ADG901BRMZ-REEL71 [ADI]
Wideband, 40 dB Isolation at 1 GHz, CMOS 1.65 V to 2.75 V, SPST Switches; 宽带40 dB的隔离在1 GHz ， CMOS 1.65 V至2.75 V，单刀单掷开关
| 型号： | ADG901BRMZ-REEL71 |
| 厂家： | 
ADI |
| 描述： | Wideband, 40 dB Isolation at 1 GHz, CMOS 1.65 V to 2.75 V, SPST Switches |
| 文件： | 总16页 (文件大小：737K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Wideband, 40 dB Isolation at 1 GHz, CMOS
1.65 V to 2.75 V, SPST Switches
ADG901/ADG902
FEATURES
FUNCTIONAL BLOCK DIAGRAM
Wideband switch: −3 dB @ 4.5 GHz
ADG901—absorptive switch
ADG901
RF1
RF2
ADG902—reflective switch
High off isolation: 40 dB @ 1 GHz
Low insertion loss: 0.8 dB @1 GHz
Single 1.65 V to 2.75 V power supply
CMOS/LVTTL control logic
8-lead MSOP and tiny 3 mm × 3 mm LFCSP packages
Low power consumption (<1 μA)
50Ω
50Ω
CTRL
RF1
ADG902
RF2
APPLICATIONS
Wireless communications
General purpose RF switching
Dual-band applications
High speed filter selection
Digital transceiver front end switch
IF switching
CTRL
Figure 1.
Tuner modules
Antenna diversity switching list
GENERAL DESCRIPTION
The ADG901/ADG902 are wideband switches that use a CMOS
process to provide high isolation and low insertion loss to
1 GHz. The ADG901 is an absorptive (matched) switch with
50 Ω terminated shunt legs, while the ADG902 is a reflective
switch. These devices are designed such that the isolation is
high over the dc to 1 GHz frequency range. They have on-board
CMOS control logic, thus eliminating the need for external
controlling circuitry. The control inputs are both CMOS and
0
LVTTL compatible. The low power consumption of these
CMOS devices makes them ideally suited to wireless
applications and general-purpose high frequency switching.
PRODUCT HIGHLIGHTS
1. −40 dB Off Isolation @ 1 GHz
2. 0.8 dB Insertion Loss @ 1 GHz
3. Tiny 8-Lead MSOP/LFCSP Packages
–0.4
–0.6
–0.8
–1.0
–1.2
–1.4
–1.6
–1.8
–2.0
–2.2
–2.4
–2.6
–2.8
T
= 25°C
A
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
V
= 2.5V
DD
V
= 2.5V
= 25°C
DD
V
= 1.8V
–3.0
–3.0
10k
DD
T
A
100k
1M
10M
100M
1G
10G
10k
100k
1M
10M
100M
1G
10G
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 3. Insertion Loss vs. Frequency
Figure 2. Off Isolation vs. Frequency
Rev. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registeredtrademarks arethe property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Fax: 781.461.3113
www.analog.com
© 2005 Analog Devices, Inc. All rights reserved.
ADG901/ADG902
TABLE OF CONTENTS
Features .............................................................................................. 1
Pin Configuration and Function Descriptions..............................5
Typical Performance Characteristics ..............................................6
Terminology .......................................................................................8
Test Circuits........................................................................................9
Applications..................................................................................... 10
Absorptive vs. Reflective Switches ........................................... 10
ADG90x Evaluation Board ........................................................... 11
Outline Dimensions....................................................................... 12
Ordering Guide............................................................................... 13
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description......................................................................... 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 4
ESD Caution.................................................................................. 4
REVISION HISTORY
10/05—Rev. A to Rev. B
Changes to Figure 1..........................................................................1
Changes to Table 1............................................................................3
Changes to Ordering Guide ..........................................................12
10/04—Rev. 0 to Rev. A.
Changes to Features ......................................................................... 1
Changes to Product Highlights ...................................................... 1
Changes to Specifications................................................................ 2
Changes to Ordering Guide ............................................................ 3
Change to ADG9xx Evaluation Board Section............................. 9
Changes to Ordering Guide .......................................................... 10
8/03—Revision 0: Initial Version
Rev. B | Page 2 of 16
ADG901/ADG902
SPECIFICATIONS
VDD = 1.65 V to 2.75 V, GND = 0 V, input power = 0 dBm, all specifications TMIN to TMAX, unless otherwise specified.1
Table 1.
B Version
Parameter
Symbol
Conditions
Min
Typ2
Max
Unit
AC ELECTRICAL CHARACTERISTICS
Operating Frequency3
−3 dB Frequency4
DC
2.5
4.5
7
GHz
GHz
dBm
dBm
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
ns
ns
ns
ns
dBm
dBm
mV p-p
Input Power4
0 V dc bias
0.5 V dc bias
DC to 100 MHz; VDD = 2.5 V 10%
500 MHz; VDD = 2.5 V 10%
1000 MHz; VDD = 2.5 V 10%
100 MHz
500 MHz
1000 MHz
100 MHz
500 MHz
1000 MHz
DC to 100 MHz
500 MHz
1000 MHz
DC to 100 MHz
500 MHz
16
Insertion Loss
S21, S12
S21, S12
S21, S12
S11, S22
S11, S22
0.4
0.5
0.8
61
45
40
60
47
37
28
29
28
23
21
19
3.6
5.8
3.1
6.0
17
36
2.5
0.7
0.8
1.25
Isolation—RF1 to RF2
CP Package
60
43
34
51
37.5
31
20
23
25
18
17
15
Isolation—RF1 to RF2
RM Package
Return Loss (On Channel)4
Return Loss (Off Channel)4
1000 MHz
On Switching Time4
Off Switching Time4
Rise Time4
Fall Time4
1 dB Compression4
tON
tOFF
tRISE
tFALL
P−1 dB
50% CTRL to 90% RF
50% CTRL to 10% RF
10% to 90% RF
90% to 10% RF
1000 MHz
6
9.5
5.5
8.5
Third-Order Intermodulation Intercept IP3
Video Feedthrough5
900 MHz/901 MHz, 4 dBm
28.5
DC ELECTRICAL CHARACTERISTICS
Input High Voltage
VINH
VINH
VINL
VINL
VDD = 2.25 V to 2.75 V
VDD = 1.65 V to 1.95 V
VDD = 2.25 V to 2.75 V
VDD = 1.65 V to 1.95 V
1.7
0.65 VDD
V
V
V
V
Input Low Voltage
0.7
0.35
VDD
Input Leakage Current
CAPACITANCE4
II
0 ≤ VIN ≤ 2.75 V
0.1
1
μA
RF1/RF2, RF Port On Capacitance
CTRL Input Capacitance
POWER REQUIREMENTS
VDD
CRF on
CCTRL
f = 1 MHz
f = 1 MHz
1.2
2.1
pF
pF
1.65
2.75
1
V
μA
Quiescent Power Supply Current
IDD
Digital inputs = 0 V or VDD
0.1
1 Temperature range for B version: −40°C to +85°C.
2 Typical values are at VDD = 2.5 V and 25°C, unless otherwise specified.
3 Point at which insertion loss degrades by 1 dB.
4 Guaranteed by design, not subject to production test.
5 The dc transience at the output of any port of the switch when the control voltage is switched from high to low or low to high in a 50 Ω test setup, measured with 1 ns
rise time pulses and 500 MHz bandwidth.
Rev. B | Page 3 of 16
ADG901/ADG902
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise specified.
Table 2.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Parameter
VDD to GND
Inputs to GND
Rating
−0.5 V to +4 V
−0.5 V to VDD + 0.3
V1
Continuous Current
Input Power
30 mA
18 dBm
Operating Temperature Range
Industrial (B Version)
Storage Temperature Range
Junction Temperature
MSOP Package
−40°C to +85°C
−65°C to +150°C
150°C
θJA Thermal Impedance
LFCSP Package
206°C/W
θ JA Thermal Impedance (2-Layer
board)
θ JA Thermal Impedance (4-Layer
board)
84°C/W
48°C/W
Lead Temperature, Soldering (10 sec)
IR Reflow, Peak Temperature (<20 sec)
ESD
300°C
235°C
1 kV
1 RF1/RF2 off port inputs to ground: −0.5 V to VDD – 0.5 V
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. B | Page 4 of 16
ADG901/ADG902
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
V
1
2
3
4
8
7
6
5
RF2
DD
ADG901/
ADG902
CTRL
GND
RF1
GND
GND
GND
TOP VIEW
(Not to Scale)
Figure 4. 8-Lead MSOP (RM-8) and
8-Lead 3 mm × 3 mm LFCSP (CP-8 – Exposed pad tied to substrate, GND
Table 3. Pin Function Descriptions
Pin No.
Mnemonic Description
1
2
VDD
CTRL
Power Supply Input. These parts can be operated from 1.65 V to 2.75 V; VDD should be decoupled to GND.
CMOS or LVTTL Logic Level. CTRL input should not exceed VDD.
0 → RF1 Isolated from RF2.
1 → RF1 to RF2.
3, 5, 6, 7
4
8
GND
RF1
RF2
Ground Reference Point for All Circuitry on the Part.
RF1 Port.
RF2 Port.
Table 4. Truth Table
CTRL
Signal Path
0
1
RF1 isolated from RF2
RF1 to RF2
Rev. B | Page 5 of 16
ADG901/ADG902
TYPICAL PERFORMANCE CHARACTERISTICS
–0.4
–0.6
–0.8
–0.4
–0.6
–0.8
–1.0
–1.2
–1.4
–1.6
–1.8
–2.0
–2.2
–2.4
–2.6
–2.8
–3.0
–40°C
+25°C
V
= 2.5V
DD
+85°C
–1.0
–1.2
–1.4
–1.6
–1.8
–2.0
–2.2
–2.4
–2.6
–2.8
–3.0
V
= 2.25V
DD
V
= 2.75V
DD
V
= 2.5V
100k
DD
T
= 25°C
A
10k
1M
10M
100M
1G
10G
10k
100k
1M
10M
100M
1G
10G
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 5. Insertion Loss vs. Frequency over Supplies (S12 and S21)
Figure 8. Insertion Loss vs. Frequency over Temperature (S12 and S21)
–0.40
–0.45
–0.50
0
T
= 25°C
–5
–10
–15
–20
–25
–30
–35
–40
–45
–50
–55
–60
–65
–70
–75
–80
–85
–90
–95
–100
A
V
= 2.5V
DD
–0.55
–0.60
–0.65
–0.70
–0.75
–0.80
–0.85
–0.90
–0.95
–1.00
V
= 2.25V
V
DD
= 2.75V
DD
V
= 2.5V
DD
V
= 1.8V
1G
DD
T
= 25°C
A
10k
100k
1M
10M
100M
1G
10G
10k
100k
1M
10M
100M
10G
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 6. Insertion Loss vs. Frequency over Supplies (S12 and S21)
(Zoomed Figure 5 Plot)
Figure 9. OFF Isolation vs. Frequency over Supplies (S12 and S21)
–0.4
–0.6
–0.8
0
V
= 2.5V
DD
–5
–10
–15
–20
–25
–30
–35
–40
–45
–50
–55
–60
–65
–70
–75
–80
–85
–90
V
= 1.95V
V
= 1.8V
–1.0
–1.2
–1.4
–1.6
–1.8
–2.0
–2.2
–2.4
–2.6
–2.8
–3.0
DD
DD
+85°C
V
= 1.65V
DD
+25°C
–40°C
T
= 25°C
A
10k
100k
1M
10M
100M
1G
10G
10k
100k
1M
10M
100M
1G
10G
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 7. Insertion Loss vs. Frequency over Supplies (S12 and S21)
Figure 10. Off Isolation vs. Frequency over Temperature (S12 and S21)
Rev. B | Page 6 of 16
ADG901/ADG902
0
–5
40
35
30
25
20
15
10
5
T
V
= 25°C
A
= 2.5V
DD
–10
–15
–20
–25
–30
–35
OFF SWITCH
V
= 2.5V
DD
ON SWITCH
1M
T
= 25°C
A
0
250
10k
100k
10M
100M
1G
10G
350
450
550
650
750
850
FREQUENCY (Hz)
FREQUENCY (MHz)
Figure 11. Return Loss vs. Frequency (S11)
Figure 14. IP3 vs. Frequency
20
18
16
14
12
10
8
CH1
CH2
6
4
V
= 2.5V
= 25°C
DD
2
T
A
0
0
250
500
750
1000
1250
1500
CH1 = CTRL = 1V/DIV
CH2 = RFx = 100mV/DIV
t
= 2.8ns
= 5.1ns
RISE
t
FREQUENCY (MHz)
FALL
Figure 15. P−1dB vs. Frequency
Figure 12. Switch Timing
1
CTRL
RFx
2
CH2 pk-pk
2.016mV
CH1 500mV
CH2 1mV
10.0ns
Figure 13. Video Feedthrough
Rev. B | Page 7 of 16
ADG901/ADG902
TERMINOLOGY
VDD
tFALL
Most positive power supply potential.
Fall time. Time for the RF signal to fall from 90% to 10% of the
on level.
IDD
Positive supply current.
Off Isolation
The attenuation between input and output ports of the switch
when the switch control voltage is in the off condition.
GND
Ground (0 V) reference.
Insertion Loss
CTRL
Logic control input.
The attenuation between input and output ports of the switch
when the switch control voltage is in the on condition.
VINL
P−1 dB
Maximum input voltage for Logic 0.
1 dB compression point. The RF input power level at which the
switch insertion loss increases by 1 dB over its low level value. It
is a measure of how much power the on switch can handle
before the insertion loss increases by 1 dB.
VINH
Minimum input voltage for Logic 1.
IINL (IINH
Input current of the digital input.
)
IP3
Third-order intermodulation intercept. This is a measure of the
power in false tones that occur when closely spaced tones are
passed through a switch, whereby the nonlinearity of the switch
causes these false tones to be generated.
CIN
Digital input capacitance.
tON
Delay between applying the digital control input and the output
switching on.
Return Loss
The amount of reflected power relative to the incident power at
a port. Large return loss indicates good matching. By measuring
return loss the VSWR can be calculated from conversion charts.
voltage standing wave ratio (VSWR) indicates the degree of
matching present at a switch RF port.
tOFF
Delay between applying the digital control input and the output
switching off.
tRISE
Video Feedthrough
Rise time. Time for the RF signal to rise from 10% to 90% of the
on level.
The spurious signals present at the RF ports of the switch when
the control voltage is switched from high to low or low to high
without an RF signal present.
Rev. B | Page 8 of 16
ADG901/ADG902
TEST CIRCUITS
Similar setups for ADG902.
V
V
DD
DD
0.1μF
0.1μF
ADG901
50Ω
V
DD
V
V
DD
OUT
RF1
RF2
50%
50%
V
CTRL
NC
OSCILLOSCOPE
R
RF1
RF2
L
V
S
CTRL
50Ω
10%
90%
V
OUT
50Ω
GND
CTRL
tON
tOFF
GND
V
CTRL
Figure 16. Switching Timing: tON, tOFF
V
DD
0.1μF
Figure 20. Video Feedthrough
V
DD
V
DD
V
OUT
RF2
0.1μF
RF1
50%
50%
V
CTRL
R
L
V
S
90%
90%
RF
CTRL
50
Ω
10%
10%
V
SOURCE
OUT
V
DD
ADG901
GND
SPECTRUM
ANALYZER
COMBINER
RF1
RF2
tRISE
tFALL
50Ω
50Ω
Figure 17. Switch Timing: tRISE, tFALL
RF
SOURCE
V
DD
CTRL
0.1μF
GND
V
CTRL
V
OUT
R
L
V
50
Ω
DD
Figure 21. IP3
ADG901
V
DD
RF1
50Ω
RF2
V
S
0.1μF
50Ω
50Ω
NETWORK
ANALYZER
CTRL
GND
V
DD
ADG901
V
V
OUT
CTRL
RF
SPECTRUM
ANALYZER
OFF ISOLATION = 20 LOG
V
S
SOURCE
RF2
RF1
Figure 18. Off Isolation
V
S
V
50Ω
50Ω
DD
0.1μF
CTRL
GND
V
OUT
R
L
V
CTRL
V
50
Ω
DD
ADG901
Figure 22. P–1 dB
RF1
50Ω
RF2
V
S
50Ω
50Ω
NETWORK
ANALYZER
CTRL
GND
V
OUT
V
INSERTION LOSS = 20 LOG
CTRL
V
S
Figure 19. Insertion Loss
Rev. B | Page 9 of 16
ADG901/ADG902
APPLICATIONS
The ADG901/ADG902 are ideal solutions for low power, high
frequency applications. The low insertion loss, high isolation
between ports, low distortion, and low current consumption of
these parts make them excellent solutions for many high
frequency switching applications.
The ADG902 reflective switch is suitable for applications where
high off port VSWR does not matter and the switch has some
other desired performance feature. It can be used in many
applications, including high speed filter selection. In most cases,
an absorptive switch can be used instead of a reflective switch,
but not vice versa.
Applications include switching between high frequency filters,
ASK generators, and FSK generators.
ABSORPTIVE vs. REFLECTIVE SWITCHES
The ADG901 is an absorptive (matched) switch with
50 Ω terminated shunt legs and the ADG902 is a reflective
switch with 0 Ω terminated shunts to ground. The ADG901
absorptive switch has a good VSWR on each port, regardless of
the switch mode. An absorptive switch should be used when
there is a need for a good VSWR that is looking into the port
but not passing the through signal to the common port. The
ADG901 is therefore ideal for applications that require
minimum reflections back to the RF source. It also ensures that
the maximum power is transferred to the load.
Rev. B | Page 10 of 16
ADG901/ADG902
ADG90x EVALUATION BOARD
The ADG90x evaluation board allows designers to evaluate the
high performance wideband switches with a minimum of effort.
To prove that these devices meet user requirements, the user
requires only a power supply and a network analyzer along with
the evaluation board. An application note is available with the
evaluation board and provides complete information on
operating the evaluation board.
The RF1 port (see Figure 23) is connected through a
50 Ω transmission line to the top left SMA Connector J1. RF2 is
connected through a 50 Ω transmission line to the top SMA
Connector J2. J3 is connected to GND. A through transmission
line connects J4 and J5 and this transmission line is used to
estimate the loss of the PCB over the environmental conditions
being evaluated.
The board is constructed of a 4-layer, FR4 material with
a dielectric constant of 4.3 and an overall thickness of
0.062 inches. Two ground layers with grounded planes
provide ground for the RF transmission lines. The trans-
mission lines were designed using a coplanar waveguide
with ground plane model using a trace width of 0.052 inches,
clearance to ground plane of 0.030 inches, dielectric thickness
of 0.029 inches, and a metal thickness of 0.014 inches.
Figure 23. ADG90x Evaluation Board Top View
Rev. B | Page 11 of 16
ADG901/ADG902
OUTLINE DIMENSIONS
3.20
3.00
2.80
8
1
5
4
5.15
4.90
4.65
3.20
3.00
2.80
PIN 1
0.65 BSC
0.95
0.85
0.75
1.10 MAX
0.80
0.60
0.40
8°
0°
0.15
0.00
0.38
0.22
0.23
0.08
SEATING
PLANE
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-187-AA
Figure 24. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
0.50
0.40
0.30
3.00
BSC SQ
0.60 MAX
8
PIN 1
INDICATOR
1
PIN 1
INDICATOR
1.89
1.74
1.59
2.75
BSC SQ
TOP
VIEW
1.50
REF
0.50
BSC
4
5
1.60
1.45
1.30
0.70 MAX
0.65TYP
12° MAX
0.90 MAX
0.85 NOM
0.05 MAX
0.01 NOM
SEATING
PLANE
0.30
0.23
0.18
0.20 REF
Figure 25. 8-Lead Lead Frame Chip Scale Package [LFCSP]
3 mm × 3 mm Body
(CP-8-2)
Dimensions shown in millimeters
Rev. B | Page 12 of 16
ADG901/ADG902
ORDERING GUIDE
Model
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
Package Option
Branding
W6B
W6B
W6B
S1T
ADG901BRM
8-Lead Mini Small Outline Package [MSOP]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Lead Frame Chip Scale Package [LFCSP]
8-Lead Lead Frame Chip Scale Package [LFCSP]
8-Lead Lead Frame Chip Scale Package [LFCSP]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Lead Frame Chip Scale Package [LFCSP]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Lead Frame Chip Scale Package [LFCSP]
8-Lead Lead Frame Chip Scale Package [LFCSP]
8-Lead Lead Frame Chip Scale Package [LFCSP]
Evaluation Board
RM-8
RM-8
RM-8
RM-8
ADG901BRM-500RL7
ADG901BRM-REEL7
ADG901BRMZ1
ADG901BRMZ-REEL71
ADG901BCP-500RL7
ADG901BCP-REEL7
ADG901BCPZ-REEL7
ADG902BRM
ADG902BRM-500RL7
ADG902BRM-REEL7
ADG902BRMZ1
ADG902BCP-500RL7
ADG902BCP-REEL7
ADG902BCP-REEL7
EVAL-ADG901EB
EVAL-ADG902EB
RM-8
S1T
CP-8-2
CP-8-2
CP-8-2
RM-8
RM-8
RM-8
W6B
W6B
S1T
W7B
W7B
W7B
S1V
W7B
W7B
S1V
RM-8
CP-8-2
CP-8-2
CP-8-2
Evaluation Board
1 Z = Pb-free part.
Rev. B | Page 13 of 16
ADG901/ADG902
NOTES
Preliminary Technical Data
Rev. B | Page 14 of 16
ADG901/ADG902
NOTES
Rev. B | Page 15 of 16
ADG901/ADG902
NOTES
Preliminary Technical Data
©2005 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D03336–0–10/05(B)
Rev. B | Page 16 of 16
相关型号：
ADG902BCP
RF/Microwave Switch, 0 MHz - 2500 MHz RF/MICROWAVE DIVERSITY SWITCH, 1.25 dB INSERTION LOSS, 3 X 3 MM, CSP-8
ADI
ADG902BCPZ-REEL7
0MHz - 2500MHz RF/MICROWAVE DIVERSITY SWITCH, 1.25dB INSERTION LOSS, 3 X 3 MM, LEAD FREE, LFCSP-8
ADI
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