HMC434 [ADI]
HMC434;
ADI 
0.2 GHz to 8 GHz, GaAs, HBT MMIC,
Divide by 8 Prescaler
HMC434
Data Sheet
FEATURES
FUNCTIONAL BLOCK DIAGRAM
VCC
Ultralow SSB phase noise: −150 dBc/Hz typical
Single-ended input/outputs
HMC434
Output power: −2 dBm typical
Single supply operation: 3 V
Ultrasmall, surface-mount, 2.90 mm × 2.80 mm, 6-lead SOT-23
package
IN
÷8
OUT
APPLICATIONS
GND
DC to C band PLL prescalers
Figure 1.
Very small aperture terminal (VSAT) radios
Unlicensed national information infrastructure (UNII) and
point to point radios
IEEE 802.11a and high performance radio local area network
(HiperLAN) WLAN
Fiber optics
Cellular/3G infrastructure
GENERAL DESCRIPTION
The HMC434 is a low noise, static, divide by 8 prescaler
monolithic microwave integrated circuit (MMIC) utilizing
indium gallium phosphide/gallium arsenide (InGaP/GaAs)
heterojunction bipolar transistor (HBT) technology in an
ultrasmall surface-mount 6-lead SOT-23 package.
The HMC434 features single-ended inputs and outputs for
reduced component count and cost. The low additive single
sideband (SSB) phase noise of −150 dBc/Hz at 100 kHz offset
helps the user maintain optimal system noise performance.
The HMC434 operates from near dc (square wave) or 200 MHz
(sine wave) to 8 GHz input frequency with a single 3 V dc supply.
Rev. F
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Technical Support
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HMC434* PRODUCT PAGE QUICK LINKS
Last Content Update: 08/30/2017
COMPARABLE PARTS
View a parametric search of comparable parts.
DESIGN RESOURCES
• HMC434 Material Declaration
• PCN-PDN Information
EVALUATION KITS
• HMC434 Evaluation Board
• Quality And Reliability
• Symbols and Footprints
DOCUMENTATION
Application Notes
DISCUSSIONS
View all HMC434 EngineerZone Discussions.
• AN-1463: Frequency Divider Operation and
Compensation with No Input Signal
SAMPLE AND BUY
Visit the product page to see pricing options.
Data Sheet
• HMC434-DSCC: Military Data Sheet
• HMC434-EP: Enhanced Product Data Sheet
TECHNICAL SUPPORT
• HMC434: 0.2 GHz to 8 GHz, GaAs, HBT MMIC, Divide by 8
Prescaler Data Sheet
Submit a technical question or find your regional support
number.
TOOLS AND SIMULATIONS
DOCUMENT FEEDBACK
• ADIsimPLL™
Submit feedback for this data sheet.
REFERENCE MATERIALS
Quality Documentation
• HMC Legacy PCN: SOT26 and SOT26E packages -
Relocation of pre-existing production equipment to new
building
• Package/Assembly Qualification Test Report: Plastic
Encapsulated SOT26 (QTR: 02017 REV: 01)
• PCN: MS, QS, SOT, SOIC Packages - Sn/Pb Plating Vendor
Change
• Semiconductor Qualification Test Report: GaAs HBT-A
(QTR: 2013-00228)
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HMC434
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Pin Configuration and Function Descriptions..............................5
Interface Schematics .....................................................................5
Typical Performance Characteristics ..............................................6
Applications Information .................................................................7
Evaluation Board PCB..................................................................7
PCB Material Stackup...................................................................8
Outline Dimensions..........................................................................9
Ordering Guide .............................................................................9
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 4
Thermal Resistance ...................................................................... 4
ESD Caution.................................................................................. 4
REVISION HISTORY
8/2017—Rev. E to Rev. F
Added Endnote 2, Table 1................................................................ 3
This Hittite Microwave Products data sheet has been reformatted
to meet the styles and standards of Analog Devices, Inc.
3/2017—Rev. 04.0410 to Rev. E
Updated Format..................................................................Universal
Changes to Features Section, Figure 1, and General Description
Section..............................................................................................................1
Changes to Table 1.............................................................................3
Changes to Table 2.............................................................................4
Added Thermal Resistance Section and Table 3; Renumbered
Sequentially ........................................................................................4
Added Figure 2; Renumbered Sequentially ...................................5
Changes to Table 4, Figure 4, Figure 5, and Figure 6....................5
Changes to Figure 7, Figure 8, Figure 9, and Figure 10................6
Added Applications Information Section ......................................7
Changes to Evaluation Board PCB Section, Table 5, and
Figure 13, and Figure 14...................................................................7
Added PCB Material Stackup Section and Figure 15 ...................8
Updated Outline Dimensions..........................................................9
Change to Ordering Guide...............................................................9
Rev. F | Page 2 of 9
Data Sheet
HMC434
SPECIFICATIONS
VCC = 3 V, TA = 25°C, 50 Ω system, unless otherwise noted. PIN is input power.
Table 1.
Parameter
Min
Typ
Max
Unit
Test Conditions / Comments
RADIO FREQUENCY (RF) INPUT
Frequency 1, 2
Power
0.2
–10
0
8
+10
10
GHz
dBm
dBm
Sine wave input
fIN = 1.0 GHz to 3.0 GHz
fIN = 3.0 GHz to 8.0 GHz
0
0
RF OUTPUT
SSB Phase Noise
Power
−150
–2
dBc/Hz
dBm
100 kHz offset, PIN = 0 dBm, fIN = 4.0 GHz
fIN = 1.0 GHz to 8.0 GHz
–5
REVERSE LEAKAGE
SUPPLY
−25
dBm
PIN = 0 dBm, fIN = 4.0 GHz, output terminated
Voltage (VCC)
Current (ICC)
2.85
3
62
3.15
83
V
mA
1 Below 200 MHz, a square wave input is required.
2 For stable operation without an input signal, refer to AN-1463.
Rev. F | Page 3 of 9
HMC434
Data Sheet
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 2.
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
Parameter
Rating
Supply Voltage (VCC)
RF Input Power (VCC = 3 V)
Temperature
Operating
Storage
−0.3 V to +3.5 V
13 dBm
θ
JA is the natural convection junction to ambient thermal
−40°C to +85°C
−65°C to +125°C
135°C
resistance measured in a one cubic foot sealed enclosure. θJC is
the junction to case thermal resistance.
Junction, TJ
Table 3. Thermal Resistance
Package Type
Nominal (TA = 85°C)
Reflow
ESD Sensitivity
Human Body Model (HBM)
99°C
260°C
1
2
θJA
359
θJC
Unit
RJ-6
70
°C/W
Class 0
1 Simulated values per JEDEC JESD51-12 standards.
2 Junction to GND package pin.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
ESD CAUTION
Rev. F | Page 4 of 9
Data Sheet
HMC434
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
NIC
GND
IN
1
2
3
6
5
4
OUT
VCC
NIC
HMC434
TOP VIEW
(Not to Scale)
NOTES
1. NOT INTERNALLY CONNECTED. THESE PINS CAN
BE CONNECTED TO RF AND DC GROUND WITHOUT
AFFECTING PERFORMANCE. THE NIC PINS ARE
TYPICALLY TIED TO GND FOR ENHANCED
THERMAL PERFORMANCE (BUT NOT REQUIRED).
Figure 2. Pin Configuration
Table 4. Pin Function Descriptions
Pin No.
Mnemonic
Description
1, 4
NIC
Not Internally Connected. These pins can be connected to RF and dc ground without affecting performance.
The NIC pins are typically tied to GND for enhanced thermal performance (but not required).
2
3
5
6
GND
IN
VCC
OUT
Ground. This pin must be connected to both RF and dc ground.
RF Input. This pin must be dc blocked.
Supply Voltage (3 V).
RF Output. This pin must be dc blocked.
INTERFACE SCHEMATICS
GND
VCC
50Ω
OUT
Figure 3. GND Interface Schematic
Figure 5. OUT Interface Schematic
VCC
8pF
VCC
IN
50Ω
Figure 6. VCC Interface Schematic
Figure 4. IN Interface Schematic
Rev. F | Page 5 of 9
HMC434
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
In Figure 9, PFEEDTHROUGH is the power of the output spectrum at the input frequency.
20
20
15
15
10
10
MAX P , T = +85°C
IN
A
MIN P , T = +85°C
IN
A
5
5
MAX P , T = +25°C
RECOMMENDED
OPERATING WINDOW
IN
A
MIN P , T = +25°C
IN A
0
0
MAX P , T = –40°C
IN
A
MIN P , T = –40°C
IN
A
–5
–5
–10
–15
–20
–10
–15
–20
MAX P
IN
MIN P
IN
0
1
2
3
4
5
6
7
8
9
10
0
1
2
3
4
5
6
7
8
9
10
INPUT FREQUENCY (GHz)
INPUT FREQUENCY (GHz)
Figure 7. Input Sensitivity Window
Figure 10. Input Sensitivity Window at Various Temperatures
5
4
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
3
2
1
0
–100
–1
–2
–3
–4
–5
–110
–120
–130
–140
–150
–160
–170
0
1
2
3
4
5
6
7
8
9
10
100
1M
10M
100M
1G
10G
INPUT FREQUENCY (GHz)
OFFSET FREQUENCY (Hz)
Figure 8. Output Power vs. Frequency at Various Temperatures
Figure 11. SSB Phase Noise (PIN = 0 dBm)
0
–5
0
–5
–10
–15
–20
–25
–30
–35
–40
–45
–50
–10
–15
–20
–25
–30
–35
–30
–45
–50
P
FEEDTHROUGH
SECOND HARMONIC
THIRD HARMONIC
–55
–60
0
1
2
3
4
5
6
7
8
9
10
0
1
2
3
4
5
6
7
8
9
10
INPUT FREQUENCY (GHz)
INPUT FREQUENCY (GHz)
Figure 9. Output Harmonic Content (PIN = 0 dBm)
Figure 12. Reverse Leakage (PIN = 0 dBm)
Rev. F | Page 6 of 9
Data Sheet
HMC434
APPLICATIONS INFORMATION
J3
EVALUATION BOARD PCB
VCC
C4
10µF
Use RF circuit design techniques for the PCB used in the
application. Ensure that signal lines have 50 Ω impedance when
the package ground leads are connected directly to the ground
plane (see Figure 14. Use a sufficient number of via holes to
connect the top and bottom ground planes.
C2
100pF
SMA
C3
RFOUT
J2
1000pF
5
6
VCC
OUT
U1
HMC434
The evaluation board has two connectors, as shown in Figure 14.
The RF input connector (J1) and the RF output connector (J2)
are PCB mount SMA connectors.
IN
3
GND
2
SMA
RFIN
J1
The evaluation board is powered from a single 3 V supply;
connect this supply using the J3 (VCC) and J4 (GND) test points.
GND
J4
C1
100pF
Figure 13. Evaluation Board Schematic
See Figure 13 and Table 5 for the evaluation board schematic
and the bill of materials, respectively.
Table 5. List of Materials for Evaluation PCB 105675-HMC4341
Item
J1, J2
J3, J4
C1, C2
C3
C4
U1
PCB2
Description
PCB mount SMA RF connectors
DC pins
100 pF capacitors, 0402 package
1000 pF capacitors, 0402 package
10 μF tantalum capacitors, 1206 package
HMC434/HMC434E, divide by 8
105199 evaluation board
1 105199 is the raw bare PCB identifier. Reference 105675-HMC434 when
ordering the complete evaluation PCB.
2 Circuit board material: Arlon 25FR or Rogers RO4350B.
Figure 14. Evaluation Board—Top View
Rev. F | Page 7 of 9
HMC434
Data Sheet
PCB MATERIAL STACKUP
The evaluation board is built using Arlon 25FR or Rogers
RO4350B and standard FR4 materials. RF trace widths are
designed to achieve a controlled 50 Ω characteristic impedance.
The complete PCB stackup is shown in Figure 15.
0.5oz (18µm) FINISHED COPPER
ARLON 25FR OR ROGERS RO4350B
LAMINATE 0.010"
0.5oz (18µm) FINISHED COPPER
0.0645" ± 0.0025"
COPPER TO COPPER
FR4 PREPREG
0.5oz (18µm) FINISHED COPPER
FR4 LAMINATE
0.5oz (18µm) FINISHED COPPER
Figure 15. Evaluation Board PCB Stackup
Rev. F | Page 8 of 9
Data Sheet
HMC434
OUTLINE DIMENSIONS
3.00
2.90
2.80
6
1
5
2
4
3
3.00
2.80
2.60
1.70
1.60
1.50
PIN 1
INDICATOR
0.95 BSC
1.90
BSC
1.30
1.15
0.90
0.20 MAX
0.08 MIN
1.45 MAX
0.95 MIN
0.55
0.45
0.35
.15 MAX
.05 MIN
10°
4°
0°
SEATING
PLANE
0.60
BSC
0.50 MAX
0.30 MIN
COMPLIANT TO JEDEC STANDARDS MO-178-AB
Figure 16. 6-Lead Small Outline Transistor Package [SOT-23]
(RJ-6)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Package Description
Package Option
Branding
H434
H434
434E
434E
HMC434
HMC434TR
HMC434E
HMC434ETR
105675-HMC434
6-Lead Small Outline Transistor Package [SOT-23]
6-Lead Small Outline Transistor Package [SOT-23]
6-Lead Small Outline Transistor Package [SOT-23]
6-Lead Small Outline Transistor Package [SOT-23]
Evaluation Board
RJ-6
RJ-6
RJ-6
RJ-6
1 The HMC434E and HMC434ETR are RoHS compliant parts.
©2017 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D15684-0-8/17(F)
Rev. F | Page 9 of 9
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