APX9166EI [ANPEC]
Single-Phase Full-Wave Motor Dr iver with Built - in Hall Sensor;
| 型号： | APX9166EI |
| 厂家： | 
ANPEC ELECTRONICS COROPRATION |
| 描述： | Single-Phase Full-Wave Motor Dr iver with Built - in Hall Sensor |
| 文件： | 总10页 (文件大小：166K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
APX9166
Single-Phase Full-Wave Motor Driver with Built-in Hall Sensor
Features
General Description
The APX9166 is an integrated Hall Effect Sensor IC de-
signed for electric commutation of single-phase DC
brushless motor applications. The device is built-in lock
•
•
•
•
•
•
•
On-Chip Hall Sensor
Silent Driver
High Sensitivity Hall Effect Sensor IC: ±15G(Type.)
Built-in Lock Protection and Auto Restart Function
Built-In Thermal Protection Circuit
4 Pin TO92-M4 Package
protection. When fan is locked, the device will enter the
lock protection mode. It is also with thermal shutdown
function. The APX9166 is available in a low cost TO92-M4
package.
Lead Free and Green Devices Available
(RoHS Compliant)
Pin Description
APX9166
Front View
Applications
1 : VDD
2 : OUT1
3 : OUT2
4 : GND
•
•
Brushless DC Fans
Brushless DC Motors
1
2
3
4
Ordering and Marking I nform ation
Package Code
E : TO - 92M4
Temperature Range
I : -40 to 105 oC
Handling Code
PB : Plastic Bag
Assembly Material
G : Halogen and Lead Free Device
APX9166
Assembly Material
Handling Code
Temperature Range
Package Code
APX
9166
XXXXX
XXXXX - Date Code
APX9166 E :
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise
customers to obtain the latest version of relevant information to verify before placing orders.
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ANPEC Electronics Corp.
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Rev. A.5 - Aug., 2017
APX9166
Absolute Maxim um Ratings (TA= 25°C unless otherwise noted) (Note 1)
Symbol
VDD
Parameter
VDD Pin Supply Voltage (VDD to GND)
Rating
Unit
V
-0.3 to 20
Output Pin (OUT1, OUT2) Output Voltage
VOUT
-0.3 to 20
450
V
Output Pin (OUT1, OUT2) Maximum Output Current – Continuous
IOUT
Hold
1000
1200
150
mA
Peak
oC
oC
oC
Maximum Junction Temperature
TJ
Storage Temperature
TSTG
TSOR
-65 to 150
260
Maximum Lead Soldering Temperature, 10 Seconds
Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom-
mended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device
reliability.
Therm al Characteristics
Symbol
Parameter
Typical Value
Unit
Thermal Resistance-Junction to Ambient (Note 2)
131
oC/W
RTHJA
,
TO-92M4
TO-92M4
Pow er Dissipation, TA = 25°C
PD
950
mW
Note 3 : The maximum allowable power dissipation at any TA (ambient temperature) is calculated using: PD (max) =(TJ – TA) / θJA; TJ =
150°C. Exceeding the maximum allowable power dissipation will result in excessive die temperature.
Recom m ended Operating Conditions
Symbol
Parameter
Range
2.2 to 17
-40 to 105
-40 to 125
Unit
V
VDD
VDD Supply Voltage
TA
Operating Ambient Temperature
Junction Temperature
oC
TJ
oC
Electrical Characteristics (TA=25°C, VDD=12V unless otherwise noted)
APX9166
Typ.
5.5
Symbol
Parameter
Test Conditions
Unit
Min.
Max.
6.5
0.8
0.52
5.2
12
-
IDD
VO
VDD Supply Current
VDD=17V, no load
mA
V
Output Driver Saturation Voltage
Lock Detection On Time
IOUT=400mA, Upper and Lower total
-
0.65
0.4
TON
TOFF
RTLK
ILIM
0.28
sec
sec
-
Lock Detection Off Time
2.8
4
TOFF/TON Ratio
8
-
10
Internal Current Limit (50% Output)
Over Temperature Shutdown Threshold
1100
165
30
mA
oC
oC
-
-
OTS
Over Temperature Shutdown Hysteresis
-
-
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Rev. A.5 - Aug., 2017
APX9166
Magnetic Characteristics (TA=25°C, VDD=12V unless otherwise noted)
APX9166
Typ.
15
Symbol
Parameter
Test Conditions
Unit
Min.
5
Max.
30
-5
Bop
Brp
Magnetic Operation Point
Magnetic Release Point
Magnetic Hysteresis
Gauss
Gauss
Gauss
-30
-
-15
Bhys
30
-
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Rev. A.5 - Aug., 2017
APX9166
Typical Operating Characteristics
Output Saturation Voltage vs.
Output Current
VDD Supply Current vs. VDD Supply Voltage
1.2
1
7
VDD = 12V
6
5
4
3
2
1
Upper Side
0.8
0.6
0.4
0.2
0
Lower Side
0
0
100 200 300 400 500 600 700 800 900 1000
Output Current(mA)
0 1 2 3 4 5 6 7 8 9 1011121314151617181920
VDD Supply Voltage(V)
Magnetic Switching Points vs.
Junction Temperature
Magnetic Switching Points vs.
VDD Supply Voltage
30
30
20
10
0
VDD = 12V
Bop
Bop
20
10
0
-10
-20
-30
-10
Brp
-20
Brp
-30
-50 -25
0
25
50
75
100 125 150
0
1 2 3 4 5 6 7 8 9 1011 1213 1415 1617 18
VDD Supply Voltage(V)
Junction Temperature(oC)
Maximum Power Dissipation vs.
Ambient Temperature
1000
900
800
700
600
500
400
300
200
100
0
0
25
50
75
100
125
150
Ambient Temperature(oC)
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Rev. A.5 - Aug., 2017
APX9166
Pin Description
PIN
FUNCTION
NO.
1
NAME
VDD
Supply Voltage Input.
H-bridge output connection.
H-bridge output connection.
Ground of the IC.
2
OUT1
OUT2
GND
3
4
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Rev. A.5 - Aug., 2017
APX9166
Block Diagram
VDD
Voltage
Regulator
OUT2
OUT1
Hall
Plane
Logic Control
Citcuit
Oscillator
GND
Typical Application Circuit
APX9166
1
2
3
4
Option
VIN
D
1
FG
Q1
R
1
R2
C1
coil
Notes: D1 is to protect IC when reverse power input.
C must use at least 1 F/25V capacitor and place as close to IC as possible .
R , R and Q1 are for FG function application circuit (by OUT2 only).
µ
1
1
2
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Rev. A.5 - Aug., 2017
APX9166
Function Description
Output Switch Principle
The APX9166 built in a Hall-effect sensor plane to sense
the vertical magnetic flux density (B). There are two out-
put drivers in APX9166 to drive single-phase DC
brushless motor. When the S pole magnetic field close
to the IC marking surface and the magnetic flux density
higher than operate point (Bop), the OUT1 pin output will
turn to LOW and the OUT2 pin output will turn to HIGH.
When the S pole magnetic field far away the IC marking
surface and N pole magnetic field close to the IC mark-
ing surface until the magnetic flux density higher than
release point (Brp), the OUT1 pin output will turn HIGH
and the OUT2 pin output will turn LOW.
B=0
TOFF
TOFF
OUT2
OUT1
TON
Lock
Detection
Release Reset
Lock
Brp
Bop
S
N
N
S
Thermal Protection
The APX9166 has a thermal protection. When the inter-
nal junction temperature reaches 165oC, the output de-
vices will be switched off. When the IC’s junction tem-
perature cools by 30oC, the thermal sensor will turn the
output devices on again, resulting in a pulsed output dur-
ing continuous thermal protection.
Marking Surface
Marking Surface
VOUT1
VOUT1
B
B
Brp
Bop
Brp
Bop
Bhys
Bhys
VOUT2
VOUT2
B
B
Brp
Bop
Brp
Bop
Lockup Protection and Automatic Restart
The APX9166 detects the rotation of the motor by internal
hall sensor signal, and adjusts lock detection ON time
(TON) and lock detection OFF time (TOFF) by internal counter.
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Rev. A.5 - Aug., 2017
APX9166
Package I nform ation
TO-92M4
Hall element location
0.52
D
I
E
s
1.95
b
e
c
Sensitive Area (0.286x0.286mm2)
Position of Hall Sensor
reference to the top-left of package
x= 1.45±0.1mm
y= 1.95±0.1mm
TO-92M4
S
Y
M
B
O
L
MILLIMETERS
MIN.
INCHES
MAX.
3.75
0.56
0.51
5.32
MIN.
MAX.
0.148
0.022
0.020
0.209
A
3.45
0.31
0.35
4.98
0.136
0.012
0.014
0.196
b
c
D
0.050 BSC
e
1.27 BSC
0.055
0.149
0.531
0.053
0.020
0.071
0.184
0.622
0.065
0.035
E
1.40
3.78
13.50
1.34
0.50
1.80
4.67
15.80
1.65
0.90
l
L
L2
s
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Rev. A.5 - Aug., 2017
APX9166
Classification Profile
Classification Reflow Profiles
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
Preheat & Soak
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-120 seconds
Temperature min (Tsmin
)
Temperature max (Tsmax
Time (Tsmin to Tsmax) (ts)
)
Average ramp-up rate
(Tsmax to TP)
3 °C/second max.
3°C/second max.
Liquidous temperature (TL)
Time at liquidous (tL)
183 °C
60-150 seconds
217 °C
60-150 seconds
Peak package body Temperature
(Tp)*
See Classification Temp in table 1
20** seconds
See Classification Temp in table 2
30** seconds
Time (tP)** within 5°C of the specified
classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax
)
6 °C/second max.
6 °C/second max.
6 minutes max.
8 minutes max.
Time 25°C to peak temperature
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
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APX9166
Classification Reflow Profiles ( Cont.)
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)
Volume mm3
≥350
Package
Thickness
<2.5 mm
Volume mm3
<350
235 °C
220 °C
≥2.5 mm
220 °C
220 °C
Table 2. Pb-free Process – Classification Temperatures (Tc)
Package
Thickness
<1.6 mm
Volume mm3
Volume mm3
350-2000
260 °C
Volume mm3
<350
>2000
260 °C
245 °C
245 °C
260 °C
260 °C
250 °C
1.6 mm – 2.5 mm
≥2.5 mm
250 °C
245 °C
Reliability Test Program
Test item
Method
JESD-22, B102
JESD-22, A108
Description
5 Sec, 245°C
1000 Hrs, Bias @ Tj=125°C
168 Hrs, 100%RH, 2atm, 121°C
500 Cycles, -65°C~150°C
VHBM≧2KV
SOLDERABILITY
HOLT
PCT
JESD-22, A102
JESD-22, A104
MIL-STD-883-3015.7
JESD-22, A115
JESD 78
TCT
HBM
VMM≧200V
MM
10ms, 1tr≧100mA
Latch-Up
Custom er Service
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838
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