance and Capacitance
D
S
V
OUT
R
ON
C
D
C
V
LOAD
IN
The larger the value of CDS, larger values of feedthrough will be
produced. The typical performance characteristic graph of TPC
5 illustrates the drop in off isolation as a function of frequency.
From dc to roughly 200 kHz, the switch shows better than
–95 dB isolation. Up to frequencies of 10 MHz, the off isolation
remains better than –67 dB. As the frequency increases, more and
more of the input signal is coupled through to the output. Off
isolation can be maximized by choosing a switch with the small-
est CDS as possible. The values of load resistance and capacitance
affect off isolation also, as they contribute to the coefficients of the
poles and zeros in the transfer function of the switch when open.
R
LOAD
Figure 1. Switch Represented by Equivalent Parasitic
Components
The transfer function that describes the equivalent diagram of
the switch (Figure 1) is of the form (A)s shown below.
s(RON
CDS )+1
A(s) = RT
s(RT RON CT )+1
where:
RT = RLOAD/(RLOAD + RON
CT = CLOAD + CD + CDS
)
s(RLOAD CDS
)
A(s) =
s(RLOAD )(CLOAD + CD + CDS )+1
REV. 0
–7–
ADG749
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
6-Lead Plastic Surface Mount Package (SC70)
(KS-6)
0.087 (2.20)
0.071 (1.80)
6
5
2
4
3
0.053 (1.35)
0.045 (1.15)
0.094 (2.40)
0.071 (1.80)
1
PIN 1
0.026 (0.65) BSC
0.051 (1.30)
BSC
0.039 (1.00)
0.031 (0.80)
0.043 (1.10)
0.031 (0.80)
8ꢂ
0ꢂ
0.012 (0.30)
0.006 (0.15) PLANE
0.012 (0.30)
0.004 (0.10)
0.004 (0.10)
0.000 (0.00)
SEATING
0.007 (0.18)
0.004 (0.10)
–8–
REV. 0
相关型号:
ADG749BKS-REEL7
IC 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, PDSO6, PLASTIC, MO-203AB, SC-70, 6 PIN, Multiplexer or Switch
ADI
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