ADG820BRT-REEL [ADI]
IC 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, PDSO6, PLASTIC, SOT-23, 6 PIN, Multiplexer or Switch;
| 型号： | ADG820BRT-REEL |
| 厂家： | 
ADI |
| 描述： | IC 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, PDSO6, PLASTIC, SOT-23, 6 PIN, Multiplexer or Switch 复用器 开关 光电二极管 |
| 文件： | 总12页 (文件大小：191K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
0.5 ꢀ CMOS
a
1.8 V to 5.5 V 2:1 Mux/SPDT Switches
ADG819/ADG820
FEATURES
FUNCTIONAL BLOCK DIAGRAM
Low On Resistance 0.8 ꢀ Max at 125ꢁC
0.25 ꢀ Max On Resistance Flatness
1.8 V to 5.5 V Single Supply
200 mA Current Carrying Capability
Automotive Temperature Range: –40ꢁC to +125ꢁC
Rail-to-Rail Operation
ADG819/
ADG820
S2
D
S1
IN
6-Lead SOT-23 Package, 8-Lead ꢂSOIC Package, and
6-Bump MicroCSP (Micro Chip Scale Package) ADG819
Fast Switching Times
SWITCHES SHOWN
FOR A LOGIC “1” INPUT
Typical Power Consumption (<0.01 ꢂW)
TTL-/CMOS-Compatible Inputs
Pin Compatible with the ADG719 (ADG819)
APPLICATIONS
Power Routing
Battery-Powered Systems
Communication Systems
Data Acquisition Systems
Cellular Phones
Modems
PCMCIA Cards
Hard Drives
Relay Replacement
GENERAL DESCRIPTION
PRODUCT HIGHLIGHTS
The ADG819 and the ADG820 are monolithic, CMOS, SPDT
(single-pole, double-throw) switches. These switches are designed
on a submicron process that provides low power dissipation yet
gives high switching speed, low On resistance, and low leakage
currents.
1. Very low ON resistance, 0.5 Ω typical
2. 1.8 V to 5.5 V single-supply operation
3. High current carrying capability
4. Tiny 6-lead SOT-23 package, 8-lead µSOIC package,
and 2 × 3 bump 1.14 mm × 2.18 mm MicroCSP package
(ADG819 only)
Low power consumption and an operating supply range of 1.8 V
to 5.5 V make the ADG819 and ADG820 ideal for battery-pow-
ered, portable instruments.
Each switch of the ADG819 and the ADG820 conducts equally
well in both directions when on. The ADG819 exhibits break-
before-make switching action, thus preventing momentary shorting
when switching channels. The ADG820 exhibits make-before-
break action.
The ADG819 and the ADG820 are available in a 6-lead SOT-23
package and an 8-lead µSOIC package. The ADG819 is also
available in a 2 × 3 bump 1.14 mm × 2.18 mm MicroCSP
package. This chip occupies only a 1.14 mm × 2.18 mm area,
making it the ideal candidate for space-constrained applications.
REV. 0
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, norforanyinfringementsofpatentsorotherrightsofthirdpartiesthat
may result from its use. No license is granted by implication or otherwise
under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781/329-4700
Fax: 781/326-8703
www.analog.com
© Analog Devices, Inc., 2002
ADG819/ADG820–SPECIFICATIONS1
(VDD = 5 V ꢃ 10%, GND = 0 V.)
–40ꢁC to –40ꢁC to
Parameter
25ꢁC
+85ꢁC
+125ꢁC2
Unit
Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range
0 V to VDD
0.8
V
ON Resistance (RON
)
0.5
0.6
Ω typ
Ω max
VS = 0 V to VDD, IS = 100 mA;
Test Circuit 1
0.7
ON Resistance Match Between
Channels (∆RON
)
0.06
0.08
0.1
Ω typ
Ω max
Ω typ
Ω max
VS = 0 V to VDD, IS = 100 mA
VS = 0 V to VDD, IS = 100 mA
0.1
0.2
0.12
0.25
ON Resistance Flatness (RFLAT(ON)
)
0.17
LEAKAGE CURRENTS
Source OFF Leakage IS (OFF)
VDD = 5.5 V
VS = 4.5 V/1 V, VD = 1 V/4.5 V;
Test Circuit 2
VS = VD = 1 V, or VS = VD = 4.5 V;
Test Circuit 3
0.01
0.25
0.01
0.25
nA typ
nA max
nA typ
nA max
3
3
10
25
Channel ON Leakage ID, IS (ON)
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current
2.0
0.8
V min
V max
IINL or IINH
0.005
5
µA typ
µA max
pF typ
VIN = VINL or VINH
0.1
CIN, Digital Input Capacitance
DYNAMIC CHARACTERISTICS3
ADG819
tON
35
45
10
16
5
ns typ
ns max
ns typ
ns max
ns typ
ns min
RL = 50 Ω, CL = 35 pF,
VS = 3 V; Test Circuit 4
RL = 50 Ω, CL = 35 pF,
VS = 3 V; Test Circuit 4
RL = 50 Ω, CL = 35 pF,
VS1 = VS2 = 3 V; Test Circuit 5
50
18
55
21
1
tOFF
Break-Before-Make Time Delay, tBBM
ADG820
tON
10
18
26
40
15
ns typ
ns max
ns typ
ns max
ns typ
ns min
pC typ
RL = 50 Ω, CL = 35 pF,
VS = 3 V; Test Circuit 4
RL = 50 Ω, CL = 35 pF,
VS = 3 V; Test Circuit 4
RL = 50 Ω, CL = 35 pF,
VS = 0 V; Test Circuit 6
VS = 2.5 V, RS = 0 Ω, CL = 1 nF;
Test Circuit 7
20
45
22
50
1
tOFF
Make-Before-Break Time Delay, tMBB
Charge Injection
20
Off Isolation
–71
–72
dB typ
dB typ
RL = 50 Ω, CL = 5 pF, f = 100 kHz;
Test Circuit 8
Channel-to-Channel Crosstalk
RL = 50 Ω, CL = 5 pF, f = 100 kHz;
Test Circuit 10
Bandwidth –3 dB
CS (OFF)
CD, CS (ON)
17
80
300
MHz typ RL = 50 Ω, CL = 5 pF; Test Circuit 9
pF typ
pF typ
f = 1 MHz
f = 1 MHz
POWER REQUIREMENTS
VDD = 5.5 V
Digital Inputs = 0 V or 5.5 V
IDD
0.001
µA typ
µA max
1.0
2.0
NOTES
1Temperature range is as follows: –40°C to +125°C.
2ON resistance parameters tested with IS = 10 mA.
3Guaranteed by design, not subject to production test.
Specifications subject to change without notice.
–2–
REV. 0
ADG819/ADG820
SPECIFICATIONS1
(VDD = 2.7 V to 3.6 V, GND = 0 V.)
–40ꢁC to –40ꢁC to
Parameter
25ꢁC
+85ꢁC
+125ꢁC2
Unit
Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range
0 V to VDD
1.6
V
ON Resistance (RON
)
0.7
1.4
Ω typ
Ω max
VS = 0 V to VDD, IS = 100 mA;
Test Circuit 1
1.5
ON Resistance Match Between
Channels (∆RON
)
0.06
0.25
Ω typ
Ω max
Ω typ
VS = 0 V to VDD, IS = 100 mA
0.13
0.13
ON Resistance Flatness (RFLAT(ON)
)
VS = 0 V to VDD, IS = 100 mA
LEAKAGE CURRENTS
VDD = 3.6 V
Source OFF Leakage IS (OFF)
0.01
0.25
0.01
0.25
nA typ
nA max
nA typ
nA max
VS = 3.3 V/1 V, VD = 1 V/3.3 V;
Test Circuit 2
VS = VD = 1 V, or VS = VD = 3.3 V;
Test Circuit 3
3
3
10
25
Channel ON Leakage ID, IS (ON)
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current
2.0
0.8
V min
V max
I
INL or IINH
0.005
5
µA typ
µA max
pF typ
VIN = VINL or VINH
0.1
CIN, Digital Input Capacitance
DYNAMIC CHARACTERISTICS3
ADG819
tON
40
60
10
16
40
ns typ
ns max
ns typ
ns max
ns typ
ns min
RL = 50 Ω, CL = 35 pF,
VS = 1.5 V; Test Circuit 4
RL = 50 Ω, CL = 35 pF,
VS = 1.5 V; Test Circuit
RL = 50 Ω, CL = 35 pF,
65
18
70
21
1
tOFF
Break-Before-Make Time Delay, tBBM
V
S1 = VS2 = 1.5 V; Test Circuit 5
ADG820
tON
20
35
30
45
10
ns typ
ns max
ns typ
ns max
ns typ
ns min
pC typ
RL = 50 Ω, CL = 35 pF,
VS = 1.5 V; Test Circuit 4
RL = 50 Ω, CL = 35 pF,
VS = 1.5 V; Test Circuit 4
RL = 50 Ω, CL = 35 pF,
VS = 1.5 V; Test Circuit 6
VS = 1.5 V, RS = 0 Ω,CL = 1 nF;
Test Circuit 7
40
50
45
55
1
tOFF
Make-Before-Break Time Delay, tMBB
Charge Injection
10
Off Isolation
–71
–72
dB typ
dB typ
RL = 50 Ω, CL = 5 pF, f = 100 kHz;
Test Circuit 8
Channel-to-Channel Crosstalk
RL = 50 Ω, CL = 5 pF, f = 100 kHz;
Test Circuit 10
Bandwidth –3 dB
CS (OFF)
CD, CS (ON)
17
80
300
MHz typ RL = 50 Ω, CL = 5 pF; Test Circuit 9
pF typ
pF typ
f = 1 MHz
f = 1 MHz
POWER REQUIREMENTS
V
DD = 3.6 V
Digital Inputs = 0 V or 3.6 V
IDD
0.001
µA typ
µA max
1.0
2.0
NOTES
1Temperature range is as follows: –40°C to +125°C.
2ON resistance parameters tested with IS = 10 mA.
3Guaranteed by design, not subject to production test.
Specifications subject to change without notice.
–3–
REV. 0
ADG819/ADG820
ABSOLUTE MAXIMUM RATINGS1
(TA = 25°C, unless otherwise noted.)
MicroCSP Package
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . . . TBD
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . 300°C
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Analog Inputs2 . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V or
. . . . . . . . . . . . . . . . . . . . . . . 30 mA, Whichever Occurs First
Digital Inputs2 . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V or
. . . . . . . . . . . . . . . . . . . . . . . 30 mA, Whichever Occurs First
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . 400 mA
. . . . . . . . . . . . . . . . (Pulsed at 1 ms, 10% Duty Cycle Max)
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . 200 mA
Operating Temperature Range
Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to +85°C
Automotive . . . . . . . . . . . . . . . . . . . . . . . . –40°C to +125°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
µSOIC Package
IR Reflow, Peak Temperature (<20 sec) . . . . . . . . . . . 235°C
NOTES
1 Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
2 Overvoltages at IN, S, or D will be clamped by internal diodes. Current should be
limited to the maximum ratings given.
Table I. Truth Table for the ADG819/ADG820
IN
Switch S1
Switch S2
0
1
ON
OFF
OFF
ON
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 206°C/W
JC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 44°C/W
SOT-23 Package (4-Layer Board)
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 119°C/W
PIN CONFIGURATIONS
6-Lead SOT-23
(RT-6)
8-Lead µSOIC
2 ꢄ 3 MicroCSP
(RM-8)
TOP VIEW
(BUMPS AT THE BOTTOM)
NOT TO SCALE
6
5
4
1
2
3
4
8
7
6
5
1
2
3
S2
D
IN
S2
D
S1
S2
1
IN
6
ADG819/
ADG819/
ADG820
TOP VIEW
(Not to Scale)
NC
V
ADG820
TOP VIEW
DD
V
D
2
DD
5
IN
GND
S1
GND
(Not to Scale)
V
NC
DD
S1
3
GND
4
NC = NO CONNECT
ADG819 ONLY
ORDERING GUIDE
Temperature Range Brand1
Package Description
Model Option
Package
ADG819BRM
ADG819BRT
ADG819BCB
ADG820BRM
ADG820BRT
–40°C to +125°C
–40°C to +125°C
–40°C to +85°C
–40°C to +125°C
–40°C to +125°C
SNB
SNB
SNB
SPB
SPB
µSOIC (MicroSmall Outline IC)
SOT-23 (Plastic Surface-Mount)
MicroCSP (Micro Chip Scale Package)
µSOIC (MicroSmall Outline IC)
SOT-23 (Plastic Surface-Mount)
RM-8
RT-62
CB-62
RM-8
RT-62
NOTES
1Branding on these packages is limited to three characters due to space constraints.
2Contact factory for availability.
–4–
REV. 0
ADG819/ADG820
TERMINOLOGY
Most Positive Power Supply Potential
VDD
GND
Ground (0 V) Reference
IDD
Positive Supply Current
S
D
IN
Source Terminal. May be an input or output.
Drain Terminal. May be an input or output.
Logic Control Input
RON
∆RON
RFLAT(ON)
Ohmic Resistance between D and S
ON Resistance Match between Any Two Channels, i.e., RON max – RON min
Flatness is defined as the difference between the maximum and minimum value of ON resistance as
measured over the specified analog signal range.
Source Leakage Current with the Switch OFF
Channel Leakage Current with the Switch ON
Analog Voltage on Terminals D, S
IS (OFF)
ID, IS (ON)
VD (VS)
VINL
Maximum Input Voltage for Logic “0”
VINH
Minimum Input Voltage for Logic “1”
I
INL(IINH
)
Input Current of the Digital Input
CS (OFF)
CD, CS (ON)
tON
OFF Switch Source Capacitance
ON Switch Capacitance
Delay between applying the digital control input and the output switching ON.
Delay between applying the digital control input and the output switching OFF.
tOFF
tBBM
OFF time or ON time measured between the 90% points of both switches when switching
from one address state to another.
tMBB
ON time measured between the 80% points of both switches when switching from one
address state to another.
Charge Injection A measure of the glitch impulse transferred from the digital input to the analog output during switching.
Crosstalk
A measure of unwanted signal coupled through from one channel to another as a result of parasitic
capacitance.
OFF Isolation
Bandwidth
A measure of unwanted signal coupling through an OFF switch.
Frequency at which the output is attenuated by –3 dB.
ON Response
Insertion Loss
Frequency Response of the ON Switch
Loss due to the ON Resistance of the Switch
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate
on the human body and test equipment and can discharge without detection. Although the ADG819/
ADG820 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
REV. 0
–5–
ADG819/ADG820 –Typical Performance Characteristics
1.0
0.8
0.6
0.4
0.2
0
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
V
= 3V
T
= 25ꢁC
DD
A
V
= 2.7V
DD
T
= +125ꢁC
A
T
= +85ꢁC
A
V
= 3V
DD
T
= +25ꢁC
A
V
= 3.3V
DD
V = 5V
DD
V
= 4.5V
T
= –40ꢁC
DD
A
V
= 5.5V
DD
0
0.5
1.0
1.5
, V – V
2.0
2.5
3.0
0
1
2
3
, V – V
4
5
V
V
D
S
D
S
TPC 1. ON Resistance vs. VD (VS)
TPC 4. ON Resistance vs. VD (VS) for Different Temperatures
10
9
8
7
6
5
4
3
2
1
0
1.0
T
V
= 25ꢁC
V
= 5V
A
DD
= 1.8V
DD
0.8
0.6
0.4
0.2
0
T
= +125ꢁC
A
T
A
= +85ꢁC
T
= +25ꢁC
A
T
= –40ꢁC
A
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
0
1
2
3
4
5
V
, V – V
V , V – V
D S
D
S
TPC 2. ON Resistance vs. VD (VS)
TPC 5. ON Resistance vs. VD (VS) for Different Temperatures
50
40
10
8
V
= 3V, 5V
DD
V
= 3V
DD
tON
V
= 5V
DD
6
30
20
10
0
4
I
, I (ON)
D
S
2
V
= 3V, 5V
DD
tOFF
0
I (OFF)
S
–2
0
20
40
60
80
100
120
–40
–20
0
20
40
60
80
100
120
TEMPERATURE – ꢁC
TEMPERATURE – ꢁC
TPC 3. Leakage Currents vs. Temperatures
TPC 6. tON/tOFF Times vs. Temperature (ADG819)
–6–
REV. 0
ADG819/ADG820
250
200
150
100
50
1
0
V
= 3V, 5V
T
= 25ꢁC
DD
A
T
= 25ꢁC
A
–1
–2
–3
–4
–5
–6
V
= 5V
DD
V
= 3V
DD
0
–50
–100
–150
–200
0
0.5
1.0
1.5
2.0
2.5
– V
3.0
3.5
4.0
4.5
5.0
0.2
1
10
30
V
FREQUENCY – MHz
S
TPC 7. Charge Injection vs. Source Voltage
TPC 10. ON Response vs. Frequency
0
1.8
1.6
1.4
V
= 5V, 3V
= 25ꢁC
DD
T
= 25ꢁC
A
T
A
–10
–20
–30
–40
–50
–60
–70
–80
–90
RISING
1.2
1.0
0.8
FALLING
0.6
0.4
0.2
0
0.1
1
2
0
1
2
3
4
5
6
FREQUENCY – MHz
V
– V
DD
TPC 8. OFF Isolation vs. Frequency
TPC 11. Logic Threshold vs. Supply Voltage
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
0.1
1
2
FREQUENCY – MHz
TPC 9. Crosstalk vs. Frequency
REV. 0
–7–
ADG819/ADG820
Test Circuits
I
DS
V1
I
(ON)
I
(OFF)
I (OFF)
D
D
S
S
S
R
D
S
D
D
NC
V
V
V
V
D
S
D
S
= V1 / I
NC = NO CONNECT
ON
OS
Test Circuit 1. ON Resistance
Test Circuit 3. ON Leakage
Test Circuit 2. OFF Leakage
V
DD
0.1ꢂF
V
V
IN
DD
50%
90%
50%
90%
V
OUT
R
50ꢀ
C
L
35pF
L
V
S
IN
tOFF
tON
GND
Test Circuit 4. Switching Times
V
DD
0.1ꢂF
V
DD
V
50%
50%
IN
0V
S1
V
D
S1
V
OUT
90%
0V
90%
V
OUT
R
50ꢀ
C
L
35pF
S2
IN
L
V
S2
tBBM
tBBM
GND
V
IN
Test Circuit 5. Break-Before-Make Time Delay, tBBM (ADG819 Only)
V
DD
0.1ꢂF
V
50%
50%
80% V
IN
0V
V
DD
V
V
S1
S1
90%
80% V
D
R
C
L1
300ꢀ
L1
35pF
V
D
D
V
S2
V
S2
IN
R
C
L2
300ꢀ
L2
35pF
tMBB
V
IN
GND
Test Circuit 6. Make-Before-Break Time Delay, tMBB (ADG820 Only)
–8–
REV. 0
ADG819/ADG820
V
DD
V
ꢅV
OUT
OUT
Q
= C ꢄ ꢅV
INJ
L
OUT
V
DD
R
SW OFF
SW OFF
SW OFF
SW OFF
S
V
OUT
V
IN
C
1nF
SW ON
SW ON
L
V
IN
S
V
IN
GND
Test Circuit 7. Charge Injection
V
DD
0.1ꢂF
V
NETWORK
ANALYZER
DD
S
D
50ꢀ
IN
50ꢀ
V
S
V
OUT
R
L
50ꢀ
GND
V
IN
V
OUT
OFF ISOLATION = 20 LOG
V
S
Test Circuit 8. OFF Isolation
V
DD
0.1ꢂF
V
NETWORK
ANALYZER
DD
S
50ꢀ
IN
V
S
D
V
OUT
R
L
50ꢀ
GND
V
IN
V
WITH SWITCH
OUT
INSERTION LOSS = 20 LOG
V
WITHOUT SWITCH
OUT
Test Circuit 9. Bandwidth
V
DD
0.1ꢂF
NETWORK
ANALYZER
V
DD
S1
S2
V
OUT
R
50ꢀ
L
D
R
50ꢀ
50ꢀ
IN
V
S
GND
V
OUT
CHANNEL-TO-CHANNEL CROSSTALK = 20 LOG
V
S
Test Circuit 10. Channel-to-Channel Crosstalk
REV. 0
–9–
ADG819/ADG820
OUTLINE DIMENSIONS
6-Lead Plastic Surface-Mount Package
(RT-6)
Dimensions shown in inches and (mm)
0.1220 (3.10)
0.1063 (2.70)
6
1
5
2
4
3
0.0709 (1.80)
0.0591 (1.50)
0.1181 (3.00)
0.0984 (2.50)
PIN 1
0.0374 (0.95)
BSC
0.0748
(1.90)
BSC
0.0512 (1.30)
0.0354 (0.90)
0.0571 (1.45)
0.0354 (0.90)
10ꢁ
0ꢁ
0.0197 (0.50)
0.0098 (0.25)
0.0059 (0.15)
0.0000 (0.00)
COPLANARITY
0.0217 (0.55)
0.0138 (0.35)
SEATING
PLANE
0.0091 (0.23)
0.0031 (0.08)
8-Lead ꢂSOIC Package
(RM-8)
Dimensions shown in inches and (mm)
0.1220 (3.10)
0.1142 (2.90)
8
5
4
0.1988 (5.05)
0.1870 (4.75)
0.1220 (3.10)
0.1142 (2.90)
1
PIN 1
0.0256 (0.65) BSC
0.1201 (3.05)
0.1118 (2.84)
0.1201 (3.05)
0.1118 (2.84)
0.0429 (1.09)
0.0370 (0.94)
COPLANARITY
0.0059 (0.15)
0.0020 (0.05)
33ꢁ
27ꢁ
0.0181 (0.46)
0.0079 (0.20)
0.0280 (0.71)
0.0161 (0.41)
0.0110 (0.28)
0.0031 (0.08)
SEATING
PLANE
2 × 3 Array for MicroCSP
(CB-6)
Dimensions shown in millimeters and (inches)
0.67 (0.0264)
0.57 (0.0224)
0.47 (0.0185)
0.44 (0.0173)
0.36 (0.0142)
0.28 (0.0110)
1.34 (0.0528)
1.14 (0.0449)
0.94 (0.0370)
0.32 (0.0126)
SEATING
PLANE
0.32 (0.0126)
NOM
0.50 (0.0197)
BALL PITCH
2.38 (0.0937)
2.18 (0.0858)
1.98 (0.0780)
PIN 1
IDENTIFIER
0.59 (0.0232)
0.24 (0.0094)
0.22 (0.0087) COPLANARITY
0.20 (0.0079)
0.50 (0.0860)
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
–10–
REV. 0
–11–
–12–
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