AMMC-5620-W10 [AGILENT]
Agilent AMMC-5620 6 - 20 GHz High Gain Amplifier; 安捷伦AMMC - 5620 6 - 20 GHz的高增益放大器
| 型号： | AMMC-5620-W10 |
| 厂家： | 
AGILENT TECHNOLOGIES, LTD. |
| 描述： | Agilent AMMC-5620 6 - 20 GHz High Gain Amplifier |
| 文件： | 总8页 (文件大小：184K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Agilent AMMC-5620
6 - 20 GHz High Gain Amplifier
Data Sheet
Features
• Frequency Range: 6 - 20 GHz
• High Gain: 19 dB Typical
• Output Power: 15dBm Typical
• Input and Output Return Loss: < -10
dB
• Positive Gain Slope: + 0.21dB/GHz
Typical
Chip Size:
Chip Size Tolerance:± 10µm (± 0.4 mils)
Chip Thickness: 100 ± 10µm (4 ± 0.4 mils)
1410 x 1010 µm (55.5 x 39.7 mils)
• Single Supply Bias: 5 V @ 95 mA
Typical
Pad Dimensions: 80 x 80 µm (3.1 x 3.1 mils or larger)
Applications
• General purpose, wide-band
amplifier in communication
systems or microwave
instrumentation
Description
Agilent’s AMMC-5620 MMIC is a
GaAs wide-band amplifier
designed for medium output
power and high gain over the 6
− 20 GHz frequency range. The
3 cascaded stages provide high
gain while the single bias
supply offers ease of use. It is
fabricated using a PHEMT
integrated circuit process. The
RF input and output ports have
matching circuitry for use in
50-Ω environments. The
backside of the chip is both RF
and DC ground. This helps
simplify the assembly process
and reduces assembly related
performance variations and
costs. The MMIC is a cost
effective alternative to hybrid
(discrete FET) amplifiers that
require complex tuning and
assembly processes.
• High gain amplifier
[1]
AMMC-5620 Absolute Maximum Ratings
Symbol
Parameters/Conditions
Drain Supply Voltage
Total Drain Current
DC Power Dissipation
RF CW Input Power
Channel Temp.
Units
V
Min.
Max.
7.5
V
DD
I
mA
W
135
1.0
DD
P
P
T
DC
in
dBm
°C
20
+150
ch
T
Operating Backside Temp.
Storage Temp.
°C
-55
-65
b
T
°C
+165
+300
stg
T
Maximum Assembly Temp. (60 sec max) °C
max
Note:
1. Operation in excess of any one of these conditions may result in permanent damage to this device.
Note: These devices are ESD sensitive. The following precautions are strongly recommended:
Ensure that an ESD approved carrier is used when dice are transported from one destination to another.
Personal grounding is to be worn at all times when handling these devices.
[1]
AMMC-5620 DC Specifications / Physical Properties
Symbol
Parameters and Test Conditions
Units
V
Min.
Typical
5
Max.
V
Recommended Drain Supply Voltage
DD
I
I
Total Drain Supply Current (V = 5V)
mA
mA
°C/W
70
95
130
DD
DD
DD
Total Drain Supply Current (V = 7 V)
105
33
DD
[3]
θ
Thermal Resistance
ch-b
(Backside temperature (T ) = 25°C
b
Notes:
1. Backside temperature Tb = 25°C unless otherwise noted
2. Channel-to-backside Thermal Resistance (θch-b) = 47°C/W at Tchannel (T ) = 150°C as measured using infrared microscopy. Thermal Resistance at backside temperature
c
(Tb) = 25°C calculated from measured data.
[3]
AMMC-5620 RF Specifications (Tb = 25°C, V = 5 V, I = 95mA, Zo=50Ω)
DD
DD
Symbol
Parameters and Test Conditions
Units
dB
Min.
Typical
19
Max.
2
|S |
Small-signal Gain
16
22
21
Gain Slope Positive Small-signal Gain Slope
dB/GHz
dB
+0.21
13
RL
RL
Input Return Loss
Output Return Loss
Reverse Isolation
10
10
in
dB
14
out
2
|S |
dB
- 55
15
12
P
Output Power at 1dB Gain Compression @ 20 GHz
dBm
12.5
14.5
-1dB
sat
P
Saturated Output Power (3dB Gain Compression) @ 20 GHz dBm
17
rd
OIP3
NF
Output 3 Order Intercept Point @ 20 GHz
dBm
dB
23.5
4.2
Noise Figure @ 20 GHz
5.0
Note:
3.. 100% on-wafer RF test is done at frequency = 6, 13 and 20 GHz, except as noted.
2
AMMC-5620 Typical Performance (T
=25°C, V =5V, I = 95 mA, Zo=50Ω)
DD DD
chuck
25
20
15
10
5
0
-10
-20
-30
-40
-50
-60
-70
0
-10
-20
-30
-40
0
4
7
10
13
16
19
22
4
7
10
13
16
19
22
4
7
10
13
16
19
22
FREQUENCY (GHz)
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 1. Gain
0
Figure 2. Isolation
Figure 3. Input Return Loss
10
8
18
15
12
9
-10
-20
-30
-40
6
4
6
2
3
0
0
4
7
10
13
16
19
22
4
7
10
13
16
19
22
4
7
10
13
16
19
22
FREQUENCY (GHz)
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 4. Output Return Loss
Figure 5. Noise Figure
Figure 6.Output Power at 1 dB Gain
Compression
AMMC-5620 Typical Performance vs. Supply Voltage (Tb=25°C, Zo=50Ω)
25
20
15
10
5
0
-20
-40
-60
-80
0
-10
-20
Vdd=4V
Vdd=5V
Vdd=6V
-30
-40
-50
Vdd=4V
Vdd=5V
Vdd=6V
Vdd=4V
Vdd=5V
Vdd=6V
0
4
7
10
13
16
19
22
4
7
10
13
16
19
22
4
7
10
13
16
19
22
FREQUENCY (GHz)
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 7. Gain and Voltage
Figure 8. Isolation and Voltage
Figure 9. Input Return Loss and Voltage
3
AMMC-5620 Typical Performance vs. Supply Voltage (cont.) (Tb=25°C, Zo=50Ω)
0
-10
-20
-30
-40
20
16
12
8
Vdd=4V
Vdd=5V
Vdd=6V
Vdd=4V
Vdd=5V
Vdd=6V
4
0
4
7
10
13
16
19
22
4
7
10
13
16
19
22
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 10. Output Return Loss and Voltage
Figure 11. Output Power and Voltage
AMMC-5620 Typical Performance vs. Temperature (V =5V, Zo=50Ω)
DD
24
20
16
12
8
0
-10
-20
-30
-40
-50
-60
-70
0
-10
-20
-30
-40
-40 C
25 C
85 C
-40 C
25 C
85 C
-40 C
25 C
85 C
4
0
4
7
10
13
16
19
22
4
7
10
13
16
19
22
4
7
10
13
16
19
22
FREQUENCY (GHz)
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 12. Gain and Temperature
Figure 13. Isolation and Temperature
Figure 14. Input Return Loss and Temperature
0
-5
7
6
5
4
3
2
18
15
12
-10
-15
-20
-25
-30
-35
9
-40 C
25 C
85 C
6
3
0
-40 C
25 C
85 C
-40 C
25 C
85 C
1
0
4
7
10
13
16
19
22
4
7
10
13
16
19
22
4
7
10
13
16
19
22
FREQUENCY (GHz)
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 15.Output Return Loss and
Temperature
Figure 16. Noise Figure and Temperature
Figure 17. Output Power and Temperature
4
[1]
AMMC-5620 Typical Scattering Parameters (Tb=25°C, V = 5 V, I = 107 mA)
DD
DD
S11
Mag
0.72
0.69
0.67
0.65
0.64
0.63
0.56
0.41
0.25
0.14
0.08
0.04
0.02
0.02
0.03
0.04
0.06
0.07
0.09
0.11
0.12
0.14
0.15
0.16
0.17
0.17
0.18
0.18
0.18
0.18
0.18
0.18
0.18
0.18
0.19
0.2
S21
Mag
0.07
0.16
0.31
0.59
1.1
S12
S22
Mag
0.85
0.75
0.66
0.6
Freq GHz
dB
Phase
-147
-168
173
154
134
111
81
dB
-23.3
-16.1
-10.0
-4.6
Phase
-176
146
114
87
dB
Mag
Phase
46
dB
Phase
-72
2.00
-2.9
-50.0
-46.1
-44.0
-42.9
-42.1
-41.5
-42.1
-44.7
-49.0
-53.7
-58.0
-60.6
-61.9
-64.4
-64.4
-63.1
-63.5
-64.4
-64.4
-64.2
-62.1
-63.3
-64.4
-62.1
-61.9
-62.1
-62.9
-64.1
-61.2
-60.0
-61.8
-62.1
-61.9
-62.7
-61.9
-61.9
-60.0
-60.9
-64.1
-67.5
-67.5
0
0
-1.5
2.50
-3.3
-1
-2.5
-89
3.00
-3.5
0.01
0.01
0.01
0.01
0.01
0.01
0
-46
-89
-132
-179
128
72
-3.6
-104
-118
-136
-158
175
3.50
-3.7
-4.5
4.00
-3.8
0.8
62
-5.3
0.54
0.46
0.33
0.17
0.08
0.06
0.05
0.03
0.02
0.04
0.06
0.09
0.11
0.12
0.14
0.15
0.16
0.18
0.18
0.19
0.2
4.50
-4.0
6.6
2.15
3.96
5.73
6.84
7.06
7.28
7.41
7.81
8.12
8.29
8.34
8.35
8.37
8.36
8.37
8.38
8.4
34
-6.7
5.00
-5.0
12.0
15.2
16.7
17.0
17.2
17.4
17.9
18.2
18.4
18.4
18.4
18.5
18.5
18.5
18.5
18.5
18.5
18.6
18.6
18.7
18.8
18.9
19.1
19.2
19.3
19.5
19.7
19.9
20.0
20.1
20.2
20.3
20.3
20.2
19.9
-5
-9.6
5.50
-7.7
49
-50
-91
-123
-150
-173
164
142
121
101
83
-15.2
-21.8
-24.8
-26.4
-30.0
-34.5
-28.3
-23.8
-21.2
-19.3
-18.1
-17.1
-16.3
-15.7
-15.1
-14.7
-14.4
-14.2
-14.0
-13.7
-13.6
-13.4
-13.3
-13.3
-13.2
-13.2
-13.3
-13.4
-13.6
-14.0
-14.1
-14.6
-15.1
-15.5
157
6.00
-12.0
-16.9
-21.9
-27.2
-32.8
-33.4
-30.9
-27.7
-24.9
-22.6
-20.7
-19.3
-18.2
-17.3
-16.6
-16.0
-15.6
-15.3
-15.1
-15.0
-14.9
-14.9
-15.0
-15.0
-14.9
-14.7
-14.3
-13.8
-13.1
-11.9
-10.5
-9.0
23
19
165
6.50
5
0
-30
-78
-123
-160
-178
-179
169
157
144
145
130
127
126
125
118
107
107
98
-173
-164
-155
-102
-61
7.00
-8
0
7.50
-18
-17
-5
0
8.00
0
8.50
0
9.00
-15
-32
-50
-66
-80
-92
-103
-113
-123
-131
-140
-148
-156
-164
-172
179
170
160
149
137
122
106
89
0
-60
9.50
0
-65
10.00
10.50
11.00
11.50
12.00
12.50
13.00
13.50
14.00
14.50
15.00
15.50
16.00
16.50
17.00
17.50
18.00
18.50
19.00
19.50
20.00
20.50
21.00
21.50
22.00
Note:
0
-72
65
0
-78
48
0
-84
32
0
-90
16
0
-95
1
0
-101
-105
-110
-115
-120
-126
-131
-136
-140
-145
-150
-154
-159
-166
-171
-177
179
8.43
8.48
8.53
8.6
-14
-29
-44
-58
-73
-87
-101
-116
-131
-145
-161
-176
168
151
134
117
99
0
0
0
0
0.2
8.71
8.81
8.97
9.11
9.25
9.43
9.62
9.84
10
0
0.21
0.21
0.21
0.22
0.22
0.22
0.22
0.22
0.21
0.21
0.2
0
82
0
94
0
95
0
60
0
80
0
70
0
67
0
70
10.2
10.3
10.4
10.3
10.2
9.88
0
61
0.22
0.25
0.3
0
45
72
0
41
0.2
53
0
38
0.19
0.18
0.17
173
0.35
0.42
36
80
0
13
168
-7.5
19
60
0
5
162
1. Data obtained from on-wafer measurements
5
Biasing and Operation
Assembly Techniques
Thermosonic wedge bonding is
the preferred method for wire
attachment to the bond pads.
Gold mesh can be attached
using a 2 mil round tracking
tool and a tool force of
approximately 22 grams with an
ultrasonic power of roughly 55
dB for a duration of 76 8 mS.
A guided wedge at an ultrasonic
power level of 64 dB can be
used for the 0.7 mil wire. The
recommended wire bond stage
temperature is 150 2 °C.
The AMMC-5620 is normally
biased with a single positive
drain supply connected to the
The backside of the AMMC-5620
chip is RF ground. For
microstripline applications, the
chip should be attached directly
to the ground plane (e.g., circuit
V
bond pads shown in Figure
DD
19. The recommended supply
voltage is 5 V, which results in
carrier or heatsink) using
electrically conductive epoxy
[1]
I
= 95 mA (typical).
.
DD
No ground wires are required
because all ground connections
are made with plated through-
holes to the backside of the
device.
For best performance, the
topside of the MMIC should be
brought up to the same height
as the circuit surrounding it.
This can be accomplished by
mounting a gold plated metal
shim (same length and width as
the MMIC) under the chip,
which is of the correct
Refer the Absolute Maximum
Ratings table for allowed DC
and thermal conditions.
Caution should be taken to not
exceed the Absolute Maximum
Rating for assembly temperature
and time.
thickness to make the chip and
adjacent circuit coplanar.
The chip is 100 µm thick and
should be handled with care.
This MMIC has exposed air
bridges on the top surface and
should be handled by the edges
or with a custom collet (do not
pick up die with vacuum on die
center.)
The amount of epoxy used for
chip and or shim attachment
should be just enough to
provide a thin fillet around the
bottom perimeter of the chip or
shim. The ground plane should
be free of any residue that may
jeopardize electrical or
mechanical attachment.
This MMIC is also static
sensitive and ESD handling
precautions should be taken.
The location of the RF bond
pads is shown in Figure 20.
Note that all the RF input and
output ports are in a Ground-
Signal-Ground configuration.
Notes:
1. Ablebond 84-1 LM1 silver epoxy is
recommended.
2. Buckbee-Mears Corporation, St. Paul, MN,
800-262-3824
RF connections should be kept
as short as reasonable to
minimize performance
degradation due to undesirable
series inductance. A single bond
wire is sufficient for signal
connections, however double-
bonding with 0.7 mil gold wire
[2]
or the use of gold mesh is
recommended for best
performance, especially near the
high end of the frequency range.
6
VD1
Feedback
network
Feedback
network
RF Output
Feedback
network
Matching
Matching
RF Input
Matching
Matching
Figure 18. AMMC-5620 Schematic
To power supply
100 pF chip capacitor
Gold plated shim
AMMC-5620
RF Input
RF Output
Figure 19. AMMC-5620 Assembly Diagram
7
875 (VDD)
1010
910
350 (RFOut)
350 (RFIn)
0
0
90
1315
1410
Figure 20. AMMC-5620 Bond Pad Locations.
(dimensions in microns)
Ordering Information:
AMMC-5620-W10 = waffle pack, 10 devices per tray
AMMC-5620-W50 = waffle pack, 50 devices per tray
www.agilent.com/semiconductors
For product information and a complete list of
distributors, please go to our web site.
Data subject to change.
Copyright 2003 Agilent Technologies, Inc.
May 21, 2004
5989-0530EN
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