EVAL-ADM2582EEBZ [ADI]
Signal and Power Isolated RS-485 Transceiver with ±15 kV ESD Protection; 信号和电源隔离RS- 485收发器，提供± 15 kV ESD保护
| 型号： | EVAL-ADM2582EEBZ |
| 厂家： | 
ADI |
| 描述： | Signal and Power Isolated RS-485 Transceiver with ±15 kV ESD Protection |
| 文件： | 总20页 (文件大小：486K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Signal and Power Isolated RS-485
Transceiver with ± ±5 ꢀk ꢁSꢂ Protection
AꢂM2582ꢁ/AꢂM2587ꢁ
FEATURES
FUNCTIONAL BLOCK DIAGRAM
V
V
ISOOUT
CC
Isolated RS-485/RS-422 transceiver, configurable as half or
full duplex
isoPower DC-TO-DC CONVERTER
isoPower® integrated isolated dc-to-dc converter
15 kV ESD protection on RS-485 input/output pins
Complies with ANSI/TIA/EIA-485-A-98 and ISO 8482:1987(E)
ADM2582E data rate: 16 Mbps
OSCILLATOR
RECTIFIER
V
ISOIN
REGULATOR
ADM2587E data rate: 500 kbps
5 V or 3.3 V operation
Connect up to 256 nodes on one bus
DIGITAL ISOLATION iCoupler
TRANSCEIVER
D
Y
Z
Open- and short-circuit, fail-safe receiver inputs
High common-mode transient immunity: >25 kV/μs
Thermal shutdown protection
Safety and regulatory approvals (pending)
UL recognition: 2500 V rms for 1 minute per UL 1577
VDE Certificates of Conformity
ENCODE
DECODE
DECODE
ENCODE
TxD
DE
ENCODE
DECODE
A
B
RxD
R
DIN V VDE V 0884-10 (VDE V 0884-10):2006-12
V
IORM = 560 V peak
RE
ADM2582E/ADM2587E
Operating temperature range: −40°C to +85°C
Highly integrated, 20-lead, wide-body SOIC package
GND
GND
2
1
ISOLATION
BARRIER
Figure 1.
APPLICATIONS
Isolated RS-485/RS-422 interfaces
Industrial field networks
Multipoint data transmission systems
GENERAL DESCRIPTION
The ADM2582E/ADM2587E are fully integrated signal and
power isolated data transceivers with ±±5 kV ESD protection
and are suitable for high speed communication on multipoint
transmission lines. The ADM2582E/ADM2587E include an
integrated isolated dc-to-dc power supply, which eliminates the
need for an external dc-to-dc isolation block.
The ADM2582E/ADM2587E driver has an active high enable.
An active low receiver enable is also provided that causes the
receiver output to enter a high impedance state when disabled.
The devices have current limiting and thermal shutdown
features to protect against output short circuits and situations
where bus contention may cause excessive power dissipation.
The parts are fully specified over the industrial temperature
range and are available in a highly integrated, 20-lead, wide-
body SOIC package.
They are designed for balanced transmission lines and comply
with ANSI/TIA/EIA-485-A-98 and ISO 8482:±987(E).
The devices integrate Analog Devices, Inc., iCoupler® technology to
combine a 3-channel isolator, a three-state differential line driver, a
differential input receiver, and Analog Devices isoPower dc-to-
dc converter into a single package. The devices are powered by a
single 5 V or 3.3 V supply, realizing a fully integrated signal and
power isolated RS-485 solution.
The ADM2582E/ADM2587E contain isoPower technology that
uses high frequency switching elements to transfer power through
the transformer. Special care must be taken during printed circuit
board (PCB) layout to meet emissions standards. Refer to
Application Note AN-097±, Control of Radiated Emissions with
isoPower Devices, for details on board layout considerations.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registeredtrademarks arethe property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Fax: 781.461.3113
www.analog.com
©2009 Analog Devices, Inc. All rights reserved.
AꢂM2582ꢁ/AꢂM2587ꢁ
TABLꢁ OF CONTꢁNTS
Features .............................................................................................. ±
Test Circuits..................................................................................... ±2
Switching Characteristics .............................................................. ±3
Circuit Description......................................................................... ±4
Signal Isolation ........................................................................... ±4
Power Isolation ........................................................................... ±4
Truth Tables................................................................................. ±4
Thermal Shutdown .................................................................... ±4
Open- and Short-Circuit, Fail-Safe Receiver Inputs.............. ±4
DC Correctness and Magnetic Field Immunity........................... ±5
Applications Information.............................................................. ±6
PCB Layout ................................................................................. ±6
EMI Considerations................................................................... ±6
Insulation Lifetime..................................................................... ±6
Isolated Power Supply Considerations .................................... ±7
Typical Applications................................................................... ±9
Outline Dimensions....................................................................... 20
Ordering Guide .......................................................................... 20
Applications....................................................................................... ±
Functional Block Diagram .............................................................. ±
General Description......................................................................... ±
Revision History ............................................................................... 2
Specifications..................................................................................... 3
ADM2582E Timing Specifications ............................................ 4
ADM2587E Timing Specifications ............................................ 4
ADM2582E/ADM2587E Package Characteristics................... 4
ADM2582E/ADM2587E Regulatory Information .................. 5
ADM2582E/ADM2587E Insulation and Safety-Related
Specifications ................................................................................ 5
ADM2582E/ADM2587E VDE 0884 Insulation
Characteristics (Pending)............................................................ 5
Absolute Maximum Ratings............................................................ 6
ESD Caution.................................................................................. 6
Pin Configuration and Function Descriptions............................. 7
Typical Performance Characteristics ............................................. 8
REVISION HISTORY
9/09—Revision 0: Initial Version
Rev. 0 | Page 2 of 20
AꢂM2582ꢁ/AꢂM2587ꢁ
SPꢁCIFICATIONS
All voltages are relative to their respective ground; 3.0 ≤ VCC ≤ 5.5 V. All minimum/maximum specifications apply over the entire
recommended operation range, unless otherwise noted. All typical specifications are at TA = 25°C, VCC = 5 V unless otherwise noted.
Table 1.
Parameter
Symbol Min
Typ
Max
Unit
Test Conditions
ADM2587E SUPPLY CURRENT
Data Rate ≤ 500 kbps
ICC
90
72
125
98
mA
mA
mA
mA
mA
VCC = 3.3 V, 100 Ω load between Y and Z
VCC = 5 V, 100 Ω load between Y and Z
VCC = 3.3 V, 54 Ω load between Y and Z
VCC = 5 V, 54 Ω load between Y and Z
120 Ω load between Y and Z
120
ADM2582E SUPPLY CURRENT
Data Rate = 16 Mbps
ICC
150
230
mA
mA
120 Ω load between Y and Z
54 Ω load between Y and Z
ISOLATED SUPPLY VOLTAGE
DRIVER
VISOUT
3.3
Differential Outputs
Differential Output Voltage, Loaded
|VOD2
|
|
2.0
1.5
1.5
5.0
5.0
5.0
0.2
3.0
0.2
200
30
V
V
V
V
V
V
mA
μA
RL = 100 Ω (RS-422), see Figure 23
RL = 54 Ω (RS-485), see Figure 23
−7 V ≤ VTEST1 ≤ 12 V, see Figure 24
RL = 54 Ω or 100 Ω, see Figure 23
RL = 54 Ω or 100 Ω, see Figure 23
RL = 54 Ω or 100 Ω, see Figure 23
|VOD3
Δ|VOD| for Complementary Output States Δ|VOD
|
Common-Mode Output Voltage
Δ|VOC| for Complementary Output States
Short-Circuit Output Current
VOC
Δ|VOC
IOS
|
Output Leakage Current (Y, Z)
IO
DE = 0 V, RE = 0 V, VCC = 0 V or 3.6 V,
VIN = 12 V
−30
μA
DE = 0 V, RE = 0 V, VCC = 0 V or 3.6 V,
VIN = −7 V
Logic Inputs DE, RE, TxD
Input Threshold Low
Input Threshold High
Input Current
VIL
VIH
II
0.3 × VCC
−10
V
DE, RE, TxD
DE, RE, TxD
DE, RE, TxD
0.7 × VCC
10
V
0.01
μA
RECEIVER
Differential Inputs
Differential Input Threshold Voltage
Input Voltage Hysteresis
Input Current (A, B)
VTH
VHYS
II
−200
−125
15
−30
125
mV
mV
μA
μA
kΩ
−7 V < VCM < +12 V
VOC = 0 V
DE = 0 V, VCC = 0 V or 3.6 V, VIN = 12 V
DE = 0 V, VCC = 0 V or 3.6 V, VIN = -7 V
−7 V < VCM < +12 V
−100
96
Line Input Resistance
Logic Outputs
RIN
Output Voltage Low
Output Voltage High
VOL
VOH
0.2
0.4
V
V
IO = 1.5 mA, VA − VB = −0.2 V
IO = −1.5 mA, VA − VB = 0.2 V
VCC − 0.3 VCC − 0.2
Short-Circuit Current
100
mA
COMMON-MODE TRANSIENT IMMUNITY1
25
kV/μs VCM = 1 kV, transient magnitude = 800 V
1 CM is the maximum common-mode voltage slew rate that can be sustained while maintaining specification-compliant operation. VCM is the common-mode potential
difference between the logic and bus sides. The transient magnitude is the range over which the common-mode is slewed. The common-mode voltage slew rates
apply to both rising and falling common-mode voltage edges.
Rev. 0 | Page 3 of 20
AꢂM2582ꢁ/AꢂM2587ꢁ
ADM2582E TIMING SPECIFICATIONS
TA = −40°C to +85°C.
Table 2.
Parameter
Symbol Min Typ Max Unit
Test Conditions
DRIVER
Maximum Data Rate
Propagation Delay, Low to High
Propagation Delay, High to Low
Output Skew
Rise Time/Fall Time
Enable Time
16
Mbps
ns
ns
ns
ns
tDPLH
tDPHL
tSKEW
tDR, tDF
tZL, tZH
tLZ, tHZ
63
64
1
100
100
8
15
120
150
RL = 54 Ω, CL1 = C L2 = 100 pF, see Figure 25 and Figure 29
RL = 54 Ω, CL1 = C L2 = 100 pF, see Figure 25 and Figure 29
RL = 54 Ω, CL1 = CL2 = 100 pF, see Figure 25 and Figure 29
RL = 54 Ω, CL1 = CL2 = 100 pF, see Figure 25 and Figure 29
RL = 110 Ω, CL = 50 pF, see Figure 26 and Figure 31
RL = 110 Ω, CL = 50 pF, see Figure 26 and Figure 31
ns
ns
Disable Time
RECEIVER
Propagation Delay, Low to High
Propagation Delay, High to Low
Output Skew1
Enable Time
Disable Time
tRPLH
tRPHL
tSKEW
tZL, tZH
tLZ, tHZ
94
95
1
110
110
12
15
15
ns
ns
ns
ns
ns
CL = 15 pF, see Figure 27 and Figure 30
CL = 15 pF, see Figure 27 and Figure 30
CL = 15 pF, see Figure 27 and Figure 30
RL = 1 kΩ, CL = 15 pF, see Figure 28 and Figure 32
RL = 1 kΩ, CL = 15 pF, see Figure 28 and Figure 32
1 Guaranteed by design.
ADM2587E TIMING SPECIFICATIONS
TA = −40°C to +85°C.
Table 3.
Parameter
Symbol
Min Typ Max
Unit
Test Conditions
DRIVER
Maximum Data Rate
Propagation Delay, Low to High tDPLH
Propagation Delay, High to Low tDPHL
Output Skew
Rise Time/Fall Time
Enable Time
500
250
250
kbps
ns
ns
503
510
7
700
700
100
RL = 54 Ω, CL1 = C L2 = 100 pF, see Figure 25 and Figure 29
RL = 54 Ω, CL1 = C L2 = 100 pF, see Figure 25 and Figure 29
RL = 54 Ω, CL1 = CL2 = 100 pF, see Figure 25 and Figure 29
RL = 54 Ω, CL1 = CL2 = 100 pF, see Figure 25 and Figure 29
RL = 110 Ω, CL = 50 pF, see Figure 26 and Figure 31
RL = 110 Ω, CL = 50 pF, see Figure 26 and Figure 31
tSKEW
ns
tDR, tDF
tZL, tZH
tLZ, tHZ
200
1100 ns
2.5
200
μs
ns
Disable Time
RECEIVER
Propagation Delay, Low to High tRPLH
Propagation Delay, High to Low tRPHL
91
95
4
200
200
30
15
15
ns
ns
ns
ns
ns
CL = 15 pF, see Figure 27 and Figure 30
CL = 15 pF, see Figure 27 and Figure 30
CL = 15 pF, see Figure 27 and Figure 30
RL = 1 kΩ, CL = 15 pF, see Figure 28 and Figure 32
RL = 1 kΩ, CL = 15 pF, see Figure 28 and Figure 32
Output Skew
Enable Time
Disable Time
tSKEW
tZL, tZH
tLZ, tHZ
ADM2582E/ADM2587E PACKAGE CHARACTERISTICS
Table 4.
Parameter
Symbol
RI-O
CI-O
Min
Typ
1012
3
Max
Unit
Ω
pF
Test Conditions
Resistance (Input-to-Output)1
Capacitance (Input-to-Output)1
Input Capacitance2
f = 1 MHz
CI
4
pF
Input IC Junction-to-Case Thermal Resistance
θJCI
33
°C/W
Thermocouple located at center of
package underside
Output IC Junction-to-Case Thermal Resistance
θJCO
28
°C/W
Thermocouple located at center of
package underside
1 Device considered a 2-terminal device: short together Pin 1 to Pin 10 and short together Pin 11 to Pin 20.
2 Input capacitance is from any input data pin to ground.
Rev. 0 | Page 4 of 20
AꢂM2582ꢁ/AꢂM2587ꢁ
ADM2582E/ADM2587E REGULATORY INFORMATION
Table 5. Pending ADM2582E/ADM2587E Approvals
Organization Approval Type
Notes
UL
To be recognized under the Component
Recognition Program of Underwriters
Laboratories, Inc.
In accordance with UL 1577, each ADM2582E/ADM2587E is proof tested
by applying an insulation test voltage ≥ 3000 V rms for 1 second.
VDE
To be certified according to
In accordance with VDE 0884-10, each ADM2582E/ADM2587E is proof
DIN V VDE V 0884-10 (VDE V 0884-10):2006-12 tested by applying an insulation test voltage ≥ 1050 VPEAK for 1 second.
ADM2582E/ADM2587E INSULATION AND SAFETY-RELATED SPECIFICATIONS
Table 6.
Parameter
Symbol Value
Unit
Conditions
Rated Dielectric Insulation Voltage
Minimum External Air Gap (Clearance)
2500
>8.0
V rms 1-minute duration
L(I01)
L(I02)
mm
mm
Measured from input terminals to output terminals,
shortest distance through air
Measured from input terminals to output terminals,
shortest distance along body
Minimum External Tracking (Creepage)
>8.0
Minimum Internal Gap (Internal Clearance)
Tracking Resistance (Comparative Tracking Index)
Isolation Group
0.017 min mm
Insulation distance through insulation
DIN IEC 112/VDE 0303-1
Material Group (DIN VDE 0110: 1989-01, Table 1)
CTI
>175
IIIa
V
ADM2582E/ADM2587E VDE 0884 INSULATION CHARACTERISTICS (PENDING)
This isolator is suitable for basic electrical isolation only within the safety limit data. Maintenance of the safety data must be ensured by
means of protective circuits.
Table 7.
Description
Conditions
Symbol Characteristic Unit
CLASSIFICATIONS
Installation Classification per DIN VDE 0110 for
Rated Mains Voltage
≤150 V rms
≤300 V rms
≤400 V rms
I to IV
I to III
I to II
40/85/21
2
Climatic Classification
Pollution Degree
VOLTAGE
DIN VDE 0110, see Table 1
Maximum Working Insulation Voltage
Input-to-Output Test Voltage
Method b1
VIORM
VPR
560
V peak
V peak
VIORM × 1.875 = VPR, 100% production tested,
tm = 1 sec, partial discharge < 5 pC
1050
Method a
After Environmental Tests, Subgroup 1
After Input and/or Safety Test,
Subgroup 2/Subgroup 3
VIORM × 1.6 = VPR, tm = 60 sec, partial discharge < 5 pC
VIORM × 1.2 = VPR, tm = 60 sec, partial discharge < 5 pC
896
672
V peak
V peak
Highest Allowable Overvoltage
SAFETY-LIMITING VALUES
Case Temperature
Input Current
Output Current
Transient overvoltage, tTR = 10 sec
VTR
4000
V peak
Maximum value allowed in the event of a failure
TS
IS, INPUT
IS, OUTPUT 335
RS
>109
150
265
°C
mA
mA
Ω
Insulation Resistance at TS
VIO = 500 V
Rev. 0 | Page 5 of 20
AꢂM2582ꢁ/AꢂM2587ꢁ
ABSOLUTꢁ MAXIMUM RATINGS
TA = 25°C, unless otherwise noted. All voltages are relative to
their respective ground.
Table 9. Maximum Continuous Working Voltage1
Parameter
Max Unit
Reference Standard
AC Voltage
Bipolar Waveform
Table 8.
Parameter
424
600
V peak 50-year minimum
lifetime
Rating
VCC
−0.5 V to +7 V
−0.5 V to VDD + 0.5 V
−0.5 V to VDD + 0.5 V
−9 V to +14 V
−40°C to +85°C
−55°C to +150°C
15 kV
Unipolar Waveform
Basic Insulation
Digital Input Voltage (DE, RE, TxD)
Digital Output Voltage (RxD)
Driver Output/Receiver Input Voltage
Operating Temperature Range
Storage Temperature Range
V peak Maximum approved
working voltage per
IEC 60950-1 (pending)
Reinforced Insulation 560
V peak Maximum approved
working voltage per
IEC 60950-1 and
ESD (Human Body Model) on
A, B, Y, and Z pins
VDE V 0884-10
(pending)
2 kV
ESD (Human Body Model) on Other Pins
Lead Temperature
Soldering (10 sec)
Vapor Phase (60 sec)
Infrared (15 sec)
DC Voltage
Basic Insulation
600
V peak Maximum approved
working voltage per
260°C
215°C
220°C
IEC 60950-1(pending)
Reinforced Insulation 560
V peak Maximum approved
working voltage per
IEC 60950-1 and
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
VDE V 0884-10
(pending)
1 Refers to continuous voltage magnitude imposed across the isolation
barrier. See the Insulation Lifetime section for more details.
ESD CAUTION
Rev. 0 | Page 6 of 20
AꢂM2582ꢁ/AꢂM2587ꢁ
PIN CONFIGURATION ANꢂ FUNCTION ꢂꢁSCRIPTIONS
GND
1
2
3
4
5
6
7
8
9
20 GND
1
2
V
19
18
17
V
ISOIN
CC
GND
A
B
1
ADM2582E
ADM2587E
RxD
RE
16 GND
2
TOP VIEW
DE
15
Z
(Not to Scale)
TxD
14 GND
2
V
13
12
Y
V
CC
GND
1
ISOOUT
GND 10
1
11 GND
2
NOTES
1. PIN 12 AND PIN 19 MUST BE
CONNECTED EXTERNALLY.
Figure 2. Pin Configuration
Table 10. Pin Function Description
Pin No.
Mnemonic
Description
1
2
GND1
VCC
Ground, Logic Side.
Logic Side Power Supply. It is recommended that a 0.1 μF and a 10 μF decoupling capacitor be fitted between
Pin 2 and Pin 1.
3
4
GND1
RxD
Ground, Logic Side.
Receiver Output Data. This output is high when (A − B) > 200 mV and low when (A − B) < –200 mV.
The output is tristated when the receiver is disabled, that is, when RE is driven high.
5
RE
Receiver Enable Input. This is an active-low input. Driving this input low enables the receiver; driving it
high disables the receiver.
6
7
8
DE
TxD
VCC
Driver Enable Input. Driving this input high enables the driver; driving it low disables the driver.
Driver Input. Data to be transmitted by the driver is applied to this input.
Logic Side Power Supply. It is recommended that a 0.1 μF and a 0.01 μF decoupling capacitor be fitted between
Pin 8 and Pin 7.
9
GND1
GND1
GND2
VISOOUT
Ground, Logic Side.
Ground, Logic Side.
Ground, Bus Side.
10
11
12
Isolated Power Supply Output. This pin must be connected externally to VISOIN. It is recommended that a reservoir
capacitor of 10 μF and a decoupling capacitor of 0.1 μF be fitted between Pin 12 and Pin 11.
13
14
15
16
17
18
19
Y
Driver Noninverting Output
Ground, Bus Side.
Driver Inverting Output
Ground, Bus Side.
Receiver Inverting Input.
Receiver Noninverting Input.
Isolated Power Supply Input. This pin must be connected externally to VISOOUT. It is recommended that a
0.1 μF and a 0.01 μF decoupling capacitor be fitted between Pin 19 and Pin 20.
GND2
Z
GND2
B
A
VISOIN
20
GND2
Ground, Bus Side.
Rev. 0 | Page 7 of 20
AꢂM2582ꢁ/AꢂM2587ꢁ
TYPICAL PꢁRFORMANCꢁ CHARACTꢁRISTICS
180
120
100
80
60
40
20
0
160
R
= 54Ω
L
140
120
100
80
R
R
= 54Ω
L
R
= 120Ω
L
= 120Ω
L
NO LOAD
60
NO LOAD
40
20
0
–40
–15
10
35
60
85
85
85
–40
–15
10
35
60
85
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 3. ADM2582E Supply Current (ICC) vs. Temperature
(Data Rate = 16 Mbps, DE = 3.3 V, VCC = 3.3 V)
Figure 6. ADM2587E Supply Current (ICC) vs. Temperature
(Data Rate = 500 kbps, DE = 3.3 V, VCC = 3.3 V)
72
70
68
66
64
62
60
58
56
54
52
50
140
120
100
80
R
= 54Ω
L
L
R
= 120Ω
tDPHL
tDPLH
60
NO LOAD
40
20
0
–40
–40
–15
10
35
60
85
–15
10
35
60
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 7. ADM2582E Differential Driver Propagation Delay vs. Temperature
Figure 4. ADM2582E Supply Current (ICC) vs. Temperature
(Data Rate = 16 Mbps, DE = 5 V, VCC = 5 V)
600
580
560
140
120
100
80
60
40
20
0
R
R
= 54Ω
L
540
tDPLH
520
tDPHL
= 120Ω
L
500
480
460
440
420
400
NO LOAD
–40
–15
10
35
60
85
–40
–15
10
35
60
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 8. ADM2587E Differential Driver Propagation Delay vs. Temperature
Figure 5. ADM2587E Supply Current (ICC) vs. Temperature
(Data Rate = 500 kbps, DE = 5 V, VCC = 5 V)
Rev. 0 | Page 8 of 20
AꢂM2582ꢁ/AꢂM2587ꢁ
60
50
40
30
20
10
0
TxD
1
Z
Y
3
CH1 2.0V CH2 2.0V
CH3 2.0V
M10.00ns
A CH1
1.28V
0
1
2
3
4
5
OUTPUT VOLTAGE (V)
Figure 9. ADM2582E Driver Propagation Delay
Figure 12. Receiver Output Current vs. Receiver Output Low Voltage
4.75
4.74
4.73
4.72
4.71
4.70
4.69
4.68
4.67
TxD
1
Z
Y
3
4.66
4.65
CH1 2.0V CH2 2.0V
CH3 2.0V
M200ns
A
CH1
2.56V
–40
–15
10
35
60
85
TEMPERATURE (°C)
Figure 10. ADM2587E Driver Propagation Delay
Figure 13. Receiver Output High Voltage vs. Temperature
0
0.32
–10
–20
–30
–40
–50
–60
–70
0.30
0.28
0.26
0.24
0.22
0.20
0
1
2
3
4
5
–40
–15
10
35
60
85
OUTPUT VOLTAGE (V)
TEMPERATURE (°C)
Figure 11. Receiver Output Current vs. Receiver Output High Voltage
Figure 14. Receiver Output Low Voltage vs. Temperature
Rev. 0 | Page 9 of 20
AꢂM2582ꢁ/AꢂM2587ꢁ
100
99
98
97
96
95
94
93
92
91
90
B
A
tRPHL
1
RxD
tRPLH
3
CH1 2.0V CH2 2.0V
CH3 2.0V
M10.00ns
A
CH1
2.56V
–40
–15
10
35
60
85
TEMPERATURE (°C)
Figure 15. ADM2582E Receiver Propagation Delay
Figure 18. ADM2587E Receiver Propagation Delay vs. Temperature
3.33
3.32
3.31
3.30
A
B
1
3.29
NO LOAD
R
R
= 120Ω
= 54Ω
3.28
3.27
3.26
L
L
RxD
3
CH1 2.0V CH2 2.0V
CH3 2.0V
M10.00ns
A
CH1
2.56V
–40
–15
10
35
60
85
TEMPERATURE (°C)
Figure 19. ADM2582E Isolated Supply Voltage vs. Temperature
(VCC = 3.3 V, Data Rate = 16 Mbps)
Figure 16. ADM2587E Receiver Propagation Delay
98
3.36
3.35
3.34
3.33
3.32
3.31
3.30
3.29
97
96
95
94
93
92
tRPHL
tRPLH
NO LOAD
3.28
3.27
3.26
R
R
= 120Ω
= 54Ω
L
L
–40
–15
10
35
60
85
–40
–15
10
35
60
85
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 17. ADM2582E Receiver Propagation Delay vs. Temperature
Figure 20. ADM2582E Isolated Supply Voltage vs. Temperature
(VCC = 5 V, Data Rate = 16 Mbps)
Rev. 0 | Page 10 of 20
AꢂM2582ꢁ/AꢂM2587ꢁ
60
50
40
30
20
10
0
40
35
30
25
20
15
10
5
R
R
= 54Ω
L
R
R
= 54Ω
L
= 120Ω
L
= 120Ω
L
NO LOAD
NO LOAD
0
–40
–40
–15
10
35
60
85
–15
10
35
60
85
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 21. ADM2582E Isolated Supply Current vs. Temperature
(VCC = 3.3 V, Data Rate = 16 Mbps)
Figure 22. ADM2587E Isolated Supply Current vs. Temperature
(VCC = 3.3 V, Data Rate = 500 kbps)
Rev. 0 | Page 11 of 20
AꢂM2582ꢁ/AꢂM2587ꢁ
TꢁST CIRCUITS
Y
R
L
2
TxD
V
OD2
V
V
CC
OUT
R
L
Y
Z
R
110Ω
Z
2
L
V
OC
TxD
DE
S1
S2
C
L
50pF
Figure 23. Driver Voltage Measurement
Figure 26. Driver Enable/Disable
Y
375Ω
A
V
TxD
60Ω
OD3
375Ω
V
Z
OUT
V
TEST
RE
B
C
L
Figure 24. Driver Voltage Measurement
Figure 27. Receiver Propagation Delay
V
Y
+1.5V
–1.5V
CC
C
C
L
L
S1
TxD
R
L
R
L
S2
Z
RE
C
V
OUT
L
RE IN
Figure 25. Driver Propagation Delay
Figure 28. Receiver Enable/Disable
Rev. 0 | Page 12 of 20
AꢂM2582ꢁ/AꢂM2587ꢁ
SWITCHING CHARACTꢁRISTICS
V
CC
V
/2
V
/2
CC
CC
0V
Z
tDPLH
tDPHL
V
CC
0.5V
tZL
0.5V
CC
CC
1/2V
DE
O
V
O
0V
tLZ
2.3V
2.3V
Y
Y, Z
Y, Z
+V
V
OL
+ 0.5V
– 0.5V
O
90% POINT
90% POINT
V
= V – V
(Y) (Z)
V
DIFF
OL
V
DIFF
tZH
tHZ
V
10% POINT
10% POINT
OH
–V
O
V
OH
tDF
tDR
t
= │t
– t
│
SKEW
DPHL
DPLH
Figure 29. Driver Propagation Delay, Rise/Fall Timing
Figure 31. Driver Enable/Disable Timing
0.7V
0.3V
CC
CC
0.5V
tZL
0.5V
CC
CC
RE
A – B
0V
0V
tLZ
1.5V
1.5V
RO
V
V
+ 0.5V
tRPLH
tRPHL
OL
OUTPUT LOW
OUTPUT HIGH
V
OL
V
V
OH
tZH
tHZ
V
OH
RxD
1.5V
1.5V
tSKEW = |tRPLH
–
tRPHL
|
– 0.5V
OH
RO
0V
OL
Figure 32. Receiver Enable/Disable Timing
Figure 30. Receiver Propagation Delay
Rev. 0 | Page 13 of 20
AꢂM2582ꢁ/AꢂM2587ꢁ
CIRCUIT ꢂꢁSCRIPTION
Table 13. Receiving (see Table 11 for Abbreviations)
Inputs Output
SIGNAL ISOLATION
The ADM2582E/ADM2587E signal isolation is implemented on
the logic side of the interface. The part achieves signal isolation
by having a digital isolation section and a transceiver section
(see Figure ±). Data applied to the TxD and DE pins and referenced
to logic ground (GND±) are coupled across an isolation barrier
to appear at the transceiver section referenced to isolated ground
(GND2). Similarly, the single-ended receiver output signal,
referenced to isolated ground in the transceiver section, is
coupled across the isolation barrier to appear at the RXD pin
referenced to logic ground.
A − B
RE
RxD
> −0.03 V
< −0.2 V
−0.2 V < A − B < −0.03 V
L or NC
L or NC
L or NC
L or NC
H
H
L
X
H
Z
H
L
Inputs open
X
X
X
L or NC
L or NC
THERMAL SHUTDOWN
POWER ISOLATION
The ADM2582E/ADM2587E contain thermal shutdown circuitry
that protects the parts from excessive power dissipation during
fault conditions. Shorting the driver outputs to a low impedance
source can result in high driver currents. The thermal sensing
circuitry detects the increase in die temperature under this
condition and disables the driver outputs. This circuitry is
designed to disable the driver outputs when a die temperature
of ±50°C is reached. As the device cools, the drivers are reenabled
at a temperature of ±40°C.
The ADM2582E/ADM2587E power isolation is implemented
using an isoPower integrated isolated dc-to-dc converter. The
dc-to-dc converter section of the ADM2582E/ADM2587E works
on principles that are common to most modern power supplies.
It is a secondary side controller architecture with isolated pulse-
width modulation (PWM) feedback. VCC power is supplied to
an oscillating circuit that switches current into a chip-scale air
core transformer. Power transferred to the secondary side is
rectified and regulated to 3.3 V. The secondary (VISO) side
controller regulates the output by creating a PWM control
signal that is sent to the primary (VCC) side by a dedicated
iCoupler data channel. The PWM modulates the oscillator
circuit to control the power being sent to the secondary side.
Feedback allows for significantly higher power and efficiency.
OPEN- AND SHORT-CIRCUIT, FAIL-SAFE RECEIVER
INPUTS
The receiver inputs have open- and short-circuit, fail-safe
features that ensure that the receiver output is high when the
inputs are open or shorted. During line-idle conditions, when no
driver on the bus is enabled, the voltage across a terminating
resistance at the receiver input decays to 0 V. With traditional
transceivers, receiver input thresholds specified between −200 mV
and +200 mV mean that external bias resistors are required on the
A and B pins to ensure that the receiver outputs are in a known
state. The short-circuit, fail-safe receiver input feature eliminates
the need for bias resistors by specifying the receiver input
threshold between −30 mV and −200 mV. The guaranteed negative
threshold means that when the voltage between A and B decays
to 0 V, the receiver output is guaranteed to be high.
TRUTH TABLES
The truth tables in this section use the abbreviations found in
Table ±±.
Table 11. Truth Table Abbreviations
Letter
Description
H
L
High level
Low level
X
Don’t care
Z
NC
High impedance (off)
Disconnected
Table 12. Transmitting (see Table 11 for Abbreviations)
Inputs
Outputs
DE
H
H
L
X
L
TxD
Y
H
L
Z
Z
Z
Z
Z
L
H
L
X
X
X
X
H
Z
Z
Z
Z
X
Rev. 0 | Page 14 of 20
AꢂM2582ꢁ/AꢂM2587ꢁ
100
10
DC CORRECTNESS AND MAGNETIC FIELD IMMUNITY
The digital signals transmit across the isolation barrier using
iCoupler technology. This technique uses chip-scale transformer
windings to couple the digital signals magnetically from one
side of the barrier to the other. Digital inputs are encoded into
waveforms that are capable of exciting the primary transformer
winding. At the secondary winding, the induced waveforms are
decoded into the binary value that was originally transmitted.
1
0.1
Positive and negative logic transitions at the isolator input cause
narrow (~± ns) pulses to be sent to the decoder via the transformer.
The decoder is bistable and is, therefore, either set or reset by
the pulses, indicating input logic transitions. In the absence of
logic transitions at the input for more than ± μs, periodic sets of
refresh pulses indicative of the correct input state are sent to
ensure dc correctness at the output. If the decoder receives no
internal pulses of more than approximately 5 ꢀs, the input side
is assumed to be unpowered or nonfunctional, in which case,
the isolator output is forced to a default state by the watchdog
timer circuit.
0.01
0.001
1k
10k
100k
1M
10M
100M
MAGNETIC FIELD FREQUENCY (Hz)
Figure 33. Maximum Allowable External Magnetic Flux Density
For example, at a magnetic field frequency of ± MHz, the
maximum allowable magnetic field of 0.2 kgauss induces a
voltage of 0.25 V at the receiving coil. This is about 50% of the
sensing threshold and does not cause a faulty output transition.
Similarly, if such an event occurs during a transmitted pulse
(and is of the worst-case polarity), it reduces the received pulse
from >±.0 V to 0.75 V, which is still well above the 0.5 V sensing
threshold of the decoder.
This situation should occur in the ADM2582E/ADM2587E devices
only during power-up and power-down operations. The limitation
on the ADM2582E/ADM2587E magnetic field immunity is set
by the condition in which induced voltage in the transformer
receiving coil is sufficiently large to either falsely set or reset the
decoder. The following analysis defines the conditions under
which this can occur.
The preceding magnetic flux density values correspond
to specific current magnitudes at given distances from the
ADM2582E/ADM2587E transformers. Figure 34 expresses
these allowable current magnitudes as a function of frequency
for selected distances. As shown in Figure 34, the ADM2582E/
ADM2587E are extremely immune and can be affected only by
extremely large currents operated at high frequency very close
to the component. For the ± MHz example, a 0.5 kA current must
be placed 5 mm away from the ADM2582E/ADM2587E to affect
The 3.3 V operating condition of the ADM2582E/ADM2587E
is examined because it represents the most susceptible mode of
operation. The pulses at the transformer output have an amplitude
of >±.0 V. The decoder has a sensing threshold of about 0.5 V,
thus establishing a 0.5 V margin in which induced voltages can
be tolerated. The voltage induced across the receiving coil is
given by
component operation.
1k
V = (−dβ/dt)Σπrn2; n = ±, 2, … , N
DISTANCE = 1m
100
where:
β is magnetic flux density (gauss).
N is the number of turns in the receiving coil.
rn is the radius of the nth turn in the receiving coil (cm).
10
DISTANCE = 100mm
Given the geometry of the receiving coil in the ADM2582E/
ADM2587E and an imposed requirement that the induced
voltage be, at most, 50% of the 0.5 V margin at the decoder, a
maximum allowable magnetic field is calculated as shown in
Figure 33.
1
DISTANCE = 5mm
0.1
0.01
1k
10k
100k
1M
10M
100M
MAGNETIC FIELD FREQUENCY (Hz)
Figure 34. Maximum Allowable Current for Various Current-to-
ADM2582E/ADM2587E Spacings
Note that in combinations of strong magnetic field and high
frequency, any loops formed by printed circuit board (PCB)
traces can induce error voltages sufficiently large to trigger the
thresholds of succeeding circuitry. Take care in the layout of
such traces to avoid this possibility.
Rev. 0 | Page 15 of 20
AꢂM2582ꢁ/AꢂM2587ꢁ
APPLICATIONS INFORMATION
The ADM2582E/ADM2587E dissipate approximately 650 mW
of power when fully loaded. Because it is not possible to apply
a heat sink to an isolation device, the devices primarily depend
on heat dissipation into the PCB through the GND pins. If the
devices are used at high ambient temperatures, provide a thermal
path from the GND pins to the PCB ground plane. The board
layout in Figure 35 shows enlarged pads for Pin ±, Pin 3, Pin 9,
Pin ±0, Pin ±±, Pin ±4, Pin ±6, and Pin 20. Implement multiple
vias from the pad to the ground plane to reduce the temperature
inside the chip significantly. The dimensions of the expanded
pads are at the discretion of the designer and dependent on the
available board space.
PCB LAYOUT
The ADM2582E/ADM2587E isolated RS-422/RS-485 transceiver
contains an isoPower integrated dc-to-dc converter, requiring
no external interface circuitry for the logic interfaces. Power
supply bypassing is required at the input and output supply pins
(see Figure 35). The power supply section of the ADM2582E/
ADM2587E uses an ±80 MHz oscillator frequency to pass power
efficiently through its chip-scale transformers. In addition, the
normal operation of the data section of the iCoupler introduces
switching transients on the power supply pins.
Bypass capacitors are required for several operating frequencies.
Noise suppression requires a low inductance, high frequency
capacitor, whereas ripple suppression and proper regulation
require a large value capacitor. These capacitors are connected
between Pin ± (GND±) and Pin 2 (VCC) and Pin 8 (VCC) and
Pin 9 (GND±) for VCC. The VISOIN and VISOOUT capacitors are
connected between Pin ±± (GND2) and Pin ±2 (VISOOUT) and
Pin ±9 (VISOIN) and Pin 20 (GND2). To suppress noise and reduce
ripple, a parallel combination of at least two capacitors is required.
The recommended capacitor values are 0.± μF and ±0 μF. The
recommended best practice is to use a very low inductance
ceramic capacitor, or its equivalent, for the smaller value. The
total lead length between both ends of the capacitor and the
input power supply pin should not exceed ±0 mm.
EMI CONSIDERATIONS
The dc-to-dc converter section of the ADM2582E/ADM2587E
components must, of necessity, operate at very high frequency
to allow efficient power transfer through the small transformers.
This creates high frequency currents that can propagate in circuit
board ground and power planes, causing edge and dipole radiation.
Grounded enclosures are recommended for applications that use
these devices. If grounded enclosures are not possible, good RF
design practices should be followed in the layout of the PCB.
See Application Note AN-097±, Control of Radiated Emissions
with isoPower Devices, for more information.
INSULATION LIFETIME
All insulation structures eventually break down when subjected to
voltage stress over a sufficiently long period. The rate of insulation
degradation is dependent on the characteristics of the voltage
waveform applied across the insulation. Analog Devices conducts
an extensive set of evaluations to determine the lifetime of the
insulation structure within the ADM2582E/ADM2587E.
GND
1
2
20
19
18
17
16
15
14
13
12
11
GND
2
1
V
V
ISOIN
CC
GND
3
A
B
1
RxD
RE
4
5
GND
Z
2
DE
6
TxD
7
GND
Y
2
V
8
CC
Accelerated life testing is performed using voltage levels higher
than the rated continuous working voltage. Acceleration factors for
several operating conditions are determined, allowing calculation
of the time to failure at the working voltage of interest. The values
shown in Table 9 summarize the peak voltages for 50 years of
service life in several operating conditions. In many cases, the
working voltage approved by agency testing is higher than the
50-year service life voltage. Operation at working voltages higher
than the service life voltage listed leads to premature insulation
failure.
GND
9
V
ISOOUT
1
1
GND
10
GND
2
Figure 35. Recommended PCB Layout
In applications involving high common-mode transients, ensure
that board coupling across the isolation barrier is minimized.
Furthermore, design the board layout such that any coupling
that does occur equally affects all pins on a given component
side. Failure to ensure this can cause voltage differentials between
pins exceeding the absolute maximum ratings for the device,
thereby leading to latch-up and/or permanent damage.
The insulation lifetime of the ADM2582E/ADM2587E depends
on the voltage waveform type imposed across the isolation barrier.
The iCoupler insulation structure degrades at different rates,
depending on whether the waveform is bipolar ac, unipolar ac,
or dc. Figure 36, Figure 37, and Figure 38 illustrate these different
isolation voltage waveforms.
Bipolar ac voltage is the most stringent environment. A 50-year
operating lifetime under the bipolar ac condition determines
the Analog Devices recommended maximum working voltage.
Rev. 0 | Page 16 of 20
AꢂM2582ꢁ/AꢂM2587ꢁ
In the case of unipolar ac or dc voltage, the stress on the insulation
is significantly lower. This allows operation at higher working
voltages while still achieving a 50-year service life. The working
voltages listed in Table 9 can be applied while maintaining the
50-year minimum lifetime, provided the voltage conforms to either
the unipolar ac or dc voltage cases. Any crossinsulation voltage
waveform that does not conform to Figure 37 or Figure 38 should
be treated as a bipolar ac waveform, and its peak voltage should
be limited to the 50-year lifetime voltage value listed in Table 9.
RATED PEAK VOLTAGE
ISOLATED POWER SUPPLY CONSIDERATIONS
The typical output voltage of the integrated isoPower dc-to-dc
isolated supply is 3.3 V. The isolated supply in the ADM2587E
is capable of supplying a current of 55 mA when the junction
temperature of the device is kept below ±20°C. It is important
to note that the current available on the VISOOUT pin is the total
current available and includes the current required to supply the
internal RS-485 circuitry.
The ADM2587E can typically supply ±5 mA externally on
V
ISOOUT when the driver is switching at 500 kbps loaded with 54 Ω,
0V
while the junction temperature of the part is less than ±20°C.
Table 14. Typical Maximum External Current Available
Figure 36. Bipolar AC Waveform
on VISOOUT
RATED PEAK VOLTAGE
External Load
Current (mA)
RT
System Configuration
0V
15
54 Ω
Double terminated bus with
RT = 110 Ω
Single terminated bus
Unterminated bus
Figure 37. DC Waveform
RATED PEAK VOLTAGE
29
46
120 Ω
Unloaded
The ADM2582E typically has no current available externally
on VISOOUT
0V
.
NOTES
1. THE VOLTAGE IS SHOWN AS SINUSODIAL FOR ILLUSTRATION
PURPOSES ONLY. IT IS MEANT TO REPRESENT ANY VOLTAGE
WAVEFORM VARYING BETWEEN 0 AND SOME LIMITING VALUE.
THE LIMITING VALUE CAN BE POSITIVE OR NEGATIVE, BUT THE
VOLTAGE CANNOT CROSS 0V.
When external current is drawn from the VISOOUT pin, there is
an increased risk of generating radiated emissions due to the
high frequency switching elements used in the isoPower dc to-
dc converter. Special care must be taken during PCB layout to
meet emissions standards. See Application Note AN-097±,
Control of Radiated Emissions with isoPower Devices, for details
on board layout considerations.
Figure 38. Unipolar AC Waveform
V
CC
V
EXTERNAL
LOAD
V
ISOOUT
CC
isoPower DC-TO-DC CONVERTER
GND
GND
1
OSCILLATOR
RECTIFIER
GND
2
V
ISOIN
REGULATOR
TRANSCEIVER
DIGITAL ISOLATION iCoupler
Y
TxD
DE
500kbps
ENCODE
DECODE
DECODE
ENCODE
D
Z
V
CC
R
T
ENCODE
DECODE
A
B
RxD
RE
R
ADM2582E/ADM2587E
ISOLATION
BARRIER
GND
GND
2
1
Figure 39. ADM2587E Typical Maximum External Current Measurements
Rev. 0 | Page 17 of 20
AꢂM2582ꢁ/AꢂM2587ꢁ
3.3V/5V POWER
SUPPLY
100nF
10µF
100nF
10nF
100nF
10µF
V
V
CC
ISOOUT
V
CC
isoPower DC-TO-DC CONVERTER
OSCILLATOR
RECTIFIER
V
ISOIN
100nF 10nF
REGULATOR
DIGITAL ISOLATION
ENCODE
i
Coupler
TRANSCEIVER
D
Y
TxD
DE
R
R
DECODE
DECODE
ENCODE
Z
T
MICROCONTROLLER
AND UART
ENCODE
DECODE
A
B
RxD
R
T
RE
ADM2582E/ADM2587E
GND
GND
2
1
ISOLATION
BARRIER
GND
1
Figure 40. Example Circuit Diagram Using the ADM2582E/ADM2587E
Figure 40 is an example of a circuit diagram using the ADM2582E/ADM2587E.
Rev. 0 | Page 18 of 20
AꢂM2582ꢁ/AꢂM2587ꢁ
TYPICAL APPLICATIONS
Figure 4± and Figure 42 show typical applications of the ADM2582E/
ADM2587E in half duplex and full duplex RS-485 network
configurations. Up to 256 transceivers can be connected to the
RS-485 bus. To minimize reflections, terminate the line at the
receiving end in its characteristic impedance, and keep stub
lengths off the main line as short as possible. For half-duplex
operation, this means that both ends of the line must be
terminated because either end can be the receiving end.
MAXIMUM NUMBER OF TRANSCEIVERS ON BUS = 256
ADM2582E/
ADM2587E
ADM2582E/
ADM2587E
A
B
A
RxD
RxD
R
R
B
RE
RE
DE
R
T
R
T
DE
Z
Y
Z
TxD
TxD
D
D
Y
A
B
Z
Y
A
B
Z
Y
R
R
D
D
ADM2582E/
ADM2587E
ADM2582E/
ADM2587E
RxD RE DE TxD
RxD RE DE TxD
NOTES
1. R IS EQUAL TO THE CHARACTERISTIC IMPEDANCE OF THE CABLE.
T
2. ISOLATION NOT SHOWN.
Figure 41. ADM2582E/ADM2587E Typical Half Duplex RS-485 Network
MAXIMUM NUMBER OF NODES = 256
MASTER
R
SLAVE
A
B
Z
Y
Z
RxD
RE
D
TxD
DE
R
T
B
A
DE
RE
R
T
D
TxD
R
RxD
Y
ADM2582E/
ADM2587E
ADM2582E/
ADM2587E
A
B
Z
Y
A
B
Z
Y
SLAVE
SLAVE
R
R
D
D
ADM2582E/
ADM2587E
ADM2582E/
ADM2587E
RxD RE DE TxD
RxD RE DE TxD
NOTES
1. R IS EQUAL TO THE CHARACTERISTIC IMPEDANCE OF THE CABLE.
T
2. ISOLATION NOT SHOWN.
Figure 42. ADM2582E/ADM2587E Typical Full Duplex RS-485 Network
Rev. 0 | Page 19 of 20
AꢂM2582ꢁ/AꢂM2587ꢁ
OUTLINꢁ ꢂIMꢁNSIONS
13.00 (0.5118)
12.60 (0.4961)
20
1
11
10
7.60 (0.2992)
7.40 (0.2913)
10.65 (0.4193)
10.00 (0.3937)
0.75 (0.0295)
0.25 (0.0098)
45°
2.65 (0.1043)
2.35 (0.0925)
0.30 (0.0118)
0.10 (0.0039)
8°
0°
COPLANARITY
0.10
SEATING
PLANE
0.51 (0.0201)
0.31 (0.0122)
1.27 (0.0500)
0.40 (0.0157)
1.27
(0.0500)
BSC
0.33 (0.0130)
0.20 (0.0079)
COMPLIANT TO JEDEC STANDARDS MS-013-AC
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 43. 20-Lead Standard Small Outline Package [SOIC_W]
Wide Body
(RW-20)
Dimensions shown in millimeters and (inches)
ORDERING GUIDE
Model
Data Rate (Mbps)
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
20-Lead SOIC_W
20-Lead SOIC_W
20-Lead SOIC_W
20-Lead SOIC_W
Package Option
RW-20
RW-20
ADM2582EBRWZ1
ADM2582EBRWZ-REEL71
ADM2587EBRWZ1
ADM2587EBRWZ-REEL71
EVAL-ADM2582EEBZ1
EVAL-ADM2587EEBZ1
16
16
0.5
0.5
RW-20
RW-20
ADM2582E Evaluation Board
ADM2587E Evaluation Board
1 Z = RoHS Compliant Part.
©2009 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D08111-0-9/09(0)
Rev. 0 | Page 20 of 20
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