EVAL-AD7856CB [ADI]
5 V Single Supply, 8-Channel 14-Bit 285 kSPS Sampling ADC; 5 V单电源， 8通道14位285 kSPS的采样ADC
| 型号： | EVAL-AD7856CB |
| 厂家： | 
ADI |
| 描述： | 5 V Single Supply, 8-Channel 14-Bit 285 kSPS Sampling ADC |
| 文件： | 总32页 (文件大小：296K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
5 V Single Supply, 8-Channel
14-Bit 285 kSPS Sampling ADC
a
AD7856
FUNCTIONAL BLOCK DIAGRAM
FEATURES
Single 5 V Supply
285 kSPS Throughput Rate
AGND
AV
DD
Self- and System Calibration with Autocalibration on
Power-Up
Eight Single-Ended or Four Pseudo-Differential Inputs
Low Power: 60 mW Typ
Automatic Power-Down After Conversion (2.5 W Typ)
Flexible Serial Interface: 8051/SPI™/QSPI™/P Compatible
24-Lead DIP, SOIC and SSOP Packages
DV
DD
AIN1
AIN8
I/P
MUX
AD7856
T/H
4.096V
REFERENCE
COMP
DGND
REF /REF
BUF
IN
OUT
APPLICATIONS
C
REF1
Battery-Powered Systems (Personal Digital Assistants,
Medical Instruments, Mobile Communications)
Pen Computers
CHARGE
REDISTRIBUTION
DAC
Instrumentation and Control Systems
High Speed Modems
CLKIN
C
SAR + ADC
CONTROL
CONVST
BUSY
REF2
CALIBRATION
MEMORY AND
CONTROLLER
CAL
SLEEP
GENERAL DESCRIPTION
SERIAL INTERFACE/CONTROL REGISTER
The AD7856 is a high speed, low power, 14-bit ADC that oper-
ates from a single 5 V power supply. The ADC powers up with
a set of default conditions at which time it can be operated as a
read only ADC. The ADC contains self-calibration and system
calibration options to ensure accurate operation over time and
temperature and it has a number of power-down options for low
power applications.
SYNC
DIN
DOUT
SCLK
PRODUCT HIGHLIGHTS
1. Single 5 V supply.
2. Automatic calibration on power-up.
The AD7856 is capable of 285 kHz throughput rate. The input
track-and-hold acquires a signal in 500 ns and features a pseudo-
differential sampling scheme. The AD7856 voltage range is 0 to
VREF with straight binary output coding. Input signal range is to
the supply and the part is capable of converting full power sig-
nals to 10 MHz.
3. Flexible power management options including automatic
power-down after conversion.
4. Operates with reference voltages from 1.2 V to VDD
5. Analog input range from 0 V to VDD
.
.
6. Eight single-ended or four pseudo-differential input channels.
7. Self- and system calibration.
CMOS construction ensures low power dissipation of typically
60 mW for normal operation and 5.1 mW in power-down mode
at 10 kSPS throughput rate. The part is available in 24-lead,
0.3 inch-wide dual in-line package (DIP), 24-lead small outline
(SOIC) and 24-lead small shrink outline (SSOP) packages.
Please see page 31 for data sheet index.
8. Versatile serial I/O port (SPI/QSPI/8051/µP).
SPI and QSPI are trademarks of Motorola, Inc.
REV. A
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781/329-4700
Fax: 781/326-8703
World Wide Web Site: http://www.analog.com
© Analog Devices, Inc., 1998
A Grade: fCLKIN = 6 MHz, (–40؇C to +105؇C), fSAMPLE = 285 kHz; K Grade:
fCLKIN = 4 MHz, (0؇C to +105؇C), fSAMPLE = 102 kHz; (AVDD = DVDD = +5.0 V ؎ 5%,
REFIN/REFOUT = 4.096 V External Reference unless otherwise noted, SLEEP = Logic High; TA = TMIN to TMAX, unless otherwise noted.) Specifica-
tions apply for Mode 2 operation, standard 3-wire SPI interface; refer to Detailed Timing section for Mode 1 Specifications.
AD7856–SPECIFICATIONS1, 2
Parameter
A Version1
K Version1
Units
Test Conditions/Comments
IN = 10 kHz
79.5 dB typ
–95 dB typ
–95 dB typ
DYNAMIC PERFORMANCE
Signal to Noise + Distortion Ratio3 (SNR)
Total Harmonic Distortion (THD)
Peak Harmonic or Spurious Noise
Intermodulation Distortion (IMD)
Second Order Terms
f
78
–86
–87
78
–86
–87
dB min
dB max
dB max
–86
–86
–90
–90
–90
–90
dB typ
dB typ
dB typ
fa = 9.983 kHz, fb = 10.05 kHz
fa = 9.983 kHz, fb = 10.05 kHz
VIN = 25 kHz
Third Order Terms
Channel-to-Channel Isolation
DC ACCURACY
Resolution
Any Channel
14
14
Bits
Integral Nonlinearity
±2
LSB max
LSB typ
LSB max
LSB typ
LSB max
LSB typ
LSB max
LSB max
LSB typ
LSB max
4.096 V External Reference, VDD = 5 V
Guaranteed No Missed Codes to 13 Bits.
±2
±2
±10
Differential Nonlinearity
Offset Error
±2
±10
±5
±3
Offset Error Match
Positive Full-Scale Error
±10
±10
Positive Full-Scale Error Match
±2
ANALOG INPUT
Input Voltage Ranges
0 to VREF
0 to VREF
Volts
i.e., AIN(+) – AIN(–) = 0 to VREF, AIN(–) Can Be
Biased Up, but AIN(+) Cannot Go Below AIN(–)
Leakage Current
Input Capacitance
±1
20
±1
20
µA max
pF typ
REFERENCE INPUT/OUTPUT
REFIN Input Voltage Range
Input Impedance
4.096/VDD
150
2.3/VDD
150
V min/max
kΩ typ
Functional from 1.2 V
Resistor Connected to Internal Reference Node
REFOUT Output Voltage
REFOUT Tempco
3.696/4.496 3.696/4.496
V min/max
ppm/°C typ
20
20
LOGIC INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current, IIN
VDD – 1.0
VDD – 1.0
V min
0.4
±1
10
0.4
±1
10
V max
µA max
pF max
Typically 10 nA, VIN = 0 V or VDD
4
Input Capacitance, CIN
LOGIC OUTPUTS
Output High Voltage, VOH
Output Low Voltage, VOL
Floating-State Leakage Current
Floating-State Output Capacitance4
Output Coding
VDD – 0.4
VDD – 0.4
V min
ISOURCE = 200 µA
ISINK = 0.8 mA
0.4
±1
10
0.4
±1
10
V max
µA max
pF max
Straight (Natural) Binary
CONVERSION RATE
Conversion Time
Track/Hold Acquisition Time
3.5
0.33
5.25
0.5
µs max
µs min
21 CLKIN Cycles
–2–
REV. A
AD7856
Parameter
A Version1
K Version1
Units
Test Conditions/Comments
POWER PERFORMANCE
AVDD, DVDD
+4.75/+5.25
+4.75/+5.25
V min/max
mA max
µA typ
IDD
Normal Mode5
17
30
400
5
17
10
500
5
AVDD = DVDD = 4.75 V to 5.25 V. Typically 12 mA
Sleep Mode6
With External Clock On
Full Power-Down. Power Management Bits in Con-
trol Register Set as PMGT1 = 1, PMGT0 = 0
Partial Power-Down. Power Management Bits in
Control Register Set as PMGT1 = 1, PMGT0 = 1
Typically 0.5 µA. Full Power-Down. Power Manage-
ment. Bits in Control Register Set as PMGT1 = 1,
PMGT0 = 0
µA typ
With External Clock Off
µA max
200
200
µA typ
Partial Power-Down. Power Management Bits in
Control Register Set as PMGT1 = 1, PMGT0 = 1
Normal Mode Power Dissipation
Sleep Mode Power Dissipation
With External Clock On
89.25
89.25
mW max
V
DD = 5.25 V. Typically 60 mW; SLEEP = VDD
52.5
52.5
µW typ
V
DD = 5.25 V. SLEEP = 0 V
With External Clock Off
26.25
26.25
µW max
VDD = 5.25 V. Typically 5.25 µW; SLEEP = 0 V
SYSTEM CALIBRATION
Offset Calibration Span7
Gain Calibration Span7
+0.0375 × VREF/–0.0375 × VREF
+1.01875 × VREF/–0.98125 × VREF V max/min
V max/min
Allowable Offset Voltage Span for Calibration
Allowable Full-Scale Voltage Span for Calibration
NOTES
1Temperature ranges as follows: A Version: –40°C to +105°C. K Version: 0°C to +105°C.
2Specifications apply after calibration.
3SNR calculation includes distortion and noise components.
4Sample tested @ +25°C to ensure compliance.
5All digital inputs @ DGND except for CONVST, SLEEP, CAL and SYNC @ DVDD. No load on the digital outputs. Analog inputs @ AGND.
6CLKIN @ DGND when external clock off. All digital inputs @ DGND except for CONVST, SLEEP, CAL, and SYNC @ DVDD. No load on the digital outputs.
Analog inputs @ AGND.
7The Offset and Gain Calibration Spans are defined as the range of offset and gain errors that the AD7856 can calibrate. Note also that these are voltage spans and are
not absolute voltages (i.e., the allowable system offset voltage presented at AIN(+) for the system offset error to be adjusted out will be AIN(–) ±0.0375 × VREF, and
the allowable system full-scale voltage applied between AIN(+) and AIN(–) for the system full-scale voltage error to be adjusted out will be V REF ± 0.01875 × VREF).
This is explained in more detail in the Calibration section of the data sheet.
Specifications subject to change without notice.
REV. A
–3–
AD7856
TIMING SPECIFICATIONS1 (VDD = 5 V; TA = TMIN to TMAX, unless otherwise noted. A Grade: fCLKIN = 6 MHz; K Grade: fCLKIN = 4 MHz.)
Limit at TMIN, TMAX
Parameter
A Version
K Version
Units
Description
2
fCLKIN
500
6
6
100
500
4
4
100
kHz min
MHz max
MHz max
ns min
Master Clock Frequency
fSC3 LK
t1
CONVST Pulsewidth
t2
50
3.5
50
5.25
ns max
µs max
CONVST↓ to BUSY↑ Propagation Delay
Conversion Time = 20 tCLKIN
tCONVERT
t3
–0.4 tSCLK
±0.4 tSCLK
30
30
45
–0.4 tSCLK
±0.4 tSCLK
50
50
75
ns min
SYNC↓ to SCLK↓ Setup Time (Noncontinuous SCLK Input)
SYNC↓ to SCLK↓ Setup Time (Continuous SCLK Input)
Delay from SYNC↓ Until DOUT 3-State Disabled
Delay from SYNC↓ Until DIN 3-State Disabled
Data Access Time After SCLK↓
ns min/max
ns max
ns max
ns max
ns min
4
t44
t54
t6
t7
30
40
Data Setup Time Prior to SCLK↑
t8
20
20
ns min
Data Valid to SCLK Hold Time
t9
t10
t11
0.4 tSCLK
0.4 tSCLK
30
30/0.4 tSCLK
50
90
50
2.5 tCLKIN
2.5 tCLKIN
41.7
0.4 tSCLK
0.4 tSCLK
30
30/0.4 tSCLK ns min/max
50
90
50
2.5 tCLKIN
2.5 tCLKIN
62.5
ns min
ns min
ns min
SCLK High Pulsewidth
SCLK Low Pulsewidth
SCLK↑ to SYNC↑ Hold Time (Noncontinuous SCLK)
(Continuous SCLK)
Delay from SYNC↑ Until DOUT 3-State Enabled
Delay from SCLK↑ to DIN Being Configured as Output
Delay from SCLK↑ to DIN Being Configured as Input
CAL↑ to BUSY↑ Delay
5
t12
t13
t14
t15
t16
tCAL
ns max
ns max
ns max
ns max
ns max
ms typ
6
CONVST↓ to BUSY↑ Delay in Calibration Sequence
Full Self-Calibration Time, Master Clock Dependent
(250026 tCLKIN
Internal DAC Plus System Full-Scale Cal Time, Master
Clock Dependent (222228 tCLKIN
System Offset Calibration Time, Master Clock Dependent
(27798 tCLKIN
)
tCAL1
tCAL2
37.04
4.63
55.5
6.94
ms typ
ms typ
)
)
NOTES
1Sample tested at +25°C to ensure compliance. All input signals are specified with tr = tf = 5 ns (10% to 90% of VDD) and timed from a voltage level of 1.6 V.
See Table X and timing diagrams for different interface modes and calibration.
2Mark/Space ratio for the master clock input is 40/60 to 60/40.
3The CONVST pulsewidth here only applies for normal operation. When the part is in power-down mode, a different CONVST pulsewidth will apply
(see Power-Down section).
4Measured with the load circuit of Figure 1 and defined as the time required for the output to cross 0.8 V or 2.4 V.
5t12 is derived form the measured time taken by the data outputs to change 0.5 V when loaded with the circuit of Figure 1. The measured number is then extrapolated
back to remove the effects of charging or discharging the 100 pF capacitor. This means that the time, t12, quoted in the timing characteristics is the true bus
relinquish time of the part and is independent of the bus loading.
6t14 is derived form the measured time taken by the data outputs to change 0.5 V when loaded with the circuit of Figure 1. The measured number is then
extrapolated back to remove the effects of charging or discharging the 100 pF capacitor. This means that the time, t 14, quoted in the Timing Characteristics is the
true delay of the part in turning off the output drivers and configuring the DIN line as an input. Once this time has elapsed the user can drive the DIN line
knowing that a bus conflict will not occur.
Specifications subject to change without notice.
–4–
REV. A
AD7856
TYPICAL TIMING DIAGRAMS
I
I
1.6mA
OL
Figures 2 and 3 show typical read and write timing diagrams for
serial Interface Mode 2. The reading and writing occurs after
conversion in Figure 2, and during conversion in Figure 3. To
attain the maximum sample rate of 285 kHz, reading and writ-
ing must be performed during conversion as in Figure 3. At
least 330 ns acquisition time must be allowed (the time from
the falling edge of BUSY to the next rising edge of CONVST)
before the next conversion begins to ensure that the part is
settled to the 14-bit level. If the user does not want to provide
the CONVST signal, the conversion can be initiated in software
by writing to the control register.
TO OUTPUT
PIN
+2.1V
C
L
100pF
200A
OL
Figure 1. Load Circuit for Digital Output Timing
Specifications
tCONVERT = 3.5s MAX, 5.25s MAX FOR K VERSION
t1 = 100ns MIN, t4 = 30/50ns MAX A/K, t7 = 30/40ns MIN A/K
t1
CONVST (I/P)
tCONVERT
t2
BUSY (O/P)
SYNC (I/P)
t11
t3
t9
5
SCLK (I/P)
1
6
16
t4
t10
t12
t6
t6
THREE-
STATE
THREE-STATE
DOUT (O/P)
DIN (I/P)
DB15
DB0
DB11
t8
t7
DB15
DB11
DB0
Figure 2. Timing Diagram for Interface Mode 2 (Reading/Writing After Conversion)
tCONVERT = 3.5s MAX, 5.25s MAX FOR K VERSION
t1 = 100ns MIN, t4 = 30/50ns MAX A/K, t7 = 30/40ns MIN A/K
t1
CONVST (I/P)
tCONVERT
t2
BUSY (O/P)
SYNC (I/P)
t11
t3
t9
5
SCLK (I/P)
1
6
16
t4
t10
t12
t6
t6
THREE-
STATE
THREE-STATE
DOUT (O/P)
DIN (I/P)
DB0
DB11
DB15
t8
t7
DB11
DB0
DB15
Figure 3. Timing Diagram for Interface Mode 2 (Reading/Writing During Conversion)
REV. A
–5–
AD7856
ABSOLUTE MAXIMUM RATINGS1
ORDERING GUIDE
(TA = +25°C unless otherwise noted)
Linearity
Error
AVDD to AGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
DVDD to DGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
AVDD to DVDD . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V
Analog Input Voltage to AGND . . . . –0.3 V to AVDD + 0.3 V
Digital Input Voltage to DGND . . . . –0.3 V to DVDD + 0.3 V
Digital Output Voltage to DGND . . . –0.3 V to DVDD + 0.3 V
REFIN/REFOUT to AGND . . . . . . . . . –0.3 V to AVDD + 0.3 V
Input Current to Any Pin Except Supplies2 . . . . . . . ±10 mA
Operating Temperature Range Commercial
Package
Options2
Model
(LSB)1
AD7856AN
AD7856AR
AD7856KR
±2 typ
±2 typ
±2
N-24
R-24
R-24
RS-24
AD7856ARS
±2 typ
EVAL-AD7856CB3
EVAL-CONTROL BOARD4
A Version . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to +105°C
K Version . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +105°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . .+150°C
Plastic DIP Package, Power Dissipation . . . . . . . . . . 450 mW
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . 105°C/W
θJC Thermal Impedance . . . . . . . . . . . . . . . . . . . . 34.7°C/W
Lead Temperature, (Soldering, 10 secs) . . . . . . . . .+260°C
SOIC, SSOP Package, Power Dissipation . . . . . . . . . 450 mW
θJA Thermal Impedance . 75°C/W (SOIC) 115°C/W (SSOP)
θJC Thermal Impedance . . 25°C/W (SOIC) 35°C/W (SSOP)
Lead Temperature, Soldering
NOTES
1Linearity error here refers to integral linearity error.
2N = Plastic DIP; R = SOIC; RS = SSOP.
3This can be used as a stand-alone evaluation board or in conjunction with the
EVAL-CONTROL BOARD for evaluation/demonstration purposes.
4This board is a complete unit allowing a PC to control and communicate with
all Analog Devices evaluation boards ending in the CB designators.
PIN CONFIGURATIONS
(DIP, SOIC AND SSOP)
1
2
3
4
5
6
7
8
9
24
Vapor Phase (60 secs) . . . . . . . . . . . . . . . . . . . . . . .+215°C
Infrared (15 secs) . . . . . . . . . . . . . . . . . . . . . . . . . . .+220°C
ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >1 kV
CONVST
BUSY
SYNC
23 SCLK
22
CLKIN
SLEEP
REF /REF
IN
DIN
21
20
19
18
17
16
15
14
OUT
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute maximum rating condi-
tions for extended periods may affect device reliability.
AV
AD7856
DOUT
DGND
DD
AGND
TOP VIEW
(Not to Scale)
C
DV
DD
REF1
C
CAL
REF2
2Transient currents of up to 100 mA will not cause SCR latch-up.
AIN1
AIN8
AIN2 10
AIN7
AIN6
11
12
AIN3
AIN4
13 AIN5
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD7856 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
–6–
REV. A
AD7856
PIN FUNCTION DESCRIPTIONS
Pin
Mnemonic
Description
Convert Start. Logic Input. A low to high transition on this input puts the track/hold into its hold mode
and starts conversion. When this input is not used, it should be tied to DVDD
1
CONVST
.
2
3
4
BUSY
Busy Output. The busy output is triggered high by the falling edge of CONVST or rising edge of CAL,
and remains high until conversion is completed. BUSY is also used to indicate when the AD7856 has
completed its on-chip calibration sequence.
Sleep Input/Low Power Mode. A Logic 0 initiates a sleep, and all circuitry is powered down, including
the internal voltage reference, provided there is no conversion or calibration being performed. Calibration
data is retained. A Logic 1 results in normal operation. See Power-Down section for more details.
SLEEP
REFIN/REFOUT Reference Input/Output. This pin is connected to the internal reference through a series resistor and is
the reference source for the analog-to-digital converter. The nominal reference voltage is 4.096 V and
this appears at the pin. This pin can be overdriven by an external reference or can be taken as high as
AVDD. When this pin is tied to AVDD, or when an externally applied reference approaches AVDD, the
CREF1 pin should also be tied to AVDD
.
5
6
7
AVDD
AGND
CREF1
Analog Positive Supply Voltage, +5.0 V ± 5%.
Analog Ground. Ground reference for track/hold, reference and DAC.
Reference Capacitor (0.1 µF Multilayer Ceramic in parallel with a 470 nF NPO type). This external
capacitor is used as a charge source for the internal DAC. The capacitor should be tied between the pin
and AGND.
8
CREF2
Reference Capacitor (0.01 µF Multilayer Ceramic). This external capacitor is used in conjunction with
the on-chip reference. The capacitor should be tied between the pin and AGND.
9–16
AIN1–AIN8
Analog Inputs. Eight analog inputs that can be used as eight single-ended inputs (referenced to AGND)
or four pseudo-differential inputs. Channel configuration is selected by writing to the control register.
Both the positive and negative inputs cannot go below AGND or above AVDD at any time. Also the posi-
tive input cannot go below the negative input. See Table III for channel selection.
17
CAL
Calibration Input. This pin has an internal pull-up current source of 0.15 µA. A falling edge on this pin
resets all calibration control logic and initiates a calibration on its rising edge. There is the option of
connecting a 10 nF capacitor from this pin to DGND to allow for an automatic self-calibration on
power-up. This input overrides all other internal operations. If the autocalibration is not required, this
pin should be tied to a logic high.
18
19
20
21
DVDD
DGND
DOUT
DIN
Digital Supply Voltage, +5.0 V ± 5%.
Digital Ground. Ground reference point for digital circuitry.
Serial Data Output. The data output is supplied to this pin as a 16-bit serial word.
Serial Data Input. The data to be written is applied to this pin in serial form (16-bit word). This pin can
act as an input pin or as a I/O pin depending on the serial interface mode the part is in (see Table X).
22
CLKIN
Master clock signal for the device (A Grade: 6 MHz; K Grade: 4 MHz). Sets the conversion and calibra-
tion times.
23
24
SCLK
SYNC
Serial Port Clock. Logic Input. The user must provide a serial clock on this input.
Frame Sync. Logic Input. This pin is level triggered active low and frames the serial clock for the read
and write operations (see Table IX).
REV. A
–7–
AD7856
TERMINOLOGY1
Total Harmonic Distortion
Total Harmonic Distortion (THD) is the ratio of the rms sum of
harmonics to the fundamental. For the AD7856, it is defined as:
Integral Nonlinearity
This is the maximum deviation from a straight line passing
through the endpoints of the ADC transfer function. The end-
points of the transfer function are zero scale, a point 1/2 LSB
below the first code transition, and full scale, a point 1/2 LSB
above the last code transition.
2
V22 +V32 +V42 +V52 +V6
THD (dB) = 20 log
V1
where V1 is the rms amplitude of the fundamental and V2, V3,
V4, V5 and V6 are the rms amplitudes of the second through the
sixth harmonics.
Differential Nonlinearity
This is the difference between the measured and the ideal 1 LSB
change between any two adjacent codes in the ADC.
Peak Harmonic or Spurious Noise
Total Unadjusted Error
Peak harmonic or spurious noise is defined as the ratio of the
rms value of the next largest component in the ADC output
spectrum (up to fS/2 and excluding dc) to the rms value of the
fundamental. Normally, the value of this specification is deter-
mined by the largest harmonic in the spectrum, but for parts
where the harmonics are buried in the noise floor, it will be a
noise peak.
This is the deviation of the actual code from the ideal code
taking all errors into account (Gain, Offset, Integral Nonlinearity
and other errors) at any point along the transfer function.
Unipolar Offset Error
This is the deviation of the first code transition (00 . . . 000 to
00 . . . 001) from the ideal AIN(+) voltage (AIN(–) + 1/2 LSB).
Positive Full-Scale Error
Intermodulation Distortion
This is the deviation of the last code transition from the ideal
AIN(+) voltage (AIN(–) + Full Scale – 1.5 LSB) after the offset
error has been adjusted out.
With inputs consisting of sine waves at two frequencies, fa and
fb, any active device with nonlinearities will create distortion
products at sum and difference frequencies of mfa ± nfb where
m, n = 0, 1, 2, 3, etc. Intermodulation distortion terms are
those for which neither m nor n are equal to zero. For example,
the second order terms include (fa + fb) and (fa – fb), while the
third order terms include (2fa + fb), (2fa – fb), (fa + 2fb) and
(fa – 2fb).
Channel-to-Channel Isolation
Channel-to-channel isolation is a measure of crosstalk between
the channels. It is measured by applying a full-scale 25 kHz
signal to the other seven channels and determining how much
that signal is attenuated in the channel of interest. The figure
given is the worst case for all channels.
Testing is performed using the CCIF standard where two input
frequencies near the top end of the input bandwidth are used. In
this case, the second order terms are usually distanced in fre-
quency from the original sine waves, while the third order terms
are usually at a frequency close to the input frequencies. As a
result, the second and third order terms are specified separately.
The calculation of the intermodulation distortion is as per the
THD specification where it is the ratio of the rms sum of the
individual distortion products to the rms amplitude of the sum
of the fundamentals expressed in dBs.
Track/Hold Acquisition Time
The track/hold amplifier returns into track mode and the end of
conversion. Track/Hold acquisition time is the time required for
the output of the track/hold amplifier to reach its final value,
within ±1/2 LSB, after the end of conversion.
Signal to (Noise + Distortion) Ratio
This is the measured ratio of signal to (noise + distortion) at the
output of the A/D converter. The signal is the rms amplitude of
the fundamental. Noise is the sum of all nonfundamental signals
up to half the sampling frequency (fS/2), excluding dc. The ratio
is dependent on the number of quantization levels in the digiti-
zation process; the more levels, the smaller the quantization
noise. The theoretical signal to (noise + distortion) ratio for an
ideal N-bit converter with a sine wave input is given by:
Full Power Bandwidth
The Full Power Bandwidth (FPBW) of the AD7856 is that
frequency at which the amplitude of the reconstructed (using
FFTs) fundamental (neglecting harmonics and SNR) is reduced
by 3 dB for a full-scale input.
Signal to (Noise + Distortion) = (6.02 N + 1.76) dB
Thus for a 14-bit converter, this is 86 dB.
NOTE
1AIN(+) refers to the positive input of the pseudo-differential pair, and AIN(–)
refers to the negative analog input of the pseudo-differential pair or to AGND
depending on the channel configuration.
–8–
REV. A
AD7856
ON-CHIP REGISTERS
The AD7856 powers up with a set of default conditions. The only writing that is required is to select the channel configuration.
Without performing any other write operations the AD7856 still retains the flexibility for performing a full power-down, and a full
self-calibration.
Extra features and flexibility such as performing different power-down options, different types of calibrations including system cali-
bration, and software conversion start can be selected by further writing to the part.
The AD7856 contains a Control Register, ADC Output Data Register, Status Register, Test Register and ten Calibration
Registers. The control register is write only, the ADC output data register and the status register are read only, and the test and
calibration registers are both read/write registers. The Test Register is used for testing the part and should not be written to.
Addressing the On-Chip Registers
Writing
A write operation to the AD7856 consists of 16 bits. The two MSBs, ADDR0 and ADDR1, are decoded to determine which register
is addressed, and the subsequent 14 bits of data are written to the addressed register. It is not until all 16 bits are written that the
data is latched into the addressed registers. Table I shows the decoding of the address bits while Figure 4 shows the overall write
register hierarchy.
Table I. Write Register Addressing
ADDR1
ADDR0
Comment
0
0
0
1
This combination does not address any register so the subsequent 14 data bits are ignored.
This combination addresses the TEST REGISTER. The subsequent 14 data bits are written to the
test register.
1
1
0
1
This combination addresses the CALIBRATION REGISTERS. The subsequent 14 data bits are
written to the selected calibration register.
This combination addresses the CONTROL REGISTER. The subsequent 14 data bits are written
to the control register.
Reading
To read from the various registers the user must first write to Bits 6 and 7 in the Control Register, RDSLT0 and RDSLT1. These
bits are decoded to determine which register is addressed during a read operation. Table II shows the decoding of the read address
bits while Figure 5 shows the overall read register hierarchy. The power-up status of these bits is 00 so that the default read will be
from the ADC output data register.
Once the read selection bits are set in the Control Register, all subsequent read operations that follow will be from the selected regis-
ter until the read selection bits are changed in the Control Register.
Table II. Read Register Addressing
RDSLT1
RDSLT0
Comment
0
0
All successive read operations will be from ADC OUTPUT DATA REGISTER. This is the power-
up default setting. There will always be two leading zeros when reading from the ADC Output Data
Register.
0
1
1
1
0
1
All successive read operations will be from TEST REGISTER.
All successive read operations will be from CALIBRATION REGISTERS.
All successive read operations will be from STATUS REGISTER.
ADDR1, ADDR0
RDSLT1, RDSLT0
DECODE
DECODE
01
10
11
00
01
TEST
REGISTER
10
11
TEST
REGISTER
CALIBRATION
REGISTERS
CONTROL
REGISTER
ADC OUTPUT
DATA REGISTER
CALIBRATION
REGISTERS
STATUS
REGISTER
GAIN(1)
OFFSET(1)
DAC(8)
GAIN(1)
OFFSET(1)
DAC(8)
GAIN(1)
OFFSET(1)
GAIN(1)
OFFSET(1)
GAIN(1)
11
OFFSET(1)
10
OFFSET(1)
10
GAIN(1)
11
00
01
00
01
CALSLT1, CALSLT0
DECODE
CALSLT1, CALSLT0
DECODE
Figure 4. Write Register Hierarchy/Address Decoding
REV. A
Figure 5. Read Register Hierarchy/Address Decoding
–9–
AD7856
CONTROL REGISTER
The arrangement of the Control Register is shown below. The control register is a write only register and contains 14 bits of data.
The control register is selected by putting two 1s in ADDR1 and ADDR0. The function of the bits in the control register are de-
scribed below. The power-up status of all bits is 0.
MSB
SGL/DIFF
CH2
CH1
CH0
PMGT1
PMGT0
RDSLT1
STCAL
RDSLT0
2/3 MODE
CONVST
CALMD
CALSLT1
CALSLT0
LSB
CONTROL REGISTER BIT FUNCTION DESCRIPTION
Comment
Bit
Mnemonic
13
SGL/DIFF
A 0 in this bit position configures the input channels in pseudo-differential mode. A 1 in this bit position
configures the input channels in single-ended mode (see Table III).
12
11
10
CH2
CH1
CH0
These three bits are used to select the channel on which the conversion is performed. The channels can
be configured as eight single-ended channels or four pseudo-differential channels. The default selection
is AIN1 for the positive input and AIN2 for the negative input (see Table III for channel selection).
9
8
PMGT1
PMGT0
Power Management Bits. These two bits are used with the SLEEP pin for putting the part into various
power-down modes (see Power-Down section for more details).
7
6
5
RDSLT1
RDSLT0
2/3 MODE
These two bits determine which register is addressed for the read operations (see Table II).
Interface Mode Select Bit. With this bit set to 0, Interface Mode 2 is enabled. With this bit set to 1,
Interface Mode 1 is enabled where DIN is used as an output as well as an input. This bit is set to 0 by
default after every read cycle; thus when using the Two-Wire Interface Mode, this bit needs to be set to
1 in every write cycle.
4
3
CONVST
CALMD
Conversion Start Bit. A logic one in this bit position starts a single conversion, and this bit is automatically
reset to 0 at the end of conversion. This bit may also used in conjunction with system calibration (see
Calibration section.)
Calibration Mode Bit. A 0 here selects self-calibration, and a 1 selects a system calibration (see Table IV).
2
1
0
CALSLT1
CALSLT0
STCAL
Calibration Selection Bits and Start Calibration Bit. These bits have two functions.
With the STCAL bit set to 1 the CALSLT1 and CALSLT0 bits determine the type of calibration per-
formed by the part (see Table IV). The STCAL bit is automatically reset to 0 at the end of calibration.
With the STCAL bit set to 0 the CALSLT1 and CALSLT0 bits are decoded to address the calibration
register for read/write of calibration coefficients (see section on the Calibration Registers for more details).
–10–
REV. A
AD7856
Table III. Channel Selection
SGL/DIFF
CH2
CH1
CH0
AIN(+)*
AIN(–)*
0
0
0
0
0
0
0
0
0
0
1
1
0
1
0
1
AIN1
AIN3
AIN5
AIN7
AIN2
AIN4
AIN6
AIN8
0
0
0
0
1
1
1
1
0
0
1
1
0
1
0
1
AIN2
AIN4
AIN6
AIN8
AIN1
AIN3
AIN5
AIN7
1
1
1
1
0
0
0
0
0
0
1
1
0
1
0
1
AIN1
AIN3
AIN5
AIN7
AGND
AGND
AGND
AGND
1
1
1
1
1
1
1
1
0
0
1
1
0
1
0
1
AIN2
AIN4
AIN6
AIN8
AGND
AGND
AGND
AGND
*AIN(+) refers to the positive input seen by the AD7856 sample and hold circuit.
AIN(–) refers to the negative input seen by the AD7856 sample and hold circuit.
Table IV. Calibration Selection
CALMD
CALSLT1
CALSLT0
Calibration Type
0
0
0
A Full Internal Calibration is initiated where the Internal DAC is calibrated
followed by the Internal Gain Error, and finally the Internal Offset Error is
calibrated out. This is the default setting.
0
0
1
Here the Internal Gain Error is calibrated out followed by the Internal Offset
Error calibrated out.
0
0
1
1
1
0
0
1
0
This calibrates out the Internal Offset Error only.
This calibrates out the Internal Gain Error only.
A Full System Calibration is initiated here where first the Internal DAC is
calibrated followed by the System Gain Error, and finally the System Offset
Error is calibrated out.
1
0
1
Here the System Gain Error is calibrated out followed by the System Offset
Error.
1
1
1
1
0
1
This calibrates out the System Offset Error only.
This calibrates out the System Gain Error only.
REV. A
–11–
AD7856
STATUS REGISTER
The arrangement of the Status Register is shown below. The status register is a read only register and contains 16 bits of data. The
status register is selected by first writing to the control register and putting two 1s in RDSLT1 and RDSLT0. The function of the
bits in the status register are described below. The power-up status of all bits is 0.
START
WRITE TO CONTROL REGISTER
SETTING RDSLT0 = RDSLT1 = 1
READ STATUS REGISTER
Figure 6. Flowchart for Reading the Status Register
MSB
ZERO
BUSY
SGL/DIFF
CH2
CH1
CH0
PMGT1
PMGT0
STCAL
RDSLT1
RDSLT0
2/3 MODE
X
CALMD
CALSLT1
CALSLT0
LSB
STATUS REGISTER BIT FUNCTION DESCRIPTION
Bit
Mnemonic
Comment
This bit is always 0.
15
14
ZERO
BUSY
Conversion/Calibration Busy Bit. When this bit is 1 it indicates that there is a conversion or
calibration in progress. When this bit is 0, there is no conversion or calibration in progress.
13
12
11
10
SGL/DIFF
CH2
CH1
These four bits indicate the channel which is selected for conversion (see Table III).
CH0
9
8
PMGT1
PMGT0
Power management bits. These bits, along with the SLEEP pin, will indicate if the part is in a
power-down mode or not. See Table VI for description.
7
6
RDSLT1
RDSLT0
Both of these bits are always 1, indicating it is the status register which is being read (see Table II).
5
2/3 MODE
Interface Mode Select Bit. With this bit at 0, the device is in Interface Mode 2. With this bit at 1,
the device is in Interface Mode 1. This bit is reset to 0 after every read cycle.
4
3
X
Don’t care bit.
CALMD
Calibration Mode Bit. A 0 in this bit indicates a self calibration is selected, and a 1 in this bit
indicates a system calibration is selected (see Table IV).
2
1
0
CALSLT1
CALSLT0
STCAL
Calibration Selection Bits and Start Calibration Bit. The STCAL bit is read as a 1 if a
calibration is in progress and as a 0 if there is no calibration in progress. The CALSLT1 and
CALSLT0 bits indicate which of the calibration registers are addressed for reading and writing
(see section on the Calibration Registers for more details).
–12–
REV. A
AD7856
CALIBRATION REGISTERS
CALIBRATION REGISTERS
CAL REGISTER
ADDRESS POINTER
The AD7856 has ten calibration registers in all, eight for the
DAC, one for the offset and one for gain. Data can be written
to or read from all ten calibration registers. In self- and system
calibration the part automatically modifies the calibration regis-
ters; only if the user needs to modify the calibration registers
should an attempt be made to read from and write to the cali-
bration registers.
(1)
(2)
(3)
GAIN REGISTER
OFFSET REGISTER
DAC 1ST MSB REGISTER
CALIBRATION REGISTER
ADDRESS POINTER
POSITION IS DETERMINED
BY THE NUMBER OF
CALIBRATION REGISTERS
ADDRESSED AND THE
NUMBER OF READ/WRITE
OPERATIONS
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
Addressing the Calibration Registers
The calibration selection bits in the control register CALSLT1
and CALSLT0 determine which of the calibration registers are
addressed (see Table V). The addressing applies to both the
read and write operations for the calibration registers. The user
should not attempt to read from and write to the calibration
registers at the same time.
DAC 8TH MSB REGISTER
(10)
Figure 7. Calibration Register Arrangements
When reading from the calibration registers there will always be
two leading zeros for each of the registers. When operating in
Serial Interface Mode 1 the read operations to the calibration
registers cannot be aborted. The full number of read operations
must be completed (see section on Serial Interface Mode 1
Timing for more detail).
Table V. Calibration Register Addressing
CALSLT1 CALSLT0 Comment
0
0
1
1
0
1
0
1
This combination addresses the
Gain (1), Offset (1) and DAC Reg-
isters (8). Ten registers in total.
This combination addresses the
Gain (1) and Offset (1) Registers.
Two registers in total.
This combination addresses the
Offset Register. One register in
total.
START
WRITE TO CONTROL REGISTER SETTING STCAL = 0
AND CALSLT1, CALSLT0 = 00, 01, 10, 11
CAL REGISTER POINTER IS
AUTOMATICALLY RESET
WRITE TO CAL REGISTER
(ADDR1 = 1, ADDR0 = 0)
This combination addresses the
Gain Register. One register in total.
CAL REGISTER POINTER IS
AUTOMATICALLY INCREMENTED
Writing to/Reading from the Calibration Registers
For writing to the calibration registers a write to the control
register is required to set the CALSLT0 and CALSLT1 bits.
For reading from the calibration registers a write to the control
register is required to set the CALSLT0 and CALSLT1 bits,
but also to set the RDSLT1 and RDSLT0 bits to 10 (this ad-
dresses the calibration registers for reading). The calibration
register pointer is reset upon writing to the control register
setting the CALSLT1 and CALSLT0 bits, or upon completion
of all the calibration register write/read operations. When reset,
it points to the first calibration register in the selected write/
read sequence. The calibration register pointer will point to the
gain calibration register upon reset in all but one case, this case
being where the offset calibration register is selected on its own
(CALSLT1 = 1, CALSLT0 = 0). Where more than one cali-
bration register is being accessed the calibration register pointer
will be automatically incremented after each calibration register
write/read operation. The order in which the ten calibration
registers are arranged is shown in Figure 7. The user may abort
at any time before all the calibration register write/read opera-
tions are completed, and the next control register write opera-
tion will reset the calibration register pointer. The flowchart in
Figure 8 shows the sequence for writing to the calibration regis-
ters and Figure 9 for reading.
LAST
REGISTER
WRITE
OPERATION
OR
ABORT
?
NO
YES
FINISHED
Figure 8. Flowchart for Writing to the Calibration
Registers
REV. A
–13–
AD7856
of the 14 data bits in the offset register is binary weighted: the
MSB has a weighting of 5% of the reference voltage, the MSB-1
has a weighting of 2.5%, the MSB-2 has a weighting of 1.25%,
and so on down to the LSB, which has a weighting of 0.0006%.
START
WRITE TO CONTROL REGISTER SETTING STCAL = 0, RDSLT1 = 1,
RDSLT0 = 0, AND CALSLT1, CALSLT0 = 00, 01, 10, 11
This gives a resolution of approximately ±0.0006% of VREF
.
More accurately the resolution is ±(0.05 × VREF )/213 volts =
±0.015 mV, with a 2.5 V reference. The maximum specified
offset that can be compensated for is ±3.75% of the reference
voltage but is typically ±5%, which equates to ±125 mV with a
2.5 V reference and ±250 mV with a 5 V reference.
CAL REGISTER POINTER IS
AUTOMATICALLY RESET
READ CAL REGISTER
Q. If a +20 mV offset is present in the analog input signal and the
reference voltage is 2.5 V, what code needs to be written to the
offset register to compensate for the offset?
CAL REGISTER POINTER IS
AUTOMATICALLY INCREMENTED
A. 2.5 V reference implies that the resolution in the offset regis-
ter is 5% × 2.5 V/213 = 0.015 mV. +20 mV/0.015 mV =
1310.72; rounding to the nearest number gives 1311. In
binary terms this is 0101 0001 1111. Therefore, decrease the
offset register by 0101 0001 1111.
LAST
REGISTER
READ
OPERATION
OR
ABORT
?
NO
This method of compensating for offset in the analog input
signal allows for fine tuning the offset compensation. If the
offset on the analog input signal is known, there will be no need
to apply the offset voltage to the analog input pins and do a
system calibration. The offset compensation can take place in
software.
YES
FINISHED
Figure 9. Flowchart for Reading from the Calibration
Registers
Adjusting the Gain Calibration Register
Adjusting the Offset Calibration Register
The gain calibration register contains 16 bits, two leading 0s
and 14 data bits. The data bits are binary weighted as in the
offset calibration register. The gain register value is effectively
multiplied by the analog input to scale the conversion result
over the full range. Increasing the gain register compensates for
a smaller analog input range and decreasing the gain register
compensates for a larger input range. The maximum analog
input range for which the gain register can compensate is
1.01875 times the reference voltage; the minimum input range
is 0.98125 times the reference voltage.
The offset calibration register contains 16 bits, two leading zeros
and 14 data bits. By changing the contents of the offset register
different amounts of offset on the analog input signal can be
compensated for. Increasing the number in the offset calibration
register compensates for negative offset on the analog input
signal, and decreasing the number in the offset calibration regis-
ter compensates for positive offset on the analog input signal.
The default value of the offset calibration register is approxi-
mately 0010 0000 0000 0000. This is not an exact value, but
the value in the offset register should be close to this value. Each
–14–
REV. A
AD7856
CIRCUIT INFORMATION
this CLKIN falling edge. If the 10 ns setup time is not met, the
conversion will take 21 CLKIN periods. The maximum speci-
fied conversion time is 3.5 µs (6 MHz) 5.25 µs (4 MHz) for the
AD7856. When a conversion is completed, the BUSY output
goes low, and then the result of the conversion can be read by
accessing the data through the serial interface. To obtain opti-
mum performance from the part, the read operation should not
occur during the conversion or 500 ns prior to the next CONVST
rising edge. However, the maximum throughput rates are achieved
by reading/writing during conversion, and reading/writing during
conversion is likely to degrade the Signal to (Noise + Distor-
tion) by only 0.5 dBs. The AD7856 can operate at throughput
rates up to 285 kHz. For the AD7856 a conversion takes 21
CLKIN periods; two CLKIN periods are needed for the acqui-
sition time, giving a full cycle time of 3.66 µs (= 260 kHz, CLKIN
= 6 MHz). When using the software conversion start for maximum
throughput the user must ensure the control register write op-
eration extends beyond the falling edge of BUSY. The falling
edge of BUSY resets the CONVST bit to 0 and allows it to be
reprogrammed to 1 to start the next conversion.
The AD7856 is a fast, 14-bit single supply A/D converter. The
part requires an external 6 MHz/4 MHz master clock (CLKIN),
two CREF capacitors, a CONVST signal to start conversion and
power supply decoupling capacitors. The part provides the user
with track/hold, on-chip reference, calibration features, A/D
converter and serial interface logic functions on a single chip.
The A/D converter section of the AD7856 consists of a conven-
tional successive-approximation converter based around a ca-
pacitor DAC. The AD7856 accepts an analog input range of 0
to +VDD where the reference can be tied to VDD. The reference
input to the part is buffered on-chip.
A major advantage of the AD7856 is that a conversion can be
initiated in software as well as applying a signal to the CONVST
pin. Another innovative feature of the AD7856 is self-calibration
on power-up, which is initiated having a 0.01 µF capacitor from
the CAL pin to DGND, to give superior dc accuracy. The part
should be allowed 150 ms after power up to perform this auto-
matic calibration before any reading or writing takes place. The
part is available in a 24-pin SSOP package and this offers the
user considerable spacing saving advantages over alternative
solutions.
TYPICAL CONNECTION DIAGRAM
Figure 10 shows a typical connection diagram for the AD7856.
The AGND and DGND pins are connected together at the
device for good noise suppression. The CAL pin has a 0.01 µF
capacitor to enable an automatic self-calibration on power-up.
The conversion result is output in a 16-bit word with two lead-
ing zeros followed by the MSB of the 14-bit result. Note that
after the AVDD and DVDD power-up the part will require 150 ms
for the internal reference to settle and for the automatic calibra-
tion on power-up to be completed.
CONVERTER DETAILS
The master clock for the part must be applied to the CLKIN
pin. Conversion is initiated on the AD7856 by pulsing the
CONVST input or by writing to the control register and setting
the CONVST bit to 1. On the rising edge of CONVST (or at
the end of the control register write operation), the on-chip
track/hold goes from track to hold mode. The falling edge of the
CLKIN signal that follows the rising edge of the CONVST
signal initiates the conversion, provided the rising edge of
CONVST occurs at least 10 ns typically before this CLKIN
edge. The conversion cycle will take 20 CLKIN periods from
For applications where power consumption is a major concern
the SLEEP pin can be connected to DGND. See Power-Down
section for more detail on low power applications.
6MHz/4MHz OSCILLATOR
285kHz/148kHz PULSE GENERATOR
ANALOG
SUPPLY
+5V
MASTER CLOCK
INPUT
0.1F
10F
0.1F
CONVERSION
START INPUT
AV
DV
DD
DD
OSCILLOSCOPE
CLKIN
SCLK
0V TO 4.096V
INPUT
AIN(+)
CH1
AIN(–)
SERIAL CLOCK
INPUT
C
C
REF1
CH2
CH3
CONVST
SYNC
470nF
0.1F
0.01F
DV
AD7856
REF2
FRAME SYNC INPUT
SERIAL DATA INPUT
CH4
CH5
SLEEP
CAL
DIN
DD
0.01F
DOUT
SERIAL DATA
OUTPUT
AGND
DGND
AUTO CAL ON
POWER-UP
REFIN/REFOUT
INTERNAL/
2 LEADING
ZEROS FOR
ADC DATA
DATA GENERATOR
EXTERNAL
0.1F
REFERENCE
OPTIONAL
EXTERNAL
REFERENCE
AD780/
REF-198
PULSE GENERATOR
Figure 10. Typical Circuit
–15–
REV. A
AD7856
distortion (THD) that can be tolerated. The THD will increase
as the source impedance increases and performance will de-
grade. Figure 12 shows a graph of the total harmonic distortion
versus analog input signal frequency for different source imped-
ances. With the setup as in Figure 13, the THD is at the –90 dB
level. With a source impedance of 1 kΩ and no capacitor on the
AIN(+) pin, the THD increases with frequency.
ANALOG INPUT
The equivalent circuit of the analog input section is shown in
Figure 11. During the acquisition interval the switches are both
in the track position and the AIN(+) charges the 20 pF capaci-
tor through the 125 Ω resistance. On the rising edge of CONVST
switches SW1 and SW2 go into the hold position retaining
charge on the 20 pF capacitor as a sample of the signal on
AIN(+). The AIN(–) is connected to the 20 pF capacitor, and
this unbalances the voltage at node A at the input of the com-
parator. The capacitor DAC adjusts during the remainder of the
conversion cycle to restore the voltage at node A to the correct
value. This action transfers a charge, representing the analog
input signal, to the capacitor DAC which in turn forms a digital
representation of the analog input signal. The voltage on the
AIN(–) pin directly influences the charge transferred to the
capacitor DAC at the hold instant. If this voltage changes dur-
ing the conversion period, the DAC representation of the analog
input voltage will be altered. Therefore it is most important that
the voltage on the AIN(–) pin remains constant during the con-
version period. Furthermore, it is recommended that the AIN(–)
pin is always connected to AGND or to a fixed dc voltage.
–50
THD VS. FREQUENCY FOR DIFFERENT
SOURCE IMPEDANCES
–60
–70
R
= 560⍀
IN
–80
–90
R
= 10⍀, 10nF
IN
AS IN FIGURE 13
–100
–110
1
10
20
50
80
100
120
140
166
INPUT FREQUENCY – kHz
TRACK
125⍀
125⍀
AIN(+)
AIN(–)
CAPACITOR
DAC
Figure 12. THD vs. Analog Input Frequency
SW1
20pF
HOLD
In a single supply application (5 V), the V+ and V– of the op
amp can be taken directly from the supplies to the AD7856
which eliminates the need for extra external power supplies.
When operating with rail-to-rail inputs and outputs, at frequen-
cies greater than 10 kHz care must be taken in selecting the
particular op amp for the application. In particular for single
supply applications the input amplifiers should be connected in
a gain of –1 arrangement to get the optimum performance.
Figure 13 shows the arrangement for a single supply application
with a 50 Ω and 10 nF low-pass filter (cutoff frequency 320 kHz)
on the AIN(+) pin. Note that the 10 nF is a capacitor with good
linearity to ensure good ac performance. Recommended single
supply op amp is the AD820.
NODE A
SW2
COMPARATOR
TRACK
HOLD
C
REF2
Figure 11. Analog Input Equivalent Circuit
Acquisition Time
The track and hold amplifier enters its tracking mode on the
falling edge of the BUSY signal. The time required for the track
and hold amplifier to acquire an input signal will depend on
how quickly the 20 pF input capacitance is charged. The acqui-
sition time is calculated using the formula:
t
ACQ = 10 × (RIN + 125 Ω) × 20 pF
+5V
0.1F
10F
10k⍀
where RIN is the source impedance of the input signal, and
125 Ω, 20 pF is the input RC.
10k⍀
10k⍀
V
IN
V+
IC1
V–
TO AIN(+)
OF
AD7856
DC/AC Applications
50⍀
(0 TO V
)
REF
For dc applications high source impedances are acceptable
provided there is enough acquisition time between conversions
to charge the 20 pF capacitor. The acquisition time can be
calculated from the above formula for different source imped-
ances. For example, with RIN = 5 kΩ the required acquisition
time will be 1025 ns.
V
REF
10nF
(NPO)
10k⍀
AD820
Figure 13. Analog Input Buffering
Input Range
The analog input range for the AD7856 is 0 V to VREF. The
AIN(–) pin on the AD7856 can be biased up above AGND, if
required. The advantage of biasing the lower end of the analog
input range away from AGND is that the user does not need to
have the analog input swing all the way down to AGND. This
has the advantage in true single supply applications that the
input amplifier does not need to swing all the way down to
AGND. The upper end of the analog input range is shifted up
by the same amount. Care must be taken so that the bias ap-
plied does not shift the upper end of the analog input above the
AVDD supply. In the case where the reference is the supply,
AVDD, the AIN(–) must be tied to AGND.
For ac applications, removing high frequency components from
the analog input signal is recommended by use of an RC low-
pass filter on the AIN(+) pin as shown in Figure 13. In applica-
tions where harmonic distortion and signal-to-noise ratio are
critical, the analog input should be driven from a low impedance
source. Large source impedances will significantly affect the ac
performance of the ADC. This may necessitate the use of an
input buffer amplifier. The choice of the op amp will be a func-
tion of the particular application.
When no amplifier is used to drive the analog input the source
impedance should be limited to low values. The maximum
source impedance will depend on the amount of total harmonic
–16–
REV. A
AD7856
10⍀
ANALOG
SUPPLY
+5V
10F
0.01F
0.1F
TRACK AND HOLD
AMPLIFIER
AIN(+)
AIN(–)
V
= 0 TO V
REF
STRAIGHT
BINARY
FORMAT
IN
DOUT
AV
DV
DD
DD
C
REF1
470nF
0.1F
AD7856
AD7856
C
REF2
0.01F
Figure 14. 0 to VREF Input Configuration
REF /REF
IN
OUT
0.1F
Transfer Function
For the AD7856 input range the designed code transitions occur
midway between successive integer LSB values (i.e., 1/2 LSB,
3/2 LSBs, 5/2 LSBs . . . FS – 3/2 LSBs). The output coding
is straight binary, with 1 LSB = FS/16384 = 4.096 V/16384 =
0.25 mV when VREF = 4.096 V. The ideal input/output transfer
characteristic is shown in Figure 15.
Figure 16. Relevant Connections When Using Internal
Reference
The other option is that the REFIN/REFOUT pin be overdriven
by connecting it to an external reference. This is possible due to
the series resistance from the REFIN/REFOUT pin to the internal
reference. This external reference can have a range that includes
AVDD. When using AVDD as the reference source or when an
externally applied reference approaches AVDD, the 100 nF ca-
pacitor from the REFIN/REFOUT pin to AGND should be as
close as possible to the REFIN/REFOUT pin, and also the CREF1
pin should be connected to AVDD to keep this pin at the same
level as the reference. The connections for this arrangement are
shown in Figure 17. When using AVDD it may be necessary to
add a resistor in series with the AVDD supply. This will have the
effect of filtering the noise associated with the AVDD supply.
OUTPUT
CODE
111...111
111...110
111...101
111...100
FS
16384
000...011
1LSB =
ANALOG
SUPPLY
+5V
10⍀
000...010
0.1F
0.01F
10F
000...001
000...000
0V 1LSB
+FS –1LSB
AV
DV
DD
DD
V
= (AIN(+) – AIN(–)), INPUT VOLTAGE
IN
C
REF1
0.1F
470nF
Figure 15. Transfer Characteristic
REFERENCE SECTION
AD7856
10⍀
C
REF2
0.01F
For specified performance, it is recommended that when using
an external reference this reference should be between 4 V and
the analog supply AVDD. The connections for the relevant refer-
ence pins are shown in the typical connection diagrams. If the
internal reference is being used, the REFIN/REFOUT pin should
have a 100 nF capacitor connected to AGND very close to the
REFIN/REFOUT pin. These connections are shown in Figure 16.
REF /REF
IN
OUT
0.1F
Figure 17. Relevant Connections When Using AVDD as the
Reference
If the internal reference is required for use external to the ADC,
it should be buffered at the REFIN/REFOUT pin and a 100 nF
capacitor connected from this pin to AGND. The typical noise
performance for the internal reference, with 5 V supplies is
150 nV/√Hz @ 1 kHz and dc noise is 100 µV p-p.
REV. A
–17–
AD7856
–72
–74
–76
–78
–80
–82
–84
PERFORMANCE CURVES
AV = DV = 5.0V
The following performance curves apply to Mode 2 operation
only. If a conversion is initiated in software, then a slight degra-
dation in SNR can be expected when in Mode 2 operation. As
the sampling instant cannot be guaranteed internally, nonequi-
distant sampling will occur, resulting in a rise in the noise floor.
Initiating conversions in software is not recommended for Mode
1 operation.
DD
DD
100mV p-p SINEWAVE ON AV
DD
REF = 4.098 EXT REFERENCE
IN
Figure 18 shows a typical FFT plot for the AD7856 at 190 kHz
sample rate and 10 kHz input frequency.
–86
–88
–90
4096 POINT FFT
–15
F
F
= 190.476 kHz
SAMPLE
0.91
13.4
25.7
38.3
50.3
63.5
74.8
87.4
100
= 10.091 kHz
IN
INPUT FREQUENCY – kHz
SNR = 79.2dB
–35
–55
–75
Figure 20. PSRR vs. Frequency
POWER-DOWN OPTIONS
The AD7856 provides flexible power management to allow the
user to achieve the best power performance for a given through-
put rate. The power management options are selected by
programming the power management bits, PMGT1 and PMGT0,
in the control register and by use of the SLEEP pin. Table VI
summarizes the power-down options that are available and how
they can be selected by using either software, hardware or a
combination of both. The AD7856 can be fully or partially
powered down. When fully powered down, all the on-chip cir-
cuitry is powered down and IDD is 1 µA typ. If a partial power-
down is selected, then all the on-chip circuitry except the reference
is powered down and IDD is 400 µA typ. The choice of full or par-
tial power-down does not give any significant improvement in
throughput with a power-down between conversions. This is
discussed in the next section–Power-Up Times. However, a
partial power-down does allow the on-chip reference to be used
externally even though the rest of the AD7856 circuitry is pow-
ered down. It also allows the AD7856 to be powered up faster
after a long power-down period when using the on-chip refer-
ence (See Power-Up Times–Using On-Chip Reference).
–95
–115
0
10
20
30
40
50
60
70
80
90
FREQUENCY –kHz
Figure 18. FFT Plot
Figure 19 shows the SNR vs. Frequency for 5 V supply and a
4.096 external reference (5 V reference is typically 1 dB better
performance).
79
78
77
76
75
When using the SLEEP pin, the power management bits PMGT1
and PMGT0 should be set to zero (default status on power-up).
Bringing the SLEEP pin logic high ensures normal operation,
and the part does not power down at any stage. This may be
necessary if the part is being used at high throughput rates when
it is not possible to power down between conversions. If the user
wishes to power down between conversions at lower throughput
rates (i.e. <100 kSPS for the AD7856) to achieve better power
performances, then the SLEEP pin should be tied logic low.
0
10
20
50
80
100
120
140
166
INPUT FREQUENCY – kHz
Figure 19. SNR vs. Frequency
If the power-down options are to be selected in software only,
then the SLEEP pin should be tied logic high. By setting the
power management bits PMGT1 and PMGT0 as shown in
Table VI, a Full Power-Down, Full Power-Up, Full Power-
Down Between Conversions, and a Partial Power-Down Be-
tween Conversions can be selected.
Figure 20 shows the Power Supply Rejection Ratio versus Fre-
quency for the part. The Power Supply Rejection Ratio is de-
fined as the ratio of the power in ADC output at frequency f to
the power of a full-scale sine wave.
PSRR (dB) = 10 log (Pf/Pfs)
Pf = Power at frequency f in ADC output, Pfs = power of a
full-scale sine wave. Here a 100 mV peak-to-peak sine wave is
coupled onto the AVDD supply while the digital supply is left
unaltered.
–18–
REV. A
AD7856
A combination of hardware and software selection can also be
used to achieve the desired effect.
POWER-UP TIMES
Using an External Reference
When the AD7856 is powered up, the part is powered up from
one of two conditions. First, when the power supplies are ini-
tially powered up and, secondly, when the part is powered up
from either a hardware or software power-down (see last section).
Table VI. Power Management Options
PMGT1
Bit
PMGT0
Bit
SLEEP
Pin
Comment
When AVDD and DVDD are powered up, the AD7856 should be
left idle for approximately 42 ms (6 MHz CLK) to allow for the
autocalibration if a 10 nF cap is placed on the CAL pin, (see
Calibration section). During power-up the functionality of the
SLEEP pin is disabled, i.e., the part will not power down until
the end of the calibration if SLEEP is tied logic low. The auto-
calibration on power-up can be disabled if the CAL pin is tied to
a logic high. If the autocalibration is disabled, then the user must
take into account the time required by the AD7856 to power-up
before a self-calibration is carried out. This power-up time is the
time taken for the AD7856 to power up when power is first
applied (300 µs) typ) or the time it takes the external reference
to settle to the 14-bit level–whichever is the longer.
0
0
0
Full Power-Down Between
Conversions (HW/SW)
Full Power-Up (HW/SW)
Normal Operation
(Independent of the SLEEP
Pin)
Full Power-Down (SW)
Partial Power-Down Between
Conversions
0
0
0
1
1
X
1
1
0
1
X
X
NOTE
HW = Hardware Selection; SW = Software Selection.
4/6MHz OSCILLATOR
CURRENT, I = 12mA TYP
MASTER CLOCK
100kHz PULSE GENERATOR
INPUT
ANALOG
SUPPLY
+5V
0.1F
10F
0.1F
CONVERSION
START INPUT
AV
DV
DD
DD
CLKIN
0V TO 2.5V
INPUT
AIN(+)
AIN(–)
SCLK
SERIAL CLOCK
INPUT
C
C
REF1
AUTO POWER
DOWN AFTER
CONVERSION
CONVST
0.1F
0.01F
AD7856
LOW POWER
C/P
REF2
SYNC
SLEEP
CAL
DOUT
DIN
SERIAL DATA OUTPUT
SERIAL DATA INPUT
0.01F
AGND
DGND
AUTO CAL ON
POWER-UP
REF /REF
IN
OUT
INTERNAL
REFERENCE
0.1F
OPTIONAL
EXTERNAL
REFERENCE
REF-192
Figure 21. Typical Low Power Circuit
REV. A
–19–
AD7856
The AD7856 powers up from a full hardware or software
power-down in 5 µs typ. This limits the throughput which the
part is capable of to 93 kSPS for the K grade and 113 kSPS for
the A grade when powering down between conversions. Figure
22 shows how power-down between conversions is implemented
using the CONVST pin. The user first selects the power-down
between conversions option by using the SLEEP pin and the
power management bits, PMGT1 and PMGT0, in the control
register, (see last section). In this mode the AD7856 automati-
cally enters a full power-down at the end of a conversion, i.e.,
when BUSY goes low. The falling edge of the next CONVST
pulse causes the part to power up. Assuming the external refer-
ence is left powered up, the AD7856 should be ready for normal
operation 5 µs after this falling edge. The rising edge of CONVST
initiates a conversion so the CONVST pulse should be at least
5 µs wide. The part automatically powers down on completion
of the conversion.
internal switch opens to provide a high impedance discharge
path for the reference capacitor during power-down—see Figure
23. An added advantage of the low charge leakage from the
reference capacitor during power-down is that even though the
reference is being powered down between conversions, the
reference capacitor holds the reference voltage to within
0.5 LSBs with throughput rates of 100 samples/second and over
with a full power-down between conversions. A high input im-
pedance op amp like the AD707 should be used to buffer this
reference capacitor if it is being used externally. Note, if the
AD7856 is left in its power-down state for more than 100 ms,
the charge on CREF will start to leak away and the power-up
time will increase. If this long power-up time is a problem, the
user can use a partial power-down for the last conversion so the
reference remains powered up.
SWITCH OPENS
DURING POWER-DOWN
AD7856
START CONVERSION ON RISING EDGE
POWER-UP ON FALLING EDGE
REF /REF
IN
OUT
ON-CHIP
REFERENCE
EXTERNAL
CAPACITOR
5s
3.5s
TO OTHER
CIRCUITRY
CONVST
BUF
t
CONVERT
BUSY
Figure 23. On-Chip Reference During Power-Down
POWER-UP
TIME
NORMAL
OPERATION POWER-DOWN
FULL
POWER-UP
TIME
POWER VS. THROUGHPUT RATE
Figure 22. Power-Up Timing When Using CONVST Pin
The main advantage of a full power-down after a conversion is
that it significantly reduces the power consumption of the part
at lower throughput rates. When using this mode of operation
the AD7856 is only powered up for the duration of the conver-
sion. If the power-up time of the AD7856 is taken to be 5 µs
and it is assumed that the current during power up is 12 mA
typ, then power consumption as a function of throughput can
easily be calculated. The AD7856 has a conversion time of
3.5 µs with a 6 MHz external clock. This means the AD7856
consumes 12 mA typ, (or 60 mW typ VDD = 5 V) for 8.5 µs in
every conversion cycle if the device is powered down at the end
of a conversion. If the throughput rate is 1 kSPS, the cycle time
is 1000 µs and the average power dissipated during each cycle is
(8.5/1000) × (60 mW) = 510 µW. The graph, Figure 24, shows
the power consumption of the AD7856 as a function of through-
put. Table VII lists the power consumption for various through-
put rates.
NOTE: Where the software CONVST is used, the part must be
powered up in software with an extra write setting PMGT1 = 0
and PMGT0 = 1 before a conversion is initiated in the next
write. Automatic partial power-down after a calibration is not
possible; the part must be powered down manually. If software
calibrations are to be used when operating in the partial power-
down mode, then three separate writes are required. The first
initiates the type of calibration required, the second write pow-
ers the part down into partial power-down mode, while the third
write powers the part up again before the next calibration com-
mand is issued.
Using the Internal (On-Chip) Reference
As in the case of an external reference, the AD7856 can power-
up from one of two conditions, power-up after the supplies are
connected or power-up from hardware/software power-down.
When using the on-chip reference and powering up when AVDD
and DVDD are first connected, it is recommended that the power-
up calibration mode be disabled as explained above. When using
the on-chip reference, the power-up time is effectively the time
it takes to charge up the external capacitor on the REFIN/REFOUT
pin. This time is given by the equation:
Table VII. Power Consumption vs. Throughput
Throughput Rate
Power
1 kSPS
510 µW
10 kSPS
5.1 mW
t
UP = 10 × R × C
where R 150 kΩ and C = external capacitor.
The recommended value of the external capacitor is 100 nF;
this gives a power-up time of approximately 150 ms before a
calibration is initiated and normal operation should commence.
When CREF is fully charged, the power-up time from a hardware
or software power-down reduces to 5 µs. This is because an
–20–
REV. A
AD7856
internal current source connected to the CAL pin charges up
the external capacitor and the time required to charge the exter-
nal capacitor will depend on the size of the capacitor itself. This
time should be large enough to ensure that the internal refer-
ence is settled before the calibration is performed. A 33 nF
capacitor is sufficient to ensure that the internal reference has
settled (see Power-Up Times) before a calibration is initiated
taking into account trigger level and current source variations on
the CAL pin. However, if an external reference is being used,
this reference must have stabilized before the automatic calibra-
tion is initiated (a larger capacitor on the CAL pin should be
used if the external reference has not settled when the autocali-
bration is initiated). Once the capacitor on the CAL pin has
charged, the calibration will be performed which will take 42 ms
(6 MHz CLKIN). Therefore the autocalibration should be
complete before operating the part. After calibration, the part is
accurate to the 14-bit level and the specifications quoted on the
data sheet apply. There will be no need to perform another
calibration unless the operating conditions change or unless a
system calibration is required.
100
10
1
0.1
10
20
30
40
50
0
THROUGHPUT – kSPS
Figure 24. Power vs. Throughput Rate (6 MHz CLK)
CALIBRATION SECTION
Calibration Overview
The automatic calibration that is performed on power up en-
sures that the calibration options covered in this section will not
be required in a significant amount of applications. The user
will not have to initiate a calibration unless the operating condi-
tions change (CLKIN frequency, analog input mode, reference
voltage, temperature, and supply voltages). The AD7856 has a
number of calibration features that may be required in some
applications and there are a number of advantages in performing
these different types of calibration. First, the internal errors in
the ADC can be reduced significantly to give superior dc perfor-
mance, and secondly, system offset and gain errors can be re-
moved. This allows the user to remove reference errors (whether
it be internal or external reference) and to make use of the full
dynamic range of the AD7856 by adjusting the analog input
range of the part for a specific system.
Self-Calibration Description
There are four different calibration options within the self-
calibration mode. First, there is a full self-calibration where the
DAC, internal gain, and internal offset errors are calibrated out.
Then, there is the (Gain + Offset) self-calibration which cali-
brates out the internal gain error and then the internal offset
errors. The internal DAC is not calibrated here. Finally, there
are the self-offset and self-gain calibrations which calibrate out
the internal offset errors and the internal gain errors respectively.
The internal capacitor DAC is calibrated by trimming each of
the capacitors in the DAC. It is the ratio of these capacitors to
each other that is critical, and so the calibration algorithm en-
sures that this ratio is at a specific value by the end of the cali-
bration routine. For the offset and gain there are two separate
capacitors, one of which is trimmed when an offset or gain cali-
bration is performed. Again, it is the ratio of these capacitors to
the capacitors in the DAC that is critical and the calibration
algorithm ensures that this ratio is at a specified value for both
the offset and gain calibrations.
There are two main calibration modes on the AD7856, self-
calibration and system calibration. There are various options in
both self-calibration and system calibration as outlined previ-
ously in Table IV. All the calibration functions can be initiated
by pulsing the CAL pin or by writing to the control register and
setting the STCAL bit to one. The timing diagrams that follow
involve using the CAL pin.
The zero-scale error is adjusted for an offset calibration, and the
positive full-scale error is adjusted for a gain calibration.
The duration of each of the different types of calibrations is
given in Table VIII for the AD7856 with a 6 MHz master clock.
These calibration times are master clock dependent.
Self-Calibration Timing
The diagram of Figure 25 shows the timing for a full self-
calibration. Here the BUSY line stays high for the full length of
the self-calibration. A self-calibration is initiated by bringing the
CAL pin low (which initiates an internal reset) and then high
again or by writing to the control register and setting the STCAL
bit to 1 (note that if the part is in a power-down mode the CAL pulse -
width must take account of the power-up time ). The BUSY line is
triggered high from the rising edge of CAL (or the end of the
write to the control register if calibration is initiated in soft-
ware), and BUSY will go low when the full-self calibration is
complete after a time tCAL as shown in Figure 25.
Table VIII. Calibration Times (AD7856 with 6 MHz CLKIN)
Type of Self- or
System Calibration
Time
Full
Offset + Gain
Offset
41.7 ms
9.26 ms
4.63 ms
4.63 ms
Gain
For the self- (gain + offset), self-offset and self-gain calibrations
the BUSY line will be triggered high by the rising edge of the
CAL signal (or the end of the write to the control register if
calibration is initiated in software) and will stay high for the
full duration of the self calibration. The length of time that
the BUSY is high will depend on the type of self-calibration that
Automatic Calibration on Power-On
The CAL pin has a 0.15 µA pull up current source connected to
it internally to allow for an automatic full self-calibration on
power-on. A full self-calibration will be initiated on power-on if
a capacitor is connected from the CAL pin to DGND. The
REV. A
–21–
AD7856
is initiated. Typical figures are given in Table VIII. The timing
diagrams for the other self-calibration options will be similar to
that outlined in Figure 25.
MAX SYSTEM FULL SCALE
MAX SYSTEM FULL SCALE
IS ؎1.875% FROM V
IS ؎1.875% FROM V
REF
REF
SYS FS
SYS FS
V
– 1LSB
V
– 1LSB
REF
REF
SYSTEM GAIN
t1 = 100ns MIN,
t15 = 2.5 tCLKIN MAX,
tCAL = 250026 tCLKIN
ANALOG
INPUT
RANGE
ANALOG
INPUT
RANGE
CALIBRATION
t1
AGND
AGND
CAL (I/P)
t15
Figure 27. System Gain Calibration
BUSY (O/P)
Finally, in Figure 28 both the system offset and gain are ac-
counted for by the system offset followed by a system gain cali-
bration. First, the analog input range is shifted upward by the
positive system offset and then the analog input range is ad-
justed at the top end to account for the system full scale.
tCAL
Figure 25. Timing Diagram for Full-Self Calibration
System Calibration Description
System calibration allows the user to take out system errors
external to the AD7856 as well as calibrate the errors of the
AD7856 itself. The maximum calibration range specified for the
system offset errors is ±3.75% of VREF but typically is ±5% and
for the system gain errors is ±1.875% of VREF. Therefore, under
worst case conditions the maximum allowable system offset
voltage applied between AIN(+) and AIN(–) would be ±0.0375
× VREF, but under typical conditions this means that the maxi-
mum allowable system offset voltage applied between the AIN(+)
and AIN(–) pins for the calibration to adjust out this error is
±0.05 × VREF (i.e., the AIN(+) can be 0.05 × VREF above AIN(–)
or 0.05 × VREF below AIN(–)). For the System gain error the
maximum allowable system full-scale voltage that can be applied
between AIN(+) and AIN(–) for the calibration to adjust out
this error is VREF ± 0.01875 × VREF (i.e., the AIN(+) can be VREF
+ 0.01875 × VREF above AIN(–) or VREF – 0.01875 × VREF above
AIN(–)). If the system offset or system gain errors are outside
the ranges mentioned the system calibration algorithm will
reduce the errors as much as the trim range allows.
MAX SYSTEM FULL SCALE
MAX SYSTEM FULL SCALE
IS ؎1.875% FROM V
IS ؎1.875% FROM V
REF
REF
V
+ SYS OFFSET
REF
SYS FS
– 1LSB
SYS FS
– 1LSB
V
V
REF
REF
SYSTEM OFFSET
CALIBRATION
FOLLOWED BY
ANALOG
INPUT
RANGE
ANALOG
INPUT
RANGE
SYSTEM GAIN
CALIBRATION
SYS OFFSET
AGND
SYS OFFSET
AGND
MAX SYSTEM OFFSET
IS ؎5% OF V
REF
MAX SYSTEM OFFSET
IS ؎5% OF V
REF
Figure 28. System (Gain + Offset) Calibration
System Gain and Offset Interaction
The inherent architecture of the AD7856 leads to an interaction
between the system offset and gain errors when a system calibra-
tion is performed. Therefore, it is recommended to perform the
cycle of a system offset calibration followed by a system gain
calibration twice. Separate system offset and system gain cali-
brations reduce the offset and gain errors to at least the 14-bit
level. By performing a system offset CAL first and a system gain
calibration second, priority is given to reducing the gain error to
zero before reducing the offset error to zero. If the system errors
are small, a system offset calibration would be performed, fol-
lowed by a system gain calibration. If the systems errors are
large (close to the specified limits of the calibration range), this
cycle would be repeated twice to ensure that the offset and gain
errors were reduced to at least the 14-bit level. The advantage of
doing separate system offset and system gain calibrations is that
the user has more control over when the analog inputs need to
be at the required levels, and the CONVST signal does not have
to be used.
Figures 26 through 28 illustrate why a specific type of system
calibration might be used. Figure 26 shows a system offset cali-
bration (assuming a positive offset) where the analog input
range has been shifted upward by the system offset after the
system offset calibration is completed. A negative offset may
also be accounted for by a system offset calibration.
MAX SYSTEM FULL SCALE
IS ؎1.875% FROM V
REF
V
+ SYS OFFSET
REF
V
– 1LSB
V
– 1LSB
REF
REF
SYSTEM OFFSET
ANALOG
INPUT
ANALOG
INPUT
RANGE
RANGE
CALIBRATION
SYS OFFSET
AGND
SYS OFFSET
AGND
Alternatively, a system (gain + offset) calibration can be
performed. It is recommended to perform three system (gain +
offset) calibrations to reduce the offset and gain errors to the 14-
bit level. For the system (gain + offset) calibration priority is
given to reducing the offset error to zero before reducing the
gain error to zero. Thus if the system errors are small then two
system (gain + offset) calibrations will be sufficient. If the sys-
tem errors are large (close to the specified limits of the calibra-
tion range) three system (gain + offset) calibrations may be
MAX SYSTEM OFFSET
MAX SYSTEM OFFSET
IS ؎5% OF V
IS ؎5% OF V
REF
REF
Figure 26. System Offset Calibration
Figure 27 shows a system gain calibration (assuming a system
full scale greater than the reference voltage) where the analog
input range has been increased after the system gain calibration
is completed. A system full-scale voltage less than the reference
voltage may also be accounted for by a system gain calibration.
–22–
REV. A
AD7856
required to reduced the offset and gain errors to at least the 14-
bit level. There will never be any need to perform more than
three system (offset + gain) calibrations.
line to go high and it will stay high until the calibration sequence is
finished. The analog input should be set at the correct level for a
minimum setup time (tSETUP) of 100 ns before the rising edge of
CAL and stay at the correct level until the BUSY signal goes low.
The zero scale error is adjusted for an offset calibration and the
positive full-scale error is adjusted for a gain calibration.
t1
System Calibration Timing
CAL (I/P)
The calibration timing diagram in Figure 29 is for a full system
calibration where the falling edge of CAL initiates an internal
reset before starting a calibration (note that if the part is in power-
down mode, the CAL pulsewidth must take account of the power-up
time). For software calibrations with power-down modes, see
note in Power-Up Times section. If a full system calibration is
to be performed in software it is easier to perform separate gain
and offset calibrations so that the CONVST bit in the control
register does not have to be programmed in the middle of the
system calibration sequence. The rising edge of CAL starts
calibration of the internal DAC and causes the BUSY line to go
high. If the control register is set for a full system calibration,
the CONVST must be used also. The full-scale system voltage
should be applied to the analog input pins from the start of
calibration. The BUSY line will go low once the DAC and Sys-
tem Gain Calibration are complete. Next the system offset volt-
t15
BUSY (O/P)
tCAL2
tSETUP
V
OR V
SYSTEM OFFSET
AIN (I/P)
SYSTEM FULL SCALE
Figure 30. Timing Diagram for System Gain or System
Offset Calibration
SERIAL INTERFACE SUMMARY
Table IX details the two interface modes and the serial clock
edges from which the data is clocked out by the AD7856
(DOUT Edge) and that the data is latched in on (DIN Edge).
In both interface Modes 1, and 2 the SYNC is gated with the
SCLK. Thus the falling edge of SYNC may clock out the MSB
of data. Subsequent bits will be clocked out by the Serial Clock,
SCLK. The condition for the falling edge of SYNC clocking out
the MSB of data is as follows:
age is applied to the AIN pin for a minimum setup time (tSETUP
of 100 ns before the rising edge of the CONVST and remains
until the BUSY signal goes low. The rising edge of the CONVST
starts the system offset calibration section of the full system
calibration and also causes the BUSY signal to go high. The
BUSY signal will go low after a time tCAL2 when the calibration
sequence is complete. In some applications not all the input
channels may be used. In this case it may be useful to dedicate
two input channels for the system calibration, one which has the
system offset voltage applied to it, and one which has the system
full scale voltage applied to it. When a system offset or gain
calibration is performed, the channel selected should correspond
to the system offset or system full-scale voltage channel.
)
The falling edge of SYNC will clock out the MSB if the serial clock
is low when the SYNC goes low.
If this condition is not the case, the SCLK will clock out the
MSB. If a noncontinuous SCLK is used, it should idle high.
Table IX. SCLK Active Edges
Interface Mode
DOUT Edge
DIN Edge
1, 2
SCLK↓
SCLK↑
Resetting the Serial Interface
The timing for a system (gain + offset) calibration is very similar
to that of Figure 29 the only difference being that the time tCAL1
will be replaced by a shorter time of the order of tCAL2 as the
internal DAC will not be calibrated. The BUSY signal will
signify when the gain calibration is finished and when the part is
ready for the offset calibration.
When writing to the part via the DIN line there is the possibility
of writing data into the incorrect registers, such as the test regis-
ter for instance, or writing the incorrect data and corrupting the
serial interface. The SYNC pin acts as a reset. Bringing the
SYNC pin high resets the internal shift register. The first data
bit after the next SYNC falling edge will now be the first bit of a
new 16-bit transfer. It is also possible that the test register con-
tents were altered when the interface was lost. Therefore, once
the serial interface is reset it may be necessary to write the 16-bit
word 0100 0000 0000 0010 to restore the test register to its
default value. Now the part and serial interface are completely
reset. It is always useful to retain the ability to program the
SYNC line from a port of the µController/DSP to have the abil-
ity to reset the serial interface.
t1 = 100ns MIN, t16 = 2.5 tCLKIN MAX,
t15 = 2.5 tCLKIN MAX, tCAL1 = 222228 tCLKIN MAX,
tCAL2 = 27798 tCLKIN
t1
CAL (I/P)
t15
BUSY (O/P)
tCAL2
tCAL1
t16
Table X summarizes the interface modes provided by the
AD7856. It also outlines the various µP/µC to which the par-
ticular interface is suited.
CONVST (I/P)
tSETUP
V
V
AIN (I/P)
OFFSET
SYSTEM FULL SCALE
Interface Mode 1 may only be set by programming the control
register (See section on Control Register).
Figure 29. Timing Diagram for Full System Calibration
The timing diagram for a system offset or system gain calibra-
tion is shown in Figure 30. Here again the CAL is pulsed and
the rising edge of the CAL initiates the calibration sequence (or
the calibration can be initiated in software by writing to the
control register). The rising edge of the CAL causes the BUSY
Some of the more popular µProcessors, µControllers, and DSP
machines that the AD7856 will interface to directly are men-
tioned here. This does not cover all µCs, µPs and DSPs. A more
detailed timing description on each of the interface modes follows.
REV. A
–23–
AD7856
Table X. Interface Mode Description
In Figure 31 the part samples the input data on the rising edge
of SCLK. After the 16th rising edge of SCLK the DIN is con-
figured as an output. When the SYNC is taken high the DIN is
three-stated. Taking SYNC low disables the three-state on the
DIN pin and the first SCLK falling edge clocks out the first data
bit. Once the 16 clocks have been provided the DIN pin will
automatically revert back to an input after a time, t14. Note that
a continuous SCLK shown by the dotted waveform in Figure 31
can be used provided that the SYNC is low for only 16 clock
pulses in each of the read and write cycles.
Interface
Mode
Processor/
Controller
Comment
1
8XC51
(2-Wire)
8XL51
PIC17C42
(DIN Is an Input/
Output Pin)
2
68HC11
(3-Wire, SPI)
68L11
(Default Mode)
68HC16
In Figure 32 the SYNC line is permanently tied low and this
results in a different timing arrangement. With SYNC perma-
nently tied low the DIN pin will never be three-stated. The 16th
rising edge of SCLK configures the DIN pin as an input or an
output as shown in the diagram. Here no more than 16 SCLK
pulses must occur for each of the read and write operations.
PIC16C64
ADSP-21xx
DSP56000
DSP56001
DSP56002
DSP56L002
If reading from and writing to the calibration registers in this
interface mode, all the selected calibration registers must be
read from or written to. The read and write operations cannot
be aborted. When reading from the calibration registers, the
DIN pin will remain as an output for the full duration of all the
calibration register read operations. When writing to the calibra-
tion registers, the DIN pin will remain as an input for the full
duration of all the calibration register write operations.
DETAILED TIMING SECTION
Mode 1 (2-Wire 8051 Interface)
The read and write takes place on the DIN line and the conver-
sion is initiated by pulsing the CONVST pin (note that in every
write cycle the 2/3 MODE bit must be set to 1). The conversion
may be started by setting the CONVST bit in the control regis-
ter to 1 instead of using the CONVST pin.
NOTE: Initiating conversions in software is not recommended
in Mode 1 operation.
Figures 31 and 32 show the timing diagrams for Operating
Mode 1 in Table X where the AD7856 is in the 2-wire interface
mode. Here the DIN pin is used for both input and output as
shown. The SYNC input is level-triggered active low and can be
pulsed (Figure 31) or can be constantly low (Figure 32).
A degradation of 0.3 LSB in linearity can be expected when
operating in Mode 1; however, when hardware initiation of
conversions is used, all other specifications that apply to Mode 2
operation also apply to Mode 1.
t3 = –0.4tSCLK MIN (NONCONTINUOUS SCLK) –/+ 0.4tSCLK ns MIN/MAX (CONTINUOUS SCLK),
t6 = 45/75ns MAX (A/K), t7 = 30/40ns MIN (A/K), t8 = 20ns MIN
POLARITY PIN LOGIC HIGH
SYNC (I/P)
t11
t3
t11
t3
1
16
1
16
SCLK (I/P)
t5
t14
t7
t8
t12
t6
t6
DIN (I/O)
DB15
DB0
DB15
DB0
3-STATE
DATA WRITE
DATA READ
DIN BECOMES AN INPUT
DIN BECOMES AN OUTPUT
Figure 31. Timing Diagram for Read/Write Operation with DIN as an Input/Output (i.e., Mode 1)
t6 = 45/75ns MAX (A/K), t7 = 30/40ns MIN (A/K), t8 = 20ns MIN,
t13 = 90ns MAX, t14 = 50ns MIN
POLARITY PIN LOGIC HIGH
SCLK (I/P)
DIN (I/O)
1
16
1
6
16
t14
t7
t8
t6
t13
DB0
t6
DB15
DB15
DB0
DATA WRITE
DATA READ
DIN BECOMES AN INPUT
Figure 32. Timing Diagram for Read/Write Operation with DIN as an Input/Output and
SYNC Input Tied Low (i.e., Interface Mode 1)
–24–
REV. A
AD7856
Mode 2 (3-Wire SPI/QSPI Interface Mode)
This is the DEFAULT INTERFACE MODE.
SYNC going low disables the three-state on the DOUT pin. The
first falling edge of the SCLK after the SYNC going low clocks
out the first leading zero on the DOUT pin. The DOUT pin is
three-stated again a time, t12, after the SYNC goes high. With
the DIN pin the data input has to be set up a time, t7, before the
SCLK rising edge as the part samples the input data on the
SCLK rising edge in this case. If resetting the interface is re-
quired, the SYNC must be taken high and then low.
In Figure 33 below we have the timing diagram for interface
Mode 2, which is the SPI/QSPI interface mode. Here the SYNC
input is active low and may be pulsed or permanently tied low.
If SYNC is permanently low, 16 clock pulses must be applied to
the SCLK pin for the part to operate correctly otherwise, with a
pulsed SYNC input, a continuous SCLK may be applied pro-
vided SYNC is low for only 16 SCLK cycles. In Figure 33 the
t3 = –0.4tSCLK MIN (NONCONTINUOUS SCLK) –/+0.4tSCLK ns MIN/MAX (CONTINUOUS SCLK),
t6 = 45/75ns MAX (A/K), t7 = 30/40ns MIN (A/K), t8 = 20ns MIN,
POLARITY PIN LOGIC HIGH
t11 = 30ns MIN (NONCONTINUOUS SCLK), 30/0.4tSCLK ns MIN/MAX (CONTINUOUS SCLK)
SYNC (I/P)
t11
t3
t9
1
2
3
4
5
6
16
SCLK (I/P)
t10
t5
t12
t6
t6
THREE-
STATE
THREE-
STATE
DOUT (O/P)
DB15
DB14
DB13
DB12
DB11
DB10
DB0
t7
t8
t8
DIN (I/P)
DB15
DB14
DB13
DB12
DB11
DB10
DB0
Figure 33. SPI/QSPI Mode 2 Timing Diagram for Read/Write Operation with DIN Input
DOUT Output and SYNC Input
REV. A
–25–
AD7856
CONFIGURING THE AD7856
The options of using a hardware (pulsing the CONVST pin) or
software (setting the CONVST bit to 1) conversion start, and
reading/writing during or after conversion are shown in Figures
34 and 35. If the CONVST pin is never used, it should be
permanently tied to DVDD. Where reference is made to the
BUSY bit equal to a Logic 0, to indicate the end of conversion,
the user in this case would poll the BUSY bit in the status register.
The AD7856 contains 14 on-chip registers that can be accessed
via the serial interface. In the majority of applications it will not
be necessary to access all of these registers. Here the CLKIN
signal is applied directly after power-on, the CLKIN signal must
be present to allow the part to perform a calibration. This auto-
matic calibration will be completed approximately 150 ms
after power-on.
Interface Mode 1 Configuration
Writing to the AD7856
Figure 34 shows the flowchart for configuring the part in Inter-
face Mode 1. This mode of operation can only be enabled by
writing to the control register and setting the 2/3 MODE bit.
Reading and writing cannot take place simultaneously in this
mode as the DIN pin is used for both reading and writing.
Initiating conversions in software is not recommended in this
mode, see Detailed Timing section.
For accessing the on-chip registers it is necessary to write to the
part. To change the channel from the default channel setting the
user will be required to write to the part. To enable Serial Inter-
face Mode 1 the user must also write to the part. Figures 34 and
35 outline flowcharts of how to configure the AD7856 Serial
Interface Modes 1 and 2 respectively. The continuous loops on
all diagrams indicate the sequence for more than one conversion.
START
POWER-ON, APPLY CLKIN SIGNAL,
WAIT 150ms FOR AUTOMATIC CALIBRATION
SERIAL
INTERFACE
MODE
?
1
APPLY SYNC (IF REQUIRED), SCLK,
WRITE TO CONTROL REGISTER
SETTING CHANNEL AND TWO-WIRE MODE
PULSE CONVST PIN
READ
DATA
YES
DURING
CONVERSION
?
WAIT APPROX. 200 ns AFTER
CONVST RISING EDGE OR AFTER END
OF CONTROL REGISTER WRITE
NO
WAIT FOR BUSY SIGNAL TO GO LOW
OR
WAIT FOR BUSY BIT = 0
APPLY SYNC (IF REQUIRED), SCLK, READ
PREVIOUS CONVERSION RESULT ON DIN PIN
APPLY SYNC (IF REQUIRED), SCLK, READ
CURRENT CONVERSION RESULT ON DIN PIN
Figure 34. Flowchart for Setting Up, Reading and Writing in Interface Mode 1
–26–
REV. A
AD7856
Interface Mode 2 Configuration
that no valid data is written to any of the registers. When using
the software conversion start and transferring data during con-
version, Note 1 must be obeyed.
Figure 35 shows the flowchart for configuring the part in Inter-
face Mode 2. In this case the read and write operations take
place simultaneously via the serial port. Writing all 0s ensures
START
POWER-ON, APPLY CLKIN SIGNAL,
WAIT 150ms FOR AUTOMATIC CALIBRATION
SERIAL
INTERFACE
MODE
?
2
INITIATE
CONVERSION
YES
IN
SOFTWARE
?
NO
YES
TRANSFER
DATA DURING
CONVERSION
?
PULSE CONVST PIN
APPLY SYNC (IF REQUIRED), SCLK, WRITE
TO CONTROL REGISTER SETTING NEXT
CHANNEL, CONVST BIT TO 1, READ
PREVIOUS CONVERSION RESULT ON
DOUT PIN (NOTE 1)
NO
TRANSFER
DATA DURING
CONVERSION
?
YES
APPLY SYNC (IF REQUIRED), SCLK, WRITE
TO CONTROL REGISTER SETTING NEXT
CHANNEL, CONVST BIT TO 1, READ
RESULT ON DOUT PIN FOR
CONVERSION JUST COMPLETED
WAIT APPROX 200ns AFTER
CONVST RISING EDGE
NO
WAIT FOR BUSY SIGNAL TO GO LOW
WAIT FOR BUSY SIGNAL TO GO LOW
OR
OR
WAIT FOR BUSY BIT = 0
WAIT FOR BUSY BIT = 0
APPLY SYNC (IF REQUIRED), SCLK, READ
PREVIOUS CONVERSION RESULT ON DOUT
PIN, AND WRITE CHANNEL SELECTION
APPLY SYNC (IF REQUIRED), SCLK, READ
CURRENT CONVERSION RESULT ON
DOUT PIN, AND WRITE CHANNEL SELECTION
NOTE 1: WHEN USING THE SOFTWARE CONVERSION START AND TRANSFERRING DATA
DURING CONVERSION, THE USER MUST ENSURE THAT THE CONTROL REGISTER WRITE
OPERATION EXTENDS BEYOND THE FALLING EDGE OF BUSY. THE FALLING EDGE OF
BUSY RESETS THE CONVST BIT TO 0 AND ONLY AFTER THIS TIME CAN IT BE
REPROGRAMMED TO 1 TO START THE NEXT CONVERSION.
Figure 35. Flowchart for Setting Up, Reading and Writing in Interface Mode 2
REV. A
–27–
AD7856
MICROPROCESSOR INTERFACING
OPTIONAL
4MHz/6MHz
AD7856
CONVST
In many applications, the user may not require the facility of
writing to most of the on-chip registers. The only writing neces-
sary is to set the input channel configuration. After this the
CONVST is applied, a conversion is performed and the result
may be read using the SCLK to clock out the data from the
output register onto the DOUT pin. At the same time, a write
operation occurs and this may consist of all 0s where no data is
written to the part or may set a different input channel configu-
ration for the next conversion. The SCLK may be connected to
the CLKIN pin if the user does not want to have to provide
separate serial and master clocks. With this arrangement the
SYNC signal must be low for 16 SCLK cycles for the read and
write operations.
8XC51
MASTER
CLKIN
SCLK
DIN
P3.1
SLAVE
P3.0
(INT0/P3.2)
BUSY
SYNC
OPTIONAL
Figure 37. 8XC51/PIC16C42 Interface
AD7856 to 68HC11/16/L11/PIC16C42 Interface
Figure 38 shows the AD7856 SPI/QSPI interface to the 68HC11/
16/L11/PIC16C42. The AD7856 is in Interface Mode 2. The
SYNC line is not used and is tied to DGND. The µController is
configured as the master, by setting the MSTR bit in the SPCR
to 1, and provides the serial clock on the SCK pin. For all the
µControllers the CPOL bit is set to 1 and for the 68HC11/16/L11
the CPHA bit is set to 1. The CLKIN and CONVST signals can
be supplied from the µController or from separate sources. The
BUSY signal can be used as an interrupt to tell the µController
when the conversion is finished, then the reading and writing
can take place. If required, the reading and writing can take
place during conversion and there will be no need for the BUSY
signal in this case.
CONVST
CLKIN
SCLK
CONVERSION START
4MHz/6MHz
MASTER CLOCK
AD7856
SYNC SIGNAL TO
GATE THE SCLK
SYNC
SERIAL DATA INPUT
DIN
SERIAL DATA
OUTPUT
DOUT
Figure 36. Simplified Interface Diagram
AD7856 to 8XC51 Interface
For the 68HC16, the word length should be set to 16 bits and
the SS line should be tied to the SYNC pin for the QSPI inter-
face. The micro-sequencer and RAM associated with the 68HC16
QSPI port can be used to perform a number of read and write
operations, and store the conversion results in memory, inde-
pendent of the CPU. This is especially useful when reading the
conversion results from all eight channels consecutively. The
command section of the QSPI port RAM would be programmed
to perform a conversion on one channel, read the conversion
result, perform a conversion on the next channel, read the con-
version result, and so on until all eight conversion results are
stored into the QSPI RAM.
Figure 37 shows the AD7856 interface to the 8XC51. The
8XC51 only runs at 5 V. The 8XC51 is in Mode 0 operation.
This is a two-wire interface consisting of the SCLK and the
DIN which acts as a bidirectional line. The SYNC is tied low.
The BUSY line can be used to give an interrupt driven system
but this would not normally be the case with the 8XC51. For
the 8XC51 12 MHz version the serial clock will run at a maxi-
mum of 1 MHz so the serial interface of the AD7856 will only
be running at 1 MHz. The CLKIN signal must be provided
separately to the AD7856 from a port line on the 8XC51 or
from a source other than the 8XC51. Here the SCLK cannot be
tied to the CLKIN as the SYNC is permanently tied low. The
CONVST signal can be provided from an external timer or
conversion can be started in software if required. The sequence
of events would typically be writing to the control register via
the DIN line setting a conversion start and the 2-wire interface
mode (this would be performed in two 8-bit writes), wait for the
conversion to be finished (3.5 µs with 6 MHz CLKIN), read the
conversion result data on the DIN line (this would be performed
in two 8-bit reads), and repeat the sequence. The maximum
serial frequency will be determined by the data access and hold
times of the 8XC51 and the AD7856.
A typical sequence of events would be writing to the control
register via the DIN line setting a conversion start and at the
same time reading data from the previous conversion on the
DOUT line (both the read and write operations would each be
two 8-bit operations, one 16-bit operation for the 68HC16),
wait for the conversion to be finished (= 3.5 µs for AD7856 with
6 MHz CLKIN), and then repeat the sequence. The maximum
serial frequency will be determined by the data access and hold
times of the µControllers and the AD7856.
–28–
REV. A
AD7856
OPTIONAL
4MHz/6MHz
DV
AD7856 to DSP56000/1/2/L002 Interface
AD7856
CONVST
Figure 40 shows the AD7856 to DSP56000/1/2/L002 interface.
Here the DSP5600x is the master and the AD7856 is the slave.
The AD7856 is in Interface Mode 2. The setting of the bits in
the registers of the DSP5600x would be for synchronous opera-
tion (SYN = 1), internal frame sync (SCD2 = 1), gated internal
clock (GCK = 1, SCKD = 1), 16-bit word length (WL1 = 1,
WL0 = 0). Since a gated clock is used here the SCLK cannot be
tied to the CLKIN of the AD7856. The SCLK from the DSP5600x
must be inverted before it is applied to the AD7856. Again the
data access and hold times of the DSP5600x and the AD7856
allows for a SCLK of 6 MHz, VDD = 5 V.
DD
68HC11/L11/16
CLKIN
SYNC
SCLK
SPI
SS
SLAVE
HC16, QSPI
OPTIONAL
SCK
MASTER
MISO
IRQ
DOUT
BUSY
DIN
MOSI
Figure 38. 68HC11 and 68HC16 Interface
AD7856 to ADSP-21xx Interface
OPTIONAL
Figure 39 shows the AD7856 interface to the ADSP-21xx. The
ADSP-21xx is the master and the AD7856 is the slave. The
AD7856 is in Interface Mode 2. For the ADSP-21xx the bits in
the serial port control register should be set up as TFSR = RFSR
= 1 (need a frame sync for every transfer), SLEN = 15 (16-bit
word length), TFSW = RFSW = 1 (alternate framing mode for
transmit and receive operations), INVRFS = INVTFS = 1
(active low RFS and TFS), IRFS = 0, ITFS = 1 (External RFS
and internal TFS), and ISCLK = 1 (internal serial clock). The
CLKIN and CONVST signals can be supplied from the ADSP-
21xx or from an external source. The serial clock from the
ADSP-21xx must be inverted before the SCLK pin of the
AD7856. This SCLK could also be used to drive the CLKIN
input of the AD7856. The BUSY signal indicates when the
conversion is finished and may not be required. The data access
and hold times of the ADSP-21xx and the AD7856 allow for a
serial clock of 6 MHz at 5 V.
AD7856
CONVST
4MHz/6MHz
DSP56000/1/2/L002
CLKIN
SCK
SCLK
SLAVE
DOUT
SRD
SC2
IRQ
MASTER
SYNC
OPTIONAL
BUSY
DIN
STD
Figure 40. DSP56000/1/2/L002 Interface
APPLICATION HINTS
Grounding and Layout
The analog and digital supplies to the AD7856 are independent
and separately pinned out to minimize coupling between the
analog and digital sections of the device. The part has very good
immunity to noise on the power supplies as can be seen by the
PSRR vs. Frequency graph. However, care should still be taken
with regard to grounding and layout.
OPTIONAL
AD7856
CONVST
ADSP-21xx
SCK
4MHz/6MHz
CLKIN
SCLK
DOUT
SYNC
The printed circuit board that houses the AD7856 should be
designed so that the analog and digital sections are separated
and confined to certain areas of the board. This facilitates the
use of ground planes that can be easily separated. A minimum
etch technique is generally best for ground planes as it gives the
best shielding. Digital and analog ground planes should only be
joined in one place. If the AD7856 is the only device requiring
an AGND to DGND connection, the ground planes should
be connected at the AGND and DGND pins of the AD7856. If
the AD7856 is in a system where multiple devices require AGND
to DGND connections, the connection should still be made at
one point only, a star ground point that should be established
as close as possible to the AD7856.
DR
RFS
MASTER
SLAVE
TFS
IRQ
DT
OPTIONAL
BUSY
DIN
Figure 39. ADSP-21xx Interface
REV. A
–29–
AD7856
Avoid running digital lines under the device as these will couple
noise onto the die. The analog ground plane should be allowed
to run under the AD7856 to avoid noise coupling. The power
supply lines to the AD7856 should use as large a trace as pos-
sible to provide low impedance paths and reduce the effects of
glitches on the power supply line. Fast switching signals like
clocks should be shielded with digital ground to avoid radiating
noise to other sections of the board, and clock signals should
never be run near the analog inputs. Avoid crossover of digital
and analog signals. Traces on opposite sides of the board should
run at right angles to each other. This will reduce the effects of
feedthrough through the board. A microstrip technique is by far
the best, but is not always possible with a double-sided board.
In this technique, the component side of the board is dedicated
to ground planes while signals are placed on the solder side.
recommended digital supply decoupling capacitor between the
DVDD pin of the AD7856 and DGND.
Evaluating the AD7856 Performance
The recommended layout for the AD7856 is outlined in the
evaluation board for the AD7856. The evaluation board pack-
age includes a fully assembled and tested evaluation board,
documentation and software for controlling the board from the
PC via the EVAL-CONTROL BOARD. The EVAL-CON-
TROL BOARD can be used in conjunction with the AD7856
Evaluation board, as well as many other Analog Devices evalua-
tion boards ending in the CB designator, to demonstrate/evalu-
ate the ac and dc performance of the AD7856.
The software allows the user to perform ac (fast Fourier trans-
form) and dc (histogram of codes) tests on the AD7856. It also
gives full access to all the AD7856 on-chip registers allowing for
various calibration and power-down options to be programmed.
Good decoupling is also important. All analog supplies should
be decoupled with 10 µF tantalum in parallel with 0.1 µF ca-
pacitors to AGND. All digital supplies should have a 0.1 µF
disc ceramic capacitor to AGND. To achieve the best from
these decoupling components, they must be placed as close as
possible to the device, ideally right up against the device. In
systems where a common supply voltage is used to drive both
the AVDD and DVDD of the AD7856, it is recommended that
the system’s AVDD supply be used. In this case there should be a
10 Ω resistor between the AVDD pin and DVDD pin. This supply
should have the recommended analog supply decoupling capaci-
tors between the AVDD pin of the AD7856 and AGND and the
AD785x Family
12 bits, 200 kSPS, 3.0 V to 5.5 V:
AD7853 – Single-Channel Serial
AD7854 – Single-Channel Parallel
AD7858 – 8-Channel Serial
AD7859 – 8-Channel Parallel
14 bits, 333 kSPS, 4.75 V to 5.25 V:
AD7851 – Single-Channel Serial
–30–
REV. A
AD7856
PAGE INDEX
Topic
Self-Calibration Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 21
System Calibration Description . . . . . . . . . . . . . . . . . . . . 22
System Gain and Offset Interaction . . . . . . . . . . . . . . . . . 22
System Calibration Timing . . . . . . . . . . . . . . . . . . . . . . . . 23
SERIAL INTERFACE SUMMARY . . . . . . . . . . . . . . . . . . 23
Resetting the Serial Interface . . . . . . . . . . . . . . . . . . . . . . 23
DETAILED TIMING SECTION
Mode 1 (2-Wire 8051 Interface) . . . . . . . . . . . . . . . . . . . . 24
Mode 2 (3-Wire SPI/QSPI Interface Mode) . . . . . . . . . . . 25
CONFIGURING THE AD7856 . . . . . . . . . . . . . . . . . . . . . 26
Writing to the AD7856 . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Interface Mode 1 Configuration . . . . . . . . . . . . . . . . . . . . 26
Interface Mode 2 Configuration . . . . . . . . . . . . . . . . . . . . 27
MICROPROCESSOR INTERFACING . . . . . . . . . . . . . . . 28
AD7856–8XC51 Interface . . . . . . . . . . . . . . . . . . . . . . . . 28
AD7856–68HC11/16/L11/PIC16C42 Interface . . . . . . . . 28
AD7856–ADSP-21xx Interface . . . . . . . . . . . . . . . . . . . . . 29
AD7856–DSP56000/1/2/L002 Interface . . . . . . . . . . . . . . 29
APPLICATION HINTS
Page No.
FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
GENERAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . 1
PRODUCT HIGHLIGHTS . . . . . . . . . . . . . . . . . . . . . . . . . 1
SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
TIMING SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . 4
TYPICAL TIMING DIAGRAMS . . . . . . . . . . . . . . . . . . . . 5
ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . 6
ORDERING GUIDE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
PIN CONFIGURATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . 6
PIN FUNCTION DESCRIPTIONS . . . . . . . . . . . . . . . . . . 7
TERMINOLOGY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
ON-CHIP REGISTERS
Addressing the On-Chip Registers . . . . . . . . . . . . . . . . . . . 9
CONTROL REGISTER . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
CONTROL REGISTER BIT FUNCTION
DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
STATUS REGISTER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
STATUS REGISTER BIT FUNCTION
DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
CALIBRATION REGISTERS . . . . . . . . . . . . . . . . . . . . . . 13
Addressing the Calibration Registers . . . . . . . . . . . . . . . . 13
Writing to/Reading from the Calibration Registers . . . . . . 13
Adjusting the Offset Calibration Register . . . . . . . . . . . . . 14
Adjusting the Gain Calibration Register . . . . . . . . . . . . . . 14
CIRCUIT INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . 15
CONVERTER DETAILS . . . . . . . . . . . . . . . . . . . . . . . . . . 15
TYPICAL CONNECTION DIAGRAM . . . . . . . . . . . . . . 15
ANALOG INPUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Acquisition Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
DC/AC Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Input Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Transfer Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
REFERENCE SECTION . . . . . . . . . . . . . . . . . . . . . . . . . . 17
PERFORMANCE CURVES . . . . . . . . . . . . . . . . . . . . . . . . 18
POWER-DOWN OPTIONS . . . . . . . . . . . . . . . . . . . . . . . . 18
POWER-UP TIMES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Using an External Reference . . . . . . . . . . . . . . . . . . . . . . 19
Using the Internal (On-Chip) Reference . . . . . . . . . . . . . . 20
POWER VS. THROUGHPUT RATE . . . . . . . . . . . . . . . . 20
CALIBRATION SECTION
Grounding and Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Evaluating the AD7856 Performance . . . . . . . . . . . . . . . . 30
OUTLINE DIMENSIONS . . . . . . . . . . . . . . . . . . . . . . . . . 32
TABLE INDEX
Table
Page No.
Table I. Write Register Addressing . . . . . . . . . . . . . . . . . . . . 9
Table II. Read Register Addressing . . . . . . . . . . . . . . . . . . . . 9
Table III. Channel Selection . . . . . . . . . . . . . . . . . . . . . . . . 11
Table IV. Calibration Selection . . . . . . . . . . . . . . . . . . . . . . 11
Table V. Calibration Register Addressing . . . . . . . . . . . . . . 13
Table VI. Power Management Options . . . . . . . . . . . . . . . . 19
Table VII. Power Consumption vs. Throughput . . . . . . . . . 20
Table VIII. Calibration Times (AD7856 with 6 MHz
CLKIN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table IX. SCLK Active Edges . . . . . . . . . . . . . . . . . . . . . . . 23
Table X. Interface Mode Description . . . . . . . . . . . . . . . . . 24
Calibration Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Automatic Calibration on Power-On . . . . . . . . . . . . . . . . . 21
Self-Calibration Description . . . . . . . . . . . . . . . . . . . . . . . 21
REV. A
–31–
AD7856
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
24-Lead Plastic DIP
(N-24)
1.275 (32.30)
1.125 (28.60)
24
1
13
0.280 (7.11)
0.240 (6.10)
12
0.325 (8.25)
0.300 (7.62)
0.195 (4.95)
0.115 (2.93)
PIN 1
0.060 (1.52)
0.015 (0.38)
0.210
(5.33)
MAX
0.150
(3.81)
MIN
0.200 (5.05)
0.125 (3.18)
0.015 (0.381)
0.008 (0.204)
0.100 (2.54)
BSC
0.022 (0.558)
0.014 (0.356)
0.070 (1.77) SEATING
PLANE
0.045 (1.15)
24-Lead Small Outline Package
(R-24)
0.6141 (15.60)
0.5985 (15.20)
24
13
12
1
PIN 1
0.1043 (2.65)
0.0926 (2.35)
0.0291 (0.74)
x 45°
0.0098 (0.25)
0.0500 (1.27)
0.0157 (0.40)
8°
0.0500
(1.27)
BSC
0.0192 (0.49)
0.0138 (0.35)
0.0118 (0.30)
0.0040 (0.10)
0°
0.0125 (0.32)
0.0091 (0.23)
SEATING
PLANE
24-Lead Shrink Small Outline Package
(RS-24)
0.328 (8.33)
0.318 (8.08)
24
13
1
12
0.07 (1.78)
0.078 (1.98)
0.068 (1.73)
PIN 1
0.066 (1.67)
0.037 (0.94)
8°
0°
0.015 (0.38)
0.010 (0.25)
0.0256
(0.65)
BSC
0.022 (0.559)
0.008 (0.203)
0.002 (0.050)
SEATING
PLANE
0.009 (0.229)
0.005 (0.127)
–32–
REV. A
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