AOD450 [AOS]

N-Channel Enhancement Mode Field Effect Transistor; N沟道增强型网络场效晶体管
AOD450
型号: AOD450
厂家: ALPHA & OMEGA SEMICONDUCTORS    ALPHA & OMEGA SEMICONDUCTORS
描述:

N-Channel Enhancement Mode Field Effect Transistor
N沟道增强型网络场效晶体管

晶体 晶体管
文件: 总5页 (文件大小:117K)
中文:  中文翻译
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AOD450  
N-Channel Enhancement Mode Field Effect Transistor  
General Description  
Features  
The AOD450 uses advanced trench technology and  
design to provide excellent RDS(ON) with low gate  
charge. This device is suitable for use in inverter, load  
switching and general purpose applications. Standard  
product AOD450 is Pb-free (meets ROHS & Sony  
259 specifications). AOD450L is a Green Product  
ordering option. AOD450 and AOD450L are  
electrically identical.  
VDS (V) = 200V  
ID = 3.8A  
RDS(ON) <0.7(VGS = 10V)  
TO-252  
D-PAK  
D
Top View  
Drain Connected to  
Tab  
G
S
G
D
S
Absolute Maximum Ratings TA=25°C unless otherwise noted  
Parameter  
Symbol  
Maximum  
Units  
VDS  
Drain-Source Voltage  
200  
V
VGS  
Gate-Source Voltage  
±30  
V
A
TC=25°C  
3.8  
Continuous Drain  
Current  
TC=100°C  
ID  
2.7  
Pulsed Drain Current C  
Avalanche Current C  
Repetitive avalanche energy L=1.35mH C  
IDM  
IAR  
EAR  
10  
3
6
A
mJ  
TC=25°C  
25  
PD  
W
Power Dissipation B  
TC=100°C  
12.5  
2.1  
TA=25°C  
PDSM  
W
Power Dissipation A  
TA=70°C  
1.3  
TJ, TSTG  
Junction and Storage Temperature Range  
-55 to 175  
°C  
Thermal Characteristics  
Parameter  
Symbol  
Typ  
17.1  
50  
Max  
Units  
°C/W  
°C/W  
°C/W  
Maximum Junction-to-Ambient A  
30  
60  
6
t 10s  
RθJA  
Maximum Junction-to-Ambient A  
Maximum Junction-to-Case B  
Steady-State  
Steady-State  
RθJC  
4
Alpha & Omega Semiconductor, Ltd.  
AOD450  
Electrical Characteristics (TJ=25°C unless otherwise noted)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
STATIC PARAMETERS  
BVDSS  
Drain-Source Breakdown Voltage  
ID=10mA, VGS=0V  
VDS=160V, VGS=0V  
200  
V
1
5
IDSS  
Zero Gate Voltage Drain Current  
µA  
TJ=55°C  
IGSS  
Gate-Body leakage current  
Gate Threshold Voltage  
On state drain current  
VDS=0V, VGS=±30V  
VDS=VGS, ID=250µA  
VGS=10V, VDS=15V  
100  
6
nA  
V
VGS(th)  
ID(ON)  
3
5
10  
A
VGS=10V, ID=3.8A  
0.55  
1.1  
8.7  
0.8  
0.70  
1.32  
RDS(ON)  
Static Drain-Source On-Resistance  
TJ=125°C  
gFS  
VSD  
IS  
Forward Transconductance  
Diode Forward Voltage  
VDS=15V, ID=3.8A  
S
V
A
IS=1A, VGS=0V  
Maximum Body-Diode Continuous CurrentG  
1
6
DYNAMIC PARAMETERS  
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
215  
32  
pF  
pF  
pF  
V
GS=0V, VDS=25V, f=1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate resistance  
7.2  
5.5  
VGS=0V, VDS=0V, f=1MHz  
SWITCHING PARAMETERS  
Qg(10V)  
Total Gate Charge  
Total Gate Charge  
Gate Source Charge  
Gate Drain Charge  
Turn-On DelayTime  
Turn-On Rise Time  
Turn-Off DelayTime  
Turn-Off Fall Time  
3.82  
0.92  
1.42  
1.47  
6.3  
nC  
nC  
nC  
nC  
ns  
Qg(4.5V)  
V
GS=10V, VDS=25V, ID=3.8A  
Qgs  
Qgd  
tD(on)  
tr  
VGS=10V, VDS=25V, RL=6.5,  
RGEN=3Ω  
3.3  
ns  
tD(off)  
tf  
10.5  
2.8  
ns  
ns  
trr  
IF=3.8A, dI/dt=100A/µs  
IF=3.8A, dI/dt=100A/µs  
59  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
ns  
Qrr  
142  
nC  
A: The value of R θJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with T A =25°C. The  
Power dissipation PDSM is based on R θJA and the maximum allowed junction temperature of 150°C. The value in any a given application depends  
on the user's specific board design, and the maximum temperature fo 175°C may be used if the PCB allows it.  
B. The power dissipation PD is based on TJ(MAX)=175°C, using junction-to-case thermal resistance, and is more useful in setting the upper  
dissipation limit for cases where additional heatsinking is used.  
C: Repetitive rating, pulse width limited by junction temperature T J(MAX)=175°C.  
D. The R θJA is the sum of the thermal impedence from junction to case R θJC and case to ambient.  
E. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max.  
F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink, assuming a  
maximum junction temperature of T J(MAX)=175°C.  
G. The maximum current rating is limited by bond-wires.  
H. These tests are performed with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. The SOA  
curve provides a single pulse rating.  
Rev0: Feb 2006  
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL  
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING  
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,  
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.  
Alpha & Omega Semiconductor, Ltd.  
AOD450  
TYPICAL ELECTRICAL CHARACTERISTICS  
14  
1.0E+02  
1.0E+01  
1.0E+00  
1.0E-01  
1.0E-02  
1.0E-03  
12  
VDS=15V  
10V  
10  
8
6
4
2
0
8V  
125°C  
25°C  
7V  
VGS=6V  
15  
0
5
10  
20  
2
4
6
8
10  
VDS(Volts)  
VGS(Volts)  
Figure 1:On-Region Characteristics  
Figure 2: Transfer Characteristics  
800  
700  
600  
500  
400  
300  
200  
2.4  
2.2  
2
VGS=10V  
VGS=10V, 3.8A  
1.8  
1.6  
1.4  
1.2  
1
0.8  
0
0
1
2
3
4
5
6
7
25  
50  
75  
100  
125  
150  
175  
I
D (A)  
Temperature(°C)  
Figure 3: On-Resistance vs. Drain Current and Gate  
Voltage  
Figure 4: On-Resistance vs. Junction Temperature  
1400  
1200  
1.0E+01  
ID=3.8A  
1.0E+00  
1.0E-01  
1.0E-02  
1.0E-03  
1.0E-04  
1.0E-05  
125°C  
125°C  
25°C  
1000  
800  
600  
400  
200  
25°C  
0.0  
0.2  
0.4  
0.6  
VSD (Volts)  
Figure 6: Body-Diode Characteristics  
0.8  
1.0  
1.2  
6
8
10  
12  
GS (Volts)  
Figure 5: On-Resistance vs. Gate-Source Voltage  
14  
16  
18  
20  
V
Alpha & Omega Semiconductor, Ltd.  
AOD450  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
300  
250  
200  
150  
100  
50  
10  
8
VDS=10V  
ID=3.8A  
Ciss  
6
4
Coss  
2
Crss  
0
0
0
1
2
3
4
0
5
10  
15  
DS (Volts)  
20  
25  
Qg (nC)  
V
Figure 7: Gate-Charge Characteristics  
Figure 8: Capacitance Characteristics  
100.00  
10.00  
1.00  
200  
TJ(Max)=175°C, TC=25°C  
160  
120  
80  
40  
0
TJ(max)=175°C  
TC=25°C  
10µs  
RDS(ON)  
limited  
100µ  
1ms  
DC  
0.10  
0.01  
0.0001  
0.001  
0.01  
0.1  
1
10  
0.1  
1
10  
100  
1000  
Pulse Width (s)  
VDS (Volts)  
Figure 10: Single Pulse Power Rating Junction-to-  
Case (Note F)  
Figure 9: Maximum Forward Biased Safe  
Operating Area (Note F)  
10  
1
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
D=Ton/T  
TJ,PK=TC+PDM.ZθJC.RθJC  
RθJC=6°C/W  
PD  
0.1  
Ton  
T
Single Pulse  
0.01  
0.00001  
0.0001  
0.001  
0.01  
Pulse Width (s)  
Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)  
0.1  
1
10  
100  
Alpha & Omega Semiconductor, Ltd.  
AOD450  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
30  
25  
20  
15  
10  
5
5
4
3
2
1
TA=25°C  
0
0
0
25  
50  
75  
100  
125  
150  
175  
0.000001  
0.00001  
Time in avalanche, tA (s)  
Figure 12: Single Pulse Avalanche capability  
0.0001  
0.001  
TCASE (°C)  
Figure 13: Power De-rating (Note B)  
50  
40  
30  
20  
10  
0
5
4
3
2
1
0
TA=25°C  
0
25  
50  
75  
CASE (°C)  
Figure 14: Current De-rating (Note B)  
100  
125  
150  
175  
0.001  
0.01  
0.1  
1
10  
100  
1000  
T
Pulse Width (s)  
Figure 15: Single Pulse Power Rating Junction-to-  
Ambient (Note H)  
10  
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
1
0.1  
D=Ton/T  
TJ,PK=TA+PDM.ZθJA.RθJA  
RθJA=60°C/W  
PD  
0.01  
Single Pulse  
Ton  
T
0.001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
Pulse Width (s)  
Figure 16: Normalized Maximum Transient Thermal Impedance (Note H)  
Alpha & Omega Semiconductor, Ltd.  

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