HSMS-8209-BLK [AGILENT]
Surface Mount Microwave Schottky Mixer Diodes; 表面贴装肖特基微波混频二极管
| 型号： | HSMS-8209-BLK |
| 厂家： | 
AGILENT TECHNOLOGIES, LTD. |
| 描述： | Surface Mount Microwave Schottky Mixer Diodes |
| 文件： | 总5页 (文件大小：100K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Surface Mount Microwave
Schottky Mixer Diodes
HSMS-8101 Single
Technical Data
HSMS-8202 Series Pair
HSMS-8207 Ring Quad
HSMS-8209 Crossover Quad
Features
• Optimized for use at
10-14 GHz
Plastic SOT-23 Package
Package Lead Code
Identification
(Top View)
• Low Capacitance
• Low Conversion Loss
• Low RD
SINGLE
3
SERIES
3
• Low Cost Surface Mount
Plastic Package
1
2
1
2
#1
#2
• Lead-free Option Available
Plastic SOT-143 Package
RING
QUAD
CROSS-OVER
QUAD
3
4
3
4
Description/Applications
These low cost microwave
Schottky diodes are specifically
designed for use at X/Ku-bands
and are ideal for DBS and VSAT
downconverter applications. They
are available in SOT-23 and
SOT-143 standard package
configurations.
1
2
1
2
#7
#9
Note that Agilent's manufacturing
techniques assure that dice found in
pairs and quads are taken from
adjacent sites on the wafer, assur-
ing the highest degree of match.
Absolute Maximum Ratings[1], TA = +25°C
Notes:
Symbol Parameter
Unit
Min.
Max.
1. Operation in excess of any one
of these conditions may result
in permanent damage to the
device.
2. Measured in an infinite heat
sink at TCASE = 25°C. Derate
linearly to zero at 150°C per
diode.
PT
PIV
TJ
Total Device Dissipation[2]
mW
V
—
—
75
4
Peak Inverse Voltage
Junction Temperature
°C
°C
—
+150
+150
TSTG, Top Storage and Operating
Temperature
-65
ESD WARNING:
Handling Precautions Should Be Taken To Avoid Static Discharge.
2
DC Electrical Specifications, TA = 25°C
HSMS-8101
HSMS-8202
HSMS-8207
HSMS-8209
Symbol Parameters and Test Conditions
Units Min. Max. Min. Max. Min. Max. Min. Max.
VBR
CT
Breakdown Voltage
IR = 10 µA
V
pF
pF
Ω
4
4
4
4
Total Capacitance
VR = 0 V, f = 1 MHz
0.26
—
0.26
0.04
14
0.26
0.04
14
0.26
0.04
14
∆CT
RD
Capacitance Difference
VR = 0 V, f = 1 MHz
Dynamic Resistance
IF = 5 mA
14
∆RD
VF
Dynamic Resistance Difference
IF = 5 mA
Ω
—
2
2
2
Forward Voltage
IF = 1 mA
mV
mV
250
350
—
250
350
20
250
350
20
250
350
20
∆VF
Forward Voltage Difference
IF = 1 mA
Lead Code
1
2
7
9
Package Marking Code in White
where x is date code
R1x
2Rx
R7x
R9x
RF Electrical Parameters, TA = 25°C
Symbol
Parameter
Units
dB
Typical
6.3
Lc
Conversion Loss at 12 GHz
IF Impedance
ZIF
Ω
150
SWR
SWR at 12 GHz
1.2
Note:
DC Load Resistance = 0 Ω; LO Power = 1 mW.
SPICE Parameters
Linear Equivalent Circuit
0.08 pF
IS = 4.6 E-8
RS = 6
EG = 0.69
CJO = 0.18 E-12
PB (VJ) = 0.5
M = 0.5
TT = 0
N = 1.09
BV = 7.3
0.17 pF
1.0 nH
1.3 nH 6 Ω
IBV = 10E-5
FC = 0.5
R
j
Self Bias
1 mA
263
2.5 mA
142
R
j
3
Typical Performance, TC = 25°C
100
30
30
10
9
8
7
6
I
(Left Scale)
F
10
10
1
∆V (Right Scale)
F
TA = +125°C
1
1
0.1
0.01
T
T
A = +25°C
A = –55°C
0.3
0.3
0
0.2
0.4
0.6
0.8
0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55
–7 –5 –3 –1
1
3
5
7
9
11 13
FORWARD VOLTAGE (V)
V - FORWARD VOLTAGE (V)
LOCAL OSCILLATOR POWER (dBm)
Figure 1. Typical Forward Current
vs. Forward Voltage at Three
Temperatures.
Figure 2. Typical VF Match, HSMS-
820X Pairs and Quads.
Figure 3. Typical Conversion Loss
vs. Local Oscillator Power.
Ordering Information
Specify part number followed by option. For example:
Profile Option
Descriptions
-BLK = Bulk
HSMS - 8101 - XXX
-TR1 = 3K pc. Tape and Reel,
Device Orientation
Figures 4, 5
Bulk or Tape and Reel Option
Part Number
-TR2 = 10K pc. Tape and Reel,
Device Orientation
Figures 4, 5
Surface Mount Schottky
Tape and Reeling conforms to
Electronic Industries RS-481,
“Taping of Surface Mounted
Components for Automated
Placement.”
Device Orientation
REEL
For lead-free option, the part
number will have the character "G"
at the end, eg. -TR2G for a 10K pc
lead-free reel.
CARRIER
TAPE
USER
FEED
DIRECTION
COVER TAPE
TOP VIEW
4 mm
END VIEW
TOP VIEW
END VIEW
4 mm
8 mm
8 mm
ABC
ABC
ABC
ABC
ABC
ABC
ABC
ABC
Note: "AB" represents package marking code.
"C" represents date code.
Note: "AB" represents package marking code.
"C" represents date code.
Figure 4. Option -TR1/-TR2 for SOT-23 Packages.
Figure 5. Option -TR1/-TR2 for SOT-143 Packages.
Package Characteristics
Lead Material ...................................................................................... Alloy 42
Lead Finish............................................................................ Tin-Lead 85-15%
Maximum Soldering Temperature.............................. 260°C for 5 seconds
Minimum Lead Strength.......................................................... 2 pounds pull
Typical Package Inductance .................................................................. 2 nH
Typical Package Capacitance ..............................0.08 pF (opposite leads)
Package Dimensions
Outline 23 (SOT-23)
1.02 (0.040)
0.89 (0.035)
0.54 (0.021)
DATE CODE (X)
0.37 (0.015)
PACKAGE
MARKING
CODE (XX)
3
1.40 (0.055)
1.20 (0.047)
2.65 (0.104)
2.10 (0.083)
X X X
2
1
0.60 (0.024)
0.45 (0.018)
2.04 (0.080)
1.78 (0.070)
TOP VIEW
0.152 (0.006)
0.066 (0.003)
3.06 (0.120)
2.80 (0.110)
1.02 (0.041)
0.85 (0.033)
0.69 (0.027)
0.45 (0.018)
0.10 (0.004)
0.013 (0.0005)
SIDE VIEW
END VIEW
DIMENSIONS ARE IN MILLIMETERS (INCHES)
Outline 143 (SOT-143)
0.92 (0.036)
0.78 (0.031)
DATE CODE (X)
2
1
PACKAGE
MARKING
CODE (XX)
1.40 (0.055)
1.20 (0.047)
2.65 (0.104)
2.10 (0.083)
X X X
4
3
0.60 (0.024)
0.45 (0.018)
0.54 (0.021)
0.37 (0.015)
2.04 (0.080)
1.78 (0.070)
3.06 (0.120)
2.80 (0.110)
0.15 (0.006)
0.09 (0.003)
1.04 (0.041)
0.85 (0.033)
0.69 (0.027)
0.45 (0.018)
0.10 (0.004)
0.013 (0.0005)
DIMENSIONS ARE IN MILLIMETERS (INCHES)
Tape Dimensions and Product Orientation
For Outline SOT-23
P
P
D
2
E
F
P
0
W
D
1
t1
Ko
13.5° MAX
8° MAX
9° MAX
B
A
0
0
DESCRIPTION
SYMBOL
SIZE (mm)
SIZE (INCHES)
CAVITY
LENGTH
WIDTH
DEPTH
PITCH
A
B
K
P
3.15 0.10
2.77 0.10
1.22 0.10
4.00 0.10
1.00 + 0.05
0.124 0.004
0.109 0.004
0.048 0.004
0.157 0.004
0.039 0.002
0
0
0
BOTTOM HOLE DIAMETER
D
1
PERFORATION
CARRIER TAPE
DIAMETER
PITCH
POSITION
D
1.50 + 0.10
4.00 0.10
1.75 0.10
0.059 + 0.004
0.157 0.004
0.069 0.004
P
E
0
WIDTH
W
8.00+0.30–0.10 0.315+0.012–0.004
THICKNESS
t1
0.229 0.013
0.009 0.0005
DISTANCE
BETWEEN
CAVITY TO PERFORATION
(WIDTH DIRECTION)
F
3.50 0.05
0.138 0.002
CENTERLINE
CAVITY TO PERFORATION
(LENGTH DIRECTION)
P
2.00 0.05
0.079 0.002
2
For Outline SOT-143
P
D
P2
P0
E
F
W
D1
www.agilent.com/semiconductors
For product information and a complete list of
distributors, please go to our web site.
t1
K
0
9° MAX
9° MAX
For technical assistance call:
Americas/Canada: +1 (800) 235-0312 or
(916) 788-6763
A0
B
0
Europe: +49 (0) 6441 92460
DESCRIPTION
SYMBOL
SIZE (mm)
SIZE (INCHES)
China: 10800 650 0017
CAVITY
LENGTH
WIDTH
DEPTH
PITCH
A
0
3.19 0.10
2.80 0.10
1.31 0.10
4.00 0.10
1.00 + 0.25
0.126 0.004
0.110 0.004
0.052 0.004
0.157 0.004
0.039 + 0.010
Hong Kong: (65) 6756 2394
B
0
0
India, Australia, New Zealand: (65) 6755 1939
K
P
Japan: (+81 3) 3335-8152(Domestic/International), or
0120-61-1280(Domestic Only)
BOTTOM HOLE DIAMETER
D
1
Korea: (65) 6755 1989
PERFORATION
DIAMETER
PITCH
POSITION
D
1.50 + 0.10
4.00 0.10
1.75 0.10
0.059 + 0.004
0.157 0.004
0.069 0.004
P
E
0
Singapore, Malaysia, Vietnam, Thailand, Philippines,
Indonesia: (65) 6755 2044
CARRIER TAPE
DISTANCE
WIDTH
THICKNESS
W
t1
8.00+0.30–0.10 0.315+0.012–0.004
Taiwan: (65) 6755 1843
0.254 0.013
0.0100 0.0005
Data subject to change.
Copyright © 2004 Agilent Technologies, Inc.
Obsoletes 5988-3328EN
March 24, 2004
CAVITY TO PERFORATION
(WIDTH DIRECTION)
F
3.50 0.05
0.138 0.002
CAVITY TO PERFORATION
(LENGTH DIRECTION)
P
2.00 0.05
0.079 0.002
2
5989-0481EN
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