AOZ1342 [AOS]
Dual Channel USB Switch; 双通道USB开关
| 型号： | AOZ1342 |
| 厂家： | 
ALPHA & OMEGA SEMICONDUCTORS |
| 描述： | Dual Channel USB Switch |
| 文件： | 总12页 (文件大小：559K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AOZ1342
Dual Channel USB Switch
General Description
Features
The AOZ1342 power-distribution switches is intended
for applications where heavy capacitive loads and
short-circuits are likely to be encountered. This device
incorporates N-channel MOSFET power switches for
power-distribution systems that require multiple power
switches in a single package. Each switch is controlled
by a logic enable input. Gate drive is provided by an
internal charge pump designed to control the power-switch
rise times and fall times to minimize current surges
during switching. The charge pump requires no external
components and allows operation from supplies as low
as 2.7 V.
z Typical 70 mΩ (NFET)
z 1.5 A maximum continuous current
z Two enable options: EN or EN
z Vin range: 2.7 V to 5.5 V
z Open Drain Fault Flag
z Fault Flag deglitched (blanking time)
z Thermal shutdown
z Reverse current blocking
z Exposed pad SO-8 package
Applications
The AOZ1342 offers 1.5 A of maximum continuous
current.
z Notebook Computers
z Desktop Computers
The AOZ1342 is available in an Exposed Pad SO-8
package and is rated over a -40 °C to +85 °C ambient
temperature range.
Typical Application
VIN
Vout
OUT1
IN
LOAD
LOAD
Cx
Cx
0.1μF
22μF
Rx
Rx
AOZ1342
Cx
OC1
Vout
EN1/EN1
OC2
OUT2
Cx
0.1μF
Cx
22μF
EN2/EN2
GND
Rev. 1.5 July 2011
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Page 1 of 12
AOZ1342
Ordering Information
Maximum
Continuous Current
Typical Short-circuit
Current Limit
Enable
Setting
Output
Discharge Environmental
Part Number Channel 1 Channel 2 Channel 1 Channel 2
Package
AOZ1341AI
AOZ1341EI
SO-8
Active Low
Active High
EPAD MSOP-8
SO-8
1 A
1A
1.5 A
2 A
1.5 A
2 A
AOZ1341AI-1
AOZ1341EI-1
AOZ1342PI
EPAD MSOP-8
Active Low EPAD SO-8
Active High EPAD SO-8
1.5 A
1.5 A
1.5A
0.5A
AOZ1342PI-1
AOZ1343AI*
AOZ1343EI*
AOZ1343AI-1*
AOZ1343EI-1*
AOZ1312AI-1
AOZ1312EI-1
AOZ1310CI-1
Green Product
No
SO-8
Active Low
RoHS Compliant
EPAD MSOP-8
2 A
0.75 A
SO-8
Active High
EPAD MSOP-8
SO-8
Active High
1.5 A
0.5 A
None
None
2 A
None
None
EPAD MSOP-8
0.75 A
Active High SOT23-5
*Contact factory for availability
AOS Green Products use reduced levels of Halogens, and are also RoHS compliant.
Please visit www.aosmd.com/web/quality/rohs_compliant.jsp for additional information.
Pin Configuration
1
2
3
4
8
7
6
5
GND
IN
OC1
OUT1
OUT2
OC2
PAD
EN1/EN1
EN2/EN2
Exposed Pad SO-8
(Top View)
Pin Description
Pin Name
Pin Number
Pin Function
GND
IN
1
2
3
4
5
6
7
8
Ground
Input voltage
EN1/EN1
EN2/EN2
OC2
Enable input, logic high/logic low turns on power switch IN-OUT1
Enable input, logic high/logic low turns on power switch IN-OUT2
Overcurrent, open-drain output, active low, IN-OUT1
Power-switch output, IN-OUT1
OUT2
OUT1
OC1
Power-switch output, IN-OUT2
Overcurrent, open-drain output, active low, IN-OUT2
Rev. 1.5 July 2011
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Page 2 of 12
AOZ1342
Absolute Maximum Ratings
Exceeding the Absolute Maximum Ratings may damage the
Recommended Operating Conditions
The device is not guaranteed to operate beyond the
device.
Recommended Operating Conditions.
Parameter
Input Voltage (VIN)
Enable Voltage (VEN
Rating
Parameter
Input Voltage (VIN)
Rating
6 V
6 V
+2.7 V to +5.5 V
-40 °C to +125 °C
)
Junction Temperature (TJ)
Storage Temperature (TS)
Maximum Continuous Current
ESD Rating(1)
-55 °C to +150 °C
Package Thermal Resistance
1.5 A
2 kV
Exposed Pad SO-8 (ΘJA
)
45 °C/W
Note:
1. Devices are inherently ESD sensitive, handling precautions are
required. Human body model is a 100 pF capacitor discharging
through a 1.5 kΩ resistor.
Electrical Characteristics
T = 25 °C, V = V = 5.5 V, unless otherwise specified.
A
IN
EN
Symbol
Parameter
Conditions
Min. Typ. Max. Units
POWER SWITCH
RDS(ON) Switch On-Resistance
VIN = 2.7 V to 5 V, IO = 0.5 A/1.5 A
70
0.6
0.4
135
1.5
1
mΩ
tr
Rise Time, Output
VIN = 5.5 V
VIN = 2.7 V
VIN = 5.5 V
VIN = 2.7 V
CL = 1 μF, RL = 5 Ω
ms
tf
Fall time, Output
0.05
0.05
0.5
0.5
ms
FET Leakage Current
Out connect to ground,
2.7 V ≤ VIN ≤ 5.5 V,
-40 °C ≤ TJ ≤ 125 °C(2)
1
μA
V(ENx) = VIN or V(ENx) = 0 V
ENABLE INPUT EN OR EN
VIH
VIL
II
High-level Input Voltage
2.7 V ≤ VIN ≤ 5.5 V
2.7 V ≤ VIN ≤ 5.5 V
2.0
V
V
Low-level Input Voltage
Input Current
0.8
0.5
3
-0.5
μA
ms
ton
toff
Turn-on Time
CL = 100 μF, RL = 5 Ω
CL = 100 μF, RL = 5 Ω
Turn-off Time
10
CURRENT LIMIT
IOS Short-circuit Output
Current (per Channel)
IOC_TRIP Overcurrent Trip
Threshold (per Channel)
V(IN) = 2.7 V to 5.5 V, OUT connected to GND,
device enable into short-circuit, Channel 1 or 2
1.6
1.6
2.0
2.2
2.4
2.5
A
A
V(IN) = 5 V, current ramp (≤ 100 A/s) on OUT,
Channel 1 or 2
SUPPLY CURRENT
Supply Current, Low-level No load on OUT,
TJ = 25°C
-40 °C ≤ TJ ≤ 125 °C(2)
0.5
0.5
1
5
μA
Output
2.7 V ≤ VIN ≤ 5.5 V,
V(ENx) = VIN or V(ENx) = 0 V
Supply current, High-level No load on OUT,
TJ = 25 °C
-40 °C ≤ TJ ≤ 125 °C(2)
65
65
81
90
μA
μA
Output
V(ENx) = 0 V or V(ENx) = 5.5 V
Reverse Leakage Current V(OUTx) = 5.5 V, IN = ground
0.2
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Page 3 of 12
AOZ1342
Electrical Characteristics (Continued)
T = 25 °C, V = V = 5.5 V, unless otherwise specified.
A
IN
EN
Symbol
Parameter
Conditions
Min. Typ. Max. Units
UNDERVOLTAGE LOCKOUT
Low-level voltage, IN
2.0
2.5
0.4
V
Hysteresis, IN
200
mV
OVERCURRENT OC1 AND OC2
Output Low Voltage
VOL(OCx)
IO(OCx) = 5 mA
V
Off-state Current
OC_L Deglitch
VO(OCx) = 5 V or 3.3 V
1
μA
OCx assertion or deassertion
4
8
15
ms
THERMAL SHUTDOWN
Thermal Shutdown
Threshold
135
105
°C
°C
°C
Recovery from Thermal
Shutdown
Hysteresis
30
Note:
2. Parameters are guaranteed by design only and not production tested.
Rev. 1.5 July 2011
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Page 4 of 12
AOZ1342
Functional Block Diagram
OC1
Deglitch
Thermal
Shutdown
EN1/EN1
Enable 1
Current
Limit
Gate Driver
OUT1
OUT2
IN
Gate Driver
UVLO
Comparator
Current
Limit
2.2 V
Thermal
Enable 2
Shutdown
EN2/EN2
OC2
Deglitch
AOZ1342
Rev. 1.5 July 2011
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AOZ1342
Functional Characteristics
Figure 2. Turn-Off Delay and Fall Time
with 1μF Load (Active High)
Figure 1. Turn-On Delay and Rise Time
with 1μF Load (Active High)
R
C
A
= 5Ω
= 1μF
= 25°C
R
C
A
= 5Ω
= 1μF
= 25°C
L
L
L
L
T
T
EN
5V/div
EN
5V/div
VOUT
2V/div
VOUT
2V/div
400μs/div
400μs/div
Figure 4. Turn-Off Delay and Fall Time
Figure 3. Turn-On Delay and Rise Time
with 100μF Load (Active High)
with 100μF Load (Active High)
R
C
A
= 5Ω
= 100μF
= 25°C
R
C
A
= 5Ω
= 100μF
= 25°C
L
L
L
L
T
T
EN
5V/div
EN
5V/div
VOUT
2V/div
VOUT
2V/div
400μs/div
400μs/div
Figure 6. 0.6Ω Load Connected to Enable to Device
Figure 5. Short-circuit Current, Device Enable
to Short (Active High)
(Active High)
OC
2V/div
EN
2V/div
IOUT
1A/div
IOUT
1A/div
400μs/div
2ms/div
Rev. 1.5 July 2011
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Page 6 of 12
AOZ1342
Typical Characteristics
Figure 7. Supply Current, Output Enabled
vs. Junction Temperature
Figure 8. Supply Current, Output Disabled
vs. Junction Temperature
0.5
0.45
0.4
70
60
50
40
30
20
10
0
Vin=5.5V
Vin=5V
Vin=3.3V
Vin=2.5V
0.35
0.3
0.25
0.2
Vin=5.5V
Vin=5V
Vin=3.3V
Vin=2.5V
0.15
0.1
0.05
0
-50
0
50
100
150
-50
0
50
100
C)
150
Junction Temperature (°C)
Junction Temperature (
°
Figure 10. UVLO Threshold vs. Junction Temperature
Figure 9. Rds(on) vs. Ambient Temperature
2.30
2.28
2.26
2.24
2.22
2.2
160
140
120
100
80
Rising
Falling
2.18
2.16
2.14
2.12
2.10
60
Vin=2.5V
40
Vin=3.3V
Vin=5V
20
Vin=5.5V
0
-40
-20
0
20
40
60
80
-50
0
50
100
150
Ambient Temperature (°C)
Junction Temperature (°C)
Rev. 1.5 July 2011
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AOZ1342
Detailed Description
The AOZ1342 family of power-distribution switches are
intended for applications where heavy capacitive loads
and short-circuits are likely to be encountered. This
device incorporates 70 mΩ N-channel MOSFET power
switches for power-distribution systems that require
multiple power switches in a single package. Each switch
is controlled by a logic enable input. Gate drive is
provided by an internal charge pump designed to control
the power-switch rise times and fall times to minimize
current surges during switching. The charge pump
requires no external components and allows operation
from supplies as low as 2.7 V.
Thermal Shut-down Protection
When the output load exceeds the current-limit threshold
or a short is present, the device limits the output current
to a safe level by switching into a constant-current mode,
pulling the overcurrent (OC) logic output low.
During current limit or short circuit conditions, the
increasing power dissipation in the chip causes the die
temperature to rise. When the die temperature reaches a
certain level, the thermal shutdown circuitry will shutdown
the device. The thermal shutdown will cycle repeatedly
until the short circuit condition is resolved.
Applications Information
Input Capacitor Selection
Power Dissipation Calculation
The input capacitor prevents large voltage transients
from appearing at the input, and provides the
Calculate the power dissipation for normal load condition
using the following equation:
instantaneous current needed each time the switch turns
on and to also limit input voltage drop. The input
capacitor also prevents high-frequency noise on the
power line from passing through the output of the power
side. The choice of input capacitor is based on its ripple
current and voltage ratings rather than its capacitor
value. The input capacitor should be located as close as
possible to the VIN pin. A 0.1 μF ceramic cap is
recommended. However, a higher value capacitor will
reduce the voltage drop at the input.
2
P = R x (I )
OUT
D
ON
The worst case power dissipation occurs when the load
current hits the current limit due to over-current or short
circuit faults. The power dissipation under these
conditions can be calculated using the following
equation:
P = (V – V
) x I
LIMIT
D
IN
OUT
Layout Guidelines
Output Capacitor Selection
Good PCB layout is important for improving the thermal
and overall performance of AOZ1342. To optimize the
switch response time to output short-circuit conditions,
keep all traces as short as possible to reduce the effect of
unwanted parasitic inductance. Place the input and
output bypass capacitors as close as possible to the IN
and OUT pins. The input and output PCB traces should
be as wide as possible for the given PCB space. Use a
ground plane to enhance the power dissipation capability
of the device.
The output capacitor acts in a similar way. A small 0.1 μF
capacitor prevents high-frequency noise from going into
the system. Also, the output capacitor has to supply
enough current for the large load that it may encounter
during system transients. This bulk capacitor must be
large enough to supply a fast transient load in order to
prevent the output from dropping.
Rev. 1.5 July 2011
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Page 8 of 12
AOZ1342
USB Power Distribution Application
D+
D-
VBUS
Cx
Cx
GND
GND
0.1μF
22μF
D+
D-
VBUS
Cx
0.1μF
Cx
22μF
D+
D-
VBUS
Power Supply
OUT1
IN
Cx
0.1μF
Cx
22μF
GND
AOZ1342
10kΩ
10kΩ
0.1μF
OC1
EN1/EN1
OC2
D+
D-
USB
Controller
VBUS
OUT2
EN2/EN2
Cx
Cx
GND
GND
GND
GND
0.1μF
22μF
D+
D-
VBUS
Cx
0.1μF
Cx
22μF
D+
D-
VBUS
Cx
0.1μF
Cx
22μF
Figure 11. Typical Six-Port USB Host/Self-Powered Hub Applications Circuitry
Rev. 1.5 July 2011
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Page 9 of 12
AOZ1342
Package Dimensions, Exposed Pad SO-8
Gauge plane
0.2500
D0
C
L
L1
E1
E
E2
E3
L1'
D1
D
Note 5
θ
7 (4x)
A2
A1
A
e
B
Dimensions in millimeters
Dimensions in inches
Symbols Min.
Nom. Max.
Symbols Min.
Nom. Max.
A
A1
A2
B
C
D
D0
D1
E
1.40
0.00
1.40
0.31
0.17
4.80
3.20
3.10
5.80
—
1.55
0.05
1.50
0.406
—
4.96
3.40
3.30
6.00
1.27
3.90
2.41
0.40 REF
0.95
—
1.70
0.10
1.60
0.51
0.25
5.00
3.60
3.50
6.20
—
A
A1
A2
B
C
D
D0
D1
E
0.055 0.061 0.067
RECOMMENDED LAND PATTERN
0.000 0.002 0.004
0.055 0.059 0.063
0.012 0.016 0.020
3.70
0.007
—
0.010
0.189 0.195 0.197
0.126 0.134 0.142
0.122 0.130 0.138
0.228 0.236 0.244
2.20
5.74
2.71
e
e
—
0.050
—
E1
E2
E3
L
y
θ
3.80
2.21
4.00
2.61
E1
E2
E3
L
y
θ
0.150 0.153 0.157
0.087 0.095 0.103
0.016 REF
2.87
0.40
—
0°
1.27
0.10
8°
0.016 0.037 0.050
—
0°
—
—
3°
0.004
8°
0.80
UNIT: mm
1.27
3°
0.635
|
L1–L1'
L1
|
—
0.04
1.04 REF
0.12
|
L1–L1'
L1
|
0.002 0.005
0.041 REF
Notes:
1. Package body sizes exclude mold flash and gate burrs.
2. Dimension L is measured in gauge plane.
3. Tolerance 0.10mm unless otherwise specified.
4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.
5. Die pad exposure size is according to lead frame design.
6. Followed from JEDEC MS-012
Rev. 1.5 July 2011
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Page 10 of 12
AOZ1342
Tape and Reel Dimensions, Exposed Pad SO-8
Carrier Tape
P1
P2
D1
T
E1
E2
E
B0
K0
D0
P0
A0
Feeding Direction
UNIT: mm
Package
A0
B0
K0
D0
D1
E
E1
E2
P0
P1
P2
T
SO-8
(12mm)
6.40
0.10
5.20
0.10
2.10
0.10
1.60
0.10
1.50
0.10
12.00 1.75
0.10 0.10
5.50
0.10
8.00
0.10
4.00
0.10
2.00
0.10
0.25
0.10
Reel
W1
S
G
V
N
K
M
R
H
W
UNIT: mm
Tape Size Reel Size
12mm ø330
M
N
W
W1
ø330.00 ø97.00 13.00 17.40
0.50 0.10 0.30 1.00 +0.50/-0.20
H
K
S
G
R
V
ø13.00
10.60
2.00
0.50
—
—
—
Leader/Trailer and Orientation
Trailer Tape
300mm min. or
75 empty pockets
Components Tape
Orientation in Pocket
Leader Tape
500mm min. or
125 empty pockets
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Page 11 of 12
AOZ1342
Part Marking
AOZ1342PI
(Exposed Pad SO-8)
AOZ1342PI-1
(Exposed Pad SO-8)
Z1342PI
FAYWLT
Z1342PI1
FAYWLT
Part Number Code
Part Number Code
Assembly Lot Code
Assembly Lot Code
Fab Code & Assembly
Location Code
Year & Week Code
Fab Code & Assembly
Location Code
Year & Week Code
This datasheet contains preliminary data; supplementary data may be published at a later date.
Alpha & Omega Semiconductor reserves the right to make changes at any time without notice.
LIFE SUPPORT POLICY
ALPHA & OMEGA SEMICONDUCTOR PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body or (b) support or sustain life, and (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury of
the user.
2. A critical component in any component of a life
support, device, or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
Rev. 1.5 July 2011
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Page 12 of 12
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