HMC8410LP2FE [ADI]
0.01 GHz to 10 GHz, GaAs, pHEMT, MMIC, Low Noise Amplifier;
| 型号： | HMC8410LP2FE |
| 厂家： | 
ADI |
| 描述： | 0.01 GHz to 10 GHz, GaAs, pHEMT, MMIC, Low Noise Amplifier 射频 微波 |
| 文件： | 总17页 (文件大小：759K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
0.01 GHz to 10 GHz, GaAs, pHEMT, MMIC,
Low Noise Amplifier
Data Sheet
HMC8410
FEATURES
FUNCTIONAL BLOCK DIAGRAM
Low noise figure: 1.1 dB typical
High gain: 19.5 dB typical
HMC8410
High output third-order intercept (IP3): 33 dBm typical
6-lead, 2 mm × 2 mm LFCSP package
RFIN/V
1
RFOUT/V
DD
GG
APPLICATIONS
Software defined radios
Electronics warfare
Radar applications
Figure 1.
GENERAL DESCRIPTION
The HMC8410 also features inputs/outputs (I/Os) that are
internally matched to 50 Ω, making it ideal for surface-mounted
technology (SMT)-based, high capacity microwave radio
applications.
The HMC8410 is a gallium arsenide (GaAs), monolithic
microwave integrated circuit (MMIC), pseudomorphic high
electron mobility transistor (pHEMT), low noise wideband
amplifier that operates from 0.01 GHz to 10 GHz. The HMC8410
provides a typical gain of 19.5 dB, a 1.1 dB typical noise figure,
and a typical output IP3 of 33 dBm, requiring only 65 mA from
a 5 V supply voltage. The saturated output power (PSAT) of up to
22.5 dBm enables the low noise amplifier (LNA) to function as a
local oscillator (LO) driver for many of Analog Devices, Inc.,
balanced, I/Q or image rejection mixers.
The HMC8410 is housed in a RoHS-compliant, 2 mm × 2 mm,
LFCSP package.
Multifunction pin names may be referenced by their relevant
function only.
Rev. A
Document Feedback
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rightsof third parties that may result fromits use. Specifications subject to change without notice. No
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Tel: 781.329.4700 ©2016–2017 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com
HMC8410
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Pin Configuration and Function Descriptions..............................6
Interface Schematics .....................................................................6
Typical Performance Characteristics ..............................................7
Theory of Operation ...................................................................... 13
Applications Information .............................................................. 14
Recommended Bias Sequencing .............................................. 14
Typical Application Circuit....................................................... 14
Evaluation Board ............................................................................ 15
Evaluation Board Schematic..................................................... 16
Outline Dimensions....................................................................... 17
Ordering Guide .......................................................................... 17
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description......................................................................... 1
Revision History ............................................................................... 2
Electrical Specifications ................................................................... 3
0.01 GHz to 3 GHz Frequency Range........................................ 3
3 GHz to 8 GHz Frequency Range............................................. 3
8 GHz to 10 GHz Frequency Range........................................... 4
Absolute Maximum Ratings............................................................ 5
ESD Caution.................................................................................. 5
REVISION HISTORY
11/2017—Rev. 0 to Rev. A
Change to Noise Figure Parameter, Table 1 .................................. 3
Change to Continuous Power Dissipation (PDISS) Parameter,
Table 4 ................................................................................................ 5
Changes to Figure 11........................................................................ 7
Changes to Figure 17........................................................................ 8
Changes to Figure 18 and Figure 20 Caption ............................... 9
Changes to Figure 33 and Figure 34 Caption ............................. 11
Added Figure 36; Renumbered Sequentially .............................. 12
Updated Outline Dimensions....................................................... 17
Changes to Ordering Guide .......................................................... 17
7/2016—Revision 0: Initial Version
Rev. A | Page 2 of 17
Data Sheet
HMC8410
ELECTRICAL SPECIFICATIONS
0.01 GHz TO 3 GHz FREQUENCY RANGE
TA = 25°C, VDD = 5 V, and IDQ = 65 mA, unless otherwise noted.
Table 1.
Parameter
Symbol
Min
0.01
17.5
Typ
Max
Unit
GHz
dB
dB/°C
dB
Test Conditions/Comments
FREQUENCY RANGE
GAIN
Gain Variation Over Temperature
NOISE FIGURE
3
19.5
0.01
1.1
1.6
0.3 GHz to 3 GHz
RETURN LOSS
Input
Output
15
24
dB
dB
OUTPUT
Output Power for 1 dB Compression
Saturated Output Power
Output Third-Order Intercept
SUPPLY CURRENT
SUPPLY VOLTAGE
P1dB
PSAT
IP3
19.0
2
21.0
22.5
33
dBm
dBm
dBm
mA
V
IDQ
65
80
6
Adjust VGG1 to achieve IDQ = 65 mA typical
VDD
5
3 GHz TO 8 GHz FREQUENCY RANGE
TA = 25°C, VDD = 5 V, and IDQ = 65 mA, unless otherwise noted.
Table 2.
Parameter
Symbol
Min
3
Typ
Max
Unit
GHz
dB
Test Conditions/Comments
FREQUENCY RANGE
GAIN
8
15.5
18
Gain Variation Over Temperature
NOISE FIGURE
0.01
1.4
dB/°C
dB
1.9
RETURN LOSS
Input
Output
12
12
dB
dB
OUTPUT
Output Power for 1 dB Compression
Saturated Output Power
Output Third-Order Intercept
SUPPLY CURRENT
SUPPLY VOLTAGE
P1dB
PSAT
IP3
18.0
2
21.0
22.5
31.5
65
dBm
dBm
dBm
mA
V
IDQ
80
6
Adjust VGG1 to achieve IDQ = 65 mA typical
VDD
5
Rev. A | Page 3 of 17
HMC8410
Data Sheet
8 GHz TO 10 GHz FREQUENCY RANGE
TA = 25°C, VDD = 5 V, and IDQ = 65 mA, unless otherwise noted.
Table 3.
Parameter
Symbol
Min
8
Typ
Max
Unit
GHz
dB
Test Conditions/Comments
FREQUENCY RANGE
GAIN
10
13
16
Gain Variation Over Temperature
NOISE FIGURE
0.01
1.7
dB/°C
dB
2.2
RETURN LOSS
Input
Output
6
10
dB
dB
OUTPUT
Output Power for 1 dB Compression
Saturated Output Power
Output Third-Order Intercept
SUPPLY CURRENT
SUPPLY VOLTAGE
P1dB
PSAT
IP3
17.5
2
19.5
21.5
33
dBm
dBm
dBm
mA
V
IDQ
65
80
6
Adjust VGG1 to achieve IDQ = 65 mA typical
VDD
5
Rev. A | Page 4 of 17
Data Sheet
HMC8410
ABSOLUTE MAXIMUM RATINGS
Stresses at or above those listed under Absolute Maximum
Table 4.
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Parameter1
Rating
Drain Bias Voltage (VDD
)
7 V dc
Radio Frequency (RF) Input Power (RFIN)
20 dBm
Continuous Power Dissipation (PDISS), T = 85°C
(Derate 14.8 mW/°C above 85°C)
1.3 W
Channel Temperature
175°C
Storage Temperature Range
Operating Temperature Range
Thermal Resistance (Channel to Ground
Paddle)
−65°C to +150°C
−40°C to +85°C
67.73°C/W
ESD CAUTION
Maximum Peak Reflow Temperature (MSL3)2 260°C
ESD Sensitivity
Human Body Model (HBM)
Class1B Passed
500 V
1 When referring to a single function of a multifunction pin in the parameters,
only the portion of the pin name that is relevant to the specification is listed.
For the full pin names of multifunction pins, refer to the Pin Configuration
and Function Descriptions section.
2 See the Ordering Guide section for more information.
Rev. A | Page 5 of 17
HMC8410
Data Sheet
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
1
2
3
6
5
4
GND
RFIN/V
NIC
HMC8410
RFOUT/V
1
DD
GG
TOP VIEW
(Not to Scale)
NIC
NIC
NOTES
1. NIC = NOT INTERNALLY CONNECTED. THIS PIN
MUST BE CONNECTED TO THE RF/DC GROUND.
2. EXPOSED PAD. THE EXPOSED PAD MUST BE
CONNECTED TO RF/DC GROUND.
Figure 2. Pin Configuration
Table 5. Pin Function Descriptions
Pin No. Mnemonic Description
1
2
GND
RFIN/VGG
Ground. This pin must be connected to the RF/dc ground. See Figure 3 for the interface schematic.
RF Input (RFIN). This pin is ac-coupled and matched to 50 Ω. See Figure 4 for the interface schematic.
1
Gate Bias of the Amplifier (VGG1). This pin is ac-coupled and matched to 50 Ω. See Figure 4 for the interface
schematic.
3, 4, 6
5
NIC
Not Internally Connected. This pin must be connected to the RF/dc ground.
RFOUT/VDD RF Output (RFOUT). This pin is ac-coupled and matched to 50 Ω. See Figure 5 for the interface schematic.
Drain Bias for Amplifier (VDD). This pin is ac-coupled and matched to 50 Ω. See Figure 5 for the interface schematic.
EPAD
Exposed Pad. The exposed pad must be connected to RF/dc ground.
INTERFACE SCHEMATICS
RFOUT/V
DD
GND
Figure 3. GND Interface Schematic
Figure 5. RFOUT/VDD Interface Schematic
RFIN/V
1
GG
Figure 4. RFIN/VGG1 Interface Schematic
Rev. A | Page 6 of 17
Data Sheet
HMC8410
TYPICAL PERFORMANCE CHARACTERISTICS
25
20
15
10
5
22
20
18
16
14
12
10
8
–40°C
+25°C
+85°C
0
–5
–10
–15
–20
S21
S11
S22
–25
–30
0
1
2
3
4
5
6
7
8
9
10
0
2
4
6
8
10
FREQUENCY (GHz)
FREQUENCY(GHz)
Figure 6. Gain and Return Loss vs. Frequency
Figure 9. Gain vs. Frequency for Various Temperatures
0
–2
0
–5
–40°C
+25°C
+85°C
–40°C
+25°C
+85°C
–4
–6
–10
–15
–20
–25
–8
–10
–12
–14
–16
–18
–20
0
1
2
3
4
5
6
7
8
9
10
0
1
2
3
4
5
6
7
8
9
10
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 7. Input Return Loss vs. Frequency for Various Temperatures
Figure 10. Output Return Loss vs. Frequency for Various Temperatures
4.0
10.0
–40°C
+25°C
+85°C
9.5
9.0
8.5
8.0
7.5
7.0
6.5
6.0
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
–40°C
+25°C
+85°C
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
0
2
4
6
8
10
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9 1.0
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 8. Noise Figure vs. Frequency for Various Temperatures
Figure 11. Noise Figure vs. Frequency for Various Temperatures,
10 MHz to 1 GHz
Rev. A | Page 7 of 17
HMC8410
Data Sheet
25
50
45
40
35
30
25
20
–40°C
+25°C
+85°C
24
23
22
21
20
19
18
17
16
15
0
2
4
6
8
10
0
2
4
6
8
10
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 12. P1dB vs. Frequency for Various Temperatures
Figure 15. Output IP2 vs. Frequency at POUT/Tone = 5 dBm
25
24
23
22
21
20
19
18
17
16
15
0
–5
–40°C
+25°C
+85°C
–10
–15
–20
–25
–30
–35
–40°C
+25°C
+85°C
0
2
4
6
8
10
0
1
2
3
4
5
6
7
8
9
10
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 13. PSAT vs. Frequency for Various Temperatures
Figure 16. Reverse Isolation vs. Frequency for Various Temperatures
36
34
32
30
28
26
24
22
20
18
36
34
32
30
28
26
24
22
–40°C
+25°C
+85°C
20
0dBm
5dBm
18
0
2
4
6
8
10
0
2
4
6
8
10
FREQUENCY GHz)
FREQUENCY (GHz)
Figure 14. Output IP3 vs. Frequency for Various Temperatures,
Output Power (POUT)/Tone = 5 dBm
Figure 17. Output IP3 vs. Frequency for Various POUT/Tone
Rev. A | Page 8 of 17
Data Sheet
HMC8410
40
35
30
25
20
55
50
45
40
35
30
25
20
15
10
5
PAE
SAT
P
GAIN
15
P1dB
SAT
OUTPUT IP3
P
10
0.1
0
0.2 0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0
2
4
6
8
10
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 18. Gain, P1dB, PSAT, and Output IP3 vs. Frequency
Figure 21. PSAT and PAE vs. Frequency
40
35
30
25
20
15
10
5
0.6
0.5
0.4
0.3
0.2
0.1
0
1GHz
3GHz
5GHz
7GHz
9GHz
PAE
P1dB
0
–10 –8 –6 –4 –2
0
2
4
6
8
10 12 14
0
2
4
6
8
10
INPUT POWER (dBm)
FREQUENCY (GHz)
Figure 22. Power Dissipation at 85°C vs. Input Power at Various Frequencies
Figure 19. P1dB and Power Added Efficiency (PAE) vs. Frequency
22
100
95
90
85
80
75
70
65
60
55
45
40
35
30
25
20
15
10
5
5mA
P
OUT
15mA
25mA
GAIN
PAE
20
35mA
I
DD
45mA
65mA
70mA
75mA
18
16
14
12
10
8
0
–10
0
2
4
6
8
10
–5
0
5
10
FREQUENCY (GHz)
INPUT POWER (dBm)
Figure 23. Gain vs. Frequency for Various Supply Currents, VDD = 5 V
Figure 20. POUT, Gain, PAE, and Supply Current with RF Applied (IDD) vs.
Input Power at 5 GHz
Rev. A | Page 9 of 17
HMC8410
Data Sheet
7
45
40
35
30
25
20
15
5mA
15mA
35mA
65mA
75mA
5mA
45mA
25mA
45mA
70mA
15mA
25mA
35m
65mA
70mA
75mA
6
5
4
3
2
1
0
0
2
4
6
8
10
0
2
4
6
8
10
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 24. Noise Figure vs. Frequency for Various Supply Currents (IDQ),
DD = 5 V
Figure 27. Output IP3 vs. Frequency for Various Supply Currents (IDQ),
OUT/Tone = 5 dBm, VDD = 5 V
V
P
25
20
15
10
5
22
20
18
16
14
12
10
8
2V
3V
4V
5V
6V
7V
5mA
15mA
35mA
65mA
75mA
25mA
45mA
70mA
0
0
2
4
6
8
10
0
2
4
6
8
10
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 25. P1dB vs. Frequency for Various Supply Currents (IDQ), VDD = 5 V
Figure 28. Gain vs. Frequency for Various Supply Voltages, IDQ = 65 mA
25
24
23
22
4.0
2V
3V
4V
5V
6V
7V
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
21
5mA
15mA
25mA
35mA
45mA
65mA
70mA
75mA
20
19
18
0
2
4
6
8
10
0
2
4
6
8
10
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 26. PSAT vs. Frequency for Various Supply Currents (IDQ), VDD = 5 V
Figure 29. Noise Figure vs. Frequency for Various Supply Voltages, IDQ = 65 mA
Rev. A | Page 10 of 17
Data Sheet
HMC8410
24
45
40
35
30
25
20
15
2V
3V
4V
5V
6V
7V
22
20
18
16
14
2V
3V
4V
12
5V
6V
7V
10
0
2
4
6
8
10
0
2
4
6
8
10
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 32. Output IP3 vs. Frequency for Various Supply Voltages,
OUT/Tone = 5 dBm
Figure 30. P1dB vs. Frequency for Various Supply Voltages, IDQ = 65 mA
P
90
80
70
60
50
40
30
20
10
0
27
25
23
21
19
17
2V
3V
4V
15
5V
6V
7V
13
–0.90 –0.85 –0.80 –0.75 –0.70 –0.65 –0.60 –0.55 –0.50 –0.45
0
2
4
6
8
10
V
1 (V)
FREQUENCY (GHz)
GG
Figure 31. PSAT vs. Frequency for Various Supply Voltages, IDQ = 65 mA
Figure 33. Supply Current (IDQ) vs. VGG1, VDD = 5 V,
Representative of a Typical Device
Rev. A | Page 11 of 17
HMC8410
Data Sheet
–70
–80
120
100
80
–90
–100
–110
–120
–130
–140
–150
–160
–170
60
5mA
40
25mA
45mA
70mA
80mA
15mA
35mA
65mA
75mA
20
0
–10
–5
0
5
10
15
10
100
1k
10k
100k
1M
OFFSET FREQUENCY (Hz)
INPUT POWER (dBm)
Figure 34. Supply Current with RF Applied (IDD) vs. Input Power for
Various Supply Currents (IDQ) at 5 GHz, VDD = 5 V
Figure 36. Additive Phase Noise Vs Offset Frequency, RF Frequency = 5 GHz,
RF Input Power = 3 dBm (P1dB)
20
5mA
15mA
25mA
18
35mA
45mA
65mA
16
14
12
10
8
70mA
75mA
80mA
6
–10
–5
0
5
10
15
INPUT POWER (dBm)
Figure 35. Gain vs. Input Power for Various Supply Currents (IDQ) at 5 GHz,
DD = 5 V
V
Rev. A | Page 12 of 17
Data Sheet
HMC8410
THEORY OF OPERATION
The HMC8410 is a gallium arsenide (GaAs), monolithic
microwave integrated circuit (MMIC), pseudomorphic (pHEMT),
low noise wideband amplifier.
The HMC8410 has single-ended input and output ports whose
impedances are nominally equal to 50 Ω over the 0.01 GHz to
10 GHz frequency range. Consequently, it can directly insert
into a 50 Ω system with no required impedance matching
circuitry, which also means that multiple HMC8410 amplifiers
can be cascaded back to back without the need for external
matching circuitry.
The cascode amplifier uses a fundamental cell of two field effect
transistors (FETs) in series, source to drain. The basic schematic
for the cascode cell is shown in Figure 37, which forms a low
noise amplifier operating from 0.01 GHz to 10 GHz with
excellent noise figure performance.
The input and output impedances are sufficiently stable vs.
variations in temperature and supply voltage that no impedance
matching compensation is required.
V
DD
RFOUT
Note that it is critical to supply very low inductance ground
connections to the ground pins as well as to the backside
exposed paddle to ensure stable operation.
RFIN
To achieve optimal performance from the HMC8410 and prevent
damage to the device, do not exceed the absolute maximum
ratings.
V
1
GG
Figure 37. Basic Schematic for the Cascode Cell
Rev. A | Page 13 of 17
HMC8410
Data Sheet
APPLICATIONS INFORMATION
Figure 38 shows the basic connections for operating the
HMC8410. AC couple the input and output of the HMC8410
with appropriately sized capacitors. DC block capacitors and RF
choke inductors are supplied on the RFIN and RFOUT pins of
the HMC8410 evaluation board. See Table 6 for additional
information. These dc block capacitors and RF choke inductors
form wideband bias tees on the input and output ports to provide
both ac coupling and the necessary supply voltages to the RFIN
and RFOUT pins. A 5 V dc bias is supplied to the amplifier
through the choke inductor connected to the RFOUT pin, and
the negative VGG1 voltage is supplied to the RFIN pin through
the choke inductor.
During Power-Down
The recommended bias sequence during power-down for the
HMC8410 follows:
1. Turn off the RF signal.
2. Decrease VGG1 to −2 V to achieve a typical IDQ = 0 mA.
3. Decrease VDD to 0 V.
4. Increase VGG1 to 0 V.
The bias conditions previously listed (VDD = 5 V and IDQ
65 mA) are the recommended operating points to achieve
=
optimum performance. The data used in this data sheet was
taken with the recommended bias conditions. When using the
HMC8410 with different bias conditions, different performance
than what is shown in the Typical Performance Characteristics
section may result.
RECOMMENDED BIAS SEQUENCING
To not damage the amplifier, follow the recommended bias
sequencing.
Figure 18, Figure 30, and Figure 31 show that increasing the
voltage from 2 V to 7 V typically increases P1dB and PSAT at the
expense of power consumption with minor degradation on
noise figure (NF).
During Power-Up
The recommended bias sequence during power-up for the
HMC8410 follows:
1. Connect to GND.
2. Set VGG1 to −2 V.
3. Set VDD to +5 V.
4. Increase VGG1 to achieve a typical supply current (IDQ) =
65 mA.
5. Apply the RF signal.
TYPICAL APPLICATION CIRCUIT
V
1
GG
V
DD
+
C14
4.7µF
+
C5
2.2µF
C13
100nF
C5
10nF
C15
20pF
L2
590nH
C4
20pF
HMC8410
L2
590nH
1
2
3
6
5
4
RFIN/V
1
J1
RFOUT
J2
GG
PACKAGE
BASE
GND
Figure 38. Typical Application Circuit
Rev. A | Page 14 of 17
Data Sheet
HMC8410
EVALUATION BOARD
The HMC8410 evaluation board is a 4-layer board fabricated
using a Rogers 4350 and the best practices for high frequency
RF design. The RF input and RF output traces have a 50 Ω
characteristic impedance.
The HMC8410 evaluation board and populated components
operate over the −40°C to +85°C ambient temperature range.
For proper bias sequence, see the Applications Information
section.
The HMC8410 evaluation board schematic is shown in Figure 40.
A fully populated and tested evaluation printed circuit board
(PCB) is available from Analog Devices, Inc., upon request
(see Figure 39).
Figure 39. HMC8410 Evaluation PCB
Rev. A | Page 15 of 17
HMC8410
Data Sheet
EVALUATION BOARD SCHEMATIC
V
1
GG
VDD
J3
J8
C12
DNI
C13
100nF
C14
4.7µF
C4
100nF
C5
2.2µF
C3
DNI
+
R2
15Ω
R1
0Ω
C15
20pF
C16
20pF
L1
590nH
L2
590nH
HMC8410
GND
NIC
1
2
3
6
5
4
RFIN
RFOUT
RFIN/V
1
RFOUT/V
GG
DD
J1
J2
C1
10nF
C2
10nF
NIC
NIC
EPAD
V
2
GG
J5
DNI
C6
DNI
C7
DNI
C8
DNI
THRU CAL
J6
J7
C9
C10
DNI
DNI
DNI
GND
J4
DNI
Figure 40. HMC8410 Evaluation Board Schematic
Table 6. Bill of Materials for Evaluation PCB EV1HMC8410LP2F
Item
Description
J1, J2
J3, J4, J8
PCB mount SMA RF connectors, SRI 21-146-1000-01
DC bias test points
C1, C2
Capacitors, broadband, 10 nF and 82 pF, 0502, 160 kHz and 40 GHz; Presidio Components MBB0502X103MLP5N8L
C3, C6 to C10, C12, J5 to J7
Do not install (DNI)
C4, C13
C5
C14
C15, C16
L1, L2
R1
Capacitors, ceramic, 100 nF, 0402 package
Capacitor, tantalum, 2.2 μF, Size A
Capacitor, tantalum, 4.7 μF, 3216 package
Capacitors, ceramic, 20 pF, 0402 package
Inductors, 590 nH, 0402, 5%, ferrite DF, Coilcraft 0402DF-591XJRU
0 Ω resistor
R2
15 Ω resistor, 0402 package
U1
Amplifier, HMC8410
Heat sink
PCB
Heat sink
600-01660-00 evaluation PCB; circuit board material: Rogers 4350
Rev. A | Page 16 of 17
Data Sheet
HMC8410
OUTLINE DIMENSIONS
DETAIL A
(JEDEC 95)
1.65
1.60
1.55
2.05
2.00 SQ
1.95
4
6
PIN 1 INDEX
1.05
1.00
0.95
AREA
EXPOSED
PAD
0.20
MIN
PIN 1
INDIC ATOR AREA OPTIONS
(SEE DETAIL A)
3
1
0.30
0.25
0.20
TOP VIEW
SIDE VIEW
BOTTOM VIEW
0.65 BSC
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
0.90
0.85
0.80
0.05 MAX
0.02 NOM
COPLANARITY
0.08
SECTION OF THIS DATA SHEET.
0.35
0.30
0.25
SEATING
PLANE
0.203 REF
Figure 41. 6-Lead Lead Frame Chip Scale Package [LFCSP],
2 mm × 2 mm Body and 0.85 mm Package Height
(CP-6-9)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Temperature Range
−40°C to +85°C
−40°C to +85°C
MSL Rating2
MSL3
Lead Finish
Package Description
6-Lead LFCSP
6-Lead LFCSP
Package Option
CP-6-9
CP-6-9
HMC8410LP2FE
HMC8410LP2FETR
EV1HMC8410LP2F
100% Matte Sn
100% Matte Sn
MSL3
Evaluation PCB
1 The HMC8410LP2FE and HMC8410LP2FETR are RoHS Compliant Parts.
2 See the Absolute Maximum Ratings section for additional information.
©2016–2017 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D14657-0-11/17(A)
Rev. A | Page 17 of 17
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