ADN2915ACPZ [ADI]

Continuous Rate 6.5 Mbps to 11.3 Gbps Clock and Data Recovery IC with Integrated Limiting Amp/EQ;
ADN2915ACPZ
型号: ADN2915ACPZ
厂家: ADI    ADI
描述:

Continuous Rate 6.5 Mbps to 11.3 Gbps Clock and Data Recovery IC with Integrated Limiting Amp/EQ

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Continuous Rate 6.5 Mbps to 11.3 Gbps Clock and  
Data Recovery IC with Integrated Limiting Amp/EQ  
Data Sheet  
ADN2915  
FEATURES  
GENERAL DESCRIPTION  
Serial data input: 6.5 Mbps to 11.3 Gbps  
No reference clock required  
The ADN2915 provides the receiver functions of quantization,  
signal level detect, and clock and data recovery for continuous  
data rates from 6.5 Mbps to 11.3 Gbps. The ADN2915 automati-  
cally locks to all data rates without the need for an external  
reference clock or programming. ADN2915 jitter performance  
exceeds all jitter specifications required by SONET/SDH, including  
jitter transfer, jitter generation, and jitter tolerance.  
Exceeds SONET/SDH requirements for jitter  
transfer/generation/tolerance  
Quantizer sensitivity: 7.3 mV typical (limiting amplifier mode)  
Optional limiting amplifier, equalizer, and bypass inputs  
Programmable jitter transfer bandwidth to support G.8251 OTN  
Programmable slice level  
The ADN2915 provides manual or automatic slice adjust and  
manual sample phase adjusts. Additionally, the user can select a  
limiting amplifier, equalizer, or bypass at the input. The equalizer  
is either adaptive or can be manually set.  
Sample phase adjust (5.65 Gbps or greater)  
Output polarity invert  
Programmable LOS threshold via I2C  
I2C to access optional features  
Loss of signal (LOS) alarm (limiting amplifier mode only)  
Loss of lock (LOL) indicator  
PRBS generator/detector  
The receiver front-end loss of signal (LOS) detector circuit  
indicates when the input signal level has fallen below a user-  
programmable threshold. The LOS detect circuit has hysteresis  
to prevent chatter at the LOS output. In addition, the input  
signal strength can be read through the I2C registers.  
Application-aware power  
430 mW at 11.3 Gbps, equalizer enabled, no clock output  
380 mW at 6.144 Gbps, limiting amplifier mode, no clock  
output  
340 mW at 622 Mbps, input bypass mode, no clock output  
Power supply: 1.2 V, flexible 1.8 V to 3.3 V, and 3.3 V  
4 mm × 4 mm 24-lead LFCSP  
The ADN2915 also supports pseudorandom binary sequence  
(PRBS) generation, bit error detection, and input data rate  
readback features.  
The ADN2915 is available in a compact 4 mm × 4 mm, 24-lead  
chip scale package (LFCSP). All ADN2915 specifications are  
defined over the ambient temperature range of −40°C to +85°C,  
unless otherwise noted.  
APPLICATIONS  
SONET/SDH OC-1/OC-3/OC-12/OC-48/OC-192 and all  
associated FEC rates  
1GFC, 2GFC, 4GFC, 8GFC, 10GFC, 1GE, and 10GE  
WDM transponders  
Any rate regenerators/repeaters  
FUNCTIONAL BLOCK DIAGRAM  
REFCLKP/  
REFCLKN  
(OPTIONAL)  
DATOUTP/  
DATOUTN  
CLKOUTP/  
CLKOUTN  
SCK  
2
SDA  
LOL  
DATA RATE  
2
I C REGISTERS  
I C_ADDR  
FREQUENCY  
ACQUISITION  
AND LOCK  
CML  
CML  
DETECTOR  
CLK  
DDR  
ADN2915  
LOS  
DETECT  
LOS  
FIFO  
SAMPLE  
PHASE  
÷N  
÷2  
ADJUST  
DOWNSAMPLER  
AND LOOP  
FILTER  
DCO  
LA  
DATA  
INPUT  
SAMPLER  
PIN  
NIN  
2
RXD  
BYPASS  
EQ  
RXCK  
50  
50Ω  
CLOCK  
2
PHASE  
I C  
2
I C  
SHIFTER  
V
V
CC  
CM  
FLOAT  
Figure 1.  
Rev. A  
Document Feedback  
Information furnished by Analog Devices is believed to be accurate and reliable. However, no  
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other  
rights of third parties that may result from its use. Specifications subject to change without notice. No  
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.  
Trademarks and registeredtrademarks arethe property of their respective owners.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 781.329.4700 ©2013–2016 Analog Devices, Inc. All rights reserved.  
Technical Support  
www.analog.com  
 
 
 
 
 
ADN2915  
Data Sheet  
TABLE OF CONTENTS  
Features .............................................................................................. 1  
Frequency Acquisition............................................................... 22  
Limiting Amplifier ..................................................................... 22  
Slice Adjust.................................................................................. 22  
Edge Select................................................................................... 22  
Loss of Signal (LOS) Detector .................................................. 23  
Passive Equalizer ........................................................................ 24  
Bypass........................................................................................... 24  
Lock Detector Operation .......................................................... 25  
Harmonic Detector .................................................................... 25  
Output Disable and Squelch ..................................................... 26  
I2C Interface ................................................................................ 26  
Reference Clock (Optional)...................................................... 26  
Additional Features Available via the I2C Interface............... 28  
Input Configurations ................................................................. 30  
DC-Coupled Application .......................................................... 32  
Outline Dimensions....................................................................... 33  
Ordering Guide .......................................................................... 33  
Applications....................................................................................... 1  
General Description......................................................................... 1  
Functional Block Diagram .............................................................. 1  
Revision History ............................................................................... 2  
Specifications..................................................................................... 3  
Jitter Specifications....................................................................... 5  
Output and Timing Specifications............................................. 6  
Timing Diagrams.......................................................................... 8  
Absolute Maximum Ratings............................................................ 9  
Thermal Characteristics .............................................................. 9  
ESD Caution.................................................................................. 9  
Pin Configuration and Function Descriptions........................... 10  
Typical Performance Characteristics ........................................... 11  
I2C Interface Timing and Internal Register Descriptions ......... 14  
Register Map ............................................................................... 15  
Theory of Operation ...................................................................... 20  
Functional Description.................................................................. 22  
REVISION HISTORY  
1/16—Rev. 0 to Rev. A  
Changed NC to DNC.................................................... Throughout  
Changes to Figure 5........................................................................ 10  
Updated Outline Dimensions....................................................... 33  
Changes to Ordering Guide .......................................................... 33  
7/13—Revision 0: Initial Version  
Rev. A | Page 2 of 36  
 
Data Sheet  
ADN2915  
SPECIFICATIONS  
TA = TMIN to TMAX, VCC = VCCMIN to VCCMAX, VCC1 = VCC1MIN to VCC1MAX, VDD = VDDMIN to VDDMAX, VEE = 0 V, input data  
pattern: PRBS 223 − 1, ac-coupled, I2C register default settings, unless otherwise noted.  
Table 1.  
Parameter  
Test Conditions/Comments  
Min  
Typ  
Max  
Unit  
DATA RATE SUPPORT RANGE  
INPUT—DC CHARACTERISTICS  
Peak-to-Peak Differential Input1  
Input Resistance  
0.0065  
11.3  
Gbps  
PIN − NIN  
Differential  
1.0  
105  
V
Ω
95  
100  
BYPASS PATH—CML INPUT  
Input Voltage Range  
Input Common-Mode Level  
At PIN or NIN, dc-coupled, RX_TERM_FLOAT = 1 (float) 0.5  
VCC  
VCC − 0.15  
V
V
DC-coupled (see Figure 39), 600 mV p-p differential,  
RX_TERM_FLOAT = 1 (float)  
0.65  
Differential Input Sensitivity  
OC-192  
AC-coupled, RX_TERM_FLOAT = 0 (VCM = 1.2 V), bit  
error rate (BER) = 1 × 10−10  
Jitter tolerance scrambled pattern (JTSPAT), ac-  
coupled, RX_TERM_FLOAT = 0 (VCM = 1.2 V), BER = 1 ×  
10−12  
200  
200  
mV p-p  
mV p-p  
8GFC2  
LIMITING AMPLIFIER INPUT PATH  
Differential Input Sensitivity  
OC-48  
BER = 1 × 10−10  
7.0  
9.2  
8.3  
11.0  
mV p-p  
mV p-p  
mV p-p  
mV p-p  
OC-192  
8GFC2  
10.3125 Gbps  
BER = 1 × 10−10  
JTSPAT, BER = 1 × 10−12  
JTSPAT, BER = 1 × 10−12  
EQUALIZER INPUT PATH  
Differential Input Sensitivity  
15 inch FR-4, 100 Ω differential transmission line,  
adaptive EQ on  
JTSPAT, BER = 1 × 10−12  
BER = 1 × 10−10  
8GFC2  
OC-192  
115  
184  
mV p-p  
mV p-p  
INPUT—AC CHARACTERISTICS  
S11  
At 7.5 GHz, differential return loss, see Figure 14  
−12  
dB  
LOSS OF SIGNAL DETECT (LOS)  
Loss of Signal Detect  
10  
5
128  
5.7  
135  
110  
mV p-p  
mV p-p  
mV p-p  
dB  
µs  
µs  
Loss of signal minimum program value  
Loss of signal maximum program value  
Hysteresis (Electrical)  
LOS Assert Time  
LOS Deassert Time  
AC-coupled3  
AC-coupled3  
LOSS OF LOCK (LOL) DETECT  
DCO Frequency Error for LOL Assert  
With respect to nominal, data collected in lock to  
reference (LTR) mode  
1000  
ppm  
DCO Frequency Error for LOL Deassert With respect to nominal, data collected in LTR mode  
250  
10  
51  
25  
18  
ppm  
ms  
µs  
µs  
µs  
LOL Assert Response Time  
10.0 Mbps  
2.5 Gbps  
8.5 Gbps, JTSPAT  
10 Gbps  
ACQUISITION TIME  
Lock to Data (LTD) Mode  
10 Mbps  
2.5 Gbps  
8.5 Gbps, JTSPAT  
10 Gbps  
24  
ms  
ms  
ms  
ms  
ms  
0.5  
0.5  
0.5  
6.0  
Optional LTR Mode4  
Rev. A | Page 3 of 36  
 
 
 
ADN2915  
Data Sheet  
Parameter  
Test Conditions/Comments  
Min  
Typ  
Max  
Unit  
DATA RATE READBACK ACCURACY  
5
Coarse Readback  
%
100  
Fine Readback  
In addition to reference clock accuracy  
ppm  
POWER SUPPLY VOLTAGE  
VCC  
VDD  
VCC1  
1.14  
2.97  
1.62  
1.2  
3.3  
1.8  
1.26  
3.63  
3.63  
V
V
V
POWER SUPPLY CURRENT  
VCC  
Limiting amplifier mode, clock output enabled  
1.25 Gbps  
277.1 311.0  
256.2 288.3  
270.1 304.0  
303.1 340.4  
319.1 359.5  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
3.125 Gbps  
4.25 Gbps  
6.144 Gbps  
8GFC,2 JTSPAT  
OC-192  
1.25 Gbps  
3.125 Gbps  
4.25 Gbps  
6.144 Gbps  
8GFC,2 JTSPAT  
OC-192  
1.25 Gbps  
3.125 Gbps  
4.25 Gbps  
333  
377.4  
8.28  
8.21  
8.33  
8.17  
8.1  
VDD  
7.24  
7.21  
7.23  
7.26  
7.20  
7.21  
35.6  
19.0  
22.2  
19.4  
22.2  
35.1  
VCC1  
8.59  
46.8  
24.1  
28.2  
24.6  
28.4  
47.4  
6.144 Gbps  
8GFC,2 JTSPAT  
OC-192  
TOTAL POWER DISSIPATION  
Limiting amplifier mode, clock output enabled  
1.25 Gbps  
420.4  
365.5  
388  
422.5  
446.6  
486.5  
mW  
mW  
mW  
mW  
mW  
mW  
°C  
3.125 Gbps  
4.25 Gbps  
6.144 Gbps  
8GFC,2 JTSPAT  
OC-192  
OPERATING TEMPERATURE RANGE  
1 See Figure 40.  
−40  
+85  
2 Fibre Channel Physical Interface 4 standard, FC-P1-4, Rev 8.00, May 21, 2008.  
3 When ac-coupled, the LOS assert and deassert times are dominated by the RC time constant of the ac coupling capacitor and the 100 Ω differential input termination  
of the ADN2915 input stage.  
4 This typical acquisition specification applies to all selectable reference clock frequencies in the range of 11.05 MHz to 176.8 MHz.  
Rev. A | Page 4 of 36  
Data Sheet  
ADN2915  
JITTER SPECIFICATIONS  
TA = TMIN to TMAX, VCC = VCCMIN to VCCMAX, VCC1 = VCC1MIN to VCC1MAX, VDD = VDDMIN to VDDMAX, VEE = 0 V, input data  
pattern: PRBS 223 − 1, ac-coupled to 100 Ω differential termination load, I2C register default settings, unless otherwise noted.  
Table 2.  
Parameter  
Test Conditions/Comments  
Min  
Typ  
Max  
Unit  
PHASE-LOCKED LOOP CHARACTERISTICS  
Jitter Transfer Bandwidth (BW)1  
OC-192  
TRANBW[2:0] = 3  
1064  
294  
1242  
663  
157  
175  
44  
1650  
529  
1676  
896  
kHz  
kHz  
kHz  
kHz  
kHz  
kHz  
kHz  
OTN mode,2 TRANBW[2:0] = 1  
8GFC3  
OC-48  
TRANBW[2:0] = 4 (default)  
OTN mode,2 TRANBW[2:0] = 1  
181  
OC-12  
OC-3  
Jitter Peaking  
OC-192  
20 kHz to 80 MHz  
20 kHz to 80 MHz  
20 kHz to 10 MHz  
0.014  
0.004  
0.004  
0.01  
0.024  
0.021  
0.023  
dB  
dB  
dB  
dB  
dB  
8GFC3  
OC-48  
OC-12  
OC-3  
0.01  
Jitter Generation  
OC-192  
Unfiltered  
Unfiltered  
Unfiltered  
Unfiltered  
12 kHz to 20 MHz  
Unfiltered  
12 kHz to 20 MHz  
Unfiltered  
12 kHz to 5 MHz  
Unfiltered  
12 kHz to 5 MHz  
Unfiltered  
0.0045  
0.076  
0.005  
0.044  
0.0025  
0.0067 UI rms  
UI p-p  
8GFC3  
OC-48  
UI rms  
UI p-p  
UI rms  
0.0046 UI rms  
UI p-p  
0.0276 UI p-p  
UI rms  
0.0011 UI rms  
UI p-p  
0.0076 UI p-p  
UI rms  
0.0156  
0.0007  
0.0038  
0.0002  
0.0008  
OC-12  
OC-3  
12 kHz to 1.3 MHz  
Unfiltered  
12 kHz to 1.3 MHz  
Unfiltered  
0.0003 UI rms  
UI p-p  
0.0018 UI p-p  
Jitter Tolerance  
OC-192  
TRANBW[2:0] = 4 (default)  
2000 Hz  
20 kHz  
400 kHz  
4 MHz  
4255  
106  
3.78  
0.46  
0.42  
UI p-p  
UI p-p  
UI p-p  
UI p-p  
UI p-p  
80 MHz  
8GFC,3 JTSPAT  
Sinusoidal Jitter at 340 kHz  
Sinusoidal Jitter at 5.098 MHz  
Sinusoidal Jitter at 80 MHz  
Rx Jitter Tracking Test4  
6.7  
0.53  
0.59  
UI p-p  
UI p-p  
UI p-p  
Voltage modulation amplitude (VMA) = 170 mV p-p at 100 MHz,  
425 mV p-p at 100 MHz, 170 mV p-p at 2.5 GHz, and 425 mV p-p  
at 2.5 GHz excitation frequency5  
510 kHz, 1 UI  
100 kHz, 5 UI  
10−12 <10−12  
10−12 <10−12  
BER  
BER  
Rev. A | Page 5 of 36  
 
 
 
 
ADN2915  
Data Sheet  
Parameter  
Test Conditions/Comments  
Min  
Typ  
1528  
378  
16.6  
0.70  
0.63  
193  
Max  
Unit  
OC-48  
600 Hz  
6 kHz  
100 kHz  
1 MHz  
20 MHz  
30 Hz  
300 Hz  
25 kHz  
250 kHz  
5 MHz  
30 Hz  
300 Hz  
6500 Hz  
65 kHz  
1.3 MHz  
UI p-p  
UI p-p  
UI p-p  
UI p-p  
UI p-p  
UI p-p  
UI p-p  
UI p-p  
UI p-p  
UI p-p  
UI p-p  
UI p-p  
UI p-p  
UI p-p  
UI p-p  
OC-12  
OC-3  
44  
19.2  
0.82  
0.60  
50.0  
24.0  
14.4  
0.80  
0.61  
1 Jitter transfer bandwidth is programmable by adjusting TRANBW[2:0] in the DPLLA register (0x10).  
2 Set TRANBW[2:0] = 1 to enter OTN mode. OTN is the optical transport network as defined in ITU G.709.  
3 Fibre Channel Physical Interface 4 standard, FC-P1-4, Rev 8.00, May 21, 2008.  
4 Conditions of FC-P1-4, Rev 8.00, Table 27, 800-DF-EL-S apply.  
5 Must have zero errors during the tests for an interval of time that is ≤10−12 BER to pass the tests.  
OUTPUT AND TIMING SPECIFICATIONS  
TA = TMIN to TMAX, VCC = VCCMIN to VCCMAX, VCC1 = VCC1MIN to VCC1MAX, VDD = VDDMIN to VDDMAX, VEE = 0 V, input data  
pattern: PRBS 223 − 1, ac-coupled to 100 Ω differential termination load, I2C register default settings, unless otherwise noted.  
Table 3.  
Parameter  
Test Conditions/Comments  
Min  
Typ  
Max  
Unit  
CML OUTPUT CHARACTERISTICS  
Data Differential Output Swing  
OC-192, DATA_SWING[3:0] setting = 0xC (default)  
OC-192, DATA_SWING[3:0] setting = 0xF (maximum)  
OC-192, DATA_SWING[3:0] setting = 0x4 (minimum)  
OC-192, CLOCK_SWING[3:0] setting = 0xC (default) 406  
OC-192, CLOCK_SWING[3:0] setting = 0xF (maximum) 448  
OC-192, CLOCK_SWING[3:0] setting = 0x4 (minimum)  
8GFC, DATA_SWING[3:0] setting = 0xC (default)  
8GFC, DATA_SWING[3:0] setting = 0xF (maximum)  
8GFC, DATA_SWING[3:0] setting = 0x4 (minimum  
8GFC, CLOCK_SWING[3:0] setting = 0xC (default)  
8GFC, CLOCK_SWING[3:0] setting = 0xF (maximum)  
535  
668  
189  
600  
724  
219  
508  
583  
217  
600  
725  
214  
518  
603  
213  
672  
771  
252  
570  
659  
249  
666  
778  
245  
588  
680  
245  
VCC  
mV p-p  
mV p-p  
mV p-p  
mV p-p  
mV p-p  
mV p-p  
mV p-p  
mV p-p  
mV p-p  
mV p-p  
mV p-p  
mV p-p  
V
Clock Differential Output Swing  
Data Differential Output Swing  
Clock Differential Output Swing  
162  
540  
662  
190  
426  
489  
8GFC, CLOCK_SWING[3:0] setting = 0x4 (minimum) 166  
VOH, dc-coupled  
Output High Voltage  
Output Low Voltage  
VCC − 0.05  
VCC −  
0.025  
VCC −  
0.325  
VOL, dc-coupled  
VCC − 0.36  
VCC −  
0.29  
V
CML OUTPUT TIMING CHARACTERISTICS  
Rise Time  
20% to 80%, at OC-192, DATOUTN/DATOUTP  
20% to 80%, at OC-192, CLKOUTN/CLKOUTP  
20% to 80%, at 8GFC,1 DATOUTN/DATOUTP  
20% to 80%, at 8GFC,1 CLKOUTN/CLKOUTP  
80% to 20%, at OC-192, DATOUTN/DATOUTP  
20% to 80%, at OC-192, CLKOUTN/CLKOUTP  
80% to 20%, at 8GFC,1 DATOUTN/DATOUTP  
20% to 80%, at 8GFC,1 CLKOUTN/CLKOUTP  
tS (see Figure 2)  
17.4  
22.2  
20.4  
23.1  
17.5  
23.9  
23  
32.6  
28.3  
33.1  
29.7  
33  
29.2  
34.2  
31.3  
0.5  
46.5  
33.1  
44  
35.8  
49.1  
33.7  
46.8  
37.1  
ps  
ps  
ps  
ps  
ps  
ps  
ps  
ps  
UI  
UI  
UI  
UI  
Fall Time  
25  
Setup Time, Full Rate Clock  
Hold Time, Full Rate Clock  
Setup Time, DDR Clock  
Hold Time, DDR clock  
tH (see Figure 2)  
tS (see Figure 3)  
tH (see Figure 3)  
0.5  
0.5  
0.5  
Rev. A | Page 6 of 36  
 
 
 
Data Sheet  
ADN2915  
Parameter  
Test Conditions/Comments  
Min  
2.0  
Typ  
Max  
Unit  
I2C INTERFACE DC CHARACTERISTICS  
Input High Voltage  
LVTTL  
VIH  
V
Input Low Voltage  
VIL  
0.8  
V
Input Current  
VIN = 0.1 × VDD or VIN = 0.9 × VDD  
VOL, IOL = 3.0 mA  
−10.0  
+10.0  
0.4  
µA  
V
Output Low Voltage  
I2C INTERFACE TIMING  
SCK Clock Frequency  
SCK Pulse Width High  
SCK Pulse Width Low  
Start Condition Hold Time  
Start Condition Setup Time  
Data Setup Time  
Data Hold Time  
SCK/SDA Rise/Fall Time  
Stop Condition Setup Time  
Bus Free Time Between Stop and  
Start Conditions  
See Figure 24  
400  
kHz  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tHIGH  
tLOW  
600  
1300  
600  
600  
100  
300  
20 + 0.1 Cb  
600  
tHD;STA  
tSU;STA  
tSU;DAT  
tHD;DAT  
tR/tF  
2
300  
tSU;STO  
tBUF  
1300  
LVTTL DC INPUT CHARACTERISITICS  
(I2C_ADDR)  
Input Voltage  
High  
Low  
Input Current  
High  
Low  
VIH  
VIL  
2.0  
−5  
2.4  
V
V
0.8  
+5  
IIH, VIN = 2.4 V  
IIL, VIN = 0.4 V  
µA  
µA  
LVTTL DC OUTPUT CHARACTERISITICS  
(LOS/LOL)  
Output Voltage  
High  
Low  
VOH, IOH = +2.0 mA  
VOL, IOL = −2.0 mA  
Optional LTR mode  
VCM (no input offset, no input current),  
see Figure 32, ac-coupled input  
V
V
0.4  
1.0  
REFERENCE CLOCK CHARACTERISTICS  
Input Compliance Voltage (Single-  
Ended)  
0.55  
V
Minimum Input Drive  
Reference Frequency  
Required Accuracy3  
See Figure 32, ac-coupled, differential input  
100  
100  
mV p-p diff  
MHz  
ppm  
11.05  
176.8  
AC-coupled, differential input  
1 Fibre Channel Physical Interface 4 standard, FC-P1-4, Rev 8.00, May 21, 2008.  
2 Cb is the total capacitance of one bus line in picofarads (pF). If mixed with high speed (HS) mode devices, faster rise/fall times are allowed (refer to the Philips  
I2C Bus Specification, Version 2.1).  
3 Required accuracy in dc-coupled mode is guaranteed by design as long as the clock common-mode voltage output matches the reference clock common-  
mode voltage range.  
Rev. A | Page 7 of 36  
 
ADN2915  
Data Sheet  
TIMING DIAGRAMS  
CLKOUTP  
tH  
tS  
DATOUTP/  
DATOUTN  
Figure 2. Data to Clock Timing (Full Rate Clock Mode)  
CLKOUTP  
tS  
tH  
DATOUTP/  
DATOUTN  
Figure 3. Data to Clock Timing (Half-Rate Clock/DDR Mode)  
DATOUTP  
DATOUTN  
V
SE  
V
SE  
V
DIFF  
0V  
DATOUTP – DATOUTN  
Figure 4. Single-Ended vs. Differential Output Amplitude Relationship  
Rev. A | Page 8 of 36  
 
 
 
Data Sheet  
ADN2915  
ABSOLUTE MAXIMUM RATINGS  
Table 4.  
THERMAL CHARACTERISTICS  
Thermal Resistance  
Parameter  
Rating  
1.26 V  
3.63 V  
1.26 V  
Thermal resistance is specified for the worst-case conditions,  
that is, a device soldered in a circuit board for surface-mount  
packages, for a 4-layer board with the exposed paddle soldered  
to VEE.  
Supply Voltage (VCC = 1.2 V)  
Supply Voltage (VDD and VCC1 = 3.3 V)  
Maximum Input Voltage (REFCLKP/REFCLKN,  
NIN/PIN)  
Minimum Input Voltage (REFCLKP/REFCLKN,  
NIN/PIN)  
Maximum Input Voltage (SDA, SCK,  
I2C_ADDR)  
VEE – 0.4 V  
3.63 V  
Table 5. Thermal Resistance  
Package Type θJA  
24-Lead LFCSP 45  
1
2
3
θJB  
θJC  
Unit  
5
11  
°C/W  
Minimum Input Voltage (SDA, SCK,  
I2C_ADDR)  
Maximum Junction Temperature  
Storage Temperature Range  
VEE − 0.4 V  
1 Junction to ambient.  
2 Junction to base.  
3 Junction to case.  
125°C  
−65°C to +150°C  
300°C  
ESD CAUTION  
Lead Temperature (Soldering, 10 sec)  
Stresses at or above those listed under Absolute Maximum  
Ratings may cause permanent damage to the product. This is a  
stress rating only; functional operation of the product at these  
or any other conditions above those indicated in the operational  
section of this specification is not implied. Operation beyond  
the maximum operating conditions for extended periods may  
affect product reliability.  
Rev. A | Page 9 of 36  
 
 
 
ADN2915  
Data Sheet  
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS  
PIN 1  
INDICATOR  
VCC  
18  
17  
16  
15  
14  
13  
1
VCC  
PIN 2  
NIN 3  
VDD  
DNC  
ADN2915  
TOP VIEW  
VEE  
LOS  
LOL  
4
5
6
DATOUTP  
DATOUTN  
VCC  
(Not to Scale)  
NOTES  
1. DNC = DO NOT CONNECT.  
2. EXPOSED PADDLE ON BOTTOM OF DEVICE  
PACKAGE MUST BE CONNECTED TO VEE  
ELECTRICALLY.  
Figure 5. Pin Configuration  
Table 6. Pin Function Descriptions  
Pin No. Mnemonic Type1 Description  
1
VCC  
P
1.2 V Supply for Limiting Amplifier.  
2
3
4
5
6
7
8
9
PIN  
NIN  
VEE  
LOS  
LOL  
VEE  
VCC1  
VDD  
AI  
AI  
P
DO  
DO  
P
Positive Differential Data Input (CML).  
Negative Differential Data Input (CML).  
Ground for Limiting Amplifier.  
Loss of Signal Output (Active High).  
Loss of Lock Output (Active High).  
Digital Control Oscillator (DCO) Ground.  
1.8 V to 3.3 V DCO Supply.  
P
P
3.3 V High Supply.  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
CLKOUTN  
CLKOUTP  
VEE  
DO  
DO  
P
Negative Differential Recovered Clock Output (CML).  
Positive Differential Recovered Clock Output (CML).  
Ground for CML Output Drivers.  
1.2 V Supply for CML Output Drivers.  
Negative Differential Retimed Data Output (CML).  
Positive Differential Retimed Data Output (CML).  
Do Not Connect. Tie off to ground.  
3.3 V High Supply.  
VCC  
P
DATOUTN  
DATOUTP  
DNC  
VDD  
VCC  
SCK  
SDA  
VCC  
I2C_ADDR  
DO  
DO  
DI  
P
P
1.2 V Core Digital Supply.  
DI  
DIO  
P
Clock for I2C.  
Bidirectional Data for I2C.  
1.2 V Core Supply.  
DI  
Sets the device I2C address = 0x80 when I2C_ADDR = 0, and the device I2C address = 0x82 when  
I2C_ADDR = 1.  
23  
24  
REFCLKN  
REFCLKP  
EPAD  
DI  
DI  
P
Negative Reference Clock Input (Optional).  
Positive Reference Clock Input (Optional).  
Exposed Pad (VEE). The exposed pad on the bottom of the device package must be connected to VEE  
electrically. The exposed pad works as a heat sink.  
1 P = power, AI = analog input, DI = digital input, DO = digital output, DIO = digital input/output.  
Rev. A | Page 10 of 36  
 
Data Sheet  
ADN2915  
TYPICAL PERFORMANCE CHARACTERISTICS  
TA = 25°C, VCC = 1.2 V, VCC1 = 1.8 V, VDD = 3.3 V, VEE = 0 V, input data pattern: PRBS 215 − 1, ac-coupled inputs and outputs,  
unless otherwise noted.  
16.8ps/DIV  
66.9ps/DIV  
Figure 6. Output Eye Diagram at OC-192  
Figure 9. Output Eye Diagram at OC-48  
5
0
1k  
100  
10  
XFP MASK  
ADN2915 TOLERANCE  
–5  
–10  
–15  
–20  
–25  
–30  
–35  
–40  
–45  
1
SONET REQUIREMENT MASK  
0.1  
0.01  
1k  
10k  
100k  
1M  
10M  
100M  
100  
1k  
10k  
100k  
1M  
10M  
100M  
FREQUENCY (Hz)  
JITTER FREQUENCY (Hz)  
Figure 7. Jitter Tolerance: OC-192  
Figure 10. Jitter Transfer: OC-192 (TRANBW[2:0] = 3)  
5
0
1k  
100  
10  
ADN2915  
EQUIPMENT LIMIT  
SONET MASK  
SONET MASK  
–5  
–10  
–15  
–20  
–25  
1
0.1  
1k  
10k  
100k  
1M  
10M  
100M  
10  
100  
1k  
10k  
100k  
1M  
10M  
100M  
FREQUENCY (Hz)  
JITTER FREQUENCY (Hz)  
Figure 11. Jitter Transfer: OC-48  
Figure 8. Jitter Tolerance: OC-48  
Rev. A | Page 11 of 36  
 
ADN2915  
Data Sheet  
5
0
1k  
ADN2915  
EQUIPMENT LIMIT  
SONET MASK  
SONET MASK  
–5  
100  
10  
1
–10  
–15  
–20  
–25  
–30  
–35  
–40  
–45  
0.1  
10  
1k  
10k  
100k  
1M  
10M  
100  
1k  
10k  
100k  
1M  
10M  
FREQUENCY (Hz)  
JITTER FREQUENCY (Hz)  
Figure 12. Jitter Tolerance: OC-12  
Figure 15. Jitter Transfer: OC-12  
5
0
100  
10  
1
ADN2915  
EQUIPMENT LIMIT  
SONET MASK  
SONET MASK  
–5  
–10  
–15  
–20  
–25  
–30  
–35  
–40  
–45  
0.1  
10  
500  
5k  
50k  
FREQUENCY (Hz)  
500k  
5M  
100  
1k  
10k  
100k  
1M  
10M  
JITTER FREQUENCY (Hz)  
Figure 13. Jitter Tolerance: OC-3  
Figure 16. Jitter Transfer: OC-3  
12  
10  
8
0
–5  
–10  
–15  
–20  
–25  
–30  
–35  
6
4
2
0
–40  
1M  
10M  
100M  
1G  
10G  
100G  
FREQUENCY (Hz)  
DATA RATE (Gbps)  
Figure 14. Typical S11 Spectrum Performance  
Figure 17. Sensitivities of SONET/SDH Data Rates (BER = 10−10  
)
Rev. A | Page 12 of 36  
 
Data Sheet  
ADN2915  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
16  
14  
12  
10  
8
6
TYPICAL  
ADAPTIVE EQ  
SETTING  
4
2
0
0
2
4
6
8
10  
12  
14  
16  
EQ SETTING  
DATA RATE (Gbps)  
Figure 18. BER in Equalizer Mode vs. EQ Compensation at OC-192  
(Measured with a OC-192 Signal of 400 mV p-p diff, on 15-Inch FR4 Traces,  
with Variant EQ Compensation, Including Adaptive EQ)  
Figure 19. Sensitivities of Non-SONET/SDH Data Rates (BER = 10−12  
)
Rev. A | Page 13 of 36  
ADN2915  
Data Sheet  
I2C INTERFACE TIMING AND INTERNAL REGISTER DESCRIPTIONS  
R/W  
CTRL.  
SLAVE ADDRESS[6:0]  
1
0
0
0
0
0
x
x
MSB = 1  
SET BY 0 = W  
PIN 22 1 = R  
Figure 20. Slave Address Configuration  
S
SLAVE ADDR, LSB = 0 (W) A(S) SUBADDR A(S) DATA A(S)  
DATA A(S)  
P
Figure 21. I2C Write Data Transfer  
S
SLAVE ADDR, LSB = 0 (W) A(S) SUBADDR A(S)  
S
SLAVE ADDR, LSB = 1 (R) A(S) DATA A(M)  
DATA A(M) P  
S = START BIT  
P = STOP BIT  
A(M) = NO ACKNOWLEDGE BY MASTER  
A(S) = ACKNOWLEDGE BY SLAVE  
A(M) = ACKNOWLEDGE BY MASTER  
Figure 22. I2C Read Data Transfer  
START BIT  
STOP BIT  
SLAVE ADDRESS  
SUBADDRESS  
DATA  
SDA  
SCK  
A6  
A5  
A7  
A0  
D7  
D0  
S
P
WR  
ACK  
ACK  
ACK  
SLAVE ADDR[4:0]  
SUBADDR[6:1]  
DATA[6:1]  
Figure 23. I2C Data Transfer Timing  
tF  
tSU;DAT  
tHD;STA  
tBUF  
tR  
SDA  
SCK  
tSU;STO  
tR  
tF  
tLOW  
tHIGH  
tHD;STA  
tSU;STA  
S
S
P
S
tHD;DAT  
Figure 24. I2C Interface Timing Diagram  
Rev. A | Page 14 of 36  
 
 
 
 
 
 
Data Sheet  
ADN2915  
REGISTER MAP  
Writing to register bits other than those clearly labeled is not recommended and may cause unintended results.  
Table 7. Internal Register Map  
Addr  
R/W (Hex) (Hex)  
Readback/Status  
Default  
Reg Name  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
FREQMEAS0  
FREQMEAS1  
FREQMEAS2  
FREQ_RB1  
FREQ_RB2  
STATUSA  
R
R
R
R
R
R
0x0  
0x1  
0x2  
0x4  
0x5  
0x6  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
FREQ0[7:0] (RATE_FREQ[7:0])  
FREQ1[7:0] (RATE_FREQ[15:8])  
FREQ2[7:0] (RATE_FREQ[23:16])  
VCOSEL[7:0]  
FULLRATE  
DIVRATE[3:0]  
VCOSEL[9:8]  
LOS  
status  
LOL  
LOS done  
Static LOL  
RATE_  
MEAS_  
COMP  
status  
General Control  
CTRLA  
CTRLB  
CTRLC  
R/W 0x8  
R/W 0x9  
R/W 0xA  
0x00  
0x00  
0x05  
0
CDR_MODE[2:0]  
0
Reset static  
LOL  
RATE_  
MEAS_  
EN  
RATE_MEAS_  
RESET  
SOFTWARE_ INIT_  
RESET  
CDR  
LOL config  
LOS PDN  
0
LOS polarity  
0
0
1
FREQ_  
ACQ  
bypass  
0
0
0
0
REFCLK_  
PDN  
0
FLL Control  
LTR_MODE  
D/PLL Control  
DPLLA  
R/W 0xF  
0x00  
0
LOL data  
FREF_RANGE[1:0]  
DATA_TO_REF_RATIO[3:0]  
TRANBW[2:0]  
R/W 0x10  
R/W 0x13  
0x1C  
0x06  
0
0
0
0
0
0
EDGE_SEL[1:0]  
DPLLD  
0
0
0
ADAPTIVE_  
SLICE_EN  
DLL_SLEW[1:0]  
Phase  
Slice  
R/W 0x14  
0x00  
N/A  
0
0
0
SAMPLE_PHASE[3:0]  
W
0x15  
Extended  
slice  
Slice[6:0]  
LA_EQ  
R/W 0x16  
0x08  
N/A  
RX_  
TERM_  
FLOAT  
INPUT_SEL[1:0]  
ADAPTIVE_  
EQ_EN  
EQ_BOOST[3:0]  
Slice  
R
0x73  
SLICE_RB[7:0]  
Readback  
Output Control  
OUTPUTA  
R/W 0x1E  
R/W 0x1F  
0x00  
0xCC  
0
0
Data  
DATOUT_  
CLKOUT_  
DISABLE  
DDR_  
DISABLE  
DATA_  
POLARITY POLARITY  
CLOCK_  
squelch DISABLE  
OUTPUTB  
DATA_SWING[3:0]  
CLOCK_SWING[3:0]  
LOS Control  
LOS_DATA  
LOS_CTRL  
R/W 0x36  
R/W 0x74  
0x00  
0x00  
LOS_DATA[7:0]  
0
0
0
0
LOS_  
WRITE  
LOS_  
LOS_  
RESET  
LOS_ADDRESS[2:0]  
ENABLE  
LOS_THRESH  
PRBS Control  
PRBS Gen 1  
R/W 0x38  
R/W 0x39  
0x0A  
0x00  
LOS_THRESHOLD[7:0]  
DATA_  
CID_  
BIT  
DATA_  
CID_  
EN  
0
DATA_  
GEN_  
EN  
DATA_GEN_MODE[1:0]  
PRBS Gen 2  
PRBS Gen 3  
PRBS Gen 4  
PRBS Gen 5  
PRBS Gen 6  
PRBS Rec 1  
R/W 0x3A  
R/W 0x3B  
R/W 0x3C  
R/W 0x3D  
R/W 0x3E  
R/W 0x3F  
0x00  
0x00  
0x00  
0x00  
0x00  
0x00  
DATA_CID_LENGTH[7:0]  
PROG_DATA[7:0]  
PROG_DATA[15:8]  
PROG_DATA[23:16]  
PROG_DATA[31:24]  
DATA_  
0
0
0
0
DATA_  
DATA_RECEIVER_  
MODE[1:0]  
RECEIVER_ RECEIVER_  
CLEAR  
ENABLE  
PRBS Rec 2  
PRBS Rec 3  
R
R
0x40  
0x41  
0x00  
0x00  
PRBS_ERROR_COUNT[7:0]  
PRBS_ERROR  
Rev. A | Page 15 of 36  
 
 
ADN2915  
Data Sheet  
Addr  
Default  
Reg Name  
R/W (Hex) (Hex)  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
PRBS Rec 4  
PRBS Rec 5  
PRBS Rec 6  
PRBS Rec 7  
ID/Revision  
REV  
R
0x42  
0x43  
0x44  
0x45  
N/A  
N/A  
N/A  
N/A  
DATA_LOADED[7:0]  
DATA_LOADED[15:8]  
DATA_LOADED[23:16]  
DATA_LOADED[31:24]  
R
R
R
R
R
0x48  
0x49  
0x54  
0x15  
Rev[7:0]  
ID[7:0]  
ID  
Table 8. Status Register, STATUSA (Address 0x6)  
Bits  
Bit Name  
Bit Description  
0 = no loss of signal  
1 = loss of signal  
0 = locked  
1 = frequency acquisition mode  
0 = LOS action not completed  
1 = LOS action completed  
0 = no LOL event since last reset  
1 = LOL event since last reset; clear by CTRLA[2]  
Rate measurement complete  
D5  
LOS status  
D4  
D3  
D2  
D0  
LOL status  
LOS done  
Static LOL  
RATE_MEAS_COMP  
0 = frequency measurement incomplete  
1 = frequency measurement complete; clear by CTRLA[0]  
Table 9. Control Register, CTRLA (Address 0x8)  
Bits  
Bit Name  
Bit Description  
D7  
Reserved to 0.  
D6:D4  
CDR_MODE[2:0]  
CDR modes.  
000 = lock to data (LTD).  
010 = lock to reference (LTR).  
001, 011 = reserved.  
Reserved to 0.  
Set to 1 to clear static LOL.  
Fine data rate measurement enable. Set to 1 to initiate a rate measurement.  
Rate measurement reset. Set to 1 to clear a rate measurement.  
D3  
D2  
D1  
D0  
Reset static LOL  
RATE_MEAS_EN  
RATE_MEAS_RESET  
Table 10. Control Register, CTRLB (Address 0x9)  
Bits  
Bit Name  
Bit Description  
D7  
D6  
SOFTWARE_RESET  
INIT_FREQ_ACQ  
Software reset. Write a 1 followed by a 0 to reset the part.  
Initiate frequency acquisition. Write a 1 followed by a 0 to initiate a frequency acquisition  
(optional).  
D5  
CDR bypass  
LOL config  
LOS PDN  
CDR bypass.  
0 = CDR enabled.  
1 = CDR bypassed.  
LOL configuration.  
0 = normal LOL.  
1 = static LOL.  
LOS power-down.  
0 = normal LOS.  
D4  
D3  
1 = LOS powered down.  
LOS polarity.  
D2  
LOS polarity  
0 = active high LOS pin.  
1 = active low LOS pin.  
Reserved to 0.  
D1:D0  
Rev. A | Page 16 of 36  
Data Sheet  
ADN2915  
Table 11. Control Register, CTRLC (Address 0xA)  
Bits  
D7:D3  
D2  
Bit Name  
Bit Description  
Reserved to 0.  
REFCLK_PDN  
Reference clock power-down. Write a 0 to enable the reference clock.  
D1  
D0  
Reserved to 0.  
Reserved to 1.  
Table 12. Lock to Reference Clock Mode Programming Register, LTR_MODE1 (Address 0xF)  
Bits  
Bit Name  
Bit Description  
D7  
Reserved to 0.  
D6  
LOL data  
LOL data  
0 = CLK vs. reference clock during tracking  
1 = CLK vs. data during tracking  
fREF range  
00 = 11.05 MHz to 22.1 MHz  
01 = 22.1 MHz to 44.2 MHz  
10 = 44.2 MHz to 88.4 MHz  
11 = 88.4 MHz to 176.8 MHz  
Data to reference ratio  
0000 = 1/2  
D5:D4  
D3:D0  
FREF_RANGE[1:0]  
DATA_TO_REF_RATIO  
0001 = 1  
0010 = 2  
N = 2(n − 1)  
1010 = 512  
1 Where DIV_fREF is the divided down reference referred to the 11.05 MHz to 22.1 MHz band (see the Reference Clock (Optional) section).  
Data Rate/2(LTR_MODE[3:0] − 1) = REFCLK/2LTR_MODE[5:4]  
Table 13. D/PLL Control Register, DPLLA (Address 0x10)  
Bits  
Bit Name  
Bit Description  
D7:D5  
D4:D3  
Reserved to 0.  
EDGE_SEL[1:0]  
Edge for phase detection. See the Edge Select section for further details.  
00 = rising and falling edge data.  
01 = rising edge data.  
10 = falling edge data.  
11 = rising and falling edge data.  
D2:D0  
TRANBW[2:0]  
Transfer bandwidth. Scales transfer bandwidth. Default value is 4, resulting in the OC-192  
default BW shown in Table 2. See the Transfer Bandwidth section for further details.  
Transfer BW = Default BW × (TRANBW[2:0]/4)  
Table 14. D/PLL Control Register, DPLLD (Address 0x13)  
Bits  
Bit Name  
Bit Description  
D7:D3  
D2  
D1:D0  
Reserved to 0.  
ADAPTIVE_SLICE_EN  
DLL_SLEW[1:0]  
Adaptive slice enable.1 = enables automatic slice adjust.  
DLL slew. Sets the BW of the DLL. See the DLL Slew section for further details.  
Table 15. Phase Control Register, Phase (Address 0x14)  
Bits  
Bit Name  
Bit Description  
D7:D4  
D3:D0  
Reserved to 0.  
SAMPLE_PHASE[3:0]  
Adjust the phase of the sampling instant for data rates above 5.65 Gbps in steps of 1/32 UI. This  
register is in twos complement notation. See the Sample Phase Adjust section for further details.  
Rev. A | Page 17 of 36  
ADN2915  
Data Sheet  
Table 16. Slice Level Control Register, Slice (Address 0x15)  
Bits  
Bit Name  
Bit Description  
D7  
Extended slice  
Extended slice enable.  
0 = normal slice mode.  
1 = extended slice mode.  
D6:D0  
Slice[6:0]  
Slice. Slice is a digital word that sets the input threshold. See the Slice Adjust section for further  
details. When Slice[6:0] = 0000000, the slice function is disabled.  
Table 17. Input Stage Programming Register, LA_EQ (Address 0x16)  
Bits  
Bit Name  
Bit Description  
D7  
RX_TERM_FLOAT  
Rx termination float.  
0 = termination common-mode driven.  
1 = termination common-mode floated.  
D6:D5  
INPUT_SEL[1:0]  
Input stage select.  
00: limiting amplifier.  
01: equalizer.  
10: 0 dB buffer.  
11: undefined.  
D4  
ADAPTIVE_EQ_EN  
EQ_BOOST[3:0]  
Enable adaptive EQ.  
0 = manual EQ control.  
1 = adaptive EQ enabled.  
Equalizer gain. These bits set the EQ gain. See the Passive Equalizer section for further details.  
D3:D0  
Table 18. Output Control Register, OUTPUTA (Address 0x1E)  
Bits  
D7:D6  
D5  
Bit Name  
Bit Description  
Reserved to 0.  
Squelch  
Data squelch  
0 = normal data  
1 = squelch data  
D4  
D3  
D2  
D1  
D0  
DATOUT_DISABLE  
CLKOUT_DISABLE  
DDR_DISABLE  
Data output disable  
0 = data output enabled  
1 = data output disabled  
Clock output disable  
0 = clock output enabled  
1 = clock output disabled  
Double data rate  
0 = DDR clock enabled  
1 = DDR clock disabled  
Data polarity  
DATA_POLARITY  
CLOCK_POLARITY  
0 = normal data polarity  
1 = flip data polarity  
Clock polarity  
0 = normal clock polarity  
1 = flip clock polarity  
Rev. A | Page 18 of 36  
Data Sheet  
ADN2915  
Table 19. Output Swing Register, OUTPUTB (Address 0x1F)  
Bits  
Bit Name  
Bit Description  
D7:D4  
DATA_SWING[3:0]  
Adjust data output amplitude. Step size is approximately 50 mV differential.  
Default register value is 0xC. Typical differential data output amplitudes are  
0x1 = invalid.  
0x2 = invalid.  
0x3 = invalid.  
0x4 = 200 mV.  
0x5 = 250 mV.  
0x6 = 300 mV.  
0x7 = 345 mV.  
0x8 = 390 mV.  
0x9 = 440 mV.  
0xA = 485 mV.  
0xB = 530 mV.  
0xC = 575 mV.  
0xD = 610 mV.  
0xE = 640 mV.  
0xF = 655 mV.  
D3:D0  
CLOCK_SWING[3:0]  
Adjust clock output amplitude. Step size is approximately 50 mV differential.  
Default register value is 0xC. Typical differential clock output amplitudes are  
0x1 = invalid.  
0x2 = invalid.  
0x3 = invalid.  
0x4 = 200 mV.  
0x5 = 250 mV.  
0x6 = 300 mV.  
0x7 = 345 mV.  
0x8 = 390 mV.  
0x9 = 440 mV.  
0xA = 485 mV.  
0xB = 530 mV.  
0xC = 575 mV.  
0xD = 610 mV.  
0xE = 640 mV.  
0xF = 655 mV.  
Rev. A | Page 19 of 36  
ADN2915  
Data Sheet  
THEORY OF OPERATION  
The ADN2915 implements a clock and data recovery for data  
rates between 6.5 Mbps and 11.3 Gbps. A front end is configurable  
to either amplify or equalize the nonreturn-to-zero (NRZ) input  
waveform to full-scale digital logic levels, or to bypass a full  
digital logic signal.  
frequency components of jitter. The initial frequency of the  
DCO is set by a third loop that compares the DCO frequency  
with the input data frequency. This third loop also sets the  
decimation ratio of the digital downsampler.  
The delay-locked and phase-locked loops together track the  
phase of the input data. For example, when the clock lags the  
input data, the phase detector drives the DCO to higher  
frequency and decreases the delay of the clock through the  
phase shifter; both of these actions serve to reduce the phase  
error between the clock and data. Because the loop filter is an  
integrator, the static phase error is driven to zero.  
The user can choose among three input stages to process the  
data: a high gain limiting amplifier with better than 10 mV  
sensitivity, a high-pass passive equalizer with up to 10 dB of  
boost at 5 GHz, or a bypass buffer with 600 mV sensitivity.  
An on-chip loss of signal (LOS) detector works with the high  
sensitivity limiting amplifier. The default threshold for the LOS is  
the sensitivity of the part, with a maximum threshold level of  
128 mV p-p. The limiting amplifier slice threshold can use a  
factory trim setting, a user-defined threshold set by the I2C, or  
an adjusted level for the best eye opening at the phase detector.  
Another view of the circuit is that the phase shifter implements  
the zero required for frequency compensation of a second-order  
phase-locked loop, and this zero is placed in the feedback path  
and, thus, does not appear in the closed-loop transfer function.  
Because this circuit has no zero in the closed-loop transfer, jitter  
peaking is eliminated.  
When the input signal is corrupted due to FR-4 or other  
impairments in the PCB traces, a passive equalizer can be one  
of the signal integrity options. The equalizer high frequency  
boost is configurable through the I2C registers, in place of the  
factory default settings. A user-enabled adaptation is included  
that automatically adjusts the equalizer to achieve the widest  
eye opening. The equalizer can be manually set for any data  
rate, but adaptation is available only at data rates greater than  
5.5 Gbps.  
The delay-locked and phase-locked loops, together, simultane-  
ously provide wideband jitter accommodation and narrow-band  
jitter filtering. The simplified block diagram in Figure 25 shows  
that Z(s)/X(s) is a second-order low-pass jitter transfer function  
that provides excellent filtering. The low frequency pole is  
formed by dividing the gain of the PLL by the gain of the DLL,  
where the upsampling and zero-order hold in the DLL has a gain  
approaching N at the transfer bandwidth of the loop. Note that  
the jitter transfer has no zero, unlike an ordinary second-order  
phase-locked loop. This means that the main PLL loop has no  
jitter peaking. This makes the circuit ideal for signal regenerator  
applications, where jitter peaking in a cascade of regenerators  
can contribute to hazardous jitter accumulation.  
When a signal presents to the clock and data recovery (CDR), the  
ADN2915 is a delay-locked and phase-locked loop circuit for  
clock recovery and data retiming from an NRZ encoded data  
stream. Input data is sampled by a high speed clock. A digital  
downsampler accommodates data rates spanning three orders of  
magnitude. Downsampled data is applied to a binary phase  
detector.  
The error transfer, e(s)/X(s), has the same high-pass form as an  
ordinary phase-locked loop up to the slew rate limit of the DLL  
with a binary phase detector. This transfer function is free to be  
optimized to give excellent wideband jitter accommodation  
because the jitter transfer function, Z(s)/X(s), provides the  
narrow-band jitter filtering.  
The phase of the input data signal is tracked by two separate feed-  
back loops. A high speed delay-locked loop path cascades a  
digital integrator with a digitally controlled phase shifter on  
the digital control oscillator (DCO) clock to track the high  
frequency components of jitter. A separate phase control loop  
composed of a digital integrator and DCO tracks the low  
PHASE-LOCKED LOOP (PLL)  
BINARY  
PHASE  
DETECTOR  
X(s)  
Z(s)  
K
× TRANBW  
K
RECOVERED  
CLOCK  
PLL  
DCO  
s
INPUT  
DATA  
÷N  
N
–1  
I – z  
DELAY-LOCKED LOOP (DLL)  
–N  
K
DLL  
–1  
I – z  
PSH  
N
–1  
I – z  
I – z  
ZERO-ORDER HOLD  
SAMPLE CLOCK  
Z(s)  
K
× TRANBW – K  
DCO  
PLL  
X(s) s × N × PSH × K  
=
+ K  
PLL  
× TRANBW × K  
DCO  
DLL  
Figure 25. CDR Jitter Block Diagram  
Rev. A | Page 20 of 36  
 
 
Data Sheet  
ADN2915  
The delay-locked and phase-locked loops contribute to overall  
jitter accommodation. At low frequencies of input jitter on the  
data signal, the integrator in the loop filter provides high gain to  
track large jitter amplitudes with small phase error. In this case,  
the oscillator is frequency modulated and jitter is tracked as in  
an ordinary phase-locked loop. The amount of low frequency  
jitter that can be tracked is a function of the DCO tuning range.  
A wider tuning range gives larger accommodation of low fre-  
quency jitter. The internal loop control word remains small for  
small jitter frequency, so that the phase shifter remains close to  
the center of its range and, thus, contributes little to the low  
frequency jitter accommodation.  
size of the DCO tuning range, therefore, has only a small effect  
on the jitter accommodation. The delay-locked loop control range  
is now larger; therefore, the phase shifter takes on the burden of  
tracking the input jitter. An infinite range phase shifter is used  
on the clock. Consequently, the minimum range of timing  
mismatch between the clock at the data sampler and the retiming  
clock at the output is limited to 32 UI by the depth of the FIFO.  
There are two ways to acquire the data rate. The default mode  
frequency locks to the input data, where a finite state machine  
extracts frequency measurements from the data to program the  
DCO and loop division ratio so that the sampling frequency  
matches the data rate to within 250 ppm. The PLL is enabled,  
driving this frequency difference to 0 ppm. The second mode is  
lock to reference, in which case the user provides a reference  
clock between 11.05 MHz and 176.8 MHz. Division ratios must  
be written to a serial port register.  
At medium jitter frequencies, the gain and tuning range of the  
DCO are not large enough to track input jitter. In this case, the  
DCO control word becomes large and saturates. As a result, the  
DCO frequency dwells at an extreme of its tuning range. The  
Rev. A | Page 21 of 36  
ADN2915  
Data Sheet  
FUNCTIONAL DESCRIPTION  
Accurate control of the slice threshold requires the user to read  
back the factory trimmed offset, which is stored as a 7-bit  
number in the I2C slice readback register (Register 0x73). Use  
Table 20 to decode the measured offset of the part, where an  
LSB corresponds to 0.24 mV.  
FREQUENCY ACQUISITION  
The ADN2915 acquires frequency from the data over a range of  
data frequencies from 6.5 Mbps to 11.3 Gbps. The lock detector  
circuit compares the frequency of the DCO and the frequency  
of the incoming data. When these frequencies differ by more  
than 1000 ppm, LOL is asserted and a new frequency acquisi-  
tion cycle is initiated. The DCO frequency is reset to the bottom  
of its range, and the internal division rate is set to its lowest  
value of N = 1, which is the highest octave of data rates. The  
frequency detector then compares this sampling rate frequency  
to the data rate frequency and either increases N by a factor of 2  
if the sampling rate frequency is found to be greater than the  
data rate frequency, or increases the DCO frequency if the data  
rate frequency is found to be greater than the data sampling  
rate. Initially, the DCO frequency is incremented in large steps  
to aid fast acquisition. As the DCO frequency approaches the  
data frequency, the step size is reduced until the DCO frequency is  
within 250 ppm of the data frequency, at which point LOL is  
deasserted.  
Table 20. Program Slice Level, Normal Slice Mode (Extended  
Slice = 0)  
Slice[6:0]  
0000000  
0000001  
1000000  
Decimal Value  
Offset  
0
1
64  
127  
Slice function disabled  
−15 mV  
0 mV  
1111111  
+14.75 mV  
The amount of offset required for manual slice adjust is deter-  
mined by subtracting the offset of the part from the desired  
slice adjust level. Use Table 20 or Table 21 to determine the code  
word to be written to the I2C slice register.  
An extended slice with coarser granularity for each LSB step is  
found in Table 21. Setting the extended slice bit (Bit 7) = 1 in  
Register 0x15 scales the full-scale range of the slice adjust by a  
factor of 6.  
When LOL is deasserted, the frequency-locked loop is turned  
off. The PLL or DLL pulls in the DCO frequency until the DCO  
frequency equals the data frequency.  
LIMITING AMPLIFIER  
Table 21.Program Slice Level, Extended Slice Mode (Extended  
Slice = 1)  
The limiting amplifier has differential inputs (PIN and NIN)  
that are each internally terminated with 50 Ω to an on-chip  
voltage reference (VCM = 0.95 V typically). The inputs must be  
ac-coupled. Input offset is factory trimmed to achieve better  
than 10 mV p-p typical sensitivity with minimal drift. The  
limiting amplifier can be driven differentially or single-ended.  
DC coupling of the limiting amplifier is not possible because  
the user needs to supply a common-mode voltage to exactly  
match the internal common-mode voltage; otherwise, the  
internal 50 Ω termination resistors absorb the difference in  
common-mode voltages.  
Slice[6:0]  
0000000  
0000001  
Decimal Value  
Offset  
128  
129  
Slice function disabled  
−100 mV  
1000000  
192  
0 mV  
1111111  
255  
+100 mV  
When manual slice is desired, disable the dc offset loop, which  
drives duty cycle distortion on the data to 0. Adaptive slice is  
disabled by setting ADAPTIVE_SLICE_EN = 0 in the DPLLD  
register (0x13).  
Another reason the limiting amplifier cannot be dc-coupled is  
that the factory trimmed input offset becomes invalid. The  
offset is adjusted to zero by differential currents from the slice  
adjust DAC (see Figure 1). With ac coupling, all of the current  
goes to the 50 Ω termination resistors on the ADN2915. However,  
with dc coupling, this current is shared with the external drive  
circuit, and calibration of the offset is lost. In addition, the slice  
adjust must have all the current from the slice adjust DAC go to  
the resistors; otherwise, the calibration is lost (see the Slice  
Adjust section).  
EDGE SELECT  
A binary or Alexander phase detector drives both the DLL and  
PLL loops at all division rates. Duty cycle distortion on the  
received data leads to a dead band in the phase detector transfer  
function if phase errors are measured on both rising and falling  
data transitions. This dead band leads to jitter generation of  
unknown spectral composition whose peak-to-peak amplitude  
is potentially large.  
SLICE ADJUST  
The recommended usage of the part when the dc offset loop is  
disabled computes phase errors exclusively on either the rising  
data edges with EDGE_SEL[1:0] (DPLLA[4:3]) = 1 (decimal) or  
falling data edges with EDGE_SEL[1:0] = 2 in Register 0x10.  
The alignment of the clock to the rising data edges with  
EDGE_SEL[1:0] = 1 is represented by the top two curves in  
The quantizer slicing level can be offset by 100 mV in 1.6 mV  
steps or 15 mV in 0.24 mV steps to mitigate the effect of  
amplified spontaneous emission (ASE) noise or duty cycle  
distortion. Quantizer slice adjust level is set by the slice[6:0] bits  
in I2C Register 0x15.  
Rev. A | Page 22 of 36  
 
 
 
 
 
 
 
Data Sheet  
ADN2915  
Figure 26. Duty cycle distortion with Narrow 1s moves the  
significant sampling instance where data is sampled to the right  
of center. The alignment of the clock to the falling data edges  
with EDGE_SEL[1:0] = 2 is represented by the first and third  
curves in Figure 26. The significant sampling instance moves to  
the left of center. Sample phase adjust for rates above 5.65 Gbps  
can be used to move the significant sampling instance to the  
center of the Narrow 1 (or Narrow 0) for best jitter tolerance.  
Transfer Bandwidth  
The transfer bandwidth can be adjusted over the I2C by writing to  
TRANBW[2:0] in the DPLLA register (Register 0x10). The default  
value is 4. When set to values below 4, the transfer bandwidth is  
reduced, and when set to values above 4, the transfer bandwidth is  
increased. The resulting transfer bandwidth is based on the  
following formula:  
TRANBW[2:0]  
Transfer BW (Default Transfer BW )  
DATA  
4
EDGE_SEL[1:0]  
CLK1  
For example, at OC-192, the default transfer bandwidth is  
2 MHz. The resulting transfer bandwidth when TRANBW[2:0]  
is changed is  
EDGE_SEL = 2  
CLK2  
TRANBW[2:0] = 1: transfer BW = 500 kHz  
TRANBW[2:0] = 2: transfer BW = 1.0 MHz  
TRANBW[2:0] = 3: transfer BW = 1.5 MHz  
TRANBW[2:0] = 4: transfer BW = 2.0 MHz (default)  
TRANBW[2:0] = 5: transfer BW = 2.5 MHz  
TRANBW[2:0] = 6: transfer BW = 3.0 MHz  
TRANBW[2:0] = 7: transfer BW = 3.5 MHz  
Figure 26. Phase Detector Timing  
DLL Slew  
Jitter tolerance beyond the transfer bandwidth of the CDR is  
determined by the slew rate of the delay-locked loop implement-  
ing a delta modulator on phase. Setting DLL_SLEW[1:0] = 2,  
the default value, in the DPLLD register (Register 0x13) config-  
ures the DLL to track 0.75 UI p-p jitter at the highest frequency  
breakpoint in the SONET/SDH jitter tolerance mask. This  
frequency scales with the rate as fp4 = Rate (Hz)/2500 (for  
example, 4 MHz for OC-192). Peak-to-peak tracking in UI at  
fp4 obeys the expression (1 + DLL_SLEW)/4 UI p-p.  
Reducing the transfer bandwidth is commonly used in OTN  
applications. Never set TRANBW[2:0] = 0, because this makes  
the CDR open loop. Also, note that setting TRANBW[2:0]  
above 4 may cause a slight increase in jitter generation and  
potential jitter peaking.  
In some applications, full SONET/SDH jitter tolerance is not  
needed. In this case, DPLLD[1:0] can be set to 0, giving lower jitter  
generation on the recovered clock and better high frequency  
jitter tolerance.  
LOSS OF SIGNAL (LOS) DETECTOR  
The receiver front-end LOS detector circuit detects when the  
input signal level falls below a user-adjustable threshold.  
There is typically 6 dB of electrical hysteresis on the LOS  
detector to prevent chatter on the LOS pin. This means that, if the  
input level drops below the programmed LOS threshold,  
causing the LOS pin to assert, the LOS pin is not deasserted  
until the input level has increased to 6 dB (2×) above the LOS  
threshold (see Figure 27).  
Sample Phase Adjust  
The phase of the sampling instant can be adjusted over the I2C  
when operating at data rates 5.65 Gbps or higher by writing to the  
SAMPLE_PHASE[3:0] bits (Phase[3:0]) in Register 0x14. This  
feature allows the user to adjust the sampling instant with the  
intent of improving the BER and jitter tolerance. Although the  
default sampling instant chosen by the CDR is sufficient in  
most applications, when dealing with some degraded input  
signals, the BER and jitter tolerance performance can be  
improved by manually adjusting the phase.  
LOS OUTPUT  
INPUT LEVEL  
HYSTERESIS  
There is a total adjustment range of 0.5 UI, with 0.25 UI in each  
direction, in increments of 1/32 UI. SAMPLE_PHASE[3:0] is a  
twos complement number, and the relationship between data  
and the sampling clock is shown in Figure 28.  
LOS THRESHOLD  
t
Figure 27. LOS Detector Hysteresis  
DATA  
PHASE = 4  
PHASE = 7  
PHASE = –4  
PHASE = –8  
CLOCK  
PHASE = 0  
(DEFAULT)  
Figure 28. Data vs. Sampling Clock  
Rev. A | Page 23 of 36  
 
 
 
 
 
 
 
ADN2915  
Data Sheet  
performance; however, the adaptive EQ finds the best setting in  
most cases.  
The LOS detector and the slice level adjust can be used simulta-  
neously on the ADN2915. Therefore, any offset added to the  
input signal by the slice adjust pins does not affect the LOS  
detector measurement of the absolute input level.  
Table 22 indicates a typical EQ setting for several trace lengths.  
The values in Table 22 are based on measurements taken on a  
test board with simple FR-4 traces. Table 23 lists the typical  
maximum reach in inches of FR-4 of the EQ at several data  
rates. If a real channel includes lossy connectors or vias, the  
FR-4 reach length is lower. For any real-world system, it is  
highly recommended to test several EQ settings with the real  
channel to ensure best signal integrity.  
LOS Power-Down  
The LOS, by default, is enabled and consumes power. The LOS  
is placed in a low power mode by setting the LOS PDN  
(CTRLB[3]) = 1 in Register 0x9.  
LOS Threshold  
The LOS threshold has a range between 0 mV and 128 mV and  
is set by writing the number of millivolts (mV) to the LOS_DATA  
register (0x36) followed by toggling the LOS_ENABLE bit in  
the LOS_CTRL register (Register 0x74) while LOS_ADDRESS  
is set to 1. The following is a procedure for writing the LOS  
threshold:  
Table 22. EQ Settings vs. Trace Length on FR-4  
Trace Length (inches)  
Typical EQ Setting  
6
10  
15  
20 to 30  
10  
12  
14  
15  
1. Write 0x21 to LOS_CTRL (Register 0x74).  
2. Write the desired threshold in millivolts to LOS_DATA  
(Register 0x36).  
Table 23. Typical EQ Reach on FR-4 vs. Maximum Data  
Rates Supported  
3. Write 0x31 to LOS_CTRL (Register 0x74).  
4. Write 0x21 to LOS_CTRL (Register 0x74).  
Maximum Data Rate  
(Gbps)  
Typical EQ Reach on FR-4  
(inches)  
4
8
10  
11  
30  
20  
15  
10  
The LOS threshold can be set to a value between 0 mV and  
63 mV in 1 mV steps and 64 mV to 128 mV in 2 mV steps.  
In the lower range, all of the bits are active, giving 1 mV/LSB  
resolution, where Bit D0 is the LSB.  
BYPASS  
However, in the upper range, Bit D0 is disabled (that is, D0 = 0),  
making Bit D1 the new LSB and resulting in 2 mV/LSB  
resolution.  
I2C Register LOS_CTRL contains the necessary address and  
write enable bits to program this LOS threshold.  
The bypass path connects the input signal directly to the digital  
logic inside the ADN2915. This is useful at lower data rates  
where the signal is large (therefore, the limiting amplifier is not  
needed, and power can be saved by deselecting the limiting  
amplifier) and unimpaired (therefore, the equalizer is not needed).  
The signal swing of the internal digital circuit is 600 mV p-p  
differential, the minimum signal amplitude that must be provided  
as the input in bypass mode.  
Signal Strength Measurement  
The LOS measures and digitizes the peak-to-peak amplitude  
of the received signal. A single shot measurement is taken by  
writing the following sequence of bytes to LOS_CTRL at I2C  
Address 0x74: 0x7, 0x17, 0x7. Upon LOS_ENABLE going low,  
the peak-to-peak amplitude in millivolts is loaded into LOS_DATA  
(Register 0x36). The contents of LOS_DATA change only when  
LOS_ENABLE (LOS_CTRL[4]) in Register 0x74 is toggled low-  
high-low while pointing to LOS_ADDRESS[2:0] (LOS_CTRL[2:0])  
= 7.  
In bypass mode, the internal 50 Ω termination resistors can be  
configured in one of two ways, either floated or tied to VCC = 1.2 V  
(see Figure 33 and Table 26). By setting the RX_TERM_FLOAT  
bit (D7) in I2C Register LA_EQ (Register 0x16) to 1, these 50 Ω  
termination resistors are floated internal to the ADN2915 (see  
Figure 36). By setting RX_TERM_FLOAT bit (D7) to 0, these  
50 Ω termination resistors are connected to VCC = 1.2 V (see  
Figure 37). In both of these termination cases, the user must  
ensure a valid common-mode voltage on the input.  
PASSIVE EQUALIZER  
A passive equalizer is available at the input to equalize large  
signals that have undergone distortion due to PCB traces, vias,  
and connectors. The adaptive EQ functions only at data rates  
greater than 5.5 Gbps. Therefore, at rates less than 5.5 Gbps, the  
EQ must be manually set.  
In the case where the termination is floated, the two 50 Ω  
resistors are purely a differential termination. The input must  
conform to the range of signals shown in Figure 39.  
In the case of termination to 1.2 V VCC power supply (see Figure 37  
and Figure 38), the common-mode voltage is created by joint  
enterprise between the driver circuit and the 50 Ω resistors on  
the ADN2915. For example, the driver can be an open-drain  
switched current (see Figure 37), and the 50 Ω resistors return  
this current to VCC. In Figure 37, the common-mode voltage is  
The equalizer can be manually set through Register LA_EQ  
(Register 0x16). An adaptive loop is also available that  
optimizes the EQ setting based on characteristics of the  
received eye at the phase detector. If the channel is known in  
advance, manual set the EQ setting to obtain the best  
Rev. A | Page 24 of 36  
 
 
 
 
Data Sheet  
ADN2915  
created by both the current and the resistors. In this case, ensure  
that the current is a minimum of 6 mA, which gives a single-  
ended swing of 300 mV or a differential swing of 600 mV p-p  
differential, with VCM = 1.05 V (see Figure 39). The maximum  
current is 10 mA, which gives a single-ended 500 mV swing and  
differential 1.0 V p-p, with VCM = 0.95 V (see Figure 40).  
For more details, see the Reference Clock (Optional) section.  
In this mode, the lock detector monitors the difference in fre-  
quency between the divided down DCO and the divided down  
reference clock. The loss of lock signal, which appears on LOL  
(Pin 6), is deasserted when the DCO is within 250 ppm of the  
desired frequency. This enables the D/PLL, which pulls in the  
DCO frequency the remaining amount with respect to the input  
data and acquires phase lock. When locked, if the frequency  
error exceeds 1000 ppm (0.1%), the loss of lock signal is  
reasserted and control returns to the frequency loop, which  
reacquires with respect to the reference clock. The LOL pin  
remains asserted until the DCO frequency is within 250 ppm of  
the desired frequency. This hysteresis is shown in Figure 29.  
Another possibility is to have the switched current driver back  
terminated, as shown in Figure 38, and the two VCC supplies  
having the same potential. In this example, the current is  
returned to VCC by two 50 Ω resistors in parallel, or 25 Ω, so  
that the minimum current is 12 mA and the maximum current  
is 20 mA.  
LOCK DETECTOR OPERATION  
Static LOL Mode  
The lock detector on the ADN2915 has three modes of opera-  
tion: normal mode, LTR mode, and static LOL mode.  
The ADN2915 implements a static LOL feature that indicates if  
a loss of lock condition has ever occurred and remains asserted,  
even if the ADN2915 regains lock, until the static LOL bit  
(STATUSA[2]) in Register 0x6 is manually reset. If there is ever  
an occurrence of a loss of lock condition, this bit is internally  
asserted to logic high. The static LOL bit remains high even  
after the ADN2915 has reacquired lock to a new data rate. This  
bit can be reset by writing a 1, followed by 0, to the reset static  
LOL bit (CTRLA[2]) in I2C Register 0x8. When reset, the static  
LOL bit (STATUSA[2]) remains deasserted until another loss of  
lock condition occurs.  
Writing a 1 to Bit LOL config (CTRLB[4]) in I2C Register 0x9  
causes the LOL pin, Pin 6, to become a static LOL indicator. In  
this mode, the LOL pin mirrors the contents of the static LOL  
bit (STATUSA[2]) in Register 0x6 and has the functionality  
described previously. The LOL config bit (CTRLB[4]) defaults  
to 0. In this mode, the LOL pin operates in the normal operat-  
ing mode; that is, it is asserted only when the ADN2915 is in  
acquisition mode and deasserts when the ADN2915 has  
reacquired lock.  
Normal Mode  
In normal mode, the ADN2915 is a continuous rate CDR that  
locks onto any data rate from 6.5 Mbps to 11.3 Gbps without  
the use of a reference clock as an acquisition aid. In this mode,  
the lock detector monitors the frequency difference between the  
DCO and the input data frequency, and deasserts the loss of  
lock signal, which appears on LOL, Pin 6, when the DCO is  
within 250 ppm of the data frequency. This enables the digital  
PLL (D/PLL), which pulls the DCO frequency in the remaining  
amount and acquires phase lock. When locked, if the input  
frequency error exceeds 1000 ppm (0.1%), the loss of lock signal  
is reasserted and control returns to the frequency loop, which  
begins a new frequency acquisition. The LOL pin remains  
asserted until the DCO locks onto a valid input data stream to  
within 250 ppm frequency error. This hysteresis is shown in  
Figure 29.  
LOL  
1
HARMONIC DETECTOR  
The ADN2915 provides a harmonic detector that detects whether  
the input data has changed to a lower harmonic of the data rate  
than the one that the sampling clock is currently locked onto. For  
example, if the input data instantaneously changes from OC-12,  
622.08 Mbps, to an OC-3, 155.52 Mbps bit stream, this can be  
perceived as a valid OC-12 bit stream because the OC-3 data  
pattern is exactly 4× slower than the OC-12 pattern. Therefore,  
if the change in data rate is instantaneous, a 101 pattern at OC-3  
is perceived by the ADN2915 as a 111100001111 pattern at OC-12.  
If the change to a lower harmonic is instantaneous, a typical  
inferior CDR may remain locked at the higher data rate.  
–1000  
–250  
0
250  
1000 fDCO ERROR  
(ppm)  
Figure 29. Transfer Function of LOL  
LOL Detector Operation Using a Reference Clock  
In this mode, a reference clock is used as an acquisition aid to  
lock the ADN2915 DCO. Lock to reference mode is enabled by  
setting CDR_MODE[2:0] to 2 in the CTRLA register (Register  
0x8). The user must also write to FREF_RANGE[1:0] and  
DATA_TO_REF_RATIO[3:0] in the LTR_MODE register  
(Register 0xF) to set the reference frequency range and the  
divide ratio of the data rate with respect to the reference  
frequency. Finally, the reference clock power down to the  
reference clock buffer must be deasserted by writing a 0 to I2C  
Bit REFCLK_PDN in the CTRLC register (Register 0xA). To  
maintain fastest acquisition, keep CTRLC[0] set to 1.  
The ADN2915 implements a harmonic detector that automati-  
cally identifies whether the input data has switched to a lower  
harmonic of the data rate than the DCO is currently locked  
onto. When a harmonic is identified, the LOL pin is asserted,  
and a new frequency acquisition is initiated. The ADN2915  
automatically locks onto the new data rate, and the LOL pin is  
deasserted.  
Rev. A | Page 25 of 36  
 
 
 
ADN2915  
Data Sheet  
The time to detect lock to harmonic is  
peripheral. Logic 1 on the LSB of the first byte means that the  
master reads information from the peripheral.  
216 × (Td/ρ)  
The ADN2915 acts as a standard slave device on the bus. The  
data on the SDA pin is eight bits long, supporting the 7-bit  
addresses plus the R/W bit. The ADN2915 has subaddresses to  
enable the user-accessible internal registers (see Table 7).  
where:  
1/Td is the new data rate. For example, if the data rate is  
switched from OC-12 to OC-3, then Td = 1/155.52 MHz.  
ρ is the data transition density. Most coding schemes seek to  
ensure that ρ = 0.5, for example, PRBS and 8B/10B.  
The ADN2915, therefore, interprets the first byte as the device  
address and the second byte as the starting subaddress. Auto-  
increment mode is supported, allowing data to be read from or  
written to the starting subaddress and each subsequent address  
without manually addressing the subsequent subaddress. A data  
transfer is always terminated by a stop condition. The user can  
also access any unique subaddress register on a one-by-one  
basis without updating all registers.  
When the ADN2915 is placed in lock to reference mode, the  
harmonic detector is disabled.  
OUTPUT DISABLE AND SQUELCH  
The ADN2915 has two types of output disable/squelch. The  
DATOUTP/DATOUTN and CLKOUTP/CLKOUTN outputs  
can be disabled by setting DATOUT_DISABLE (OUTPUTA[4])  
and CLKOUT_DISABLE (OUTPUTA[3]) high, respectively, in  
Register 0x1E. When an output is disabled, it is fully powered  
down, saving approximately 30 mW per output. Disabling  
DATOUTP/DATOUTN also disables the CLKOUTP/  
Stop and start conditions can be detected at any stage of the  
data transfer. If these conditions are asserted out of sequence  
with normal read and write operations, they cause an immedi-  
ate jump to the idle condition. During a given SCK high period,  
issue one start condition, one stop condition, or a single stop  
condition followed by a single start condition. If an invalid subad-  
dress is issued by the user, the ADN2915 does not issue an  
acknowledge and returns to the idle condition. If the user exceeds  
the highest subaddress while reading back in auto-increment  
mode, the highest subaddress register contents continue to be  
output until the master device issues a no acknowledge. This  
indicates the end of a read. In a no acknowledge condition, the  
SDA line is not pulled low on the ninth pulse. See Figure 22 and  
Figure 21 for sample read and write data transfers, respectively,  
and Figure 23 for a more detailed timing diagram.  
CLKOUTN output, saving a total of about 60 mW of power.  
If it is desired to gate the data output while leaving the clock  
on, the output data can be squelched by setting the data squelch  
bit (OUTPUTA[5]) in Register 0x1E high. In this mode, the  
data driver is left powered, but the data itself is forced to be  
always 0 (or 1, depending on the setting of DATA_POLARITY  
(OUTPUTA[1]) in Register 0x1E).  
I2C INTERFACE  
The ADN2915 supports a 2-wire, I2C-compatible, serial bus  
driving multiple peripherals. Two inputs, serial data (SDA) and  
serial clock (SCK), carry information between any devices con-  
nected to the bus. Each slave device is recognized by a unique  
address. The slave address consists of the seven MSBs of an  
8-bit word. The upper six bits (Bits[6:1]) of the 7-bit slave  
address are factory programmed to 100000. The LSB of the  
slave address (Bit 0) is set by Pin 22, I2C_ADDR. The LSB of the  
word sets either a read or write operation (see Figure 20). Logic 1  
corresponds to a read operation, whereas Logic 0 corresponds  
to a write operation.  
REFERENCE CLOCK (OPTIONAL)  
A reference clock is not required to perform clock and data  
recovery with the ADN2915. However, support for an optional  
reference clock is provided. The reference clock can be driven  
differentially or single-ended. If the reference clock is not being  
used, float both REFCLKP and REFCLKN.  
Two 50 Ω series resistors present a differential load between  
REFCLKP and REFCLKN. Common mode is internally set to  
0.56 × VCC by a resistor divider between VCC and VEE. See  
Figure 30, Figure 31, and Figure 32 for sample configurations.  
To control the device on the bus, the following protocol must be  
used. First, the master initiates a data transfer by establishing a  
start condition, defined by a high-to-low transition on SDA  
while SCK remains high. This indicates that an address/data  
stream follows. All peripherals respond to the start condition and  
shift the next eight bits (the 7-bit address and the R/W bit).  
The bits are transferred from MSB to LSB. The peripheral that  
recognizes the transmitted address responds by pulling the  
data line low during the ninth clock pulse. This is known as an  
acknowledge bit. All other devices withdraw from the bus at  
this point and maintain an idle condition. The idle condition is  
where the device monitors the SDA and SCK lines waiting for  
the start condition and correct transmitted address. The R/W  
bit determines the direction of the data. Logic 0 on the LSB of  
the first byte means that the master writes information to the  
The reference clock input buffer accepts any differential signal  
with a peak-to-peak differential amplitude of greater than  
100 mV. Phase noise and duty cycle of the reference clock are  
not critical and 100 ppm accuracy is sufficient.  
ADN2915  
REFCLKP  
24  
BUFFER  
REFCLKN  
23  
50Ω 50Ω  
VCC/2  
Figure 30. DC-Coupled, Differential REFCLKx Configuration  
Rev. A | Page 26 of 36  
 
 
 
 
Data Sheet  
ADN2915  
VCC  
ADN2915  
Table 24. LTR_MODE Settings  
LTR_MODE[5:4] Range (MHz) LTR_MODE[3:0] Ratio  
REFCLKP  
REFCLKN  
CLK  
OSC  
24  
OUT  
00  
01  
10  
11  
11.05 to 22.1  
22.1 to 44.2  
44.2 to 88.4  
88.4 to 176.8  
0000  
0001  
n
2−1  
20  
2n − 1  
29  
BUFFER  
23  
50Ω 50Ω  
VCC/2  
1010  
Figure 31. AC-Coupled, Single-Ended REFCLKx Configuration  
The user can specify a fixed integer multiple of the reference clock  
to lock onto using DATA_TO_REF_RATIO[3:0]  
(LTR_MODE[3:0]) in Register 0xF. Set  
ADN2915  
REFCLKP  
24  
DATA_TO_REF_RATIO[3:0] = data rate ÷ DIV_fREF  
REFCLK  
BUFFER  
REFCLKN  
23  
where DIV_fREF represents the divided-down reference referred  
to the 11.05 MHz to 22.1 MHz band.  
50Ω 50Ω  
For example, if the reference clock frequency is 38.88 MHz and  
the input data rate is 622.08 Mbps, then FREF_RANGE[1:0] is  
set to 01 to give a divided-down reference clock of 19.44 MHz.  
DATA_TO_REF_RATIO[3:0] is set to 0110, that is, 6, because  
VCC/2  
Figure 32. AC-Coupled, Differential REFCLKx Configuration  
The reference clock can be used either as an acquisition aid for  
the ADN2915 to lock onto data, or to measure the frequency  
of the incoming data to within 0.01%. The modes are mutually  
exclusive because, in the first use, the user can force the part to  
lock onto only a known data rate; in the second use, the user  
can measure an unknown data rate.  
622.08 Mbps/19.44 MHz = 2(6 − 1)  
While the ADN2915 is operating in lock to reference mode, if  
the user changes the reference frequency, that is, the fREF range  
(LTR_MODE[5:4]) or the fREF ratio (LTR_MODE[3:0]), this  
must be followed by writing a 0-1-0 transition into the  
INIT_FREQ_ACQ (CTRLB[6]) bit in Register 0x9 to initiate a  
new lock to reference command.  
Lock to reference mode is enabled by writing a 2 to CDR_  
MODE[2:0] (CTRLA[6:4]) in Register 0x8. An on-chip clock  
buffer must be powered on by writing a 0 to REFCLK_PDWN  
(CTRLC[2]) in Register 0xA. Fine data rate readback mode is  
enabled by writing a 1 to RATE_MEAS_EN (CTRLA[1]) in  
Register 0x8. Enabling lock to reference and data rate readback  
at the same time causes an indeterminate state and is not  
supported.  
By default in lock to reference clock mode, when lock has been  
achieved and the ADN2915 is in tracking mode, the frequency  
of the DCO is being compared to the frequency of the reference  
clock. If this frequency error exceeds 1000 ppm, lock is lost, LOL is  
asserted, and it relocks to the reference clock while continuing  
to output a stable clock.  
Using the Reference Clock to Lock onto Data  
An alternative configuration is enabled by setting LOL data  
(LTR_MODE[6]) = 1. In this configuration, when the part is in  
tracking mode, the frequency of the DCO is being compared to  
the frequency of the input data, rather than the frequency of the  
reference clock. If this frequency error exceeds 1000 ppm, lock  
is lost, LOL is asserted, and it relocks to the reference clock  
while continuing to output a stable clock.  
In this mode, the ADN2915 locks onto a frequency derived  
from the reference clock according to the following equation:  
Data Rate/2(LTR_MODE[3:0] − 1) = REFCLK/2LTR_MODE[5:4]  
The user must know exactly what the data rate is and provide a  
reference clock that is a function of this rate. The ADN2915 can  
still be used as a continuous rate device in this configuration if  
the user has the ability to provide a reference clock that has a  
variable frequency (see the AN-632 Application Note).  
Using the Reference Clock to Measure Data Frequency  
The user can also provide a reference clock to measure the  
recovered data frequency. In this case, the user provides a  
reference clock, and the ADN2915 compares the frequency of  
the incoming data to the incoming reference clock and returns a  
ratio of the two frequencies to 0.01% (100 ppm). The accuracy  
error of the reference clock is added to the accuracy of the  
ADN2915 data rate measurement. For example, if a 100 ppm  
accuracy reference clock is used, the total accuracy of the  
measurement is 200 ppm.  
The reference clock can be anywhere between 11.05 MHz and  
176.8 MHz. By default, the ADN2915 expects a reference clock  
of between 11.05 MHz and 22.1 MHz. If it is between 22.1 MHz  
and 44.2 MHz, 44.2 MHz and 88.4 MHz, or 88.4 MHz and  
176.8 MHz, the user must configure the ADN2915 to use the  
correct reference frequency range by setting the two bits of  
FREF_RANGE[1:0] (LTR_MODE[5:4]) in Register 0xF.  
Rev. A | Page 27 of 36  
 
 
 
ADN2915  
Data Sheet  
The reference clock can range from 11.05 MHz and 176.8 MHz.  
Prior to reading back the data rate using the reference clock, the  
LTR_MODE[5:4] bits must be set to the appropriate frequency  
range with respect to the reference clock being used according  
to Table 24. A fine data rate readback is then executed as follows:  
read back the new data rate. Note that a data rate readback is  
valid only if the LOL pin is low. If LOL is high, the data rate  
readback is invalid.  
Initiating a frequency measurement by writing a 0-1-0 to  
RATE_MEAS_RESET (CTRLA[0]) also resets the RATE_  
MEAS_COMP (STATUSA[0]) bit. The approximate time to  
complete a frequency measurement from RATE_MEAS_RESET  
(CTLRA[0]) being written with a 0-1-0 transition to when the  
RATE_MEAS_COMP (STATUSA[0]) bit returns high is given by  
1. Apply the reference clock.  
2. Write a 0 to REFCLK_PDN (CTRLC[2]) in Register 0xA to  
enable the reference clock circuit.  
3. Write to FREF_RANGE[1:0] (LTR_MODE[5:4]) in  
Register 0xF to select the appropriate reference clock  
frequency circuit.  
4. Write a 1 to RATE_MEAS_EN (CTRLA[1]) in Register 0x8.  
This enables the fine data rate measurement capability of the  
ADN2915. This bit is level sensitive and does not need to be  
reset to perform subsequent frequency measurements.  
5. Write a 0-1-0 to RATE_MEAS_RESET (CTRLA[0]) in  
Register 0x8. This initiates a new data rate measurement.  
6. Read back RATE_MEAS_COMP (STATUSA[0]) in Register  
0x6. If it is 0, the measurement is not complete. If it is 1, the  
measurement is complete and the data rate can be read  
back on RATE_FREQ[23:0] and FREQ_RB2[6:2] (see  
Table 7). The approximate time for a data rate  
211 ×2LTR[5:4]  
MeasurementTime =  
(2)  
fREFCLK  
LOS Configuration  
The LOS detector output, LOS (Pin 5), can be configured to  
be either active high or active low. If LOS polarity (CTRLB[2])  
in Register 0x9 is set to Logic 0 (default), the LOS pin is active  
high when a loss of signal condition is detected.  
ADDITIONAL FEATURES AVAILABLE VIA THE I2C  
INTERFACE  
Coarse Data Rate Readback  
The data rate can be read back over the I2C interface to approx-  
imately 5% without needing an external reference clock  
according to the following formula:  
measurement is given in Equation 2.  
Use the following equation to determine the data rate:  
fDCO  
(
RATE _ FREQ  
[
23:0  
]
× fREFCLK  
)
Data =  
(1)  
fDATARATE  
=
(1)  
2FULLRATE × 2DIVRATE  
2LTR[5:4] × 27 × 2FULLRATE × 2DIVRATE  
where  
where:  
DATARATE is the data rate (Mbps).  
FREQ[23:0] is from FREQ2[7:0] (most significant byte),  
FREQ1[7:0], and FREQ0[7:0] (least significant byte). See Table 7.  
REFCLK is the reference clock frequency (MHz).  
FULLRATE = FREQ_RB2[6].  
DIVRATE = FREQ_RB2[5:2].  
f
fDCO is the frequency of the DCO, derived as shown in Table 25:  
f
Four oscillator cores defined by VCOSEL[9:8] (FREQ_RB2[1:0])  
in Register 0x5 span the highest octave of data rates according  
to Table 25.  
FULLRATE = FREQ_RB2[6].  
DIVRATE = FREQ_RB2[5:2].  
MSB  
LSB  
Table 25. DCO Center Frequency vs. VCOSEL[9:8]  
(FREQ_RB2[1:0])  
D23 to D16  
D15 to D8  
FREQ1[7:0]  
D7 to D0  
FREQ0[7:0]  
FREQ2[7:0]  
Min Frequency  
Consider the example of a 1.25 Gbps (GbE) input signal and a  
reference clock source of 32 MHz at the PIN/NIN and REFCLKP/  
REFCLKN ports, respectively. In this case, FREF_RANGE[1:0]  
(LTR_MODE[5:4]) = 01 and the reference frequency falls into  
the range of 22.1 MHz to 44.2 MHz. After following Step 1  
through Step 6, the readback value of RATE_FREQ[23:0] is  
0x13880, which is equal to 8 × 104. The readback value of  
FULLRATE (FREQ_RB2[6]) is 1, and the readback value of  
DIVRATE[3:0] (FREQ_RB2[5:2]) is 2. Plugging these values into  
Equation 1 yields  
Core =  
(FREQ_RB2[1:0]) Min_f(core)  
(MHz) =  
Max Frequency  
(MHz) = Max_f(core)  
0
1
2
3
5570  
7000  
8610  
10,265  
7105  
8685  
10,330  
11,625  
f
DCO is determined from FREQ_RB1 and FREQ_RB2[1:0],  
according to the following formula:  
fDCO  
=
((8 × 104) × (32 × 106))/(21 × 27 × 21 × 22) = 1.25 Gbps  
Max _ f (core) Min _ f (core)  
Min _ f (core) +  
× FREQ _ RB1  
256  
If subsequent frequency measurements are required, keep  
RATE_MEAS_EN (CTRLA[1]) set to 1. It does not need to be  
reset. The measurement process is reset by writing a 1 followed  
by a 0 to RATE_MEAS_RESET (CTRLA[0]). This initiates a  
new data rate measurement. Follow Step 2 through Step 6 to  
Rev. A | Page 28 of 36  
 
 
Data Sheet  
ADN2915  
of CIDs is 8 × DATA_CID_LENGTH, which is set via  
PRBS Gen 2[7:0] in Register 0x3A.  
Worked Example  
Read back the contents of the FREQ_RB1 and FREQ_RB2  
registers. For example, with an OC-192 signal presented to  
PIN/NIN ports,  
Table 26. PRBS Settings  
PRBS Patterns  
DATA_GEN_MODE[1:0] PRBS Polynomial  
PRBS7  
PRBS15  
PRBS31  
PROG_DATA[31:0] 0x11  
0x00  
0x01  
0x10  
1 + X6 + X7  
1 + X14 + X15  
1 + X28 + X31  
N/A  
FREQ_RB1 = 0xCE  
FREQ_RB2 = 0x02  
FULLRATE (FREQ_RB2[6]) = 0  
DIVRATE (FREQ_RB2[5:2]) = 0  
core (FREQ_RB2[1:0]) = 2  
Double Data Rate Mode  
Then  
The default output clock mode is a double data rate (DDR)  
clock, where the output clock frequency is ½ the data rate.  
This allows direct interfacing to FPGAs that support clocking  
on both rising and falling edges. Setting DDR_DISABLE  
(OUTPUTA[2]) = 1 in Register 0x1E enables full data rate  
mode. Full data rate mode is not supported for data rates in  
the highest octave between 5.6 Gbps and 11.3 Gbps.  
fDCO  
=
10300Mbps 8610Mbps  
8610Mbps +  
× 206 = 9994.06Mbps  
256  
and  
9994.06Mbps  
fdata  
=
= 9.99406Gbps  
CDR Bypass Mode  
20 × 20  
The CDR in the ADN2915 can be bypassed by setting the CDR  
bypass bit (CTRLB[5]) = 1. In this mode, the ADN2915 feeds the  
input directly through the input amplifiers to the output buffer,  
completely bypassing the CDR. The CDR bypass path is  
intended for use in testing or debugging a system. Use the CDR  
bypass path at data rates at or below 3.0 Gbps only.  
Initiate Frequency Acquisition  
A frequency acquisition can be initiated by writing a 1 followed  
by a 0 to INIT_FREQ_ACQ (CTRLB[6]) in I2C Register 0x9.  
This initiates a new frequency acquisition while keeping the  
ADN2915 in the operating mode that was previously  
programmed in the CTRLA, CTRLB, and CTRLC registers.  
Disable Output Buffers  
PRBS Generator/Receiver  
The ADN2915 provides the option of disabling the output buffers  
for power savings. The clock output buffer can be disabled by  
setting Bit CLKOUT_DISABLE (OUTPUTA[3]) = 1. This  
reduces the total output power by 30 mW. For a total of 60 mW  
of power savings, such as in a low power standby mode, both the  
CLKOUT and DATOUT buffers can be disabled together by  
setting Bit DATOUT_DISABLE (OUTPUTA[4]) = 1.  
The ADN2915 has an integrated PRBS generator and detector  
for system testing purposes. The devices are configurable as  
either a PRBS detector or a PRBS generator.  
The following steps configure the PRBS detector:  
1. Set DATA_RECEIVER_ENABLE (PRBS Rec 1[2]) to 1 while  
also setting DATA_RECEIVER_MODE[1:0] (PRBS Rec 1[1:0])  
according to the desired PRBS pattern (0: PRBS7; 1: PRBS15;  
2: PRBS31). Setting DATA_RECEIVER_MODE[1:0] to 3  
leads to a one-shot sampling of recovered data into  
DATA_LOADED[15:0].  
2. Set DATA_RECEIVER_CLEAR (PRBS Rec 1[3]) to 1 followed  
by 0 to clear PRBS_ERROR and PRBS_ERROR_COUNT.  
3. States of PRBS_ERROR (PRBS Rec 3[1]) and PRBS_  
ERROR_COUNT[7:0] (PRBS Rec 2[7:0]) can be frozen by  
setting DATA_RECEIVER_ENABLE (PRBS Rec 1[2]) to 0.  
Transmission Lines  
Use of 50 Ω transmission lines is required for all high frequency  
input and output signals to minimize reflections: PIN, NIN,  
CLKOUTP, CLKOUTN, DATOUTP, and DATOUTN (also  
REFCLKP and REFCLKN, if using a high frequency reference  
clock, such as 155 MHz). It is also necessary for the PIN and NIN  
input traces to be matched in length, and the CLKOUTP,  
CLKOUTN, DATOUTP, an d DATOUTN output traces to be  
matched in length to avoid skew between the differential traces.  
The following steps configure the PRBS generator:  
The high speed inputs (PIN and NIN) are each internally termi-  
nated with 50 Ω to an internal reference voltage (see Figure 33).  
As with any high speed, mixed-signal circuit, take care to keep  
all high speed digital traces away from sensitive analog nodes.  
1. Set DATA_GEN_EN (PRBS Gen 1[2]) = 1 to enable the  
PRBS generator while also setting DATA_GEN_MODE[1:0]  
(PRBS Gen 1[1:0]) for a desired PRBS output pattern (0:  
PRBS7; 1: PRBS15; 2: PRBS31). An arbitrary 32-bit pattern  
stored as PROG_DATA[31:0] is activated by setting  
The high speed outputs (DATOUTP, DATOUTN, CLKOUTP, and  
CLKOUTN) are internally terminated with 50 Ω to VCC.  
DATA_GEN_MODE[1:0] to 3.  
2. Strings of consecutive identical digits of sensed DATA_CID_  
BIT (PRBS Gen 1[5]) can be introduced in the generator  
with DATA_CID_EN (PRBS Gen 1[4]) set to 1. The length  
Rev. A | Page 29 of 36  
 
ADN2915  
Data Sheet  
Soldering Guidelines for Lead Frame Chip Scale Package  
of following input modes: limiting amplifier, equalizer, or  
bypass. It is easy to set the ADN2915 to use any required input  
configuration through the I2C bus. Figure 33 shows a block  
diagram of the input stage circuit.  
The lands on the 24-lead LFCSP are rectangular. The printed  
circuit board pad for these is 0.1 mm longer than the package  
land length, and 0.05 mm wider than the package land width.  
Center the land on the pad to ensure that the solder joint size is  
maximized. The bottom of the lead frame chip scale package has a  
central exposed pad. The pad on the printed circuit board must  
be at least as large as this exposed pad. The user must connect  
the exposed pad to VEE using plugged vias to prevent solder  
from leaking through the vias during reflow. This ensures a  
solid connection from the exposed pad to VEE.  
LOS  
DETECT  
LOS  
LA  
PIN  
NIN  
2
It is highly recommended to include as many vias as possible  
when connecting the exposed pad to VEE. This minimizes the  
thermal resistance between the die and VEE, and minimizes the  
die temperature. It is recommended that the vias be connected  
to a VEE plane, or planes, rather than a signal trace, to improve  
heat dissipation as shown in Figure 34.  
BYPASS  
EQ  
2.9k  
2.9k50Ω  
50Ω  
INPUT_SEL[1:0]  
RX_TERM_FLOAT  
V
CC  
V
REF  
FLOAT  
Placing an external VEE plane on the backside of the board  
opposite the ADN2915 provides an additional benefit because  
this allows easier heat dissipation into the ambient environment.  
Figure 33. Input Stage Block Diagram  
A correct input signal pass is configurable with the INPUT_  
SEL[1:0] bits (LA_EQ[6:5]) in Register 0x16. Table 27 shows the  
INPUT_SEL[1:0] bits and the input signal configuration.  
INPUT CONFIGURATIONS  
The ADN2915 input stage can work with the signal source in  
either ac-coupled or dc-coupled configuration. To best fit in a  
required applications environment, the ADN2915 supports one  
Table 27. Input Signal Configuration  
Selected Input  
Limiting Amplifier  
Equalizer  
Bypass (0 dB Buffer)  
Not Defined  
INPUT_SEL[1:0]  
RX_TERM_FLOAT = 0  
RX_TERM_FLOAT = 1  
Not defined  
Not defined  
Float  
00  
01  
10  
11  
VREF  
VREF  
VCC  
Not defined  
Not defined  
Figure 34. Connecting Vias to VEE  
Rev. A | Page 30 of 36  
 
 
 
 
Data Sheet  
ADN2915  
Therefore,  
τ = 12t  
Choosing AC Coupling Capacitors  
AC coupling capacitors at the inputs (PIN, NIN) and outputs  
(DATOUTP, DATOUTN) of the ADN2915 must be chosen  
such that the device works properly over the full range of data  
rates used in the application. When choosing the capacitors, the  
time constant formed with the two 50 Ω resistors in the signal  
path must be considered. When a large number of consecutive  
identical digits (CIDs) are applied, the capacitor voltage can  
droop due to baseline wander (see Figure 35), causing pattern  
dependent jitter (PDJ).  
where:  
τ is the RC time constant (C is the ac coupling capacitor, R = 100 Ω  
seen by C).  
t is the total discharge time  
t = nΤ  
where:  
n is the number of CIDs.  
T is the bit period.  
The user must determine how much droop is tolerable and choose  
an ac coupling capacitor based on that amount of droop. The  
amount of PDJ can then be approximated based on the capaci-  
tor selection. The actual capacitor value selection may require  
some trade-offs between droop and PDJ.  
Calculate the capacitor value by combining the equations for τ  
and t.  
C = 12nT/R  
When the capacitor value is selected, the PDJ can be  
approximated as  
For example, assuming that 2% droop is tolerable, the  
maximum differential droop is 4%.  
PDJps p-p = 0.5tr(1 − e(−nT/RC)/0.6  
Normalizing to V p-p,  
where:  
Droop = Δ V = 0.04 V = 0.5 V p-p (1 − e–t/τ  
)
PDJps p-p is the amount of pattern dependent jitter allowed,  
<0.01 UI p-p typical.  
tr is the rise time, which is equal to 0.22/BW; BW ≈ 0.7 (bit  
rate).  
Note that this expression for tr is accurate only for the inputs.  
The output rise time for the ADN2915 is ~30 ps regardless of  
data rate.  
VCC  
ADN2915  
V1  
V2  
PIN  
50  
DATAOUTP  
2
C
CDR  
TIA  
OUT  
C
V
REF  
IN  
50Ω  
NIN  
DATAOUTN  
V1b  
V2b  
1
2
3
4
V1  
V1b  
V2  
VREF  
VTH  
V2b  
VDIFF  
VDIFF = V2 – V2b  
VTH = ADN2915 QUANTIZER THRESHOLD  
NOTES  
1. DURING THE DATA PATTERNS WITH HIGH TRANSITION DENSITY, DIFFERENTIAL DC VOLTAGE AT V1 AND V2 IS ZERO.  
2. WHEN THE TIA OUTPUTS CONSECUTIVE IDENTICAL DIGITS, V1 AND V1b ARE DRIVEN TO DIFFERENT DC LEVELS. V2 AND V2b DISCHARGE TO  
THE V  
LEVEL, WHICH EFFECTIVELY INTRODUCES A DIFFERENTIAL DC OFFSET ACROSS THE AC COUPLING CAPACITORS.  
REF  
3. WHEN THE BURST OF DATA STARTS AGAIN, THE DIFFERENTIAL DC OFFSET ACROSS THE AC COUPLING CAPACITORS IS APPLIED TO THE  
INPUT LEVELS, CAUSING A DC SHIFT IN THE DIFFERENTIAL INPUT. THIS SHIFT IS LARGE ENOUGH SUCH THAT ONE OF THE STATES, EITHER  
HIGH OR LOW, DEPENDING ON THE LEVELS OF V1 AND V1b WHEN THE TIA WENT TO CID, IS CANCELLED OUT. THE QUANTIZER DOES NOT  
RECOGNIZE THIS AS A VALID STATE.  
4. THE DC OFFSET SLOWLY DISCHARGES UNTIL THE DIFFERENTIAL INPUT VOLTAGE EXCEEDS THE SENSITIVITY OF THE ADN2915. THE  
QUANTIZER RECOGNIZES BOTH HIGH AND LOW STATES AT THIS POINT.  
Figure 35. Example of Baseline Wander  
Rev. A | Page 31 of 36  
 
ADN2915  
Data Sheet  
VCC  
DC-COUPLED APPLICATION  
ADN2915  
The inputs to the ADN2915 can also be dc-coupled. This can be  
necessary in burst mode applications with long periods of CIDs  
and where baseline wander cannot be tolerated. If the inputs to  
the ADN2915 are dc-coupled, care must be taken not to violate  
the input range and common-mode level requirements of the  
ADN2915 (see Figure 39 or Figure 40). If dc coupling is required,  
and the output levels of the transimpedance amplifier (TIA) do  
not adhere to the levels shown in Figure 39 or Figure 40, level  
shifting and/or attenuation must occur between the TIA outputs  
and the ADN2915 inputs.  
50  
50Ω  
PIN  
NIN  
50Ω  
50Ω  
50Ω  
VCC  
I
Figure 38. DC-Coupled Application, Bypass Input (Back Terminated Mode)  
ADN2915  
VCC  
PIN  
1.2V  
0.8V  
TIA  
50  
NIN  
600mV p-p,  
DIFF  
V
= 1.05V  
CM  
50Ω  
INPUT (V)  
= 0.65V  
50Ω  
600mV p-p,  
DIFF  
V
CM  
0.9V  
0.5V  
Figure 36. DC-Coupled Application, Bypass Input (Rx Term Float Mode)  
Figure 37 shows the default dc-coupled situation when using  
the bypass input. The two terms are connected directly to VCC  
in a normal CML fashion, giving a common mode that is set by  
the dc signal strength from the driving chip. The bypass input  
has a high common-mode range and can tolerate VCM up to and  
including VCC.  
Figure 39. Minimum Allowed DC-Coupled Input Levels  
1.2V  
ADN2915  
1.0V  
1.0V p-p,  
DIFF  
V
= 0.95V  
CM  
PIN  
INPUT (V)  
= 0.75V  
1.0V p-p,  
DIFF  
V
CM  
50  
0.7V  
NIN  
0.5V  
50Ω  
50Ω  
VCC  
I
Figure 40. Maximum Allowed DC-Coupled Input Levels  
Figure 37. DC-Coupled Application, Bypass Input (Normal Mode)  
Rev. A | Page 32 of 36  
 
 
 
 
 
 
Data Sheet  
ADN2915  
OUTLINE DIMENSIONS  
4.10  
4.00 SQ  
3.90  
0.30  
0.25  
0.18  
PIN 1  
INDICATOR  
PIN 1  
INDICATOR  
24  
19  
0.50  
BSC  
18  
1
EXPOSED  
PAD  
2.65  
2.50 SQ  
2.45  
13  
6
12  
7
0.50  
0.40  
0.30  
0.25 MIN  
TOP VIEW  
BOTTOM VIEW  
0.80  
0.75  
0.70  
FOR PROPER CONNECTION OF  
THE EXPOSED PAD, REFER TO  
THE PIN CONFIGURATION AND  
FUNCTION DESCRIPTIONS  
0.05 MAX  
0.02 NOM  
COPLANARITY  
0.08  
SECTION OF THIS DATA SHEET.  
SEATING  
PLANE  
0.20 REF  
COMPLIANT TO JEDEC STANDARDS MO-220-WGGD.  
Figure 41. 24-Lead Lead Frame Chip Scale Package [LFCSP]  
4 mm × 4 mm Body and 0.75 mm Package Height  
(CP-24-7)  
Dimensions shown in millimeters  
ORDERING GUIDE  
Model1  
Temperature Range  
Package Description  
Package Option  
Ordering Qty  
ADN2915ACPZ  
EVALZ-ADN2915  
−40°C to +85°C  
24-Lead Lead Frame Chip Scale Package [LFCSP]  
Evaluation Board  
CP-24-7  
490  
1 Z = RoHS Compliant Part.  
Rev. A | Page 33 of 36  
 
 
ADN2915  
NOTES  
Data Sheet  
Rev. A | Page 34 of 36  
Data Sheet  
NOTES  
ADN2915  
Rev. A | Page 35 of 36  
ADN2915  
NOTES  
Data Sheet  
I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).  
©2013–2016 Analog Devices, Inc. All rights reserved. Trademarks and  
registered trademarks are the property of their respective owners.  
D08413-0-1/16(A)  
Rev. A | Page 36 of 36  

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