ADN2891ACPZ-RL7 [ADI]
3.3 V, 3.2 Gbps, Limiting Amplifier; 3.3 V ， 3.2 Gbps速率限幅放大器
| 型号： | ADN2891ACPZ-RL7 |
| 厂家： | 
ADI |
| 描述： | 3.3 V, 3.2 Gbps, Limiting Amplifier |
| 文件： | 总16页 (文件大小：606K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
3.3 V, 3.2 Gbps,
Limiting Amplifier
ADN2891
FEATURES
GENERAL DESCRIPTION
Input sensitivity: 4 mV p-p
80 ps rise/fall times
The ADN2891 is a 3.2 Gbps limiting amplifier with integrated
loss-of-signal (LOS) detection circuitry and a received signal
strength indicator (RSSI). This part is optimized for SONET,
Gigabit Ethernet (GbE), and Fibre Channel optoelectronic
conversion applications. The ADN2891 has a differential input
sensitivity of 4 mV p-p and accepts up to a 2.0 V p-p differential
input overload voltage. The ADN2891 supports current mode
logic (CML) outputs with controlled rise and fall times.
CML outputs: 700 mV p-p differential
Programmable LOS detector: 3.5 mV to 35 mV
Rx signal strength indicator (RSSI)
SFF-8472-compliant average power measurement
Single-supply operation: 3.3 V
Low power dissipation: 145 mW
Available in space-saving 3 mm × 3 mm, 16-lead LFCSP
Extended temperature range: −40°C to +95°C
SFP reference design available
By monitoring the bias current through a photodiode, the on-
chip RSSI detector measures the average power received with
2% typical linearity over the entire valid input range of the
photodiode. The on-chip RSSI detector facilitates SFF-8472-
compliant optical transceivers by eliminating the need for
external RSSI detector circuitry.
APPLICATIONS
SFP/SFF/GBIC optical transceivers
OC-3/OC-12/OC-48, GbE, Fibre Channel (FC) receivers
10GBASE-LX4 transceivers
Additional features include a programmable loss-of-signal
(LOS) detector and output squelch.
WDM transponders
The ADN2891 is available in a 3 mm × 3 mm, 16-lead LFCSP.
FUNCTIONAL BLOCK DIAGRAM
AVCC
AVEE
DRVCC DRVEE
DRVCC
ADN2891
50Ω
50Ω
PIN
NIN
OUTP
OUTN
+V
ADN2880
50Ω
50Ω
3kΩ
V
REF
10k
Ω
LOS
PD_VCC
RSSI/LOS
DETECTOR
ADuC7020
RSSI_OUT
PD_CATHODE
CAZ1
CAZ2
THRADJ SQUELCH
0.01μF
Figure 1.
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Fax: 781.461.3113
www.analog.com
©2005 Analog Devices, Inc. All rights reserved.
ADN2891
TABLE OF CONTENTS
Specifications..................................................................................... 3
Loss of Signal (LOS) Detector .................................................. 10
Received Signal Strength Indicator (RSSI) ............................. 10
Squelch Mode ............................................................................. 10
Applications..................................................................................... 11
PCB Design Guidelines ............................................................. 11
Outline Dimensions....................................................................... 13
Ordering Guide .......................................................................... 13
Absolute Maximum Ratings............................................................ 5
Thermal Resistance ...................................................................... 5
ESD Caution.................................................................................. 5
Pin Configuration and Function Descriptions............................. 6
Typical Performance Characteristics ............................................. 7
Theory of Operation ...................................................................... 10
Limiting Amplifier ..................................................................... 10
REVISION HISTORY
7/05—Rev. 0 to Rev. A
Changes to Table 1............................................................................ 3
Changes to Ordering Guide .......................................................... 13
3/05—Revision 0: Initial Version
Rev. A | Page 2 of 16
ADN2891
SPECIFICATIONS
Test Conditions: VCC = 2.9 V to 3.6 V, VEE = 0 V, TA = −40°C to +95°C, unless otherwise noted.
Table 1.
Parameter
Min
Typ
Max
Unit
Test Conditions/Comments
QUANTIZER DC CHARACTERISTICS
Input Voltage Range
Input Common Mode
Differential Input Range
Differential Input Sensitivity
Input Offset Voltage
Input RMS Noise
1.8
2.1
2.8
2.7
2.0
V p-p
V
V p-p
mV p-p
μV
At PIN or NIN, dc-coupled
DC-coupled
AC-coupled
3.2 Gbps, PRBS 223 − 1, BER ≤ 10−10
5.2
3.5
100
235
50
μV rms
Ω
Input Resistance
Single-ended
Input Capacitance
QUANTIZER AC CHARACTERISTICS
Input Data Rate
Small Signal Gain
S11
S22
Random Jitter
Deterministic Jitter
Low Frequency Cutoff
0.65
pF
155
3200
Mb/s
dB
dB
50
Differential
Differential, f < 3.2 GHz
Differential, f < 3.2 GHz
Input ≥ 10 mV p-p, OC-48, PRBS 223 − 1
Input ≥ 10 mV p-p, OC-48, PRBS 223 − 1
CAZ = Open
−10
−10
4.0
9.0
30
dB
6.4
34
ps rms
ps p-p
kHz
kHz
dB
1.0
45
CAZ = 0.0 1 μF
f < 10 MHz
Power Supply Rejection Ratio
LOSS OF SIGNAL DETECTOR (LOS)
LOS Assert Level
1.9
19
2.4
2.75
3.5
35
5.0
5.0
950
62
5.6
53
mV p-p
mV p-p
dB
dB
ns
RTHRADJ = 100 kΩ
RTHRADJ = 1 kΩ
OC-3, PRBS 223 − 1
OC-48, PRBS 223 − 1
DC-coupled
Electrical Hysteresis
LOS Assert Time
LOS De-Assert Time
RSSI
ns
DC-coupled
Input Current Range
RSSI Output Linearity
Gain
5
1000
μA
%
mA/mA
nA
2
1.0
145
5 μA < IIN ≤ 1000 μA
IRSSI/IPD
Difference between measured RSSI output
and PD_CATHODE (input) current of 5 μA
Offset
Compliance Voltage
VCC − 0.9
VCC − 0.4
V
Measured at PD_CATHODE, with I = 5 μA
or I = 1 mA
POWER SUPPLIES
VCC
ICC
2.9
3.3
45
3.6
49
V
mA
°C
OPERATING TEMPERATURE RANGE
CML OUTPUT CHARACTERISTICS
Output Impedance
Output Voltage Swing
Output Rise and Fall Time
−40
+25
+95
TMIN to TMAX
50
660
80
Ω
Single-ended
Differential
20% to 80%
600
850
130
mV p-p
ps
Rev. A | Page 3 of 16
ADN2891
Parameter
Min
Typ
Max
Unit
Test Conditions/Comments
LOGIC INPUTS (SQUELCH)
VIH, Input High Voltage
VIL, Input Low Voltage
Input Current
2.0
V
V
μA
μA
0.8
40
6
IINH, VIN = 2.4 V, 100 kΩ pull-down resistor on-chip
IINL, VIN = 0.4 V, 100 kΩ pull-down resistor on-chip
LOGIC OUTPUTS (LOS)
VOH, Output High Voltage
2.4
V
V
Open drain output, 4.7 kΩ to 10 kΩ
pull-up resistor to VCC
Open drain output, 4.7 kΩ to 10 kΩ
pull-up resistor to VCC
VOL, Output Low Voltage
0.4
Rev. A | Page 4 of 16
ADN2891
ABSOLUTE MAXIMUM RATINGS
Table 2.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Parameter
Rating
Power Supply Voltage
4.2 V
Minimum Voltage
VEE − 0.4 V
(All Inputs and Outputs)
Maximum Voltage
VCC + 0.4 V
(All Inputs and Outputs)
Storage Temperature
−65°C to +150°C
−40°C to +95°C
J-STD-20
Operating Temperature Range
Production Soldering Temperature
Junction Temperature
THERMAL RESISTANCE
θJA is specified for 4-layer PCB with exposed paddle soldered
to GND.
125°C
Table 3.
Package Type
θJA
Unit
3 mm × 3 mm, 16-lead LFCSP
28
°C/W
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. A | Page 5 of 16
ADN2891
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
16 15 14 13
AVCC
PIN
1
2
3
4
12 DRVCC
ADN2891 11 OUTP
TOP VIEW
NIN
10 OUTN
(Not to Scale)
AVEE
9 DRVEE
5
6
7
8
Figure 2. Pin Configuration
Note that the LFCSP has an exposed pad on the bottom. To improve heat dissipation, the exposed pad must be soldered to the GND plane
with filled vias.
Table 4. Pin Function Descriptions
Pin No.
Mnemonic
AVCC
PIN
I/O Type1
Descriptions
1
2
3
4
5
6
P
Analog Power Supply.
AI
AI
P
Differential Data Input, Positive Port, 50 Ω On-Chip Termination.
Differential Data Input, Negative Port, 50 Ω On-Chip Termination.
Analog Ground.
NIN
AVEE
THRADJ
CAZ1
AO
AI
LOS Threshold Adjust Resistor.
If needed, one capacitor can connect between the CAZ1 and CAZ2 pin for
input offset correction.
7
CAZ2
AI
If needed, one capacitor can connect between the CAZ1 and CAZ2 pin for
input offset correction.
8
LOS
DO
P
LOS Detector Output, Open Collector.
Output Buffer Ground.
9
DRVEE
10
11
12
13
14
15
16
OUTN
OUTP
DO
DO
P
Differential Data Output, CML, Negative Port, 50 Ω On-Chip Termination.
Differential Data Output, CML, Positive Port, 50 Ω On-Chip Termination.
Output Buffer Power Supply.
DRVCC
SQUELCH
RSSI_OUT
PD_VCC
PD_CATHODE
Pad
DI
AO
P
Disable Outputs, 100 kΩ On-Chip Pull-Down Resistor.
Average Current Output.
Power Input for RSSI Measurement.
AO
P
Photodiode Bias Voltage.
Exposed
Pad
Connect to Ground.
1 P = power; DI = digital input; DO = digital output; AI = analog input; and AO = analog output.
Rev. A | Page 6 of 16
ADN2891
TYPICAL PERFORMANCE CHARACTERISTICS
50ps/DIV
50ps/DIV
Figure 3. Eye of ADN2891 @ 25°C, 3.2 Gbps, and 10 mV Input
Figure 6. Eye of ADN2891 @ 95°C, 3.2 Gbps, and 500 mV Input
50ps/DIV
1ns/DIV
Figure 4. Eye of ADN2891 @ 25°C, 3.2 Gbps, and 500 mV Input
Figure 7. Eye of ADN2891 @ 25°C, 155 Mbps, and 10 mV Input
50ps/DIV
Figure 5. Eye of ADN2891 @ 95°C, 3.2 Gbps, and 10 mV Input
Rev. A | Page 7 of 16
ADN2891
70
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
60
–40°C
50
40
30
20
10
0
+95°C
+25°C
+95°C
+25°C
DEASSERTION
–40°C
ASSERTION
1k
10k
(Ω)
100k
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
R
DATA RATE (Gbps)
TH
Figure 8. LOS Trip and Release vs. RTH at OC48
Figure 11. Random Jitter vs. Data Rate
8
14
12
10
8
OC48
6
4
2
0
OC3
6
4
2
0
1k
10k
100k
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
DATA RATE (Gbps)
R
(Ω)
TH
Figure 12. Deterministic Jitter vs. Data Rate
Figure 9. LOS Electrical Hysteresis vs. RTH at 25°C
70
60
50
40
30
20
10
0
18
16
14
12
10
8
6
4
2
0
100k
1M
10M
6.0 6.3 6.6 6.9 7.2 7.5 7.8 8.1 8.4 8.7 9.0
ELECTRICAL HYSTERESIS (dB)
SUPPLY-NOISE FREQUENCY (Hz)
Figure 13. PSRR vs. Supply-Noise Frequency
Figure 10. Sample Lot Distribution—Worst-Case Condition:
Conditions = 155 Mbps, 100 kΩ @ 95°C, 3.6 V
Rev. A | Page 8 of 16
ADN2891
1200
1000
800
600
400
200
0
900
800
700
600
500
400
300
200
100
0
–40
–20
0
20
40
60
80
100
1000
120
0
200
400
600
800
1000
1200
TEMPERATURE (°C)
PD_CATHODE CURRENT (PHOTODIODE CURRENT) (μA)
Figure 17. RSSI Offset is the Difference Between Measured RSSI
Output and PD_CATHODE (Input) Current of 5 μA
Figure 14. RSSI Output vs. Average Photodiode Current
5.0
60
50
40
30
20
10
0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
+100°C
+30°C
–40°C
0
200
400
600
800
0
10
20
30
40
50
60
PD_CATHODE CURRENT (μA)
PD_CATHODE CURRENT (PHOTODIODE CURRENT) (μA)
Figure 18. RSSI Linearity % vs. PD_CATHODE Current
Figure 15. RSSI Output vs. Average Photodiode Current (Zoomed)
44.5
44.0
43.5
43.0
42.5
42.0
41.5
41.0
–0.15
–0.20
–0.25
–0.30
–0.35
–0.40
–0.45
–0.50
–0.55
–0.60
–0.65
–0.70
–60
–40
–20
0
20
40
60
80
100
0
100 200 300 400 500 600 700 800 900 1000
TEMPERATURE (°C)
INPUT CURRENT (μA)
Figure 19. ADN2891 ICC Current vs. Temperature
Figure 16. PD_CATHODE Compliance Voltage vs.
Input Current RSSI (Refer to VCC)
Rev. A | Page 9 of 16
ADN2891
THEORY OF OPERATION
LIMITING AMPLIFIER
LOSS OF SIGNAL (LOS) DETECTOR
Input Buffer
The on-chip LOS circuit drives LOS to logic high when the
input signal level falls below a user-programmable threshold.
The threshold level can be set to anywhere from 3.5 mV p-p to
35 mV p-p, typical, and is set by a resistor connected between
the THRADJ pin and VEE. See Figure 8 and Figure 9 for the
LOS threshold vs. THRADJ. The ADN2891 LOS circuit has an
electrical hysteresis greater than 2.5 dB to prevent chatter at the
LOS signal. The LOS output is an open-collector output that
must be pulled up externally with a 4.7 kΩ to 10 kΩ resistor.
The ADN2891 limiting amplifier provides differential inputs
(PIN/NIN), each having single-ended, on-chip, 50 Ω termina-
tion. The amplifier can accept either dc-coupled or ac-coupled
signals; however, an ac-coupled signal is recommended. Using a
dc-coupled signal, the amplifier needs a correct input common-
mode voltage and enough headroom to handle the dynamic
input signal strength. Additionally, TIA output offset drifts may
degrade receiver performance.
RECEIVED SIGNAL STRENGTH INDICATOR (RSSI)
The ADN2891 limiting amplifier is a high gain device. It is
susceptible to dc offsets in the signal path. The pulse width
distortion presented in the NRZ data or a distortion generated
by the TIA may appear as dc offset or a corrupted signal to the
ADN2891 inputs. An internal offset correction loop can
compensate for certain levels of offset. To compensate for more
offset, an external capacitor connected between the CAZ1 and
CAZ2 pins maybe necessary. For GbE and FC applications, no
external capacitor is necessary; however, for SONET appli-
cations, a 0.01 μF capacitor helps the input signal offset
compensation and provides a 3 dB cutoff frequency at 1 kHz.
The ADN2891 has an on-chip, RSSI circuit. By monitoring the
current supplied to the photodiode, the RSSI circuit provides an
accurate, average power measurement. The output of the RSSI is
a current that is directly proportional to the average amount of
PIN photodiode current. Placing a resistor between the
RSSI_OUT pin and GND converts the current to a GND
referenced voltage. This function eliminates the need for
external RSSI circuitry for SFF-8472-compliant optical
receivers. For more information, see Figure 14 to Figure 18.
SQUELCH MODE
CML Output Buffer
Driving the SQUELCH input to logic high disables the limiting
amplifier outputs. Using LOS output to drive the SQUELCH
input, the limiting amplifier outputs stop toggling anytime a
signal input level to the limiting amplifier drops below the
programmed LOS threshold.
The ADN2891 provides differential CML outputs, OUTP and
OUTN. Each output has an internal 50 Ω termination to VCC.
The SQUELCH pin has a 100 kΩ, internal, pull-down resistor.
Rev. A | Page 10 of 16
ADN2891
APPLICATIONS
The exposed pad should connect to the GND plane using filled
vias so that solder does not leak through the vias during reflow.
Using filled vias in parallel under the package greatly reduces
the thermal resistance and enhances the reliability of the
connectivity of the exposed pad to the GND plane during
reflow.
PCB DESIGN GUIDELINES
Proper RF PCB design techniques must be used to ensure
optimal performance.
Output Buffer Power Supply and Ground Planes
Pin 9 (DRVEE) and Pin 12 (DRVCC) are the power supply and
ground pins that provide current to the differential output
buffer. To reduce possible series inductance, Pin 9, which is the
ground return of the output buffer, should connect to ground
directly. If the ground plane is an internal plane and
To reduce power noise, a 10 μF electrolytic decoupling capacitor
between power and ground should be close to where the 3.3 V
supply enters the PCB. The other 0.1 μF and 1 nF ceramic chip
decoupling capacitors should be close to the VCC and VEE pins
to provide better decouple filtering and a shorter current return
loop.
connections to the ground plane are vias, multiple vias in
parallel to ground can reduce series inductance.
Similarly, to reduce the possible series inductance, Pin 12,
which supplies power to the high speed differential
OUTP/OUTN output buffer, should connect to the power plane
directly. If the power plane is an internal plane and connections
to the power plane are vias, multiple vias in parallel can reduce
the series inductance, especially on Pin 12. See Figure 20 for the
recommended connections.
VCC
C9
VCC
RSSI MEASUREMENT
TO ADC
R1
C10
0.1μF
VCC
VCC
C8
C5
C6
16
15
14
13
C7
AVCC
PIN
DRVCC
1
2
3
4
12
11
10
9
ADN2891
C1
C2
OUTP C3
OUTN C4
DRVEE
CONNECT
EXPOSED
PAD TO
GND
TO HOST
BOARD
NIN
ADN2880
AVEE
5
6
7
8
C1–C4, C11: 0.01μF X5R/X7R DIELECTRIC, 0201 CASE
C5, C7, C9, C10, C12: 0.1μF X5R/X7R DIELECTRIC, 0402 CASE
C6, C8: 1nF X5R/X7R DIELECTRIC, 0201 CASE
C11
R3
4.7kΩ TO 10kΩ
ON HOST BOARD
C12
R2
VCC
Figure 20. Typical Applications Circuit (Example of Using PIN PD and On-Chip RSSI Detector)
Rev. A | Page 11 of 16
ADN2891
PCB Layout
As with any high speed, mixed-signal design, keep all high
speed digital traces away from sensitive analog nodes.
Figure 21 shows the recommended PCB layout. The 50 Ω
transmission lines are the traces that bring the high frequency
input and output signals (PIN, NIN, OUTP, and OUTN) to the
SMA connectors with minimum reflection. To avoid a signal
skew between the differential traces, each differential PIN/NIN
and OUTP/OUTN pair should have matched trace lengths from
the signal pins to the corresponding SMA connectors. C1, C2,
C3, and C4 are ac coupling capacitors in series with the high
speed, signal input/output paths. To minimize the possible
mismatch, the ac coupling capacitor pads should be the same
width as the 50 Ω transmission line trace width. To reduce
supply noise, a 1 nF decoupling capacitor should be placed on
the same layer as close as possible to the VCC pins. A 0.1 μF
decoupling capacitor can be placed on the bottom of the PCB
directly underneath the 1 nF capacitor. All high speed, CML
outputs have internal 50 Ω resistor termination between the
output pin and VCC. The high speed inputs, PIN and NIN, also
have the internal 50 Ω termination to an internal reference
voltage.
Soldering Guidelines for the LFCSP
The lands on the 16-lead LFCSP are rectangular. The PCB pad
for these should be 0.1 mm longer than the package land length
and 0.05 mm wider than the package land width. The land
should be centered on the pad. This ensures that the solder joint
size is maximized. The bottom of the LFCSP has a central
exposed pad. The pad on the printed circuit board should be at
least as large as the exposed pad. Users must connect the
exposed pad to VEE using filled vias so that solder does not
leak through the vias during reflow. This ensures a solid
connection from the exposed pad to VEE.
R1, C9, C10 ON BOTTOM
TO ROSA
DOUBLE-VIAS TO REDUCE
INDUCTANCE TO SUPPLY
AND GND
PLACE C5 ON
PLACE C7 ON
BOTTOM OF BOARD
UNDERNEATH C8
BOTTOM OF BOARD
UNDERNEATH C6
1
EXPOSED PAD
C6
C8
C1
C3
PIN
NIN
OUTP
VIAS TO
GND
∼4mm
OUTN
C2
C4
DOUBLE-VIA TO GND
TO REDUCE INDUCTANCE
VIA TO C12, R2
ON BOTTOM
C11
VIA TO BOTTOM
Figure 21. Recommended PCB Layout (Top View)
Rev. A | Page 12 of 16
ADN2891
OUTLINE DIMENSIONS
0.50
0.40
0.30
3.00
BSC SQ
0.60 MAX
PIN 1
INDICATOR
*
1.65
13
12
16
0.45
1
1.50 SQ
1.35
PIN 1
INDICATOR
2.75
BSC SQ
TOP
VIEW
EXPOSED
PAD
(BOTTOM VIEW)
4
9
8
5
0.50
BSC
0.25 MIN
1.50 REF
0.80 MAX
12° MAX
0.65 TYP
0.90
0.85
0.80
0.05 MAX
0.02 NOM
SEATING
PLANE
0.30
0.23
0.18
0.20 REF
*
COMPLIANT TO JEDEC STANDARDS MO-220-VEED-2
EXCEPT FOR EXPOSED PAD DIMENSION.
Figure 22. 16-Lead Lead Frame Chip Scale Package [VQ_LFCSP]
3 mm × 3 mm Body, Very Thin Quad
(CP-16-3)
Dimensions shown in millimeters
ORDERING GUIDE
Model
ADN2891ACPZ-500RL71
ADN2891ACPZ-RL71
ADN2891ACPZ-RL1
EVAL-ADN2891EB
Temperature Range
–40°C to +95°C
–40°C to +95°C
–40°C to +95°C
Package Description
Package Option
CP-16-3
CP-16-3
Branding
F04
F04
16-Lead VQ_LFCSP, 500 pieces
16-Lead VQ_LFCSP, 1,500 pieces
16-Lead VQ_LFCSP, 5,000 pieces
Evaluation Board
CP-16-3
F04
1 Z = Pb-free part.
Rev. A | Page 13 of 16
ADN2891
NOTES
Rev. A | Page 14 of 16
ADN2891
NOTES
Rev. A | Page 15 of 16
ADN2891
NOTES
©
2005 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D05244–0–7/05(A)
Rev. A | Page 16 of 16
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