AOTF2606L [AOS]
60V N-Channel MOSFET; 60V N沟道MOSFET
| 型号： | AOTF2606L |
| 厂家： | 
ALPHA & OMEGA SEMICONDUCTORS |
| 描述： | 60V N-Channel MOSFET |
| 文件： | 总7页 (文件大小：354K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AOT2606L/AOB2606L/AOTF2606L
60V N-Channel MOSFET
General Description
Product Summary
VDS
The AOT2606L & AOB2606L & AOTF2606L uses Trench
MOSFET technology that is uniquely optimized to provide
the most efficient high frequency switching performance.
Both conduction and switching power losses are
60V
72A
ID (at VGS=10V)
RDS(ON) (at VGS=10V)
< 6.5mΩ (< 6.2mΩ )
minimized due to an extremely low combination of RDS(ON)
Ciss and Coss. This device is ideal for boost converters
and synchronous rectifiers for consumer, telecom,
industrial power supplies and LED backlighting.
,
100% UIS Tested
100% Rg Tested
Top View
TO-263
D2PAK
D
TO-220
TO-220F
D
G
S
S
S
S
D
D
G
G
G
AOT2606L
AOTF2606L
AOB2606L
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
AOT2606L/AOB2606L
60
AOTF2606L
Units
Drain-Source Voltage
VDS
V
V
Gate-Source Voltage
VGS
±20
TC=25°C
72
56
54
38
Continuous Drain
Current G
ID
TC=100°C
A
Pulsed Drain Current C
IDM
260
13
TA=25°C
TA=70°C
Continuous Drain
Current
IDSM
A
10
Avalanche Current C
IAS
60
A
Avalanche energy L=0.1mH C
EAS
180
mJ
TC=25°C
Power Dissipation B
TC=100°C
115
36.5
18
PD
W
57.5
TA=25°C
2.1
1.3
PDSM
W
°C
Power Dissipation A
TA=70°C
Junction and Storage Temperature Range
TJ, TSTG
-55 to 175
Thermal Characteristics
Parameter
Symbol
AOT2606L/AOB2606L
AOTF2606L
Units
°C/W
°C/W
°C/W
Maximum Junction-to-Ambient A
Maximum Junction-to-Ambient A D
Maximum Junction-to-Case
t
≤ 10s
15
60
15
60
RθJA
Steady-State
Steady-State
RθJC
1.3
4.1
* Surface mount package TO263
Rev 1 : Mar. 2012
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Page 1 of 7
AOT2606L/AOB2606L/AOTF2606L
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
Conditions
Min
Typ
Max Units
STATIC PARAMETERS
ID=250µA, VGS=0V
BVDSS
Drain-Source Breakdown Voltage
60
V
VDS=60V, VGS=0V
1
IDSS
Zero Gate Voltage Drain Current
µA
5
TJ=55°C
VDS=0V, VGS=±20V
VDS=VGS，ID=250µA
VGS=10V, VDS=5V
VGS=10V, ID=20A
TO220/TO220F
IGSS
Gate-Body leakage current
Gate Threshold Voltage
On state drain current
±100
3.5
nA
V
VGS(th)
ID(ON)
2.5
3
260
A
5.4
8.5
6.5
mΩ
mΩ
TJ=125°C
10.5
RDS(ON)
Static Drain-Source On-Resistance
VGS=10V, ID=20A
5.1
6.2
TO263
VDS=5V, ID=20A
gFS
VSD
IS
Forward Transconductance
Diode Forward Voltage
75
S
V
A
IS=1A,VGS=0V
Maximum Body-Diode Continuous Current G
0.7
1
72
DYNAMIC PARAMETERS
Ciss
Coss
Crss
Rg
Input Capacitance
4050
345
pF
pF
pF
Ω
VGS=0V, VDS=30V, f=1MHz
Output Capacitance
Reverse Transfer Capacitance
Gate resistance
16.8
0.65
VGS=0V, VDS=0V, f=1MHz
0.3
1.0
SWITCHING PARAMETERS
Qg(10V) Total Gate Charge
53
22
17
5
75
31
nC
nC
nC
nC
ns
Qg(4.5V) Total Gate Charge
VGS=10V, VDS=30V, ID=20A
Qgs
Qgd
tD(on)
tr
Gate Source Charge
Gate Drain Charge
Turn-On DelayTime
Turn-On Rise Time
Turn-Off DelayTime
Turn-Off Fall Time
18
20
33
4
VGS=10V, VDS=30V, RL=1.5Ω,
RGEN=3Ω
ns
tD(off)
tf
ns
ns
trr
IF=20A, dI/dt=500A/µs
IF=20A, dI/dt=500A/µs
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
26
ns
Qrr
nC
125
A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The
Power dissipation PDSM is based on R θJA and the maximum allowed junction temperature of 150°C. The value in any given application
depends on the user's specific board design, and the maximum temperature of 175°C may be used if the PCB allows it.
B. The power dissipation PD is based on TJ(MAX)=175°C, using junction-to-case thermal resistance, and is more useful in setting the upper
dissipation limit for cases where additional heatsinking is used.
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=175°C. Ratings are based on low frequency and duty cycles to keep
initial TJ =25°C.
D. The RθJA is the sum of the thermal impedance from junction to case RθJC and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-case thermal impedance which is measured with the device mounted to a large heatsink,
assuming a maximum junction temperature of TJ(MAX)=175°C. The SOA curve provides a single pulse rating.
G. The maximum current limited by package.
H. These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C.
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Rev 1 : Mar. 2012
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Page 2 of 7
AOT2606L/AOB2606L/AOTF2606L
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
120
100
80
60
40
20
0
100
VDS=5V
10V
6V
80
60
40
20
0
5V
125°C
4.5V
25°C
Vgs=4V
4
2
3
4
5
6
0
1
2
3
5
VGS(Volts)
VDS (Volts)
Fig 1: On-Region Characteristics (Note E)
Figure 2: Transfer Characteristics (Note E)
10
8
2
1.8
1.6
1.4
1.2
1
VGS=10V
VGS=10V
ID=20A
6
4
2
0.8
0
0
5
10
15
ID (A)
20
25
30
0
25
50
75
100 125 150 175 200
Temperature (°C)
Figure 3: On-Resistance vs. Drain Current and Gate
Voltage (Note E)
Figure 4: On-Resistance vs. Junction Temperature
(Note E)
14
12
10
8
1.0E+02
1.0E+01
ID=20A
1.0E+00
125°C
1.0E-01
1.0E-02
1.0E-03
1.0E-04
1.0E-05
125°C
25°C
6
25°C
4
2
0.0
0.2
0.4
VSD (Volts)
Figure 6: Body-Diode Characteristics (Note E)
0.6
0.8
1.0
1.2
2
4
6
8
10
VGS (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
(Note E)
Rev 1 : Mar. 2012
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Page 3 of 7
AOT2606L/AOB2606L/AOTF2606L
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
10
5000
VDS=30V
ID=20A
Ciss
8
4000
6
3000
2000
1000
0
4
Coss
2
Crss
0
0
10
20
30
Qg (nC)
40
50
60
0
10
20
30
40
50
60
VDS (Volts)
Figure 8: Capacitance Characteristics
Figure 7: Gate-Charge Characteristics
1000
800
600
400
200
0
1000.0
100.0
10.0
1.0
TJ(Max)=175°C
TC=25°C
10µs
100µs
RDS(ON)
1ms
10ms
DC
TJ(Max)=175°C
TC=25°C
0.1
0.0
0.01
0.1
1
10
100
1000
0.0001 0.001
0.01
0.1
1
100
10
VDS (Volts)
Pulse Width (s)
Figure 9: Maximum Forward Biased Safe Operating
Area for AOT2606L and AOB2606L (Note F)
Figure 10: Single Pulse Power Rating Junction-to-Case
for AOT2606L and AOB2606L (Note F)
10
1
D=Ton/T
TJ,PK=TC+PDM.ZθJC.RθJC
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
RθJC=1.3°C/W
0.1
PD
Single Pulse
0.01
0.001
Ton
T
1E-05
0.0001
0.001
0.01
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance for AOT2606L and AOB2606L (Note F)
0.1
1
10
Rev 1 : Mar. 2012
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Page 4 of 7
AOT2606L/AOB2606L/AOTF2606L
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
1000
1000.0
100.0
10.0
1.0
TJ(Max)=175°C
TC=25°C
10µs
800
RDS(ON)
100µs
600
400
200
0
1ms
10ms
DC
TJ(Max)=175°C
TC=25°C
0.1
0.0
0.01
0.1
1
10
100
1000
0.0001 0.001
0.01
0.1
1
10
100
VDS (Volts)
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-to-Case
Figure 9: Maximum Forward Biased
Safe Operating Area for AOTF2606L
for AOTF2606L (Note F)
10
1
D=Ton/T
TJ,PK=TC+PDM.ZθJC.RθJC
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
RθJC=4.1°C/W
0.1
P
Single Pulse
0.001
0.01
T
T
0.001
1E-05
0.0001
0.01
0.1
1
10
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance for AOTF2606L (Note F)
Rev 1 : Mar. 2012
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Page 5 of 7
AOT2606L/AOB2606L/AOTF2606L
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
1000
150
TA=25°C
100
TA=100°C
100
TA=150°C
50
0
TA=125°C
10
1
10
100
1000
0
25
50
75
100
125
150
175
Time in avalanche, tA (µs)
TCASE (°C)
Figure 12: Single Pulse Avalanche capability
(Note C)
Figure 13: Power De-rating for AOT2606L and
AOB2606L (Note F)
80
10000
1000
100
10
TA=25°C
60
40
20
0
1
0
25
50
75
100
125
150
175
1E-05
0.001
0.1
10
1000
TCASE (°C)
Pulse Width (s)
Figure 14: Current De-rating for AOT2606L and
AOB2606L (Note F)
Figure 15: Single Pulse Power Rating Junction-to-
Ambient (Note H)
10
1
D=Ton/T
TJ,PK=TA+PDM.ZθJA.RθJA
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
RθJA=60°C/W
0.1
PD
0.01
Single Pulse
Ton
T
0.001
0.001
0.01
0.1
1
10
100
1000
Pulse Width (s)
Figure 16: Normalized Maximum Transient Thermal Impedance (Note H)
Rev 1 : Mar. 2012
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Page 6 of 7
AOT2606L/AOB2606L/AOTF2606L
Gate Charge Test Circuit & Waveform
Vgs
Qg
10V
+
VDC
+
Qgs
Qgd
Vds
VDC
-
-
DUT
Vgs
Ig
Charge
Resistive Switching Test Circuit & Waveforms
RL
Vds
Vds
90%
10%
+
DUT
Vdd
Vgs
VDC
Rg
-
Vgs
Vgs
td(on)
t
r
td(off)
t
f
ton
toff
Unclamped Inductive Switching (UIS) Test Circuit & Waveforms
L
EAR= 1/2 LIA2R
BVDSS
Vds
Id
Vgs
Vds
+
Vgs
Vdd
I AR
VDC
Id
Rg
-
DUT
Vgs
Vgs
Diode Recovery Test Circuit & Waveforms
Qrr = - Idt
Vds +
Vds -
Ig
DUT
Vgs
trr
L
Isd
I F
Isd
Vgs
dI/dt
I RM
+
Vdd
VDC
Vdd
-
Vds
Rev 1 : Mar. 2012
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Page 7 of 7
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