AT24C256C1-10CI-2.7 [ATMEL]
2-Wire Serial EEPROMs; 2线串行EEPROM
| 型号： | AT24C256C1-10CI-2.7 |
| 厂家： | 
ATMEL |
| 描述： | 2-Wire Serial EEPROMs |
| 文件： | 总15页 (文件大小：228K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Features
• Low Voltage and Standard Voltage Operation
– 5.0 (VCC = 4.5V to 5.5V)
– 2.7 (VCC = 2.7V to 5.5V)
– 1.8 (VCC = 1.8V to 3.6V)
• Internally Organized 16,384 x 8 and 32,768 x 8
• 2-Wire Serial Interface
• Schmitt Trigger, Filtered Inputs for Noise Suppression
• Bidirectional Data Transfer Protocol
• 1 MHz (5V), 400 kHz (2.7V) and 100 kHz (1.8V) Compatibility
• Write Protect Pin for Hardware and Software Data Protection
• 64-Byte Page Write Mode (Partial Page Writes Allowed)
• Self-Timed Write Cycle (5 ms typical)
• High Reliability
2-Wire Serial
EEPROMs
– Endurance: 100,000 Write Cycles
– Data Retention: 40 Years
– ESD Protection: > 4000V
128K (16,384 x 8)
• Automotive Grade and Extended Temperature Devices Available
• 8-Pin JEDEC PDIP, 8-Pin JEDEC and EIAJ SOIC, 14-Pin TSSOP, and
8-Pin Leadless Array Packages
256K (32,768 x 8)
AT24C128
AT24C256
Description
The AT24C128/256 provides 131,072/262,144 bits of serial electrically erasable and
programmable read only memory (EEPROM) organized as 16,384/32,768 words of 8
bits each. The device’s cascadable feature allows up to 4 devices to share a common
2-wire bus. The device is optimized for use in many industrial and commercial applica-
tions where low power and low voltage operation are essential. The devices are avail-
able in space-saving 8-pin JEDEC PDIP, 8-pin EIAJ, 8-pin JEDEC SOIC, 14-pin
TSSOP, and 8-pin LAP packages. In addition, the entire family is available in 5.0V
(4.5V to 5.5V), 2.7V (2.7V to 5.5V) and 1.8V (1.8V to 3.6V) versions.
Pin Configurations
8-Pin PDIP
Pin Name
A0 to A1
SDA
Function
A0
A1
1
2
3
4
8
7
6
5
VCC
WP
Address Inputs
Serial Data
NC
SCL
SDA
GND
SCL
Serial Clock Input
Write Protect
No Connect
WP
8-Pin SOIC
NC
A0
A1
1
2
3
4
8
7
6
5
VCC
WP
14-Pin TSSOP
NC
SCL
SDA
GND
A0
A1
1
2
3
4
5
6
7
14
VCC
WP
NC
13
12
11
10
9
NC
NC
NC
8-Pin Leadless Array
NC
NC
VCC
WP
8
7
6
5
1
2
3
4
A0
NC
SCL
SDA
A1
GND
8
SCL
SDA
NC
GND
Rev. 0670C–08/98
Bottom View
Absolute Maximum Ratings*
*NOTICE:
Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent dam-
age to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect device
reliability.
Operating Temperature.................................. -55°C to +125°C
Storage Temperature..................................... -65°C to +150°C
Voltage on Any Pin
with Respect to Ground.....................................-1.0V to +7.0V
Maximum Operating Voltage........................................... 6.25V
DC Output Current........................................................ 5.0 mA
Block Diagram
Pin Description
SERIAL CLOCK (SCL): The SCL input is used to positive
edge clock data into each EEPROM device and negative
edge clock data out of each device.
WRITE PROTECT (WP): The write protect input, when tied
to GND, allows normal write operations. When WP is tied
high to VCC, all write operations to the memory are inhib-
ited. If left unconnected, WP is internally pulled down to
GND. Switching WP to VCC prior to a write operation cre-
ates a software write protect function.
SERIAL DATA (SDA): The SDA pin is bidirectional for
serial data transfer. This pin is open-drain driven and may
be wire-ORed with any number of other open-drain or open
collector devices.
Memory Organization
DEVICE/PAGE ADDRESSES (A1, A0): The A1 and A0
pins are device address inputs that are hardwired or left not
connected for hardware compatibility with AT24C32/64.
When the pins are hardwired, as many as four 128K/256K
devices may be addressed on a single bus system (device
addressing is discussed in detail under the Device
Addressing section). When the pins are not hardwired, the
default A1 and A0 are zero.
AT24C128/256, 128K/256K SERIAL EEPROM: The
128K/256K is internally organized as 256/512 pages of 64-
bytes each. Random word addressing requires a 14/15-bit
data word address.
AT24C128/256
2
AT24C128/256
Pin Capacitance(1)
Applicable over recommended operating range from TA = 25°C, f = 1.0 MHz, VCC = +1.8V.
Symbol
CI/O
Test Condition
Max
8
Units
pF
Conditions
VI/O = 0V
VIN = 0V
Input/Output Capacitance (SDA)
Input Capacitance (A0, A1, SCL)
CIN
6
pF
Note:
This parameter is characterized and is not 100% tested.
DC Characteristics
Applicable over recommended operating range from: TAI = -40°C to +85°C, VCC = +1.8V to +5.5V, TAC = 0°C to +70°C,
VCC = +1.8V to +5.5V (unless otherwise noted).
Symbol Parameter
Test Condition
Min
1.8
2.7
4.5
Typ
Max
3.6
5.5
5.5
2.0
3.0
0.2
2.0
0.5
6.0
Units
V
VCC1
VCC2
VCC3
ICC1
Supply Voltage
Supply Voltage
Supply Voltage
Supply Current
Supply Current
V
V
VCC = 5.0V
VCC = 5.0V
VCC = 1.8V
READ at 400 kHz
WRITE at 400 kHz
1.0
2.0
mA
mA
µA
ICC2
Standby Current
(1.8V option)
ISB1
VIN = VCC or VSS
V
CC = 3.6V
CC = 2.7V
V
µA
Standby Current
(2.7V option)
ISB2
VIN = VCC or VSS
VIN = VCC or VSS
VCC = 5.5V
Standby Current
(5.0V option)
ISB3
VCC = 4.5 - 5.5V
6.0
µA
ILI
ILO
Input Leakage Current
Output Leakage Current
Input Low Level(Note:)
Input High Level(Note:)
Output Low Level
VIN = VCC or VSS
0.10
0.05
3.0
3.0
µA
µA
V
VOUT = VCC or VSS
VIL
-0.6
VCC x 0.3
VCC + 0.5
0.4
VIH
VCC x 0.7
V
VOL2
VOL1
Note:
VCC = 3.0V
VCC = 1.8V
IOL = 2.1 mA
IOL = 0.15 mA
V
Output Low Level
0.2
V
VIL min and VIH max are reference only and are not tested
3
AC Characteristics
Applicable over recommended operating range from TA = -40°C to +85°C, VCC = +1.8V to +5.5V, CL = 100 pF (unless oth-
erwise noted). Test conditions are listed in Note 2.
1.8-volt
2.7-volt
5.0-volt
Symbol
fSCL
Parameter
Min
Max
Min
Max
Min
Max
Units
kHz
µs
Clock Frequency, SCL
Clock Pulse Width Low
Clock Pulse Width High
Clock Low to Data Out Valid
100
400
1000
tLOW
4.7
4.0
0.1
1.3
1.0
0.6
0.4
tHIGH
tAA
µs
4.5
0.05
0.9
0.05
0.55
µs
Time the bus must be free before a new
transmission can start(1)
tBUF
4.7
1.3
0.5
µs
tHD.STA
tSU.STA
tHD.DAT
tSU.DAT
tR
Start Hold Time
4.0
4.7
0
0.6
0.6
0
0.25
0.25
0
µs
µs
µs
ns
µs
ns
µs
ns
ms
Start Set-up Time
Data In Hold Time
Data In Set-up Time
Inputs Rise Time(1)
Inputs Fall Time(1)
Stop Set-up Time
Data Out Hold Time
Write Cycle Time
200
100
100
1.0
0.3
0.3
tF
300
300
100
tSU.STO
tDH
4.7
0.6
50
0.25
50
100
tWR
20
10
10
Write
Cycles
Endurance(1)
5.0V, 25°C, Page Mode
100K
100K
100K
Notes: 1. This parameter is characterized and is not 100% tested.
2. AC measurement conditions:
RL (connects to VCC): 1.3KΩ (2.7V, 5V), 10KΩ (1.8V)
Input pulse voltages: 0.3VCC to 0.7VCC
Input rise and fall times: ≤50ns
Input and output timing reference voltages: 0.5VCC
Device Operation
CLOCK and DATA TRANSITIONS: The SDA pin is nor-
mally pulled high with an external device. Data on the SDA
pin may change only during SCL low time periods (refer to
Data Validity timing diagram). Data changes during SCL
high periods will indicate a start or stop condition as defined
below.
ACKNOWLEDGE: All addresses and data words are seri-
ally transmitted to and from the EEPROM in 8-bit words.
The EEPROM sends a zero during the ninth clock cycle to
acknowledge that it has received each word.
STANDBY MODE: The AT24C128/256 features a low
power standby mode which is enabled: a) upon power-up
and b) after the receipt of the STOP bit and the completion
of any internal operations.
START CONDITION: A high-to-low transition of SDA with
SCL high is a start condition which must precede any other
command (refer to Start and Stop Definition timing dia-
gram).
MEMORY RESET: After an interruption in protocol, power
loss or system reset, any 2-wire part can be reset by follow-
ing these steps: (a) Clock up to 9 cycles, (b) look for SDA
high in each cycle while SCL is high and then (c) create a
start condition as SDA is high.
STOP CONDITION: A low-to-high transition of SDA with
SCL high is a stop condition. After a read sequence, the
stop command will place the EEPROM in a standby power
mode (refer to Start and Stop Definition timing diagram).
AT24C128/256
4
AT24C128/256
Bus Timing (SCL: Serial Clock, SDA: Serial Data I/O)
Write Cycle Timing (SCL: Serial Clock, SDA: Serial Data I/O)
SCL
SDA
ACK
8th BIT
WORD n
(1)
tWR
STOP
START
CONDITION
CONDITION
Note:
1. The write cycle time tWR is the time from a valid stop condition of a write sequence to the end of the internal clear/write
cycle.
5
Data Validity
Start and Stop Definition
Output Acknowledge
AT24C128/256
6
AT24C128/256
data word address will “roll over” and previous data will be
overwritten. The address “roll over” during write is from the
last byte of the current page to the first byte of the same
page.
Device Addressing
The 128K/256K EEPROM requires an 8-bit device address
word following a start condition to enable the chip for a read
or write operation (refer to Figure 1). The device address
word consists of a mandatory one, zero sequence for the
first five most significant bits as shown. This is common to
all 2-wire EEPROM devices.
ACKNOWLEDGE POLLING: Once the internally-timed
write cycle has started and the EEPROM inputs are dis-
abled, acknowledge polling can be initiated. This involves
sending a start condition followed by the device address
word. The read/write bit is representative of the operation
desired. Only if the internal write cycle has completed will
the EEPROM respond with a zero, allowing the read or
write sequence to continue.
The 128K/256K uses the two device address bits A1, A0 to
allow as many as four devices on the same bus. These bits
must compare to their corresponding hardwired input pins.
The A1 and A0 pins use an internal proprietary circuit that
biases them to a logic low condition if the pins are allowed
to float.
Read Operations
The eighth bit of the device address is the read/write opera-
tion select bit. A read operation is initiated if this bit is high
and a write operation is initiated if this bit is low.
Read operations are initiated the same way as write opera-
tions with the exception that the read/write select bit in the
device address word is set to one. There are three read
operations: current address read, random address read
and sequential read.
Upon a compare of the device address, the EEPROM will
output a zero. If a compare is not made, the device will
return to a standby state.
CURRENT ADDRESS READ: The internal data word
address counter maintains the last address accessed dur-
ing the last read or write operation, incremented by one.
This address stays valid between operations as long as the
chip power is maintained. The address “roll over” during
read is from the last byte of the last memory page, to the
first byte of the first page.
DATA SECURITY: The AT24C128/256 has a hardware
data protection scheme that allows the user to write protect
the whole memory when the WP pin is at VCC
.
Write Operations
BYTE WRITE: A write operation requires two 8-bit data
word addresses following the device address word and
acknowledgment. Upon receipt of this address, the
EEPROM will again respond with a zero and then clock in
the first 8-bit data word. Following receipt of the 8-bit data
word, the EEPROM will output a zero. The addressing
device, such as a microcontroller, then must terminate the
write sequence with a stop condition. At this time the
EEPROM enters an internally-timed write cycle, tWR, to the
nonvolatile memory. All inputs are disabled during this
write cycle and the EEPROM will not respond until the write
is complete (refer to Figure 2).
Once the device address with the read/write select bit set
to one is clocked in and acknowledged by the EEPROM,
the current address data word is serially clocked out. The
microcontroller does not respond with an input zero but
does generate a following stop condition (refer to Figure 4).
RANDOM READ: A random read requires a “dummy” byte
write sequence to load in the data word address. Once the
device address word and data word address are clocked in
and acknowledged by the EEPROM, the microcontroller
must generate another start condition. The microcontroller
now initiates a current address read by sending a device
address with the read/write select bit high. The EEPROM
acknowledges the device address and serially clocks out
the data word. The microcontroller does not respond with a
zero but does generate a following stop condition (refer to
Figure 5).
PAGE WRITE: The 128K/256K EEPROM is capable of 64-
byte page writes.
A page write is initiated the same way as a byte write, but
the microcontroller does not send a stop condition after the
first data word is clocked in. Instead, after the EEPROM
acknowledges receipt of the first data word, the microcon-
troller can transmit up to 63 more data words. The
EEPROM will respond with a zero after each data word
received. The microcontroller must terminate the page
write sequence with a stop condition (refer to Figure 3).
SEQUENTIAL READ: Sequential reads are initiated by
either a current address read or a random address read.
After the microcontroller receives a data word, it responds
with an acknowledge. As long as the EEPROM receives an
acknowledge, it will continue to increment the data word
address and serially clock out sequential data words. When
the memory address limit is reached, the data word
address will “roll over” and the sequential read will con-
tinue. The sequential read operation is terminated when
the microcontroller does not respond with a zero but does
generate a following stop condition (refer to Figure 6).
The data word address lower 6 bits are internally incre-
mented following the receipt of each data word. The higher
data word address bits are not incremented, retaining the
memory page row location. When the word address, inter-
nally generated, reaches the page boundary, the following
byte is placed at the beginning of the same page. If more
than 64 data words are transmitted to the EEPROM, the
7
Figure 1. Device Address
Figure 2. Byte Write
Figure 3. Page Write
(* = DON’T CARE bit)
(† = DON’T CARE bit for the 128K)
Figure 4. Current Address Read
AT24C128/256
8
AT24C128/256
Figure 5. Random Read
(* = DON’T CARE bit)
(† = DON’T CARE bit for the 128K)
Figure 6. Sequential Read
9
AT24C128 Ordering Information
tWR (max)
(ms)
ICC (max)
ISB (max)
fMAX
(kHz)
(µA)
(µA)
Ordering Code
Package
Operation Range
10
3000
3000
1500
1500
6.0
6.0
0.5
0.5
1000
1000
400
AT24C128-10PC
AT24C128N-10SC
AT24C128W-10SC
AT24C128-10CC
AT24C128C1-10CC
AT24C128T1-10TC
8P3
8S1
8S2
8C
Commercial
(0°C to 70°C)
8C1
14T
AT24C128-10PI
AT24C128N-10SI
AT24C128W-10SI
AT24C128-10CI
AT24C128C1-10CI
AT24C128T1-10TI
8P3
8S1
8S2
8C
Industrial
(-40°C to 85°C)
8C1
14T
10
AT24C128-10PC-2.7
AT24C128N-10SC-2.7
AT24C128W-10SC-2.7
AT24C128-10CC-2.7
AT24C128C1-10CC-2.7
AT24C128T1-10TC-2.7
8P3
8S1
8S2
8C
Commercial
(0°C to 70°C)
8C1
14T
400
AT24C128-10PI-2.7
AT24C128N-10SI-2.7
AT24C128W-10SI-2.7
AT24C128-10CI-2.7
AT24C128C1-10CI-2.7
AT24C128T1-10TI-2.7
8P3
8S1
8S2
8C
Industrial
(-40°C to 85°C)
8C1
14T
Package Type
8C
8-Lead, 0.230" Wide, Leadless Array Package (LAP)
8-Lead, 0.300" Wide, Leadless Array Package (LAP)
8-Lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-Lead, 0.150" Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)
8-Lead, 0.200" Wide, Plastic Gull Wing Small Outline Package (EIAJ SOIC)
14-Lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)
Options
8C1
8P3
8S1
8S2
14T
Blank
-2.7
Standard Operation (4.5V to 5.5V)
Low-Voltage (2.7V to 5.5V)
-1.8
Low-Voltage (1.8V to 3.6V)
AT24C128/256
10
AT24C128/256
AT24C128 Ordering Information (Continued)
tWR (max)
(ms)
ICC (max)
ISB (max)
fMAX
(kHz)
(µA)
(µA)
Ordering Code
Package
Operation Range
20
800
0.2
100
AT24C128-10PC-1.8
AT24C128N-10SC-1.8
AT24C128W-10SC-1.8
AT24C128-10CC-1.8
AT24C128C1-10CC-1.8
AT24C128T1-10TC-1.8
8P3
8S1
8S2
8C
Commercial
(0°C to 70°C)
8C1
14T
800
0.2
100
AT24C128-10PI-1.8
AT24C128N-10SI-1.8
AT24C128W-10SI-1.8
AT24C128-10CI-1.8
AT24C128C1-10CI-1.8
AT24C128T1-10TI-1.8
8P3
8S1
8S2
8C
Industrial
(-40°C to 85°C)
8C1
14T
Package Type
8C
8-Lead, 0.230" Wide, Leadless Array Package (LAP)
8-Lead, 0.300" Wide, Leadless Array Package (LAP)
8-Lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-Lead, 0.150" Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)
8-Lead, 0.200" Wide, Plastic Gull Wing Small Outline Package (EIAJ SOIC)
14-Lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)
Options
8C1
8P3
8S1
8S2
14T
Blank
-2.7
Standard Operation (4.5V to 5.5V)
Low-Voltage (2.7V to 5.5V)
-1.8
Low-Voltage (1.8V to 3.6V)
11
AT24C256 Ordering Information
tWR (max)
(ms)
ICC (max)
ISB (max)
fMAX
(kHz)
(µA)
(µA)
Ordering Code
Package
Operation Range
10
3000
3000
1500
1500
6.0
6.0
0.5
0.5
1000
1000
400
AT24C256-10PC
AT24C256N-10SC
AT24C256W-10SC
AT24C256-10CC
AT24C256C1-10CC
AT24C256T1-10TC
8P3
8S1
8S2
8C
Commercial
(0°C to 70°C)
8C1
14T
AT24C256-10PI
AT24C256N-10SI
AT24C256W-10SI
AT24C256-10CI
AT24C256C1-10CI
AT24C256T1-10TI
8P3
8S1
8S2
8C
Industrial
(-40°C to 85°C)
8C1
14T
10
AT24C256-10PC-2.7
AT24C256N-10SC-2.7
AT24C256W-10SC-2.7
AT24C256-10CC-2.7
AT24C256C1-10CC-2.7
AT24C256T1-10TC-2.7
8P3
8S1
8S2
8C
Commercial
(0°C to 70°C)
8C1
14T
400
AT24C256-10PI-2.7
AT24C256N-10SI-2.7
AT24C256W-10SI-2.7
AT24C256-10CI-2.7
AT24C256C1-10CI-2.7
AT24C256T1-10TI-2.7
8P3
8S1
8S2
8C
Industrial
(-40°C to 85°C)
8C1
14T
Package Type
8C
8-Lead, 0.230" Wide, Leadless Array Package (LAP)
8-Lead, 0.300" Wide, Leadless Array Package (LAP)
8-Lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-Lead, 0.150" Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)
8-Lead, 0.200" Wide, Plastic Gull Wing Small Outline Package (EIAJ SOIC)
14-Lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)
Options
8C1
8P3
8S1
8S2
14T
Blank
-2.7
Standard Operation (4.5V to 5.5V)
Low-Voltage (2.7V to 5.5V)
-1.8
Low-Voltage (1.8V to 3.6V)
AT24C128/256
12
AT24C128/256
AT24C256 Ordering Information (Continued)
tWR (max)
(ms)
ICC (max)
ISB (max)
fMAX
(kHz)
(µA)
(µA)
Ordering Code
Package
Operation Range
20
800
0.2
100
AT24C256-10PC-1.8
AT24C256N-10SC-1.8
AT24C256W-10SC-1.8
AT24C256-10CC-1.8
AT24C256C1-10CC-1.8
AT24C256T1-10TC-1.8
8P3
8S1
8S2
8C
Commercial
(0°C to 70°C)
8C1
14T
800
0.2
100
AT24C256-10PI-1.8
AT24C256N-10SI-1.8
AT24C256W-10SI-1.8
AT24C256-10CI-1.8
AT24C256C1-10CI-1.8
AT24C256T1-10TI-1.8
8P3
8S1
8S2
8C
Industrial
(-40°C to 85°C)
8C1
14T
Package Type
8C
8-Lead, 0.230" Wide, Leadless Array Package (LAP)
8-Lead, 0.300" Wide, Leadless Array Package (LAP)
8-Lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-Lead, 0.150" Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)
8-Lead, 0.200" Wide, Plastic Gull Wing Small Outline Package (EIAJ SOIC)
14-Lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)
Options
8C1
8P3
8S1
8S2
14T
Blank
-2.7
Standard Operation (4.5V to 5.5V)
Low-Voltage (2.7V to 5.5V)
-1.8
Low-Voltage (1.8V to 3.6V)
13
AT24C128/256
Packaging Information
8C, 8-Lead, 0.230" Wide, Leadless Array Package
(LAP)
8C1, 8-Lead, 0.300" Wide, Leadless Array Package
(LAP)
Dimensions in Inches and (Millimeters)
Dimensions in Inches and (Millimeters)
SIDE
SIDE
TOP VIEW
VIEW
TOP VIEW
VIEW
5.15 (0.203)
4.85 (0.191)
5.15 (0.203)
4.85 (0.191)
8.15 (0.321)
7.85 (0.309)
1.30 (0.051)
1.00 (0.039)
0.42 (0.017)
0.34 (0.013)
6.15 (0.242)
5.85 (0.230)
1.30 (0.051)
1.00 (0.039)
0.42 (0.017)
0.34 (0.013)
BOTTOM VIEW
BOTTOM VIEW
8
7
6
5
1
2
3
4
8
7
6
5
1
2
3
4
0.41 (0.016) TYP
0.41 (0.016) TYP
1.27 (0.050) TYP
1.27 (0.050) TYP
0.64 (0.025) TYP
0.64 (0.025) TYP
8P3, 8-Lead, 0.300" Wide,
8S1, 8-Lead, 0.150" Wide,
Plastic Dual Inline Package (PDIP)
Dimensions in Inches and (Millimeters)
JEDEC STANDARD MS-001 BA
Plastic Gull Wing Small Outline (JEDEC SOIC)
Dimensions in Inches and (Millimeters)
.400 (10.16)
.355 (9.02)
.020 (.508)
.013 (.330)
PIN
1
.280 (7.11)
.240 (6.10)
.244 (6.20)
.228 (5.79)
.157 (3.99)
.150 (3.81)
PIN 1
.037 (.940)
.027 (.690)
.300 (7.62) REF
.210 (5.33) MAX
.050 (1.27) BSC
.100 (2.54) BSC
SEATING
PLANE
.196 (4.98)
.189 (4.80)
.068 (1.73)
.053 (1.35)
.015 (.380) MIN
.150 (3.81)
.115 (2.92)
.022 (.559)
.014 (.356)
.070 (1.78)
.045 (1.14)
.010 (.254)
.004 (.102)
.325 (8.26)
.300 (7.62)
0
REF
15
0
8
REF
.010 (.254)
.007 (.203)
.012 (.305)
.008 (.203)
.430 (10.9) MAX
.050 (1.27)
.016 (.406)
14
Packaging Information
8S2, 8-Lead, 0.200" Wide,
Plastic Gull Wing Small Outline (EIAJ SOIC)
Dimensions in Inches and (Millimeters)
14T, 14-Lead, 0.170" Wide, Thin Shrink Small
Outline Package (TSSOP)
Dimensions in Inches and (Millimeters)
INDEX MARK
.020 (.508)
.012 (.305)
PIN
1
.213 (5.41) .330 (8.38)
.205 (5.21) .300 (7.62)
6.50 (.256)
6.25 (.246)
4.50 (.177)
4.30 (.169)
PIN 1
.050 (1.27) BSC
.212 (5.38)
.203 (5.16)
.080 (2.03)
.070 (1.78)
5.10 (.201)
4.90 (.193)
1.20 (.047) MAX
.650 (.026) BSC
0.30 (.012)
0.15 (.006)
0.05 (.002)
SEATING
PLANE
.013 (.330)
.004 (.102)
0.19 (.007)
0.20 (.008)
0.09 (.004)
0
8
0
8
REF
REF
.010 (.254)
.007 (.178)
0.75 (.030)
0.45 (.018)
.035 (.889)
.020 (.508)
*Controlling dimension: millimeters
AT24C128/256
15
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