ADSP-BF592BCPZ [ADI]
Blackfin Embedded Processor; Blackfin嵌入式处理器型号: | ADSP-BF592BCPZ |
厂家: | ADI |
描述: | Blackfin Embedded Processor |
文件: | 总44页 (文件大小:1670K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Blackfin
Embedded Processor
ADSP-BF592
FEATURES
PERIPHERALS
Up to 400 MHz high performance Blackfin processor
Two 16-bit MACs, two 40-bit ALUs, four 8-bit video ALUs,
40-bit shifter
RISC-like register and instruction model for ease of
programming and compiler-friendly support
Advanced debug, trace, and performance monitoring
Accepts a wide range of supply voltages for internal and I/O
operations, see Operating Conditions on Page 16
Off-chip voltage regulator interface
Four 32-bit timers/counters, three with PWM support
2 dual-channel, full-duplex synchronous serial ports (SPORT),
supporting eight stereo I2S channels
2 serial peripheral interface (SPI) compatible ports
1 UART with IrDA support
Parallel peripheral interface (PPI), supporting ITU-R 656
video data formats
2-wire interface (TWI) controller
9 peripheral DMAs
64-lead (9 mm × 9 mm) LFCSP package
2 memory-to-memory DMA channels
Event handler with 28 interrupt inputs
32 general-purpose I/Os (GPIOs), with programmable
hysteresis
Debug/JTAG interface
On-chip PLL capable of frequency multiplication
MEMORY
68K bytes of core-accessible memory
(See Table 1 on Page 3 for L1 and L3 memory size details)
64K byte L1 instruction ROM
Flexible booting options from internal L1 ROM and SPI mem-
ory or from host devices including SPI, PPI, and UART
Memory management unit providing memory protection
WATCHDOG TIMER
SPORT1
PORT F
VOLTAGE REGULATOR INTERFACE
JTAG TEST AND EMULATION
PERIPHERAL
SPI0
TIMER2–0
UART
PPI
ACCESS BUS
GPIO
INTERRUPT
CONTROLLER
B
L1 INSTRUCTION
SRAM
SPORT0
SPI1
L1 INSTRUCTION
ROM
L1 DATA
SRAM
PORT G
DMA
CONTROLLER
DMA
ACCESS
BUS
DCB
TWI
DEB
BOOT
ROM
Figure 1. Processor Block Diagram
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©2013 Analog Devices, Inc. All rights reserved.
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ADSP-BF592
TABLE OF CONTENTS
Features ................................................................. 1
Memory ................................................................ 1
Peripherals ............................................................. 1
General Description ................................................. 3
Portable Low Power Architecture ............................. 3
System Integration ................................................ 3
Blackfin Processor Core .......................................... 3
Memory Architecture ............................................ 5
Event Handling .................................................... 5
DMA Controllers .................................................. 6
Processor Peripherals ............................................. 6
Dynamic Power Management .................................. 8
Voltage Regulation ................................................ 9
Clock Signals ....................................................... 9
Booting Modes ................................................... 11
Instruction Set Description ................................... 12
Development Tools ............................................. 12
Additional Information ........................................ 13
Related Signal Chains ........................................... 13
Signal Descriptions ................................................. 14
Specifications ........................................................ 16
Operating Conditions ........................................... 16
Electrical Characteristics ....................................... 18
Absolute Maximum Ratings ................................... 20
ESD Sensitivity ................................................... 20
Package Information ............................................ 21
Timing Specifications ........................................... 22
Output Drive Currents ......................................... 36
Test Conditions .................................................. 37
Environmental Conditions .................................... 40
64-Lead LFCSP Lead Assignment ............................... 41
Outline Dimensions ................................................ 43
Automotive Products .............................................. 44
Ordering Guide ..................................................... 44
REVISION HISTORY
7/13—Rev. A to Rev. B
Corrected Processor Block Diagram ............................. 1
Updated Development Tools .................................... 12
Updated text in Signal Descriptions ............................ 14
Corrected VDDINT rating in Table 14,
Absolute Maximum Ratings ..................................... 20
Rev. B
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ADSP-BF592
GENERAL DESCRIPTION
The ADSP-BF592 processor is a member of the Blackfin® family
of products, incorporating the Analog Devices/Intel Micro
Signal Architecture (MSA). Blackfin processors combine a dual-
MAC state-of-the-art signal processing engine, the advantages
of a clean, orthogonal RISC-like microprocessor instruction set,
and single-instruction, multiple-data (SIMD) multimedia capa-
bilities into a single instruction-set architecture.
SYSTEM INTEGRATION
The ADSP-BF592 processor is a highly integrated system-on-a-
chip solution for the next generation of digital communication
and consumer multimedia applications. By combining industry
standard interfaces with a high performance signal processing
core, cost-effective applications can be developed quickly, with-
out the need for costly external components. The system
peripherals include a watchdog timer; three 32-bit tim-
ers/counters with PWM support; two dual-channel, full-duplex
synchronous serial ports (SPORTs); two serial peripheral inter-
face (SPI) compatible ports; one UART® with IrDA support; a
parallel peripheral interface (PPI); and a 2-wire interface (TWI)
controller.
The ADSP-BF592 processor is completely code compatible with
other Blackfin processors. The ADSP-BF592 processor offers
performance up to 400 MHz and reduced static power con-
sumption. The processor features are shown in Table 1.
Table 1. Processor Features
Feature
ADSP-BF592
BLACKFIN PROCESSOR CORE
Timer/Counters with PWM
SPORTs
3
As shown in Figure 2, the Blackfin processor core contains two
16-bit multipliers, two 40-bit accumulators, two 40-bit ALUs,
four video ALUs, and a 40-bit shifter. The computation units
process 8-, 16-, or 32-bit data from the register file.
2
SPIs
2
UART
1
The compute register file contains eight 32-bit registers. When
performing compute operations on 16-bit operand data, the
register file operates as 16 independent 16-bit registers. All
operands for compute operations come from the multiported
register file and instruction constant fields.
Parallel Peripheral Interface
TWI
1
1
32
GPIOs
L1 Instruction SRAM
L1 Instruction ROM
L1 Data SRAM
32K
64K
Each MAC can perform a 16-bit by 16-bit multiply in each
cycle, accumulating the results into the 40-bit accumulators.
Signed and unsigned formats, rounding, and saturation
are supported.
32K
L1 Scratchpad SRAM
4K
L3 Boot ROM
4K
Maximum Instruction Rate1
Maximum System Clock Speed
Package Options
400 MHz
100 MHz
64-Lead LFCSP
The ALUs perform a traditional set of arithmetic and logical
operations on 16-bit or 32-bit data. In addition, many special
instructions are included to accelerate various signal processing
tasks. These include bit operations such as field extract and pop-
ulation count, modulo 232 multiply, divide primitives, saturation
and rounding, and sign/exponent detection. The set of video
instructions includes byte alignment and packing operations,
16-bit and 8-bit adds with clipping, 8-bit average operations,
and 8-bit subtract/absolute value/accumulate (SAA) operations.
The compare/select and vector search instructions are also
provided.
1 Maximum instruction rate is not available with every possible SCLK selection.
By integrating a rich set of industry-leading system peripherals
and memory, Blackfin processors are the platform of choice for
next-generation applications that require RISC-like program-
mability, multimedia support, and leading-edge signal
processing in one integrated package.
For certain instructions, two 16-bit ALU operations can be per-
formed simultaneously on register pairs (a 16-bit high half and
16-bit low half of a compute register). If the second ALU is used,
quad 16-bit operations are possible.
PORTABLE LOW POWER ARCHITECTURE
Blackfin processors provide world-class power management
and performance. They are produced with a low power and low
voltage design methodology and feature on-chip dynamic
power management, which provides the ability to vary both the
voltage and frequency of operation to significantly lower overall
power consumption. This capability can result in a substantial
reduction in power consumption, compared with just varying
the frequency of operation. This allows longer battery life for
portable appliances.
The 40-bit shifter can perform shifts and rotates and is used to
support normalization, field extract, and field deposit
instructions.
The program sequencer controls the flow of instruction execu-
tion, including instruction alignment and decoding. For
program flow control, the sequencer supports PC relative and
indirect conditional jumps (with static branch prediction) and
subroutine calls. Hardware is provided to support zero over
Rev. B
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ADSP-BF592
head looping. The architecture is fully interlocked, meaning that
the programmer need not manage the pipeline when executing
instructions with data dependencies.
The architecture provides three modes of operation: user mode,
supervisor mode, and emulation mode. User mode has
restricted access to certain system resources, thus providing a
protected software environment, while supervisor mode has
unrestricted access to the system and core resources.
The address arithmetic unit provides two addresses for simulta-
neous dual fetches from memory. It contains a multiported
register file consisting of four sets of 32-bit index, modify,
length, and base registers (for circular buffering) and eight
additional 32-bit pointer registers (for C-style indexed stack
manipulation).
The Blackfin processor instruction set has been optimized so
that 16-bit opcodes represent the most frequently used instruc-
tions, resulting in excellent compiled code density. Complex
DSP instructions are encoded into 32-bit opcodes, representing
fully featured multifunction instructions. Blackfin processors
support a limited multi-issue capability, where a 32-bit instruc-
tion can be issued in parallel with two 16-bit instructions,
allowing the programmer to use many of the core resources in a
single instruction cycle.
Blackfin processors support a modified Harvard architecture in
combination with a hierarchical memory structure. Level 1 (L1)
memories are those that typically operate at the full processor
speed with little or no latency. At the L1 level, the instruction
memory holds instructions only. Data memory holds data, and
a dedicated scratchpad data memory stores stack and local vari-
able information.
The Blackfin processor assembly language uses an algebraic syn-
tax for ease of coding and readability. The architecture has been
optimized for use in conjunction with the C/C++ compiler,
resulting in fast and efficient software implementations.
Multiple L1 memory blocks are provided. The memory
management unit (MMU) provides memory protection for
individual tasks that may be operating on the core and can
protect system registers from unintended access.
ADDRESS ARITHMETIC UNIT
SP
FP
P5
P4
I3
I2
I1
I0
L3
L2
L1
L0
B3
B2
B1
B0
M3
M2
M1
M0
DAG1
P3
DAG0
P2
P1
P0
DA1
DA0
32
32
32
PREG
32
RAB
SD
LD1
LD0
32
32
32
ASTAT
32
32
SEQUENCER
R7.H
R7.L
R6.H
R5.H
R4.H
R3.H
R2.H
R1.H
R0.H
R6.L
R5.L
R4.L
R3.L
R2.L
R1.L
R0.L
ALIGN
16
16
8
8
8
8
DECODE
BARREL
SHIFTER
LOOP BUFFER
40
40
40 40
A0
A1
CONTROL
UNIT
32
32
DATA ARITHMETIC UNIT
Figure 2. Blackfin Processor Core
Rev. B
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ADSP-BF592
Custom ROM (Optional)
MEMORY ARCHITECTURE
The on-chip L1 Instruction ROM on the ADSP-BF592 may be
customized to contain user code with the following features:
The Blackfin processor views memory as a single unified
4G byte address space, using 32-bit addresses. All resources,
including internal memory and I/O control registers, occupy
separate sections of this common address space. See Figure 3.
• 64K bytes of L1 Instruction ROM available for custom code
• Ability to restrict access to all or specific segments of the
on-chip ROM
The core-accessible L1 memory system is high performance
internal memory that operates at the core clock frequency. The
external bus interface unit (EBIU) provides access to the boot
ROM.
Customers wishing to customize the on-chip ROM for their
own application needs should contact ADI sales for more infor-
mation on terms and conditions and details on the technical
implementation.
The memory DMA controller provides high bandwidth data-
movement capability. It can perform block transfers of code or
data between the L1 Instruction SRAM and L1 Data SRAM
memory spaces.
I/O Memory Space
The processor does not define a separate I/O space. All
resources are mapped through the flat 32-bit address space.
On-chip I/O devices have their control registers mapped into
memory-mapped registers (MMRs) at addresses near the top of
the 4G byte address space. These are separated into two smaller
blocks, one which contains the control MMRs for all core func-
tions, and the other which contains the registers needed for
setup and control of the on-chip peripherals outside of the core.
The MMRs are accessible only in supervisor mode and appear
as reserved space to on-chip peripherals.
0xFFFF FFFF
CORE MEMORY MAPPED REGISTERS (2M BYTES)
0xFFE0 0000
SYSTEM MEMORY MAPPED REGISTERS (2M BYTES)
0xFFC0 0000
RESERVED
0xFFB0 1000
L1 SCRATCHPAD RAM (4K BYTES)
0xFFB0 0000
RESERVED
0xFFA2 0000
L1 INSTRUCTION ROM (64K BYTES)
0xFFA1 0000
RESERVED
Booting from ROM
0xFFA0 8000
L1 INSTRUCTION BANK B SRAM (16K BYTES)
0xFFA0 4000
L1 INSTRUCTION BANK A SRAM (16K BYTES)
0xFFA0 0000
The processor contains a small on-chip boot kernel, which con-
figures the appropriate peripheral for booting. If the processor is
configured to boot from boot ROM memory space, the proces-
sor starts executing from the on-chip boot ROM. For more
information, see Booting Modes on Page 11.
RESERVED
0xFF80 8000
DATA SRAM (32K BYTES)
0xFF80 0000
RESERVED
0xEF00 1000
BOOT ROM (4K BYTES)
EVENT HANDLING
0xEF00 0000
RESERVED
0x0000 0000
The event controller on the processor handles all asynchronous
and synchronous events to the processor. The processor
provides event handling that supports both nesting and prioriti-
zation. Nesting allows multiple event service routines to be
active simultaneously. Prioritization ensures that servicing of a
higher-priority event takes precedence over servicing of a lower-
priority event. The controller provides support for five different
types of events:
Figure 3. Internal/External Memory Map
Internal (Core-Accessible) Memory
The processor has three blocks of core-accessible memory, pro-
viding high bandwidth access to the core.
The first block is the L1 instruction memory, consisting of
32K bytes SRAM. This memory is accessed at full processor
speed.
• Emulation – An emulation event causes the processor to
enter emulation mode, allowing command and control of
the processor via the JTAG interface.
The second core-accessible memory block is the L1 data mem-
ory, consisting of 32K bytes. This memory block is accessed at
full processor speed.
• RESET – This event resets the processor.
• Nonmaskable Interrupt (NMI) – The NMI event can be
generated by the software watchdog timer or by the NMI
input signal to the processor. The NMI event is frequently
used as a power-down indicator to initiate an orderly shut-
down of the system.
The third memory block is a 4K byte L1 scratchpad SRAM,
which runs at the same speed as the other L1 memories.
L1 Utility ROM
The L1 instruction ROM contains utility ROM code. This
includes the TMK (VDK core), C run-time libraries, and DSP
libraries. See the VisualDSP++ documentation for more
information.
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ADSP-BF592
• Exceptions – Events that occur synchronously to program
flow (in other words, the exception is taken before the
instruction is allowed to complete). Conditions such as
data alignment violations and undefined instructions cause
exceptions.
The processor DMA controller supports both one-dimensional
(1-D) and two-dimensional (2-D) DMA transfers. DMA trans-
fer initialization can be implemented from registers or from sets
of parameters called descriptor blocks.
The 2-D DMA capability supports arbitrary row and column
sizes up to 64K elements by 64K elements, and arbitrary row
and column step sizes up to 32K elements. Furthermore, the
column step size can be less than the row step size, allowing
implementation of interleaved data streams. This feature is
especially useful in video applications where data can be de-
interleaved on the fly.
• Interrupts – Events that occur asynchronously to program
flow. They are caused by input signals, timers, and other
peripherals, as well as by an explicit software instruction.
Each event type has an associated register to hold the return
address and an associated return-from-event instruction. When
an event is triggered, the state of the processor is saved on the
supervisor stack.
Examples of DMA types supported by the processor DMA con-
troller include:
The processor event controller consists of two stages: the core
event controller (CEC) and the system interrupt controller
(SIC). The core event controller works with the system interrupt
controller to prioritize and control all system events. Conceptu-
ally, interrupts from the peripherals enter into the SIC and are
then routed directly into the general-purpose interrupts of the
CEC.
• A single, linear buffer that stops upon completion
• A circular, auto-refreshing buffer that interrupts on each
full or fractionally full buffer
• 1-D or 2-D DMA using a linked list of descriptors
• 2-D DMA using an array of descriptors, specifying only the
base DMA address within a common page
Core Event Controller (CEC)
In addition to the dedicated peripheral DMA channels, there are
two memory DMA channels, which are provided for transfers
between the various memories of the processor system with
minimal processor intervention. Memory DMA transfers can be
controlled by a very flexible descriptor-based methodology or
by a standard register-based autobuffer mechanism.
The CEC supports nine general-purpose interrupts (IVG15–7),
in addition to the dedicated interrupt and exception events. Of
these general-purpose interrupts, the two lowest priority
interrupts (IVG15–14) are recommended to be reserved for
software interrupt handlers, leaving seven prioritized interrupt
inputs to support the peripherals of the processor. The inputs to
the CEC, their names in the event vector table (EVT), and their
priorities are described in the ADSP-BF59x Blackfin Processor
Hardware Reference, “System Interrupts” chapter.
PROCESSOR PERIPHERALS
The ADSP-BF592 processor contains a rich set of peripherals
connected to the core via several high bandwidth buses, provid-
ing flexibility in system configuration, as well as excellent
overall system performance (see Figure 1). The processor also
contains dedicated communication modules and high speed
serial and parallel ports, an interrupt controller for flexible man-
agement of interrupts from the on-chip peripherals or external
sources, and power management control functions to tailor the
performance and power characteristics of the processor and sys-
tem to many application scenarios.
System Interrupt Controller (SIC)
The system interrupt controller provides the mapping and rout-
ing of events from the many peripheral interrupt sources to the
prioritized general-purpose interrupt inputs of the CEC.
Although the processor provides a default mapping, the user
can alter the mappings and priorities of interrupt events by writ-
ing the appropriate values into the interrupt assignment
registers (SIC_IARx). The inputs into the SIC and the default
mappings into the CEC are described in the ADSP-BF59x Black-
fin Processor Hardware Reference, “System Interrupts” chapter.
The SPORTs, SPIs, UART, and PPI peripherals are supported
by a flexible DMA structure. There are also separate memory
DMA channels dedicated to data transfers between the proces-
sor’s various memory spaces, including boot ROM. Multiple
on-chip buses running at up to 100 MHz provide enough band-
width to keep the processor core running along with activity on
all of the on-chip and external peripherals.
The SIC allows further control of event processing by providing
three pairs of 32-bit interrupt control and status registers. Each
register contains a bit, corresponding to each peripheral inter-
rupt event. For more information, see the ADSP-BF59x Blackfin
Processor Hardware Reference, “System Interrupts” chapter.
The ADSP-BF592 processor includes an interface to an off-chip
voltage regulator in support of the processor’s dynamic power
management capability.
DMA CONTROLLERS
The processor has multiple, independent DMA channels that
support automated data transfers with minimal overhead for
the processor core. DMA transfers can occur between the pro-
cessor’s internal memories and any of its DMA-capable
peripherals. DMA-capable peripherals include the SPORTs, SPI
ports, UART, and PPI. Each individual DMA-capable periph-
eral has at least one dedicated DMA channel.
Watchdog Timer
The processor includes a 32-bit timer that can be used to imple-
ment a software watchdog function. A software watchdog can
improve system availability by forcing the processor to a known
state through generation of a hardware reset, nonmaskable
interrupt (NMI), or general-purpose interrupt, if the timer
expires before being reset by software. The programmer
Rev. B
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ADSP-BF592
initializes the count value of the timer, enables the appropriate
interrupt, then enables the timer. Thereafter, the software must
reload the counter before it counts to zero from the pro-
grammed value. This protects the system from remaining in an
unknown state where software, which would normally reset the
timer, has stopped running due to an external noise condition
or software error.
Serial Peripheral Interface (SPI) Ports
The processor has two SPI-compatible ports that enable the
processor to communicate with multiple SPI-compatible
devices.
The SPI interface uses three pins for transferring data: two data
pins (Master Output-Slave Input, MOSI, and Master Input-
Slave Output, MISO) and a clock pin (serial clock, SCK). An SPI
chip select input pin (SPIx_SS) lets other SPI devices select the
processor, and many SPI chip select output pins (SPIx_SEL7–1)
let the processor select other SPI devices. The SPI select pins are
reconfigured general-purpose I/O pins. Using these pins, the
SPI port provides a full-duplex, synchronous serial interface,
which supports both master/slave modes and multimaster
environments.
If configured to generate a hardware reset, the watchdog timer
resets both the core and the processor peripherals. After a reset,
software can determine whether the watchdog was the source of
the hardware reset by interrogating a status bit in the watchdog
timer control register.
The timer is clocked by the system clock (SCLK) at a maximum
frequency of fSCLK
.
Timers
UART Port
There are four general-purpose programmable timer units in
the processor. Three timers have an external pin that can be
configured either as a pulse width modulator (PWM) or timer
output, as an input to clock the timer, or as a mechanism for
measuring pulse widths and periods of external events. These
timers can be synchronized to an external clock input to the sev-
eral other associated PF pins, to an external clock input to the
PPI_CLK input pin, or to the internal SCLK.
The ADSP-BF592 processor provides a full-duplex universal
asynchronous receiver/transmitter (UART) port, which is fully
compatible with PC-standard UARTs. The UART port provides
a simplified UART interface to other peripherals or hosts,
supporting full-duplex, DMA-supported, asynchronous trans-
fers of serial data. The UART port includes support for five to
eight data bits, one or two stop bits, and none, even, or odd par-
ity. The UART port supports two modes of operation:
The timer units can be used in conjunction with the UART to
measure the width of the pulses in the data stream to provide a
software auto-baud detect function for the respective serial
channels.
• PIO (programmed I/O) – The processor sends or receives
data by writing or reading I/O mapped UART registers.
The data is double-buffered on both transmit and receive.
• DMA (direct memory access) – The DMA controller trans-
fers both transmit and receive data. This reduces the
number and frequency of interrupts required to transfer
data to and from memory. The UART has two dedicated
DMA channels, one for transmit and one for receive. These
DMA channels have lower default priority than most DMA
channels because of their relatively low service rates.
The timers can generate interrupts to the processor core provid-
ing periodic events for synchronization, either to the system
clock or to a count of external signals.
In addition to the three general-purpose programmable timers,
a fourth timer is also provided. This extra timer is clocked by the
internal processor clock and is typically used as a system tick
clock for generation of operating system periodic interrupts.
Parallel Peripheral Interface (PPI)
Serial Ports
The processor provides a parallel peripheral interface (PPI) that
can connect directly to parallel analog-to-digital and digital-to-
analog converters, video encoders and decoders, and other gen-
eral-purpose peripherals. The PPI consists of a dedicated input
clock pin, up to three frame synchronization pins, and up to 16
data pins. The input clock supports parallel data rates up to half
the system clock rate, and the synchronization signals can be
configured as either inputs or outputs.
The ADSP-BF592 processor incorporates two dual-channel
synchronous serial ports (SPORT0 and SPORT1) for serial and
multiprocessor communications. The SPORTs support the fol-
lowing features:
Serial port data can be automatically transferred to and from
on-chip memory/external memory via dedicated DMA chan-
nels. Each of the serial ports can work in conjunction with
another serial port to provide TDM support. In this configura-
tion, one SPORT provides two transmit signals while the other
SPORT provides the two receive signals. The frame sync and
clock are shared.
The PPI supports a variety of general-purpose and ITU-R 656
modes of operation. In general-purpose mode, the PPI provides
half-duplex, bidirectional data transfer with up to 16 bits of
data. Up to three frame synchronization signals are also pro-
vided. In ITU-R 656 mode, the PPI provides half-duplex
bidirectional transfer of 8- or 10-bit video data. Additionally,
on-chip decode of embedded start-of-line (SOL) and start-of-
field (SOF) preamble packets is supported.
Serial ports operate in five modes:
• Standard DSP serial mode
• Multichannel (TDM) mode
• I2S mode
• Packed I2S mode
• Left-justified mode
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ADSP-BF592
General-Purpose Mode Descriptions
DYNAMIC POWER MANAGEMENT
The general-purpose modes of the PPI are intended to suit a
wide variety of data capture and transmission applications.
Three distinct submodes are supported:
The processor provides five operating modes, each with a differ-
ent performance/power profile. In addition, dynamic power
management provides the control functions to dynamically alter
the processor core supply voltage, further reducing power dissi-
pation. When configured for a 0 V core supply voltage, the
processor enters the hibernate state. Control of clocking to each
of the processor peripherals also reduces power consumption.
See Table 2 for a summary of the power settings for each mode.
• Input mode – Frame syncs and data are inputs into the PPI.
Input mode is intended for ADC applications, as well as
video communication with hardware signaling.
• Frame capture mode – Frame syncs are outputs from the
PPI, but data are inputs. This mode allows the video
source(s) to act as a slave (for frame capture for example).
Table 2. Power Settings
• Output mode – Frame syncs and data are outputs from the
PPI. Output mode is used for transmitting video or other
data with up to three output frame syncs.
Core
Clock
System
Clock
PLL
Core
Mode/State PLL
Bypassed (CCLK) (SCLK) Power
ITU-R 656 Mode Descriptions
Full On
Active
Enabled No
Enabled Enabled On
The ITU-R 656 modes of the PPI are intended to suit a wide
variety of video capture, processing, and transmission applica-
tions. Three distinct submodes are supported:
Enabled/ Yes
Enabled Enabled On
Disabled
Enabled
Sleep
—
Disabled Enabled On
Disabled Disabled On
Disabled Disabled Off
• Active video only mode – Active video only mode is used
when only the active video portion of a field is of interest
and not any of the blanking intervals.
Deep Sleep Disabled —
Hibernate Disabled —
• Vertical blanking only mode – In this mode, the PPI only
transfers vertical blanking interval (VBI) data.
Full-On Operating Mode—Maximum Performance
In the full-on mode, the PLL is enabled and is not bypassed,
providing capability for maximum operational frequency. This
is the power-up default execution state in which maximum per-
formance can be achieved. The processor core and all enabled
peripherals run at full speed.
• Entire field mode – In this mode, the entire incoming bit
stream is read in through the PPI.
TWI Controller Interface
The processor includes a 2-wire interface (TWI) module for
providing a simple exchange method of control data between
multiple devices. The TWI is functionally compatible with the
widely used I2C® bus standard. The TWI module offers the
capabilities of simultaneous master and slave operation and
support for both 7-bit addressing and multimedia data arbitra-
tion. The TWI interface utilizes two pins for transferring clock
(SCL) and data (SDA) and supports the protocol at speeds up to
400K bits/sec.
Active Operating Mode—Moderate Dynamic Power
Savings
In the active mode, the PLL is enabled but bypassed. Because the
PLL is bypassed, the processor’s core clock (CCLK) and system
clock (SCLK) run at the input clock (CLKIN) frequency. DMA
access is available to appropriately configured L1 memories.
For more information about PLL controls, see the “Dynamic
Power Management” chapter in the ADSP-BF59x Blackfin Pro-
cessor Hardware Reference.
The TWI module is compatible with serial camera control bus
(SCCB) functionality for easier control of various CMOS cam-
era sensor devices.
Sleep Operating Mode—High Dynamic Power Savings
The sleep mode reduces dynamic power dissipation by disabling
the clock to the processor core (CCLK). The PLL and system
clock (SCLK), however, continue to operate in this mode. Typi-
cally, an external event wakes up the processor.
Ports
The processor groups the many peripheral signals to two
ports—Port F and Port G. Most of the associated pins are shared
by multiple signals. The ports function as multiplexer controls.
System DMA access to L1 memory is not supported in
sleep mode.
General-Purpose I/O (GPIO)
The processor has 32 bidirectional, general-purpose I/O (GPIO)
pins allocated across two separate GPIO modules—PORTFIO
and PORTGIO, associated with Port F and Port G respectively.
Each GPIO-capable pin shares functionality with other proces-
sor peripherals via a multiplexing scheme; however, the GPIO
functionality is the default state of the device upon power-up.
Neither GPIO output nor input drivers are active by default.
Each general-purpose port pin can be individually controlled by
manipulation of the port control, status, and interrupt registers.
Deep Sleep Operating Mode—Maximum Dynamic Power
Savings
The deep sleep mode maximizes dynamic power savings by dis-
abling the clocks to the processor core (CCLK) and to all
synchronous peripherals (SCLK). Asynchronous peripherals
may still be running but cannot access internal resources or
external memory. This powered-down mode can only be exited
by assertion of the reset interrupt (RESET) or by an asynchro-
nous interrupt generated by a GPIO pin.
Rev. B
| Page 8 of 44 | July 2013
ADSP-BF592
Note that when a GPIO pin is used to trigger wake from deep
sleep, the programmed wake level must linger for at least 10ns
to guarantee detection.
Power Savings Factor
fCCLKRED VDDINTRED
2
TRED
= ------------------- ------------------------ -----------
TNOM
fCCLKNOM
VDDINTNOM
Hibernate State—Maximum Static Power Savings
The hibernate state maximizes static power savings by disabling
clocks to the processor core (CCLK) and to all of the peripherals
(SCLK), as well as signaling an external voltage regulator that
% Power Savings = 1 – Power Savings Factor 100%
VDDINT can be shut off. Any critical information stored inter-
nally (for example, memory contents, register contents, and
other information) must be written to a nonvolatile storage
device prior to removing power if the processor state is to be
preserved. Writing b#0 to the HIBERNATE bit causes
EXT_WAKE to transition low, which can be used to signal an
external voltage regulator to shut down.
where:
f
f
CCLKNOM is the nominal core clock frequency
CCLKRED is the reduced core clock frequency
V
V
DDINTNOM is the nominal internal supply voltage
DDINTRED is the reduced internal supply voltage
Since VDDEXT can still be supplied in this mode, all of the exter-
nal pins three-state, unless otherwise specified. This allows
other devices that may be connected to the processor to still
have power applied without drawing unwanted current.
T
NOM is the duration running at fCCLKNOM
RED is the duration running at fCCLKRED
T
VOLTAGE REGULATION
As long as VDDEXT is applied, the VR_CTL register maintains its
state during hibernation. All other internal registers and memo-
ries, however, lose their content in the hibernate state.
The ADSP-BF592 processor requires an external voltage regula-
tor to power the VDDINT domain. To reduce standby power
consumption, the external voltage regulator can be signaled
through EXT_WAKE to remove power from the processor core.
This signal is high-true for power-up and may be connected
directly to the low-true shut-down input of many common
regulators.
Power Savings
As shown in Table 3, the processor supports two different
power domains, which maximizes flexibility while maintaining
compliance with industry standards and conventions. By isolat-
ing the internal logic of the processor into its own power
domain, separate from other I/O, the processor can take advan-
tage of dynamic power management without affecting the other
I/O devices. There are no sequencing requirements for the
various power domains, but all domains must be powered
according to the appropriate Specifications table for processor
operating conditions, even if the feature/peripheral is not used.
While in the hibernate state, the external supply, VDDEXT, can
still be applied, eliminating the need for external buffers. The
external voltage regulator can be activated from this power-
down state by asserting the RESET pin, which then initiates a
boot sequence. EXT_WAKE indicates a wakeup to the external
voltage regulator.
The power good (PG) input signal allows the processor to start
only after the internal voltage has reached a chosen level. In this
way, the startup time of the external regulator is detected after
hibernation. For a complete description of the power-good
functionality, refer to the ADSP-BF59x Blackfin Processor Hard-
ware Reference.
Table 3. Power Domains
Power Domain
VDD Range
VDDINT
All internal logic and memories
All other I/O
VDDEXT
CLOCK SIGNALS
The dynamic power management feature of the processor
allows both the processor’s input voltage (VDDINT) and clock fre-
quency (fCCLK) to be dynamically controlled.
The processor can be clocked by an external crystal, a sine wave
input, or a buffered, shaped clock derived from an external
clock oscillator.
The power dissipated by a processor is largely a function of its
clock frequency and the square of the operating voltage. For
example, reducing the clock frequency by 25% results in a 25%
reduction in dynamic power dissipation, while reducing the
voltage by 25% reduces dynamic power dissipation by more
than 40%. Further, these power savings are additive, in that if
the clock frequency and supply voltage are both reduced, the
power savings can be dramatic, as shown in the following
equations.
If an external clock is used, it should be a TTL-compatible signal
and must not be halted, changed, or operated below the speci-
fied frequency during normal operation. This signal is
connected to the processor’s CLKIN pin. When an external
clock is used, the XTAL pin must be left unconnected.
Alternatively, because the processor includes an on-chip oscilla-
tor circuit, an external crystal may be used. For fundamental
frequency operation, use the circuit shown in Figure 4. A
parallel-resonant, fundamental frequency, microprocessor-
grade crystal is connected across the CLKIN and XTAL pins.
The on-chip resistance between CLKIN and the XTAL pin is in
the 500 kΩ range. Further parallel resistors are typically not
Rev. B
|
Page 9 of 44 | July 2013
ADSP-BF592
recommended. The two capacitors and the series resistor shown
in Figure 4 fine tune phase and amplitude of the sine frequency.
“FINE” ADJUSTMENT
REQUIRES PLL SEQUENCING
“COARSE” ADJUSTMENT
ON-THE-FLY
The capacitor and resistor values shown in Figure 4 are typical
values only. The capacitor values are dependent upon the crystal
manufacturers’ load capacitance recommendations and the PCB
physical layout. The resistor value depends on the drive level
specified by the crystal manufacturer. The user should verify the
customized values based on careful investigations on multiple
devices over temperature range.
CCLK
÷ 1, 2, 4, 8
PLL
5u to 64u
CLKIN
VCO
SCLK
÷ 1 to 15
SCLK d CCLK
BLACKFIN
Figure 5. Frequency Modification Methods
CLKOUT (SCLK)
CLKBUF
TO PLL CIRCUITRY
All on-chip peripherals are clocked by the system clock (SCLK).
The system clock frequency is programmable by means of the
SSEL3–0 bits of the PLL_DIV register. The values programmed
into the SSEL fields define a divide ratio between the PLL output
(VCO) and the system clock. SCLK divider values are 1 through
15. Table 4 illustrates typical system clock ratios.
EN
EN
SELECT
560 ⍀
XTAL
EXTCLK
CLKIN
18 pF *
330 ⍀*
Table 4. Example System Clock Ratios
FOR OVERTONE
OPERATION ONLY:
Example Frequency Ratios
18 pF *
(MHz)
Signal Name Divider Ratio
SSEL3–0
VCO/SCLK
VCO
100
300
400
SCLK
NOTE: VALUES MARKED WITH * MUST BE CUSTOMIZED, DEPENDING
ON THE CRYSTAL AND LAYOUT. PLEASE ANALYZE CAREFULLY. FOR
FREQUENCIES ABOVE 33 MHz, THE SUGGESTED CAPACITOR VALUE
OF 18 pF SHOULD BE TREATED AS A MAXIMUM, AND THE SUGGESTED
RESISTOR VALUE SHOULD BE REDUCED TO 0 ⍀.
0010
2:1
50
50
40
0110
6:1
1010
10:1
Figure 4. External Crystal Connections
Note that the divisor ratio must be chosen to limit the system
clock frequency to its maximum of fSCLK. The SSEL value can be
changed dynamically without any PLL lock latencies by writing
the appropriate values to the PLL divisor register (PLL_DIV).
A third-overtone crystal can be used for frequencies above
25 MHz. The circuit is then modified to ensure crystal operation
only at the third overtone, by adding a tuned inductor circuit as
shown in Figure 4. A design procedure for third-overtone oper-
ation is discussed in detail in (EE-168) Using Third Overtone
Crystals with the ADSP-218x DSP on the Analog Devices web-
site (www.analog.com)—use site search on “EE-168.”
The core clock (CCLK) frequency can also be dynamically
changed by means of the CSEL1–0 bits of the PLL_DIV register.
Supported CCLK divider ratios are 1, 2, 4, and 8, as shown in
Table 5. This programmable core clock capability is useful for
fast core frequency modifications.
The Blackfin core runs at a different clock rate than the on-chip
peripherals. As shown in Figure 5, the core clock (CCLK) and
system peripheral clock (SCLK) are derived from the input
clock (CLKIN) signal. An on-chip PLL is capable of multiplying
the CLKIN signal by a programmable 5× to 64× multiplication
factor (bounded by specified minimum and maximum VCO
frequencies). The default multiplier is 6×, but it can be modified
by a software instruction sequence.
Table 5. Core Clock Ratios
Example Frequency Ratios
(MHz)
Signal Name Divider Ratio
CSEL1–0
VCO/CCLK
VCO
300
300
400
200
CCLK
00
01
10
11
1:1
2:1
4:1
8:1
300
150
100
25
On-the-fly frequency changes can be effected by simply writing
to the PLL_DIV register. The maximum allowed CCLK and
SCLK rates depend on the applied voltages VDDINT and VDDEXT
;
the VCO is always permitted to run up to the frequency speci-
fied by the part’s instruction rate. The EXTCLK pin can be
configured to output either the SCLK frequency or the input
buffered CLKIN frequency, called CLKBUF. When configured
to output SCLK (CLKOUT), the EXTCLK pin acts as a refer-
ence signal in many timing specifications. While three-stated by
default, it can be enabled using the VRCTL register.
The maximum CCLK frequency both depends on the part’s
instruction rate (see Ordering Guide) and depends on the
applied VDDINT voltage. See Table 8 for details. The maximal sys-
tem clock rate (SCLK) depends on the chip package and the
applied VDDINT and VDDEXT voltages (see Table 10).
Rev. B
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July 2013
ADSP-BF592
• SPI0 master boot from flash (BMODE = 0x4) — In this
mode SPI0 is configured to operate in master mode and to
connect to 8-, 16-, 24-, or 32-bit addressable devices. The
processor uses the PF8/SPI0_SSEL2 to select a single SPI
EEPROM/flash device, submits a read command and suc-
cessive address bytes (0×00) until a valid 8-, 16-, 24-, or 32-
bit addressable device is detected, and begins clocking data
into the processor. Pull-up resistors are required on the
SSEL and MISO pins. By default, a value of 0×85 is written
to the SPI_BAUD register.
BOOTING MODES
The processor has several mechanisms (listed in Table 6) for
automatically loading internal and external memory after a
reset. The boot mode is defined by the BMODE input pins dedi-
cated to this purpose. There are two categories of boot modes.
In master boot modes, the processor actively loads data from
parallel or serial memories. In slave boot modes, the processor
receives data from external host devices.
Table 6. Booting Modes
• Boot from PPI host device (BMODE = 0x5) — The proces-
sor operates in PPI slave mode and is configured to receive
the bytes of the LDR file from a PPI host (master) agent.
BMODE2–0 Description
000
001
010
011
100
101
110
111
Idle/No Boot
Reserved
• Boot from UART host device (BMODE = 0x6) — In this
mode UART0 is used as the booting source. Using an auto-
baud handshake sequence, a boot-stream formatted
program is downloaded by the host. The host selects a bit
rate within the UART clocking capabilities. When per-
forming the autobaud, the UART expects a “@” (0×40)
character (eight bits data, one start bit, one stop bit, no par-
ity bit) on the RXD pin to determine the bit rate. The
UART then replies with an acknowledgment which is com-
posed of 4 bytes (0xBF—the value of UART_DLL) and
(0×00—the value of UART_DLH). The host can then
download the boot stream. To hold off the host the proces-
sor signals the host with the boot host wait (HWAIT)
signal. Therefore, the host must monitor the HWAIT, (on
PG4), before every transmitted byte.
SPI1 master boot from Flash, using SPI1_SSEL5 on PG11
SPI1 slave boot from external master
SPI0 master boot from Flash, using SPI0_SSEL2 on PF8
Boot from PPI port
Boot from UART host device
Execute from Internal L1 ROM
The boot modes listed in Table 6 provide a number of mecha-
nisms for automatically loading the processor’s internal and
external memories after a reset. By default, all boot modes use
the slowest meaningful configuration settings. Default settings
can be altered via the initialization code feature at boot time.
The BMODE pins of the reset configuration register, sampled
during power-on resets and software-initiated resets, imple-
ment the modes shown in Table 6.
• Execute from internal L1 ROM (BMODE = 0x7) — In this
mode the processor begins execution from the on-chip 64k
byte L1 instruction ROM starting at address 0xFFA1 0000.
• IDLE State/No Boot (BMODE - 0x0) — In this mode, the
boot kernel transitions the processor into Idle state. The
processor can then be controlled through JTAG for recov-
ery, debug, or other functions.
For each of the boot modes (except Execute from internal L1
ROM), a 16 byte header is first brought in from an external
device. The header specifies the number of bytes to be trans-
ferred and the memory destination address. Multiple memory
blocks may be loaded by any boot sequence. Once all blocks are
loaded, program execution commences from the start of L1
instruction SRAM.
• SPI1 master boot from flash (BMODE = 0x2) — In this
mode, SPI1 is configured to operate in master mode and to
connect to 8-, 16-, 24-, or 32-bit addressable devices. The
processor uses the PG11/SPI1_SSEL5 to select a single SPI
EEPROM/flash device, submits a read command and suc-
cessive address bytes (0×00) until a valid 8-, 16-, 24-, or 32-
bit addressable device is detected, and begins clocking data
into the processor. Pull-up resistors are required on the
SSEL and MISO pins. By default, a value of 0×85 is written
to the SPI_BAUD register.
The boot kernel differentiates between a regular hardware reset
and a wakeup-from-hibernate event to speed up booting in the
latter case. Bits 7–4 in the system reset configuration (SYSCR)
register can be used to bypass the boot kernel or simulate a
wakeup-from-hibernate boot in case of a software reset.
The boot process can be further customized by “initialization
code.” This is a piece of code that is loaded and executed prior to
the regular application boot. Typically, this is used to speed up
booting by managing the PLL, clock frequencies, or serial bit
rates.
• SPI1 slave boot from external master (BMODE = 0x3) — In
this mode, SPI1 is configured to operate in slave mode and
to receive the bytes of the .LDR file from a SPI host (mas-
ter) agent. To hold off the host device from transmitting
while the boot ROM is busy, the Blackfin processor asserts
a GPIO pin, called host wait (HWAIT), to signal to the host
device not to send any more bytes until the pin is deas-
serted. The host must interrogate the HWAIT signal,
available on PG4, before transmitting every data unit to the
processor. A pull-up resistor is required on the SPI1_SS
input. A pull-down on the serial clock may improve signal
quality and booting robustness.
The boot ROM also features C-callable functions that can be
called by the user application at run time. This enables second
stage boot or boot management schemes to be implemented
with ease.
Rev. B
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ADSP-BF592
The other Analog Devices IDE, VisualDSP++, supports proces-
sor families introduced prior to the release of CrossCore
Embedded Studio. This IDE includes the Analog Devices VDK
real time operating system and an open source TCP/IP stack.
For more information visit www.analog.com/visualdsp. Note
that VisualDSP++ will not support future Analog Devices
processors.
INSTRUCTION SET DESCRIPTION
The Blackfin processor family assembly language instruction set
employs an algebraic syntax designed for ease of coding and
readability. The instructions have been specifically tuned to pro-
vide a flexible, densely encoded instruction set that compiles to
a very small final memory size. The instruction set also provides
fully featured multifunction instructions that allow the pro-
grammer to use many of the processor core resources in a single
instruction. Coupled with many features more often seen on
microcontrollers, this instruction set is very efficient when com-
piling C and C++ source code. In addition, the architecture
supports both user (algorithm/application code) and supervisor
(O/S kernel, device drivers, debuggers, ISRs) modes of opera-
tion, allowing multiple levels of access to core
EZ-KIT Lite Evaluation Board
For processor evaluation, Analog Devices provides wide range
of EZ-KIT Lite® evaluation boards. Including the processor and
key peripherals, the evaluation board also supports on-chip
emulation capabilities and other evaluation and development
features. Also available are various EZ-Extenders®, which are
daughter cards delivering additional specialized functionality,
including audio and video processing. For more information
visit www.analog.com and search on “ezkit” or “ezextender”.
processor resources.
The assembly language, which takes advantage of the proces-
sor’s unique architecture, offers the following advantages:
EZ-KIT Lite Evaluation Kits
• Seamlessly integrated DSP/MCU features are optimized for
both 8-bit and 16-bit operations.
For a cost-effective way to learn more about developing with
Analog Devices processors, Analog Devices offer a range of EZ-
KIT Lite evaluation kits. Each evaluation kit includes an EZ-KIT
Lite evaluation board, directions for downloading an evaluation
version of the available IDE(s), a USB cable, and a power supply.
The USB controller on the EZ-KIT Lite board connects to the
USB port of the user’s PC, enabling the chosen IDE evaluation
suite to emulate the on-board processor in-circuit. This permits
the customer to download, execute, and debug programs for the
EZ-KIT Lite system. It also supports in-circuit programming of
the on-board Flash device to store user-specific boot code,
enabling standalone operation. With the full version of Cross-
Core Embedded Studio or VisualDSP++ installed (sold
separately), engineers can develop software for supported EZ-
KITs or any custom system utilizing supported Analog Devices
processors.
• A multi-issue load/store modified-Harvard architecture,
which supports two 16-bit MAC or four 8-bit ALU + two
load/store + two pointer updates per cycle.
• All registers, I/O, and memory are mapped into a unified
4G byte memory space, providing a simplified program-
ming model.
• Microcontroller features, such as arbitrary bit and bit-field
manipulation, insertion, and extraction; integer operations
on 8-, 16-, and 32-bit data-types; and separate user and
supervisor stack pointers.
• Code density enhancements, which include intermixing of
16-bit and 32-bit instructions (no mode switching, no code
segregation). Frequently used instructions are encoded
in 16 bits.
Software Add-Ins for CrossCore Embedded Studio
DEVELOPMENT TOOLS
Analog Devices offers software add-ins which seamlessly inte-
grate with CrossCore Embedded Studio to extend its capabilities
and reduce development time. Add-ins include board support
packages for evaluation hardware, various middleware pack-
ages, and algorithmic modules. Documentation, help,
configuration dialogs, and coding examples present in these
add-ins are viewable through the CrossCore Embedded Studio
IDE once the add-in is installed.
Analog Devices supports its processors with a complete line of
software and hardware development tools, including integrated
development environments (which include CrossCore® Embed-
ded Studio and/or VisualDSP++®), evaluation products,
emulators, and a wide variety of software add-ins.
Integrated Development Environments (IDEs)
For C/C++ software writing and editing, code generation, and
debug support, Analog Devices offers two IDEs.
Board Support Packages for Evaluation Hardware
The newest IDE, CrossCore Embedded Studio, is based on the
Software support for the EZ-KIT Lite evaluation boards and EZ-
Extender daughter cards is provided by software add-ins called
Board Support Packages (BSPs). The BSPs contain the required
drivers, pertinent release notes, and select example code for the
given evaluation hardware. A download link for a specific BSP is
located on the web page for the associated EZ-KIT or EZ-
Extender product. The link is found in the Product Download
area of the product web page.
TM
Eclipse framework. Supporting most Analog Devices proces-
sor families, it is the IDE of choice for future processors,
including multicore devices. CrossCore Embedded Studio
seamlessly integrates available software add-ins to support real
time operating systems, file systems, TCP/IP stacks, USB stacks,
algorithmic software modules, and evaluation hardware board
support packages. For more information, visit
www.analog.com/cces.
Rev. B
|
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|
July 2013
ADSP-BF592
gather and process data or to apply system controls based on
analysis of real-time phenomena. For more information about
this term and related topics, see the “signal chain” entry in the
Glossary of EE Terms on the Analog Devices website.
Middleware Packages
Analog Devices separately offers middleware add-ins such as
real time operating systems, file systems, USB stacks, and
TCP/IP stacks. For more information see the following web
pages:
Analog Devices eases signal processing system development by
providing signal processing components that are designed to
work together well. A tool for viewing relationships between
specific applications and related components is available on the
www.analog.com website.
• www.analog.com/ucos3
• www.analog.com/ucfs
• www.analog.com/ucusbd
• www.analog.com/lwip
TM
The Circuits from the Lab site (www.analog.com\circuits)
provides:
Algorithmic Modules
• Graphical circuit block diagram presentation of signal
chains for a variety of circuit types and applications
To speed development, Analog Devices offers add-ins that per-
form popular audio and video processing algorithms. These are
available for use with both CrossCore Embedded Studio and
VisualDSP++. For more information visit www.analog.com and
search on “Blackfin software modules” or “SHARC software
modules”.
• Drill down links for components in each chain to selection
guides and application information
• Reference designs applying best practice design techniques
Designing an Emulator-Compatible DSP Board (Target)
For embedded system test and debug, Analog Devices provides
a family of emulators. On each JTAG DSP, Analog Devices sup-
plies an IEEE 1149.1 JTAG Test Access Port (TAP). In-circuit
emulation is facilitated by use of this JTAG interface. The emu-
lator accesses the processor’s internal features via the
processor’s TAP, allowing the developer to load code, set break-
points, and view variables, memory, and registers. The
processor must be halted to send data and commands, but once
an operation is completed by the emulator, the DSP system is set
to run at full speed with no impact on system timing. The emu-
lators require the target board to include a header that supports
connection of the DSP’s JTAG port to the emulator.
For details on target board design issues including mechanical
layout, single processor connections, signal buffering, signal ter-
mination, and emulator pod logic, see the Engineer-to-Engineer
Note “Analog Devices JTAG Emulation Technical Reference”
(EE-68) on the Analog Devices website (www.analog.com)—use
site search on “EE-68.” This document is updated regularly to
keep pace with improvements to emulator support.
ADDITIONAL INFORMATION
The following publications that describe the ADSP-BF592 pro-
cessor (and related processors) can be ordered from any Analog
Devices sales office or accessed electronically on our website:
• Getting Started With Blackfin Processors
• ADSP-BF59x Blackfin Processor Hardware Reference
• Blackfin Processor Programming Reference
• ADSP-BF592 Blackfin Processor Anomaly List
RELATED SIGNAL CHAINS
A signal chain is a series of signal conditioning electronic com-
ponents that receive input (data acquired from sampling either
real-time phenomena or from stored data) in tandem, with the
output of one portion of the chain supplying input to the next.
Signal chains are often used in signal processing applications to
Rev. B
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ADSP-BF592
SIGNAL DESCRIPTIONS
Signal definitions for the ADSP-BF592 processor are listed in
Table 7. In order to maintain maximum function and reduce
package size and pin count, some pins have dual, multiplexed
functions. In cases where pin function is reconfigurable, the
default state is shown in plain text, while the alternate function
is shown in italics.
create a crystal oscillator circuit. During hibernate, all signals
are three-stated with the following exceptions: EXT_WAKE is
driven low and XTAL is driven to a solid logic level.
During and immediately after reset, all I/O pins have their input
buffers disabled with the exception of the pins that need pull-
ups or pull-downs, as noted in Table 7.
During and immediately after reset, all processor signals are
three-stated with the following exceptions: EXT_WAKE is
driven high and XTAL is driven in conjunction with CLKIN to
Adding a parallel termination to EXTCLK may prove useful in
further enhancing signal integrity. Be sure to verify over-
shoot/undershoot and signal integrity specifications on actual
hardware.
Table 7. Signal Descriptions
Driver
Type
Signal Name
Type Function
Port F: GPIO and Multiplexed Peripherals
PF0–GPIO/DR1SEC/PPI_D8/WAKEN1
PF1–GPIO/DR1PRI/PPI_D9
I/O GPIO/SPORT1 Receive Data Secondary/PPI Data 8/Wake Enable 1
I/O GPIO/SPORT1 Receive Data Primary/PPI Data 9
I/O GPIO/SPORT1 Receive Serial Clock/PPI Data 10
I/O GPIO/SPORT1 Receive Frame Sync/PPI Data 11
I/O GPIO/SPORT1 Transmit Data Secondary/PPI Data 12
I/O GPIO/SPORT1 Transmit Data Primary/PPI Data 13
I/O GPIO/SPORT1 Transmit Serial Clock/PPI Data 14
I/O GPIO/SPORT1 Transmit Frame Sync/PPI Data 15
I/O GPIO/Timer 2/SPI0 Slave Select Enable 2/Wake Enable 0
I/O GPIO/Timer 0/PPI Frame Sync 1/SPI0 Slave Select Enable 3
I/O GPIO/Timer 1/PPI Frame Sync 2
A
A
A
A
A
A
A
A
A
A
A
A
A
PF2–GPIO/RSCLK1/PPI_D10
PF3–GPIO/RFS1/PPI_D11
PF4–GPIO/DT1SEC/PPI_D12
PF5–GPIO/DT1PRI/PPI_D13
PF6–GPIO/TSCLK1/PPI_D14
PF7–GPIO/TFS1/PPI_D15
PF8–GPIO/TMR2/SPI0_SSEL2/WAKEN0
PF9–GPIO/TMR0/PPI_FS1/SPI0_SSEL3
PF10–GPIO/TMR1/PPI_FS2
PF11–GPIO/UA_TX/SPI0_SSEL4
PF12–GPIO/UA_RX/SPI0_SSEL7/TACI2–0
I/O GPIO/UART Transmit/SPI0 Slave Select Enable 4
I/O GPIO/UART Receive/SPI0 Slave Select Enable 7/Timers 2–0 Alternate Input
Capture
PF13–GPIO/SPI0_MOSI/SPI1_SSEL3
PF14–GPIO/SPI0_MISO/SPI1_SSEL4
I/O GPIO/SPI0 Master Out Slave In/SPI1 Slave Select Enable 3
A
A
I/O GPIO/SPI0 Master In Slave Out/SPI1 Slave Select Enable 4
(This pin should always be pulled high through a 4.7 kΩ resistor,
if booting via the SPI port.)
PF15–GPIO/SPI0_SCK/SPI1_SSEL5
I/O GPIO/SPI0 Clock/SPI1 Slave Select Enable 5
A
A
Port G: GPIO and Multiplexed Peripherals
PG0–GPIO/DR0SEC/SPI0_SSEL1/SPI0_SS
I/O GPIO/SPORT0 Receive Data Secondary/SPI0 Slave Select Enable 1/SPI0 Slave
Select Input
PG1–GPIO/DR0PRI/SPI1_SSEL1/WAKEN3
PG2–GPIO/RSCLK0/SPI0_SSEL5
PG3–GPIO/RFS0/PPI_FS3
I/O GPIO/SPORT0 Receive Data Primary/SPI1 Slave Select Enable 1/Wake Enable 3
I/O GPIO/SPORT0 Receive Serial Clock/SPI0 Slave Select Enable 5
I/O GPIO/SPORT0 Receive Frame Sync/PPI Frame Sync 3
A
A
A
A
PG4–GPIO(HWAIT)/DT0SEC/SPI0_SSEL6
I/O GPIO (HWAIT output for Slave Boot Modes)/SPORT0 Transmit Data
Secondary/SPI0 Slave Select Enable 6
PG5–GPIO/DT0PRI/SPI1_SSEL6
PG6–GPIO/TSCLK0
I/O GPIO/SPORT0 Transmit Data Primary/SPI1 Slave Select Enable 6
I/O GPIO/SPORT0 Transmit Serial Clock
A
A
A
A
A
PG7–GPIO/TFS0/SPI1_SSEL7
PG8–GPIO/SPI1_SCK/PPI_D0
PG9–GPIO/SPI1_MOSI/PPI_D1
I/O GPIO/SPORT0 Transmit Frame Sync/SPI1 Slave Select Enable 7
I/O GPIO/SPI1 Clock/PPI Data 0
I/O GPIO/SPI1 Master Out Slave In/PPI Data 1
Rev. B
|
Page 14 of 44
|
July 2013
ADSP-BF592
Table 7. Signal Descriptions (Continued)
Driver
Type
Signal Name
Type Function
PG10–GPIO/SPI1_MISO/PPI_D2
I/O GPIO/SPI1 Master In Slave Out/PPI Data 2
A
(This pin should always be pulled high through a 4.7 kΩ resistor if booting via
the SPI port.)
PG11–GPIO/SPI1_SSEL5/PPI_D3
PG12–GPIO/SPI1_SSEL2/PPI_D4/WAKEN2
PG13–GPIO/SPI1_SSEL1/SPI1_SS/PPI_D5
PG14–GPIO/SPI1_SSEL4/PPI_D6/TACLK1
PG15–GPIO/SPI1_SSEL6/PPI_D7/TACLK2
TWI
I/O GPIO/SPI1 Slave Select Enable 5/PPI Data 3
A
A
A
A
A
I/O GPIO/SPI1 Slave Select Enable 2 Output/PPI Data 4/Wake Enable 2
I/O GPIO/SPI1 Slave Select Enable 1 Output/PPI Data 5/SPI1 Slave Select Input
I/O GPIO/SPI1 Slave Select Enable 4/PPI Data 6/Timer 1 Auxiliary Clock Input
I/O GPIO/SPI1 Slave Select Enable 6/PPI Data 7/Timer 2 Auxiliary Clock Input
SCL
I/O TWI Serial Clock (This signal is an open-drain output and requires a pull-up
resistor. Consult version 2.1 of the I2C specification for the proper resistor
value.)
B
B
SDA
I/O TWI Serial Data (This signal is an open-drain output and requires a pull-up
resistor. Consult version 2.1 of the I2C specification for the proper resistor
value.)
JTAG Port
TCK
I
O
I
JTAG CLK
TDO
JTAG Serial Data Out
JTAG Serial Data In
JTAG Mode Select
A
TDI
TMS
I
TRST
I
JTAG Reset
(This lead should be pulled low if the JTAG port is not used.)
EMU
O
Emulation Output
A
Clock
CLKIN
I
CLK/Crystal In
XTAL
O
O
Crystal Output
EXTCLK
Mode Controls
RESET
NMI
External Clock Output pin/System Clock Output
C
I
I
Reset
Nonmaskable Interrupt
(This lead should be pulled high when not used.)
BMODE2–0
PPI_CLK
I
I
Boot Mode Strap 2–0
PPI Clock Input
External Regulator Control
PG
I
Power Good indication
Wake up Indication
EXT_WAKE
O
A
Power Supplies
ALL SUPPLIES MUST BE POWERED
See Operating Conditions on Page 16.
VDDEXT
VDDINT
GND
P
P
I/O Power Supply
Internal Power Supply
G
Ground for All Supplies (Back Side of LFCSP Package.)
Rev. B
|
Page 15 of 44
|
July 2013
ADSP-BF592
SPECIFICATIONS
Specifications are subject to change without notice.
OPERATING CONDITIONS
Parameter
Conditions
Min
1.1
Nominal
Max
1.47
1.47
Unit
V
VDDINT Internal Supply Voltage
Internal Supply Voltage
VDDEXT External Supply Voltage
External Supply Voltage
Non-Automotive Models
Automotive Models
Non-Automotive Models
Automotive Models
VDDEXT = 1.9 V
1.33
1.7
V
1.8/2.5/3.3 3.6
3.6
V
2.7
V
VIH
VIHCLKIN High Level Input Voltage1, 2
High Level Input Voltage1, 2
1.1
V
VDDEXT = 1.9 V
1.2
V
VIH
High Level Input Voltage1, 2
High Level Input Voltage1, 2
VDDEXT = 2.75 V
1.7
V
VIH
VDDEXT = 3.6 V
2.0
V
VIHCLKIN High Level Input Voltage1, 2
VDDEXT = 3.6 V
2.2
V
VIHTWI
VIL
High Level Input Voltage3
Low Level Input Voltage1, 2
Low Level Input Voltage1, 2
Low Level Input Voltage1, 2
Low Level Input Voltage3
Junction Temperature
VDDEXT = 1.90 V/2.75 V/3.6 V
VDDEXT = 1.7 V
0.7 × VDDEXT
3.6
0.6
0.7
0.8
V
V
VIL
VDDEXT = 2.25 V
V
VIL
VDDEXT = 3.0 V
V
VILTWI
TJ
VDDEXT = Minimum
64-Lead LFCSP @ TAMBIENT = 0°C to +70°C
64-Lead LFCSP @ TAMBIENT = –40°C to +85°C
0.3 × VDDEXT
V
0
80
°C
°C
°C
TJ
Junction Temperature
–40
+95
TJ
Junction Temperature
64-Lead LFCSP @ TAMBIENT = –40°C to +105°C –40
+115
1 Bidirectional leads (PF15–0, PG15–0) and input leads (TCK, TDI, TMS, TRST, CLKIN, RESET, NMI, and BMODE2–0) of the ADSP-BF592 processor are 3.3 V tolerant
(always accept up to 3.6 V maximum VIH). Voltage compliance (on outputs, VOH) is limited by the VDDEXT supply voltage.
2 Parameter value applies to all input and bidirectional leads, except SDA and SCL.
3 Parameter applies to SDA and SCL.
Rev. B
|
Page 16 of 44
|
July 2013
ADSP-BF592
ADSP-BF592 Clock Related Operating Conditions
Table 8 describes the core clock timing requirements for the
ADSP-BF592 processor. Take care in selecting MSEL, SSEL, and
CSEL ratios so as not to exceed the maximum core clock and
system clock (see Table 10). Table 9 describes phase-locked loop
operating conditions.
Table 8. Core Clock (CCLK) Requirements
Parameter
Max CCLK
Min VDDINT
1.33 V
Nom VDDINT
1.400 V
Frequency
Unit
MHz
MHz
MHz
fCCLK
Core Clock Frequency (All Models)
400
Core Clock Frequency (Industrial/Commercial Models)
1.16 V
1.225 V
300
2501
Core Clock Frequency (Industrial/Commercial Models)
1.10 V
1.150 V
1 See the Ordering Guide on Page 44.
Table 9. Phase-Locked Loop Operating Conditions
Parameter
Min
Max
Instruction Rate1
Unit
fVCO
Voltage Controlled Oscillator (VCO) Frequency
(Non-Automotive Models)
72
MHz
Voltage Controlled Oscillator (VCO) Frequency
(Automotive Models)
84
Instruction Rate1
MHz
1 See the Ordering Guide on Page 44.
Table 10. Maximum SCLK Conditions
Parameter1
VDDEXT 1.8 V/2.5 V/3.3 V Nominal
Unit
fSCLK
CLKOUT/SCLK Frequency (VDDINT 1.16 V )
CLKOUT/SCLK Frequency (VDDINT <1.16 V )
100
80
MHz
MHz
1 fSCLK must be less than or equal to fCCLK
.
Rev. B
|
Page 17 of 44
|
July 2013
ADSP-BF592
ELECTRICAL CHARACTERISTICS
Parameter
Test Conditions
Min
1.35
2.0
Typical
Max
Unit
VOH
VOH
VOH
VOL
High Level Output Voltage
High Level Output Voltage
High Level Output Voltage
Low Level Output Voltage
VDDEXT = 1.7 V, IOH = –0.5 mA
VDDEXT = 2.25 V, IOH = –0.5 mA
VDDEXT = 3.0 V, IOH = –0.5 mA
V
V
V
V
2.4
VDDEXT = 1.7 V/2.25 V/3.0 V,
IOL = 2.0 mA
0.4
0.4
VOLTWI
Low Level Output Voltage
VDDEXT = 1.7 V/2.25 V/3.0 V,
IOL = 2.0 mA
V
V
IIH
High Level Input Current1
Low Level Input Current1
High Level Input Current JTAG2
Three-State Leakage Current3
Three-State Leakage Current4
Three-State Leakage Current3
Input Capacitance5
VDDEXT =3.6 V, VIN = 3.6 V
VDDEXT =3.6 V, VIN = 0 V
10
10
50
10
10
10
86
μA
μA
μA
μA
μA
μA
pF
mA
IIL
IIHP
VDDEXT = 3.6 V, VIN = 3.6 V
VDDEXT = 3.6 V, VIN = 3.6 V
VDDEXT =3.0 V, VIN = 3.6 V
VDDEXT = 3.6 V, VIN = 0 V
10
IOZH
IOZHTWI
IOZL
CIN
fIN = 1 MHz, TAMBIENT = 25°C, VIN = 2.5 V
4
7
IDDDEEPSLEEP
VDDINT Current in Deep Sleep Mode VDDINT = 1.2 V, fCCLK = 0 MHz,
fSCLK = 0 MHz, TJ = 25°C, ASF = 0.00
0.8
IDDSLEEP
IDD-IDLE
IDD-TYP
VDDINT Current in Sleep Mode
VDDINT Current in Idle
VDDINT Current
VDDINT = 1.2 V, fSCLK = 25 MHz,
TJ = 25°C
4
mA
mA
mA
mA
mA
ꢀA
VDDINT = 1.2 V, fCCLK = 50 MHz,
TJ = 25°C, ASF = 0.35
6
VDDINT = 1.3 V, fCCLK = 200 MHz,
TJ = 25°C, ASF = 1.00
40
66
91
20
IDD-TYP
VDDINT Current
VDDINT = 1.3 V, fCCLK = 300 MHz,
TJ = 25°C, ASF = 1.00
IDD-TYP
VDDINT Current
VDDINT = 1.4 V, fCCLK = 400 MHz,
TJ = 25°C, ASF = 1.00
7
7
IDDHIBERNATE
Hibernate State Current
VDDEXT =3.3 V, TJ = 25°C,
CLKIN = 0 MHz with voltage
regulator off (VDDINT = 0 V)
IDDDEEPSLEEP
VDDINT Current in Deep Sleep Mode fCCLK = 0 MHz, fSCLK = 0 MHz
VDDINT Current fCCLK 0 MHz, fSCLK 0 MHz
Table 12
mA
mA
8
IDDINT
Table 12 +
(Table 13 × ASF)
1 Applies to input pins.
2 Applies to JTAG input pins (TCK, TDI, TMS, TRST).
3 Applies to three-statable pins.
4 Applies to bidirectional pins SCL and SDA.
5 Applies to all signal pins.
6 Guaranteed, but not tested.
7 See the ADSP-BF59x Blackfin Processor Hardware Reference Manual for definitions of sleep, deep sleep, and hibernate operating modes.
8 See Table 11 for the list of IDDINT power vectors covered.
Rev. B
|
Page 18 of 44
|
July 2013
ADSP-BF592
Total Power Dissipation
Total power dissipation has two components:
1. Static, including leakage current
The ASF is combined with the CCLK frequency and VDDINT
dependent data in Table 13 to calculate this part. The second
part is due to transistor switching in the system clock (SCLK)
domain, which is included in the IDDINT specification equation.
2. Dynamic, due to transistor switching characteristics
Many operating conditions can also affect power dissipation,
including temperature, voltage, operating frequency, and pro-
cessor activity. Electrical Characteristics on Page 18 shows the
current dissipation for internal circuitry (VDDINT). IDDDEEPSLEEP
specifies static power dissipation as a function of voltage
(VDDINT) and temperature (see Table 12), and IDDINT specifies the
total power specification for the listed test conditions, including
the dynamic component as a function of voltage (VDDINT) and
frequency (Table 13).
Table 11. Activity Scaling Factors (ASF)1
IDDINT Power Vector
IDD-PEAK
Activity Scaling Factor (ASF)
1.29
1.26
1.00
0.83
0.66
0.33
IDD-HIGH
IDD-TYP
IDD-APP
IDD-NOP
There are two parts to the dynamic component. The first part is
due to transistor switching in the core clock (CCLK) domain.
This part is subject to an Activity Scaling Factor (ASF), which
represents application code running on the processor core and
L1 memories (Table 11).
IDD-IDLE
1 See Estimating Power for ASDP-BF534/BF536/BF537 Blackfin Processors
(EE-297). The power vector information also applies to the ADSP-BF592
processor.
Table 12. Static Current - IDD-DEEPSLEEP (mA)
1
Voltage (VDDINT
)
TJ (°C)1
1.15 V
0.85
1.20 V
0.98
1.25 V
1.13
1.30 V
1.29
2.16
3.5
1.35 V
1.46
1.40 V
1.62
1.45 V
1.85
1.50 V
2.07
25
40
1.57
1.8
2.01
2.51
2.74
3.05
3.36
55
2.57
2.88
3.2
3.84
4.22
4.63
5.05
70
4.04
4.45
4.86
5.3
5.81
6.31
6.87
7.45
85
6.52
7.12
7.73
8.36
12.24
17.71
9.09
9.86
10.67
15.37
21.96
11.54
16.55
23.56
100
9.67
10.51
11.37
13.21
19.05
14.26
20.45
115
14.18
15.29
16.45
1 Valid temperature and voltage ranges are model-specific. See Operating Conditions on Page 16.
Table 13. Dynamic Current in CCLK Domain (mA, with ASF = 1.0)1
2
fCCLK
Voltage (VDDINT
)
(MHz)2
1.15 V
N/A
1.20 V
N/A
1.25 V
N/A
1.30 V
N/A
1.35 V
85.31
75.41
66.14
55.68
45.81
25.97
1.40 V
88.96
78.70
69.02
58.17
47.85
26.64
1.45 V
92.81
82.07
71.93
60.69
49.97
27.92
1.50 V
96.63
85.46
75.05
63.23
52.09
29.98
400
350
300
250
200
100
N/A
N/A
N/A
72.08
63.22
53.19
43.79
24.98
N/A
57.52
48.43
39.80
22.56
60.38
50.76
41.76
23.78
46.10
37.86
21.45
1 The values are not guaranteed as stand-alone maximum specifications. They must be combined with static current per the equations of Electrical Characteristics on Page 18.
2 Valid frequency and voltage ranges are model-specific. See Operating Conditions on Page 16 and Table 8 on Page 17.
Rev. B
|
Page 19 of 44
|
July 2013
ADSP-BF592
Characteristics table.
ABSOLUTE MAXIMUM RATINGS
Stresses greater than those listed in Table 14 may cause perma-
nent damage to the device. These are stress ratings only.
Functional operation of the device at these or any other condi-
tions greater than those indicated in the operational sections of
this specification is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device
reliability.
Table 16. Total Current Pin Groups–VDDEXT Groups
Group Pins in Group
1
PF0, PF1, PF2, PF3
2
PF4, PF5, PF6, PF7
3
PF8, PF9, PF10, PF11
4
PF12, PF13, PF14, PF15
PG3, PG2, PG1, PG0
Table 14. Absolute Maximum Ratings
5
6
PG7, PG6, PG5, PG4
Parameter
Rating
7
PG11, PG10, PG9, PG8
Internal Supply Voltage (VDDINT
)
–0.3 V to +1.50 V
8
PG15, PG14, PG13, PG12
TDI, TDO, EMU, TCK, TRST, TMS
BMODE2, BMODE1, BMODE0
EXT_WAKE, PG, RESET, NMI, PPI_CLK, EXTCLK
SDA, SCL, CLKIN, XTAL
External (I/O) Supply Voltage (VDDEXT) –0.3 V to +3.8 V
9
Input Voltage1, 2
–0.5 V to +3.6 V
–0.5 V to VDDEXT +0.5 V
55 mA (Max)
10
11
12
Output Voltage Swing
I
I
OH/IOL Current per Pin Group
OH/IOL Current per Individual Pin
25 mA (Max)
Storage Temperature Range
–65°C to +150°C
ESD SENSITIVITY
Junction Temperature While Biased +110°C
(Non-Automotive Models)
ESD (electrostatic discharge) sensitive device.
Junction Temperature While Biased +115°C
(Automotive Models)
1 Applies to 100% transient duty cycle. For other duty cycles see Table 15.
2 Applies only when VDDEXT is within specifications. When VDDEXT is outside speci-
fications, the range is VDDEXT 0.2 Volts.
Charged devices and circuit boards can discharge
without detection. Although this product features
patented or proprietary circuitry, damage may occur
on devices subjected to high energy ESD. Therefore,
proper ESD precautions should be taken to avoid
performance degradation or loss of functionality.
Table 15. Maximum Duty Cycle for Input Transient Voltage1
VIN Min (V)2
–0.5
VIN Max (V)2
+3.8
Maximum Duty Cycle3
100%
40%
25%
15%
10%
–0.7
+4.0
–0.8
+4.1
–0.9
+4.2
–1.0
+4.3
1 Applies to all signal pins with the exception of CLKIN, XTAL, EXT_WAKE.
2 The individual values cannot be combined for analysis of a single instance of
overshoot or undershoot. The worst case observed value must fall within one of
the voltages specified, and the total duration of the overshoot or undershoot
(exceeding the 100% case) must be less than or equal to the corresponding duty
cycle.
3 Duty cycle refers to the percentage of time the signal exceeds the value for the
100% case. The is equivalent to the measured duration of a single instance of
overshoot or undershoot as a percentage of the period of occurrence.
Table 14 specifies the maximum total source/sink (IOH/IOL) cur-
rent for a group of pins and for individual pins. Permanent
damage can occur if this value is exceeded. To understand this
specification, if pins PF0 and PF1 from Group 1 in Table 16
were sourcing or sinking 10 mA each, the total current for those
pins would be 20 mA. This would allow up to 35 mA total that
could be sourced or sunk by the remaining pins in the group
without damaging the device. It should also be noted that the
maximum source or sink current for an individual pin cannot
exceed 25 mA. The list of all groups and their pins are shown in
Table 16. Note that the VOH and VOL specifications have separate
per-pin maximum current requirements, see the Electrical
Rev. B
|
Page 20 of 44
|
July 2013
ADSP-BF592
PACKAGE INFORMATION
The information presented in Figure 6 and Table 17 provides
details about the package branding for the ADSP-BF592 proces-
sor. For a complete listing of product availability, see Ordering
Guide on Page 44.
a
ADSP-BF592
tppZccc
vvvvvv.x n.n
#yyww country_of_origin
B
Figure 6. Product Information on Package
Table 17. Package Brand Information
Brand Key
Field Description
Product Name
ADSP-BF592
t
Temperature Range
Package Type
pp
Z
RoHS Compliant Designation
See Ordering Guide
Assembly Lot Code
Silicon Revision
ccc
vvvvvv.x
n.n
#
RoHS Compliance Designator
Date Code
yyww
Rev. B
|
Page 21 of 44
|
July 2013
ADSP-BF592
TIMING SPECIFICATIONS
Specifications are subject to change without notice.
Clock and Reset Timing
Table 18 and Figure 7 describe clock and reset operations. Per
the CCLK and SCLK timing specifications in Table 8 to
Table 10, combinations of CLKIN and clock multipliers must
not select core/peripheral clocks in excess of the processor’s
instruction rate.
Table 18. Clock and Reset Timing
VDDEXT 1.8 V Nominal
Max
VDDEXT 2.5 V/3.3 V Nominal
Max
Parameter
Min
Min
Unit
Timing Requirements
fCKIN
CLKIN Period1, 2, 3, 4
CLKIN Low Pulse1
CLKIN High Pulse1
RESET Asserted Pulse Width Low5
12
10
10
50
12
10
10
50
MHz
ns
tCKINL
tCKINH
tWRST
ns
11 × tCKIN
11 × tCKIN
ns
Switching Characteristic
tBUFDLAY CLKIN to CLKBUF6 Delay
11
10
ns
1 Applies to PLL bypass mode and PLL non bypass mode.
2 Combinations of the CLKIN frequency and the PLL clock multiplier must not exceed the allowed fVCO, fCCLK, and fSCLK settings discussed in Table 8 on Page 17 through Table 10
on Page 17.
3 The tCKIN period (see Figure 7) equals 1/fCKIN
.
4 If the DF bit in the PLL_CTL register is set, the minimum fCKIN specification is 24 MHz.
5 Applies after power-up sequence is complete. See Table 19 and Figure 8 for power-up reset timing.
6 The ADSP-BF592 processor does not have a dedicated CLKBUF pin. Rather, the EXTCLK pin may be programmed to serve as CLKBUF or CLKOUT. This parameter applies
when EXTCLK is programmed to output CLKBUF.
tCKIN
CLKIN
tBUFDLAY
tCKINL
tCKINH
tBUFDLAY
CLKBUF
tWRST
RESET
Figure 7. Clock and Reset Timing
Rev. B
|
Page 22 of 44
|
July 2013
ADSP-BF592
Table 19. Power-Up Reset Timing
Parameter
Min
Max
Unit
Timing Requirements
tRST_IN_PWR RESET Deasserted after the VDDINT, VDDEXT, and CLKIN Pins are Stable and within 3500 × tCKIN
Specification
ꢀs
tRST_IN_PWR
RESET
CLKIN
V
DD_SUPPLIES
Figure 8. Power-Up Reset Timing
Rev. B
|
Page 23 of 44
|
July 2013
ADSP-BF592
Parallel Peripheral Interface Timing
Table 20 and Figure 9 through Figure 13 describe parallel
peripheral interface operations.
Table 20. Parallel Peripheral Interface Timing
VDDEXT = 1.8 V
Max
VDDEXT = 2.5 V/3.3 V
Max
Parameter
Min
Min
Unit
Timing Requirements
tPCLKW
tPCLK
PPI_CLK Width1
PPI_CLK Period1
tSCLK –1.5
tSCLK –1.5
ns
ns
2 × tSCLK –1.5
2 × tSCLK –1.5
Timing Requirements—GP Input and Frame Capture Modes
tPSUD
tSFSPE
External Frame Sync Startup Delay2
4 × tPCLK
6.7
4 × tPCLK
6.7
ns
ns
External Frame Sync Setup Before PPI_CLK
(Nonsampling Edge for Rx, Sampling Edge for Tx)
tHFSPE
tSDRPE
tHDRPE
External Frame Sync Hold After PPI_CLK
Receive Data Setup Before PPI_CLK
Receive Data Hold After PPI_CLK
1.8
4.1
2
1.6
3.5
1.6
ns
ns
ns
Switching Characteristics—GP Output and Frame Capture Modes
tDFSPE
tHOFSPE
tDDTPE
tHDTPE
Internal Frame Sync Delay After PPI_CLK
Internal Frame Sync Hold After PPI_CLK
Transmit Data Delay After PPI_CLK
Transmit Data Hold After PPI_CLK
9.0
8.7
8.0
8.0
ns
ns
ns
ns
1.7
2.3
1.7
1.9
1 PPI_CLK frequency cannot exceed fSCLK/2.
2 The PPI port is fully enabled 4 PPI clock cycles after the PAB write to the PPI port enable bit. Only after the PPI port is fully enabled are external frame syncs and data words
guaranteed to be received correctly by the PPI peripheral.
PPI_CLK
tPSUD
PPI_FS1/2
Figure 9. PPI with External Frame Sync Timing
DATA SAMPLED /
DATA SAMPLED /
FRAME SYNC SAMPLED
FRAME SYNC SAMPLED
PPI_CLK
tPCLKW
tSFSPE
tHFSPE
tPCLK
PPI_FS1/2
PPI_DATA
tSDRPE
tHDRPE
Figure 10. PPI GP Rx Mode with External Frame Sync Timing
Rev. B
|
Page 24 of 44
|
July 2013
ADSP-BF592
DATA DRIVEN /
FRAME SYNC SAMPLED
PPI_CLK
PPI_FS1/2
PPI_DATA
tSFSPE
tHFSPE
tPCLKW
tPCLK
tDDTPE
tHDTPE
Figure 11. PPI GP Tx Mode with External Frame Sync Timing
FRAME SYNC
DRIVEN
DATA
SAMPLED
PPI_CLK
PPI_FS1/2
PPI_DATA
tDFSPE
tPCLKW
tHOFSPE
tPCLK
tSDRPE
tHDRPE
Figure 12. PPI GP Rx Mode with Internal Frame Sync Timing
FRAME SYNC
DRIVEN
DATA
DRIVEN
tPCLK
DATA
DRIVEN
PPI_CLK
tDFSPE
tPCLKW
tHOFSPE
PPI_FS1/2
PPI_DATA
tDDTPE
tHDTPE
Figure 13. PPI GP Tx Mode with Internal Frame Sync Timing
Rev. B
|
Page 25 of 44
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July 2013
ADSP-BF592
Serial Ports
Table 21 through Table 25 and Figure 14 through Figure 18
describe serial port operations.
Table 21. Serial Ports—External Clock
VDDEXT
VDDEXT
1.8V Nominal
2.5 V/3.3V Nominal
Parameter
Min
Max
Min
Max
Unit
Timing Requirements
tSFSE
TFSx/RFSx Setup Before TSCLKx/RSCLKx1
TFSx/RFSx Hold After TSCLKx/RSCLKx1
Receive Data Setup Before RSCLKx1
Receive Data Hold After RSCLKx1
TSCLKx/RSCLKx Width
3
3
ns
ns
ns
ns
ns
ns
ns
ns
tHFSE
3
3
tSDRE
3
3
tHDRE
tSCLKEW
tSCLKE
tSUDTE
tSUDRE
3.5
4.5
3
4.5
TSCLKx/RSCLKx Period
2 × tSCLK
2 × tSCLK
4 × tTSCLKE
4 × tRSCLKE
Start-Up Delay From SPORT Enable To First External TFSx2 4 × tTSCLKE
Start-Up Delay From SPORT Enable To First External RFSx2 4 × tRSCLKE
Switching Characteristics
tDFSE
TFSx/RFSx Delay After TSCLKx/RSCLKx
10
11
10
10
ns
ns
(Internally Generated TFSx/RFSx)3
tHOFSE
TFSx/RFSx Hold After TSCLKx/RSCLKx
(Internally Generated TFSx/RFSx)1
Transmit Data Delay After TSCLKx1
Transmit Data Hold After TSCLKx1
0
0
0
0
tDDTE
tHDTE
ns
ns
1 Referenced to sample edge.
2 Verified in design but untested.
3 Referenced to drive edge.
Table 22. Serial Ports—Internal Clock
VDDEXT
1.8V Nominal
VDDEXT
2.5 V/3.3V Nominal
Parameter
Min
Max
Min
Max
Unit
Timing Requirements
tSFSI
tHFSI
tSDRI
tHDRI
TFSx/RFSx Setup Before TSCLKx/RSCLKx1
11.5
–1.5
11.5
–1.5
9.6
ns
ns
ns
ns
TFSx/RFSx Hold After TSCLKx/RSCLKx1
Receive Data Setup Before RSCLKx1
Receive Data Hold After RSCLKx1
–1.5
11.3
–1.5
Switching Characteristics
tSCLKIW TSCLKx/RSCLKx Width
tDFSI
7
8
ns
ns
TFSx/RFSx Delay After TSCLKx/RSCLKx
(Internally Generated TFSx/RFSx)2
4
4
3
3
tHOFSI
TFSx/RFSx Hold After TSCLKx/RSCLKx
(Internally Generated TFSx/RFSx)1
–2
–1.8
–2
–1.5
ns
tDDTI
tHDTI
Transmit Data Delay After TSCLKx1
Transmit Data Hold After TSCLKx1
ns
ns
1 Referenced to sample edge.
2 Referenced to drive edge.
Rev. B
|
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July 2013
ADSP-BF592
DATA RECEIVE—INTERNAL CLOCK
DATA RECEIVE—EXTERNAL CLOCK
DRIVE EDGE SAMPLE EDGE
DRIVE EDGE
SAMPLE EDGE
tSCLKE
tSCLKIW
tSCLKEW
RSCLKx
RSCLKx
tDFSI
tDFSE
tHOFSI
tHOFSE
RFSx
RFSx
(OUTPUT)
(OUTPUT)
tSFSI
tHFSI
tSFSE
tHFSE
RFSx
RFSx
(INPUT)
(INPUT)
tHDRE
tSDRI
tHDRI
tSDRE
DRx
DRx
DATA TRANSMIT—INTERNAL CLOCK
DRIVE EDGE
DATA TRANSMIT—EXTERNAL CLOCK
DRIVE EDGE SAMPLE EDGE
SAMPLE EDGE
tSCLKE
tSCLKIW
tSCLKEW
TSCLKx
TSCLKx
tDFSI
tDFSE
tHOFSI
tHOFSE
TFSx
TFSx
(OUTPUT)
(OUTPUT)
tSFSI
tHFSI
tSFSE
tHFSE
TFSx
TFSx
(INPUT)
(INPUT)
tDDTI
tDDTE
tHDTI
tHDTE
DTx
DTx
Figure 14. Serial Ports
TSCLKx
(INPUT)
tSUDTE
TFSx
(INPUT)
RSCLKx
(INPUT)
tSUDRE
RFSx
(INPUT)
FIRST
TSCLKx/RSCLKx
EDGE AFTER
SPORT ENABLED
Figure 15. Serial Port Start Up with External Clock and Frame Sync
Rev. B
|
Page 27 of 44
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July 2013
ADSP-BF592
Table 23. Serial Ports—Enable and Three-State
VDDEXT
VDDEXT
1.8V Nominal
2.5 V/3.3V Nominal
Parameter
Min
0
Max
Min
Max
Unit
Switching Characteristics
tDTENE
tDDTTE
tDTENI
tDDTTI
Data Enable Delay from External TSCLKx1
Data Disable Delay from External TSCLKx1
Data Enable Delay from Internal TSCLKx1
Data Disable Delay from Internal TSCLKx1
0
ns
ns
ns
ns
tSCLK + 1
tSCLK + 1
tSCLK + 1
tSCLK + 1
–2
–2
1 Referenced to drive edge.
DRIVE EDGE
DRIVE EDGE
TSCLKx
DTx
tDTENE/I
tDDTTE/I
Figure 16. Serial Ports — Enable and Three-State
Rev. B
|
Page 28 of 44
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July 2013
ADSP-BF592
Table 24. Serial Ports—External Late Frame Sync
VDDEXT
1.8V Nominal
VDDEXT
2.5 V/3.3V Nominal
Parameter
Min
Max
Min
Max
Unit
Switching Characteristics
tDDTLFSE
Data Delay from Late External TFSx
12
10
ns
ns
or External RFSx in multi-channel mode with MFD = 01, 2
tDTENLFSE
Data Enable from External RFSx in multi-channel mode with 0
MFD = 01, 2
0
1 When in multi-channel mode, TFSx enable and TFSx valid follow tDTENLFSE and tDDTLFSE
.
2 If external RFSx/TFSx setup to RSCLKx/TSCLKx > tSCLKE/2 then tDDTTE/I and tDTENE/I apply, otherwise tDDTLFSE and tDTENLFSE apply.
EXTERNAL RFSx IN MULTI-CHANNEL MODE
DRIVE
EDGE
SAMPLE
EDGE
DRIVE
EDGE
RSCLKx
RFSx
tDDTLFSE
tDTENLFSE
DTx
1ST BIT
LATE EXTERNAL TFSx
DRIVE
EDGE
SAMPLE
EDGE
DRIVE
EDGE
TSCLKx
TFSx
tDDTLFSE
DTx
1ST BIT
Figure 17. Serial Ports — External Late Frame Sync
Rev. B
|
Page 29 of 44
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July 2013
ADSP-BF592
Table 25. Serial Ports—Gated Clock Mode
VDDEXT
VDDEXT
1.8V Nominal
2.5 V/3.3 V Nominal
Parameter
Min
Max
Min
Max
Unit
Timing Requirements
tSDRI
tHDRI
Receive Data Setup Before TSCLKx
Receive Hold After TSCLKx
11.3
0
8.7
0
ns
ns
Switching Characteristics
tDDTI
Transmit Data Delay After TSCLKx
3
3
ns
ns
ns
ns
tHDTI
Transmit Data Hold After TSCLKx
–1.8
–1.8
tDFTSCLKCNV
tDCNVLTSCLK
First TSCLKx edge delay after TFSx/TMR1 Low
TFSx/TMR1 High Delay After Last TSCLKx Edge
0.5 × tTSCLK – 3
tTSCLK – 3
0.5 × tTSCLK – 3
tTSCLK – 3
GATED CLOCK MODE DATA RECEIVE
TSCLKx
(OUT)
tSDRI
tHDRI
DRx
DELAY TIME DATA TRANSMIT
TFS/TMR
(OUT)
tDFTSCLKCNV
tDCNVLTSCLK
TSCLKx
(OUT)
tDCNVLTSCLK
tDFTSCLKCNV
TSCLKx
(OUT)
tDDTI
tHDTI
DTx
Figure 18. Serial Ports Gated Clock Mode
Rev. B
|
Page 30 of 44
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July 2013
ADSP-BF592
Serial Peripheral Interface (SPI) Port—Master Timing
Table 26 and Figure 19 describe SPI port master operations.
Table 26. Serial Peripheral Interface (SPI) Port—Master Timing
VDDEXT
1.8V Nominal
VDDEXT
2.5 V/3.3V Nominal
Parameter
Min
Max
Min
Max
Unit
Timing Requirements
tSSPIDM
tHSPIDM
Data Input Valid to SCK Edge (Data Input Setup)
SCK Sampling Edge to Data Input Invalid
11.6
–1.5
9.6
ns
ns
–1.5
Switching Characteristics
tSDSCIM
tSPICHM
tSPICLM
tSPICLK
SPI_SELx low to First SCK Edge
2 × tSCLK – 1.5
2 × tSCLK – 1.5
2 × tSCLK – 1.5
4 × tSCLK – 1.5
2 × tSCLK – 2
2 × tSCLK – 1.5
0
2 × tSCLK – 1.5
2 × tSCLK – 1.5
2 × tSCLK – 1.5
4 × tSCLK – 1.5
2 × tSCLK – 1.5
2 × tSCLK – 1.5
0
ns
ns
ns
ns
ns
ns
ns
ns
Serial Clock High Period
Serial Clock Low Period
Serial Clock Period
tHDSM
Last SCK Edge to SPI_SELx High
Sequential Transfer Delay
tSPITDM
tDDSPIDM
tHDSPIDM
SCK Edge to Data Out Valid (Data Out Delay)
SCK Edge to Data Out Invalid (Data Out Hold)
6
6
–1
–1
SPIxSELy
(OUTPUT)
tSDSCIM
tSPICLM
tSPICHM
tSPICLK
tHDSM
tSPITDM
SPIxSCK
(OUTPUT)
tHDSPIDM
tDDSPIDM
SPIxMOSI
(OUTPUT)
tSSPIDM
CPHA = 1
tHSPIDM
SPIxMISO
(INPUT)
tHDSPIDM
tDDSPIDM
SPIxMOSI
(OUTPUT)
tSSPIDM
tHSPIDM
CPHA = 0
SPIxMISO
(INPUT)
Figure 19. Serial Peripheral Interface (SPI) Port—Master Timing
Rev. B
|
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July 2013
ADSP-BF592
Serial Peripheral Interface (SPI) Port—Slave Timing
Table 27 and Figure 20 describe SPI port slave operations.
Table 27. Serial Peripheral Interface (SPI) Port—Slave Timing
VDDEXT
VDDEXT
1.8V Nominal
2.5 V/3.3V Nominal
Parameter
Min
Max
Min
Max
Unit
Timing Requirements
tSPICHS
tSPICLS
tSPICLK
tHDS
Serial Clock High Period
2 × tSCLK – 1.5
2 × tSCLK – 1.5
4 × tSCLK
2 × tSCLK – 1.5
2 × tSCLK – 1.5
4 × tSCLK
ns
ns
ns
ns
ns
ns
ns
ns
Serial Clock Low Period
Serial Clock Period
Last SCK Edge to SPI_SS Not Asserted
Sequential Transfer Delay
2 × tSCLK – 1.5
2 × tSCLK – 1.5
2 × tSCLK – 1.5
1.6
2 × tSCLK – 1.5
2 × tSCLK – 1.5
2 × tSCLK – 1.5
1.6
tSPITDS
tSDSCI
tSSPID
tHSPID
SPI_SS Assertion to First SCK Edge
Data Input Valid to SCK Edge (Data Input Setup)
SCK Sampling Edge to Data Input Invalid
2
1.6
Switching Characteristics
tDSOE
SPI_SS Assertion to Data Out Active
0
0
12
11
10
0
0
10.3
9
ns
ns
ns
ns
tDSDHI
tDDSPID
tHDSPID
SPI_SS Deassertion to Data High Impedance
SCK Edge to Data Out Valid (Data Out Delay)
SCK Edge to Data Out Invalid (Data Out Hold)
10
0
0
SPIxSS
(INPUT)
tSDSCI
tSPICLS
tSPICHS
tSPICLK
tHDS
tSPITDS
SPIxSCK
(INPUT)
tDSOE
tDDSPID
tHDSPID
tDDSPID
tDSDHI
SPIxMISO
(OUTPUT)
CPHA = 1
tSSPID
tHSPID
SPIxMOSI
(INPUT)
tDSOE
tHDSPID
tDDSPID
tDSDHI
SPIxMISO
(OUTPUT)
tHSPID
CPHA = 0
tSSPID
SPIxMOSI
(INPUT)
Figure 20. Serial Peripheral Interface (SPI) Port—Slave Timing
Rev. B
|
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July 2013
ADSP-BF592
Universal Asynchronous Receiver-Transmitter
(UART) Ports—Receive and Transmit Timing
The UART ports receive and transmit operations are described
in the ADSP-BF59x Hardware Reference Manual.
General-Purpose Port Timing
Table 28 and Figure 21 describe general-purpose
port operations.
Table 28. General-Purpose Port Timing
VDDEXT 1.8V/2.5 V/3.3V Nominal
Parameter
Min
tSCLK + 1
0
Max
Unit
ns
Timing Requirement
tWFI
Switching Characteristic
tGPOD General-Purpose Port Pin Output Delay from CLKOUT Low
General-Purpose Port Pin Input Pulse Width
11
ns
CLKOUT
GPIO OUTPUT
GPIO INPUT
tGPOD
tWFI
Figure 21. General-Purpose Port Timing
Rev. B
|
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July 2013
ADSP-BF592
Timer Cycle Timing
Table 29 and Figure 22 describe timer expired operations. The
input signal is asynchronous in “width capture mode” and
“external clock mode” and has an absolute maximum input fre-
quency of (fSCLK/2) MHz.
Table 29. Timer Cycle Timing
VDDEXT
VDDEXT
1.8V Nominal
2.5 V/3.3V Nominal
Parameter
Min
Max
Min
Max
Unit
Timing Requirements
tWL
Timer Pulse Width Input Low
(Measured In SCLK Cycles)1
1 × tSCLK
1 × tSCLK
1 × tSCLK
1 × tSCLK
ns
ns
tWH
Timer Pulse Width Input High
(Measured In SCLK Cycles)1
tTIS
tTIH
Timer Input Setup Time Before CLKOUT Low2
Timer Input Hold Time After CLKOUT Low2
10
–2
8
ns
ns
–2
Switching Characteristics
tHTO Timer Pulse Width Output
1 × tSCLK – 2 (232 – 1) × tSCLK
tSCLK – 1.5
(232 – 1) × tSCLK ns
(Measured In SCLK Cycles)
tTOD
Timer Output Update Delay After CLKOUT High
6
6 ns
1 The minimum pulse widths apply for TMRx signals in width capture and external clock modes. They also apply to the PG0 or PPI_CLK signals in PWM output mode.
2 Either a valid setup and hold time or a valid pulse width is sufficient. There is no need to resynchronize programmable flag inputs.
CLKOUT
tTOD
TMRx OUTPUT
tTIS
tTIH
tHTO
TMRx INPUT
tWH,tWL
Figure 22. Timer Cycle Timing
Timer Clock Timing
Table 30 and Figure 23 describe timer clock timing.
Table 30. Timer Clock Timing
VDDEXT = 1.8 V
Max
VDDEXT = 2.5V/3.3 V
Max
Parameter
Min
Min
Unit
Switching Characteristic
tTODP
Timer Output Update Delay After PPI_CLK High
12.64
12.64
ns
PPI_CLK
tTODP
TMRx OUTPUT
Figure 23. Timer Clock Timing
Rev. B
|
Page 34 of 44
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July 2013
ADSP-BF592
JTAG Test And Emulation Port Timing
Table 31 and Figure 24 describe JTAG port operations.
Table 31. JTAG Port Timing
VDDEXT
1.8V Nominal
VDDEXT
2.5 V/3.3V Nominal
Parameter
Min
Max
Min
Max
Unit
Timing Requirements
tTCK
TCK Period
20
4
20
4
ns
tSTAP
tHTAP
tSSYS
tHSYS
tTRSTW
TDI, TMS Setup Before TCK High
TDI, TMS Hold After TCK High
System Inputs Setup Before TCK High1
System Inputs Hold After TCK High1
TRST Pulse Width2 (measured in TCK cycles)
ns
4
4
ns
4
5
ns
5
5
ns
4
4
TCK
Switching Characteristics
tDTDO TDO Delay from TCK Low
tDSYS
System Outputs Delay After TCK Low3
10
13
10
13
ns
ns
1 System inputs = SCL, SDA, PF15–0, PG15–0, PH2–0, TCK, NMI, BMODE3–0, PG.
2 50 MHz maximum.
3 System outputs = CLKOUT, SCL, SDA, PF15–0, PG15–0, PH2–0, TDO, EMU, EXT_WAKE.
tTCK
TCK
tSTAP
tHTAP
TMS
TDI
tDTDO
TDO
tSSYS
tHSYS
SYSTEM
INPUTS
tDSYS
SYSTEM
OUTPUTS
Figure 24. JTAG Port Timing
Rev. B
|
Page 35 of 44
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July 2013
ADSP-BF592
OUTPUT DRIVE CURRENTS
Figure 25 through Figure 33 show typical current-voltage char-
acteristics for the output drivers of the ADSP-BF592 processor.
40
30
VDDEXT = 1.9V @ – 40
VDDEXT = 1.8V @ 25
°C
°
C
The curves represent the current drive capability of the output
drivers. See Table 7 on Page 14 for information about which
driver type corresponds to a particular pin.
VDDEXT = 1.7V @ 105°C
20
V
OH
10
120
0
VDDEXT = 3.0V @ – 40
VDDEXT = 3.3V @ 25
VDDEXT = 3.6V @ 105
°C
100
°
C
–10
–20
–30
–40
80
60
°C
V
OL
40
V
OH
20
0
–20
–40
–60
–80
–100
0
0.5
1.0
1.5
SOURCE VOLTAGE (V)
V
OL
Figure 27. Driver Type A Current (1.8V VDDEXT
)
120
100
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
VDDEXT = 3.6V @ – 40
VDDEXT = 3.3V @ 25
DDEXT = 3.0V @ 105°C
°C
SOURCE VOLTAGE (V)
°
C
80
60
V
Figure 25. Driver Type A Current (3.3V VDDEXT
)
40
20
80
VDDEXT = 2.75V @ – 40
VDDEXT = 2.5V @ 25
°C
0
°C
60
40
20
–20
–40
–60
–80
–100
–120
V
DDEXT = 2.25V @ 105°C
V
OL
V
OH
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
–20
SOURCE VOLTAGE (V)
–40
–60
V
Figure 28. Driver Type B Current (3.3V VDDEXT
)
OL
80
–80
VDDEXT = 2.75V @ – 40
VDDEXT = 2.5V @ 25
°C
0
0.5
1.0
1.5
2.0
2.5
°C
60
40
20
SOURCE VOLTAGE (V)
V
DDEXT = 2.25V @ 105°C
Figure 26. Drive Type A Current (2.5V VDDEXT
)
0
–20
–40
–60
V
OL
–80
0
0.5
1.0
1.5
2.0
2.5
SOURCE VOLTAGE (V)
Figure 29. Driver Type B Current (2.5V VDDEXT
)
Rev. B
|
Page 36 of 44
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July 2013
ADSP-BF592
60
50
40
VDDEXT = 1.9V @ – 40
VDDEXT = 1.8V @ 25
°C
VDDEXT = 1.9V @ – 40
°C
°
C
VDDEXT = 1.8V @ 25
°C
40
20
VDDEXT = 1.7V @ 105°C
VDDEXT = 1.7V @ 105°C
30
20
V
OH
10
0
–20
–40
–60
0
–10
–20
–30
–40
–50
V
OL
V
OL
0
0.5
1.0
1.5
0
0.5
1.0
1.5
SOURCE VOLTAGE (V)
SOURCE VOLTAGE (V)
Figure 33. Driver Type C Current (1.8V VDDEXT
)
Figure 30. Driver Type B Current (1.8V VDDEXT
)
TEST CONDITIONS
150
120
VDDEXT = 3.6V @ – 40
VDDEXT = 3.3V @ 25
DDEXT = 3.0V @ 105°C
°C
All timing parameters appearing in this data sheet were mea-
sured under the conditions described in this section. Figure 34
shows the measurement point for ac measurements (except out-
put enable/disable). The measurement point VMEAS is VDDEXT/2
for VDDEXT (nominal) = 1.8 V/2.5 V/3.3 V.
°
C
V
90
60
V
OH
30
0
– 30
INPUT
OR
OUTPUT
V
V
MEAS
MEAS
– 60
– 90
V
OL
– 120
Figure 34. Voltage Reference Levels for AC
Measurements (Except Output Enable/Disable)
– 150
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
SOURCE VOLTAGE (V)
Output Enable Time Measurement
Output pins are considered to be enabled when they have made
a transition from a high impedance state to the point when they
start driving.
Figure 31. Driver Type C Current (3.3V VDDEXT
)
100
VDDEXT = 2.75V @ – 40
VDDEXT = 2.5V @ 25
°C
The output enable time tENA is the interval from the point when
a reference signal reaches a high or low voltage level to the point
when the output starts driving as shown on the right side of
Figure 35.
75
50
°
C
V
DDEXT = 2.25V @ 105°C
25
0
V
OH
REFERENCE
SIGNAL
– 25
– 50
V
tDIS_MEASURED
tENA_MEASURED
OL
– 75
tDIS
tENA
– 100
V
OH
V
(MEASURED)
OH
0
0.5
1.0
1.5
2.0
2.5
(MEASURED)
V
(MEASURED) ؊ ⌬V
(MEASURED) + ⌬V
OH
V
(HIGH)
TRIP
SOURCE VOLTAGE (V)
V
(LOW)
V
V
TRIP
OL
V
OL
(MEASURED)
OL
Figure 32. Driver Type C Current (2.5V VDDEXT
)
(MEASURED)
tDECAY
tTRIP
OUTPUT STOPS DRIVING
OUTPUT STARTS DRIVING
HIGH IMPEDANCE STATE
Figure 35. Output Enable/Disable
Rev. B
|
Page 37 of 44
|
July 2013
ADSP-BF592
The time tENA_MEASURED is the interval from when the reference
signal switches to when the output voltage reaches VTRIP(high)
or VTRIP(low) and is shown below.
Capacitive Loading
Output delays and holds are based on standard capacitive loads
of an average of 6 pF on all pins (see Figure 36). VLOAD is equal
to (VDDEXT)/2.
• VDDEXT (nominal) = 1.8 V, VTRIP (high) is 1.05 V, VTRIP
(low) is 0.75 V
• VDDEXT (nominal) = 2.5 V, VTRIP (high) is 1.5 V, VTRIP (low)
is 1.0 V
TESTER PIN ELECTRONICS
50:
V
LOAD
T1
• VDDEXT (nominal) = 3.3 V, VTRIP (high) is 1.9 V, VTRIP (low)
is 1.4 V
DUT
OUTPUT
45:
70:
Time tTRIP is the interval from when the output starts driving to
when the output reaches the VTRIP(high) or VTRIP(low) trip
voltage.
ZO = 50:ꢀ(impedance)
TD = 4.04 ꢀ 1.18 ns
50:
0.5pF
4pF
2pF
Time tENA is calculated as shown in the equation:
400:
tENA = tENA_MEASURED – tTRIP
If multiple pins are enabled, the measurement value is that of
the first lead to start driving.
NOTES:
THE WORST CASE TRANSMISSION LINE DELAY IS SHOWN AND CAN BE USED
FOR THE OUTPUT TIMING ANALYSIS TO REFELECT THE TRANSMISSION LINE
EFFECT AND MUST BE CONSIDERED.THE TRANSMISSION LINE (TD) IS FOR
LOAD ONLY AND DOES NOT AFFECT THE DATA SHEET TIMING SPECIFICATIONS.
Output Disable Time Measurement
Output pins are considered to be disabled when they stop driv-
ing, go into a high impedance state, and start to decay from their
output high or low voltage. The output disable time tDIS is the
difference between tDIS_MEASURED and tDECAY as shown on the left
ANALOG DEVICES RECOMMENDS USING THE IBIS MODEL TIMING FOR A GIVEN
SYSTEM REQUIREMENT. IF NECESSARY, A SYSTEM MAY INCORPORATE
EXTERNAL DRIVERS TO COMPENSATE FOR ANY TIMING DIFFERENCES.
Figure 36. Equivalent Device Loading for AC Measurements
(Includes All Fixtures)
side of Figure 35.
tDIS = tDIS_MEASURED – tDECAY
The graphs of Figure 37 through Figure 42 show how output
rise time varies with capacitance. The delay and hold specifica-
tions given should be derated by a factor derived from these
figures. The graphs in these figures may not be linear outside the
ranges shown.
The time for the voltage on the bus to decay by ΔV is dependent
on the capacitive load CL and the load current IL. This decay
time can be approximated by the equation:
tDECAY = CLV IL
The time tDECAY is calculated with test loads CL and IL, and with
ΔV equal to 0.25 V for VDDEXT (nominal) = 2.5 V/3.3 V and
0.15 V for VDDEXT (nominal) = 1.8V.
20
18
tFALL
16
The time tDIS_MEASURED is the interval from when the reference
signal switches to when the output voltage decays ΔV from the
measured output high or output low voltage.
14
tRISE
12
10
Example System Hold Time Calculation
8
6
4
To determine the data output hold time in a particular system,
first calculate tDECAY using the equation given above. Choose ΔV
to be the difference between the processor’s output voltage and
the input threshold for the device requiring the hold time. CL is
the total bus capacitance (per data line), and IL is the total leak-
age or three-state current (per data line). The hold time will be
tFALL = 1.8V @ 25
°C
2
0
tRISE = 1.8V @ 25
°C
0
50
100
150
200
250
t
DECAY plus the various output disable times as specified in the
LOAD CAPACITANCE (pF)
Timing Specifications on Page 22.
Figure 37. Driver Type A Typical Rise and Fall Times (10%–90%) vs.
Load Capacitance (1.8V VDDEXT
)
Rev. B
|
Page 38 of 44
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July 2013
ADSP-BF592
18
16
14
12
9
8
tFALL
tFALL
7
6
5
tRISE
tRISE
10
8
4
3
2
1
6
4
tFALL = 2.5V @ 25
°C
tFALL = 2.5V @ 25
°
C
2
tRISE = 2.5V @ 25
°
C
tRISE = 2.5V @ 25
°C
0
0
0
50
100
150
200
250
0
50
100
150
200
250
LOAD CAPACITANCE (pF)
LOAD CAPACITANCE (pF)
Figure 38. Driver Type A Typical Rise and Fall Times (10%–90%) vs.
Load Capacitance (2.5V VDDEXT
Figure 41. Driver Type C Typical Rise and Fall Times (10%–90%) vs.
Load Capacitance (2.5V VDDEXT
)
)
16
14
7
tFALL
6
5
tFALL
12
10
tRISE
tRISE
4
3
8
6
4
2
2
1
tFALL = 3.3V @ 25
°
C
tFALL = 3.3V @ 25
°C
tRISE = 3.3V @ 25
°
C
tRISE = 3.3V @ 25
°C
0
0
0
50
100
150
200
250
0
50
100
150
200
250
LOAD CAPACITANCE (pF)
LOAD CAPACITANCE (pF)
Figure 39. Driver Type A Typical Rise and Fall Times (10%–90%) vs.
Load Capacitance (3.3V VDDEXT
Figure 42. Driver Type C Typical Rise and Fall Times (10%–90%) vs.
Load Capacitance (3.3V VDDEXT
)
)
12
tFALL
10
8
tRISE
6
4
2
tFALL = 1.8V @ 25
°
C
tRISE = 1.8V @ 25
°C
0
0
50
100
150
200
250
LOAD CAPACITANCE (pF)
Figure 40. Driver Type C Typical Rise and Fall Times (10%–90%) vs.
Load Capacitance (1.8V VDDEXT
)
Rev. B
|
Page 39 of 44
|
July 2013
ADSP-BF592
ENVIRONMENTAL CONDITIONS
To determine the junction temperature on the application
printed circuit board use:
TJ = TCASE + JT PD
where:
TJ = junction temperature (°C)
T
CASE = case temperature (°C) measured by customer at top cen-
ter of package.
JT = from Table 32
PD = power dissipation (see Total Power Dissipation on Page 19
for the method to calculate PD)
Table 32. Thermal Characteristics
Parameter Condition
Typical Unit
θJA
0 linear m/s air flow
23.5
20.9
20.2
11.2
9.5
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
θJMA
θJMA
θJB
1 linear m/s air flow
2 linear m/s air flow
θJC
ΨJT
ΨJT
ΨJT
0 linear m/s air flow
1 linear m/s air flow
2 linear m/s air flow
0.21
0.36
0.43
Values of JA are provided for package comparison and printed
circuit board design considerations. JA can be used for a first
order approximation of TJ by the equation:
TJ = TA + JA PD
where:
TA = ambient temperature (°C)
Values of JC are provided for package comparison and printed
circuit board design considerations when an external heat sink
is required.
Values of JB are provided for package comparison and printed
circuit board design considerations.
In Table 32, airflow measurements comply with JEDEC stan-
dards JESD51-2 and JESD51-6, and the junction-to-board
measurement complies with JESD51-8. The junction-to-case
measurement complies with MIL-STD-883 (Method 1012.1).
All measurements use a 2S2P JEDEC test board.
Rev. B
|
Page 40 of 44
|
July 2013
ADSP-BF592
64-LEAD LFCSP LEAD ASSIGNMENT
Table 33 lists the LFCSP leads by signal mnemonic. Table 34
lists the LFCSP by lead number.
Table 33. 64-Lead LFCSP Lead Assignment (Alphabetical by Signal)
Signal
BMODE0
BMODE1
BMODE2
EXTCLK/SCLK
CLKIN
EMU
Lead No.
Signal
PF7
Lead No.
7
Signal
PG6
Lead No.
38
Signal
TDO
Lead No.
23
21
20
3
29
28
27
57
61
19
51
30
54
63
64
1
PF8
10
PG7
39
TMS
PF9
11
PG8
42
TRST
PF10
PF11
PF12
PF13
PF14
PF15
PG
12
PG9
43
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDINT
VDDINT
VDDINT
VDDINT
VDDINT
VDDINT
XTAL
GND*
13
PG10
PG11
PG12
PG13
PG14
PG15
PPI_CLK
RESET
SCL
44
14
25
35
46
58
8
15
45
EXT_WAKE
GND
16
47
17
48
NMI
18
49
PF0
52
50
PF1
PG0
PG1
PG2
PG3
PG4
PG5
31
56
9
PF2
32
53
26
40
41
55
62
65
PF3
2
33
60
PF4
4
34
SDA
59
PF5
5
36
TCK
24
PF6
6
37
TDI
22
* Lead no. 65 is the GND supply (see Figure 43 and Figure 44) for the processor (6.2 mm × 6.2 mm); this pad must connect to GND.
Table 34. 64-Lead LFCSP Lead Assignment (Numerical by Lead Number)
Lead No.
Signal
PF2
Lead No.
17
Signal
PF14
Lead No.
33
Signal
PG2
Lead No.
49
Signal
PG14
1
2
PF3
18
PF15
34
PG3
50
PG15
3
VDDEXT
PF4
19
EMU
35
VDDEXT
PG4
51
EXT_WAKE
PG
4
20
TRST
36
52
5
PF5
21
TMS
37
PG5
53
RESET
NMI
6
PF6
22
TDI
38
PG6
54
7
PF7
23
TDO
39
PG7
55
VDDINT
PPI_CLK
EXTCLK/SCLK
VDDEXT
SDA
8
VDDINT
VDDINT
PF8
24
TCK
40
VDDINT
VDDINT
PG8
56
9
25
VDDEXT
VDDINT
BMODE2
BMODE1
BMODE0
GND
41
57
10
11
12
13
14
15
16
26
42
58
PF9
27
43
PG9
59
PF10
PF11
VDDEXT
PF12
PF13
28
44
PG10
PG11
VDDEXT
PG12
PG13
60
SCL
29
45
61
CLKIN
XTAL
30
46
62
31
PG0
47
63
PF0
32
PG1
48
64
PF1
65
GND*
* Pin no. 65 is the GND supply (see Figure 43 and Figure 44) for the processor (6.2 mm × 6.2 mm); this pad must connect to GND.
Rev. B
|
Page 41 of 44
|
July 2013
ADSP-BF592
Figure 43 shows the top view of the LFCSP lead configuration.
Figure 44 shows the bottom view of the LFCSP lead
configuration.
PIN 64
PIN 1
PIN 49
PIN 48
PIN 1 INDICATOR
ADSP-BF592
64-LEAD LFCSP
TOP VIEW
PIN 16
PIN 33
PIN 17
PIN 32
Figure 43. 64-Lead LFCSP Lead Configuration (Top View)
PIN 49
PIN 64
PIN 48
PIN 1
ADSP-BF592
64-LEAD
LFCSP
GND PAD
(PIN 65)
PIN 1 INDICATOR
BOTTOM VIEW
PIN 33
PIN 16
PIN 32
PIN 17
Figure 44. 64-Lead LFCSP Lead Configuration (Bottom View)
Rev. B
|
Page 42 of 44
|
July 2013
ADSP-BF592
OUTLINE DIMENSIONS
Dimensions in Figure 45 are shown in millimeters.
0.60 MAX
9.00
BSC SQ
0.60
MAX
PIN 1
INDICATOR
64
49
1
48
PIN 1
INDICATOR
0.50
BSC
6.35
6.20 SQ
6.05
8.75
TOP VIEW
EXPOSED PAD
BSC SQ
(BOTTOM VIEW)
0.50
0.40
0.30
33
32
16
17
0.25 MIN
7.50
REF
0.80 MAX
0.65 TYP
12° MAX
1.00
0.85
0.80
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE LEAD ASSIGNMENT AND
SIGNAL DESCRIPTIONS
0.05 MAX
0.02 NOM
SECTIONS OF THIS DATA SHEET.
0.30
0.23
0.18
SEATING
PLANE
0.20 REF
COMPLIANT TO JEDEC STANDARDS MO-220-VMMD-4
Figure 45. 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ1]
Very Thin Quad (CP-64-4)
Dimensions shown in millimeters
1 For information relating to the CP-64-4 package’s exposed pad, see the table endnotes on Page 41.
Rev. B
|
Page 43 of 44
|
July 2013
ADSP-BF592
AUTOMOTIVE PRODUCTS
The ADSP-BF592 is available with controlled manufacturing to support the quality and reliability requirements of automotive applica-
tions. Note that this automotive model may have specifications that differ from the commercial models and designers should review the
product specifications section of this data sheet carefully. Only the automotive grade products shown in Table 35 are available for use in
automotive applications. Contact your local ADI account representative for specific product ordering information and to obtain the spe-
cific Automotive Reliability reports for these models.
Table 35. Automotive Products
Temperature
Range2
Instruction
Rate (Max)
Package
Option
Model1
Package Description
ADBF592WYCPZxx
1 Z = RoHS compliant part.
–40ºC to +105ºC
400 MHz
64-Lead LFCSP
CP-64-4
2 Referenced temperature is ambient temperature. The ambient temperature is not a specification. Please see Operating Conditions on Page 16 for junction temperature (TJ)
specification, which is the only temperature specification.
ORDERING GUIDE
Temperature
Range3
Instruction
Rate (Max)
Package
Option
Model1, 2
Package Description
64-Lead LFCSP
64-Lead LFCSP
64-Lead LFCSP
64-Lead LFCSP
ADSP-BF592KCPZ-2
ADSP-BF592KCPZ
ADSP-BF592BCPZ-2
ADSP-BF592BCPZ
1 Z = RoHS compliant part.
0ºC to +70ºC
0ºC to +70ºC
–40ºC to +85ºC
–40ºC to +85ºC
200 MHz
400 MHz
200 MHz
400 MHz
CP-64-4
CP-64-4
CP-64-4
CP-64-4
2 Available with a wide variety of audio algorithm combinations sold as part of a chipset and bundled with necessary software. For a complete list, visit our website at
www.analog.com /Blackfin.
3 Referenced temperature is ambient temperature. The ambient temperature is not a specification. Please see Operating Conditions on Page 16 for junction temperature (TJ)
specification, which is the only temperature specification.
©2013 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D09574-0-7/13(B)
Rev. B
|
Page 44 of 44
|
July 2013
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