T5750-6AQJ [ATMEL]

UHF ASK/FSK Transmitter; 超高频ASK / FSK发射器
T5750-6AQJ
型号: T5750-6AQJ
厂家: ATMEL    ATMEL
描述:

UHF ASK/FSK Transmitter
超高频ASK / FSK发射器

电信集成电路 电信电路 光电二极管
文件: 总13页 (文件大小:201K)
中文:  中文翻译
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Features  
Integrated PLL Loop Filter  
ESD Protection also at ANT1/ANT2  
(4 kV HBM/200V MM; Except Pin 2: 4 kV HBM/100V MM)  
High Output Power (5.5 dBm) with Low Supply Current (8.5 mA)  
Modulation Scheme ASK/FSK  
– FSK Modulation is Achieved by Connecting an Additional Capacitor Between the  
XTAL Load Capacitor and the Open Drain Output of the Modulating Microcontroller  
Easy to Design-in Due to Excellent Isolation of the PLL from the PA and Power Supply  
Single Li-cell for Power Supply  
Supply Voltage 2.0V to 4.0V in the Temperature Range of –40°C to +85°C/+125°C  
Package TSSOP8L  
UHF ASK/FSK  
Transmitter  
Single-ended Antenna Output with High Efficient Power Amplifier  
CLK Output for Clocking the Microcontroller  
One-chip Solution with Minimum External Circuitry  
125°C Operation for Tire Pressure Systems  
T5750  
1. Description  
The T5750 is a PLL transmitter IC which has been developed for the demands of RF  
low-cost transmission systems at data rates up to 32 kBaud. The transmitting  
frequency range is 868 MHz to 928 MHz. It can be used in both FSK and ASK  
systems.  
Figure 1-1. System Block Diagram  
UHF ASK/FSK  
UHF ASK/FSK  
Remote control transmitter  
Remote control receiver  
1 Li cell  
T5750  
T5760/  
T5761  
1 to 3 Micro-  
controller  
Demod  
Control  
Encoder  
ATARx9x  
PLL  
Keys  
Antenna Antenna  
XTO  
VCO  
LNA  
PLL  
XTO  
LNA  
VCO  
4546E–RKE–02/07  
2. Pin Configuration  
Figure 2-1. Pinning TSSOP8L  
CLK  
PA_ENABLE  
ANT2  
1
2
3
4
8
7
6
5
ENABLE  
GND  
VS  
ANT1  
XTAL  
Table 2-1.  
Pin  
Pin Description  
Symbol  
Function  
Configuration  
VS  
Clock output signal for micro con roller  
The clock output frequency is set by the  
crystal to fXTAL/4  
100Ω  
100Ω  
CLK  
1
CLK  
50 kΩ  
PA_ENABLE  
UREF = 1.1V  
Switches on power amplifier, used for  
ASK modulation  
2
PA_ENABLE  
20 µA  
ANT1  
ANT2  
3
4
ANT2  
ANT1  
Emitter of antenna output stage  
Open collector antenna output  
2
T5750  
4546E–RKE–02/07  
T5750  
Table 2-1.  
Pin  
Pin Description (Continued)  
Symbol  
Function  
Configuration  
VS  
VS  
1.5 kΩ  
1.2 kΩ  
5
XTAL  
Connection for crystal  
XTAL  
182 µA  
6
7
VS  
Supply voltage  
Ground  
See ESD protection circuitry (see Figure 4-5 on page 9)  
See ESD protection circuitry (see Figure 4-5 on page 9)  
GND  
200 kΩ  
ENABLE  
8
ENABLE  
Enable input  
Figure 2-2. Block Diagram  
T5750  
Power up/down  
f
CLK  
PA_ENABLE  
ANT2  
ENABLE  
4
1
8
7
f
64  
GND  
2
PDF  
CP  
VS  
3
4
6
5
LF  
ANT1  
PA  
VCO  
XTO  
XTAL  
PLL  
3
4546E–RKE–02/07  
3. General Description  
This fully integrated PLL transmitter allows particularly simple, low-cost RF miniature transmit-  
ters to be assembled. The VCO is locked to 64 × fXTAL hence a 13.5672 MHz crystal is needed  
for a 868.3 MHz transmitter and a 14.2969 MHz crystal for a 915 MHz transmitter. All other PLL  
and VCO peripheral elements are integrated.  
The XTO is a series resonance oscillator so that only one capacitor together with a crystal con-  
nected in series to GND are needed as external elements.  
The crystal oscillator together with the PLL needs typically < 1 ms until the PLL is locked and the  
CLK output is stable. There is a wait time of 4 ms must be used until the CLK is used for the  
microcontroller and the PA is switched on.  
The power amplifier is an open-collector output delivering a current pulse which is nearly inde-  
pendent from the load impedance. The delivered output power is hence controllable via the  
connected load impedance.  
This output configuration enables a simple matching to any kind of antenna or to 50. A high  
power efficiency of η= Pout/(IS,PA × VS) of 24% for the power amplifier at 868.3 MHz results when  
an optimized load impedance of ZLoad = (166 + j226)is used at 3V supply voltage.  
4. Functional Description  
If ENABLE = L and the PA_ENABLE = L, the circuit is in standby mode consuming only a very  
small amount of current, so that a lithium cell used as power supply can work for several years.  
With ENABLE = H the XTO, PLL and the CLK driver are switched on. If PA_ENABLE remains L  
only the PLL and the XTO is running and the CLK signal is delivered to the microcontroller. The  
VCO locks to 64 times the XTO frequency.  
With ENABLE = H and PA_ENABLE = H the PLL, XTO, CLK driver and the power amplifier are  
on. With PA_ENABLE the power amplifier can be switched on and off, which is used to perform  
the ASK modulation.  
4.1  
4.2  
ASK Transmission  
The T5750 is activated by ENABLE = H. PA_ENABLE must remain L for t 4 ms, then the CLK  
signal can be taken to clock the microcontroller and the output power can be modulated by  
means of pin PA_ENABLE. After transmission PA_ENABLE is switched to L and the microcon-  
troller switches back to internal clocking. The T5750 is switched back to standby mode with  
ENABLE = L.  
FSK Transmission  
The T5750 is activated by ENABLE = H. PA_ENABLE must remain L for t 4 ms, then the CLK  
signal can be taken to clock the microcontroller and the power amplifier is switched on with  
PA_ENABLE = H. The chip is then ready for FSK modulation. The microcontroller starts to  
switch on and off the capacitor between the XTAL load capacitor and GND with an open-drain  
output port, thus changing the reference frequency of the PLL. If the switch is closed, the output  
frequency is lower than if the switch is open. After transmission PA_ENABLE is switched to L  
and the microcontroller switches back to internal clocking. The T5750 is switched back to  
standby mode with ENABLE = L.  
The accuracy of the frequency deviation with XTAL pulling method is about ±25% when the fol-  
lowing tolerances are considered.  
4
T5750  
4546E–RKE–02/07  
T5750  
Figure 4-1. Tolerances of Frequency Modulation  
VS  
CStray1  
CStray2  
LM  
C4  
XTAL  
CM  
RS  
C0  
C5  
CSwitch  
Using C4 = 9.2 pF ±2%, C5 = 6.8 pF ±5%, a switch port with CSwitch = 3 pF ±10%, stray capaci-  
tances on each side of the crystal of CStray1 = CStray2 = 1 pF ±10%, a parallel capacitance of the  
crystal of C0 = 3.2 pF ±10% and a crystal with CM = 13 fF ±10%, an FSK deviation of ±21.5 kHz  
typical with worst case tolerances of ±16.8 kHz to ±28.0 kHz results.  
4.3  
CLK Output  
An output CLK signal is provided for a connected microcontroller, the delivered signal is CMOS  
compatible if the load capacitance is lower than 10 pF.  
4.3.1  
Clock Pulse Take-over  
The clock of the crystal oscillator can be used for clocking the microcontroller. Atmel®’s  
ATARx9x has the special feature of starting with an integrated RC-oscillator to switch on the  
T5750 with ENABLE = H, and after 4 ms to assume the clock signal of the transmission IC, so  
that the message can be sent with crystal accuracy.  
4.3.2  
Output Matching and Power Setting  
The output power is set by the load impedance of the antenna. The maximum output power is  
achieved with a load impedance of ZLoad,opt = (166 + j226)at 868.3 MHz. There must be a low  
resistive path to VS to deliver the DC current.  
The delivered current pulse of the power amplifier is 7.7 mA and the maximum output power is  
delivered to a resistive load of 475if the 0.53 pF output capacitance of the power amplifier is  
compensated by the load impedance.  
An optimum load impedance of:  
Z
Load = 475|| j/(2 × p × f × 0.53 pF) = (166 + j226)thus results for the maximum output  
power of 5.5 dBm.  
The load impedance is defined as the impedance seen from the T5750’s ANT1, ANT2 into the  
matching network. Do not confuse this large signal load impedance with a small signal input  
impedance delivered as input characteristic of RF amplifiers and measured from the application  
into the IC instead of from the IC into the application for a power amplifier.  
Less output power is achieved by lowering the real parallel part of 475where the parallel imag-  
inary part should be kept constant.  
Output power measurement can be done with the circuit of Figure 4-2 on page 6. Note that the  
component values must be changed to compensate the individual board parasitics until the  
T5750 has the right load impedance ZLoad,opt = (166 + j226)at 868.3 MHz. Also the damping of  
the cable used to measure the output power must be calibrated out.  
5
4546E–RKE–02/07  
Figure 4-2. Output Power Measurement  
VS  
C1  
1 nF  
L1 10 nH  
Power  
meter  
Z = 50Ω  
C2  
ANT1  
1.5 pF  
C3  
ZLopt  
Rin  
50Ω  
2.7 pF  
ANT2  
4.4  
Application Circuit  
For the supply-voltage blocking capacitor C3 a value of 68 nF/X7R is recommended (see Figure  
4-3 on page 7 and Figure 4-4 on page 8). C1 and C2 are used to match the loop antenna to the  
power amplifier where C1 typically is 3.9 pF/NP0 and C2 is 1 pF/NP0; for C2 two capacitors in  
series should be used to achieve a better tolerance value and to have the possibility to realize  
the ZLoad,opt by using standard valued capacitors.  
C1 forms together with the pins of T5750 and the PCB board wires a series resonance loop that  
suppresses the 1st harmonic, hence the position of C1 on the PCB is important. Normally the  
best suppression is achieved when C1 is placed as close as possible to the pins ANT1 and  
ANT2.  
The loop antenna should not exceed a width of 1.5 mm, otherwise the Q-factor of the loop  
antenna is too high.  
L1 (50 nH to 100 nH) can be printed on PCB. C4 should be selected so that the XTO runs on  
the load resonance frequency of the crystal. Normally, a value of 12 pF results for a 15 pF  
load-capacitance crystal.  
6
T5750  
4546E–RKE–02/07  
T5750  
Figure 4-3. ASK Application Circuit  
S1  
VDD  
VSS  
BPXY  
BPXY  
BPXY  
OSC1  
ATARx9x  
VS  
1
S2  
20  
BPXY  
7
T5750  
Power up/down  
CLK  
ENABLE  
f
4
1
2
8
7
f
64  
PA_ENABLE  
GND  
PDF  
CP  
C3  
C2  
ANT2  
VS  
3
4
6
5
VS  
Loop  
Antenna  
LF  
C1  
ANT1  
XTAL  
XTAL  
PA  
VCO  
XTO  
PLL  
L1  
C4  
VS  
7
4546E–RKE–02/07  
Figure 4-4. FSK Application Circuit  
S1  
VDD  
BPXY  
BPXY  
BPXY  
OSC1  
ATARx9x  
VS  
1
20  
18  
S2  
VSS  
BP42/T2O  
BPXY  
7
T5750  
Power up/down  
CLK  
ENABLE  
f
4
1
2
8
7
f
64  
PA_ENABLE  
GND  
PDF  
CP  
C3  
C2  
ANT2  
VS  
3
4
6
5
Loop  
Antenna  
LF  
VS  
C1  
C5  
XTAL  
ANT1  
XTAL  
PA  
VCO  
XTO  
PLL  
L1  
C4  
VS  
8
T5750  
4546E–RKE–02/07  
T5750  
Figure 4-5. ESD Protection Circuit  
VS  
ANT1  
ANT2  
CLK  
PA_ENABLE  
XTAL  
ENABLE  
GND  
5. Absolute Maximum Ratings  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating  
only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this  
specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.  
Parameters  
Symbol  
Minimum  
Maximum  
Unit  
V
Supply voltage  
VS  
5
100  
Power dissipation  
Junction temperature  
Storage temperature  
Ambient temperature  
Input voltage  
Ptot  
mW  
°C  
°C  
°C  
V
Tj  
Tstg  
150  
–55  
–55  
–0.3  
125  
Tamb  
125  
(VS + 0.3)(1)  
VmaxPA_ENABLE  
Note:  
1. If VS + 0.3 is higher than 3.7V, the maximum voltage will be reduced to 3.7V.  
6. Thermal Resistance  
Parameters  
Symbol  
Value  
Unit  
Junction ambient  
RthJA  
170  
K/W  
7. Electrical Characteristics  
VS = 2.0V to 4.0V, Tamb = –40°C to 125°C unless otherwise specified.  
Typical values are given at VS = 3.0V and Tamb = 25°C. All parameters are referred to GND (pin 7).  
Parameters  
Test Conditions  
Symbol  
Min.  
Typ.  
Max.  
Unit  
Power down,  
V
ENABLE < 0.25V, 40°C to 85°C  
350  
7
nA  
µA  
nA  
Supply current  
VPA_ENABLE < 0.25V, 85°C to +125°C  
VPA_ENABLE < 0.25V, 25°C  
IS_Off  
<10  
(100% correlation tested)  
Power up, PA off, VS = 3V,  
VENABLE > 1.7V, VPA_ENABLE < 0.25V  
IS  
3.6  
8.5  
5.5  
4.6  
11  
8
mA  
mA  
Supply current  
Output power  
Power up, VS = 3.0,  
VENABLE > 1.7V, VPA_ENABLE > 1.7V  
IS_Transmit  
PRef  
VS = 3.0V, Tamb = 25°C,  
f = 868.3 MHz, ZLoad = (166 + j226)Ω  
3.5  
dBm  
Note:  
1. If VS is higher than 3.6V, the maximum voltage will be reduced to 3.6V.  
9
4546E–RKE–02/07  
7. Electrical Characteristics (Continued)  
VS = 2.0V to 4.0V, Tamb = –40°C to 125°C unless otherwise specified.  
Typical values are given at VS = 3.0V and Tamb = 25°C. All parameters are referred to GND (pin 7).  
Parameters  
Test Conditions  
Symbol  
Min.  
Typ.  
Max.  
Unit  
Tamb = –40°C to +85°C,  
VS = 3.0V  
VS = 2.0V  
Output power variation for the full  
temperature range  
PRef  
PRef  
–1.5  
–4.0  
dB  
dB  
Tamb = –40°C to +125°C,  
Output power variation for the full VS = 3.0V  
PRef  
PRef  
–2.0  
–4.5  
dB  
dB  
temperature range  
VS = 2.0V,  
POut = PRef + PRef  
Achievable output-power range  
Selectable by load impedance  
POut_typ  
–3  
+5.5  
dBm  
fCLK = f0/128  
Load capacitance at pin CLK = 10 pF  
fO ±1 × fCLK  
fO ±4 × fCLK  
Spurious emission  
–52  
–52  
dBc  
dBc  
other spurious are lower  
f
XTO = f0/32  
fXTAL = resonant frequency of the XTAL,  
CM 10 fF, load capacitance selected  
Oscillator frequency XTO  
(= phase comparator frequency)  
fXTO  
accordingly  
Tamb = –40°C to +85°C,  
Tamb = –40°C to +125°C  
–30  
–40  
fXTAL  
+30  
+40  
ppm  
ppm  
PLL loop bandwidth  
250  
–116  
–80  
kHz  
Referred to fPC = fXT0,  
25 kHz distance to carrier  
Phase noise of phase comparator  
In loop phase noise PLL  
Phase noise VCO  
–110  
–74  
dBc/Hz  
25 kHz distance to carrier  
dBc/Hz  
at 1 MHz  
at 36 MHz  
–89  
–120  
–86  
–117  
dBc/Hz  
dBc/Hz  
Frequency range of VCO  
fVCO  
868  
928  
MHz  
Clock output frequency (CMOS  
microcontroller compatible)  
f0/256  
MHz  
V0h  
V0l  
VS × 0.8  
V
V
Voltage swing at pin CLK  
CLoad 10 pF  
VS × 0.2  
110  
7
Series resonance R of the crystal  
Capacitive load at pin XT0  
Rs  
pF  
FSK modulation frequency rate  
ASK modulation frequency rate  
Duty cycle of the modulation signal = 50%  
Duty cycle of the modulation signal = 50%  
0
0
32  
kHz  
kHz  
32  
Low level input voltage  
High level input voltage  
Input current high  
VIl  
VIh  
IIn  
0.25  
V
V
µA  
ENABLE input  
1.7  
1.7  
20  
Low level input voltage  
High level input voltage  
Input current high  
VIl  
VIh  
IIn  
0.25  
V
V
µA  
(1)  
PA_ENABLE input  
VS  
5
Note:  
1. If VS is higher than 3.6V, the maximum voltage will be reduced to 3.6V.  
10  
T5750  
4546E–RKE–02/07  
T5750  
8. Ordering Information  
Extended Type Number  
Package  
Remarks  
T5750-6AQJ  
TSSOP8L  
Taped and reeled, Marking: T570, Pb-free  
9. Package Information  
Package: TSSOP 8L  
Dimensions in mm  
3±0.1  
3±0.1  
+0.06  
3.8±0.3  
4.9±0.1  
0.31-0.07  
0.65 nom.  
3 x 0.65 = 1.95 nom.  
8
5
4
technical drawings  
according to DIN  
specifications  
1
Drawing-No.: 6.543-5083.01-4  
Issue: 2; 15.03.04  
11  
4546E–RKE–02/07  
10. Revision History  
Please note that the following page numbers referred to in this section refer to the specific revision  
mentioned, not to this document.  
Revision No.  
History  
Put datasheet in a new template  
Pb-free logo on page 1 deleted  
4546E-RKE-02/07  
Pb-free logo on page 1 added  
4546D-RKE-09/05  
4546C-RKE-05/05  
Ordering Information on page 11 changed  
Put datasheet in a new template  
Rename M4xCx9x in ATARx9x  
Table “Absolute Maximum Ratings” on page 9: New heading rows added  
Table “Absolute Maximum Ratings” on page 9: row “Input voltage” added  
Table “Absolute Maximum Ratings” on page 9: table note 1 added  
Table “Electrical Characteristics” on pages 9 to 10: row “PA_ENABLE input”  
changed  
4546B-RKE-07/04  
Table “Electrical Characteristics” on pages 9 to 10: table note 1 added  
Table “Ordering Informations” on page 11: Remarks changed  
12  
T5750  
4546E–RKE–02/07  
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4546E–RKE–02/07  

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