APW8713QBI-TRL [ANPEC]

High Input Voltage 8A PWM Converter With Adj. Soft Start; 高输入电压8A PWM变换器中,ADJ 。软启动
APW8713QBI-TRL
型号: APW8713QBI-TRL
厂家: ANPEC ELECTRONICS COROPRATION    ANPEC ELECTRONICS COROPRATION
描述:

High Input Voltage 8A PWM Converter With Adj. Soft Start
高输入电压8A PWM变换器中,ADJ 。软启动

软启动
文件: 总24页 (文件大小:801K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
APW8713  
High Input Voltage 8A PWM Converter With Adj. Soft Start  
Features  
General Description  
The APW8713 is a 8A, synchronous, step-down converter  
·
Adjustable Output Voltage from +0.8V to +12V  
with integrated 30mW N-channel High-Side MOSFET and  
9mW Low-Side MOSFET. The APW8713 steps down high  
voltage to generate low-voltage chipset or RAM supplies  
in notebook computers.  
- 0.8V Reference Voltage  
- +1% Accuracy over Temperature  
Operates from An Input Battery Voltage Range of  
+2.7V to +28V  
·
The APW8713 provides excellent transient response and  
accurate DC voltage output in either PFM or PWM Mode.  
In Pulse Frequency Mode (PFM), the APW8713 provides  
very high efficiency over light to heavy loads with loading-  
modulated switching frequencies. In PWM Mode, the con-  
verter works nearly at constant frequency for low-noise  
requirements.  
·
·
·
·
Power-On-Reset Monitoring on VCC pin  
Excellent line and load transient responses  
PFM mode for increased light load efficiency  
Programmable PWM Frequency from 100kHz to  
1000kHz  
·
·
Integrated 30mW at VCC=5V N-Channel MOSFET  
For High Side  
The APW8713 is equipped with accurate current-limit,  
output under-voltage, and output over-voltage protections,  
perfect for various applications. A Power-On-Reset func-  
tion monitors the voltage on VCC to prevent wrong  
operation during power-on. The APW8713 has external  
adjustable soft-start and built-in an integrated output dis-  
charge method for soft stop. A soft-start ramps up the  
output voltage with programmable timing to reduce the  
start-up current. A soft-stop function actively discharges  
the output capacitors.  
Integrated9mW atVCC=5VN-ChannelMOSFETFor  
Low Side  
·
·
·
Integrated Bootstrap Forward P-CH MOSFET  
External Adjustable Soft-Start and Soft-Stop  
Selectable Forced PWM or automatic PFM/PWM  
mode  
·
·
·
·
Power Good Monitoring  
70% Under-Voltage Protection  
125% Over-Voltage Protection  
Current-Limit Protection  
The APW8713 is available in TQFN4x4-23 (Power PAK).  
- Using Sense Low-Side MOSFET’s RDS(ON)  
Over-Temperature Protection  
TQFN-23 4mmx4mm package  
Lead Free and Green Device Available (RoHS  
Compliant)  
Applications  
·
·
·
·
·
·
·
·
·
·
Notebook  
Mother Board  
Table PC  
Hand-Held Portable  
AIO PC  
Set-top boxes  
LCD TV  
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and  
advise customers to obtain the latest version of relevant information to verify before placing orders.  
Copyright ã ANPEC Electronics Corp.  
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Rev. A.3 - Sep., 2013  
APW8713  
Simplified Application Circuit  
VCC  
EN  
RPOK  
VIN  
POK  
VIN  
LX  
H / L  
PFM  
LOUT  
VOUT  
CSS  
SS  
COUT  
APW8713  
Ordering and Marking Information  
Package Code  
QB: TQFN4x4-23  
Operating Ambient Temperature Range  
APW8713  
Assembly Material  
Handling Code  
°
I : -40 to 85 C  
Handling Code  
TR : Tape & Reel  
Lead Free Code  
Temperature Range  
Package Code  
L : Lead Free Device G : Halogen and Lead Free Device  
APW8713  
XXXXX  
XXXXX - Date Code  
APW8713 QB :  
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which  
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for  
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen  
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by  
weight).  
Pin Configuration  
POK 1  
EN 2  
17 LX  
16 LX  
PFM 3  
AGND 4  
FB 5  
15 PGND  
14 PGND  
13 PGND  
12 PGND  
VIN  
LX  
TON 6  
TQFN 4x4 -23 (TOP VIEW)  
= Exposed and Thermal Pad  
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Rev. A.3 - Sep., 2013  
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APW8713  
Absolute Maximum Ratings (Note 1)  
Symbol  
VVCC  
Parameter  
VCC Supply Voltage (VCC to AGND)  
Rating  
-0.3 ~ 7  
Unit  
V
VIN  
VIN Supply Voltage (VIN to AGND)  
TON Supply Voltage (TON to AGND)  
BOOT Supply Voltage (BOOT to AGND)  
BOOT Supply Voltage (BOOT to PHASE)  
-0.3 ~ 30  
-0.3 ~ 30  
-0.3 ~ 37  
-0.3 ~ 7  
V
VTON  
V
VBOOT-GND  
VBOOT  
VGND  
V
V
AGND to PGND  
-0.3 ~ +0.3  
-0.3 ~ 7  
V
All Other Pins (POK, EN, FB, SS and PFM to AGND)  
LX Voltage (LX to GND)  
V
-5 ~ 32  
-0.3 ~ 30  
VLX  
V
<20ns pulse width  
>20ns pulse width  
TJ  
150  
-65 ~ 150  
260  
oC  
oC  
oC  
Junction Temperature  
Storage Temperature  
TSTG  
TSDR  
Maximum Lead Soldering Temperature(10 Seconds)  
Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are  
stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom-  
mended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device  
reliability.  
Thermal Characteristics  
Symbol  
Parameter  
Typical Value  
Unit  
Junction-to-Ambient Resistance in free air (Note 2)  
50  
oC/W  
qJA  
Note 2: qJA is measured with the component mounted on a high effective thermal conductivity test board in free air.  
Recommended Operating Conditions (Note 3)  
Symbol  
VVCC  
VIN  
Parameter  
Range  
4.5 ~ 5.5  
2.7 ~ 28  
0.8 ~ 13.2  
0 ~ 8  
Unit  
V
VCC Supply Voltage  
Converter Input Voltage  
Converter Output Voltage  
Converter Output Current  
V
VOUT  
IOUT  
CIN  
V
A
PWM1/2 Converter Input Capacitor (MLCC)  
VCC Output Capacitor (MLCC)  
Ambient Temperature  
10 ~  
mF  
mF  
oC  
oC  
CVCC  
TA  
1.0 ~  
-40 ~ 85  
-40 ~ 125  
Junction Temperature  
TJ  
Note 3: Refer to the application circuit for further information.  
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Rev. A.3 - Sep., 2013  
APW8713  
Electrical Characteristics  
Unless otherwise specified, these specifications apply over VIN=12V,VEN=5V and TA= -40 to 85oC. Typical values are at TA=25oC.  
APW8713  
Symbol  
Parameter  
Test Condition  
Min.  
0.8  
Typ.  
Max.  
Unit  
VOUT AND VFB VOLTAGE  
VOUT  
VREF  
Output Voltage  
Adjustable output range  
13.2  
V
V
Reference Voltage  
Regulation Accuracy  
FB Input Bias Current  
0.8  
-
TA = -40 oC ~ 85 oC  
FB=0.75V  
-1.0  
+1.0  
-
%
mA  
IFB  
0.02  
EN go low to output remain below  
0.1V  
TSTOP  
Output Discharge Time  
-
5*Tss  
-
-
SUPPLY CURRENT  
IVCC_NOR  
MAL  
VCC Quiescent Supply  
Current  
EN=5V, FB=0.835V, VCC=5V  
EN=GND, VCC=5V  
-
-
0.7  
-
1
mA  
mA  
IVCC_SHD  
VCC Shutdown Current  
25  
N
ON-TIME TIMER AND INTERNAL SOFT START  
TON  
FSW  
Nominal on time  
200  
250  
300  
ns  
kHz  
ns  
VIN=12V, VOUT=1V, RTON=100kW  
Frequency adjustable range  
Minimum off time  
100  
1000  
TOFF(MIN)  
ISS  
VFB=0.75V, VPHASE=-0.1V  
Vss=0VCss=0.001uF to 0.1uF  
EN High to POK High  
-
8
-
250  
10  
-
12  
-
Internal Soft Start Current  
Internal Soft Start Time  
mA  
TSS  
330*Css  
ms  
GATE DRIVER  
High Side MOSFET On  
Resistance  
VIN=12VVCC=5V  
VIN=12VVCC=5V  
-
-
30  
9
45  
mW  
mW  
Low Side MOSFET On  
Resistance  
13.5  
BOOTSTRAP SWITCH  
VF  
IR  
Ron  
VPVCC – VBOOT-GND, IF = 10mA  
-
-
0.5  
-
0.7  
0.5  
V
VBOOT-GND = 30V, VPHASE = 25V,  
VPVCC = 5V  
Reverse Leakage  
mA  
VCC POR THRESHOLD  
Falling VCC POR Threshold  
VLCC_THF  
4.25  
-
4.35  
100  
4.45  
-
V
Voltage  
LDO POR Hysteresis  
mV  
CONTROL INPUTS  
EN High-Level Input Voltage  
2.5  
-
-
-
0.5  
-
V
V
EN Low-Level Input Voltage  
EN Leakage  
-
EN=0V  
-
2.5  
-
0.1  
-
mA  
V
PFM High-Level Input Voltage  
PFM Low-Level Input Voltage  
PFM Leakage  
-
-
0.5  
-
V
PFM=0V  
-
0.1  
mA  
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Rev. A.3 - Sep., 2013  
APW8713  
Electrical Characteristics  
Unless otherwise specified, these specifications apply over VIN=12V,VEN=5V and TA= -40 to 85oC. Typical values are at TA=25oC.  
APW8713  
Symbol  
Parameter  
Test Condition  
Min.  
Typ.  
Max.  
Unit  
POWER-OK INDICATOR  
POK in from Lower (POK Goes  
High)  
87  
90  
93  
%
%
VPOK  
POK Threshold  
POK out from Normal (POK Goes  
Low)  
120  
125  
130  
IPOK  
POK Leakage Current  
POK Sink Current  
VPOK=5V  
-
0.1  
7.5  
20  
-
-
-
-
mA  
mA  
ms  
VPOK=0.5V  
1.25  
POK Out Debounce Time2  
POK Enable Delay Time  
When run away 90%  
From EN High to POK High  
-
-
Tss  
ms  
CURRENT SENSE  
IOCP OCP Threshold  
Valley Current of IL  
11  
-5  
-
-
A
Zero Crossing Comparator  
Offset  
VGND-LX Voltage, PFM=0V  
0
5
mV  
PROTECTION  
VUV  
UVP Threshold  
65  
70  
16  
75  
%
ms  
ms  
%
UVP Debounce Interval  
UVP Enable Delay  
EN high to UVP workable  
OVP Occur  
Tss  
125  
3
VOVR  
OVP Rising Threshold1  
OVP Propagation Delay  
120  
-
130  
-
VFB Rising, Over Voltage=10mV  
ms  
OTP Rising Threshold (Note  
5)  
TOTR  
-
-
145  
45  
-
-
oC  
oC  
OTP Hysteresis (Note 5)  
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Rev. A.3 - Sep., 2013  
APW8713  
Typical Operating Characteristics  
Reference Voltage vs. Junction  
Switching Frequency vs. Output  
Current  
Temperature  
0.804  
1000  
100  
10  
0.802  
0.8  
0.798  
0.796  
0.794  
1
Automatic PFM/PWM Mode  
Force PWM Mode  
0.1  
0.001  
0.01  
0.1  
1
10  
-50  
-25  
0
25  
50  
75  
100  
Junction Temperature (oC)  
Output Current(A)  
Output Voltage vs Output Current  
Output Voltage vs Input Voltage  
1.090  
1.085  
1.080  
1.075  
1.070  
1.065  
1.060  
1.055  
1.050  
1.10  
1.09  
1.08  
Automatic PFM/PWM Mode  
Force PWM Mode  
1.07  
1.06  
1.05  
PFM Operation  
PWM Operation  
0
2
4
6
8
10  
0
5
10  
15  
20  
25  
30  
Output Current(A)  
Input Voltage(V)  
Switching Frequency vs. Input  
Voltage  
340  
330  
320  
310  
300  
290  
280  
0
5
10  
15  
20  
25  
30  
Input Voltage(V)  
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Rev. A.3 - Sep., 2013  
APW8713  
Operating Waveforms  
Refer to the typical application circuit. TA= 25oC unless otherwise specified.  
Enable Without Loading  
Enable With Loading  
VEN  
VEN  
1
2
1
2
VLX  
VLX  
VOUT  
VPOK  
VOUT  
VPOK  
3
3
4
4
CSS=10nF  
CSS=10nF  
CH1: VEN, 5V/Div, DC  
CH2: VLX, 10V/Div, DC  
CH1: VEN, 5V/Div, DC  
CH2: VLX, 10V/Div, DC  
CH3: VOUT, 500mV/Div, DC  
CH4: VPOK, 5V/Div, DC  
TIME:1ms/Div  
CH3: VOUT, 500mV/Div, DC  
CH4: VPOK, 5V/Div, DC  
TIME: 1ms/Div  
Soft- Stop Function  
Shutdown With Loading  
CSS=10nF  
VEN  
VLX  
VEN  
VLX  
1
1
2
2
VOUT  
VOUT  
VPOK  
VPOK  
3
4
3
4
CH1: VEN, 5V/Div, DC  
CH2: VLX, 10V/Div, DC  
CH3: VOUT, 500mV/Div, DC  
CH4: VPOK, 5V/Div, DC  
TIME:5ms/Div  
CH1: VEN, 5V/Div, DC  
CH2: VLX, 10V/Div, DC  
CH3: VOUT, 500mV/Div, DC  
CH4: VPOK, 5V/Div, DC  
TIME:500ms/Div  
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Rev. A.3 - Sep., 2013  
APW8713  
Operating Waveforms  
Refer to the typical application circuit. TA= 25oC unless otherwise specified.  
PWM Switching Waveform  
PFM Switching Waveform  
VOUT  
VOUT  
1
1
2
VLX  
VLX  
2
3
IL  
IL  
3
CH1: VOUT, 50mV/Div, AC  
CH2: VLX, 10V/Div, DC  
CH3: IL, 2A/Div, DC  
CH1: VOUT, 50mV/Div, AC  
CH2: VLX, 5V/Div, DC  
CH3: IL, 2A/Div, DC  
TIME: 2ms/Div  
TIME: 1ms/Div  
Load Transient 2  
Load Transient 1  
VOUT  
VOUT  
1
2
3
1
VLX  
VLX  
2
3
IL  
IL  
CH1: VOUT, 100mV/Div, AC  
CH2: VLX, 10V/Div, DC  
CH3: IL, 5A/Div, DC  
CH1: VOUT, 100mV/Div, AC  
CH2: VLX, 10V/Div, DC  
CH3: IL, 5A/Div, DC  
TIME: 20ms/Div  
TIME: 20ms/Div  
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Rev. A.3 - Sep., 2013  
APW8713  
Operating Waveforms  
Refer to the typical application circuit. TA= 25oC unless otherwise specified.  
Current LImit and UVP Function  
Short Circuit Protection  
VOUT  
VOUT  
1
2
1
2
VLX  
VLX  
IL  
IL  
3
3
CH1: VOUT, 1V/Div, DC  
CH2: VLX, 10V/Div, DC  
CH1: VOUT, 1V/Div, DC  
CH2: VLX, 10V/Div, DC  
CH3: IL, 10A/Div, DC  
CH3: IL, 10A/Div, DC  
TIME: 500ms/Div  
TIME: 20ms/Div  
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Rev. A.3 - Sep., 2013  
APW8713  
Pin Description  
PIN  
FUNCTION  
NO.  
1
NAME  
POK  
EN  
Power-Good Output Pin of PWM. POK is an open-drain output used to indicate the status of the PWM  
output voltage. Connect the POK in to +5V through a pull-high resistor.  
2
PWM Enable. PWM is enabled when EN=1. When EN=0, PWM is in shutdown.  
PFM Selection Input. When the PFM is above high logic level, the Device is in force PWM mode. When the  
PFM is below low logic level, the device is in automatic PFM/PWM Mode.  
3
PFM  
AGND  
FB  
4
Signal Ground for The IC.  
Output Voltage Feedback Pin. This pin is connected to the resistive divider that set the desired output  
voltage. The POK, UVP, and OVP circuits detect this signal to report output voltage status.  
5
6
7
TON  
NC  
This Pin is Allowed to Adjust The Switching Frequency. Connect a resistor RTON from TON pin to VIN pin.  
No connect.  
Battery Voltage Input Pin. VIN powers linear regulators and is also used for the constant on-time PWM  
on-time one-shot circuits. Connect VIN to the battery input and bypass with a 1mF capacitor for noise  
interference.  
8, 9, 22  
VIN  
LX  
Junction Point of The High-Side MOSFET Source, Output Filter Inductor and The Low-Side MOSFET Drain  
for PWM. Connect this pin to the Source of the high-side MOSFET. LX serves as the lower supply rail for the  
UGATE high-side gate driver. LX is the current-sense input for the PWM.  
10, 11,  
16~18  
12~15,  
19  
PGND  
BOOT  
Power Ground of The LGATE Low-Side MOSFET Drivers.  
Supply Input for The UGATE Gate Driver and an internal level-shift circuit. Connect to an external capacitor  
to create a boosted voltage suitable to drive a logic-level N-channel MOSFET.  
20  
Supply Voltage Input Pin for Control Circuitry, Connect +5V from the VCC pin to the GND pin. Decoupling at  
least 1mF of a MLCC capacitor from the VCC pin to the AGND pin.  
21  
23  
VCC  
SS  
Soft Start Output. Connect a capacitor to GND to set the soft start interval.  
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Rev. A.3 - Sep., 2013  
APW8713  
Block Diagram  
POK  
TON  
LX  
PFM  
GND  
125% VREF  
Mean Value  
Circuit  
Delay  
Current  
Limit  
90% VREF  
Reference  
125% VREF  
OV  
UV  
VIN  
Fault  
Latch  
Logic  
VCC  
BOOT  
70% VREF  
Thermal  
UG  
VLX  
Shutdown  
FB  
Gate  
Driver  
On-Time  
Generator  
Error  
Comparator  
LX  
PFM  
VCC  
LDO  
LX  
VREF  
LG  
Soft-Start  
Gate  
Driver  
POR  
EN  
PGND  
VCC  
SS  
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Rev. A.3 - Sep., 2013  
APW8713  
Typical Application Circuit  
When Vin=19V, Dual Power Input :  
19V  
VIN  
EN  
CIN  
10uF /25V X 4  
(MLCC)  
Mode  
Selection  
PFM  
100K  
TON  
LX  
5V  
VCC  
VOUT  
LOUT  
1.0uH  
APW8713  
1.058V, 8A  
CVCC  
1uF  
CBOOT  
0.1uF  
RPOK  
100k  
RTOP  
20k  
COUT1  
150uF  
COUT2  
22uFx4  
BOOT  
POK  
SS  
FB  
RGND  
62k  
PGND  
AGND  
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Rev. A.3 - Sep., 2013  
APW8713  
Typical Application Circuit  
When Vin=5V, Single Power Input :  
5V  
VIN  
EN  
CIN  
10uF /12V X 4  
(MLCC)  
PFM  
100K  
Mode  
Selection  
TON  
LX  
VCC  
VOUT  
LOUT  
1.0uH  
1.058V, 8A  
CVCC  
1uF  
CBOOT  
0.1uF  
APW8713  
RPOK  
RTOP  
20k  
100k  
COUT1  
150uF  
COUT2  
22uFx4  
BOOT  
POK  
FB  
RGND  
62k  
SS  
PGND  
AGND  
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Rev. A.3 - Sep., 2013  
APW8713  
Function Description  
Constant-On-Time PWM Controller with Input Feed-  
Forward  
Where FSW is the nominal switching frequency of the  
converter in PWM mode.  
The constant on-time control architecture is a pseudo-  
fixed frequency with input voltage feed-forward. This ar-  
chitecture relies on the output filter capacitor’s effective  
series resistance (ESR) to act as a current-sense resistor,  
so the output ripple voltage provides the PWM ramp signal.  
In PFM operation, the high-side switch on-time controlled  
by the on-time generator is determined solely by a one-  
shot whose pulse width is inversely proportional to input  
voltage and directly proportional to output voltage. In PWM  
operation, the high-side switch on-time is determined by  
a switching frequency control circuit in the on-time gen-  
erator block.  
The load current at handoff from PFM to PWM mode is  
given by:  
1
2
VIN - VOUT  
ILOAD (PFM toPWM)  
=
´
´ TON-PFM  
L
V
IN - VOUT  
1
VOUT  
=
´
´
2L  
FSW  
V
IN  
Forced-PWM Mode  
The Forced-PWM mode disables the zero-crossing  
comparator, which truncates the low-side switch on-time  
at the inductor current zero crossing. This causes the  
low-side gate-drive waveform to become the complement  
of the high-side gate-drive waveform. This in turn causes  
the inductor current to reverse at light loads while UG  
maintains a duty factor of VOUT/VIN. The benefit of Forced-  
PWM mode is to keep the switching frequency fairly  
constant. The Forced-PWM mode is most useful for re-  
ducing audio frequency noise, improving load-transient  
response, and providing sink-current capability for dy-  
namic output voltage adjustment.  
The switching frequency control circuit senses the switch-  
ing frequency of the high-side switch and keeps regulat-  
ing it at a constant frequency in PWM mode. The design  
improves the frequency variation and is more outstand-  
ing than a conventional constant on-time controller, which  
has large switching frequency variation over input voltage,  
output current and temperature. Both in PFM and PWM,  
the on-time generator, which senses input voltage on  
VIN pin, provides very fast on-time response to input line  
transients.  
When VPFM is above the PFM high threshold (2.5V,  
minimum), the converter is in forced-PWM mode. When  
VPFM is below the PFM low threshold (0.5V, maximum),  
the chip is in automatic PFM/PWM Mode.  
Another one-shot sets a minimum off-time (typical:  
250ns). The on-time one-shot is triggered if the error com-  
parator is high, the low-side switch current is below the  
current-limit threshold, and the minimum off-time one-  
shot has timed out.  
Power-On-Reset  
A Power-On-Reset (POR) function is designed to prevent  
wrong logic controls when the VCC voltage is low. The  
POR function continually monitors the bias supply volt-  
age on the VCC pin if at least one of the enable pins is set  
high. When the rising VCC voltage reaches the rising  
POR voltage threshold (4.35V, typical), the POR signal  
goes high and the chip initiates soft-start operations.  
Should this voltage drop lower than 4.25V (typical), the  
POR disables the chip.  
Over-Current Protection of the PWM Converter  
In PFM mode, an automatic switchover to pulse-frequency  
modulation (PFM) takes place at light loads. This  
switchover is affected by a comparator that truncates the  
low-side switch on-time at the inductor current zero  
crossing. This mechanism causes the threshold between  
PFM and PWM operation to coincide with the boundary  
between continuous and discontinuous inductor-current  
operation (also known as the critical conduction point).  
The on-time of PFM is given by:  
En Pin Control  
When VEN is above the EN high threshold (2.5V,  
minimum), the converter is enabled. When VEN is below  
the EN low threshold (0.5V, maximum), the chip is in the  
shutdown and only low leakage current is taken from  
VCC.  
1
VOUT  
TON-PFM  
=
´
FSW  
V
IN  
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Rev. A.3 - Sep., 2013  
APW8713  
Function Description (Cont.)  
Soft-Start  
Under-Voltage Protection (UVP)  
The APW8713 provides the programmed soft-start func-  
tion to limit the inrush current. The soft-start time can be  
programmed by the external capacitor between SS and  
GND. Typical charge current is 10uA, and the soft-start  
time can be calculated by the following formula:  
In the process of operation, if a short circuit occurs, the  
output voltage will drop quickly. When load current is big-  
ger than current limit threshold value, the output voltage  
will fall out of the required regulation range. The under-  
voltage protection circuit continually monitors the FB volt-  
age after soft-start is completed. If a load step is strong  
enough to pull the output voltage lower than the under  
voltage threshold, the under voltage threshold is 70% of  
the nominal output voltage, the internal UVP delay counter  
starts to count. After 16ms de-bounce time, the device  
turns off both high side and low-side MOSEFET with  
latched. Toggling enable pin to low, or recycling VIN, will  
clear the latch and bring the chip back to operation.  
TSS(ms) = 330´ CSS(nF)  
The APW8713 integrates soft-start circuits to ramp up the  
output voltage of the converter to the programmed regu-  
lation set point at a predictable slew rate. The slew  
rate of output voltage is internally controlled to limit the  
inrush current through the output capacitors during soft-  
start process. When the EN pin is pulled above the rising  
EN threshold voltage, the device initiates a soft-start pro-  
cess to ramp up the output voltage.  
Over-Voltage Protection (OVP)  
The over voltage function monitors the output voltage by  
FB pin. Should the FB voltage increase over 125% of the  
reference voltage due to the high-side MOSFET failure or  
for other reasons, the over voltage protection comparator  
designed with a 3ms noise filter will force the low-side  
MOSFET gate driver fully turn on and latch high. This ac-  
tion actively pulls down the output voltage.  
During soft-start stage before the PGOOD pin is ready,  
the under voltage protection is prohibited. The over volt-  
age and current limit protection functions are enabled. If  
the output capacitor has residue voltage before startup,  
both low-side and high-side MOSFETs are in off-state  
until the soft start voltage equal the VFB voltage. This will  
ensure the output voltage starts from its existing voltage  
level.  
This OVP scheme only clamps the voltage overshoot,  
and does not invert the output voltage when otherwise  
activated with a continuously high output from low-side  
MOSFET driver. It’s a common problem for OVP schemes  
with a latch. Once an over-voltage fault condition is set, it  
can only be reset by toggling EN or VIN power-on-reset  
signal.  
In the event of under-voltage, over-voltage, over-tempera-  
ture or shutdown, the chip enables the soft-stop function.  
The soft-stop function discharges the output voltages by  
low side turns MOSFET on linearly.  
Power Good Indicator  
POK is actively held low in shutdown and soft-start status.  
In the soft-start process, the POK is an open-drain. When  
the soft-start is finished, the POK is released. In normal  
operation, the POK window is from 90% to 125% of the  
converter reference voltage. When the output voltage has  
to stay within this window, POK signal will become high.  
When the output voltage outruns 90% or 125% of the  
target voltage, POK signal will be pulled low immediately.  
In order to prevent false POK drop, capacitors need to  
parallel at the output to confine the voltage deviation with  
severe load step transient.  
Current Limit  
The current limit circuit employs a "valley" current-sens-  
ing algorithm (See Figure 1). The APW8713 uses the  
low-side MOSFET’s RDS(ON) of the synchronous rectifier  
as a current-sensing element. If the magnitude of the  
current-sense signal at LX pin is above the current-limit  
threshold 11A(minimum), the PWM is not allowed to ini-  
tiate a new cycle. The actual peak current is greater than  
the current-limit threshold by an amount equal to the in-  
ductor ripple current. Therefore, the exact current-limit char-  
acteristic and maximum load capability are a function of  
the sense resistance, inductor value, and input voltage.  
Copyright ã ANPEC Electronics Corp.  
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Rev. A.3 - Sep., 2013  
APW8713  
Function Description (Cont.)  
Programming the On-Time Control and PWM Switch-  
ing Frequency  
Current Limit( Cont.)  
IPEAK  
The APW8713 does not use a clock signal to produce  
PWM. The device uses the constant on-time control ar-  
chitecture to produce pseudo-fixed frequency with input  
voltage feed-forward. The on-time pulse width is propor-  
tional to output voltage VOUT and inverse proportional to  
input voltage VIN. In PWM, the on-time calculation is writ-  
ten as below equation.  
IOUT  
ΔI  
ILIMIT  
0
Time  
26.3´ 10-12 ´ RTON(W)  
TON  
=
V (V)  
IN  
Figure 1. Current Limit algorithm  
Where:  
RTON is the resistor connected from TON pin to VIN pin.  
Furthermore, The approximate PWM switching frequency  
is written as:  
The PWM controller uses the low-side MOSFETs on-re-  
sistance RDS(ON) to monitor the current for protection  
against shorted outputs. The MOSFET’s RDS(ON) is varied  
by temperature and gate to source voltage, the user  
should determine the maximum RDS(ON) in manufacture’s  
datasheet.  
VOUT  
D
V
IN  
TON  
=
FSW =  
FSW  
TON  
The PCB layout guidelines should ensure that noise and  
DC errors do not corrupt the current-sense signals at LX.  
Place the hottest power MOSEFTs as close to the IC as  
possible for best thermal coupling. When combined with  
the under-voltage protection circuit, this current-limit  
method is effective in almost every circumstance.  
Where:  
FSW is the PWM switching frequency.  
Over-Temperature Protection (OTP)  
When the junction temperature increases above the ris-  
ing threshold temperature TOTR, the IC will enter the over  
temperature protection state that suspends the PWM,  
which forces the UG and LG gate drivers output low. The  
thermal sensor allows the converters to start a start-up  
process and regulate the output voltage again after the  
junction temperature cools by 45oC. The OTP designed  
with a 45oC hysteresis lowers the average TJ during con-  
tinuous thermal overload conditions, which increases life-  
time of the APW8713.  
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Rev. A.3 - Sep., 2013  
APW8713  
Application Information  
A good starting point is to choose the ripple current to be  
approximately 30% of the maximum output current. Once  
the inductance value has been chosen, selecting an in-  
ductor that is capable of carrying the required peak cur-  
rent without going into saturation.In some types of  
inductors, especially core that is made of ferrite, the ripple  
current will increase abruptly when it saturates. This re-  
sults in a larger output ripple voltage. Besides, the induc-  
tor needs to have low DCR to reduce the loss of efficiency.  
Output Inductor Selection  
The output voltage is adjustable from 0.8V to 12V with a  
resistor-divider connected with FB, GND, and converter?¦s  
output. Using 1% or better resistors for the resistor-di-  
vider is recommended. The output voltage is determined  
by:  
RTOP  
VOUT = 0.8 ´ (1+  
)
RGND  
Output Capacitor Selection  
Where 0.8 is the reference voltage, RTOP is the resistor  
connected from converter¡¦s output to FB, and RGND is the  
resistor connected from FB to GND. Suggested RGND is in  
the range from 1k to 20kW. To prevent stray pickup, locate  
resistors RTOP and RGND close to APW8713.  
Output voltage ripple and the transient voltage deviation  
are factors that have to be taken into consideration when  
selecting an output capacitor. Higher capacitor value and  
lower ESR reduce the output ripple and the load transient  
drop. Therefore, selecting high performance low ESR  
capacitors is recommended for switching regulator  
applications. In addition to high frequency noise related  
to MOSFET turn-on and turnoff, the output voltage ripple  
includes the capacitance voltage drop DVCOUT and ESR  
voltage drop DVESR caused by the AC peak-to-peak  
inductor’s current. These two voltages can be represented  
by:  
Output Inductor Selection  
The duty cycle (D) of a buck converter is the function of the  
input voltage and output voltage. Once an output voltage  
is fixed, it can be written as:  
VOUT  
D =  
V
IN  
IRIPPLE  
DCOUT  
=
8 ´ COUT ´ FSW  
The inductor value (L) determines the inductor ripple  
current, IRIPPLE, and affects the load transient response.  
Higher inductor value reduces the inductor?¦s ripple cur-  
rent and induces lower output ripple voltage. The ripple  
current and ripple voltage can be approximated by:  
DVESR = IRIPPLE ´ RESR  
These two components constitute a large portion of the  
total output voltage ripple. In some applications, multiple  
capacitors have to be paralleled to achieve the desired  
ESR value. If the output of the converter has to support  
another load with high pulsating current, more capacitors  
are needed in order to reduce the equivalent ESR and  
suppress the voltage ripple to a tolerable level. A small  
decoupling capacitor (1mF) in parallel for bypassing the  
noise is also recommended, and the voltage rating of the  
output capacitors are also must be considered.  
V
IN - VOUT VOUT  
IRIPPLE  
=
´
FSW ´ L  
V
IN  
Where FSW is the switching frequency of the regulator.  
Although the inductor value and frequency are increased  
and the ripple current and voltage are reduced, a tradeoff  
exists between the inductor’s ripple current and the regu-  
lator load transient response time.  
A smaller inductor will give the regulator a faster load  
transient response at the expense of higher ripple current.  
Increasing the switching frequency (FSW) also reduces  
the ripple current and voltage, but it will increase the  
switching loss of the MOSFETs and the power dissipa-  
tion of the converter. The maximum ripple current occurs  
at the maximum input voltage.  
To support a load transient that is faster than the switch-  
ing frequency, more capacitors are needed for reducing  
the voltage excursion during load step change. Another  
aspect of the capacitor selection is that the total AC cur-  
rent going through the capacitors has to be less than the  
rated RMS current specified on the capacitors in order to  
prevent the capacitor from over-heating.  
Copyright ã ANPEC Electronics Corp.  
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Rev. A.3 - Sep., 2013  
APW8713  
Application Information (Cont.)  
Input Capacitor Selection  
Layout Consideration  
The input capacitor is chosen based on the voltage rating  
and the RMS current rating. For reliable operation, select-  
ing the capacitor voltage rating to be at least 1.3 times  
higher than the maximum input voltage. The maximum  
RMS current rating requirement is approximately IOUT/2,  
where IOUT is the load current. During power-up, the input  
capacitors have to handle great amount of surge current.  
For low-duty notebook applications, ceramic capacitor is  
recommended. The capacitors must be connected be-  
tween the drain of high-side MOSFET and the source of  
low-side MOSFET with very low-impedance PCB layout.  
In any high switching frequency converter, a correct lay-  
out is important to ensure proper operation of the  
regulator. With power devices switching at higher  
frequency, the resulting current transient will cause volt-  
age spike across the interconnecting impedance and  
parasitic circuit elements. As an example, consider the  
turn-off transition of the PWM MOSFET. Before turn-off  
condition, the MOSFET is carrying the full load current.  
During turn-off, current stops flowing in the MOSFET and  
is freewheeling by the low side MOSFET and parasitic  
diode. Any parasitic inductance of the circuit generates a  
large voltage spike during the switching interval. In  
general, using short and wide printed circuit traces should  
minimize interconnecting impedances and the magni-  
tude of voltage spike. Besides, signal and power grounds  
are to be kept separate and finally combined using ground  
plane construction or single point grounding. The best  
tie-point between the signal ground and the power ground  
is at the negative side of the output capacitor on each  
channel, where there is less noise. Noisy traces beneath  
the IC are not recommended. Below is a checklist for  
your layout:  
Thermal Consideration  
Because the APW8802 build-in high-side and low-side  
MOSFET, the heat dissipated may exceed the maximum  
junction temperature of the part in applications. If the junc-  
tion temperature reaches approximately 150oC, both  
power switches will be turned off and the LX node will  
become high impedance. To avoid the APW8713 from  
exceeding the maximum junction temperature, the user  
will need to do some thermal analysis. The goal of the  
thermal analysis is to determine whether the power dis-  
sipated exceeds the maximum junction temperature of  
the part. The main power dissipated by the part is  
approximated:  
- Keep the switching nodes (BOOT and LX) away from  
sensitive small signal nodes since these nodes are  
fast moving signals. Therefore, keep traces to these  
nodes as short as possible and there should be no  
other weak signal traces in parallel with theses traces  
on any layer.  
PUPPER = IO2 UT(1+ TC)(RDS(ON))D + 0.5(IOUT)(V )(tSW )FSW  
IN  
= IO2 UT(1+ TC)(RDS(ON))(1-D)  
- The large layout plane between the drain of the MOSFETs  
(VIN and LX nodes) can get better heat sinking.  
- The current sense resistor should be close to OCSET  
pin to avoid parasitic capacitor effect and noise coupling.  
- Decoupling capacitors, the resistor-divider, and boot  
capacitor should be close to their pins.  
P
LOWER  
IOUT is the load current  
TC is the temperature dependency of RDS(ON)  
FSW is the switching frequency  
tSW is the switching interval  
- The output bulk capacitors should be close to the loads.  
The input capacitor’s ground should be close to the  
grounds of the output capacitors.  
D is the duty cycle  
Note that both internal MOSFETs have conduction losses  
while the upper MOSFET include an additional transition  
loss. The switching internal, tSW, is the function of the  
reverse transfer capacitance CRSS. The (1+TC) term fac-  
tors in the temperature dependency of the RDS(ON) and can  
be extracted from the "RDS(ON) vs. Temperature" curve  
of the power MOSFET. In APW8713 case, the RDS(ON) is  
about 30mW from specification table.  
- Locate the resistor-divider close to the FB pin to mini-  
mize the high impedance trace. In addition, FB pin traces  
can’t be close to the switching signal traces (BOOT and  
LX).  
Copyright ã ANPEC Electronics Corp.  
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Rev. A.3 - Sep., 2013  
APW8713  
Application Information (Cont.)  
Recommended Minimum Footprint  
TQFN4x4-23  
4mm  
ThermalVia  
diameter  
0.3mm X 12  
0.45mm *  
1.35mm  
0.14mm  
0.3mm  
4mm  
0.2mm  
0.5mm  
0.51mm  
0.94mm  
0.37mm  
0.45mm  
* Just Recommend  
Copyright ã ANPEC Electronics Corp.  
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Rev. A.3 - Sep., 2013  
APW8713  
Package Information  
TQFN4x4-23  
D
A
Pin 1  
A1  
A3  
NX  
Pin 1 Corner  
aaa  
C
D1  
D2  
TQFN4x4-23  
MILLIMETERS  
MIN. MAX.  
S
Y
M
B
O
L
INCHES  
MIN.  
MAX.  
0.032  
0.002  
A
0.70  
0.00  
0.80  
0.05  
0.028  
0.000  
A1  
A3  
b
0.20 REF  
0.008 REF  
0.008  
0.154  
0.102  
0.116  
0.154  
0.049  
0.033  
0.012  
0.161  
0.109  
0.124  
0.161  
0.057  
0.041  
0.20  
3.90  
2.58  
2.95  
3.90  
1.24  
0.85  
0.30  
4.10  
2.78  
3.15  
4.10  
1.44  
1.05  
D
D1  
D2  
E
E1  
E2  
e
0.50 BSC  
0.020 BSC  
0.35  
0.20  
0.45  
0.014  
0.008  
0.018  
L
K
0.003  
aaa  
0.08  
Copyright ã ANPEC Electronics Corp.  
Rev. A.3 - Sep., 2013  
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APW8713  
Carrier Tape & Reel Dimensions  
P0  
P2  
P1  
OD0  
A
K0  
A0  
A
OD1  
B
B
SECTION A-A  
SECTION B-B  
d
T1  
Application  
TQFN4x4  
A
H
T1  
12.4+2.00 13.0+0.50  
-0.00 -0.20  
P2 D0  
C
d
D
W
E1  
F
5.50±0.10  
K0  
330.0±2.00  
50 MIN.  
1.5 MIN.  
D1  
20.2 MIN. 12.0±0.30 1.75±0.10  
P0  
P1  
T
A0  
B0  
1.5+0.10  
-0.00  
0.6+0.00  
-0.40  
4.00±0.10 8.00±0.10 2.00±0.05  
1.5 MIN.  
4.30±0.20 4.30±0.20 1.00±0.20  
(mm)  
Devices Per Unit  
Package Type  
TQFN4x4  
Unit  
Quantity  
3000  
Tape & Reel  
Copyright ã ANPEC Electronics Corp.  
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Rev. A.3 - Sep., 2013  
APW8713  
Taping Direction Information  
TQFN4x4  
USER DIRECTION OF FEED  
Classification Profile  
Copyright ã ANPEC Electronics Corp.  
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Rev. A.3 - Sep., 2013  
APW8713  
Classification Reflow Profiles  
Profile Feature  
Sn-Pb Eutectic Assembly  
Pb-Free Assembly  
Preheat & Soak  
100 °C  
150 °C  
60-120 seconds  
150 °C  
200 °C  
60-120 seconds  
Temperature min (Tsmin  
)
Temperature max (Tsmax  
)
Time (Tsmin to Tsmax) (ts)  
Average ramp-up rate  
(Tsmax to TP)  
3 °C/second max.  
3°C/second max.  
Liquidous temperature (TL)  
Time at liquidous (tL)  
183 °C  
60-150 seconds  
217 °C  
60-150 seconds  
Peak package body Temperature  
(Tp)*  
See Classification Temp in table 1  
20** seconds  
See Classification Temp in table 2  
30** seconds  
Time (tP)** within 5°C of the specified  
classification temperature (Tc)  
Average ramp-down rate (Tp to Tsmax  
)
6 °C/second max.  
6 °C/second max.  
6 minutes max.  
8 minutes max.  
Time 25°C to peak temperature  
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.  
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.  
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)  
Volume mm3  
350  
Package  
Thickness  
<2.5 mm  
³ 2.5 mm  
Volume mm3  
<350  
235 °C  
220 °C  
220 °C  
220 °C  
Table 2. Pb-free Process – Classification Temperatures (Tc)  
Package  
Thickness  
<1.6 mm  
Volume mm3  
Volume mm3  
350-2000  
260 °C  
Volume mm3  
<350  
260 °C  
260 °C  
250 °C  
>2000  
260 °C  
245 °C  
245 °C  
1.6 mm – 2.5 mm  
³ 2.5 mm  
250 °C  
245 °C  
Reliability Test Program  
Test item  
SOLDERABILITY  
HOLT  
Method  
JESD-22, B102  
JESD-22, A108  
JESD-22, A102  
JESD-22, A104  
MIL-STD-883-3015.7  
JESD-22, A115  
JESD 78  
Description  
5 Sec, 245°C  
1000 Hrs, Bias @ Tj=125°C  
168 Hrs, 100%RH, 2atm, 121°C  
500 Cycles, -65°C~150°C  
VHBM2KV  
PCT  
TCT  
HBM  
MM  
VMM200V  
10ms, 1tr100mA  
Latch-Up  
Copyright ã ANPEC Electronics Corp.  
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Rev. A.3 - Sep., 2013  
APW8713  
Customer Service  
Anpec Electronics Corp.  
Head Office :  
No.6, Dusing 1st Road, SBIP,  
Hsin-Chu, Taiwan, R.O.C.  
Tel : 886-3-5642000  
Fax : 886-3-5642050  
Taipei Branch :  
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,  
Sindian City, Taipei County 23146, Taiwan  
Tel : 886-2-2910-3838  
Fax : 886-2-2917-3838  
Copyright ã ANPEC Electronics Corp.  
Rev. A.3 - Sep., 2013  
24  
www.anpec.com.tw  

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