ADG901BCP-REEL7 [ADI]
Wideband, 40 dB Isolation at 1 GHz, CMOS 1.65 V to 2.75 V, SPST Switches; 宽带40 dB的隔离在1 GHz , CMOS 1.65 V至2.75 V,单刀单掷开关型号: | ADG901BCP-REEL7 |
厂家: | ADI |
描述: | Wideband, 40 dB Isolation at 1 GHz, CMOS 1.65 V to 2.75 V, SPST Switches |
文件: | 总12页 (文件大小:1083K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Wideband, 40 dB Isolation at 1 GHz, CMOS
1.65 V to 2.75 V, SPST Switches
ADG901/ADG902
FUNCTIONAL BLOCK DIAGRAMS
ADG901
FEATURES
Wideband Switch: –3 dB @ 4.5 GHz
Absorptive/Reflective Switches
High Off Isolation (40 dB @ 1 GHz)
Low Insertion Loss (0.8 dB @1 GHz)
Single 1.65 V to 2.75 V Power Supply
CMOS/LVTTL Control Logic
RF1
RF2
50ꢀ
50ꢀ
8-Lead MSOP and Tiny 3 mm ꢁ 3 mm LFCSP Packages
Low Power Consumption (<1 ꢂA)
CTRL
RF1
APPLICATIONS
ADG902
Wireless Communications
General-Purpose RF Switching
Dual-Band Applications
High Speed Filter Selection
Digital Transceiver Front End Switch
IF Switching
RF2
CTRL
Tuner Modules
Antenna Diversity Switching
GENERAL DESCRIPTION
LVTTL compatible. The low power consumption of these
CMOS devices makes them ideally suited to wireless applica-
tions and general-purpose high frequency switching.
The ADG901/ADG902 are wideband switches that use a
CMOS process to provide high isolation and low insertion loss to
1 GHz. The ADG901 is an absorptive (matched) switch with
50 Ω terminated shunt legs, while the ADG902 is a reflective
switch. These devices are designed such that the isolation is
high over the dc to 1 GHz frequency range. They have on-board
CMOS control logic, thus eliminating the need for external
controlling circuitry. The control inputs are both CMOS and
PRODUCT HIGHLIGHTS
1. –40 dB Off Isolation @ 1 GHz
2. 0.8 dB Insertion Loss @ 1 GHz
3. Tiny 8-Lead MSOP/LFCSP Packages
0
–0.4
–0.6
–0.8
–1.0
–1.2
–1.4
–1.6
–1.8
–2.0
–2.2
–2.4
–2.6
T
= 25ꢃC
A
–10
–20
–30
–40
–50
–60
–70
–80
V
= 2.5 V
DD
V
T
= 2.5V
= 25ꢃC
DD
A
–90
–2.8
V
= 1.8 V
DD
–100
–3.0
10k
10k
100k
1M
10M
100M
1G
10G
100k
1M
10M
100M
1G
10G
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 2. Insertion Loss vs. Frequency
Figure 1. Off Isolation vs. Frequency
REV. A
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, norforanyinfringementsofpatentsorotherrightsofthirdpartiesthat
may result from its use. No license is granted by implication or otherwise
under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781/329-4700
Fax: 781/326-8703
www.analog.com
© 2004 Analog Devices, Inc. All rights reserved.
(VDD = 1.65 V to 2.75 V, GND = 0 V, input power = 0 dBm,
ADG901/ADG902–SPECIFICATIONS1 all specifications TMIN to TMAX, unless otherwise noted.)
B Version
Parameter
Symbol Conditions
Min
Typ2
Max
Unit
AC ELECTRICAL CHARACTERISTICS
Operating Frequency3
–3 dB Frequency4
DC
2.5
4.5
7
GHz
GHz
dBm
dBm
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
Input Power4
0 V dc Bias
+0.5 V dc Bias
DC to 100 MHz; VDD = 2.5 V 10%
500 MHz; VDD = 2.5 V 10%
1000 MHz; VDD = 2.5 V 10%
100 MHz
500 MHz
1000 MHz
100 MHz
500 MHz
1000 MHz
DC to 100 MHz
500 MHz
1000 MHz
DC to 100 MHz
500 MHz
16
Insertion Loss
S21, S12
S21, S12
S21, S12
S11, S22
S11, S22
0.4
0.5
0.8
61
45
40
60
47
37
28
29
28
23
21
19
3.6
5.8
3.1
6.0
17
36
2.5
0.7
0.8
1.25
Isolation—RF1 to RF2
(CP Package)
60
43
34
51
37.5
31
20
23
25
18
17
15
Isolation—RF1 to RF2
(RM Package)
Return Loss (On Channel)4
Return Loss (Off Channel)4
1000 MHz
On Switching Time4
Off Switching Time4
Rise Time4
tON
tOFF
tRISE
tFALL
P–1 dB
50% CTRL to 90% RF
50% CTRL to 10% RF
10% to 90% RF
90% to 10% RF
1000 MHz
6
ns
ns
ns
ns
dBm
dBm
mV p-p
9.5
5.5
8.5
Fall Time4
1 dB Compression4
Third Order Intermodulation Intercept IP3
900 MHz/901 MHz, 4 dBm
30
Video Feedthrough5
DC ELECTRICAL CHARACTERISTICS
Input High Voltage
Input Low Voltage
Input Leakage Current
VINH
VDD = 2.25 V to 2.75 V
VDD = 1.65 V to 1.95 V
VDD = 2.25 V to 2.75 V
VDD = 1.65 V to 1.95 V
0 ≤ VIN ≤ 2.75 V
1.7
0.65 VCC
V
V
V
V
VINH
VINL
VINL
II
0.7
0.35 VCC
1
0.1
µA
CAPACITANCE4
RF1/RF2, RF Port On Capacitance
CTRL Input Capacitance
CRF ON f = 1 MHz
1.2
2.1
pF
pF
CCTRL
f = 1 MHz
POWER REQUIREMENTS
VDD
Quiescent Power Supply Current
1.65
2.75
1
V
µA
IDD
Digital inputs = 0 V or VDD
0.1
NOTES
1Temperature range B Version: –40°C to +85°C.
2Typical values are at VDD = 2.5 V and 25°C, unless otherwise stated.
3Point at which insertion loss degrades by 1 dB.
4Guaranteed by design, not subject to production test.
5The dc transience at the output of any port of the switch when the control voltage is switched from high to low or low to high in a 50 Ω test setup, measured with
1 ns rise time pulses and 500 MHz bandwidth.
Specifications subject to change without notice.
–2–
REV. A
ADG901/ADG902
ABSOLUTE MAXIMUM RATINGS1
LFCSP Package
(TA = 25°C, unless otherwise noted.)
JA Thermal Impedance (2-layer board) . . . . . . . . . . 84°C/W
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to +4 V
Inputs to GND . . . . . . . . . . . . . . . . . . –0.5 V to VDD + 0.3 V2
Continuous Current . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 mA
Input Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 dBm
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
MSOP Package
JA Thermal Impedance (4-layer board) . . . . . . . . . . 48°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . . 300°C
IR Reflow, Peak Temperature (<20 sec) . . . . . . . . . . . . 235°C
ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 kV
NOTES
1 Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only and functional operation of
the device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 206°C/W
2 RF1/2 Off Port Inputs to Ground ................................... –0.5 V to VDD – 0.5 V
ORDERING GUIDE
Model
Temperature Range
Package Description
Package Option
Branding
ADG901BRM
–40°C to +85°C
Mini Small Outline Package (MSOP)
Mini Small Outline Package (MSOP)
Mini Small Outline Package (MSOP)
Lead Frame Chip Scale Package (LFCSP)
Lead Frame Chip Scale Package (LFCSP)
Mini Small Outline Package (MSOP)
Mini Small Outline Package (MSOP)
Lead Frame Chip Scale Package (LFCSP)
Lead Frame Chip Scale Package (LFCSP)
Lead Frame Chip Scale Package (LFCSP)
Evaluation Board
RM-8
RM-8
RM-8
CP-8
CP-8
RM-8
RM-8
RM-8
CP-8
CP-8
W6B
W6B
W6B
W6B
W6B
W7B
W7B
W7B
W7B
W7B
ADG901BRM-500RL7 –40°C to +85°C
ADG901BRM-REEL7 –40°C to +85°C
ADG901BCP-500RL7 –40°C to +85°C
ADG901BCP-REEL7
ADG902BRM
ADG902BRM-500RL7 –40°C to +85°C
ADG902BRM-REEL7 –40°C to +85°C
ADG902BCP-500RL7 –40°C to +85°C
ADG902BCP-REEL7
EVAL-ADG901EB
EVAL-ADG902EB
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Evaluation Board
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
ADG901/ADG902 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
PIN CONFIGURATION
8-Lead MSOP (RM-8)
8-Lead 3 mm ꢁ 3 mm LFCSP (CP-8)
PIN FUNCTION DESCRIPTIONS
Pin No. Mnemonic Function
1
VDD
Power Supply Input. These parts can
be operated from 1.65 V to 2.75 V;
VDD should be decoupled to GND.
1
2
3
4
8
7
6
5
RF2
GND
GND
GND
V
DD
ADG901/
ADG902
TOP VIEW
CTRL
GND
2
CTRL
CMOS or TTL Logic Level.
0
1
➞
➞
RF1 Isolated from RF2
RF1 to RF2
(Not to Scale)
RF1
3, 5, 6, 7 GND
Ground Reference Point for All
Circuitry on the Part.
4
8
RF1
RF2
RF1 Port.
RF2 Port.
Table I. Truth Table
Signal Path
CTRL
0
1
RF1 isolated from RF2
RF1 to RF2
REV. A
–3–
ADG901/ADG902
TERMINOLOGY
Parameter
Description
VDD
Most positive power supply potential.
Positive supply current.
IDD
GND
CTRL
VINL
VINH
Ground (0 V) reference.
Logic control input.
Maximum input voltage for Logic 0.
Minimum input voltage for Logic 1.
Input current of the digital input.
Digital input capacitance.
IINL (IINH
CIN
)
tON
Delay between applying the digital control input and the output switching on.
Delay between applying the digital control input and the output switching off.
Rise time. Time for the RF signal to rise from 10% to 90% of the ON level.
Fall time. Time for the RF signal to fall from 90% to 10% of the ON level.
tOFF
tRISE
tFALL
Off Isolation
Insertion Loss
P–1 dB
The attenuation between input and output ports of the switch when the switch control voltage is in the
OFF condition.
The attenuation between input and output ports of the switch when the switch control voltage is in the
ON condition.
1 dB compression point. The RF input power level at which the switch insertion loss increases by 1 dB over its
low level value. It is a measure of how much power the ON switch can handle before the insertion loss increases
by 1 dB.
IP3
Third order intermodulation intercept. This is a measure of the power in false tones that occur when closely spaced
tones are passed through a switch, whereby the nonlinearity of the switch causes these false tones to be generated.
Return Loss
The amount of reflected power relative to the incident power at a port. Large return loss indicates good matching.
By measuring Return Loss the VSWR can be calculated from conversion charts. VSWR (voltage standing wave ratio)
indicates degree of matching present at a switch RF port.
Video Feedthrough Spurious signals present at the RF ports of the switch when the control voltage is switched from high to low
or low to high without an RF signal present.
–4–
REV. A
Typical Performance Characteristics–ADG901/ADG902
–0.40
–0.45
–0.50
–0.55
–0.60
–0.65
–0.70
–0.75
–0.80
–0.85
–0.90
–0.95
–1.00
–0.4
–0.4
–0.6
–0.8
–1.0
–1.2
–1.4
–1.6
–1.8
–2.0
–2.2
–2.4
–2.6
–2.8
–3.0
–0.6
–0.8
–1.0
V
= 2.5V
DD
V
= 1.95V
DD
V
= 1.8V
V
= 2.25V
DD
DD
V
= 2.25V
DD
–1.2
–1.4
–1.6
–1.8
–2.0
V
= 2.5V
DD
V
= 2.75V
DD
V
= 2.75V
V
= 1.65V
DD
DD
–2.2
–2.4
–2.6
–2.8
–3.0
T
= 25ꢃC
T
A
= 25ꢃC
T
A
= 25ꢃC
A
10k
100k
1M
10M 100M
1G
10G
10k
100k
1M
10M 100M
1G
10G
10k
100k
1M
10M 100M
1G
10G
FREQUENCY (Hz)
FREQUENCY (Hz)
FREQUENCY (Hz)
TPC 1. Insertion Loss vs. Frequency
over Supplies (S12 and S21)
TPC 2. Insertion Loss vs. Frequency
over Supplies (S12 and S21)
(Zoomed TPC 1 Plot)
TPC 3. Insertion Loss vs. Frequency
over Supplies (S12 and S21)
0
0
–0.4
V
= 2.5V
–5
–10
–15
–20
–25
–30
–35
–40
–45
–50
–55
–60
–65
–70
–75
–80
–85
–90
DD
–5
–10
–15
–20
–25
–30
–35
–40
–45
–50
–55
T = 25ꢃC
A
–40ꢃC
–0.6
+25ꢃC
–0.8
–1.0
–1.2
–1.4
–1.6
–1.8
–2.0
–2.2
–2.4
–2.6
–2.8
–3.0
+85ꢃC
+85ꢃC
+25ꢃC
V
= 2.5V
DD
–60
–65
–70
–75
–80
–85
V
= 1.8V
V
= 2.5V
DD
–90
DD
–40ꢃC
100M 1G
–95
–100
10k 100k
1M
10M
10G
10k 100k
1M
10M
100M 1G
10G
10k 100k
1M
10M
100M 1G
10G
FREQUENCY (Hz)
FREQUENCY (Hz)
FREQUENCY (Hz)
TPC 4. Insertion Loss vs. Frequency
over Temperature (S12 and S21)
TPC 6. OFF Isolation vs. Frequency
over Temperature (S12 and S21)
TPC 5. OFF Isolation vs. Frequency
over Supplies (S12 and S21)
0
T
V
= 25ꢃC
A
= 2.5V
–5
DD
CH1
–10
–15
–20
–25
CTRL
RFx
OFF SWITCH
CH2
–30
–35
ON SWITCH
CH1 = CTRL = 1V/DIV
CH2 = RFx = 100mV/DIV
t
t
= 2.8ns
= 5.1ns
CH2 pk-pk
2.016mV
RISE
FALL
10k 100k
1M
10M
100M 1G
10G
FREQUENCY (Hz)
CH1 500mV CH2 1mV 10.0ns
TPC 8. Switch Timing
TPC 7. Return Loss vs. Frequency
(S11)
TPC 9. Video Feedthrough
REV. A
–5–
ADG901/ADG902
40
20
18
16
14
35
30
25
20
15
10
12
10
8
6
4
5
0
V
T
= 2.5V
V
T
= 2.5V
DD
= 25ꢃC
DD
= 25ꢃC
2
A
A
0
250
350
450
550
650
750
850
0
250
500
750
1000 1250 1500
FREQUENCY (MHz)
FREQUENCY (MHz)
TPC 10. IP3 vs. Frequency
TPC 11. P–1dB vs. Frequency
–6–
REV. A
ADG901/ADG902
Test Circuits*
V
DD
0.1ꢂF
V
DD
0.1ꢂF
V
OUT
R
L
V
50ꢀ
DD
ADG901
V
DD
V
RF1
50ꢀ
RF2
OUT
RF1
RF2
50%
50%
V
S
V
CTRL
50ꢀ
R
50ꢀ
L
V
S
CTRL
50ꢀ
10%
90%
NETWORK
ANALYZER
V
OUT
CTRL
GND
GND
V
OUT
V
= 20 LOG
INSERTION LOSS
CTRL
tON
tOFF
V
S
Test Circuit 1. Switching Timing: tON, tOFF
Test Circuit 4. Insertion Loss
V
DD
0.1ꢂF
V
DD
0.1ꢂF
V
DD
ADG901
V
DD
NC
OSCILLOSCOPE
V
OUT
RF1
RF2
RF2
RF1
50%
50%
V
CTRL
R
L
50ꢀ
50ꢀ
V
S
90%
90%
CTRL
50ꢀ
10%
10%
V
OUT
CTRL
GND
GND
V
CTRL
tRISE
tFALL
Test Circuit 2. Switch Timing: tRISE, tFALL
Test Circuit 5. Video Feedthrough
V
DD
0.1ꢂF
V
OUT
R
L
V
50ꢀ
DD
ADG901
RF1
50ꢀ
RF2
V
S
50ꢀ
50ꢀ
NETWORK
ANALYZER
CTRL
GND
V
OUT
V
OFF ISOLATION = 20 LOG
CTRL
V
S
Test Circuit 3. Off Isolation
*Similiar setups for ADG902.
REV. A
–7–
ADG901/ADG902
V
V
DD
DD
0.1ꢂF
0.1ꢂF
RF
SOURCE
V
V
DD
DD
ADG901
ADG901
RF
SOURCE
SPECTRUM
ANALYZER
SPECTRUM
ANALYZER
COMBINER
RF1
RF2
RF2
RF1
V
S
50ꢀ
50ꢀ
50ꢀ
50ꢀ
RF
SOURCE
CTRL
CTRL
GND
GND
V
V
CTRL
CTRL
Test Circuit 7. P–1dB
Test Circuit 6. IP3
–8–
REV. A
ADG901/ADG902
APPLICATIONS
ADG9xx EVALUATION BOARD
The ADG901/ADG902 are ideal solutions for low power, high
frequency applications. The low insertion loss, high isolation
between ports, low distortion, and low current consumption of
these parts make them excellent solutions for many high frequency
switching applications.
The ADG9xx evaluation board allows designers to evaluate the
high performance wideband switches with a minimum of effort.
To prove that these devices meet user requirements, the user
requires only a power supply and a network analyzer along with
the evaluation board. An application note is available with the
evaluation board and provides complete information on operating
the evaluation board.
Applications include switching between high frequency filters,
ASK generator, and FSK generator.
Absorptive vs. Reflective Switches
The RF1 port (see Figure 3) is connected through a 50 Ω trans-
mission line to the top left SMA connector J1. RF2 is connected
through a 50 Ω transmission line to the top SMA connector J2.
J3 is connected to GND. A through transmission line connects
J4 and J5 and this transmission line is used to estimate the loss
of the PCB over the environmental conditions being evaluated.
The ADG901 is an absorptive (matched) switch with 50 Ω termi-
nated shunt legs, and the ADG902 is a reflective switch with 0 Ω
terminated shunts to ground. The ADG901 absorptive switch
has a good VSWR on each port, regardless of the switch mode.
An absorptive switch should be used when there is a need for a
good VSWR that is looking into the port but not passing the
through signal to the common port. The ADG901 is therefore
ideal for applications that require minimum reflections back to
the RF source. It also ensures that the maximum power is trans-
ferred to the load.
The board is constructed of a 4-layer, FR4 material with a dielec-
tric constant of 4.3 and an overall thickness of 0.062 inches. Two
ground layers with grounded planes provide ground for the RF
transmission lines. The transmission lines were designed using a
coplanar waveguide with ground plane model using a trace width
of 0.052 inches, clearance to ground plane of 0.030 inches,
dielectric thickness of 0.029 inches, and a metal thickness of
0.014 inches.
The ADG902 reflective switch is suitable for applications where
high off port VSWR does not matter and the switch has some
other desired performance feature. It can be used in many appli-
cations, including high speed filter selection. In most cases, an
absorptive switch can be used instead of a reflective switch, but
not vice versa.
Figure 3. ADG9xx Evaluation Board Top View
REV. A
–9–
ADG901/ADG902
OUTLINE DIMENSIONS
8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
3.00
BSC
8
5
4
4.90
BSC
3.00
BSC
1
PIN 1
0.65 BSC
1.10 MAX
0.15
0.00
0.80
0.60
0.40
8ꢃ
0ꢃ
0.38
0.22
0.23
0.08
SEATING
PLANE
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-187AA
8-Lead Lead Frame Chip Scale Package [LFCSP]
3 mm ꢁ 3 mm Body
(CP-8)
Dimensions shown in millimeters
0.50
0.40
0.30
3.00
BSC SQ
0.60 MAX
8
PIN 1 INDICATOR
0.45
1
PIN 1
INDICATOR
1.90
1.75
1.60
2.75
BSC SQ
1.50
REF
TOP
VIEW
BOTTOM
VIEW
0.50
BSC
4
5
0.25
MIN
1.60
1.45
1.30
0.80 MAX
0.65TYP
0.90
0.85
0.80
12ꢃ MAX
0.05 MAX
0.02 NOM
SEATING
PLANE
0.30
0.23
0.18
0.20 REF
–10–
REV. A
ADG901/ADG902
Revision History
Location
Page
10/04—Data Sheet changed from REV. 0 to REV. A.
Changes to FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Changes to PRODUCT HIGHLIGHTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Changes to SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Changes to ORDERING GUIDE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Change to ADG9xx EVALUATION BOARD section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Updated OUTLINE DIMENSIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
REV. A
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